SN74HCT245DBRE4 - Texas Instruments

SN54HCT245, SN74HCT245

OCTAL BUS TRANSCEIVERS

WITH 3-STATE OUTPUTS

SCLS020E – MARCH 1984 – REVISED AUGUST 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Operating Voltage Range of 4.5 V to 5.5 V

High-Current 3-State Outputs Drive Bus

Lines Directly or Up To 15 LSTTL Loads

Low Power Consumption, 80-µA Max ICC

Typical tpd = 14 ns

±6-mA Output Drive at 5 V

Low Input Current of 1 µA Max

Inputs Are TTL-Voltage Compatible

description/ordering information

These octal bus transceivers are designed for

asynchronous two-way communication between

data buses. The control-function implementation

minimizes external timing requirements.

The ’HCT245 devices allow data transmission

from the A bus to the B bus or from the B bus to the

A bus, depending upon the logic level at the

direction-control (DIR) input. The output-enable

(OE) input can be used to disable the device so

that the buses are effectively isolated.

ORDERING INFORMATION

TAPACKAGE†ORDERABLE

PART NUMBER TOP-SIDE

MARKING

–40 C to 85 C

PDIP – N T ube of 20 SN74HCT245N SN74HCT245N

–40 C to 85 C

SOIC – DW

T ube of 25 SN74HCT245DW

HCT245

–40 C to 85 C

SOIC – DW

Reel of 2000 SN74HCT245DWR

HCT245

–40

C to 85

SOP – NS Reel of 2000 SN74HCT245NSR HCT245

–40°C to 85°C

SSOP – DB Reel of 2000 SN74HCT245DBR HT245

TSSOP – PW

T ube of 70 SN74HCT245PW

HT245

TSSOP – PW

Reel of 2000 SN74HCT245PWR

HT245

Reel of 250 SN74HCT245PWT

–55 C to 125 C

CDIP – J T ube of 20 SNJ54HCT245J SNJ54HCT245J

–55

C to 125

CFP – W T ube of 85 SNJ54HCT245W SNJ54HCT245W

LCCC – FK T ube of 55 SNJ54HCT245FK SNJ54HCT245FK

†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

3 2 1 20 19

910111213

DIR

B6 OE

GND

B8 VCC

SN54HCT245 . . . FK PACKAGE

(TOP VIEW)

DIR

GND

VCC

SN54HCT245 ...J OR W PACKAGE

SN74HCT245 . . . DB, DW, N, NS, OR PW PACKAGE

(TOP VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

On products compliant to MIL-PRF-38535, all parameters are tested

unless otherwise noted. On all other products, production

processing does not necessarily include testing of all parameters.

SN54HCT245, SN74HCT245

OCTAL BUS TRANSCEIVERS

WITH 3-STATE OUTPUTS

SCLS020E – MARCH 1984 – REVISED AUGUST 2003

2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

FUNCTION TABLE

INPUTS

OPERATION

OE DIR

OPERATION

L L B data to A bus

LH A data to B bus

H X Isolation

logic diagram (positive logic)

DIR

To Seven Other Channels

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous output current, IO (VO = 0 to VCC) ±35 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through VCC or GND ±70 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance, θJA (see Note 2): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

N package 69°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.

NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

SN54HCT245, SN74HCT245

OCTAL BUS TRANSCEIVERS

WITH 3-STATE OUTPUTS

SCLS020E – MARCH 1984 – REVISED AUGUST 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

recommended operating conditions (see Note 3)

