2015 Microchip Technology Inc. Preliminary DS40001803A-page 1
MTCH6303
Description
Microchip’s MTCH6303 is an innovative turnkey projected capacitive touch controller that provides multi-touch coordinates
as well as a readymade multi-finger surface gesture suite. M TCH6303 brings modern user interface (UI) element s – such as
pinch and zoom, multi-finger scrolling, and swipes – to any e m bedded design, with minimal host requirements.
The MTCH6303’s advanced signal processing provides noise-avoidance techniques and predictive tracking for ten
fingers, typically at 100 Hz each for five touches. It also combines with Microchip’s MTCH652 High-voltage Line Driver
to achieve a superior signal-to-noise ratio (SNR) for outstanding touch performance in noisy environments (refer to
www.microchip.com/MTCH652). These capabilities are critical in demanding environments such as industrial controls,
home and office automation with security control panels, thermostat, printers and lighting controls, and various
consumer applications including exercise equipment and audio systems.
Features
• Multi-Touch up to Ten Touches
• Five Touches Typically at 100 Hz+ Each
• 27RX x 19TX Channels Support Approximately 8"
Touch Screens (larger possible )
• Combines with MTCH652 High-Voltage Driver for
Superior Signal-to-Noise Ratio (SNR)
• Integrated Single and Multi-finger Gesture
Recognition Suite including Taps, Swipes,
Scrolling, Pinching and Zooming
• Advanced Processing Provides Noise Avoidance
Techniques
• USB and I2C™ Communication
• Supports 3D Gestures up to 20 cm when
Combined with the MGC 3130 GestIC® Controller
Power Management
Example:
• 27RX 19TX Sens or
- 27 mA full-scan rate
- 1 mA reduced-scan rate
Applications
• Touch screen des ig ns a nd touc h pads that requi r e
cost effective, easy to integrate, fast time to
market PCAP touch so luti on s
• Perfect for touch screens over displays, control
panels, keypads and many other input devices
• Targeting the industrial, medical, home and office
automation, and consumer markets
TABLE 1: MTCH6303 SOLUTION PART NUMBERS
Device Pin Count Package Types Touch Channels Features
MTCH6303-I/PT 64 10 x10 mm TQFP Up to 27 RX Multi-touch, up to 8” sensors
MTCH6303-I/RG 9 x 9 mm QFN
*MTCH652-I/SO 28 7.5 mm SOIC Up to 19 TX 1.8 – 5.5V input, 6V – 18V
configurable output
*MTCH652-I/SS 5.3 mm SSOP
*MTCH652-I/MV 4 x 4 mm UQFN
Note: *One MTCH652 high-voltage driver (boost) is required with MTCH6303.
Note: The MTCH6303 devices are pre-programmed with a Library Loader (bootloader) only. Refer to
Section 8.0, Firmwa re update for more details.
MTCH6303 Projected Capacitive Touch Controller Data Shee t
MTCH6303
DS40001803A-page 2 Preliminary 2015 Microchip Technology Inc.
PIN DIAGRAM
FIGURE 1: MTCH6303 64-PIN DIAGRAM TQFP/QFN
IN0
IN1
IN2
IN3
IN4
IN5
RESET
IN6
VSS
VDD
IN7
IN8
IN9
IN10
IN25
IN26
IN11
IN12
AVDD
AVSS
IN13
IN14
IN15
IN16
VSS
VDD
IN17
IN18
IN19
IN20
SDA
SCL
COMM_SEL
NC
BOOSTPWM
BOOSTDO
NC
NC
NC
VSS
OSC2
OSC1
VDD
D+
D-
VUSB3V3
VBUS
NC
IN24
IRQ
IN23
NC
NC
NC
NC
VDD
VCAP
NC
BOOSTLE1
NC
BOOSTOE1
IN22
BOOSTCLK
IN21
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
MTCH6303
DNC
2015 Microchip Technology Inc. Preliminary DS40001803A-page 3
MTCH6303
PIN ALLOCATION TABLE
TABLE 2: MTCH6303 PINOUT DESCRIPTION
Name Pin Description
IN0 1
IN 0 – 5
IN1 2
IN2 3
IN3 4
IN4 5
IN5 6
RESET 7 Reset
IN6 8 IN 6
VSS 9 Ground
VDD 10 Power Supply Input
IN7 11
IN 7 – 10
IN8 12
IN9 13
IN10 14
IN25 15 IN 25 – 26
IN26 16
IN11 17 IN 11 – 12
IN12 18
AVDD 19 Positive supply for analog modules. This pin must be connected at all times.
AVSS 20 Ground reference for analog modules
IN13 21
IN 13 – 16
IN14 22
IN15 23
IN16 24
VSS 25 Ground
VDD 26 Power Supply Input
IN17 27
IN 17 – 20
IN18 28
IN19 29
IN20 30
SDA 31 I2C™ Data
SCL 32 I2C Clock
MTCH6303
DS40001803A-page 4 Preliminary 2015 Microchip Technology Inc.
DNC
33
Do not connect any signal to these pins.
42
43
44
47
53
55
58
59
60
61
VBUS 34 USB Bus Power Monitor
VUSB3V3 35 USB internal transce iver supply. If the USB module is not used, this pin must be
connected to VDD.
D- 36 USB D-
D+ 37 USB D+
VDD 38 Power Supply Input
OSC1 39 Oscillator Pin 1
OSC2 40 Oscillator Pin 2
VSS 41 Ground
BOOSTDO 45 MTCH652 DO outp ut/DI N Inp ut
BOOSTPWM 46 MTCH652 PWM Out/OSCIN input
COMM_SEL 48 Communic ati on Sele ct Pin (VDD = I2C™, V SS = USB)
IN21 49 IN 21
BOOSTCLK 50 MTCH652 C LK Output
IN22 51 IN 22
BOOST O E1 52 MTCH652 OE Output 1
BOOSTLE1 54 MTCH652 LE Out put 1
VCAP 56 Capac itor for Internal Voltage Regulator
VDD 57 Power Supply Input
IN23 62 IN 23
IRQ 63 I2C Interrupt
IN24 64 IN 24
MGC_TS 42 Gest ure Transfer Sta tus
MGC_SDA 43 Gesture I2C Data
MGC_SCL 44 Gesture I2C Clock
MGC_ MC L R 61 Gest ure Re se t
MGC_MO D E 60 Gest ure Mod e Co ntro l
MGC_SYNC 47 Gesture Sync
TABLE 2: MTCH6303 PINOUT DESCRIPTION (CONTINUED)
Name Pin Description
2015 Microchip Technology Inc. Preliminary DS40001803A-page 5
MTCH6303
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 6
2.0 Layout........................................................................................................................................................................................... 7
3.0 Communication ............................................................................................................................................................................ 9
4.0 Message Prot ocol . ...................................................................................................................................................................... 15
5.0 Parameters................................................................................................................................................................................. 18
6.0 Communi cation Examples............ ................... ................... .................. ................... ................................................................... 22
7.0 Sensor Des i g n Co n side rations...................................... ........... ................... ............................................................................... 26
8.0 Firmware update ........................................................................................................................................................................ 29
9.0 Operating Modes........................................................................................................................................................................ 33
10.0 Applicatio n Co mma nds ...................... ........... .................. ........... ................... .......... ................................................................... 38
11.0 Gesture Features and Parameters................................ ................... ................... ................... ... ................................................. 44
12.0 Electrical Specifications .............................................................................................................................................................. 48
13.0 Ordering Information .................................................................................................................................................................. 57
14.0 Packagin g In fo rmation........................ ...................................... ................... ................... ............................................................ 58
Appendix A: “Revision History” ............................................................................................................................................................ 65
The Micro chip Web Site....................... ................... .................. ................... ................... ..................................................................... 66
Product Identification System .............................................................................................................................................................. 67
Customer Change Notification Service................................................................................................................................................ 66
Customer Support.................................................................................... ...... ................. ..................................................................... 66
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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MTCH6303
DS40001803A-page 6 Preliminary 2015 Microchip Technology Inc.
1.0 DEVICE OVERVIEW
FIGURE 1-1: MTCH6303 BLOCK DIAGRAM
(SPI) TX Drive Control
RX Electrode
Measurement
27
MTCH652
(Boost)
19
Touch
Sensor
Acquisition
Module
Touch Tracking/
Decoding
Prediction
Module
Communications
& Diagnostics
USB Stack
I2C™ Engine
Sensor Configuration/Calibration
Noise Detection
& Management
I²C™
USB
MTCH652
2015 Microchip Technology Inc. Preliminary DS40001803A-page 7
MTCH6303
2.0 LAYOUT
FIGURE 2-1: TYPICAL APPLICATION CIRCUIT
2.1 SENSOR CHANNEL NAMING
CONVENTION
Throughout this document, there are references to
signals such as IN, RX, OUT and TX. This is
deliberately done to avoid confusion between sensor
channels and physical pins on the controller. Refer to
Figure 2-2 for an example of channel numbers chosen
randomly.
• When referring to a sensor, the channels are
labeled RX0-RXn and TX0-TXn.
• When referring to the MTCH6303 controller, the
INn pins connect to any RXn on the sensor.
• When referring to the MTCH652 boost converter,
the OU Tn pins connect to any TX n on the sensor.
FIGURE 2-2: EXAMPLE OF CHANNEL
NUMBERS CHOSEN AT
RANDOM
OUT18
OUT17
OSCIN
OE
LE
DIN
CLK
8
9
10
11
12
13
14
21
20
19
18
17
16
15
OUT10
OUT11
OUT12
OUT13
OUT14
OUT15
OUT16
OUT6
OUT7
VPP
VDD
VSS
OUT8
OUT9
28
27
26
25
24
23
22
OUT5
OUT4
LC
OUT3
OUT2
OUT1
OUT0
1
2
3
4
5
6
7
IN11
IN12
AV
DD
AV
SS
IN13
IN14
IN15
IN16
V
SS
V
DD
IN17
IN18
IN19
IN20
SDA
SCL
COMM_SEL
BOOSTPWM
BOOSTDO
MGC_TS
V
SS
OSC2
OSC1
V
DD
D+
D-
V
USB3V3
V
BUS
IN24
IRQ
IN23
V
DD
V
CAP
BOOSTLE1
BOOSTOE1
IN22
BOOSTCLK
IN21
IN0
IN1
IN2
IN3
IN4
IN5
RESET
IN6
V
SS
V
DD
IN7
IN8
IN9
IN10
IN25
IN26
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
1
Resistors (discrete or networks) placed on all RX
lines as close to the MTCH6303 as possible
V
DD
10k
GND
V
DD
1k1
V
DD
V
DD
GND
V
DD
GND
GND
2.2 μH
GND GND
0.1 μF
1 μF
V
DD
GND
1 μF 25V V
DD
GND
To I2C™ Host
IRQ
SCL
SDA
GND
18 pF
18 pF
GND
GND
8 MHz
RX Channels
TX Channels
*See Comm
Select Note
3
V
DD
GND
COMM_SEL
COMM_SEL
I²C™
Configuration
USB
Configuration
3
Comm Select Note
To USB Host2
2ESD Protection per
User Requirements
D+
D-
VBUS
V
DD
GND
V
DD
5x 0.1 μF
Tantalum or ceramic
10 μF ESR ≤ 3Ω
150k
GND
1.8k
V
DD
4.7k
Diag 2
Diag 1
MTCH6303
MTCH652
SENSOR
SENSOR
IN4
IN5
...
INn
RX0
RX1
...
RXn
TX0
TX1
...
TXn
OUT18
OUT17
...
OUTn
MTCH6303
MTCH652
MTCH6303
DS40001803A-page 8 Preliminary 2015 Microchip Technology Inc.
2.2 Decoupling Capacitors
The use of decoupling capacitors on power supply
pins, such as VDD, VSS, is required. Consider the
following criteria when using decoupling capacitors.
2.2.1 VALUE AND TYPE OF CAPACITOR
A value of 0.1 µF (100 nF), 10-20V is recommended.
The capacitor should be a low Equivalent Series
Resistance (low ESR) capacitor and have resonance
frequency in the range of 20 MHz and higher. It is
further recommended that ceramic capacitors be used.
2.2.2 PLACEMENT ON THE PRINTED
CIRCUIT BOARD
The deco upling capa citors should b e placed as close to
the pins as possible. It is recommended that the
capacitors be placed on the same side of the board as
the de vice. I f space is re stricte d, the c apacitor ca n be
placed on another layer on the PCB; however, ensure
that the trace length from the pin to the capacitor is
within one-quarter of an inch (6 mm) in length.
2.2.3 HANDLING HIGH-FREQUENCY
NOISE
If the board is experiencing high-frequency noise,
upward of tens of MHz, add a second ceramic-type
capacitor in parallel to the above described decoupling
capacit o r. T h e valu e of th e se cond c apa ci tor c an b e in
the range of 0.01 µF to 0.001 µF. Place this second
capacitor next to the primary decoupling capacitor. In
high-speed circuit designs, consider implementing a
decade pair of c ap acitances as close to th e pow er and
ground pins as possible. For example, 0.1 µF in parallel
with 0.001 µF.
2.2.4 MAXIMIZING PERFORMANCE
On the board layout from the power supply circuit, run
the power and return traces to the decoupling
capacitors first, and then to the device pins. This
ensures that the decoupling capacitors are first in the
power chain. Equally important is to keep the trace
length between the capacitor and the power pins to a
minimum, thereby reducing PCB track inductance .
2.3 Bulk Capacitors
The use of a bulk capacitor is recommended to improve
power supply stability . T ypical values range from 4.7 µF
to 47 µF. This capac itor shou ld be locat ed as clo se to
the device as possible.
2015 Microchip Technology Inc. Preliminary DS40001803A-page 9
MTCH6303
3.0 COMMUNICATION
3.1 USB/I2C™ Selection
The MTCH6303 can communicate over either USB or
I2C™. The decision of which protocol is selected is
made on start-up and persists until the controller is
reset.
Communications are selectable between USB/I2C
through the use of the COM M _SEL pi n, wh ic h m us t b e
permanently tied to either VSS or VDD as follows:
3.2 Communications Overview
Communi cations with the MTCH630 3 fall into two mai n
categories:
1. T ouch Dat a: Data representing the current state
of an y cont ac t point s; t his is the main fun ction of
the touch controller.
2. Streamed Messaging: Packet-based
messaging protocol used to:
• Send con trol ler commands
• Read/Write parameters
• Receive diagnostic reports (when enabled)
• Read 2D gesture data
• Read 3D gesture data (requires MGC3130)
Both types of dat a are available ov er either USB or I2C,
as shown in the Table 3-2 below.
