Data Sheet, V1.1, Aug. 2006 XC164CS-32F/32R 16-Bit Single-Chip Microcontroller with C166SV2 Core Microcontrollers Edition 2006-08 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2006. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Data Sheet, V1.1, Aug. 2006 XC164CS-32F/32R 16-Bit Single-Chip Microcontroller with C166SV2 Core Microcontrollers XC164-32 Derivatives XC164CS Revision History: V1.1, 2006-08 Previous Version(s): V1.0, 2005-06 (XC164-32F) Page Subjects (major changes since last revision) 6 New derivatives added. 51 Footnote at XTAL1 input pin. 55 Footnote on leakage of P3.15 added. 76 Green Package added. 75 Thermal Resistance: RTHA replaced by RJC and RJL because RTHA strongly depends on the external system (PCB, environment). PDISS removed, because no static parameter, but derived from thermal resistance. We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: mcdocu.comments@infineon.com Data Sheet V1.1, 2006-08 XC164-32 Derivatives Table of Contents Table of Contents 1 Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 2.1 2.2 General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 3.12 3.13 3.14 3.15 3.16 3.17 3.18 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Bus Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Central Processing Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capture/Compare Units (CAPCOM1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . The Capture/Compare Unit CAPCOM6 . . . . . . . . . . . . . . . . . . . . . . . . . . . General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Asynchronous/Synchronous Serial Interfaces (ASC0/ASC1) . . . . . . . . . . High Speed Synchronous Serial Channels (SSC0/SSC1) . . . . . . . . . . . . TwinCAN Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 18 20 21 23 28 29 32 33 37 39 40 41 42 44 45 45 47 48 4 4.1 4.2 4.3 4.4 4.4.1 4.4.2 4.4.3 4.4.4 4.4.5 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Analog/Digital Converter Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On-chip Flash Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Clock Drive XTAL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 51 54 60 63 63 67 68 69 70 5 5.1 5.2 Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Data Sheet 3 V1.1, 2006-08 16-Bit Single-Chip Microcontroller with C166SV2 Core XC166 Family 1 * * * * * * * * XC164CS Summary of Features High Performance 16-bit CPU with 5-Stage Pipeline - 25 ns Instruction Cycle Time at 40 MHz CPU Clock (Single-Cycle Execution) - 1-Cycle Multiplication (16 x 16 bit), Background Division (32 / 16 bit) in 21 Cycles - 1-Cycle Multiply-and-Accumulate (MAC) Instructions - Enhanced Boolean Bit Manipulation Facilities - Zero-Cycle Jump Execution - Additional Instructions to Support HLL and Operating Systems - Register-Based Design with Multiple Variable Register Banks - Fast Context Switching Support with Two Additional Local Register Banks - 16 Mbytes Total Linear Address Space for Code and Data - 1024 Bytes On-Chip Special Function Register Area (C166 Family Compatible) 16-Priority-Level Interrupt System with 75 Sources, Sample-Rate down to 50 ns 8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via Peripheral Event Controller (PEC), 24-Bit Pointers Cover Total Address Space Clock Generation via on-chip PLL (factors 1:0.15 ... 1:10), or via Prescaler (factors 1:1 ... 60:1) On-Chip Memory Modules - 2 Kbytes On-Chip Dual-Port RAM (DPRAM) - 4 Kbytes On-Chip Data SRAM (DSRAM) - 6 Kbytes On-Chip Program/Data SRAM (PSRAM) - 256 Kbytes On-Chip Program Memory (Flash Memory or Mask ROM) On-Chip Peripheral Modules - 14-Channel A/D Converter with Programmable Resolution (10-bit or 8-bit) and Conversion Time (down to 2.55 s or 2.15 s) - Two 16-Channel General Purpose Capture/Compare Units (12 Input/Output Pins) - Capture/Compare Unit for flexible PWM Signal Generation (CAPCOM6) (3/6 Capture/Compare Channels and 1 Compare Channel) - Multi-Functional General Purpose Timer Unit with 5 Timers - Two Synchronous/Asynchronous Serial Channels (USARTs) - Two High-Speed-Synchronous Serial Channels - On-Chip TwinCAN Interface (Rev. 2.0B active) with 32 Message Objects (Full CAN/Basic CAN) on Two CAN Nodes, and Gateway Functionality - On-Chip Real Time Clock Idle, Sleep, and Power Down Modes with Flexible Power Management Programmable Watchdog Timer and Oscillator Watchdog Data Sheet 4 V1.1, 2006-08 XC164-32 Derivatives Summary of Features * * * * * * Up to 12 Mbytes External Address Space for Code and Data - Programmable External Bus Characteristics for Different Address Ranges - Multiplexed or Demultiplexed External Address/Data Buses - Selectable Address Bus Width - 16-Bit or 8-Bit Data Bus Width - Four Programmable Chip-Select Signals Up to 79 General Purpose I/O Lines, partly with Selectable Input Thresholds and Hysteresis On-Chip Bootstrap Loader Supported by a Large Range of Development Tools like C-Compilers, MacroAssembler Packages, Emulators, Evaluation Boards, HLL-Debuggers, Simulators, Logic Analyzer Disassemblers, Programming Boards On-Chip Debug Support via JTAG Interface 100-Pin Green TQFP Package, 0.5 mm (19.7 mil) pitch (RoHS compliant) Ordering Information The ordering code for Infineon microcontrollers provides an exact reference to the required product. This ordering code identifies: * * the derivative itself, i.e. its function set, the temperature range, and the supply voltage the package and the type of delivery. For the available ordering codes for the XC164CS please refer to your responsible sales representative or your local distributor. Note: The ordering codes for Mask-ROM versions are defined for each product after verification of the respective ROM code. This document describes several derivatives of the XC164CS group. Table 1 enumerates these derivatives and summarizes the differences. As this document refers to all of these derivatives, some descriptions may not apply to a specific product. For simplicity all versions are referred to by the term XC164CS throughout this document. Data Sheet 5 V1.1, 2006-08 XC164-32 Derivatives Summary of Features Table 1 XC164CS Derivative Synopsis Derivative1) Temp. Range Program Memory On-Chip RAM Interfaces Standard Devices2) SAK-XC164CS-32F40F SAK-XC164CS-32F20F SAF-XC164CS-32F40F SAF-XC164CS-32F20F -40 C to 256 Kbytes 2 Kbytes DPRAM, 125 C Flash 4 Kbytes DSRAM, 6 Kbytes PSRAM -40 C to ASC0, ASC1, SSC0, SSC1, CAN0, CAN1, CC6 -40 C to 256 Kbytes 2 Kbytes DPRAM, 125 C Flash 4 Kbytes DSRAM, 6 Kbytes PSRAM -40 C to ASC0, ASC1, SSC0, SSC1, CAN0, CAN1, CC6 -40 C to 256 Kbytes 2 Kbytes DPRAM, 125 C ROM 4 Kbytes DSRAM, 6 Kbytes PSRAM -40 C to ASC0, ASC1, SSC0, SSC1, CAN0, CAN1, CC6 85 C Grade A Devices2) SAK-XC164CS-32F40F SAK-XC164CS-32F20F SAF-XC164CS-32F40F SAF-XC164CS-32F20F 85 C ROM Devices SAK-XC164CS-32R40F SAK-XC164CS-32R20F SAF-XC164CS-32R40F SAF-XC164CS-32R20F 85 C 1) This Data Sheet is valid for devices starting with and including design step BA. 2) The Flash speed grading indicates the access time to the on-chip Flash module. According to this access time Flash waitstates must be selected (bitfield WSFLASH