CREAT BY ART
- Glass passivated junction chip
- Ideal for automated placement
- Fast switching for high efficiency
- Moisture sensitivity level: level 1, per J-STD-020
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
RAL RBL RDL RGL RJL RKL RML
V
RRM
50 100 200 400 600 800 1000 V
V
RMS
35 70 140 280 420 560 700 V
V
DC
50 100 200 400 600 800 1000 V
I
F(AV)
A
Cj pF
Trr 250 ns
T
JO
C
T
STG O
C
Document Number: DS_D1405034 Version: K14
RS1AL thru RS1ML
Taiwan Semiconductor
Surface Mount Fast Recover
y
Rectifiers
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
RS1
DL
RS1
GL
MECHANICAL DATA
Case: Sub SMA Sub SMA
Polarity: Indicated by cathode band
Weight: 0.019 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
RS1
JL
RS1
KL
RS1
ML UNIT
Marking code
Maximum repetitive peak reverse voltage
PARAMETER SYMBOL RS1
AL
RS1
BL
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 0.8
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
30 A
Maximum instantaneous forward voltage (Note 1)
@ 0.8 A V
F
1.3 V
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃I
R
5μA
50
Typical junction capacitance (Note 2) 10
Maximum reverse recovery time (Note 3) 150 500
Typical thermal resistance R
θjL
R
θjA
32
105
Note 2: Measured at 1 MHz and Applied VR=4.0 Volts.
Note 3: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
O
C/W
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
Note 1: Pulse test with PW=300μs, 1% duty cycle
PART NO.
PART NO.
RS1ML
RS1ML
RS1ML
(TA=25℃ unless otherwise noted)
Document Number: DS_D1405034 Version: K14
RS1AL thru RS1ML
Taiwan Semiconductor
ORDERING INFORMATION
AEC-Q101
QUALIFIED
PACKING COD E GREEN COMPOUND
CODE
PACKAGE PACKING
RS1xL
(Note 1) Prefix "H"
RU
Suffix "G"
Sub SMA 1,800 / 7" Plastic reel (8mm tape)
RV Sub SMA 3,000 / 7" Plastic reel (8mm tape)
RT Sub SMA 7,500 / 13" Paper reel (8mm tape)
MT Sub SMA 7,500 / 13" Plastic reel (8mm tape)
RQ Sub SMA 10,000 / 13" Paper reel (8mm tape)
MQ Sub SMA 10,000 / 13" Plastic reel (8mm tape)
R3 Sub SMA 1,800 / 7" Plastic reel (12mm tape)
RF Sub SMA 3,000 / 7" Plastic reel (12mm tape)
R2 Sub SMA 7,500 / 13" Paper reel (12mm tape)
M2 Sub SMA 7,500 / 13" Plastic reel (12mm tape)
RH Sub SMA 10,000 / 13" Paper reel (12mm tape)
MH Sub SMA 10,000 / 13" Plastic reel (12mm tape)
Note 1: "x" defines voltage from 50V (RS1AL) to 1000V (RS1ML)
EXAMPLE
PREFERRED P/N AEC-Q101
QUALIFIED PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
RS1ML RU RU
RS1ML RUG RU G Green compound
RS1MLHRU H RU AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 25 50 75 100 125 150 175
AVERAGE FORWARD A
CURRENT (A)
LEAD TEMPERATURE (oC)
FIG.1 FORWARD CURRENT DERATING CURVE
RESISTIVE OR
INDUCTIVE LOAD
0
10
20
30
40
50
1 10 100
PEAK FORWARD SURGE CURRENT
(A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half Sine Wave
0.001
0.01
0.1
1
10
100
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=100℃
TJ=125℃
0.1
1
10
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
INSTANTANEOUS FORWARD CURRENT
(A)
FORWARD VOLTAGE (V)
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
Pulse Width=300μs
1% Duty Cycle
TJ=25℃
TJ=125℃
Min Max Min Max
B 1.70 1.90 0.067 0.075
C 2.70 2.90 0.106 0.114
D 0.16 0.30 0.006 0.012
E 1.23 1.43 0.048 0.056
F 0.80 1.20 0.031 0.047
G 3.40 3.80 0.134 0.150
H 2.45 2.60 0.096 0.102
I 0.35 0.85 0.014 0.033
J 0.00 0.10 0.000 0.004
P/N = Marking Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1405034 Version: K14
RS1AL thru RS1ML
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
SUGG ESTED PAD LAYO UT
Symbol Unit (mm) Unit (inch)
A 1.4 0.055
B 1.2 0.047
C 3.1 0.122
MARKING DIAGRAM
D 1.9 0.075
E 4.3 0.169
1
10
100
1 10 100
CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1405034 Version: K14
RS1AL thru RS1ML
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
