Data sheet acquired from Harris Semiconductor SCHS015C - Revised August 2003 The CD4001B, CD4002B, and CD4025B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright 2003, Texas Instruments Incorporated MECHANICAL MPDI002C - JANUARY 1995 - REVISED DECEMBER 20002 N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 16 PINS SHOWN PINS ** 14 16 18 20 A MAX 0.775 (19,69) 0.775 (19,69) 0.920 (23,37) 1.060 (26,92) A MIN 0.745 (18,92) 0.745 (18,92) 0.850 (21,59) 0.940 (23,88) MS-100 VARIATION AA BB AC DIM A 16 9 0.260 (6,60) 0.240 (6,10) 1 C AD 8 0.070 (1,78) 0.045 (1,14) 0.045 (1,14) 0.030 (0,76) D D 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gauge Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.430 (10,92) MAX 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) M 14/18 PIN ONLY 20 pin vendor option D 4040049/E 12/2002 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001, except 18 and 20 pin minimum body lrngth (Dim A). D. The 20 pin end lead shoulder width is a vendor option, either half or full width. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MECHANICAL DATA MSOI002B - JANUARY 1995 - REVISED SEPTEMBER 2001 D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 8 PINS SHOWN 0.020 (0,51) 0.014 (0,35) 0.050 (1,27) 8 0.010 (0,25) 5 0.008 (0,20) NOM 0.244 (6,20) 0.228 (5,80) 0.157 (4,00) 0.150 (3,81) Gage Plane 1 4 0.010 (0,25) 0- 8 A 0.044 (1,12) 0.016 (0,40) Seating Plane 0.010 (0,25) 0.004 (0,10) 0.069 (1,75) MAX PINS ** 0.004 (0,10) 8 14 16 A MAX 0.197 (5,00) 0.344 (8,75) 0.394 (10,00) A MIN 0.189 (4,80) 0.337 (8,55) 0.386 (9,80) DIM 4040047/E 09/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15). Falls within JEDEC MS-012 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MECHANICAL DATA MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Applications amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2003, Texas Instruments Incorporated