in register IMBCTRL) according to the intended operating frequency. For more details, please refer to Section 4.4.2. Grade A devices are identified by "Grade A" in the fourth line of the chip marking. Data Sheet 6 V1.1, 2006-08 XC164-32 Derivatives General Device Information 2 General Device Information 2.1 Introduction The XC164CS derivatives are high-performance members of the Infineon XC166 Family of full featured single-chip CMOS microcontrollers. These devices extend the functionality and performance of the C166 Family in terms of instructions (MAC unit), peripherals, and speed. They combine high CPU performance (up to 40 million instructions per second) with high peripheral functionality and enhanced IO-capabilities. They also provide clock generation via PLL and various on-chip memory modules such as program Flash, program RAM, and data RAM. VAREF VAGND VDDI/P VSSI/P PORT0 16 bit XTAL1 PORT1 16 bit XTAL2 NMI Port 3 14 bit RSTIN RSTOUT XC164 Port 4 8 bit EA Port 20 5 bit ALE RD WR/WRL Port 5 14 bit Port 9 6 bit TRST JTAG Debug via Port 3 MCA05554_XC164 Figure 1 Data Sheet Logic Symbol 7 V1.1, 2006-08 XC164-32 Derivatives General Device Information 2.2 Pin Configuration and Definition P1L.7/A7/CTRAP/CC22IO P1L.6/A6/COUT63 P1L.5/A5/COUT62 P1L.4/A4/CC62 P1L.3/A3/COUT61 P1L.2/A2/CC61 P1L.1/A1/COUT60 P1L.0/A0/CC60 P0H.7/AD15 P0H.6/AD14 P0H.5/AD13 VSSP VDDP P1H.7/A15/CC27IO/EX7IN P1H.6/A14/CC26IO/EX6IN P1H.5/A13/CC25IO/EX5IN P1H.4/A12/CC24IO/EX4IN P1H.3/A11/T7IN/SCLK1/EX3IN/E*) P1H.2/A10/C6P2/MTSR1/EX2IN P1H.1/A9/C6P1/MRST1/EX1IN P1H.0/A8/C6P0/CC23IO/EX0IN VSSI VDDI 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 XTAL1 XTAL2 The pins of the XC164CS are described in detail in Table 2, including all their alternate functions. Figure 2 summarizes all pins in a condensed way, showing their location on the 4 sides of the package. E*) and C*) mark pins to be used as alternate external interrupt inputs, C*) marks pins that can have CAN interface lines assigned to them. RSTIN P20.12/RSTOUT NMI P0H.0/AD8 P0H.1/AD9 P0H.2/AD10 P0H.3/AD11 VSSP VDDP P9.0/CC16IO/C*) P9.1/CC17IO/C*) P9.2/CC18IO/C*) P9.3/CC19IO/C*) P9.4/CC20IO P9.5/CC21IO VSSP VDDP XC164 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 P0H.4/AD12 P0L.7/AD7 P0L.6/AD6 P0L.5/AD5 P0L.4/AD4 P0L.3/AD3 P0L.2/AD2 P0L.1/AD1 P0L.0/AD0 P20.5/EA P20.4/ALE P20.1/WR/WRL P20.0/RD VSSP VDDP P4.7/A23/C*) P4.6/A22/C*) P4.5/A21/C*) P4.4/A20/C*) P4.3/A19/CS0 P4.2/A18/CS1 P4.1/A17/CS2 P4.0/A16/CS3 P3.15/CLKOUT/FOUT P3.13/SCLK0/E*) Figure 2 Data Sheet P3.1/T6OUT/RxD1/TCK/E*) P3.2/CAPIN/TDI P3.3/T3OUT/TDO P3.4/T3EUD/TMS P3.5/T4IN/TxD1/BRKOUT P3.6/T3IN P3.7/T2IN/BRKIN P3.8/MRST0 P3.9/MTSR0 P3.10/TxD0/E*) P3.11/RxD0/E*) P3.12/BHE/WRH/E*) VSSP VDDP TRST VSSI VDDI P5.12/AN12/T6IN P5.13/AN13/T5IN P5.14/AN14/T4EUD P5.15/AN15/T2EUD VAREF VAGND P5.6/AN6 P5.7/AN7 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 P5.0/AN0 P5.1/AN1 P5.2/AN2 P5.3/AN3 P5.4/AN4 P5.5/AN5 P5.10/AN10/T6EUD P5.11/AN11/T5EUD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 MCP06457 Pin Configuration (top view) 8 V1.1, 2006-08 XC164-32 Derivatives General Device Information Table 2 Pin Definitions and Functions Symbol Pin Num. Input Outp. Function RSTIN 1 I Reset Input with Schmitt-Trigger characteristics. A low level at this pin while the oscillator is running resets the XC164CS. A spike filter suppresses input pulses < 10 ns. Input pulses > 100 ns safely pass the filter. The minimum duration for a safe recognition should be 100 ns + 2 CPU clock cycles. Note: The reset duration must be sufficient to let the hardware configuration signals settle. External circuitry must guarantee low level at the RSTIN pin at least until both power supply voltages have reached the operating range. P20.12 2 NMI 3 P0H.0 - 4 ... 7 P0H.3 Data Sheet IO For details, please refer to the description of P20. I Non-Maskable Interrupt Input. A high to low transition at this pin causes the CPU to vector to the NMI trap routine. When the PWRDN (power down) instruction is executed, the NMI pin must be low in order to force the XC164CS into power down mode. If NMI is high, when PWRDN is executed, the part will continue to run in normal mode. If not used, pin NMI should be pulled high externally. IO For details, please refer to the description of PORT0. 9 V1.1, 2006-08 XC164-32 Derivatives General Device Information Table 2 Symbol Pin Definitions and Functions (cont'd) Pin Num. P9 P9.0 10 P9.1 11 P9.2 12 P9.3 13 P9.4 P9.5 14 15 Function IO Port 9 is a 6-bit bidirectional I/O port. Each pin can be programmed for input (output driver in high-impedance state) or output (configurable as push/pull or open drain driver). The input threshold of Port 9 is selectable (standard or special). The following Port 9 pins also serve for alternate functions:1) CC16IO CAPCOM2: CC16 Capture Inp./Compare Outp., CAN1_RxD CAN Node B Receive Data Input, EX7IN Fast External Interrupt 7 Input (alternate pin B) CC17IO CAPCOM2: CC17 Capture Inp./Compare Outp., CAN1_TxD CAN Node B Transmit Data Output, EX6IN Fast External Interrupt 6 Input (alternate pin B) CC18IO CAPCOM2: CC18 Capture Inp./Compare Outp., CAN0_RxD CAN Node A Receive Data Input, EX7IN Fast External Interrupt 7 Input (alternate pin A) CC19IO CAPCOM2: CC19 Capture Inp./Compare Outp., CAN0_TxD CAN Node A Transmit Data Output, EX6IN Fast External Interrupt 6 Input (alternate pin A) CC20IO CAPCOM2: CC20 Capture Inp./Compare Outp. CC21IO CAPCOM2: CC21 Capture Inp./Compare Outp. I/O I I I/O O I I/O I I I/O O I I/O I/O I P5 P5.0 P5.1 P5.2 P5.3 P5.4 P5.5 P5.10 P5.11 P5.6 P5.7 P5.12 P5.13 P5.14 P5.15 Input Outp. 18 19 20 21 22 23 24 25 26 27 30 31 32 33 Data Sheet I I I I I I I I I I I I I I Port 5 is a 14-bit input-only port. The pins of Port 5 also serve as analog input channels for the A/D converter, or they serve as timer inputs: AN0 AN1 AN2 AN3 AN4 AN5 AN10, T6EUD GPT2 Timer T6 Ext. Up/Down Ctrl. Inp. AN11, T5EUD GPT2 Timer T5 Ext. Up/Down Ctrl. Inp. AN6 AN7 AN12, T6IN GPT2 Timer T6 Count/Gate Input AN13, T5IN GPT2 Timer T5 Count/Gate Input AN14, T4EUD GPT1 Timer T4 Ext. Up/Down Ctrl. Inp. AN15, T2EUD GPT1 Timer T2 Ext. Up/Down Ctrl. Inp. 10 V1.1, 2006-08 XC164-32 Derivatives General Device Information Table 2 Pin Definitions and Functions (cont'd) Symbol Pin Num. Input Outp. Function TRST 36 I Test-System Reset Input. A high level at this pin activates the XC164CS's debug system. For normal system operation, pin TRST should be held low. IO Port 3 is a 14-bit bidirectional I/O port. Each pin can be programmed for input (output driver in high-impedance state) or output (configurable as push/pull or open drain driver). The input threshold of Port 3 is selectable (standard or special). The following Port 3 pins also serve for alternate functions: T6OUT GPT2 Timer T6 Toggle Latch Output, RxD1 ASC1 Data Input (Async.) or Inp./Outp. (Sync.), EX1IN Fast External Interrupt 1 Input (alternate pin A), TCK Debug System: JTAG Clock Input CAPIN GPT2 Register CAPREL Capture Input, TDI Debug System: JTAG Data In T3OUT GPT1 Timer T3 Toggle Latch Output, TDO Debug System: JTAG Data Out T3EUD