FIGURE 3-1: COMMUNICATIONS OVERVIEW DIAGRAM
TABLE 3-1: COMM_SEL SETTINGS
Setti ng Communica tions Type
VDD I2C™
VSS USB
TABLE 3-2: COMMUNICATIONS
CATEGORIES
Data Type USB I2C™
Touch Data Digitizer
endpoint Register-based
memory map
Streamed
Messaging Generic HID
endpoint S tre am buffers
accessed via
I2C™ registers
USB EP1
IRQ
Streamed
Messaging
IRQ Logic
Touch Data Touch Registers
Digitizer
Generic HID
Message Stream
Buffer (Output)
Message Stream
Buffer (Input)
Message Stream
Access Registers
USB
I2C
USB EP2
I²C™
USB Host
I²C™ Master
MTCH6303
MTCH6303
DS40001803A-page 10 Preliminary 2015 Microchip Technology Inc.
3.3 USB Protocol
3.3.1 HID DIGITIZER (EP 1, TOUCH DATA)
3.3.2 HID GENERIC (EP 2, STREAMED
MESSAGES)
This ge n er ic e ndp oi nt is us ed to se nd an d re ce iv e o ne
or more messages within t he payload.
FIGURE 3-2: HID GENERIC
3.4 I2C™ PROTOCOL
3.4.1 OVERVIEW
The MTCH6303 uses a standard register-based read /
write I2C™ protocol. This protocol is similar to many
other devices such as temperature sensors and serial
EEPROMs. Although data can be read at any time
(polling), a configurable interrupt pin (INT) is provided
for flexible integration options.
3.4.2 READING/WRITING REGISTERS
To access memory (both to read or write), the I2C
tran saction must start by addre ssing t he chip w ith the
WRITE bit set, then writing out a single byte of data
representing the memory address to be operated on.
After that, the host can choose to do either of the
following:
1. To wri te memory, continu e writing “n ” data by tes.
2. To read memory, restart the I2C transaction (via
either a Stop and S t ar t or Rest ar t), then addres s
the chi p with the READ bit set. Co nti nue to rea d
“n” data bytes.
During either of these transactions, multiple bytes may
be read or written due to the device’s address
auto-increment feature.
FIGURE 3-3: I2C™ TRANSACTION
DIAGRAM
TABLE 3-3: HID DIGITIZER
Byte 76543210
0 REPORT ID (0X01)
TOUCH 1
1 PADDING IR TS
2 TOUCH ID 0
3 X1 LSB
4X1 MSB
5 Y1 LSB
6Y1 MSB
7 PADDING IR TS
TOUCH 2
8 TOUCH ID 1
9 X2 LSB
10 X2 MSB
11 Y2 LSB
12 Y2 MSB
.. .. .. ..
TO UCHES 3-9
.. ..
.. ..
.. ..
.. ..
.. ..
47 PADDING IR TS
TOUCH 10
48 TOUCH ID 9
49 X4 LSB
50 X4 MSB
51 Y4 LSB
52 Y4 MSB
53 #OF VALID TOUCHES
Legend: IR = In Range
TS = Touch State
TABLE 3-4: HID GENERIC
Byte Name Value/Description
Report ID 0x05 0x05 (Con stant)
SeqCntr
[7:6] R [reserved]
SeqCntr
[5:0]
SEQ
Sequence counter, increments on
every HID packet.
• Values range from 0-63
• IN and OUT packets utilize
independent sequence
counters
DATAIN DATAIN
... P
SR I2CADDR R
DATAOUT ... PDATAOUT
S I2CADDR WREGADDR
Write
Read
S W
R
P I2CADDR
REGADDR
Start Condition Write Bit
Read Bit
Stop Condition
SR Restart Condition
I2C™ Device Address (7bit)
Register Address
2015 Microchip Technology Inc. Preliminary DS40001803A-page 11
MTCH6303
3.4.3 DEVICE ADDRESSING
The device’s 7-bit base address is 0x25. Each
transmission must be prefixed with this address, as
well as a bit signifying whether the transmission is a
MASTER WRITE (0) or MASTER READ (1). After
appending this read/write bit to the base address, this
first byte becomes either 0x4A (write) or 0x4B (read).
FIGURE 3-4: EXAMPLE I 2C™ READ
TRANSACTION
FIGURE 3-5: EXAMPLE I 2C™ WRITE
TRANSACTION
Note: If this addres s con flict s w ith an other in the
system, it may be possible to customize
the device. Contact Microchip support for
more information.
S0x25 WACK
SR
0x10 0x25 RACK 0x01 NK P
INT
I
2
C™ ACK
Address Data
Note: Reading one byte from address 0x10, byte value is
0x01.
S
0x25 W
ACK
0x04 0x80 PI
2
C™
ACK ACK
Address Data
Note: Writing one byte to address 0x04, value 0x80.
MTCH6303
DS40001803A-page 12 Preliminary 2015 Microchip Technology Inc.
TABLE 3-5: I2C™ MEMORY MAP
ADDR NAME 7 6 5 4 3 2 1 0 Description
TOUCH
0x00 TOUCHSTATUS R MGC GST STR NUMTOUCHES MGC = GestIC® data, GST = Gestures
Ready, STR = Stream Ready
0x01
TOUCH 0
IR TS IR = In Range, TS = Touch State
0x02 TOUCH ID 1 ID = touch ID, 0-16
0x03 X1 LSB
0x04 X1 MSB
0x05 Y1 LSB
0x06 Y1 MSB
0x07
TOUCH 1
IR TS
0x08 TOUCH ID 1
0x09 X1 LSB
0x0A X1 MSB
0x0B Y1 LSB
0x0C Y1 MSB
0x0D (TOUCH 2) ... (format follows from above)
0x13 (TOUCH 3) ...
0x19 (TOUCH 4) ...
0x1F (TOUCH 5) ...
0x25 (TOUCH 6) ...
0x2B (TOUCH 7) ...
0x31 (TOUCH 8) ...
0x37 (TOUCH 9) ...
0x42
[RESERVED]—
0x7F
STREAM BUFFER
0xF0
[RESERVED]—
0xFA
0xFB RX Bytes
Ready RXRDY Space available (bytes) for writing into
RX buffer
0xFC RX Buffer RXBUFF Pointer to RX Buffer
0xFD TX Bytes Left TXRDY Bytes ready to be read from TX buffer
0xFE TX Buffer TXBUFF Pointer to TX Buffer
2015 Microchip Technology Inc. Preliminary DS40001803A-page 13
MTCH6303
3.4.4 TOUCH REGISTERS
Touch data can be read out of the touch registers at
any time, and is ensured to represent the latest state
of the sensor. Use of the IRQ pin can improve
efficiency by letting the host controller only read data
when necessary. (See Section 6.0, Communication
Examples for mo re details.)
3.4.5 MESSAGE STREAM ACCESS
For sending and receiving stream messages
(described further on in this document), register-based
acces s to the m essag e stream is provid ed as s hown in
Figure 3-6.
FIGURE 3-6: MESSAGE STREAM ACCESS
3.4.5.1 Reading Stream Messages Over I2C
The host discovers that data is ready to be read from
the stream by reading a non-zero value from the
TXRDY register. This register should be queried after
one of the following events:
• IRQ activity
• STR bit of TOUCHSTATUS register is set
• Polled at a random interval (of the host ’s choosing)
To read the dat a, an I2C register r ead shoul d be st arted
at the address of TXBUFF. The host can choose to
read any amount of bytes (up to the value in TXRDY).
3.4.5.2 Writing Stream Messages Over I2C
The host can write messages directly into the address
of RXBUFF. Before writing, the host should check the
amount of space available for writing by reading the
RXRDY register.
3.4.5.3 Interrupt Pin
To alert the host th at new dat a is ready, an interrupt pin
(IRQ) is provided. The IRQ is an ‘open-drain’ output
that is pulled to GND when asserted, and high-
impedance (tri-state) when not asserted. A suitable
pull-up resistor should be used on this output.
The IRQ can be configured using the parameters in
Table 3-6 below (refer to Section 5.0, Parameters for
accessing).
RXRDY
RXBUFF
0xFE
0xFB
[BUFFER READ]
[BUFFER LOAD]
# BYTES RDY
0xFC
TXBUFF
TXRDY0xFD
OUTPUT STREAM
BUFFER
[BUFFER LOAD]
[BUFFER READ]
# BYTES LEFT
(SPACE AVAIL.)
INPUT STREAM
BUFFER
From
MTCH
To
MTCH
From HOST
To HOST
I2C™ REGISTERS
MTCH6303
DS40001803A-page 14 Preliminary 2015 Microchip Technology Inc.
TABLE 3-6: IRQ CONFIGURATION PARAMETERS
Parameter Default Description
irqMode 1 Overall IRQ mode
0 = IRQ deactivated
1 = IRQ level maintained until data read
2 = IRQ pulsed for [irqPulseWidth] msec
irqPolarity 0 IRQ Polarity control
0 = Active-Low,
1 = Active-High
irqPulseWidth 5 Value (msec) to pulse IRQ when irqMode is set to ‘2’
irqTrigger 2 Event control for IRQ activity
0 = Off
1 = Every touch decoding frame
2 = Any to uch is present
3 = Only when touch is changed
2015 Microchip Technology Inc. Preliminary DS40001803A-page 15
MTCH6303
4.0 MESSAGE PROTOCOL
4.1 Overview
The MTCH6303 messaging protocol is used to send
and receive streamed messages. Full or partial
(fragment) messages may be exchanged with this
protocol.
Messages are transmitted in an overall ‘block’ size of
64 and must be split up accordingly. Refer to
Section 6.0, Communication Examples for
depictions of messages being fragmented.
FIGURE 4-1: ME SSAGE PROTOCOL
4.2 Message Definitions
Messages starting with REP are reports sent from the
MTCH6303 to the host. Messages starting with CMD
are commands sent from the host to the MTCH6303.
Messages that require further clarification are
expanded upon in the following section.
TABLE 4-1: MTCH6303 MESSAGE
FORMAT
Name Description
Status/
Size
B5-0 SZ
Size of message fr agment. If 63 (0x3f), the
fragment is incomplete and uses up ALL
of the parent transport layer packet
B6 C
1 = Continued (from last fragment)
0 = Not continued (start of message)
B7 M
1 = More messages to follow in this block
0 = Last message
CMD ID Command ID, only sent on first
frag ment of message. For fragments
after, this is a normal payload byte.
CMD
Payload Data bytes of message fragment.
765:0
MTCH6303
DS40001803A-page 16 Preliminary 2015 Microchip Technology Inc.
TABLE 4-2: MESSAGE DEFINITIONS
ID Name Payloa d size Payload Description
(assume uint8 unless noted) Gated by NVDM(1) Description
0x04 REP_Echo <varies> [data]...[datan] [NO GATE] It will echo the exact payload of a received ‘echo’ command
0x17 REP_FlashContents <varies> [data]...[datan] [NO GATE] Flash contents readback (invoked by CMD_ReadFlash)
0x60 REP_AdcDbg 132 [rx] [tx] [freq] [RSVD] [uint16 D0] [uint16 D1]...[uint16 Dn] NVDM_ADC Raw sample output from ADC
0x90 REP_Trace 2 [location][event] NVDM_DIAG —
0xA0 REP_Swipe 2 [flags][fingers] NVDM_GESTURE Swipe gesture
0xA1 REP_Scroll 8 [fingers][diamHI][uint16 diameter][uint16 centerx][uint16 centery] NVDM_GESTURE Scroll gesture
0xA2 REP_Tap 2 [flags][fingers] NVDM_GESTURE Tap gesture
0xB0 REP_Noise <varies> [subID][data]...[datan] NVDM_NOISE Noise messages (see below)
0xC3 REP_MutNormSection 2+2*nodes [rx][tx][uint16 node0][uint16 node1]...[uint16 noden] NVDM_MUTCACHE Sends out a dynamic amount of nodes (from 1 to full RX electrode)
0xCF REP_ParameterRead 2+len [uint16 address][data] (up to ‘len’ bytes) [NO GA TE] Parameter read response
0xF0 REP_Ack 1 [command ID] [NO GATE] Acknowledgment of receipt of command
0xF2 REP_TouchFiltered 5*i [STATE/ID][uint16 X][uint16 Y] NVDM_FINGERPOS Filtered (but not scaled) touch coordinates
0xF3 REP_TouchPredict 9 [ID][uint16 X0][uint16 Y0][uint16 Xpred][uint16 Ypred] NVDM_RAWPOS Prediction value for a touch
0xF4 REP_TouchRaw 5*i [STATE/ID][uint16 X][uint16 Y] NVDM_RAWPOS Raw touch report (pre-filter)
0xF5 REP_TouchPos16 5*i [PEN/ID][uint16 X][uint16 Y] NVDM_FINGERPOS Final scaled touch report – first byte has touch status as bit 7
0xFA REP_SelfRaw 2*numRXch [uint16 self0][uint16 self1]...[uint16 selfn] NVDM_SELFRA W Self measurements (raw)
0xFD REP_SelfNorm 2*numRXch [uint16 self0][uint16 self1]...[uint16 selfn] NVDM_SELFNORM Self measurements (normalized)
0xFE REP_ForwardGestIC <varies> [data]...[datan] NVDM_GESTIC Packet from GestIC® (direct)
0xFF REP_FwVersion <varies> [fwVersionInfo] [NO GATE] Large array of bytes denoting all firmware information
0x04 CMD_Echo <varies> [data]...[datan] n/a Firmware will echo back any payload sent
0x17 CMD_ReadFlash 6 [uin32 address][uint16 size] n/a Allows host to read Flash contents of device (fw dump)
0x55 CMD_EnterBootLoader 0 (none) n/a Commands firmware to enter the bootloader – ACK will be sent
before jumping
0xE0 CMD_SetParameter 10 [uint16 address][uint8[4] data][uint8[4] mask] n/a Writes a parameter
0xE1 CMD_GetParameter 2 [uint16 address] n/a Reads a parameter
0xFB CMD_ForceBaseline 0 (none) n/a Forces a baseline
0xFC CMD_ResetGestIC 0 (none) n/a Resets GestIC immediately
0xFD CMD_GestIC <varies> (gestic command) n/a Sends packet directly on to GestIC
0xFF CMD_QueryVersion 0 (none) n/a Requests all firmware version information – bytes 124:127
represent Rev[2].Minor.Major
Note: Refer to parameter documentation for explanation of NVDM bitfields.
2015 Microchip Technology Inc. Preliminary DS40001803A-page 17
MTCH6303
4.2. 1 SET PARAMETER COMMAND
FIGURE 4-2: SET PARAMETER
COMMAND
4.2.2 GET PARAMETER COMMAND
FIGURE 4-3: GET PARAMETER
COMMAND
ADDR ESS DATA MASK
Address: 16bit address location of parameter to set
Data: 32bit (4 bytes) data value to write. For data sizes
smaller than 4 bytes, pad with 0x00
Mask: 32 bi t ( 4 byt es) mask value to ma sk off bi ts that sho uld
not be set. (usually set to 0xFFFFFFFF)
ADDRESS
Address: 16bit address location of parameter to retrieve
MTCH6303
DS40001803A-page 18 Preliminary 2015 Microchip Technology Inc.
