TD62501~507PG/FG TOSHIBA Bipolar Digital Integrated Circuit SIlicon Monolithic TD62501PG,TD62501FG,TD62502PG,TD62502FG,TD62503PG,TD62503FG,TD62504PG TD62504FG,TD62505PG,TD62505FG,TD62506PG,TD62506FG,TD62507PG,TD62507FG 7ch Single Driver TD62501PG/FG, TD62502PG/FG, TD62503PG/FG, TD62504PG/FG Common emitter TD62505PG/FG, TD62506PG/FG Common collector TD62507PG/FG Isolated The TD62501PG/FG Series are comprised of seven or five NPN transistor arrays. For proper operation, the substrate (SUB) must be connected to the most negative voltage. Applications include relay, hammer, lamp and display (LED) drivers. TD62501PG, TD62502PG, TD62503PG, TD62504PG, TD62505PG, TD62506PG, TD62507PG TD62501FG, TD62502FG, TD62503FG, TD62504FG, TD62505FG, TD62506FG, TD62507FG Features * Output current (single output) 200 mA (max) * High sustaining voltage output 35 V (min) * Inputs compatible with various types of logic. * TD62501PG/FG, TD62505PG/FG and TD62507PG/FG : Using external resistor*** General Purpose * TD62502PG/FG : RIN = 10.5 k + 7 V Zener Diode*** 14 to 25 V P-MOS * TD62503PG/GF, TD62506PG/FG : RIN = 2.7 k*** TTL, 5 V C-MOS * TD62504PG/FG: RIN = 10.5 k*** 6 to 15 V P-MOS, C-MOS * Package Type-PG: DIP-16 pin * Package Type-FG: SOP-16 pin 1 Weight DIP16-P-300-2.54A : 1.11g (typ.) SOP16-P-225-1.27 : 0.16g (typ.) 2004-03-26 TD62501~507PG/FG Pin Assignment (top view) TD62501PG/FG, TD62502PG/FG TD62503PG/FG, TD62504PG/FG TD62505PG/FG, TD62506PG/FG O1 O2 O3 O4 O5 O6 O7 NC O1 O2 O3 O4 O5 O6 O7 COM-C 16 15 14 13 12 11 10 9 16 15 14 13 12 11 10 9 1 I1 2 I2 3 I3 4 I4 5 I5 6 I6 7 8 I7 COM-E 1 I1 2 I2 3 I3 4 I4 5 I5 6 I6 7 I7 8 SUB E5 B5 C4 E4 B4 B3 E3 C3 16 15 14 13 12 11 10 9 1 C5 2 C1 3 E1 4 5 6 B1 SUB C2 7 E2 8 B2 TD62507PG/FG *: NC pin assignment The NC pin is not assigned to an internal chip of these products; hence, no need to assign necessarily. If it is needed, Toshiba recommends that you connect the NC pin to the common emitter (GND). Schematics (each driver) TD62501PG/FG Output (*) Input (*) (*) (*) (*) (*) Common emitter TD62502PG/FG Output Input 10 k 7V 10.5 k (*) (*) (*) (*) (*) (*) Common emitter TD62503PG/FG TD62504PG/FG Output (*) TD62503PG/FG TD62504PG/FG 10 k R1 Input (*) (*) (*) (*) (*) Common emitter R1 = 2.7 k, R1 = 10.5 k : Parasitic diodes Note: The input and output parasitic diodes cannot be used as clamp diodes. 2 2004-03-26 TD62501~507PG/FG Schematics (Each driver) TD62505PG/FG Common collector (*) (*) (*) (*) (*) SUB (*) Output TD62506PG/FG Common collector 2.7 k Input (*) (*) (*) (*) (*) (*) SUB Output TD62507PG/FG (*) (*) (*) (*) (*) (*) (*) (*) (*) (*) GND (SUB) : Parasitic diodes Note: The input and output parasitic diodes cannot be used as clamp diodes. Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Collector-emitter voltage VCEO 35 V Collector-base voltage VCBO 50 V IC 200 mA/ch Collector current Input voltage Input current Isolation voltage Power dissipation VIN (Note 1) -0.5 to 45 VIN (Note 2) -0.5 to 30 IIN (Note 3) 25 mA 35 V VSUB PG FG PD 1.0 0.625 (Note 4) V W Operating temperature Topr -40 to 85 C Storage temperature Tstg -55 to 150 C Note 1: TD62506PG/FG Note 2: TD62502PG/FG, TD62503PG/FG, TD62504PG/FG Note 3: TD62501PG/FG, TD62505PG/FG, TD62507PG/FG Note 4: On Glass Epoxy PCB (30 x 30 x 1.6 mm Cu 50%) 3 2004-03-26 TD62501~507PG/FG Recommended Operating Conditions (Ta = -40 to 85C) Characteristics Symbol Condition Min Typ. Max Unit Collector-emitter voltage VCEO 0 35 V Collector-base voltage VCBO 0 50 V IC 0 150 mA/ch VIN V Collector current Input voltage 0 35 14.0 25 2.4 25 TD62504PG/FG 7.0 25 TD62502PG/FG 0 7.0 0 0.4 0 0.8 0 10 0.360 0.325 Min Typ. Max Unit VCE = 25 V, VIN = 0 V 10 A TD62506PG/FG TD62502PG/FG Input voltage (Output on) Input voltage (Output off) TD62503PG/FG TD62503PG/FG VIN (ON) VIN (OFF) IIN = 1 mA, IC = 10 mA IC 10 A TD62504PG/FG