GPT1 Timer T3 External Up/Down Control Input, TMS Debug System: JTAG Test Mode Selection T4IN GPT1 Timer T4 Count/Gate/Reload/Capture In., TxD1 ASC0 Clock/Data Output (Async./Sync.), BRKOUT Debug System: Break Out T3IN GPT1 Timer T3 Count/Gate Input T2IN GPT1 Timer T2 Count/Gate/Reload/Capture In., BRKIN Debug System: Break In MRST0 SSC0 Master-Receive/Slave-Transmit In/Out. MTSR0 SSC0 Master-Transmit/Slave-Receive Out/In. TxD0 ASC0 Clock/Data Output (Async./Sync.), EX2IN Fast External Interrupt 2 Input (alternate pin B) RxD0 ASC0 Data Input (Async.) or Inp./Outp. (Sync.), EX2IN Fast External Interrupt 2 Input (alternate pin A) BHE External Memory High Byte Enable Signal, WRH External Memory High Byte Write Strobe, EX3IN Fast External Interrupt 3 Input (alternate pin B) SCLK0 SSC0 Master Clock Output / Slave Clock Input, EX3IN Fast External Interrupt 3 Input (alternate pin A) CLKOUT System Clock Output (= CPU Clock), FOUT Programmable Frequency Output P3 P3.1 39 P3.2 40 P3.3 41 P3.4 42 P3.5 43 P3.6 P3.7 44 45 P3.8 P3.9 P3.10 46 47 48 P3.11 49 P3.12 50 P3.13 51 P3.15 52 Data Sheet O I/O I I I I O O I I I O O I I I I/O I/O O I I/O I O O I I/O I O O 11 V1.1, 2006-08 XC164-32 Derivatives General Device Information Table 2 Symbol Pin Definitions and Functions (cont'd) Pin Num. P4 P4.0 53 P4.1 54 P4.2 55 P4.3 56 P4.4 57 P4.5 58 P4.6 59 P4.7 60 Data Sheet Input Outp. Function IO Port 4 is an 8-bit bidirectional I/O port. Each pin can be programmed for input (output driver in high-impedance state) or output (configurable as push/pull or open drain driver). The input threshold of Port 4 is selectable (standard or special). Port 4 can be used to output the segment address lines, the optional chip select lines, and for serial interface lines:1) A16 Least Significant Segment Address Line, CS3 Chip Select 3 Output A17 Segment Address Line, Chip Select 2 Output CS2 A18 Segment Address Line, CS1 Chip Select 1 Output A19 Segment Address Line, CS0 Chip Select 0 Output A20 Segment Address Line, CAN1_RxD CAN Node B Receive Data Input, EX5IN Fast External Interrupt 5 Input (alternate pin B) A21 Segment Address Line, CAN0_RxD CAN Node A Receive Data Input, EX4IN Fast External Interrupt 4 Input (alternate pin B) A22 Segment Address Line, CAN0_TxD CAN Node A Transmit Data Output, EX5IN Fast External Interrupt 5 Input (alternate pin A) A23 Most Significant Segment Address Line, CAN0_RxD CAN Node A Receive Data Input, CAN1_TxD CAN Node B Transmit Data Output, EX4IN Fast External Interrupt 4 Input (alternate pin A) O O O O O O O O O I I O I I O O I O I O I 12 V1.1, 2006-08 XC164-32 Derivatives General Device Information Table 2 Symbol Pin Definitions and Functions (cont'd) Pin Num. P20 Input Outp. Function IO Port 20 is a 5-bit bidirectional I/O port. Each pin can be programmed for input (output driver in high-impedance state) or output. The input threshold of Port 20 is selectable (standard or special). The following Port 20 pins also serve for alternate functions: RD External Memory Read Strobe, activated for every external instruction or data read access. WR/WRL External Memory Write Strobe. In WR-mode this pin is activated for every external data write access. In WRL-mode this pin is activated for low byte data write accesses on a 16-bit bus, and for every data write access on an 8-bit bus. ALE Address Latch Enable Output. Can be used for latching the address into external memory or an address latch in the multiplexed bus modes. EA External Access Enable pin. A low level at this pin during and after Reset forces the XC164CS to latch the configuration from PORT0 and pin RD, and to begin instruction execution out of external memory. A high level forces the XC164CS to latch the configuration from pins RD, ALE, and WR, and to begin instruction execution out of the internal program memory. "ROMless" versions must have this pin tied to `0'. RSTOUT Internal Reset Indication Output. Is activated asynchronously with an external hardware reset. It may also be activated (selectable) synchronously with an internal software or watchdog reset. Is deactivated upon the execution of the EINIT instruction, optionally at the end of reset, or at any time (before EINIT) via user software. P20.0 63 O P20.1 64 O P20.4 65 O P20.5 66 I P20.12 2 O Note: Port 20 pins may input configuration values (see EA). Data Sheet 13 V1.1, 2006-08 XC164-32 Derivatives General Device Information Table 2 Symbol Pin Definitions and Functions (cont'd) Pin Num. PORT0 Input Outp. Function IO PORT0 consists of the two 8-bit bidirectional I/O ports P0L and P0H. Each pin can be programmed for input (output driver in high-impedance state) or output. In case of an external bus configuration, PORT0 serves as the address (A) and address/data (AD) bus in multiplexed bus modes and as the data (D) bus in demultiplexed bus modes. Demultiplexed bus modes: 8-bit data bus: P0H = I/O, P0L = D7 - D0 16-bit data bus: P0H = D15 - D8, P0L = D7 - D0 Multiplexed bus modes: 8-bit data bus: P0H = A15 - A8, P0L = AD7 - AD0 16-bit data bus: P0H = AD15 - AD8, P0L = AD7 - AD0 P0L.0 - 67 - 74 P0L.7 P0H.0 - 4 - 7 P0H.3 P0H.4 - 75 - 78 P0H.7 Note: At the end of an external reset (EA = 0) PORT0 also may input configuration values IO PORT1 P1L.0 P1L.1 P1L.2 P1L.3 P1L.4 P1L.5 P1L.6 P1L.7 79 80 81 82 83 84 85 86 I/O O I/O O I/O O O I I/O P1H ... Data Sheet PORT1 consists of the two 8-bit bidirectional I/O ports P1L and P1H. Each pin can be programmed for input (output driver in high-impedance state) or output. PORT1 is used as the 16-bit address bus (A) in demultiplexed bus modes (also after switching from a demultiplexed to a multiplexed bus mode). The following PORT1 pins also serve for alt. functions: CC60 CAPCOM6: Input / Output of Channel 0 COUT60 CAPCOM6: Output of Channel 0 CC61 CAPCOM6: Input / Output of Channel 1 COUT61 CAPCOM6: Output of Channel 1 CC62 CAPCOM6: Input / Output of Channel 2 COUT62 CAPCOM6: Output of Channel 2 COUT63 Output of 10-bit Compare Channel CTRAP CAPCOM6: Trap Input CTRAP is an input pin with an internal pull-up resistor. A low level on this pin switches the CAPCOM6 compare outputs to the logic level defined by software (if enabled). CC22IO CAPCOM2: CC22 Capture Inp./Compare Outp. ...continued... 