DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC8211TK SiGe LOW NOISE AMPLIFIER FOR GPS/MOBILE COMMUNICATIONS DESCRIPTION The PC8211TK is a silicon germanium (SiGe) monolithic integrated circuit designed as a low noise amplifier for GPS and mobile communications. The package is 6-pin lead-less minimold, suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process. FEATURES * Low noise : NF = 1.3 dB TYP. @ VCC = 3.0 V * High gain * Low current consumption : GP = 18.5 dB TYP. @ VCC = 3.0 V : ICC = 3.5 mA TYP. @ VCC = 3.0 V * Gain 1 dB compression output power : Po (1 dB) = -6.0 dBm @ VCC = 3.0 V * Built-in power-save function * High-density surface mounting : 6-pin lead-less minimold package (1.5 x 1.3 x 0.55 mm) APPLICATION * Low noise amplifier for GPS and mobile communications ORDERING INFORMATION Part Number PC8211TK-E2 Order Number PC8211TK-E2-A Package Marking 6-pin lead-less minimold (1511 PKG) (Pb-Free) Note 6G Supplying Form * Embossed tape 8 mm wide * Pin 1, 6 face the perforation side of the tape * Qty 5 kpcs/reel Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC8211TK-A Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Document No. PU10426EJ04V0DS (4th edition) Date Published January 2006 CP(K) The mark shows major revised points. PC8211TK PIN CONNECTIONS (Top View) 2 6G 1 (Bottom View) 3 6 6 1 5 5 2 4 4 3 INTERNAL BLOCK DIAGRAM INPUT 1 6 VCC GND 2 5 GND 4 OUTPUT Bias PS 2 3 Data Sheet PU10426EJ04V0DS Pin No. Pin Name 1 INPUT 2 GND 3 PS 4 OUTPUT 5 GND 6 VCC PC8211TK ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions TA = +25C Ratings Unit 4.0 V -0.3 to VCC +0.3 V 232 mW Supply Voltage VCC Power-Saving Voltage VPS Power Dissipation of Package PD Operating Ambient Temperature TA -40 to +85 C Storage Temperature Tstg -55 to +150 C Input Power Pin +10 dBm Note TA = +85C Note Mounted on double-side copper-clad 50 x 50 x 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 2.7 3.0 3.3 V Operating Ambient Temperature TA -25 +25 +85 C Operating Frequency Range fin - 1 575 - MHz Data Sheet PU10426EJ04V0DS 3 PC8211TK ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = 3.0 V, VPS = 3.0 V, fin = 1 575 MHz, unless otherwise specified) Parameter Symbol Circuit Current ICC Test Conditions No Signal At Power-Saving Mode MIN. TYP. MAX. Unit 2.5 3.5 4.5 mA - - 1 A Power Gain GP 15.5 18.5 21.5 dB Noise Figure NF - 1.3 1.5 dB Input 3rd Order Distortion Intercept IIP3 - -12 - dBm Input Return Loss RLin 6.0 7.5 - dB Output Return Loss RLout 10 14.5 - dB ISL - 33.5 - dB Rising Voltage From Power-Saving VPSon 2.2 - - V Falling Voltage From Power-Saving Mode VPSoff - - 0.8 V Gain Flatness Flat - - 0.5 dB - -6.0 - dBm -1.5 +2.0 - dBm Point Isolation Mode Gain 1 dB Compression Output fRF = 2.5 MHz PO (1 dB) Power Output Power PO Pin = -10 dBm TEST CIRCUIT IN C4 L1 C3 33 pF 4.7 nH 0.1F 1 6 2 5 3 4 1.3 pF C2 VPS High : ON Low : OFF (Power-Save) C1 R1 750 0.1F L2 22 nH 8.2 nH L3 VCC C5 82 pF OUT COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Symbol Form Rating Part Number Maker C1, C4 Chip Capacitor 0.1 F GRM36 Murata C2 Chip Capacitor 1.3 pF GRM36 Murata C3 Chip Capacitor 33 pF GRM36 Murata C5 Chip Capacitor 82 pF GRM36 Murata R1 Resistor 750 RR0816 Susumu L1 Inductor 4.7 nH TFL0510 Susumu L2 Inductor 22 nH TFL0816 or TFL0510 Susumu L3 Inductor 8.2 nH TFL0510 Susumu 4 Data Sheet PU10426EJ04V0DS PC8211TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD VCC 0.1 F 6 1 2 5 4 33 pF 750 22 nH 4.7 nH IN 8.2 nH 3 1.3 pF 82 pF OUT 0.1 F PS Notes 1. 