5.0 PARAMETERS
5.1 Operation
Defaul t param eters are lo aded on sta rt-up, as shown in
the parameter table section. These values can be
modified during runtime, but will not be restored on
Reset. To permanently modify parameters, the
MTCH6303 Utility should be used to export and Flash
a new configuration. Refer to the MTCH6303 Utility
docum entation for mor e inform ation.
5.2 Parameter Table
Many parameters are tuned by the MTCH6303 Utility
itself, so descriptions are not provided. Table 5-1 is
provided for reference only.
TABLE 5-1: PARAMETER TABLE
Module Name Address Format Default Description
pub mgc313 0 0x01 02 uint8 _t 0 1 = MTC31 30 is presen t
pub numberOfRXChannels 0x0100 uint8_t 27 Number of RX channels currently in use
pub numberOfTXChannels 0x0101 uint8_t 19 Number of TX channels currently in use
pub diagMask 0x0080 uint16_t [see NVDM] [see NVDM]
pub activeModules 0x0081 uint16_t [see NVAM] [see NVAM]
pub streamingMode 0x0082 uint8_t 0 see Operating M odes
pub swipeDistan c e 0x0501 uint1 6_t 4*256 See Gesture definitio n
pub swipeTimeout 0x0500 uint32_t msec2ticks(1500)(1) See Gest ure definiti o n
pub swipeBorder n/a (struct) n/a See Gesture definition
pub swipeBo rde r.left 0x05 02 uint1 6_t 3* 25 6 See Gesture definitio n
pub swipeBo rde r.right 0x05 03 uint1 6_t 24*256 See Gesture defini tio n
pub swipeBo rde r.top 0x0504 uint1 6_t 3*256 See Gesture definitio n
pub swipeBo rde r.bottom 0x0505 uint1 6_t 16*256 See Gesture defi nitio n
pub swipeExtBorder n/a (struct) n/a See Gesture definition
pub swipeExtBorder.left 0x0506 uint1 6_t 2*256 See Gesture defini tio n
pub swipeExtB o rde r.right 0x05 07 uint1 6_t 25*256 See Gesture defini tio n
pub swipeExtBorder.top 0x0508 uint1 6_t 2* 25 6 See Gesture definitio n
pub swipeExtBo rder.b otto m 0 x05 09 uint1 6_t 17 *2 56 See Gesture defini tio n
pub tapBorder n/a (struct) n/a See Gesture definition
pub tapBorder.left 0x0540 uint1 6_t 1*256 See Gesture defi nition
pub tapBorder.right 0x05 41 uint1 6_t 26*256 See Gesture defini tio n
pub tapBorder.top 0x05 42 uint1 6_t 1* 25 6 See Gest ure defini tio n
pub tapBorder.bottom 0x0543 uint1 6_t 18*256 See Gesture defi nitio n
pub tapTimeout 0x0544 uint32_t mSec2Ticks(200)(1) S ee Gest ure defi nitio n
pub dblTapTimeout 0x0545 uint32_t mSec2Ticks(500) (1) See Gesture defi nitio n
pub commSelectMode 0x0584 uint8_t 0 0 = use COMMSEL pin, 1 = force I2C™,
2 = force USB
pub irqPolarity 0x0581 uint8_t 0 0 = Active-Low, 1 = Active-High
pub irqPulseWidth 0x0582 uint8_t 5 Value in msec to pulse (when mode 2)
pub irqTrigger 0x0583 uint8_t 2 0 = Off, 1 = Set on frame, 2 = Set on
touch, 3 = Set on touch changed
pub irqMode 0x0580 uint8_t 1
0 = Off, 1 = Level-trigger, 2 = Pulse-trigger
pub idleTime2D 0x0103 uint16_t 100 Scan period while 2D is idle (in msec)
map txSelfTape 0x02c0 uint16_t [66] [see below]
map rxPinMap 0x0200 uint8_t[27] [see below]
map rxPrechargePinMap 0x0240 uint8_t[27] [see bel ow]
map txPinMap 0x0280 uint8_t[36] [see below]
acq baseUpdateTime 0x0802 uint32_t mSec2Ticks(10000)
(1) Calibration update rate
acq selfScanPhase 0x0812 uint16_t[4] {52,45,40,40} Self measurement period
acq selfScanISRPhase 0x0816 uint16_t[4] {59,49,46,45} Self measurement phase
acq mutScanPeriode 0x0803 uint16_t[4] {122,105,104,100} Mutual measurement period
2015 Microchip Technology Inc. Preliminary DS40001803A-page 19
MTCH6303
acq mutScanPhase 0x0807 uint16_t[4] {68,60,59,55} Mutual measurement phase
acq mutFreqH o ppin g 0x080B uint8_t 0 Frequency hopp i ng con trol (0 =
enabled, 1-4 = lock to F0-F3)
acq mutFreqHoppingLevel 0x080C int8_t[4] {0,0,0,0} Linear gain to apply to results from each
frequency
acq diagRxChannel 0x0800 uint8_t 0xff
acq diagTxChannel 0x0801 uint8_t 0xff
acq syncRxChannel 0x081A uint8_t 0xff
acq syncTxChannel 0x081B uint8_t 0xff
acq fullScanRxStart 0x081C uint8_t 0
acq fullScanRxStop 0x081D uint8_t 27
acq fullScanTxStart 0x081E uint8_t 0
acq fullScanTxStop 0x081F uint8_t 19
dec penDownTimer 0x0403 uint16_t 781
dec penUpTimer 0x0404 uint16_t 781
dec selfTouchThres 0x0400 uint8_t 60
dec mutTouchThres 0x0401 uint8_t 60
dec minCuspDelta 0x040b uint8_t 25
dec weightThreshold 0x0402 uint8_t 20
dec minTouchDistance 0x040c uint8_t 5*8
dec fatThreshold 0x040d uint8_t 95
dec nbSampleSelf 0x0407 uint8_t 64
dec touchActiveHysteresis2D 0x0409 uint16_t 1000
dec touchActiveHysteresis2D3D 0x0401 uint16_t 50
rep flipState 0x0041 uint8_t 0b010
rep rxScale n/a (struct) n/a
rep rxScale.shift 0x0042 uint8_t 7
rep rxScale.divide 0x0043 uint8_t 27
rep rxScale.offset 0x0044 uint16_t 0
rep txScale n/a (struct) n/a
rep txScale.shift 0x0045 uint8_t 7
rep txScale.divide 0x0046 uint8_t 19
rep txScale.offset 0x0047 uint16_t 0
mtc mtch65x_active_config none uint32_t 0x27
mtc mtch65x_periode_fast_rise 0x0900 uint16_t 10
mtc mtch65x_periode_fast_rise_oc 0x0901 uint16_t 7
mtc mtch65x_fast_rise_delay 0x0902 uint16_t 300
mtc mtch65x_periode_self_measurement 0x090D uint16_t[4] {20,20,20,20}
mtc mtch65x_periode_self_measurement_oc 0x0911 uint16_t[4] {10,10,10,10}
mtc mtch65x_periode_mutu_measurement 0x0905 uint16_t[4] {66,60,59,58}
mtc mtch65x_periode_mutu_measurement_oc 0x0909 uint16_t[4] {16,15,14,14}
Note 1: mSec2Ticks(ms) = (((ms) * 625 + 2) / 4)
TABLE 5-1: PARAMETER TABLE (CONTINUED)
Module Name Address Format Default Description
MTCH6303
DS40001803A-page 20 Preliminary 2015 Microchip Technology Inc.
EXAMPLE 5-1: COMPLICATED INITIALIZATIONS
5.3 Speci al Parameters
5.3.1 ACTIVE MODULES REGISTER
(NVAM)
rxPinMap = {(15), (14), (13), (12), (11), (10), (9), (8), (7), (6), (0), (1), (2), (3), (4), (5),
(19), (18), (17), (16), (27), (23), (22), (21), (20), (26), (24)}
rxPrechargePinMap = {(24), (24), (24), (24), (24), (24), (24), (24), (24), (24), (24), (24), (24),
(15), (15), (15), (15), (15), (15), (15), (15), (15), (15), (15), (15), (15), (15)}
txPinMap = {(0+ 17), (0+ 18), (0+ 0), (0+ 1), (0+ 2), (0+ 3), (0+ 4), (0+ 5), (0+ 6), (0+ 7), (0+
8), (0+ 9), (0+ 10), (0+ 11), (0+ 12), (0+ 13), (0+ 14), (0+ 15), (0+ 16)}
txSelfTape = {0x0000,
0x0F,0x0010,0x0010,0x7110,0x00,0x00,0x00,0x00,0x00,0x00,0x0F,0x0010,0x0310,0x8110,0x00,0x00,0x00
,0x00,0x00,0x00,0x0F,0x0010,0x1C10,0x0110,0x00,0x00,0x00,0x00,0x00,0x00,0x0F,0x0010,0xE010,0x011
0,0x00,0x00,0x00,0x00,0x00,0x00,0x0F,0x0F10,0x0010,0x0110,0x00,0x00,0x00,0x00,0x00,0x00,0x0C,0x0
000,0x0000,0,0,0,0,0,0,0,0,0,0,0,0}
REGISTER 5-1: ACTIVE MODULES REGISTER (NVAM)
U-x U-x U-x U-x R/W-1 R/W-1 R/W-1 R/W-1
— — — — DECODE DIGITIZER AUTOBASE BESTFREQ
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-x U-x R/W-0 U-x R/W-1
AW_EVENT SW_EVENT FL_EVENT ——FULLSCAN— GESTURE
bit 7 bit 0
Legend:
R = Readable bit x = Bit is unknown -n = Value after initialization (default)
W = Writable bit U = Unimplemented bit q = Conditional
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 15-12 Unused
bit 11 DECODE: Turns touch decoding logic on or off
bit 10 DIGITIZER: Turns digitize r/ I2C™ register output on or off
bit 9 AUTOBASE: Turns on or off automatic baseline functionality
bit 8 BESTFREQ: Turns on or off bestfrequency selection algorithms
bit 7 AW_EVENT: Events related to GestIC airwheel
bit 6 SW_EVENT: Events related to GestIC swipes
bit 5 FL_EVENT: Events related to GestIC flicks
bit 4-3 Unused
bit 2 FULLSCAN: Turns on full mutual scanning
bit 1 Unused
bit 0 GESTURE: Turns on 2d gesture recog niti on
2015 Microchip Technology Inc. Preliminary DS40001803A-page 21
MTCH6303
5.3.2 DIAGNOSTIC MODULES REGISTER
(NVDM)
REGISTER 5-2: ACTIVE DIAGNOSTICS MODULES REGISTER (NVDM)
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
GESTIC DIAG CUSTOM GESTURE FINGERPOS RAWPOS NOISE TRACE
bit 15 bit 8
U-x U-x R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—— ADC_COR ADC MUTRAW SELFRAW MUTCACHE SELFNORM
bit 7 bit 0
Legend:
R = Readable bit x = Bit is unknown -n = Value after initialization (default)
W = Writable bit U = Unimplemented bit q = Conditional
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 15 GESTIC: Forward GestIC® packets to host, also packets from host to GestIC
bit 14 DIAG: Diagnostic Messages
bit 13 CUSTOM: Custom Messages
bit 12 GESTURE: Gesture Messages
bit 11 FINGERPOS: Filtered Touch Data
bit 10 RAWPOS: Unfiltered Touch Data
bit 9 NOISE: Noise Messages
bit 8 TRACE: Trace Messages
bit 7-6 Unused
bit 5 ADC_COR: Use ADC Offsets
bit 4 ADC: ADC Messages
bit 3 MUTRAW: Mutual Raw Data
bit 2 SELFRAW: Se lf Raw Data
bit 1 MUTCACHE: Mutual Normalized Data
bit 0 SELFNORM: Self Normalized Data
MTCH6303
DS40001803A-page 22 Preliminary 2015 Microchip Technology Inc.
6.0 COMMUNICATION EXAMPLES
6.1 Reading Touch Data
The following examples show a frame of data
communicating three Touch ID contact points:
6.1.1 READING TO UCH DATA (USB)
Touch data is populated in the HID report (refer to
Section 3.3.2, HID Generic (EP 2, Streamed
Messages)).
TABLE 6-1: READING TOUCH DATA
Touch ID ID5
5 Conta ct at (2345,4657)
8 Conta ct at (9823,0023)
13 Touch Removed (last contact 7264,1893)
TABLE 6-2: READING TOUCH DATA HID REPORT
00x010x030x050x290x090x310x120x037
REPID STATUS0 ID0 XLSB0 XMSB0 YLSB0 YLSB0 STATUS1
8 0x08 0x5F 0x26 0x17 0x00 0x02 0x0D 0x60 15
ID1 XLSB1 XMSB1 YLSB1 YMSB1 STATUS2 ID2 XLSB2
16 0x1C 0x65 0x07 0x00 ————23
XMSB2 YLSB2 YMSB2 STATUS3 ID3 XLSB3 XMSB3 YLSB3
24 ————————31
YMSB3 STATUS4 ID4 XLSB4 XMSB4 YLSB4 YMSB4 STATUS5
32 ————————39
ID5 XLSB5 XMSB5 YLSB5 YMSB5 STATUS6 ID6 XLSB6
40 ————————47
XMSB6 YLSB6 YMSB6 STATUS7 ID7 XLSB7 XMSB7 YLSB7
48 ————————55
YMSB7 STATUS8 ID8 XLSB8 XMSB8 YLSB8 YMSB8 STATUS9
56 — — — — —0x03— —
ID9 XLSB9 XMSB9 YLSB9 YMSB9 #VALID — —
2015 Microchip Technology Inc. Preliminary DS40001803A-page 23
MTCH6303
6.1.2 READING TOUCH DATA (I2C)
Readi ng touc h dat a ov er I2C must be performed in one
single transaction to ensure the data is all from the
same frame.
FIGURE 6-1: READING TOUCH DATA (I2C™)
6.2 Message Send/Receive
In these examples, a message setting the current
number of RX channels is sent, and the response
received is shown. (including acknowledgment).
6.2. 1 MESSAGE TO SEND
Message ID
0xE0 (CM D_SetParameter)
Payload (message specific)
Address: 0x0100
Data: 0x14
First, the message must be created according to the
message form at in Figure 6-2.
FIGURE 6-2: MESSAGE TO SEND
Note: The host could continue to read all 10 touches, but there is no need since the first byte indicates only
three touches are valid.