14 V1.1, 2006-08 XC164-32 Derivatives General Device Information Table 2 Symbol Pin Definitions and Functions (cont'd) Pin Num. PORT1 (cont'd) P1H.0 89 P1H.1 90 P1H.2 91 P1H.3 92 P1H.4 93 P1H.5 94 P1H.6 95 P1H.7 96 XTAL2 XTAL1 99 100 Input Outp. Function IO ...continued... I I I/O I I I/O I I I/O I I/O I I I/O I I/O I I/O I I/O I CC6POS0 EX0IN CC23IO CC6POS1 EX1IN MRST1 CC6POS2 EX2IN MTSR1 T7IN SCLK1 EX3IN EX0IN CC24IO EX4IN CC25IO EX5IN CC26IO EX6IN CC27IO EX7IN O I XTAL2: XTAL1: CAPCOM6: Position 0 Input, Fast External Interrupt 0 Input (default pin), CAPCOM2: CC23 Capture Inp./Compare Outp. CAPCOM6: Position 1 Input, Fast External Interrupt 1 Input (default pin), SSC1 Master-Receive/Slave-Transmit In/Out. CAPCOM6: Position 2 Input, Fast External Interrupt 2 Input (default pin), SSC1 Master-Transmit/Slave-Receive Out/Inp. CAPCOM2: Timer T7 Count Input, SSC1 Master Clock Output / Slave Clock Input, Fast External Interrupt 3 Input (default pin), Fast External Interrupt 0 Input (alternate pin A) CAPCOM2: CC24 Capture Inp./Compare Outp., Fast External Interrupt 4 Input (default pin) CAPCOM2: CC25 Capture Inp./Compare Outp., Fast External Interrupt 5 Input (default pin) CAPCOM2: CC26 Capture Inp./Compare Outp., Fast External Interrupt 6 Input (default pin) CAPCOM2: CC27 Capture Inp./Compare Outp., Fast External Interrupt 7 Input (default pin) Output of the oscillator amplifier circuit Input to the oscillator amplifier and input to the internal clock generator To clock the device from an external source, drive XTAL1, while leaving XTAL2 unconnected. Minimum and maximum high/low and rise/fall times specified in the AC. Characteristics must be observed. Note: Input pin XTAL1 belongs to the core voltage domain. Therefore, input voltages must be within the range defined for VDDI. VAREF VAGND 28 - Reference voltage for the A/D converter. 29 - Reference ground for the A/D converter. Data Sheet 15 V1.1, 2006-08 XC164-32 Derivatives General Device Information Table 2 Pin Definitions and Functions (cont'd) Symbol Pin Num. Input Outp. Function VDDI 35, 97 - Digital Core Supply Voltage (On-Chip Modules): +2.5 V during normal operation and idle mode. Please refer to the Operating Condition Parameters. VDDP 9, 17, - 38, 61, 87 Digital Pad Supply Voltage (Pin Output Drivers): +5 V during normal operation and idle mode. Please refer to the Operating Condition Parameters. VSSI VSSP 34, 98 Digital Ground Connect decoupling capacitors to adjacent VDD/VSS pin pairs as close as possible to the pins. All VSS pins must be connected to the ground-line or groundplane. - 8, 16, - 37, 62, 88 1) The CAN interface lines are assigned to ports P4 and P9 under software control. Data Sheet 16 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3 Functional Description The architecture of the XC164CS combines advantages of RISC, CISC, and DSP processors with an advanced peripheral subsystem in a very well-balanced way. In addition, the on-chip memory blocks allow the design of compact systems-on-silicon with maximum performance (computing, control, communication). The on-chip memory blocks (program code-memory and SRAM, dual-port RAM, data SRAM) and the set of generic peripherals are connected to the CPU via separate buses. Another bus, the LXBus, connects additional on-chip resources as well as external resources (see Figure 3). This bus structure enhances the overall system performance by enabling the concurrent operation of several subsystems of the XC164CS. The following block diagram gives an overview of the different on-chip components and of the advanced, high bandwidth internal bus structure of the XC164CS. ProgMem Flash/ROM 256 Kbytes CPU Osc / PLL Clock Generator RTC WDT EBC LXBus Control External Bus Control C166SV2 - Core LXBus XTAL OCDS Debug Support DSRAM DMU DPRAM PMU PSRAM Interrupt & PEC ADC 8-Bit/ 10-Bit 14 Ch GPT T2 ASC0 ASC1 SSC0 SSC1 SPI SPI CC1 CC2 CC6 T0 T7 T12 T1 T8 T13 USART USART T3 T4 T5 T6 P 20 P 9 5 Peripheral Data Bus Interrupt Bus Twin CAN A B BRGen BRGen BRGen BRGen Port 5 Port 4 Port 3 PORT1 PORT0 14 8 14 16 16 6 MCB04323_X432R Figure 3 Data Sheet Block Diagram 17 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.1 Memory Subsystem and Organization The memory space of the XC164CS is configured in a Von Neumann architecture, which means that all internal and external resources, such as code memory, data memory, registers and I/O ports, are organized within the same linear address space. This common memory space includes 16 Mbytes and is arranged as 256 segments of 64 Kbytes each, where each segment consists of four data pages of 16 Kbytes each. The entire memory space can be accessed bytewise or wordwise. Portions of the on-chip DPRAM and the register spaces (E/SFR) have additionally been made directly bitaddressable. The internal data memory areas and the Special Function Register areas (SFR and ESFR) are mapped into segment 0, the system segment. The Program Management Unit (PMU) handles all code fetches and, therefore, controls accesses to the program memories, such as Flash memory and PSRAM. The Data Management Unit (DMU) handles all data transfers and, therefore, controls accesses to the DSRAM and the on-chip peripherals. Both units (PMU and DMU) are connected via the high-speed system bus to exchange data. This is required if operands are read from program memory, code or data is written to the PSRAM, code is fetched from external memory, or data is read from or written to external resources, including peripherals on the LXBus (such as TwinCAN). The system bus allows concurrent two-way communication for maximum transfer performance. 256 Kbytes of on-chip Flash memory store code or constant data. The on-chip Flash memory is organized as four 8-Kbyte sectors, one 32-Kbyte sector, and three 64-Kbyte sectors. Each sector can be separately write protected1), erased and programmed (in blocks of 128 bytes). The complete Flash area can be read-protected. A password sequence temporarily unlocks protected areas. The Flash module combines very fast 64-bit one-cycle read accesses with protected and efficient writing algorithms for programming and erasing. Thus, program execution out of the internal Flash results in maximum performance. Dynamic error correction provides extremely high read data security for all read accesses. For timing characteristics, please refer to Section 4.4.2. 6 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user code or data. The PSRAM is accessed via the PMU and is therefore optimized for code fetches. 4 Kbytes of on-chip Data SRAM (DSRAM) are provided as a storage for general user data. The DSRAM is accessed via the DMU and is therefore optimized for data accesses. 2 Kbytes of on-chip Dual-Port RAM (DPRAM) are provided as a storage for user defined variables, for the system stack, and general purpose register banks. A register bank can consist of up to 16 wordwide (R0 to R15) and/or bytewide (RL0, RH0, ..., RL7, 1) Each two 8-Kbyte sectors are combined for write-protection purposes. Data Sheet 18 V1.1, 2006-08 XC164-32 Derivatives Functional Description RH7) so-called General Purpose Registers (GPRs). The upper 256 bytes of the DPRAM are directly bitaddressable. When used by a GPR, any location in the DPRAM is bitaddressable. 