Data sheet acquired from Harris Semiconductor
SCHS015C – Revised August 2003
The CD4001B, CD4002B, and CD4025B
types are supplied in 14-lead hermetic
dual-in-line ceramic packages (F3A
suffix), 14-lead dual-in-line plastic
packages (E suffix), 14-lead small-outline
packages (M, MT, M96, and NSR suffixes),
and 14-lead thin shrink small-outline
packages (PW and PWR suffixes).
Copyright 2003, Texas Instruments Incorporated
MECHANICAL
MPDI002C – JANUARY 1995 – REVISED DECEMBER 20002
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE
BB AC AD
0.325 (8,26)
0.300 (7,62)
0.010 (0,25) NOM
Gauge Plane
0.015 (0,38)
0.430 (10,92) MAX
20
1.060
(26,92)
0.940
(23,88)
18
0.920
0.850
14
0.775
0.745
(19,69)
(18,92)
16
0.775
(19,69)
(18,92)
0.745
A MIN
DIM
A MAX
PINS **
(23,37)
(21,59)
Seating Plane
14/18 PIN ONLY
20 pin vendor option 4040049/E 12/2002
9
8
0.070 (1,78)
A
0.045 (1,14) 0.020 (0,51) MIN
16
1
0.015 (0,38)
0.021 (0,53)
0.200 (5,08) MAX
0.125 (3,18) MIN
0.240 (6,10)
0.260 (6,60)
M
0.010 (0,25)
0.100 (2,54)
16 PINS SHOWN
MS-100
VARIATION AA
C
D
D
D
0.030 (0,76)
0.045 (1,14)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001, except 18 and 20 pin minimum body lrngth (Dim A).
D. The 20 pin end lead shoulder width is a vendor option, either half or full width.
MECHANICAL DATA
MSOI002B – JANUARY 1995 – REVISED SEPTEMBER 2001
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
8 PINS SHOWN
8
0.197
(5,00)
A MAX
A MIN (4,80)
0.189 0.337
(8,55)
(8,75)
0.344
14
0.386
(9,80)
(10,00)
0.394
16
DIM
PINS **
4040047/E 09/01
0.069 (1,75) MAX
Seating Plane
0.004 (0,10)
0.010 (0,25)
0.010 (0,25)
0.016 (0,40)
0.044 (1,12)
0.244 (6,20)
0.228 (5,80)
0.020 (0,51)
0.014 (0,35)
1 4
8 5
0.150 (3,81)
0.157 (4,00)
0.008 (0,20) NOM
0°– 8°
Gage Plane
A
0.004 (0,10)
0.010 (0,25)0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2003, Texas Instruments Incorporated