S0x25 W0x00 RS 0x25 R0x03
0x03 0x05 0x29 0x09 0x32 0x12
0x03 0x08 0x5F 0x26 0x17 0x00
0x02 0x0D 0x60 0x1C 0x65 0x07 P
Touch 0
Touch 1
Touch 2
0x00 0x01 0x14
0x00 0x01 0x140x00 0x00 0x00 0xFF0xE0
0x00 0x01 0x140x00 0x00 0x00 0xFF 0xFF0xE00x0B3
2
1
ab
cde
f
0xFF 0xFF
0xFF0xFF0xFF
MTCH6303
DS40001803A-page 24 Preliminary 2015 Microchip Technology Inc.
6.2.1.1 Steps
1. Parameter address (a) and value to write (b)
2. Message ID is added (e).
Fill bytes are added to value to make it 32 bits (c).
Dat a mask is a dded (d) – note that sinc e the p arameter
is only one b yte , onl y th e las t by te o f the mas k ac tu all y
affects the behavior.
3. Status byte is added:
-size is 11 (0x0B)
- “more messages” is set to 0
- “is continued” ID set to 0 (this is the start of
message)
6.2.2 EXPECTED RESPONSE
Every message sent to the controller also contains an
acknowledgment message back (ACK), which follows
this format:
Message ID
0xF0 (REP_Ack)
Payload
0xE0 (command received was CM D_SetParameter)
FIGURE 6-3: EXPECTED RESPONSE
6.2.2.1 Steps
1. Expected payload for an ACK message is an
echo of the command being ACK’d – in this
case, 0xE0
2. Message ID is added
3. Status byte is added:
-Size = 2
- More messages = 0
- Continued = 0
6.2. 3 MESSAGE SEND/RECEIVE (USB)
FIGURE 6-4: MESSAGE SEND/RECEIVE (USB)
6.2.3.1 Steps
1. Message to send (from previous section)
2. Adding sequence ID (b), which was chosen at
random for this example. Adding reportID
(alway s 0x0 5)
3. Response expected (from previous section)
4. Adding sequence ID (c), which was chosen at
random for this example. Adding reportID
(alway s 0x0 5).
6.2.4 MESSAGE SEND/RECEIVE (I2C)
First, the host must query the RXRDY buffer to ensure
there is enough space to write the command. In this
case, the controller is reporting that 255 bytes are
available for writing:
FIGURE 6-5: MESSAGE SEND/
RECEIVE (I2C™)
0xE0
0xE00xF0
0xE00xF00x023
2
1
a
0x00 0x01 0x140x00 0x00 0x00 0xFF 0xFF0xE00x0B10xFF 0xFF
0x00 0x01 0x140x00 0x00 0x00 0xFF 0xFF0xE00x0B20xFF 0xFF0x230x05
0xE00xF00x02
0x320x05 0xE00xF00x02
ba
c
d
3
4
S0x25 W0xFB RS 0x25 R0xFF P
2015 Microchip Technology Inc. Preliminary DS40001803A-page 25
MTCH6303
Next, the hos t write s the comma nd into th e co ntrol le r’s
RXBUFF register (Figure 6-6).
FIGURE 6-6: HOST WR IT E TO RXBUFF REGISTER
The host may now query the TXRDY buffer to see if
the respon se is rea dy, eith er after a se t amoun t of time
or by observing IRQ (Figure 6-7).
FIGURE 6-7: HOST READ FROM
TXRDY REGISTER
Since there are three bytes ready to be read, the host
should no w rea d th os e th ree by tes out of the TXBUFF
register (Figure 6-8).
FIGURE 6-8: HOST READ FROM
TXBUFF REGISTER
Reading address 0xFD auto-increments the address
pointer to 0xFE, the stream buffer. Further bytes read
will all be from within the s tream buffer , maintaining the
0xFE addre ss. The first byte read, 0x 03, would indica te
that three more bytes are within the stream buffer and
may be read immediately.
S0x25 W0xFC P
0x00 0x01 0x140x00 0x00 0x00 0xFF 0xFF0xE00x0B 0xFF 0xFF
S0x25 w0xFD RS 0x25 R0x03 P
S
0x25 W0xFE RS 0x25 R0x02 P
Note: The two previous steps could have been
completed in a single read by a host capable of
performing decisions during a read (based on
the value of TXRDY).
MTCH6303
DS40001803A-page 26 Preliminary 2015 Microchip Technology Inc.
7.0 SENSOR DESIGN
CONSIDERATIONS
7.1 Sensor Patterns and PCB Layout
With regard to touch sensor patterns, refer to the
mTouch® Design Center (www.microchip.com/
mtouch) for additional information on designing and
laying out a touch sensor pattern, as well as using the
correct techniques for PCB trace routing.
7.1.1 PROTOTYPING DESIGNS
Touch sensor designs typically require a thorough
debugging phase to ensure a reliable product. If
possible, it is recommended that flexible prototyping
hardware be created with this in mind. A common
example is providing external access to the
communication lines for quick test and tuning while in
circuit.
7.1.2 SENSOR OVERLAY MATERIAL
To prevent saturation of sensor levels, a minimum
overlay of 0.5 mm pl astic or glas s is requir ed for proper
operation of the device, even during a prototyping
phase. (Even if this value is different than the final
design.)
7.1.3 OPERATION WITH AN LCD
The MTCH6303 has integrated algorithms to detect
and minimize the effects of noise, but proper care
should always be taken in selecting an LCD and
support c om po nen ts with a focus on r educing noise a s
much as possible. Since the interaction between the
touch s ens or a nd d is pla y i s h ighly dependen t up on th e
physical arrangement of the components, proper
testing should always be executed with a fully
integrated device. Please reference your projected
capacitive touch screen manufacturer’s integration
guide for additional design considerations.
7.2 Sensor Layout Configuration
The MTCH6303 is designed to work with sensors with
a minimum of 3 RX and 3 TX sensor channels, and a
maximum of 27 RX and 19 TX channels using a single
MTCH652.
7.3 Sensor Output Resolution
The MTCH6303 interpolates 256 discrete points
between each sensor channel and 128 points past the
centerline of each edge. These internal values are then
scaled over a default range of 0-32767 (0-0x7FFF) for
the default sensor configuration. If the number of TX or
RX channels is modified, then the related output
resolution values must also be updated.
7.3.1 MODIFYING OUTPUT RESOLUTION
The X and Y resolution may be modified by changing
address es 0x004 2 thr ough 0x 0047. T he firm ware use s
the values in equation Equation 7-1.
EQUATION 7-1: RESOLUTION CHANGE
These values must be updated when changing the
number of TX or RX channels on the sensor if the
0-0x7FFF resolution is to be maintained.
Note: At no time should the device be expected
to respond correctly to a user touching a
bare PCB sens or.
TABLE 7-1: REGISTERS ASSOCIATED
WITH SENSORS LAYOUT
CONFIGURATION
Address Name Description
0x0200 NUMBEROFX-
CHANNELS Number of
channel s use d for X
axis
0x0280 NUMBEROFY-
CHANNELS Number of
channel s use d for Y
axis
TABLE 7-2: OUTPUT RESOLUTION
REGISTERS
Address Name
0x0042 RX Shift
0x0043 RX Divide
0x0044 RX Offset
0x0045 TX Shif t
0x0046 TX Divi de
0x0047 TX Offset
Final Value Value 2Shift
Divide
----------------------------------- Offset+=
2015 Microchip Technology Inc. Preliminary DS40001803A-page 27
MTCH6303
7.4 Sensor Orientation
To aid in PCB layo ut, the sen sor can be orie nted in an y
direction, have either axis reversed or have the axis
swapped.
TABLE 7-3: SENSOR ORIENTATION
Address Name Description
0x0041 FLIPST A TE Determines X and Y flips,
as well as swaps
REGISTER 7-1: SENSOR ORIENTATION REGISTER
U-x U-x U-x U-x U-x R/W-0 R/W-0 R/W-0
— — — — — XYSWAP TXFLIP RXFLIP
bit 7 bit 0
Legend:
R = Readable bit x = Bit is unknown -n = Value after initialization (default)
W = Writable b it U = Unimplemented bit q = Cond itional
‘1’ = Bit is set ‘0’ = Bit is clea red
bit 7-3 Unused
bit 2 XYSWAP: Swap the TX and RX coordinates
bit 1 TXFLIP: Swap the coordinates along the TX axis
bit 0 RXFLIP: Swap the coordinates along the RX axis
MTCH6303
DS40001803A-page 28 Preliminary 2015 Microchip Technology Inc.
FIGURE 7-1: SENSOR ORIENTATION EXAMPLES
SENSOR
RX0 RXn
TX0
TXn
SENSOR
RXn RX0
TX0
TXn
SENSOR
RX0 RXn
TXn
TX0
SENSOR
RXn RX0
TXn
TX0
SENSOR
SENSOR
SENSOR
TX0 TXn
SENSOR
TXn TX0
0, 0 xM ax , 0
xM ax , yM a x0, yM ax
0, 0 xM ax , 0
xM ax, yM a x0, yM ax
0, 0 xM ax, 0
xM ax , yM a x0, yM ax
0, 0 xM ax, 0
xM ax, yM a x0, yM ax
0, 0 xMax, 0
xM ax, yM a x0, yMax
0, 0 xMax, 0
xM ax, yM a x0, yMax
0, 0 xMax, 0
xM ax, yM a x0, yM ax
0, 0 xMax, 0
xM ax, yM a x0, yM ax
RX0
RXn
RX0
RXn
RX0
RXn
RX0
RXn
TX0 TXn
TXn TX0
XY SWAP
TXFLIP
RXFLIP
0
1
0
XY SWAP
TXFLIP
RXFLIP
0
0
0
XY SWAP
TXFLIP
RXFLIP
0
1
1
XY SWAP
TXFLIP
RXFLIP
0
0
1
XY SWAP
TXFLIP
RXFLIP
1
0
1
XY SWAP
TXFLIP
RXFLIP
1
0
0
XY SWAP
TXFLIP
RXFLIP
1
1
1
XY SWAP
TXFLIP
RXFLIP
1
1
0
Defa ul t C on fig ura ti on
2015 Microchip Technology Inc. Preliminary DS40001803A-page 29
MTCH6303
8.0 FIRMWARE UPDATE
8.1 Library Loader
The MTC H6303 de vices ar e manufa ctu red with a b uilt-
in Library Loader (bootloader) only. There will not be
any PCAP touch decoding library preloaded. The
library loader has interfaces for USB HID and I2C, so
that an MTCH6303 library can be uploaded to the
MTCH63 03 Flas h memory.
The latest MTCH6303 PCAP touch decoding library
can be found in the MTCH6303 Utility download which
can be accessed from the MTCH6303 device page.
There are three ways to upload the MTCH6303 library
to the MTC H6303 devi ce, as listed i n Sections 8 .1.1. to
8.1.3 below.
8.1.1 UPLOAD VIA THE MTCH6303
UTILITY
The MTCH6303 Utility can be used to perform the
update. For this option, USB connectivity to a PC with
the MTCH6303 Utility installed will be needed.
8.1.2 UPLOAD VIA EMBEDDED HOST
CONTROLLER
This option requires an embedded host controller
which performs the upload using the MTCH6303
Bootloader commands (refer to Table 8-1).
Microchip pre-programmed MTCH6303 parts can be
ordered through the Microchip Programming Center.
Please reference www.microchipdirect.com/
programming for further information.
8.1.3 QUICK TIME PROGRAMMING (QTP)
For larger quantities of pre-programmed parts with
unique part numbers, contact your local Microchip
sales office.
8.2 Overview
The firmware update process involves a host device
transmitting a hex file to the MTCH6303 while in
Bootloader mode. The hex file should be parsed and
all data bytes extracted before being sent to the
MTCH6303. This can either be done by the host or by
software that utilizes the host as a bridge to send the
bytes to the MTCH6303.
When the MTCH6303 is in Bootloader mode, the host
has access to commands to read, erase and write
ROM pages that contain the touch application. An
outline of the update procedure is detailed in this
section.
8.3 Bootloader Command Overview
The command interpreter within the bootloader
operates in a similar manner as the standard
MTCH6303 command interpreter. The bootloader
supports the following commands:
TABLE 8-1: BOOTLOADER COMMANDS
ID Name Description
0x10 EXIT_BOOTLOADER Exit Bootloader mode
0x11 SETUP_SESSION Setup and initiate a
bootloading session
0x12 ERASE_PAGE Erase a ROM page
0x1 3 SET_ADDRESS Writ e the Flash
address to operate on
0x14 LOAD_DATA Load program data
into RAM
0x15 WRITE_PAGE Latch program data
from RAM into R OM
0x16 V ALIDA TE_FW Read from a section in
Flash
0x17 READ_FLASH Read a section in
ROM
0xff QUERY_VERSION Read the bootloader
firmware revision
MTCH6303
DS40001803A-page 30 Preliminary 2015 Microchip Technology Inc.
8.4 Update Procedure
FIGURE 8-1: BOOTLOADER
FLOWCHART
8.4.1 ENTER THE BOOTLOADER
The MTCH6303 normally runs in Application mode, so
the host mus t communicate to the MTCH 63 03 to en ter
its Bootloader mode. To do this, issue the ‘Enter
bootloader’ command as seen in Section 10.5,
Command: ENTER_BOOTLOADER. If using USB,
the device will disconnect from the USB bus, then re-
attach as the bootloader. (VID 0x04D8, PID 0x09D5)
8.4.2 SETUP A FIRMWARE UPDATE
SESSION
Once the MTCH6303 is in Bootloader mode establish
an update session with the MTCH6303. The purpose of
this is to setup the ROM boundaries and other various
param et ers for the update. Use the SETUP_SESSI ON
comma nd t o c onfi gure the sessio n. Pri or to receiving a
valid SETUP_SESSION command the bootloader will
not allow modifications to the ROM. Once a
SETUP_SESSION command is received, the
application firmware is identified as unstable and it is
no longer possible to exit the bootloader until a
firmware update sequence has been completed.
8.4.3 PERFORM A SETADDRESS/ERASE/
WRITE CYCLE ON EACH ROM
PAGE
With a valid session in place the host can now begin
acces sin g th e MT C H 630 3 de vi ce’s ROM to update the
firmwa re. The typical proc edure is to upd ate the devic e
one Flash page at a ti me, erasin g and writin g one pag e
before moving onto the next.
First, use SET_ADDRESS to configure the address of
the start of the ROM page to perform further operations
on. The address should be the start of a 4 Kb ROM
page.
Next, use ERASE_PAGE to erase the page s tarting at
the address selected using the SET_ADDRESS
command.