1024 bytes (2 x 512 bytes) of the address space are reserved for the Special Function Register areas (SFR space and ESFR space). SFRs are wordwide registers which are used for controlling and monitoring functions of the different on-chip units. Unused SFR addresses are reserved for future members of the XC166 Family. Therefore, they should either not be accessed, or written with zeros, to ensure upward compatibility. In order to meet the needs of designs where more memory is required than is provided on chip, up to 12 Mbytes (approximately, see Table 3) of external RAM and/or ROM can be connected to the microcontroller. The External Bus Interface also provides access to external peripherals. Table 3 XC164CS Memory Map1) Address Area Start Loc. End Loc. Area Size2) Notes Flash register space FF'F000H FF'FFFFH 4 Kbytes 3) Reserved (Acc. trap) FE'0000H FF'EFFFH 60 Kbytes - Reserved for EPSRAM F8'1800H FD'FFFFH 378 Kbytes - Emul. Program SRAM4) F8'0000H F8'17FFH 6 Kbytes 2nd way to PSRAM Reserved for PSRAM E0'1800H F7'FFFFH < 1.5 Mbytes Minus PSRAM Program SRAM E0'0000H E0'17FFH 6 Kbytes Maximum Reserved for program memory C4'0000H DF'FFFFH < 2 Mbytes Minus Flash Program Flash/ROM C0'0000H C3'FFFFH 256 Kbytes - Reserved BF'0000H BF'FFFFH 64 Kbytes - External memory area 40'0000H BE'FFFFH < 8 Mbytes Minus reserved segment External IO area5) 20'0800H 3F'FFFFH < 2 Mbytes Minus TwinCAN TwinCAN registers 20'0000H 20'07FFH 2 Kbytes - External memory area 01'0000H 1F'FFFFH < 2 Mbytes Minus segment 0 Data RAMs and SFRs 00'8000H 00'FFFFH 32 Kbytes Partly used External memory area 00'0000H 00'7FFFH 32 Kbytes - 1) Accesses to the shaded areas generate external bus accesses. 2) The areas marked with "<" are slightly smaller than indicated, see column "Notes". 3) Not defined register locations return a trap code. 4) The Emulation PSRAM (EPSRAM) realizes a 2nd access path to the PSRAM with a different timing. Data Sheet 19 V1.1, 2006-08 XC164-32 Derivatives Functional Description 5) Several pipeline optimizations are not active within the external IO area. This is necessary to control external peripherals properly. 3.2 External Bus Controller All of the external memory accesses are performed by a particular on-chip External Bus Controller (EBC). It can be programmed either to Single Chip Mode when no external memory is required, or to one of four different external memory access modes1), which are as follows: * * * * 16 ... 24-bit Addresses, 16-bit Data, Demultiplexed 16 ... 24-bit Addresses, 16-bit Data, Multiplexed 16 ... 24-bit Addresses, 8-bit Data, Multiplexed 16 ... 24-bit Addresses, 8-bit Data, Demultiplexed In the demultiplexed bus modes, addresses are output on PORT1 and data is input/output on PORT0 or P0L, respectively. In the multiplexed bus modes both addresses and data use PORT0 for input/output. The high order address (segment) lines use Port 4. The number of active segment address lines is selectable, restricting the external address space to 8 Mbytes ... 64 Kbytes. This is required when interface lines are assigned to Port 4. Up to 4 external CS signals (3 windows plus default) can be generated in order to save external glue logic. External modules can directly be connected to the common address/data bus and their individual select lines. Important timing characteristics of the external bus interface have been made programmable (via registers TCONCSx/FCONCSx) to allow the user the adaption of a wide range of different types of memories and external peripherals. In addition, up to 4 independent address windows may be defined (via registers ADDRSELx) which control the access to different resources with different bus characteristics. These address windows are arranged hierarchically where window 4 overrides window 3, and window 2 overrides window 1. All accesses to locations not covered by these 4 address windows are controlled by TCONCS0/FCONCS0. The currently active window can generate a chip select signal. Note: The chip select signal of address window 4 is not available on a pin. The external bus timing is related to the rising edge of the reference clock output CLKOUT. The external bus protocol is compatible with that of the standard C166 Family. The EBC also controls accesses to resources connected to the on-chip LXBus. The LXBus is an internal representation of the external bus and allows accessing integrated peripherals and modules in the same way as external components. The TwinCAN module is connected and accessed via the LXBus. 1) Bus modes are switched dynamically if several address windows with different mode settings are used. Data Sheet 20 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.3 Central Processing Unit (CPU) The main core of the CPU consists of a 5-stage execution pipeline with a 2-stage instruction-fetch pipeline, a 16-bit arithmetic and logic unit (ALU), a 32-bit/40-bit multiply and accumulate unit (MAC), a register-file providing three register banks, and dedicated SFRs. The ALU features a multiply and divide unit, a bit-mask generator, and a barrel shifter. PSRAM Flash/RO M PM U CPU P refetch U nit B ranch U nit FIFO CSP VECSEG CPUCON1 CPUCON2 R etu rn S tack ID X 0 ID X 1 QX0 QX1 QR0 QR1 + /- + /- M u ltip ly U nit IP MRW + /- MCW MSW MAH MAL 2-S tage P refetch P ipeline TF R Injection/ Exception Handler 5-S tage P ipeline IFU DPRAM IPIP DPP0 DPP1 DPP2 DPP3 SPSEG SP STKO V STKUN ADU D ivisio n U n it B it-M a sk-G e n . M u ltip ly U n it B a rre l-S h ifte r MDC CP RR1515 RR1414 R 15 R 14 R 15 R 14 GPRs GPRs GPRs GPRs RR1 1 RR0 0R 1 R0 R1 R0 RF PSW + /- MDH MDL ZE R O S ONES M AC B uffer ALU WB DSRAM EBC Peripherals DM U m ca04917_x.vsd Figure 4 CPU Block Diagram Based on these hardware provisions, most of the XC164CS's instructions can be executed in just one machine cycle which requires 25 ns at 40 MHz CPU clock. For Data Sheet 21 V1.1, 2006-08 XC164-32 Derivatives Functional Description example, shift and rotate instructions are always processed during one machine cycle independent of the number of bits to be shifted. Also multiplication and most MAC instructions execute in one single cycle. All multiple-cycle instructions have been optimized so that they can be executed very fast as well: for example, a division algorithm is performed in 18 to 21 CPU cycles, depending on the data and division type. Four cycles are always visible, the rest runs in the background. Another pipeline optimization, the branch target prediction, allows eliminating the execution time of branch instructions if the prediction was correct. The CPU has a register context consisting of up to three register banks with 16 wordwide GPRs each at its disposal. The global register bank is physically allocated within the on-chip DPRAM area. A Context Pointer (CP) register determines the base address of the active global register bank to be accessed by the CPU at any time. The number of register banks is only restricted by the available internal RAM space. For easy parameter passing, a register bank may overlap others. A system stack of up to 32 Kwords is provided as a storage for temporary data. The system stack can be allocated to any location within the address space (preferably in the on-chip RAM area), and it is accessed by the CPU via the stack pointer (SP) register. Two separate SFRs, STKOV and STKUN, are implicitly compared against the stack pointer value upon each stack access for the detection of a stack overflow or underflow. The high performance offered by the hardware implementation of the CPU can efficiently be utilized by a programmer via the highly efficient XC164CS instruction set which includes the following instruction classes: * * * * * * * * * * * * * Standard Arithmetic Instructions DSP-Oriented Arithmetic Instructions Logical Instructions Boolean Bit Manipulation