INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-OMA160-R11 1
OMA160
Single Pole, Normally Open
OptoMOS® Relay
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Pb
Part Number Description
OMA160 6-Pin DIP (50/Tube)
OMA160S 6-Pin Surface Mount (50/Tube)
OMA160STR 6-Pin Surface Mount (1000/Reel)
Parameter Rating Units
Blocking Voltage 250 VP
Load Current 50 mArms / mADC
On-Resistance (max) 100
Applications
Features
Description
Ordering Information
Pin Configuration
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment - Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• Fast Switching Times: 0.125ms
• Low Off-State Leakage Current: 25nA
• 3750Vrms Input/Output Isolation
• 100% Solid State
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
• Tape & Reel Version Available
OMA160 is a 250V, 50mA, 100 normally open
(1-Form-A) relay. This high performance, optically
isolated Solid State Relay provides one of the fastest
(0.125ms) switching times available along with a very
low off-state leakage current of 25nA.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate # 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Switching Characteristics
of Normally Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
1
2
3
+ Control
– Control
Do Not Use
6
5
4
Load
Do Not Use
Load
AC/DC Configuration
1
3
2
4
5
6
+ Control
– Control
Do Not Use
+ Load
– Load
DC Only Configuration
INTEGRATED CIRCUITS DIVISION
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2R11
OMA160
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Parameter Ratings Units
Blocking Voltage 250 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current, Continuous
AC/DC Confi guration -I
L--
50 mArms / mADC
DC Confi guration 80 mADC
Peak t=10ms ILPK - - ±100 mAP
On-Resistance
AC/DC Confi guration IL=50mA RON -50 100
DC Confi guration IL=80mA 15 30
Off-State Leakage Current VL=250VPILEAK - - 25 nA
Switching Speeds
Turn-On IF=10mA, VL=10V ton - - 0.125 ms
Turn-Off toff
Output Capacitance VL=50V, f=1MHz COUT -5- pF
Input Characteristics
Input Control Current to Activate IL=50mA IF- - 10 mA
Input Control Current to Deactivate - IF0.4 - - mA
Input Voltage Drop IF=10mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10A
Common Characteristics
Input to Output Capacitance - CI/O -3- pF
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OMA160
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R11
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=10mA)
0.05 0.09 0.13 0.150.07 0.11
Turn-On Time (ms)
Device Count (N)
30
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=10mA, IL=50mADC)
0.012 0.022 0.032 0.0370.0270.017
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=10mA, IL=50mADC)
2.075 2.9751.625 2.525 3.425 3.875
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=50mADC)
25
20
15
10
5
0
2.075 2.9751.625 2.525 3.425 3.875
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=50mADC)
35
30
25
20
15
10
5
0
42.5 44.5 46.5 47.543.5 45.5
On-Resistance (:)
Device Count (N)
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=50mADC)
35
30
25
20
15
10
5
0
367.5 381.5 395.5 402.5374.5 388.5
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC) LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
50
Typical Turn-On Time
vs. LED Forward Current
(IL=50mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
05 101520253035404550
Typical Turn-Off Time
vs. LED Forward Current
(IL=50mADC)
0.040
0.035
0.030
0.025
0.020
0.015
INTEGRATED CIRCUITS DIVISION
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4R11
OMA160
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Turn-On Time (ms)
-40
1.50
1.25
1.00
0.75
0.50
0.25
0
-20 0 20 40 60 80 100
IF=10mA
IF=20mA
Typical Turn-On Time
vs. Temperature
(IL=50mADC)
Temperature (ºC)
Turn-Off Time (ms)
-40
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-20 0 20 40 60 80 100
Typical Turn-Off Time
vs. Temperature
(IF=10mA, IL=50mADC)
Temperature (ºC)
On-Resistance (:)
-40
70
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
Typical On-Resistance vs. Temperature
(IF=5mA, IL=50mADC)
Temperature (ºC)
LED Current (mA)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical IF for Switch Operation
vs. Temperature
(IL=50mADC)
Temperature (ºC)
LED Current (mA)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical IF for Switch Dropout
vs. Temperature
Load Voltage (V)
Load Current (mA)
50
40
30
20
10
0
-10
-20
-30
-40
-50
-3 -2 -1 0 1 2 3
Typical Load Current vs. Load Voltage
(IF=10mA)
Load Current (mA)
100
90
80
70
60
50
40
30
20
10
0
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
I
F
=30mA
I
F
=20mA
I
F
=10mA
Maximum Load Current
vs. Temperature
Blocking Voltage (VP)
-40
400
395
390
385
380
375
370
365
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Leakage (PA)
-40
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 4&6
Temperature (ºC)
Time
Load Current (A)
10Ps
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
1ms100Ps 100ms 1s
10ms 10s 100s
Energy Rating Curve
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OMA160
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Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
OMA160 / OMA160S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
OMA160 / OMA160S 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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Pb
INTEGRATED CIRCUITS DIVISION
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6R11
OMA160
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002) 4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020) 6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
OMA160
OMA160S
Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION
Specification: DS-OMA160-R11
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
For additional information please visit our website at: www.ixysic.com
OMA160
7
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Dimensions
mm
(inches)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
A0 = 10.10
(0.398)
P = 12.00
(0.472)
K1 = 3.80
(0.15)
K0 = 4.90
(0.19)
User Direction of Feed
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Authorized Distributor
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