Once the pa ge is eras ed, the host should se nd parsed
hex dat a to update the selecte d page. Thi s process wil l
ta ke several iteratio ns of the LOAD_DAT A co mmand to
write all 4Kb of data. The LOAD_DATA command has
size and offset parameters that denote respectively the
size of the current LOAD_DATA packet and the offset
from the address defined by the SET_ADDRESS
command.
After all 4 Kb of data has been provided to the
controller, use the WRITE_P AGE command to wri te the
data i nto the selected page.
Continue this process of SET_ADDRESS,
ERASE_PAGE, LOAD_DATA(s), and WRITE_PAGE
for each 4Kb block of ROM until the entire update is
completed.
8.5 Bootloader Commands
This section describes the bootloader commands . The
format for each command and its response are detailed
below.
8.5.1 COMMANDS
8.5.1.1 0X10 EXIT _B OOT LO A DER
When called, this command will cause the bootloader
to exit, returning to the touch application if a valid
application is present. If not, the controller will remain
in Bootloader mode.
TABLE 8-2: EXIT BOOTLOADER
Cmd Size Cmd ID Data
0x01 0x10 <none>
2015 Microchip Technology Inc. Preliminary DS40001803A-page 31
MTCH6303
8.5.1.2 0x11 SETUP_SESSION
This will initiate a bootloading session, defining
session type, start address and end address.
8.5.1.3 0x12 ERASE_PAGE
This command will cause the currently set page to be
erased. The SET_ADDRESS command must be used
to define the address of the page to be erased prior to
calling ERASE_PAG E.
8.5.1.4 0x13 SET_ADDRESS
This com mand def ines the st art address of the pa ge of
ROM to perform furth er ope rati ons upon . This add res s
MUST be the start of one of the 4 Kb ROM pages.
8.5.1.5 0x14 LOAD_D ATA
Load application data from the host into RAM.
8.5.1.6 0x15 WRITE_PAGE
Write loaded RAM data into ROM at the defined
address.
8.5.1.7 0x16 VA LIDATE_FW
Read from a section in Flash.
8.5.1.8 0x17 READ_FL AS H
Read a section in ROM.
8.5.1.9 0xff QUERY_VERSION
Read the bootloader firmware version.
8.5.2 RESPONSES
TABLE 8-3: SETUP SESSION
Cmd
Size Cmd
ID Data
0x0A 0x11 Session
Type [8 bits] Start
Address
[32 bits]
End
Address
[32 bits]
TABLE 8-4: ERASE PAGE
Cmd Size Cmd ID Data
0x01 0x12 <none>
TABLE 8-5: SET ADDRESS
Cmd
Size Cmd
ID Data
0x05 0x13 Addr[7:
0] Addr[15:
8] Addr[23:1
6] Addr[3
1:24]
TABLE 8-6: LOAD DATA
Cmd
Size Cmd
ID
Data
Size Offset progData[0]-
progData[n]**
varies 0x14 [7:
0]
[15:8
]
[7:
0]
[15:
8]
[0] [n]**
Note: Max length of progData is 54 bytes.
TABLE 8-7: WRITE PAGE
Cmd Size Cmd ID Data
0x01 0x15 <none>
TABLE 8-8: VALIDATE FW
Cmd Size Cmd ID Data
0x01 0x16 <none>
TABLE 8-9: READ FLASH
Cmd Size Cmd ID Data
0x03 0x 17 Size [7:0] Size[15 :8]
TABLE 8-10: QUERY VERSION
Cmd Size Cmd ID Data
0x01 0xff <none>
TABLE 8-11: BOOTLOAD COMMAND
RESPONSE ID
Value Description
0x00 Successful operat ion
0x07 Checksum mismatch
0x08 Flash read/erase/write failure
0x0a Out-o f-Ran ge add res s
0x0b No session data
0x0c Unrecognized comm and ID
0x0d Invalid number of bytes for this command
0x0e Error exiting Bootloader mode
2015 Microchip Technology Inc. Preliminary DS40001803A-page 33
MTCH6303
9.0 OPE RATING MODES
The MTCH6303 allows enabling and disabling
individual modules within the controller by modifying
the active Modules (NVAM) register. Node control is
from the NVAM in conjunction with the Streaming
Modes register.
REGISTER 9-1: STREAMING MODE REGISTER (STREAMINGMODE)
U-x U-x U-x U-x U-x U-x U-x U-x
MODE<7:0>
bit 7 bit 0
Legend:
R = Readable bit x = Bit is unknown -n = Value after initialization (default)
W = Writable bit U = Unimplemented bit q = Conditional
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 MODE: Mode Selection – See Section 9.2, Controller State Machine for more information.
0: 2D3D
1: PCAP_ONLY
2: GESTIC_BRIDGE
4: ACTIVE_STANDBY
5: 2D_SLEEP_MODE
0xFF: INVALID
MTCH6303
DS40001803A-page 34 Preliminary 2015 Microchip Technology Inc.
9.1 Active Modules Register (NVAM)
9.2 Controller State Machine
Using the Active Modules Register there are numerous
different operating modes for the MTCH6303. The
streaming Mode register (address 0x0082) can be
used to configure the overall operational mode of the
controller. Please contact Microchip for further
information on using the MTCH6303 in combination
with an MGC3130 GestIC® controller for 3D gestures.
REGISTER 9-2: ACTIVE MODULES REGISTER (NVAM)
U-x U-x U-x U-x R/W-1 R/W-1 R/W-1 R/W-1
— — — — DECODE DIGITIZER AUTOBASE BESTFREQ
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-x U-x R/W-0 U-x R/W-1
AW_EVENT SW_EVENT FL_EVENT ——FULLSCAN— GESTURE
bit 7 bit 0
Legend:
R = Readable bit x = Bit is unknown -n = Value after initialization (default)
W = Writable bit U = Unimplemented bit q = Conditional
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 15-12 Unused
bit 11 DECODE: Turns touch decoding logic on or o ff
bit 10 DIGITIZER: Turns digitizer/I2C register output on or off
bit 9 AUTOBASE: Turns on or off automatic baseline functionality
bit 8 BESTFREQ: Turns on or off bestfrequency selection algorithms
bit 7 AW_EVENT: Events related to GestIC® airwheel
bit 6 SW_EVENT: Events related to GestIC® swipes
bit 5 FL_EVENT: Events related to GestIC® flicks
bit 4-3 Unused
bit 2 FULLSCAN: Turns on full mutual scanning
bit 1 Unused
bit 0 GESTURE: Turns on 2D gesture recognition
2015 Microchip Technology Inc. Preliminary DS40001803A-page 35
MTCH6303
FIGURE 9-1: STANDARD CONTROLLER OPERATION STATE MACHINE
FIGURE 9-2: 2D ONLY MODE
2D
Active
2D
Recent
3D
Gesture
3D
Approach
Sleep
2D
Self
touch touch
Starting s tate of MTCH6303
Reachable state
Disabled state
Power
Saving
2
D
Ac
tiv
e
2
D
Rece
nt
3
D
Ges
t
u
r
e
3
D
App
roac
h
S
l
eep
2
D
Se
l
f
t
ouc
h t
ouc
h
Po
w
er
Sav
i
n
g
Scan rate:
120 Hz
Active
Standby
Host
2D sleep
Host
2D
Active
2D
Recent
3D
Ge stu re
3D
Approach
Sl eep
2D
Self
touch touch
Pr oxi
detected
Timer
wakeup
Note: Set to 2D mode only
CMD: 0x82, 1
MTCH6303
DS40001803A-page 36 Preliminary 2015 Microchip Technology Inc.
FIGURE 9-3: DISABLE AUTO-SLEE P
FIGURE 9-4: DISABLE AUTO-WAKE -UP
2D
Active
2D
Recent
3D
Ge stu re
3D
Approach
touch touch
Pr oxi
detected
Sl eep
2D
Self
touch
Timer
wakeup
Note: Disable Auto-sleep
CMD: bit12 (NVAM)
The PCAP does not return to sleep
2D
Active
2D
Recent
3D
Ge stu re
3D
Approach
Sl eep
2D
Self
touch touch
Pr oxi
detected
Timer
wakeup
Note: Disable Auto-Wake-up
CMD: bit13 (NVAM)
The PCAP does not return to Active mode.
The Sleep time can be set with idleTime2D parameter
CMD: 0x103, 64 (data in ms, max 420 ms)
2015 Microchip Technology Inc. Preliminary DS40001803A-page 37
MTCH6303
FIGURE 9-5: ACTIVE STANDBY MODE
FIGURE 9-6: 2D SLEEP MODE
2D
Active
2D
Recent
3D
Ge stu re
3D
Approach
Sl eep
2D
Sel f
touch to uch
Pr oxi
detected
Timer
wakeup
Active
Standby
Host
Note: Set to Active Standby mode
CMD: 0x82, 4
Safe mode to change multiple parameters without having any side effect on the code. No running code
in this mode.
2D
Active
2D
Recent
3D
Ge stu re
3D
Approach
Sl eep
2D
Self
touch to uch
Pr oxi
detected
Ti mer
wakeup
2D Sleep
Host
Note: Set to 2D Sleep mode
CMD: 0x82, 5
MTCH6303
DS40001803A-page 38 Preliminary 2015 Microchip Technology Inc.
10.0 APPLICATION COMMANDS
10.1 Command: ECHO
Host command to test communication. Host sends
<04><01><02><03>, and the controller will respond
with the exact same packet <04><01><02><03>. Any
bytes following the 0x04 ID byte will not be processed
by the controller, and should only be used to verify
communication is working properly.
10.2 Command: FORCE_BASELINE
Forces the controller to update touch sensor baseline
measurements.
TABLE 10-1: APPLICATION COMMANDS
CMD ID Name Description
0x04 ECHO Echo back the received packet
0xfb FORCE_BASELINE Force the touch sensor to update its baseline measurements
0xff QUERY_VERSION Read the MTCH6303 firmware and application revisions
0x17 READ_FLASH Read from a section in ROM
0x55 ENTER_BOOTLOADER Enter Bootloader mode
0xfc GESTIC_BRIDGE Pass information through to an MGC3130
0xe0 SET_PARAMETER Write a value to a register
0xe1 GET_PARAMETER Read a value from a register
TABLE 10-2: COMMAND: ECHO
Byte Value Description
1n+1 Length, # of bytes to
follow
2 0X04 Command ID
3-n Packet[0]:Packet[n] Test packet
inform ation for
confirmation
TABLE 10-3: COMMAND RESPONSE:
ECHO
Byte Value Description
1n+1 Length, # of bytes to
follow
2 0X04 Command ID
3-n Packet[0]:Packet[n] Identical test pa cket for
confirmation
TABLE 10-4: COMMAND:
FORCE_BASELINE
Byte Value Description
1 0x01 Length, # of bytes to follow
2 0Xfb Command ID
TABLE 10-5: COMMAND RESPONSE:
FORCE_BASELINE
Byte Value Description
1 0x02 Length, # of bytes to follow
2 0Xf0 Acknowledge CMD ID
30xfbRepeat FORCE_BASELINE
Command ID
TABLE 10-6: FORCE_BASELINE EXAMPLE
SEND
0x01 0xfb
Length CMD ID
RECEIVE
0x02 0xf0 0xfb
Length ACK CMD ID Repeat
FORCE_BASELINE
ID
2015 Microchip Technology Inc. Preliminary DS40001803A-page 39
MTCH6303
10.3 Co mmand : QUERY_ VERSION
The QUERY_VERSION command will read the
MTCH6303 firmware and application revisions.
Sending a QUERY_VERSION command while in
Application mode will prompt two packets to be
returned from the MTCH6303. The first packet will
contain the 128 bytes of version data, and the second
packet is the acknowledgment of the
QUERY_VERSION command.
10.4 Command: READ_FLASH
Read from a section in ROM. When used as an
application command, the controller will respond with
two packets: one containing the read data, and a
second acknowledgment packet.
10.5 Command:
ENTER_BOOTLOADER
10.6 Command: GESTIC_BRIDGE
Use GEST IC_BRIDG E to p ass inform ation through the
MTCH6303 to the MGC3130 controller.
TABLE 10-7: COMMAND:
QUERY_VERSION
Byte Value Description
1 0x01 Length, # of bytes to follow
2 0Xff Comma nd ID
TABLE 10-8: COMMAND RESPONSE:
QUERY_VERSION
Byte Value Description
1 0x80 Length, # of bytes to follow
2 128 bytes of ve rsion information
130
1 0x02 Length, # of bytes to follow
2 0Xf0 Ackno wled ge C MD ID
3 0xff Repeat QUERY_VERSION
Command ID
TABLE 10-9: COMMAND: READ_FLASH
Byte Value Description
1 0x07 Length, # of bytes to follow
2 0x17 Command ID
3 addr[7:0]
4-byte (32-bit) Start address
4 addr[15:8]
5 addr[23:16]
6 addr[31:24]
7 size[7:0] Length of Flash block to read,
in Bytes
8size[15:8]
TABLE 10-10: COMMAND RESPONSE:
READ_FLASH
Byte Value Description
1 0x05 Length, # of bytes to follow
2 0x17 Command ID
3-[size] Data [size] number of bytes of data, as
requested in command, starting
at Start address
1 0x02 Length, # of bytes to follow
2 0Xf0 Acknowled ge CMD ID
30x17
Repeat GET_REGISTER CMD
ID
TABLE 10-11: COMMAND:
ENTER_BOOTLOADER
Byte Value Description
1 0x01 Length, # of bytes to follow
2 0X55 Command ID
TABLE 10-12: COMMAND RESPONSE:
ENTER_BOOTLOADER
Byte Value Description
1 0x02 Length, # of bytes to follow
2 0Xf0 Acknowledge CMD ID
30x55Repeat ENTER_BOOTLOADER
command ID
TABLE 10-13: COMMAND: GESTIC_BRIDGE
Byte Value Description
1 n+1 Length, # of bytes to follow
2 0Xfc Command ID
3-n Packet[0]:P
acket[n] Packets to send to MGC3130
MTCH6303
DS40001803A-page 40 Preliminary 2015 Microchip Technology Inc.
10.7 Register Commands
There are a number of para met er reg is ters that can be
configured to modify the performance of the
MTCH6303. Table details a list of all modifiable regis-
ters.