Instructions Compare and Loop Control Instructions Shift and Rotate Instructions Prioritize Instruction Data Movement Instructions System Stack Instructions Jump and Call Instructions Return Instructions System Control Instructions Miscellaneous Instructions The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes and words. A variety of direct, indirect or immediate addressing modes are provided to specify the required operands. Data Sheet 22 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.4 Interrupt System With an interrupt response time of typically 8 CPU clocks (in case of internal program execution), the XC164CS is capable of reacting very fast to the occurrence of nondeterministic events. The architecture of the XC164CS supports several mechanisms for fast and flexible response to service requests that can be generated from various sources internal or external to the microcontroller. Any of these interrupt requests can be programmed to being serviced by the Interrupt Controller or by the Peripheral Event Controller (PEC). In contrast to a standard interrupt service where the current program execution is suspended and a branch to the interrupt vector table is performed, just one cycle is `stolen' from the current CPU activity to perform a PEC service. A PEC service implies a single byte or word data transfer between any two memory locations with an additional increment of either the PEC source, or the destination pointer, or both. An individual PEC transfer counter is implicitly decremented for each PEC service except when performing in the continuous transfer mode. When this counter reaches zero, a standard interrupt is performed to the corresponding source related vector location. PEC services are very well suited, for example, for supporting the transmission or reception of blocks of data. The XC164CS has 8 PEC channels each of which offers such fast interrupt-driven data transfer capabilities. A separate control register which contains an interrupt request flag, an interrupt enable flag and an interrupt priority bitfield exists for each of the possible interrupt nodes. Via its related register, each node can be programmed to one of sixteen interrupt priority levels. Once having been accepted by the CPU, an interrupt service can only be interrupted by a higher prioritized service request. For the standard interrupt processing, each of the possible interrupt nodes has a dedicated vector location. Fast external interrupt inputs are provided to service external interrupts with high precision requirements. These fast interrupt inputs feature programmable edge detection (rising edge, falling edge, or both edges). Software interrupts are supported by means of the `TRAP' instruction in combination with an individual trap (interrupt) number. Table 4 shows all of the possible XC164CS interrupt sources and the corresponding hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers. Note: Interrupt nodes which are not assigned to peripherals (unassigned nodes), may be used to generate software controlled interrupt requests by setting the respective interrupt request bit (xIR). Data Sheet 23 V1.1, 2006-08 XC164-32 Derivatives Functional Description Table 4 XC164CS Interrupt Nodes Source of Interrupt or PEC Service Request Control Register Vector Location1) Trap Number CAPCOM Register 0 CC1_CC0IC xx'0040H 10H / 16D CAPCOM Register 1 CC1_CC1IC xx'0044H 11H / 17D CAPCOM Register 2 CC1_CC2IC xx'0048H 12H / 18D CAPCOM Register 3 CC1_CC3IC xx'004CH 13H / 19D CAPCOM Register 4 CC1_CC4IC xx'0050H 14H / 20D CAPCOM Register 5 CC1_CC5IC xx'0054H 15H / 21D CAPCOM Register 6 CC1_CC6IC xx'0058H 16H / 22D CAPCOM Register 7 CC1_CC7IC xx'005CH 17H / 23D CAPCOM Register 8 CC1_CC8IC xx'0060H 18H / 24D CAPCOM Register 9 CC1_CC9IC xx'0064H 19H / 25D CAPCOM Register 10 CC1_CC10IC xx'0068H 1AH / 26D CAPCOM Register 11 CC1_CC11IC xx'006CH 1BH / 27D CAPCOM Register 12 CC1_CC12IC xx'0070H 1CH / 28D CAPCOM Register 13 CC1_CC13IC xx'0074H 1DH / 29D CAPCOM Register 14 CC1_CC14IC xx'0078H 1EH / 30D CAPCOM Register 15 CC1_CC15IC xx'007CH 1FH / 31D CAPCOM Register 16 CC2_CC16IC xx'00C0H 30H / 48D CAPCOM Register 17 CC2_CC17IC xx'00C4H 31H / 49D CAPCOM Register 18 CC2_CC18IC xx'00C8H 32H / 50D CAPCOM Register 19 CC2_CC19IC xx'00CCH 33H / 51D CAPCOM Register 20 CC2_CC20IC xx'00D0H 34H / 52D CAPCOM Register 21 CC2_CC21IC xx'00D4H 35H / 53D CAPCOM Register 22 CC2_CC22IC xx'00D8H 36H / 54D CAPCOM Register 23 CC2_CC23IC xx'00DCH 37H / 55D CAPCOM Register 24 CC2_CC24IC xx'00E0H 38H / 56D CAPCOM Register 25 CC2_CC25IC xx'00E4H 39H / 57D CAPCOM Register 26 CC2_CC26IC xx'00E8H 3AH / 58D CAPCOM Register 27 CC2_CC27IC xx'00ECH 3BH / 59D CAPCOM Register 28 CC2_CC28IC xx'00F0H 3CH / 60D Data Sheet 24 V1.1, 2006-08 XC164-32 Derivatives Functional Description Table 4 XC164CS Interrupt Nodes (cont'd) Source of Interrupt or PEC Service Request Control Register Vector Location1) Trap Number CAPCOM Register 29 CC2_CC29IC xx'0110H 44H / 68D CAPCOM Register 30 CC2_CC30IC xx'0114H 45H / 69D CAPCOM Register 31 CC2_CC31IC xx'0118H 46H / 70D CAPCOM Timer 0 CC1_T0IC xx'0080H 20H / 32D CAPCOM Timer 1 CC1_T1IC xx'0084H 21H / 33D CAPCOM Timer 7 CC2_T7IC xx'00F4H 3DH / 61D CAPCOM Timer 8 CC2_T8IC xx'00F8H 3EH / 62D GPT1 Timer 2 GPT12E_T2IC xx'0088H 22H / 34D GPT1 Timer 3 GPT12E_T3IC xx'008CH 23H / 35D GPT1 Timer 4 GPT12E_T4IC xx'0090H 24H / 36D GPT2 Timer 5 GPT12E_T5IC xx'0094H 25H / 37D GPT2 Timer 6 GPT12E_T6IC xx'0098H 26H / 38D GPT2 CAPREL Register GPT12E_CRIC xx'009CH 27H / 39D A/D Conversion Complete ADC_CIC xx'00A0H 28H / 40D A/D Overrun Error ADC_EIC xx'00A4H 29H / 41D ASC0 Transmit ASC0_TIC xx'00A8H 2AH / 42D ASC0 Transmit Buffer ASC0_TBIC xx'011CH 47H / 71D ASC0 Receive ASC0_RIC xx'00ACH 2BH / 43D ASC0 Error ASC0_EIC xx'00B0H 2CH / 44D ASC0 Autobaud ASC0_ABIC xx'017CH 5FH / 95D SSC0 Transmit SSC0_TIC xx'00B4H 2DH / 45D SSC0 Receive SSC0_RIC xx'00B8H 2EH / 46D SSC0 Error SSC0_EIC xx'00BCH 2FH / 47D PLL/OWD PLLIC xx'010CH 43H / 67D ASC1 Transmit ASC1_TIC xx'0120H 48H / 72D ASC1 Transmit Buffer ASC1_TBIC xx'0178H 5EH / 94D ASC1 Receive ASC1_RIC xx'0124H 49H / 73D ASC1 Error ASC1_EIC xx'0128H 4AH / 74D ASC1 Autobaud ASC1_ABIC xx'0108H 42H / 66D End of PEC Subchannel EOPIC xx'0130H 4CH / 76D Data Sheet 25 V1.1, 2006-08 XC164-32 Derivatives Functional Description Table 4 XC164CS Interrupt Nodes (cont'd) Source of Interrupt or PEC Service Request Control Register Vector Location1) Trap Number CAPCOM6 Timer T12 CCU6_T12IC xx'0134H 4DH / 77D CAPCOM6 Timer T13 CCU6_T13IC xx'0138H 4EH / 78D CAPCOM6 Emergency CCU6_EIC xx'013CH 4FH / 79D CAPCOM6 CCU6_IC xx'0140H 50H / 80D SSC1 Transmit SSC1_TIC xx'0144H 51H / 81D SSC1 Receive SSC1_RIC xx'0148H 52H / 82D SSC1 Error SSC1_EIC xx'014CH 53H / 83D CAN0 CAN_0IC xx'0150H 54H / 84D CAN1 CAN_1IC xx'0154H 55H / 85D CAN2 CAN_2IC xx'0158H 56H / 86D CAN3 CAN_3IC xx'015CH 57H / 87D CAN4 CAN_4IC xx'0164H 59H / 89D CAN5 CAN_5IC xx'0168H 5AH / 90D CAN6 CAN_6IC xx'016CH 5BH / 91D CAN7 CAN_7IC xx'0170H 5CH / 92D RTC RTC_IC xx'0174H 5DH / 93D Unassigned node - xx'0100H 40H / 64D Unassigned node - xx'0104H 41H / 65D Unassigned