2. 3. 4. 5. 30 x 30 x 0.51 mm double-side copper-clad hydrocarbon ceramic woven glass PWB (Rogers: R04003, r = 3.38). Back side: GND pattern Au plated on pattern represents cutout : Through holes Data Sheet PU10426EJ04V0DS 5 PC8211TK TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified) NOISE FIGURE vs. FREQUENCY VOLTAGE GAIN vs. FREQUENCY 2.0 VCC = VPS = 3.0 V 22 Noise Figure NF (dB) TA = -40C 20 TA = +25C 18 TA = +85C 16 1.55 1.6 1.0 0.8 TA = -40C TA = 85C 5 1.55 30 1.6 10 f1 = 1 575.5 MHz f2 = 1 576.5 MHz Pout -10 TA = 25C -5 0.4 1.5 Output Power (2 tones) Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) Voltage Gain Gain (dB) TA = +25C OUTPUT POWER (2 tones), IM3 vs. INPUT POWER -30 TA = -25C -50 -25 0 1 2 3 4 -90 -50 VCC = VPS = 3.0 V TA = 25C -40 -30 -20 -10 Power-Save Pin Applied Voltage VPS (V) Input Power Pin (dBm) OUTPUT POWER (2 tones), IM3 vs. INPUT POWER OUTPUT POWER (2 tones), IM3 vs. INPUT POWER f1 = 1 575.5 MHz f2 = 1 576.5 MHz Pout 30 10 0 f1 = 1 575.5 MHz f2 = 1 576.5 MHz Pout -10 -30 -30 IM3 -50 -70 -90 -50 IM3 -70 VCC = 3.0 V f = 1 575 MHz -10 -50 VCC = VPS = 3.0 V TA = -40C -40 -30 -20 -10 0 IM3 -70 -90 -50 Input Power Pin (dBm) VCC = VPS = 3.0 V TA = 85C -40 -30 -20 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. 6 TA = +85C VOLTAGE GAIN vs. POWER-SAVE PIN APPLIED VOLTAGE -15 Output Power (2 tones) Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) 1.2 Frequency f (GHz) 15 10 1.4 Frequency f (GHz) 25 30 1.6 0.6 14 1.5 -35 VCC = VPS = 3.0 V 1.8 Output Power (2 tones) Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) Voltage Gain Gain (dB) 24 Data Sheet PU10426EJ04V0DS -10 0 PC8211TK S-PARAMETERS (TA = +25C, VCC = VPS = 3.0 V, monitored at connector on board) S11-FREQUENCY S22-FREQUENCY 1 1 1; 57.094 51.530 5.2072 nH 1.575 000 000 GHz STOP 2 000.000 000 MHz START 100.000 000 MHz START 100.000 000 MHz INPUT RETURN LOSS vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY 0 Output Return Loss RLout (dB) Input Return Loss RLin (dB) 0 -2 -4 -6 -8 -10 -12 0.1 1.575 GHz 1.0 -5 -10 -15 1.575 GHz -20 -25 0.1 10 1.0 Frequency f (GHz) POWER GAIN vs. FREQUENCY 0 20 -10 ISOLATION vs. FREQUENCY Isolation ISL (dB) -5 Power Gain Gain (dB) 10 Frequency f (GHz) 25 15 10 5 1; 31.739 3.4192 29.554 pF 1.575 000 000 GHz STOP 2 000.000 000 MHz 1.575 GHz 1.575 GHz -15 -20 -25 -30 -35 -40 -45 0 0.1 1.0 10 -50 0.1 Frequency f (GHz) 1.0 10 Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PU10426EJ04V0DS 7 PC8211TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm) (Bottom View) 0.160.05 0.480.05 0.480.05 1.50.1 (Top View) 1.10.1 0.20.1 0.11+0.1 -0.05 0.550.03 1.30.05 Remark ( ) : Reference value 8 Data Sheet PU10426EJ04V0DS 0.90.1 PC8211TK NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Metho d Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) For soldering Condition Symbo l : 260C or below : 10 seconds or less IR260 : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 260C or below Time at peak temperature : 10 seconds or less Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 1 time : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below WS260 Preheating temperature (package surface temperature) : 120C or below Partial Heating Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 3 seconds or less : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PU10426EJ04V0DS 9