Pressure Document Number: MPX2202 Rev 8, 10/2012 Freescale Semiconductor Data Sheet: Technical Data 200 kPa On-Chip Temperature Compensated Silicon Pressure Sensors MPX2202 Series 0 to 200 kPa (0 to 29 psi) 40 mV Full Scale (Typical) The MPX2202 devices series are silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. They are designed for use in applications such as pump/ motor controllers, robotics, level indicators, medical diagnostics, pressure switching, barometers, altimeters, etc. Application Examples * * * * * * * Features * * * * * Temperature Compensated Over 0C to +85C Easy-to-Use Chip Carrier Package Options Available in Absolute, Differential and Gauge Configurations Ratiometric to Supply Voltage Available in Easy-to-Use Tape and Reel Pump/Motor Controllers Robotics Level Indicators Medical Diagnostics Pressure Switching Barometers Altimeters ORDERING INFORMATION Case Device Name No. None Unibody Package (MPX2202 Series) MPX2202A 344 * MPX2202DP 344C MPX2202AP 344B MPX2202GP 344B MPX2202ASX 344F Small Outline Package (MPXV2202 Series) MPXV2202GP 1369 MPXV2202DP 1320 1320A MPXM2202GST1 1320A MPXM2202AS 1320A Gauge * Pressure Type Differential Absolute * * * * * * * * MPXV2202G MPXM2202D MPXM2202D * (c) 2005-2008, 2012 Freescale Semiconductor, Inc. All rights reserved. MPX2202A MPXV2202DP * * * * * MPX2202AP MPXV2202GP * * MPX2202A MPX2202GP * * Device Marking MPX2202DP * * 482A MPAK Package (MPXM2202 Series) MPXM2202D 1320 * MPXM2202DT1 1320 * MPXM2202GS Dual * 1351 MPXV2202GC6TI MPXM2202A # of Ports Single * * MPXM2202A MPXM2202GS MPXM2202GS * MPXM2202AS Pressure UNIBODY PACKAGES MPX2202A CASE 344-15 MPX2202AP/GP CASE 344B-01 MPX2202DP CASE 344C-01 MPX2202ASX CASE 344F-01 MPAK SMALL OUTLINE PACKAGES MPXV2202DP CASE 1351-01 MPXV2202GP CASE 1369-01 MPXV2202GC6T1 CASE 482A-01 MPXM2202A CASE 1320-02 MPXM2202GS/AS CASE 1320A-02 MPX2202 2 Sensors Freescale Semiconductor, Inc. Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 Vdc, TA = 25C unless otherwise noted, P1 > P2) Characteristics Symbol Min Typ Max Unit POP POP 20 0 -- -- 200 200 kPa kPa Supply Voltage(2) VS -- 10 16 Vdc Supply Current Io -- 6.0 -- mAdc VFSS 38.5 40 41.5 mV Voff -1.0 -2.0 -- -- 1.0 2.0 mV V/P -- 0.2 -- mV/kPa -- -0.6 -1.0 -- -- 0.4 1.0 %VFSS Pressure Hysteresis(5) (0 to 200 kPa) -- -- 0.1 -- %VFSS Temperature Hysteresis(5) (-40C to +125C) -- -- 0.5 -- %VFSS TCVFSS -2.0 -- 2.0 %VFSS TCVoff -1.0 -- 1.0 mV Input Impedance Zin 1000 -- 2500 Output Impedance Zout 1400 -- 3000 Response Time(6) (10% to 90%) tR -- 1.0 -- ms Warm-Up -- -- 20 -- ms Offset Stability(7) -- -- 0.5 -- %VFSS Pressure Range(1) Absolute Pressure Range MPX2202A Differential Pressure Range MPX2202D Full Scale Span(3) Offset(4) MPX2202D, MPXM2202D/G Series MPX2202A, MPXM2202A Series Sensitivity (5) Linearity MPXM2202D/G, MPX2202D Series MPXM2202A, MPX2202A Series Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2202 Sensors Freescale Semiconductor, Inc. 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Max Value Unit 400 kPa Storage Temperature -40 to 125 C Operating Temperature -40 to 125 C Maximum Pressure (P1 > P2) 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Voltage Output versus Applied Differential The differential voltage output of the sensor is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 Thin Film Temperature Compensation and Calibration Circuitry Sensing Element 2 4 +VOUT -VOUT 1 GND Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic MPX2202 4 Sensors Freescale Semiconductor, Inc. Pressure On-Chip Temperature Compensation and Calibration VS = 10 VDC TA = 25C P1 > P2 40 35 30 TYP Span Range (TYP) Output (mVDC) 25 MAX 20 15 MIN 10 5 0 kPa PSI -5 0 25 50 7.25 75 100 125 14.5 Pressure 150 21.75 175 Offset (TYP) 200 29 Figure 2. Output vs. Pressure Differential Figure 2 shows the output characteristics of the MPX2202 series at 25C. The output is directly proportional to the differential pressure and is essentially a straight line. Silicone Gel Die Coat Differential/Gauge Die P1 Epoxy Case Differential/Gauge Element P2 Absolute Die Silicone Gel Die Coat Stainless Steel Metal Cover Wire Bond Lead Frame The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics. Bond