TABLE 10-14: COMMAND RESPONSE:
GESTIC_BRIDGE
Byte Value Description
1 n+1 Length, # of bytes to follow
2 0Xf0 Acknowledge CMD ID
3-n Packet[0]:
Packet[n] Packets to send to MGC3130
TABLE 10-15: COMMAND: SET_REGISTER
Byte Value Description
1 0x0b Length, # of bytes to follow
2 0xe0 Command ID
3 addr[7:0] 2-byte (16-bit) Register
Address
4 addr[15:8]
5 value[7:0]
4-byte (32-bit) register value
to be written
6 value[15:8]
7 value[23:16]
8 value[31:24]
9 mask[7:0]
4-byt e (32-bi t) va lue to mask
register va lue to be written
10 mask[15:8]
11 mask[23:16]
12 mask[31:24]
TABLE 10-16: COMMAND: SET_REGISTER
RESPONSE
Byte Value Description
1 0x02 Length, # of bytes to follow
2 0Xf0 Acknowledge CMD ID
30xe0 Repeat SET_REGISTER
Command ID
TABLE 10-17: SET_REGISTER 0X0004 TO VALUE 0XAABBCCDD EXAMPLE
SEND
0x0b 0xe0 0x04 0x00 0xdd 0xcc 0xbb 0xaa 0xff 0xff 0xff 0xff
Length CMD ID Register 0x0004 New Register Value 0xaabbccdd Register Bit Mask
RECEIVE
0x02 0xf0 0xe0
Length ACK CMD ID Repeat SET_REGISTER ID
2015 Microchip Technology Inc. Preliminary DS40001803A-page 41
MTCH6303
10.8 Command: GET_REGISTER
The MTCH6303 will respond with two packets when
issued the GET_REGISTER command. The first
packet will contain the data, and the second packet is
the acknowledgment of the GET_REGISTER
command.
TABLE 10-18: COMMAND: GET_RESGISTER
Byte Value Description
10x03 Leng th, # of bytes
to follow
2 0xe1 Command I D
3 addr[7:0] 2-byte (16-bit)
Register Addre ss
TABLE 10-19: COMMAND: GET_REGISTER
RESPONSE
Byte Value Description
1 0x05, 0x06, or 0x07 Length, # of bytes
to follow
2 0xe1 Comma nd ID
3 addr[7:0] 2-byte (16-bit)
Register Address
4 addr[15:8]
5 value[7:0] Up to 4 bytes
(32bit) of value
dat a, dep end ing
on register
6 value[15:8]
7 value[23:16]
8 value[31:24]
10x02 Length, # of bytes
to follow
20Xf0 Acknowledge
CMD ID
30xe1 Repeat
GET_REGISTER
CMD ID
TABLE 10-20: GET_REGISTER VALUE 0X00CC AT 0X0004 EXAMPLE
SEND
0x03 0xe1 0x04 0x00
Length CMD ID Register 0x0004
RECEIVE
0x05 0xe1 0x04 0x00 0xcc 0x00 0x02 0xf0 0xe1
Length CMD ID Register 0x0004 Data Length ACK
CMD ID
Repeat
GET_REGISTER
CMD ID
MTCH6303
DS40001803A-page 42 Preliminary 2015 Microchip Technology Inc.
TABLE 10-21: MTCH6303 PARAMETER REGISTERS
Register # Name Description Default Value
0x0040 numOfAvg
0x0041 flipState bit 0 = X flip, bit 1 = Y f lip , bi t 2 = X/Y
swap
0x0080 diagMask
0x0081 activeModules
0x0082 streamingMode
0x0100 numberOfXChannels Number of R X Channels al ong long/
wide axis of touch screen
0x0101 numberOfYChannels Number of TX Channels along short/
narrow axi s of touch screen
0x0200 - 0x021a rxPinMap[0] - rxPinMap[26]
0x0280 - 0x02a3 txPinMap[0] - txPinMap[35]
0x0400 selfTouchThres
0x0401 mutTouchThres
0x0402 weightThreshold
Limits the max distance a touch can
travel between frames before
assigning a new ID (native position
units)
0x0403 penDownTimer
0x0404 penUpTimer
0x0405 largeActThres
0x0480 minCuspDelta Slope value must be above this to
determine that a ‘peak’ has been
found
0x0500 swipeTimeout
0x0501 swipeDistance
0x0502 swipeBorder.left
0x0503 swipeBorder.right
0x0504 swipeBorder.top
0x0505 swipeBorder.bottom
0x0540 tapBorder.left
0x0541 tapBorder.right
0x0542 tapBorder.top
0x0543 tapBorder.bottom
0x0800 diagRxChannel
0x0801 diagTxChannel
0x0802 baseUpdateTime Stopwatch time for baseline counter,
no touch for this duration will engage
a recalib rati on
0x0803 - 0x0806 mutScanPeriode[0] -
mutScanPeriode[3]
2015 Microchip Technology Inc. Preliminary DS40001803A-page 43
MTCH6303
0x0807 - 0x080a mutScanPhase[0] -
mutScanPhase[3]
0x080b mutFreqHopping If >0, selects Fixed Frequency mode
(indexed by this value). If 0, all
frequencies are in use
0x080c - 0x080f mutFreqHoppingLevel[0] -
mutFreqHoppingLevel[3]
Provides a software gain for
frequencies that provide smaller
amplitude than n ormal. (0 = none)
0x0810 selfSampleTime
0x0811 mutSampleTime
0x0812 - 0x0815 selfScanPhase[0] -
selfScanPhase[3]
0x0816 - 0x0819 selfScanISRPhase[0] -
selfScanISRPhase[3]
0x081a syncRxChannel
0x081b syncTxChannel
0x081c fullScanRxStart
0x081d fullScanRxStop
0x081e fullScanTxStart
0x081f fullScanTxStop
0x0900 mtch65x_periode_fast_rise Period for TMR2 (pwm for 652)
0x0901 mtch65x_periode_-
fast_rise_oc
Sets OC1 for TMR2 duty cycle -
divide “fast_rise” by this number to
calculate DC
0x0902 mtch65x_fast_rise_delay TMR1 counts to wait un til full boost is
established
0x0905 - 0x0908 mtch65x_periode_mutu_mea-
surement[0] - mtch65x_peri-
ode_mutu_measurement[3]
0x0909 - 0x090c
mtch65x_periode_mutu_mea-
surement_oc[0] -
mtch65x_periode_mutu_mea-
surement_oc[3]
0x090d - 0x0910 mtch65x_periode_self_mea-
surement[0] - mtch65x_peri-
ode_self_measurement[3]
0x0911 - 0x0914
mtch65x_periode_self_mea-
surement_oc[0] -
mtch65x_periode_self_mea-
surement_oc[3]
TABLE 10-21: MTCH6303 PARAMETER REGISTERS (CONTINUED)
Register # Name Description Default Value
MTCH6303
DS40001803A-page 44 Preliminary 2015 Microchip Technology Inc.
11.0 GESTURE FEATURES AND
PARAMETERS
To simplify touch-based application development the
controll er already i ncludes th e cap ability t o recognize a
fixed set of touch gestures. The gesture recognizer
supports the following kinds of gestures:
• Swipe-Gestures
• Scroll-Gestures
• Tap-Gestures
The gesture recognizer in the MTCH6303 is generic in
that it supports those gestures for any number of
fingers greater or equal to one. In practice, the
maximum number of fingers is still limited because of
the following two othe r factors:
1. The number of concurrent finger contacts the
touch digitizer stages of the MTCH6303 is able
to tr ace. This is cur rent ly in ter nal ly li mited to 10
although HID only reports a maximum of 5.
2. Ergonomic considerations also play a role: e.g.,
on a 3.7-inch touch surface the user would be
hard pressed to correctly perform a five finger
gesture.
In order for gestures to be recognized, the gesture
recognition module has to be enabled and in order to
output results the gesture bit has to be set in the
diagnostic mask (see Section 7.0, Sensor Design
Considerations).
11.1 Swipe Gestures
The MTCH6303 can detect two different types of
swip es: swip es start ing from the ed ge and then goi ng
towards the center of the touch surface and swipes
with in t he c entr al are a of the sens or. T he cr iter ia used
to decide when a user’s movement should be
consid ered an edge s wipe are il lustrated in Figure 11-1
below.
FIGURE 11-1: SWIPE GESTURES
1. The user starts touching the surface with “n”
fingers, where n is any number greater than
zero. In the illustration above the user touches
the surface with three fingers on the northern
edge of the devic e.
2. The gesture recognizer checks if all fingers
started on the same edge of the device. It does
so in a tolerant w ay: i.e., if two fingers were on
the northern edge, but a third finger was in the
north-east corner, it would consider it to be on
the northern edge. If all fingers did not start on
the sa me ed ge, the gesture re cognize r will ab ort
the swipe detection at this stage.
3. To distinguish between the edge and the inner
area of the surface the gesture recognizer uses
two parameters: SwipeBorder and
SwipeExtBorder. The two parameters are
nec essary for the f ollowing reasons :
• In order to avoid the user accidentally starting a
swipe gesture it is desirable to make the border
area as narro w as poss ib le.
• However when touching with multiple fingers it is
hard for the user to align all of them sufficiently
within a narrow band. Typically the contact points,
when touching with multiple fingers, would be on
a sli ght curve, not a straight line.
• To resolve this dilemma, between having narrow
border area to avoi d accide nta l sw ipes a nd havin g
a wider one to allow for easier use with multiple
fingers, the recognizer utilizes two border areas.
One, SwipeBorder, having smaller borders and
another one, SwipeExtBorder, with bigger
borders, which is inside of it. The recognizer then
only requires one finger to start within the
narrower borders described by SwipeBorder, all
the other fingers are allowed to start within the
wider borders from SwipeExtBorder to be
considered on an edge.
4. If the con troller determines that the st art positio n
is not with in the edge, the re cog ni zer che ck s f or
a center swipe to have occurred. If all fingers
have moved beyond a certain distance (param-
eter centerSwipeDistance) and stayed within a
certa in range of horizont al or vertical (para meter
centerSwipeMaxWidth), then a center swipe
message is generated.
SwipeExtBorder
SwipeBorder
SwipeExtBorder
SwipeBorder
centerSwipeDistance
CenterSwipeMaxWidth
2015 Microchip Technology Inc. Preliminary DS40001803A-page 45
MTCH6303
5. If the edge criteria have been fulfilled, the user
has to move all fingers towards the center. The
recognizer checks if all fingers have moved
beyond a certain distance (parameter
SwipeDistance) within a specific timeout
(parameter SwipeTimeout). For swipes starting
from the n orthern or the s outhern edge, only th e
vertical distance is considered, while for swipes
starting from the western or eastern edge only
the horizontal distance is considered. Once the
user has moved all touching fingers beyond the
distance threshold, a swipe is reported, unless
the timeo ut has expi red. The gestu re recogniz er
then sto ps the s wipe de tection un til the use r has
removed all fingers from the surface and starts
touching again.
The unit for the timeout is in 1s/156250, so a value of
2343 75 cor responds to 1.5 seconds.
Distance and border are in units of internal digitizer
resolution, without any coordinate transformation such
as scaling or flipping applied.
ID: A0
Payload:uint8 flags; // flags describing the swipe
uint8 fingers; // number of fingers which
participated in the swipe.
Flags is a bitmas k . It conta ins curre ntl y only one of the
following values (in theory they are logically or-ed
toget her, but p rac tic all y a swip e is on ly f rom one edge,
so they are mutually exclusive).
EDGE_N 0x 01 // swipe started at northern
edge EDGE_E 0x02 // … eastern…
EDGE_S 0x04 // … southern…
EDGE_W 0x08 // … western…
SWIPE_SOUTH 0x10 // center swipe moving
south
SWIPE_WEST 0x20 // center swipe moving
west
SWIPE_NORTH 0x40 // center swipe moving
north
SWIPE_EAST 0x80 // center swipe moving
east
11.2 Scroll Gestures
The gesture recognizer takes the incoming data of the
moving fingers and derives additional data from them
which can be used in an application to generate
responses such as scroll, zoom and other gestures
which depend on sliding fingers. As soon as the user
touches the surface with n fingers, with n being any
number greater than zero, the gesture recognizer
continuously calculates the center of the touching
points as well as the length of the diagonal of the
boundin g bo x arou nd thos e poin ts, as illus trated b y the
followi ng drawing.
TABLE 11-1: PARAMETERS ASSOCIATED
WITH SWIPE GESTURES
ID Name Type
Default
(Sensor:
10137_100h)
0x0500 SwipeTimeout uint32 234375
(1.5s)
0x0501 SwipeDistance uint16 1024
0x0502 SwipeBorder.Left uint16 768
0x0503 SwipeBorder.Right uint16 4352
0x0504 SwipeBorder.Top uint16 768
0x0505 SwipeBorder.Bot-
tom uint16 8448
0x0506 SwipeExtBorder.Left uint16 1536
0x0507 SwipeExtBor-
der.Right uint16 3484
0x0508 SwipeExtBorder.Top uint16 1536
0x0509 SwipeExtBor-
der.Bottom uint16 7680
0x050A centerSwipeDis-
tance uint16 1024
0x050B centerSwipeMax-
Width uint16 512
TABLE 11-2: MESSAGE OUTPUT FOR
SWIPE GESTURES
ID Payload
0xA0 Flags Fingers
byte Uint8 Uint8
Note: Edge swipes are named by the edge the
swipe starts from. Center swipes are
named by the direction of travel.
MTCH6303
DS40001803A-page 46 Preliminary 2015 Microchip Technology Inc.
FIGURE 11-2: SCROLL GESTURES
As can be seen, the bounding box is orthogonal to the
coordinate system of the surface, the edges being
horizontal and vertical. There is no attempt to find a
smaller bounding box for the surface contact points,
which would be rotated against the surface. For two
fingers the length of the diagonal of the bounding box
is incidentally equal to the distance between those two
fingers and the center of gravity would equal the
mid point between the two. For three or more fingers no
such obvious interpretation is available, but since the
bounding box circumscribes all touching fingers the
behavior of the diagonal measure when spreading out
those fingers on the surface or contracting them is
often quite usable, depending on the application. The
comput ati on als o run s when the u ser touches wi th onl y
a single finger.
There are no parameters associated with scroll
gestures.
ID: 0xA1
Payload:uint8 fingers; // number of fingers touching
uint8 diamHi; // bits 16 to 23 of diam eter
uint16 diam; // bits 0 to 15 of diameter
uint16 centerX; // x of center of gravity
uint16 centerY; // y of center of gravity
Currently diamHi can be ignored. It is here for future
compatibility.
11.3 Tap Gestures
There is also support in the gesture recognizer to
detect short taps on the surface. The implemented
algorithm also supports detection of repeated taps as
well as taps with multiple fingers.
FIGURE 11-3: TAP RECOGNIZER
Once the user contacts the surface a timer starts
running. If the user does not lift their finger(s) from the
surface before TapTimeout has expired (as in part A of
the drawing), the tap is considered aborted and the
recognizer stops further processing. If the user lifts the
finger without exceeding the timeout (as in part B and
C), the recognizer considers it a tap.
