INTEGRATED CIRCUITS DATA SHEET TDA1541A Stereo high performance 16-bit DAC Product specification File under Integrated Circuits, IC01 February 1991 Philips Semiconductors Product specification Stereo high performance 16-bit DAC TDA1541A FEATURES GENERAL DESCRIPTION * High sound quality The TDA1541A is a stereo 16-bit digital-to-analog converter (DAC). The ingenious design of the electronic circuit guarantees a high performance and superior sound quality. The TDA1541A is therefore extremely suitable for use in top-end hi-fi digital audio equipment such as high quality Compact Disc players or digital amplifiers. * High performance: low noise and distortion, wide dynamic range * 4 x or 8 x oversampling possible * Selectable two-channel input format * TTL compatible inputs. ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TDA1541A(1) 28 DIL plastic SOT117 Note 1. SOT117; SOT117-1; 1996 August 09. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VDD supply voltage; pin 28 4.5 5.0 5.5 V -VDD1 supply voltage; pin 26 4.5 5.0 5.5 V -VDD2 supply voltage; pin 15 14.0 15.0 16.0 V IDD supply current; pin 28 - 27 40 mA -IDD1 supply current; pin 26 - 37 50 mA -IDD2 supply current; pin 15 - 25 35 mA THD total harmonic distortion THD total harmonic distortion including noise - -95 -90 dB at 0 dB - 0.0018 0.0032 % including noise - -42 - dB at -60 dB - 0.79 - % at Tamb = -20 to +85 C - 0.5 1.0 LSB NL non-linearity tcs current settling time to 1LSB - 0.5 - s BR input bit rate at data input; (pin 3 and 4) - - 6.4 Mbits/s fBCK clock frequency at clock input - - 6.4 MHz TCFS full scale temperature coefficient - 200 x 10-6 - K-1 Tamb operating ambient temperature range -40 - +85 C Ptot total power dissipation - 700 - mW February 1991 at analog (AOL;AOR) 2 Philips Semiconductors Product specification Stereo high performance 16-bit DAC TDA1541A (1) TDA1542. (2) 2 x NE5534 or equivalent. Fig.1 Block diagram. February 1991 3 Philips Semiconductors Product specification Stereo high performance 16-bit DAC TDA1541A PINNING SYMBOL PIN LE/WS(1) DESCRIPTION 1 latch enable input/ word select input BCK(1) 2 bit clock input DATA L /DATA(1) 3 data left channel input/ data input (selected format) DATA R(1) 4 data right channel input GND(A) 5 analog ground AOR 6 right channel output DECOU 7 to 13 GND (D) 14 digital ground VDD2 15 -15 V supply voltage COSC DECOU 16,17 decoupling oscillator 18 to 24 decoupling AOL 25 left channel output VDD1 26 -5 V supply voltage OB/TWC(1) 27 mode select input VDD 28 +5 V supply voltage Note 1. See Table 1 data selection input. Fig.2 Pin configuration FUNCTIONAL DESCRIPTION The TDA1541A accepts input sample formats in time multiplexed mode or simultaneous mode up to 16-bit word length. The most significant bit (MSB) must always be first. The flexible input data format allows easy interfacing with signal processing chips such as interpolation filters, error correction circuits, pulse code modulation adaptors and audio signal processors (ASP). The high maximum input bit-rate and fast setting facilitates application in 8 x oversampling systems (44.1 kHz to 352.8 kHz or 48 kHz to 384 kHz) with the associated simple analog filtering function (low order, linear phase filter). Input data selection (see also Table 1) With the input OB/TWC connected to ground, data input (offset binary format) must be in time multiplexed mode. It is accompanied with a word select (WS) and a bit clock input (BCK) signal. The converted samples appear at the output, at the first positive going transition of the bit clock signal after a negative going transition of the word select signal. With OB/TWC connected to VDD the mode is the same but the data format must be in the two's complement. When input OB/TWC input is connected to VDD1 the two channels of data (L/R) are input simultaneously via DATA L and DATA R, accompanied with BCK and a latch-enable input (LE). With this mode selected the data must be in offset binary. The converted samples appear at the output at the positive going transition of the latch enable signal. The format of the data input signals is shown in Fig.5 and 6. February 1991 4 Philips Semiconductors Product specification Stereo high performance 16-bit DAC TDA1541A True 16-bit performance is achieved by each channel using three 2-bit active dividers, operating on the dynamic element matching principle, in combination with a 10-bit passive current divider, based on emitter scaling. All digital inputs are TTL compatible. Table 1 Input data selection OB/TWC MODE PIN 1 PIN 2 PIN 3 PIN 4 -5 V simultaneous LE BCK DATA L DATA R 0V time MUX OB WS BCK DATA OB not used +5 V time MUX TWC WS BCK DATA TWC not used Where: LE = latch enable WS = word select, LOW = left channel; HIGH = right channel BCK = bit clock DATA L = data left DATA R = data right DATA OB = data offset binary DATA TWC = data two's complement MUX OB = mulitplexed offset binary MUX TWC = multiplexed two's complement = I2S- format LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDD supply voltage; pin 28 0 7 V -VDD1 supply voltage; pin 26 0 7 V -VDD2 supply voltage; pin 15 0 17 V Tstg storage temperature range -55 +150 C Tamb operating ambient temperature range -40 +85 C Ves electrostatic handling* -1000 +1000 V TYP. UNIT 30 K/W * Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. THERMAL RESISTANCE SYMBOL Rth j-a February 1991 PARAMETER from junction to ambient 5 Philips Semiconductors Product specification Stereo high performance 16-bit DAC TDA1541A CHARACTERISTICS VDD = 5 V; -VDD1 = 5 V; -VDD2 = 15 V; Tamb = +25 C; mea sured in the circuit of Fig.1; unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDD supply voltage; pin 28 4.5 5.0 5.5 V -VDD1 supply voltage; pin 26 4.5 5.0 5.5 V -VDD2 supply voltage; pin 15 14.0 15.0 16.0 V VGND(A) -VGND(D) voltage difference between analog and digital ground -0.3 0 +0.3 V IDD supply current; pin 28 - 27 40 mA -IDD1 supply current; pin 26 - 37 50 mA -IDD2 supply current; pin 15 - 25 35 mA Inputs input current pins (1, 2, 3 and 4) -IIL digital inputs LOW VI = 0.8 V - - 0.4 mA IIH digital inputs HIGH VI = 2.0 V - - 20 A Digital input currents (pin 27) IOB/TWC +5 V - - 1 A IOB/TWC 0V - - 20 A IOB/TWC -5 V - - 40 A input frequency/bit rate fBCK clock input pin 2 - - 6.4 MHz BR bit rate data input pin 3 and 4 - - 6.4 Mbits/s fWS word select input pin 2 - - 200 kHz fLE latch enable input 1 - - 200 kHz CI input capacitance of digital inputs - 12 - pF Analog outputs (AOL;AOR; see note 1) Res resolution IFS full scale current IZS zero scale current TCFS full scale temperature coefficient - 16 - bits 3.4 4.0 4.6 mA - 25 50 nA Tamb = -20 to +85 C - 200 x 10-6 - K-1 Analog outputs (Vref) EL integral linearity error Tamb = 25 C - 0.5 1.0 LSB EL integral linearity error Tamb = -20 to +85 C - - 1.0 LSB EdL differential linearity error Tamb = 20 C, note 2 - 0.5 1.0 LSB EdL differential linearity error Tamb = -20 to +85 C - - 1.0 LSB THD total harmonic distortion at 0 dB; note 3 -100 - - dB - 0.0010 - % February 1991 6 Philips Semiconductors Product specification Stereo high performance 16-bit DAC SYMBOL THD TDA1541A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT total harmonic distortion including noise at 0 dB; note 3, Fig. 3, 4 - -95 -90 dB - 0.0018 0.0032 % including noise at -60 dB; note 3, Fig. 3, 4 - -42 - dB THD total harmonic distortion - 0.79 - % tcs settling time 1 LSB - 0.5 - s channel separation 90 98 - dB - < 0.1 0.3 dB - - 0.2 s |dIO| unbalance between outputs |td| time delay between outputs note 4 SSVR supply voltage ripple rejection VDD = +5 V; note 4 - -76 - dB SSVR supply voltage ripple rejection VDD1 = -5 V; note 4 - -84 - dB SSVR supply voltage ripple rejection VDD2 = -15 V; note 4 - -58 - dB S/N signal-to-noise ratio at bipolar zero - 110 - dB S/N signal-to-noise ratio at full scale 98 104 - dB - - 32 ns Timing (Fig. 5 and 6) tr rise time tf fall time - - 32 ns tCY bit clock cycle time 156 - - ns tHB bit clock HIGH time 46 - - ns tLB bit clock LOW time 46 - - ns tFBRL bit clock fall time to latch enable rise time 0 - - ns tRBFL bit clock rise time to latch enable fall time 0 - - ns tSU;DAT data set-up time 32 - - ns tHD;DAT data hold time to bit clock 0 - - ns tHD;WS word select hold time 0 - - ns tSU;WS word select set-up time 32 - - ns Notes to the characteristics 1. To ensure no performance losses, permitted output voltage compliance is 25 mV maximum. 2. Selections have been made with respect to the maximum differential linearity error (EdL): TDA1541A/N2 bit 1-16 EdL < 1 LSB TDA1541A/N2/R1 bit 1-16 EdL < 2 LSB TDA1541A/N2/S1 bit 1-7 bit 8-15 bit 16 EdL < 0.5 LSB EdL < 1 LSB EdL < 0.75 LSB February 1991 7 Philips Semiconductors Product specification Stereo high performance 16-bit DAC TDA1541A The S1 version has been specially selected to achieve extremely good performance even for small signals. 3. Measured using a 1 kHz sinewave generated at a sampling rate of 176.4 kHz. 4. Vripple = 100 mV and fripple = 100 Hz. (1) Measured including all distortion plus noise at a signal level of -60 dB. (2) Measured including all distortion plus noise at a signal level of -0 dB. Fig.3 Distortion as a function of frequency (4FS). Notes to Fig.3 * The sample frequency 4FS: 176.4 kHz. * Ref: 0 dB is the output level of a full scale digital sine wave stimulus. February 1991 8 Philips Semiconductors Product specification Stereo high performance 16-bit DAC TDA1541A (1) Measured including all distortion plus noise at a signal level of -60 dB. (2) Measured including all distortion plus noise at a signal level of -0 dB. Fig.4 Distortion as a function of frequency (8FS). Notes to Fig.4 * The sample frequency 8FS: 352.8 kHz. * Ref: 0 dB is the output level of a full scale digital sine wave stimulus. February 1991 9 Philips Semiconductors Product specification Stereo high performance 16-bit DAC TDA1541A Fig.5 Format of input signals; time multiplexed (I2S format). Fig.6 Format of input signals; simultaneous data. February 1991 10 Philips Semiconductors Product specification Stereo high performance 16-bit DAC TDA1541A PACKAGE OUTLINE seating plane handbook, full pagewidthdual in-line package; 28 leads (600 mil) DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 1.7 inches 0.20 0.020 0.16 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT117-1 051G05 MO-015AH February 1991 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 11 Philips Semiconductors Product specification Stereo high performance 16-bit DAC TDA1541A The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. February 1991 12