Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
High Power Chip Resistors / Wide Terminal Type
E
1
R
2
J
3
A
4
1
5
A
6 7
J
8
1
9
0
10
2
11
U
Thick Film
Chip Resistors
Product Code Size, Power Rating
Type : inches
A1 : 2512
B1 : 2010
B2 : 1206
B3 : 0805
Resistance Value Region
A
B
C
D
Resistance Value
Packaging Methods
U
VERJB2
ERJB3
ERJA1
ERJB1
Code Packaging Type
Punched Carrier Taping
4mmpitch
Embossed Carrier Taping
4mmpitch
10 <R
0.22 <R <10
0.01 <R<0.22
0.005 <R<0.01
Resistance Tolerance
F
G
J
±1%
±2%
±5%
The first two digits are significant figures of resistance and the third one
denotes number of zeros following. Decimal point is expressed by “R”.
(ex.) 222 2.2 k
4R7 4.7
Power R.
1.33 W
1W
0.5 W
0.33 W,
0.5 W
(R <1)
E
1
R
2
J
3
A
4
1
5
C
6 7
J
8
R
9
0
10
1
11
5
Thick Film
Chip Resistors
Product Code
C
D
Resistance Value
12
U
0.01 <R<0.22
0.005 <R<0.01
Resistance Tolerance
±1%
±2%
±5%
Decimal point is expressed by “R” with three figures following it.
(ex.) R015 0.015 =15m
Resistance Value Region
F
G
J
Packaging Methods
U
VERJB2
ERJB3
ERJA1
ERJB1
Code Packaging Type
Punched Carrier Taping
4mmpitch
Embossed Carrier Taping
4mmpitch
Size, Power Rating
Type : inches
A1 : 2512
B1 : 2010
B2 : 1206
B3 : 0805
Power R.
1.33 W
1W
0.5 W
0.33 W,
0.5 W
(R <1)
High Power Chip Resistors / Wide Terminal Type
2512, 2010, 1206, 0805
Type: ERJ A1, B1, B2, B3
■Features
● High solder-joint reliability by wide terminal con struc tion
● Excellent heat dissipation characteristics by wide
terminal construction
■Explanation of Part Numbers
■Recommended Applications
●
Automotive electronic circuits including ECUs (Electrical
control unit), anti-lock breaking systems and air-bag systems
● Current sensing for power supply circuits in a variety
of equipment
● If the case of Resistance value is less than 100 m
Aug. 2009
High Power Chip Resistors / Wide Terminal Type
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Protective coating
Thick film
resistive element
Electrode (Inner) Electrode (Between)
Electrode (Outer)
Alumina substrate
l03
b
b
T
L
aa
W
A2
B2 B1
A1
10–φD
B1
W
B2 C
PT
L
102
RRRRRRRR
Rl0
bb
T
L
aa
W
R
R20
bbaa
T
L
W
R R
■Construction (Example : ERJA1 type)
■Dimensions in mm (not to scale)
■Circuit Confi guration
ERJA1 type ERJB1 type
ERJA1 type
Mass (Weight) [1000 pcs.] : 40 g (ERJA1 type)
: 27 g (ERJB1 type)
: 11 g (ERJB2 type)
: 4.8 g (ERJB3 type)
<Marking Confi guration>
Resistance value is shown by three or four fi gures.
The marking is indicated on products with a resistance of
10 ohm higher.
Di men sions
(mm)
LWT a b
5.00±0.20 2.50±0.20 0.55±0.20 0.25±0.20 0.90±0.20
Di men sions
(mm)
LWTA
1B1
6.40±0.20 3.20±0.20 0.55±0.10 0.70±0.20 0.45±0.20
Di men sions
(mm)
A2B2PφDC
0.70±0.201.25±0.15 1.27±0.10 0.30
+0.10 0.4 min.
–0.20
ERJB2 type ERJB3 type
LWT a b
5 m<R<10 m
3.20±0.20 1.60±0.15 0.65±0.15 0.30±0.20 0.30±0.20
10 m<R<220 m
0.50±0.20
220 m<R<1 M
0.20±0.20
ERJB1 type
(Unit : mm)
ERJB2 type
Di men sions
(mm)
LWT a b
2.00±0.10 1.25±0.10 0.50±0.10 0.25±0.15 0.40±0.15
ERJB3 type
Oct. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
High Power Chip Resistors / Wide Terminal Type
–60 –40 –20 0 20 40 60 80 100 120 140 160 180
0
20
40
60
80
100 70 °C
155 °C
Ambient Temperature (°C)
Rated Load (%)
–55 °C
Power Derating Curve
For resistors operated in ambient temperature above
70 °C, power rating shall be derated in accordance
with the fi gure on the right.
(1) Rated Continuous Working Voltage (RCWV) shall be de ter mined from RCWV=Power Rating Re sis tance Values, or Limiting Element Voltage
(max. RCWV) list ed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=2.5 Power Rating or max. Over load Volt age list ed above
which ev er less.