Die P1 Stainless Steel Metal Cover Epoxy Case Wire Bond Lead Frame Die Bond Absolute Element P2 Figure 3. Cross Sectional Diagram (not to scale) LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 4) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Square Deviation Least Squares Fit Relative Voltage Output Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2202 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Exaggerated Performance Curve Straight Line Deviation End Point Straight Line Fit Offset 0 50 Pressure (% Full Scale) 100 Figure 4. Linearity Specification Comparison MPX2202 Sensors Freescale Semiconductor, Inc. 5 Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Table 3. Pressure (P1) Side Delineation Part Number MPX2202A Case Type 344 Pressure (P1) Side Identifier Stainless Steel Cap MPX2202DP 344C Side with Part Marking MPX2202GP/AP 344B Side with Port Attached MPX2202ASX 344F Side with Port Attached MPX2202GP 1369 Side with Port Attached MPX2202DP 1351 Side with Part Marking MPXV2202GP 1369 Side with Port Attached MPXV2202DP 1351 Side with Part Marking MPXV2202GC6TI 482A Side with Port Attached MPXM2202A/ATI/DT/DTI 1320 Side with Part Marking 1320A Side with Port Attached MPXM2202GS/GSTI/AS/ASTI MPX2202 6 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS -A- D 8 PL 4 0.25 (0.010) 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S N -B- G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 -T- K M PIN 1 IDENTIFIER SEATING PLANE CASE 482A-01 ISSUE A DATE 05/13/98 MPX2202 Sensors Freescale Semiconductor, Inc. 7 Pressure PACKAGE DIMENSIONS C R M 1 B 2 -A- Z 4 3 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. Y M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30 NOM 30 NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -A- -T- U L R H N PORT #1 POSITIVE PRESSURE (P1) -Q- B 1 2 3 4 PIN 1 K -P0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2202 8 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 N DIM A B C D F G H J K L N P Q R S U V W PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- 0.25 (0.010) -T- M T Q S S F J G D 4 PL C 0.13 (0.005) T S M S Q S INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. -AU SEATING PLANE -T- L H PORT #2 VACUUM (P2) R DIM A B C D F G H J K L N P Q R S U POSITIVE PRESSURE (P1) N -Q- B 1 2 3 4 K PIN 1 S C J F -P0.25 (0.010) M T Q S G D 4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. 2. 3. 4. INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.158 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344D-01 ISSUE B UNIBODY PACKAGE MPX2202 Sensors Freescale Semiconductor, Inc. 9 Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE 1 OF 2 MPX2202 10 Sensors Freescale Semiconductor, Inc. Pressure PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2202 Sensors Freescale Semiconductor, Inc. 11 Pressure CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2202 12 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2202 Sensors Freescale Semiconductor, Inc. 13 Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK MPX2202 14 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK MPX2202 Sensors Freescale Semiconductor, Inc. 15 Pressure PACKAGE DIMENSIONS PIN 4 PIN 1 CASE 1320A-02 ISSUE A MPAK MPX2202 16 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A MPAK MPX2202 Sensors Freescale Semiconductor, Inc. 17 Pressure REVISION HISTORY Revision number Revision date 7 01/2012 * In Table 1. Operating Characteristics, in the Characteristic column under Pressure Range, added rows for Absolute Pressure Range MPX2202A and Differential Pressure Range MPX2202D devices 8 10/2012 * Deleted references to device number MPXV2022GC6U throughout the document Description of changes MPX2202 Sensors Freescale Semiconductor, Inc. 18 How to Reach Us: Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright Home Page: freescale.com Web Support: freescale.com/support licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. 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U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. (c) 2012 Freescale Semiconductor, Inc. All rights reserved. MPX2202 Rev. 8 10/2012