node - xx'012CH 4BH / 75D Unassigned node - xx'00FCH 3FH / 63D Unassigned node - xx'0160H 58H / 88D 1) Register VECSEG defines the segment where the vector table is located to. Bitfield VECSC in register CPUCON1 defines the distance between two adjacent vectors. This table represents the default setting, with a distance of 4 (two words) between two vectors. Data Sheet 26 V1.1, 2006-08 XC164-32 Derivatives Functional Description The XC164CS also provides an excellent mechanism to identify and to process exceptions or error conditions that arise during run-time, so-called `Hardware Traps'. Hardware traps cause immediate non-maskable system reaction which is similar to a standard interrupt service (branching to a dedicated vector table location). The occurrence of a hardware trap is additionally signified by an individual bit in the trap flag register (TFR). Except when another higher prioritized trap service is in progress, a hardware trap will interrupt any actual program execution. In turn, hardware trap services can normally not be interrupted by standard or PEC interrupts. Table 5 shows all of the possible exceptions or error conditions that can arise during runtime: Table 5 Hardware Trap Summary Trap Vector Vector Trap Trap 1) Location Number Priority RESET RESET RESET xx'0000H xx'0000H xx'0000H 00H 00H 00H III III III NMI STKOF STKUF SOFTBRK NMITRAP STOTRAP STUTRAP SBRKTRAP xx'0008H xx'0010H xx'0018H xx'0020H 02H 04H 06H 08H II II II II UNDOPC PACER PRTFLT BTRAP BTRAP BTRAP xx'0028H xx'0028H xx'0028H 0AH 0AH 0AH I I I ILLOPA BTRAP xx'0028H 0AH I Reserved - - [2CH - 3CH] [0BH 0FH] - Software Traps * TRAP Instruction - - Any Any [xx'0000H - [00H xx'01FCH] 7FH] in steps of 4H Current CPU Priority Exception Condition Trap Flag Reset Functions: * Hardware Reset * Software Reset * Watchdog Timer Overflow - Class A Hardware Traps: * Non-Maskable Interrupt * Stack Overflow * Stack Underflow * Software Break Class B Hardware Traps: * Undefined Opcode * PMI Access Error * Protected Instruction Fault * Illegal Word Operand Access 1) Register VECSEG defines the segment where the vector table is located to. Data Sheet 27 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.5 On-Chip Debug Support (OCDS) The On-Chip Debug Support system provides a broad range of debug and emulation features built into the XC164CS. The user software running on the XC164CS can thus be debugged within the target system environment. The OCDS is controlled by an external debugging device via the debug interface, consisting of the IEEE-1149-conforming JTAG port and a break interface. The debugger controls the OCDS via a set of dedicated registers accessible via the JTAG interface. Additionally, the OCDS system can be controlled by the CPU, e.g. by a monitor program. An injection interface allows the execution of OCDS-generated instructions by the CPU. Multiple breakpoints can be triggered by on-chip hardware, by software, or by an external trigger input. Single stepping is supported as well as the injection of arbitrary instructions and read/write access to the complete internal address space. A breakpoint trigger can be answered with a CPU-halt, a monitor call, a data transfer, or/and the activation of an external signal. Tracing data can be obtained via the JTAG interface or via the external bus interface for increased performance. The debug interface uses a set of 6 interface signals (4 JTAG lines, 2 break lines) to communicate with external circuitry. These interface signals are realized as alternate functions on Port 3 pins. Complete system emulation is supported by the New Emulation Technology (NET) interface. Data Sheet 28 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.6 Capture/Compare Units (CAPCOM1/2) The CAPCOM units support generation and control of timing sequences on up to 32 channels with a maximum resolution of 1 system clock cycle (8 cycles in staggered mode). The CAPCOM units are typically used to handle high speed I/O tasks such as pulse and waveform generation, pulse width modulation (PMW), Digital to Analog (D/A) conversion, software timing, or time recording relative to external events. Four 16-bit timers (T0/T1, T7/T8) with reload registers provide two independent time bases for each capture/compare register array. The input clock for the timers is programmable to several prescaled values of the internal system clock, or may be derived from an overflow/underflow of timer T6 in module GPT2. This provides a wide range of variation for the timer period and resolution and allows precise adjustments to the application specific requirements. In addition, external count inputs for CAPCOM timers T0 and T7 allow event scheduling for the capture/compare registers relative to external events. Both of the two capture/compare register arrays contain 16 dual purpose capture/compare registers, each of which may be individually allocated to either CAPCOM timer T0 or T1 (T7 or T8, respectively), and programmed for capture or compare function. 12 registers of the CAPCOM2 module have each one port pin associated with it which serves as an input pin for triggering the capture function, or as an output pin to indicate the occurrence of a compare event. Table 6 Compare Modes (CAPCOM1/2) Compare Modes Function Mode 0 Interrupt-only compare mode; several compare interrupts per timer period are possible Mode 1 Pin toggles on each compare match; several compare events per timer period are possible Mode 2 Interrupt-only compare mode; only one compare interrupt per timer period is generated Mode 3 Pin set `1' on match; pin reset `0' on compare timer overflow; only one compare event per timer period is generated Double Register Mode Two registers operate on one pin; pin toggles on each compare match; several compare events per timer period are possible Single Event Mode Generates single edges or pulses; can be used with any compare mode Data Sheet 29 V1.1, 2006-08 XC164-32 Derivatives Functional Description When a capture/compare register has been selected for capture mode, the current contents of the allocated timer will be latched (`captured') into the capture/compare register in response to an external event at the port pin which is associated with this register. In addition, a specific interrupt request for this capture/compare register is generated. Either a positive, a negative, or both a positive and a negative external signal transition at the pin can be selected as the triggering event. The contents of all registers which have been selected for one of the five compare modes are continuously compared with the contents of the allocated timers. When a match occurs between the timer value and the value in a capture/compare register, specific actions will be taken based on the selected compare mode. Data Sheet 30 V1.1, 2006-08 XC164-32 Derivatives Functional Description Reload Reg. T0REL/T7REL f CC T0IN/T7IN T6OUF T0/T7 Input Control Timer T0/T7 CCxIO CCxIO CCxIRQ CCxIRQ Mode Control (Capture or Compare) Sixteen 16-bit Capture/ Compare Registers CCxIO f CC T6OUF T0IRQ, T7IRQ CCxIRQ T1/T8 Input Control Timer T1/T8 T1IRQ, T8IRQ Reload Reg. T1REL/T8REL CAPCOM1 provides channels x = 0 ... 