■Ratings
Type
(inches)
Power
Rating
at 70 °C (W)
Limiting Element
Voltage
(Maximum
RCWV)(1) (V)
Maximum Over-
load Voltage(2)
(V)
Resistance
Tolerance
(%)
Resistance
Range
()
T.C.R.
[10–6/°C
(ppm/°C)]
Category Temperature
Range
(Operating
Temperature Range)
(°C)
ERJA1
(2512) 1.33 200 400
±1
100 m to 10 k (E24)
R < 100 m : ±350
100 m < R : ±100 (±1%)
±200 (±2%, ±5%)
–55 to +155
±2, ±5 10 m to 10 k (E24)
ERJB1
(2010) 1 200 400 ±1, ±2, ±5 10 m to 10 k (E24)
R < 22 m : ±350
22 m < R < 47 m : ±200
47 m < R < 100 m : ±150
100 m < R : ±100 (±1%)
±200 (±2%, ±5%)
–55 to +155
ERJB2
(1206) 0.5 200 400
±1, ±2 10 m to 1 M (E24)
R < 22 m : 0 to +300
22 m < R < 47 m : 0 to +200
47 m < R < 100 m : 0 to +150
100 m < R < 1 : 0 to +150 (±1%)
0 to +200 (±2%, ±5%)
1 < R : ±100 (±1%)
±200 (±2%, ±5%)
–55 to +155
±5
5 m to 1 M
5 m to 9 m : 1m step
10 m to 1 M : E24
ERJB3
(0805)
0.33
0.5(R < 1 )150 200 ±1, ±2, ±5 20 m to 10 (E24)
R < 56 m : 0 to +300
56 m < R < 1.2 : 0 to +200
1.2 < R : ±100 (±1%)
±200 (±2%, ±5%)
–55 to +155
（ ）
Aug. 2009
High Power Chip Resistors / Wide Terminal Type
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
φB
W
T
φA
φC
TT
Punched Carrier Embossed Carrier
A
P0
P2
P1
φD0
φD1(Only Emboss)
B
F
W
E
6.4
0.6
Land pattern
Unit : mm
1.71.7
Land pattern
Unit : mm
Land pattern
Unit : mm
5.0
0.75 1.31.3
0.70 0.950.95
3.2
Land pattern
Unit : mm
0.55 0.850.85
2.0
■Packaging Methods (Taping)
● Standard Quantity
Type (inches) Kind of Taping Pitch (P1)Quantity
ERJA1 (2512) Embossed Carrier Taping
4 mm
4000 pcs./reel
ERJB1 (2010)
5000 pcs./reel
ERJB2 (1206) Punched Carrier Taping
ERJB3 (0805)
●Taping Reel
●Carrier Tape
● ERJA1 type ● ERJB1 type
■Recommended Land Pattern
Type φAφBφCW T
ERJA1
180.0–3.0 60 min. 13.0±1.0
13.0±0.10 15.4±0.20
ERJB1
ERJB2 9.0±0.10 11.4±0.10
ERJB3
+0
Type A B W F E P1P2P0φD0TφD1
ERJA1 3.50±0.20 6.80±0.20
12.00±0.30 5.50±0.20 1.75±0.20
4.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10
1.10±0.20
1.50+0.10
ERJB1 2.80±0.20 5.30±0.20 1.00±0.20
ERJB2 2.00±0.15 3.60±0.15 8.00±0.15
3.50±0.05 1.75±0.10 0.84±0.10 —
ERJB3 1.65±0.15 2.50±0.20 8.00±0.20 0.84±0.05 —
–0
–0
(Unit : mm)
(Unit : mm)
● ERJB2 type ● ERJB3 type
Jul. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
High Power Chip Resistors / Wide Terminal Type
Preheating
Peak
Heating
Temperature
Time
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
For soldering For lead-free soldering
Temperature Time Temperature Time
Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s
Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s
■Recommended Soldering Conditions
Recommendations and precautions are described below.
●Recommended soldering conditions for refl ow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
●Recommended soldering conditions for fl ow
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER2 of this catalog.
1. Take measures against mechanical stress during and after mounting of High Power Chip Resistors (here af ter called the
resistors) so as not to damage their electrodes and protective coatings.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avo id exc ess ive b en ding of printed circuit boards in order to protect the resistors from abnormal stress.
Jul. 2008
– ER3 –
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifi cations described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Be fore use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to
vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating
ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and stan dard use in general elec tron ic
equipment (e.g. AV equipment, home electric ap pli anc es, offi ce equipment, information and com mu ni ca tion
equipment)
• These products are not intended for use in the following special conditions. Be fore using the products, care ful ly
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. S e al in g o r co ating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or
infl ammables, such as vinyl-coated wires, near these products .
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water res i dues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their
elec tri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tap ing ma te ri als)
may be de formed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Oct. 2007