V V TD62501PG/FG Input current IIN TD62505PG/FG mA TD62507PG/FG Power dissipation PG PD FG (Note 1) W Note 1: 30 x 30 x 1.6 mm Cu 50% Electrical Characteristics (Ta = 25C) Symbol Test Circuit ICEX 1 IIN = 1 mA, IC = 10 mA 0.2 VCE (sat) 2 IIN = 3 mA, IC = 150 mA (Note 1) 0.8 hFE 2 VCE = 10 V, IC = 10 mA 70 50 Turn-on delay tON 4 50 ns Turn-off delay tOFF 4 VOUT = 35 V, RL = 3.3 k CL = 15 pF 200 ns Characteristics Output leakage current Collector-emitter saturation voltage DCCurrent transfer ratio (Note 2) (Note 3) Test Condition V Note 1: Except TD62502PG/FG Only Note 2: Only TD62501PG/FG, TD62505PG/FG, TD62506PG/FG, TD62507PG/FG Note 3: Only TD62502PG/FG, TD62503PG/FG, TD62504PG/FG 4 2004-03-26 TD62501~507PG/FG Test Circuit 1. ICEX 2. hFE, VCE (sat) IIN VCE Open VIN 3. VIN (ON) IC IIN VCE, VCE (sat) IC VIN (ON) IC hFE = IIN ICEX 4. tON, tOFF VOUT = 35 V Input R1 Pulse generator C B (Note 2) (Note 1) E RL = 3.3 k Output tf tr 90% 50% Input 10% CL = 15 pF (Note 3) VIH 90% 50% 50 s 10% 0 tOFF tON VOH Output 50% 50% VOL Note 1: Pulse width 50 s, Duty cycle 10% Output impedance 50 , tr 5 ns, tf 10 ns Note 2: See below Input Condition Type Number R1 VIH TD62501PG/FG 2.7 k 3V TD62502PG/FG 0 15 V TD62503PG/FG 0 3V TD62504PG/FG 0 10 V TD62505PG/FG 2.7 k 3V TD62506PG/FG 0 3V TD62507PG/FG 2.7 k 3V Note 3: CL includes probe and jig capacitance Precautions for Using This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding. 5 2004-03-26 TD62501~507PG/FG IC - IB Collector current IC 80 TD62501PG/FG TD62505PG/FG TD62507PG/FG Emitter grounded Ta = 25C 0.7 0.6 100 (mA) (mA) 100 IC - VCE 120 Collector current IC 120 VCE = 3 V 60 40 20 0.5 80 0.4 60 0.3 40 0.2 IB = 0.1 mA 20 0 0 0.2 0.4 0.6 0 0 0.8 10 Base current IB (mA) 20 VBE - IB (V) PD - Ta 1.2 (W) (V) 0.8 Power dissipation PD VBE Base-emitter voltage 30 Collector-emitter voltage VCE 1.0 VCE = 3 V 0.6 TD62501PG/FG TD62505PG/FG 0.4 TD62507PG/FG 1.0 (1) Type-PG FREE AIR (2) Type-FG ON PCB 30 x 30 x 1.6 mm Cu 50% On glass Epoxy PCB (3) Type-FG FREE AIR (1) 0.8 (2) 0.6 (3) 0.4 0.2 Emitter grounded Ta = 25C 0.2 0 0.2 0.4 0.6 0 0 0.8 25 Base current IB (mA) 50 VCE (sat) - IC 125 150 Ta (C) hFE - IC DC current transfer ratio hFE IC/IB = 25 0.1 IC/IB = 10 VCE (sat) 0.03 0.01 0.003 0.3 100 10000 TD62501PG/FG TD62505PG/FG TD62507PG/FG 0.3 Ta = 25C 0.001 0.1 75 Ambient temperature 1 Collector-emitter saturation voltage VCE (sat) (V) TD62501PG/FG TD62505PG/FG TD62507PG/FG Emitter grounded Ta = 25C 1 3 Collector current IC 10 30 TD62501PG/FG TD62505PG/FG TD62507PG/FG 3000 Ta = 25C 1000 300 hFE (VCE = 10 V) 100 30 10 0.1 100 (mA) 0.3 1 3 Collector current IC 6 10 30 100 (mA) 2004-03-26 TD62501~507PG/FG TD62501PG/FG IIN - VIN TD62502PG/FG IIN - VIN 8 4 IOUT = 25 mA 4 Input current Input current 3 IIN (mA) 6 IIN (mA) Ta = 25C 50 100 2 2 1 Ta = 25C IOUT = 25 to 100 mA 0 0 0.2 0.4 0.6 Input voltage VIN 0.8 0 0 1.0 (V) 20 30 Input voltage VIN 40 50 (V) TD62504PG/FG IIN - VIN 4 3 3 IIN (mA) 4 IIN (mA) TD62503PG/FG IIN - VIN 2 Input current Input current 10 1 2 1 Ta = 25C Ta = 25C IOUT = 25 to 100 mA 0 0 4 8 12 Input voltage VIN 16 IOUT = 25 to 100 mA 0 0 20 (V) 10 20 30 Input voltage VIN 40 50 (V) IC - VCE (sat) 120 2 mA Collector current IC (mA) 100 1 mA 80 700 A 60 IIN = 500 A 40 20 Ta = 25C 0 0 0.2 0.4 0.6 0.8 Output saturation voltage 1.0 1.2 1.4 VCE (sat) 7 2004-03-26 TD62501~507PG/FG Package Dimensions Weight: 1.11 g (typ.) 8 2004-03-26 TD62501~507PG/FG Package Dimensions Weight: 0.16 g (typ.) 9 2004-03-26 TD62501~507PG/FG About solderability, following conditions were confirmed * Solderability (1) Use of Sn-63Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux RESTRICTIONS ON PRODUCT USE 030619EBA * The information contained herein is subject to change without notice. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. 10 2004-03-26