If the gesture recognizer has recognized a tap a
second timeout, which is used to distinguish repeated
taps from single taps and is called RepeatTimeout,
starts running. If the user does not touch the surface
before the timer has expired (part B), the next tap will
not be co nsidered a repeate d tap. Otherwise, if he does
touch th e surface whil e the timeou t has not expired , the
following touch will be indicated as a repeated tap.
FIGURE 11-4: TAPBOARDER
PARAMETER
At least one finger has to be inside the area enclosed
by TapBorder to start tap recognition, while the other
fingers may be either outside or inside. So for a one
finger tap the finger has to be inside, while for a two
fing er ta p, o ne f i nger m u st be i ns id e , whi l e t he s e co nd
can be either inside or outside.
This is done because a user moving around at the
edges of the surface might enter and leave the actual
area where touch is detected for very short moments
and thereby trigger ac cidental tap events. By requiring
at least one finger to be inside a smaller area, this can
be prevented.
TABLE 11-3: MESSAGE OUTPUT FOR
SCROLL GESTURES
ID Payload
0xA1 Fingers diamHi Diam centerX center
byte Uint8 Uint8 Uint16 Uint16 Uint16
2015 Microchip Technology Inc. Preliminary DS40001803A-page 47
MTCH6303
The unit for the timeouts is 1s/156250, so a value of
31250 corresponds to 200 milliseconds and a value of
78125 to 500 milliseconds.
The border is in units of internal digitizer resolution,
without any coordinate transformation such as scaling
or flipping applied.
ID: A2
Payload:uint8 flags; // flags with details about the tap
uint8 fingers; // number of fingers for this tap.
The flags field is a bitmask where the following values
could be logically or-ed together:
TAPPED 0x01
ABORTED 0x02
NOREPEAT 0x04
REPEAT 0x08
EQFINGERS 0x10
If TAPPED is set it means that a tap has occurred, in
that case the “fingers” field contains the number of
fingers used for this tap.
The ABORTED flag is set if tap recognition has been
aborted because TapTimeout has expired (part A of
previ o us dr a wi ng ). I n th is ca se t he “f in ge rs ” f i el d is not
valid.
The REPEAT/NOREPEAT flags can be used to
distinguish between taps which happened within a
timespan of RepeatTimeout from the previous tap, or
from which the previous tap has been a longer while
back.
The EQFINGERS flag indicates that the previous tap
was performed with the same number of fingers
touching the surface than t he cur rent one.
Having all those flags allows the user t o decide whether
to distinguish between repeated taps and single
isolated taps or not to do so by either looking at the
REPEAT/NOREPEAT flags or by ignoring them.
Likew is e, th e us er m ay dec id e if a repe ate d tap should
only be considered a repeated tap if it was performed
with th e same nu mb er of fin gers as th e pr eviou s tap b y
simply looking at the EQFINGERS field in addition to
the REPEAT field. If the user instead does not care if a
repeated tap has been performed with a different
number of fi ngers, he can ignore the EQFINGERS flag.
That way the user can chose the behavior which fits the
application best.
TABLE 11-4: PARAMETERS ASSOCIATED
WITH THE TAP RECOGNIZER
ID Name Type Default
(Sensor:
10137_100h)
0x0540 TapBorder.Left uint16 256
0x0541 TapBorder.Right uint16 4864
0x0542 TapBorder.Top uint16 256
0x0543 TapBorder.Bottom uint16 8960
0x0544 TapTimeout uint32 31250
(200ms)
0x0545 RepeatTimeout uint32 78125
(500ms)
TABLE 11-5: MESSAGE OUTPUT FOR
SWIPE GESTURES
ID Payload
0xA2 Flags Fingers
byte Uint8 Uint8
MTCH6303
DS40001803A-page 48 Preliminary 2015 Microchip Technology Inc.
12.0 EL ECTRICAL SPECIFICATIONS
Abso lute Maximu m Ratings for th e MTCH630 3 devices
are li st ed b elo w. Stresses abo ve thos e l is ted und er th e
Absolute Maximum Ratings may cause permanent
damage to the device. This is a stress rating only and
functio nal operation of the dev ic e at thos e o r any oth er
conditions, above those indicated in the operation
listing s of thi s sp ec ific at ion, is not impl ie d. Expo sure to
maximum rating conditions for extended periods may
affect device reliabi lity.
Absolute Maxim um Ratings(†)
Ambient temperature under bias.........................................................................................................-40°C to +85°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on pins with respect to VSS
on VDD pin.................................................................................................................................-0.3V to +4.0V
on any pin that is not 5V tolerant(2)................................................................................-0.3V to (VDD + 0.3V)
on any 5V tolerant pin when VDD 2.3V(2) ..............................................................................-0.3V to +6.0V
on any 5V tolerant pin when VDD 2.3V(2) ..............................................................................-0.3V to +3.6V
Voltage on D+ or D- pin with respect to VUSB3V3.............................................................-0.3V to (VUSB3V3 + 0.3V)
Volt a ge on VBUS with respect to VSS ..................................................................................................-0.3V to + 5.5V
Maximum curr ent
out of VSS pin(s)...................................................................................................................................200 mA
into VDD pin(s)(1)..................................................................................................................................200 mA
Maximum output current
sourced/sunk by any 4x I/O pin .............................................................................................................15 mA
sourced/sunk by any 8x I/O pin .............................................................................................................25 mA
Maximum current sunk by all ports .................................................................................................................150 mA
Maximum current sourced by all ports(1).........................................................................................................150 mA
Note 1: Maximum allowable current is a function of device maximum power dissipation (see Table 12-2)
2: See the Pin Diagram section for the 5V tolerant pins.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device . This is a stre ss rating onl y and functi onal operati on of the devi ce at those or an y other condi tions abov e those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle and protect
the device in an application may cause partial to complete failure of the device.
12.1 DC Charact eristics: MTCH6303
Rating Min. Typ.† Max. Units Conditions
Supply Voltage 2.3 — 3.6 V
2015 Microchip Technology Inc. Preliminary DS40001803A-page 49
MTCH6303
TABLE 12-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min. Typical Max. Unit
Industrial Temperature Devices
Operating Junction Temperature Range TJ-40 — +125 °C
Operating Ambient Temperature Range TA-40 — +85 °C
Power Dissi pation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD – S IOH) PDPINT + PI/OW
I/O Pin Power Dissipation:
I/O = S (({VDD – VOH} x IOH) + S (VOL x IOL))
Maximum Allo wed Power Dissipation PDMAX (TJ – TA)/JA W
TABLE 12-2: THERMAL PACKAGING CHARACTERISTICS
Characteristics Symbol Typical Max. Unit
Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm)(1) JA 28 — °C/W
Package T herma l Res istance, 64-pin TQFP (10x 10x1 mm)(1) JA 47 — °C/W
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
TABLE 12-3: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions:
(unless otherwis e stated)
2.3V to 3.6V
Operating temp erature -40 °C TA +85°C for Industrial
Param.
No. Symbol Characteristics Min. Typical Max. Units Conditions
Operating Voltage
DC10 VDD Supply Voltage 2.3 — 3.6 V —
DC12 VDR RAM Data Retention Voltage
(Note 1) 1.75 — — V —
DC16 VPOR VDD Start Voltage
to Ensure Internal
Power-on Reset Signal
1.75 — 2.1 V —
DC17 SVDD VDD Rise Rate
to Ensure Internal
Power-on Reset Signal
0.00005 — 0.115 V/s—
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
MTCH6303
DS40001803A-page 50 Preliminary 2015 Microchip Technology Inc.
TABLE 12-4: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
DC CHARACTERISTICS
St andard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temperature -40°C TA +85°C for Industrial
Param.
No. Symb. Characteristics Min. Typ.(1) Max. Units Conditions
DI18 VIL
Input Low Voltage
I/O Pins VSS —0.2VDD V
SDAx, SCLx VSS —0.3VDD V
DI19 SDAx, SCLx VSS —0.8V
VIH
Input High Voltage
I/O Pins 5V-tolerant with
PMP(4) 0.25 VDD + 0.8V — 5.5 V (Note 5)
I/O Pins 5V-tolerant(4) 0.65 VDD —5.5V
DI28 SDAx, SCLx 0.65 VDD —5.5V
DI29 SDAx, SCLx 2.1 — 5.5 V
IIL
Input Le ak ag e C u rr en t(3)
DI50 I/O Ports — — +1AVSS VPIN VDD,
Pin at high-impe dan ce
DI51 Analog Input Pins — — +1AVSS VPIN VDD,
Pin at high-impe dan ce
DI55 MCLR(2) ——+1AVSS VPIN VDD
Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
4: See the Pin Diagram section for the 5V tolerant pins.
5: The VIH specifications are only in relation to externally applied inputs, and not with respect to the
user-selectable internal pull-ups. External open-drain input signals utilizing the internal pull-ups of the
PIC32 device are ensured to be recognized only as a logic “high” internally to the PIC32 device,
provided that the external load does not exceed the minimum value of ICNPU. For External “input” logic
inputs that require a pull-up source, to ensure the mini mum VIH of those components, it is recom-
mended to use an external pull-up resistor rather than the internal pull-ups of the PIC32 device.
6: VIH source > (VDD + 0.3) for non-5V tolerant pins only.
7: Digital 5V tolerant pins do not have an internal high side diode to VDD, and therefore, cannot tolerate any
“positive” input injection current.
8: Injecti on curre nts > | 0 | can aff ect the ADC res ult s by a pprox imatel y 4 to 6 coun t s (i.e ., VIH Source > (VDD
+ 0.3) or VIL source < (VSS - 0.3)).
9: Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted
provided the “absolute instantaneous” sum of the input injection currents from all pins do not ex ceed the
specif ied lim it. If Note 7 , IICL = (((Vs s - 0.3) - VIL source ) / Rs). If Note 8, IICH = ((IICH sourc e - (VDD + 0.3))
/ RS). RS = Resistance between input source voltage and device pin. If (VSS - 0.3) VSOURCE (VDD +
0.3), injecti on cur rent = 0.
2015 Microchip Technology Inc. Preliminary DS40001803A-page 51
MTCH6303
DI60a IICL Input Low Injection
Current 0—-5
(6,9) mA
Pins with Analog
functi ons. Ex cept ions :
[N/A] = 0 mA max
Digital 5V tolerant desig-
nated pins. Exceptions:
[N/A] = 0 mA max
Digital non-5V t ol era nt
designated pins .
Except ions:
[N/A] = 0 mA max
TABLE 12-4: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED)
DC CHARACTERISTICS
St andard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temp erat ure -40°C TA +85°C for Industrial
Param.
No. Symb. Characteristics Min. Typ.(1) Max. Units Conditions
Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
4: See the Pin Diagram section for the 5V tolerant pins.
5: The VIH specifications are only in relation to externally applied inputs, and not with respect to the
user-selectable internal pull-ups. External open-drain input signals utilizing the internal pull-ups of the
PIC32 device are ensured to be recognized only as a logic “high” internally to the PIC32 device,
provided that the external load does not exceed the minimum value of ICNPU. For External “input” logic
inputs that require a pull-up source, to ensure the minimum VIH of those components, it is recom-
mended to use an external pull-up resistor rather than the internal pull-ups of the PIC32 device.
6: VIH source > (VDD + 0.3) for non-5V tolerant pins only.
7: Digital 5V tolerant pins do not have an internal high side diode to VDD, and therefore, cannot tolerate any
“positive” input injection current.
8: Injecti on curre nts > | 0 | can aff ect the ADC res ult s b y appr oximat ely 4 to 6 c ount s (i.e. , V IH Source > (VDD
+ 0.3) or VIL source < (VSS - 0.3)).
9: Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted
provided the “absolute instantaneous” sum of the input injection currents from all pins do not ex ceed the
specif ied lim it. If Note 7 , IICL = (((Vs s - 0.3) - V IL source) / Rs). If Note 8, IICH = ((IICH source - (VDD + 0.3))
/ RS). RS = Resistance between input source voltage and device pin. If (VSS - 0.3) VSOURCE (VDD +
0.3), injecti on cur rent = 0.
MTCH6303
DS40001803A-page 52 Preliminary 2015 Microchip Technology Inc.
DI60b IICH Input High Injection
Current 0—+5
(7,8,9) mA
Pins with Analog
functi ons. Ex cept ions :
[SOSCI] = 0 mA max.
Digital 5V tolerant desig-
nated pi ns (V IH < 5.5V)(8).
Excepti on s : [All] = 0 mA
max.
Digital non-5V t ol era nt
designated pins .
Except ions:
[N/A] = 0 mA max.
DI60c IICT Total Input Injection
Current (sum of all I/O
and control pins)
-20(11) —+20
(9) mA Absolute instantaneous
sum of all ± input injection
currents from all I/O pins
(| I
ICL + | IICH |) IICT
TABLE 12-4: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED)
DC CHARACTERISTICS
St andard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temperature -40°C TA +85°C for Industrial
Param.
No. Symb. Characteristics Min. Typ.(1) Max. Units Conditions
Note 1: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as current sourced by the pin.
4: See the Pin Diagram section for the 5V tolerant pins.
5: The VIH specifications are only in relation to externally applied inputs, and not with respect to the
user-selectable internal pull-ups. External open-drain input signals utilizing the internal pull-ups of the
PIC32 device are ensured to be recognized only as a logic “high” internally to the PIC32 device,
provided that the external load does not exceed the minimum value of ICNPU. For External “input” logic
inputs that require a pull-up source, to ensure the mini mum VIH of those components, it is recom-
mended to use an external pull-up resistor rather than the internal pull-ups of the PIC32 device.
6: VIH source > (VDD + 0.3) for non-5V tolerant pins only.
7: Digital 5V tolerant pins do not have an internal high side diode to VDD, and therefore, cannot tolerate any
“positive” input injection current.
8: Injecti on curre nts > | 0 | can aff ect the ADC res ult s by a pprox imatel y 4 to 6 coun t s (i.e ., VIH Source > (VDD
+ 0.3) or VIL source < (VSS - 0.3)).
9: Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted
provided the “absolute instantaneous” sum of the input injection currents from all pins do not ex ceed the
specif ied lim it. If Note 7 , IICL = (((Vs s - 0.3) - VIL source ) / Rs). If Note 8, IICH = ((IICH sourc e - (VDD + 0.3))
/ RS). RS = Resistance between input source voltage and device pin. If (VSS - 0.3) VSOURCE (VDD +
0.3), injecti on cur rent = 0.