SN54HCT245 SN74HCT245

UNIT

MIN NOM MAX MIN NOM MAX

UNIT

VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V

VIH High-level input voltage VCC = 4.5 V to 5.5 V 2 2 V

VIL Low-level input voltage VCC = 4.5 V to 5.5 V 0.8 0.8 V

VIInput voltage 0 VCC 0 VCC V

VOOutput voltage 0 VCC 0 VCC V

∆t/∆vInput transition rise/fall time 500 500 ns

TAOperating free-air temperature –55 125 –40 85 °C

NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

TA = 25°C SN54HCT245 SN74HCT245

UNIT

PARAMETER

TEST CONDITIONS

VCC

MIN TYP MAX MIN MAX MIN MAX

UNIT

VOH

VI = VIH or VIL

IOH = –20 µA

4.5 V

4.4 4.499 4.4 4.4

VOH

VI = VIH or VIL

IOH = –6 mA

4.5 V

3.98 4.3 3.7 3.84

VOL

VI = VIH or VIL

IOL = 20 µA

4.5 V

0.001 0.1 0.1 0.1

VOL

VI = VIH or VIL

IOL = 6 mA

4.5 V

0.17 0.26 0.4 0.33

IIDIR or OE VI = VCC or 0 5.5 V ±0.1 ±100 ±1000 ±1000 nA

IOZ A or B VO = VCC or 0 5.5 V ±0.01 ±0.5 ±10 ±5µA

ICC VI = VCC or 0, IO = 0 5.5 V 8 160 80 µA

∆ICC†One input at 0.5 V or 2.4 V,

Other inputs at 0 or VCC 5.5 V 1.4 2.4 3 2.9 mA

Ci‡DIR or OE 4.5 V

to 5.5 V 3 10 10 10 pF

†This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.

‡Parameter Ci does not apply to transceiver I/O ports.

switching characteristics over recommended operating free-air temperature range, CL = 50 pF

(unless otherwise noted) (see Figure 1)

PARAMETER

FROM

VCC

TA = 25°C SN54HCT245 SN74HCT245

UNIT

PARAMETER

FROM

(INPUT)

(OUTPUT)

VCC

MIN TYP MAX MIN MAX MIN MAX

UNIT

tpd

A or B

B or A

4.5 V 16 22 33 28

tpd

A or B

B or A

5.5 V 14 20 30 25

ten

A or B

4.5 V 25 46 69 58

ten

A or B

5.5 V 22 41 62 52

tdis

A or B

4.5 V 26 40 60 50

tdis

A or B

5.5 V 23 36 54 45

A or B

4.5 V 9 12 18 15

A or B

5.5 V 811 16 14

SN54HCT245, SN74HCT245

OCTAL BUS TRANSCEIVERS

WITH 3-STATE OUTPUTS

SCLS020E – MARCH 1984 – REVISED AUGUST 2003

4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

switching characteristics over recommended operating free-air temperature range, CL = 150 pF

(unless otherwise noted) (see Figure 1)

PARAMETER

FROM

VCC

TA = 25°C SN54HCT245 SN74HCT245

UNIT

PARAMETER

FROM

(INPUT)

(OUTPUT)

VCC

MIN TYP MAX MIN MAX MIN MAX

UNIT

tpd

A or B

B or A

4.5 V 20 30 45 38

tpd

A or B

B or A

5.5 V 18 27 41 34

ten

A or B

4.5 V 36 59 89 74

ten

A or B

5.5 V 30 53 80 67

A or B

4.5 V 17 42 63 53

A or B

5.5 V 14 38 57 48

operating characteristics, TA = 25°C

PARAMETER TEST CONDITIONS TYP UNIT

Cpd Power dissipation capacitance per transceiver No load 40 pF

SN54HCT245, SN74HCT245

OCTAL BUS TRANSCEIVERS

WITH 3-STATE OUTPUTS

SCLS020E – MARCH 1984 – REVISED AUGUST 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PARAMETER MEASUREMENT INFORMATION

From Output

Under Test

LOAD CIRCUIT

PARAMETER CL

tPZH

tpd or tt

tdis

ten tPZL

tPHZ

tPLZ

1 kΩ

50 pF

150 pF

50 pF

Open Closed

RLS1

Closed Open

Open Closed

Closed Open

50 pF

150 pF Open Open––

NOTES: A. CL includes probe and test-fixture capacitance.

B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.

W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.

C. Phase relationships between waveforms were chosen arbitrarily . All input pulses are supplied by generators having the following

characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.