2015 Microchip Technology Inc. Preliminary DS40001803A-page 53
MTCH6303
TABLE 12-5: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating tempe rature -40 °C TA +85°C for Industrial
Param. Symbol Characteristic Min. Typ. Max. Units Conditions
DO10 VOL
Output Low Voltage
I/O Pins:
4x Sink Driver Pins – All I/O
output pins not defined as 8x
Sink Driver pins
——0.4V IOL 9 mA, VDD = 3.3V
Output Low Voltage
I/O Pins:
8x Sink Driver Pins – RC15,
RD2, RD10, RF6, RG6
——0.4VI
OL 15 mA, VDD = 3.3V
DO20 VOH
Output High Voltage
I/O Pins:
4x So urce Driver Pins – A ll I/O
output pins not defined as 8x
Source Driver pins
2.4 — — V IOH -10 mA, VDD = 3.3V
Output High Voltage
I/O Pins:
8x So urce Driver Pins – R C15 ,
RD2, RD10, RF6, RG6
2.4 — — V IOH -15 mA, VDD = 3.3V
DO20A VOH1
Output High Voltage
I/O Pins:
4x So urce Driver Pins – A ll I/O
output pins not defined as 8x
Sink Driver pins
1.5(1) ——
V
IOH -14 mA, VDD = 3.3V
2.0(1) —— IOH -12 mA, VDD = 3.3V
3.0(1) —— IOH -7 m A, VDD = 3.3V
Output High Voltage
I/O Pins:
8x So urce Driver Pins – R C15 ,
RD2, RD10, RF6, RG6
1.5(1) ——
V
IOH -22 mA, VDD = 3.3V
2.0(1) —— IOH -18 mA, VDD = 3.3V
3.0(1) —— IOH -10 mA, VDD = 3.3V
Note 1: Parameters are characterized, but not tested.
TABLE 12-6: E LECTRICAL CHARACTERISTICS: BOR
DC CHARACTERISTICS
Standard Operating Conditions:
(unles s oth erwise stated)
2.3V to 3.6V
Operating temperature -40°C TA +85°C for Industrial
Param.
No. Symbol Characteristics Min.(1) Typical Max. Units Conditions
BO10 VBOR BOR Event on VDD transition
high-to-low 2.0 — 2.3 V —
Note 1: Parameters are for design guidance only and are not tested in manufacturing.
MTCH6303
DS40001803A-page 54 Preliminary 2015 Microchip Technology Inc.
12.2 AC Charact eristics and Timing
Parameters
The information contained in this section defines
MTCH6303 AC characteristics and timing parameters.
FIGURE 12-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
FIGURE 12-2: EXTERNAL CLOCK TIMING
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL=464
CL= 50 pF for all pins
50 pF for OSC2 pin (EC mode)
Load Cond itio n 1 – for all pins except OSC2 Load Condition 2 – for OSC2
TABLE 12-7: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS
AC CHARACTERISTICS
Standard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operati ng tem pe rature -40°C TA +85°C for Industrial
Param.
No. Symbol Characteristics Min. Typical(1) Max. Units Conditions
DO50 COSCO OSC2 pin — — 15 pF In XT and HS modes when an
external crystal is used to drive
OSC1
DO50a CSOSC SOSCI/SOSCO pins — 33 — pF Epson P/N: MC-306
32.7680K-A0:ROHS
DO56 CIO All I/O pi ns and OSC2 — — 50 pF EC mode
DO58 CBSCLx, SDAx — — 400 pF In I2C™ mode
Note 1: Data i n “T ypic al” colum n is at 3.3V, 25°C unless otherw ise st ated. Paramete rs are for desi gn guidanc e only
and are not tested.
OSC1
OS20 OS30
OS30
OS31
OS31
2015 Microchip Technology Inc. Preliminary DS40001803A-page 55
MTCH6303
FIGURE 12-3: I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS
FIGURE 12-4: I2C™ BUS DATA TIMING CHARACTERISTICS
TABLE 12-8: EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions:
(unless otherwise stated)
2.3V to 3.6V
Operating temperature -40°C TA +85°C for Industria l
Param.
No. Symbol Characteristics Min. Typical(1) Max. Units Conditions
OS11 FOSC Oscillator Crystal Frequency — 8 — MHz XT (Note)
OS20 TOSC TOSC = 1/FOSC = TCY (1) — — — — See param eter
OS10 for FOSC
value
OS41 TFSCM Primary Clock Fail Safe
Time-out Period —2 —ms(Note)
OS42 GMExternal Os ci ll ator
Transconductance (Primary
Oscillator only)
—12 —mA/VVDD = 3.3V,
TA = +25°C
(Note)
Note 1: The external clock is required for USB operation and not needed for I2C™ ope rati on.
IS34
SCLx
SDAx
Start
Condition Stop
Condition
IS33
Note: Refer to Figure 12-1 for lo ad conditio ns.
IS31
IS30
IS30 IS31 IS33
IS11
IS10
IS20
IS26 IS25
IS40 IS40 IS45
IS21
SCLx
SDAx
In
SDAx
Out
Note: Refer to Figure 12-1 for load conditions.
MTCH6303
DS40001803A-page 56 Preliminary 2015 Microchip Technology Inc.
TABLE 12-9: I2C™ BUS DATA TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions:
(unless otherw ise stated)
2.3V to 3.6V
Operating temperature -40°C TA +85°C fo r Industria l
Param.
No. Symbol Characteristics Min. Max. Units Conditions
IS10 TLO:SCL Clock Low Time
100 kHz mode 4.7 — s PBCLK must operate at a
minimum of 800 kHz
400 kHz mode 1.3 — s PBCLK must operate at a
minimum of 3.2 MHz
IS11 THI:SCL Clock High Time
100 kHz mode 4.0 — s PBCLK must operate at a
minimum of 800 kHz
400 kHz mode 0.6 — s PBCLK must operate at a
minimum of 3.2 MHz
IS20 TF:SCL SDAx and SCLx
Fall Time 100 kHz mode — 300 ns CB is specified to be from
10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
IS21 TR:SCL SDAx and SCLx
Rise Time 100 kHz mode — 1000 ns CB is specified to be from
10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
IS25 TSU:DAT Data Input
Setup Time 100 kHz mode 250 — ns —
400 kHz mode 100 — ns
IS26 THD:DAT Data Input
Hold Time 100 kHz mode 0 — ns —
400 kHz mode 0 0.9 s
IS30 TSU:STA Start Condition
Setup Time 100 kHz mode 4700 — ns Only relevant for Repeated
Start condition
400 kHz mode 600 — ns
IS31 THD:STA Start Condition
Hold Time 100 kHz mo de 4000 — ns After this period, the first
clock pulse is generated
400 kHz mode 600 — ns
IS33 TSU:STO Stop Con dition
Setup Time 100 kHz mode 4000 — ns —
400 kHz mode 600 — ns
IS34 THD:STO Stop Condition
Hold Time 100 kHz mode 4000 — ns —
400 kHz mode 600 — ns
IS40 TAA:SCL Output Valid fr om
Clock 100 kHz mode 0 3500 ns —
400 kHz mode 0 1000 ns
IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — s The amount of time the bus
must be free bef ore a new
transmission can start
400 kHz mode 1.3 — s
IS50 CBBus Capacitive Loading — 400 pF —
2015 Microchip Technology Inc. Preliminary DS40001803A-page 57
MTCH6303
13.0 ORDERING INFORMATION
TABLE 13-1: ORDERING INFORMATION
Part Number Pin Package Packing
MTCH6303-I/PT 64-Lead TQFP (10x10mm) Tray
MTCH6303-I/RG 64-Lead QFN (9x9mm) Tube
MTCH6303T-I/PT 64-Lead TQFP (10x10mm) T/R
MTCH6303T-I/RG 64-Lead QFN (9x9mm) T/R
MTCH6303
DS40001803A-page 58 Preliminary 2015 Microchip Technology Inc.
14.0 PACKAGING INFORMATION
14.1 Package Marking Information
64-Lead TQFP (10x10x1 mm) Example
XXXXXXXXXX
YYWWNNN
XXXXXXXXXX
XXXXXXXXXX
Legend: XX...X Customer-speci fic information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The P b-free JEDEC® designator ( )
can be found on the outer packaging for this package.
Note: In the even t the full M icroc hip p art numb er cann ot be marked on one line, it wil l
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
MTCH6303
1524017
64-Lead QFN (9x9x0.9 mm) Example
PIN 1
XXXXXXXXXXX
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
PIN 1
MTCH6303
1524017
2015 Microchip Technology Inc. Preliminary DS40001803A-page 59
MTCH6303
14.2 Package Details
The following sections give the technical details of the packages.
0.20 C
0.20 C
0.10 C A B
0.05 C
(DATUM B)
(DATUM A)
C
SEATING PLANE
1
2
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
NOTE 1
0.10 C
Microchip Technology Drawing C04-260A Sheet 1 of 2
2X
N
N
64X (K)
64X L
e
2
0.10 C A B
0.10 C A B
NOTE 1
DETAIL A
64-Terminal Plastic Quad Flat Pack, No Lead (RG) 9x9x0.9 mm Body [QFN]
Saw Singulated
B
A
D2
E2
E
D
1
2
64X b
(A3)
A
e
MTCH6303
DS40001803A-page 60 Preliminary 2015 Microchip Technology Inc.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Exposed Pad Width
Exposed Pad Length
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E2
D2
e
L
E
N
0.50 BSC
4.60
0.30
0.15
0.80
0.00
0.20
0.40
4.70
0.85
0.02
9.00 BSC
MILLIMETERS
MIN NOM
64
4.80
0.50
0.25
0.90
0.05
MAX
K 1.755 REF
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
0.08 C
64X
DETAIL A
Microchip Technology Drawing C04-260A Sheet 2 of 2
64-Terminal Plastic Quad Flat Pack, No Lead (RG) 9x9x0.9 mm Body [QFN]
Saw Singulated
4.60 4.70
9.00 BSC
4.80
C
SEATING PLANE
A1
Standoff A3 0.20 REF
2015 Microchip Technology Inc. Preliminary DS40001803A-page 61
MTCH6303
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
4.80
4.80
MILLIMETERS
0.50 BSC
MIN
E
MAX
8.90
Contact Pad Length (X64)
Contact Pad Width (X64)
Y1
X1
0.85
0.25
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2260A
NOM
C1Contact Pad Spacing 8.90
Contact Pad to Center Pad (X64) G1 1.625 REF
C1
C2
E
X2
Y2
64-Lead Very Thin Plastic Quad Flat, No Lead Package (RG) - 9x9x1.0 mm Body [QFN]
4.7x4.7 mm Exposed Pad
Y1
SILK SCREEN Y1
(G1)
MTCH6303
DS40001803A-page 62 Preliminary 2015 Microchip Technology Inc.
0.20 CA-B D
64 X b
0.08 CA-B D
C
SEATING
PLANE
4X N/4 TIPS
TOP VIEW
SIDE VIEW
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-085C Sheet 1 of 2
64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP]
D
EE1
D1
D
A B
0.20 HA-B D
4X
D1/2
e
A
0.08 C
A1
A2
SEE DETAIL 1
AA
E1/2
NOTE 1
NOTE 2
123
N
0.05
2015 Microchip Technology Inc. Preliminary DS40001803A-page 63
MTCH6303
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP]
13°12°11°
E
Mold Draft Angle Bottom
13°12°11°
D
Mold Draft Angle Top
0.270.220.17
b
Lead Width
0.20-0.09
c
Lead Thickness
10.00 BSC
D1
Molded Package Length
10.00 BSCE1Molded Package Width
12.00 BSCDOverall Length
12.00 BSCEOverall Width
7°3.5°0°
I
Foot Angle
0.750.600.45LFoot Length
0.15-0.05A1Standoff
1.051.000.95A2Molded Package Thickness
1.20--AOverall Height
0.50 BSC
e
Lead Pitch
64NNumber of Leads
MAXNOMMINDimension Limits
MILLIMETERSUnits
Footprint L1 1.00 REF
2. Chamfers at corners are optional; size may vary.
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
Notes:
Microchip Technology Drawing C04-085C Sheet 2 of 2
L
(L1)
E
c
H
X
X=A—B OR D
e/2
DETAIL 1
SECTION A-A
T
MTCH6303
DS40001803A-page 64 Preliminary 2015 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C1Contact Pad Spacing
Contact Pad Spacing
Contact Pitch
C2
MILLIMETERS
0.50 BSC
MIN
E
MAX
11.40
11.40
Contact Pad Length (X28)
Contact Pad Width (X28)
Y1
X1
1.50
0.30
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2085B Sheet 1 of 1
GDistance Between Pads 0.20
NOM
64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP]
C2
C1
E
G
Y1
X1
2015 Microchip Technology Inc. Preliminary DS40001803A-page 65
MTCH6303
APPENDIX A: REVISION HISTORY
Revision A (06/2015)
Initial release of this document.
MTCH6303
DS40001803A-page 66 Preliminary 2015 Microchip Technology Inc.
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at
www.microchip.com. This web site i s us ed as a m ean s
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online dis cu ss io n gr oups, Microchip con su lt a n t
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specif ied produ ct family or develo pment tool of inte rest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPP ORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Appl ication Engineer (FAE)
• Technical Support
Customers should contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is avail able throug h the web si te
at: http://www.microchip.com/support
2015 Microchip Technology Inc. Preliminary DS40001803A-page 67
MTCH6303
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: MTCH6303
Tape and Reel
Option: Blank = Standard packaging (tube or tray)
T = Tape and Ree l(1)
Temperature
Range: I= -40C to +85C (Industrial)
Package: RG = QFN
PT = TQFP
Pattern: QTP, SQTP, Code or Special Requirements
(blank oth erwis e )
Examples:
a) MTCH6303-I/PT = Industrial Temp TQFP
package.
Note 1: Tape and Reel id entifier only a ppears in the
catalog part number description. This
identifier is used for ordering purposes and
is not p rinted o n the device packa ge. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
[X](1)
Tape and R e e l
Option
DS40001803A-page 68 Preliminary 2015 Microchip Technology Inc.
Information contained in this publication regarding device
applications a nd the lik e is p ro vided on ly for yo ur con ve nien ce
and may be supers eded by updates . I t is you r r es ponsibil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer ,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoL yzer , PIC, PICSTART, PIC32 logo, RightTouch, S pyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsP ICDEM. net, ECA N, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLA B Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PI CDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technolo gy
Germany II GmbH & Co. KG, a subsidiar y of Mic r o chip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-531-3
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in t heir particular Microchip Data Sheet.
• Microchip believes that i ts family of products is one of the most secure famili es of its kind on the market today, when used i n t he
intended manner and under normal conditions.
• The re are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2015 Microchip Technology Inc. Preliminary DS40001803A-page 69
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Tel: 678-957-9614
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Tel: 631-435-6000
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Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
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Tel: 852-2943-5100
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Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
ASIA/PACIFIC
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiw a n - Ka ohs iung
Tel: 886-7-213-7828
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha gen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-14 4-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Ma drid
Tel: 34-91-708-08-90
Fax: 34-91-708-08 -91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
01/27/15