D. The outputs are measured one at a time with one input transition per measurement.

E. tPLZ and tPHZ are the same as tdis.

F. tPZL and tPZH are the same as ten.

G. t

PLH

and t

PHL

are the same as t

(see Note A)

Test

Point

VOLTAGE WAVEFORM

INPUT RISE AND FALL TIMES

1.3 V1.3 V 0.3 V0.3 V 2.7 V 2.7 V 3 V

0 V

trtf

Input

VOLTAGE WAVEFORMS

PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES

1.3 V

1.3 V1.3 V 10%10% 90% 90%

3 V

VOH

VOL

0 V

trtf

Input

In-Phase

Output

1.3 V

tPLH tPHL

1.3 V 1.3 V

10% 10% 90%90% VOH

VOL

tPHL tPLH

Out-of-

Phase

Output

1.3 V

10%

90%

3 V

≈VCC

VOL

0 V

Output

Control

(Low-Level

Enabling)

Output

W aveform 1

(See Note B)

1.3 V

tPZL tPLZ

VOLTAGE WAVEFORMS

ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS

VOH

≈0 V

1.3 V

tPZH tPHZ

Output

W aveform 2

(See Note B)

Figure 1. Load Circuit and Voltage Waveforms

PACKAGE OPTION ADDENDUM

www.ti.com 23-Mar-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

5962-8550601VRA ACTIVE CDIP J 20 20 TBD A42 N / A for Pkg Type

5962-8550601VSA ACTIVE CFP W 20 25 TBD Call TI N / A for Pkg Type

85506012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI

8550601RA ACTIVE CDIP J 20 1 TBD Call TI Call TI

JM38510/65553BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

JM38510/65553BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

M38510/65553BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

M38510/65553BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

SN54HCT245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SN74HCT245DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI

SN74HCT245DBR ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245DW ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245DWE4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245DWG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245DWR ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

SN74HCT245N3 OBSOLETE PDIP N 20 TBD Call TI Call TI

SN74HCT245NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

PACKAGE OPTION ADDENDUM

www.ti.com 23-Mar-2012

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

SN74HCT245NSR ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245NSRE4 ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245NSRG4 ACTIVE SO NS 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245PW ACTIVE TSSOP PW 20 70 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI

SN74HCT245PWR ACTIVE TSSOP PW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245PWT ACTIVE TSSOP PW 20 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HCT245PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SNJ54HCT245FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

SNJ54HCT245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

SNJ54HCT245W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

PACKAGE OPTION ADDENDUM

www.ti.com 23-Mar-2012

Addendum-Page 3

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54HCT245, SN54HCT245-SP, SN74HCT245 :

•Catalog: SN74HCT245, SN54HCT245

•Military: SN54HCT245

•Space: SN54HCT245-SP

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Military - QML certified for Military and Defense Applications

•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

SN74HCT245DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1

SN74HCT245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1

SN74HCT245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 Q1

SN74HCT245NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1

SN74HCT245PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1

SN74HCT245PWRG4 TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1

SN74HCT245PWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74HCT245DBR SSOP DB 20 2000 367.0 367.0 38.0

SN74HCT245DWR SOIC DW 20 2000 367.0 367.0 45.0

SN74HCT245NSR SO NS 20 2000 367.0 367.0 45.0

SN74HCT245PWR TSSOP PW 20 2000 367.0 367.0 38.0

SN74HCT245PWR TSSOP PW 20 2000 364.0 364.0 27.0

SN74HCT245PWRG4 TSSOP PW 20 2000 367.0 367.0 38.0

SN74HCT245PWT TSSOP PW 20 250 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

4040065 /E 12/01

28 PINS SHOWN

Gage Plane

8,20

7,40

0,55

0,95

0,25

12,90

12,30

10,50

8,50

Seating Plane

9,907,90

10,50

9,90

0,38

5,60

5,00

0,22

2016

6,50

0,05 MIN

5,905,90

DIM

A MAX

A MIN

PINS **

2,00 MAX

6,90

7,50

0,65 M

0,15

0°–ā8°

0,10

0,09

0,25

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

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Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

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