15, CAPCOM2 provides channels x = 16 ... 31. (see signals CCxIO and CCxIRQ) Figure 5 Data Sheet MCB05569 CAPCOM1/2 Unit Block Diagram 31 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.7 The Capture/Compare Unit CAPCOM6 The CAPCOM6 unit supports generation and control of timing sequences on up to three 16-bit capture/compare channels plus one independent 10-bit compare channel. In compare mode the CAPCOM6 unit provides two output signals per channel which have inverted polarity and non-overlapping pulse transitions (deadtime control). The compare channel can generate a single PWM output signal and is further used to modulate the capture/compare output signals. In capture mode the contents of compare timer T12 is stored in the capture registers upon a signal transition at pins CCx. Compare timers T12 (16-bit) and T13 (10-bit) are free running timers which are clocked by the prescaled system clock. Mode Select Register CC6MSEL fCPU Offset Register T12OF Compare Timer T12 16-bit Trap Register CC Channel 1 CC61 CC Channel 2 CC62 CTRAP CC60 COUT60 CC Channel 0 CC60 Control Prescaler Period Register T12P Port Control Logic CC61 COUT61 CC62 COUT62 Prescaler Control Register CTCON fCPU Compare Timer T13 10-bit Compare Register CMP13 COUT63 Block Commutation Control CC6MCON.H Period Register T13P The timer registers (T12, T13) are not directly accessible. The period and offset registers are loading a value into the timer registers. Figure 6 CC6POS0 CC6POS1 CC6POS2 MCB04109 CAPCOM6 Block Diagram For motor control applications both subunits may generate versatile multichannel PWM signals which are basically either controlled by compare timer T12 or by a typical hall sensor pattern at the interrupt inputs (block commutation). Data Sheet 32 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.8 General Purpose Timer (GPT12E) Unit The GPT12E unit represents a very flexible multifunctional timer/counter structure which may be used for many different time related tasks such as event timing and counting, pulse width and duty cycle measurements, pulse generation, or pulse multiplication. The GPT12E unit incorporates five 16-bit timers which are organized in two separate modules, GPT1 and GPT2. Each timer in each module may operate independently in a number of different modes, or may be concatenated with another timer of the same module. Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for one of four basic modes of operation, which are Timer, Gated Timer, Counter, and Incremental Interface Mode. In Timer Mode, the input clock for a timer is derived from the system clock, divided by a programmable prescaler, while Counter Mode allows a timer to be clocked in reference to external events. Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the operation of a timer is controlled by the `gate' level on an external input pin. For these purposes, each timer has one associated port pin (TxIN) which serves as gate or clock input. The maximum resolution of the timers in module GPT1 is 4 system clock cycles. The count direction (up/down) for each timer is programmable by software or may additionally be altered dynamically by an external signal on a port pin (TxEUD) to facilitate e.g. position tracking. In Incremental Interface Mode the GPT1 timers (T2, T3, T4) can be directly connected to the incremental position sensor signals A and B via their respective inputs TxIN and TxEUD. Direction and count signals are internally derived from these two input signals, so the contents of the respective timer Tx corresponds to the sensor position. The third position sensor signal TOP0 can be connected to an interrupt input. Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer overflow/underflow. The state of this latch may be output on pin T3OUT e.g. for time out monitoring of external hardware components. It may also be used internally to clock timers T2 and T4 for measuring long time periods with high resolution. In addition to their basic operating modes, timers T2 and T4 may be configured as reload or capture registers for timer T3. When used as capture or reload registers, timers T2 and T4 are stopped. The contents of timer T3 is captured into T2 or T4 in response to a signal at their associated input pins (TxIN). Timer T3 is reloaded with the contents of T2 or T4 triggered either by an external signal or by a selectable state transition of its toggle latch T3OTL. When both T2 and T4 are configured to alternately reload T3 on opposite state transitions of T3OTL with the low and high times of a PWM signal, this signal can be constantly generated without software intervention. Data Sheet 33 V1.1, 2006-08 XC164-32 Derivatives Functional Description T3CON.BPS1 f GPT 2n:1 Basic Clock Interrupt Request (T2IRQ) Aux. Timer T2 T2IN T2EUD T2 Mode Control U/D Reload Capture Interrupt Request (T3IRQ) T3IN T3 Mode Control T3EUD Core Timer T3 T3OTL T3OUT Toggle Latch U/D Capture T4IN T4EUD T4 Mode Control Reload Aux. Timer T4 U/D Interrupt Request (T4IRQ) MCA05563 Figure 7 Block Diagram of GPT1 With its maximum resolution of 2 system clock cycles, the GPT2 module provides precise event control and time measurement. It includes two timers (T5, T6) and a capture/reload register (CAPREL). Both timers can be clocked with an input clock which is derived from the CPU clock via a programmable prescaler or with external signals. The Data Sheet 34 V1.1, 2006-08 XC164-32 Derivatives Functional Description count direction (up/down) for each timer is programmable by software or may additionally be altered dynamically by an external signal on a port pin (TxEUD). Concatenation of the timers is supported via the output toggle latch (T6OTL) of timer T6, which changes its state on each timer overflow/underflow. The state of this latch may be used to clock timer T5, and/or it may be output on pin T6OUT. The overflows/underflows of timer T6 can additionally be used to clock the CAPCOM1/2 timers, and to cause a reload from the CAPREL register. The CAPREL register may capture the contents of timer T5 based on an external signal transition on the corresponding port pin (CAPIN), and timer T5 may optionally be cleared after the capture procedure. This allows the XC164CS to measure absolute time differences or to perform pulse multiplication without software overhead. The capture trigger (timer T5 to CAPREL) may also be generated upon transitions of GPT1 timer T3's inputs T3IN and/or T3EUD. This is especially advantageous when T3 operates in Incremental Interface Mode. Data Sheet 35 V1.1, 2006-08 XC164-32 Derivatives Functional Description T6CON.BPS2 f GPT 2 n:1 Basic Clock Interrupt Request (T5IR) GPT2 Timer T5 T5IN T5 Mode Control U/D Clear Capture CAPIN T3IN/ T3EUD CAPREL Mode Control GPT2 CAPREL Interrupt Request (CRIR) Reload Clear Interrupt Request (T6IR) Toggle FF T6IN T6 Mode Control GPT2 Timer T6 T6OTL T6OUT T6OUF U/D MCA05564 Figure 8 Data Sheet Block Diagram of GPT2 36 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.9 Real Time Clock The Real Time Clock (RTC) module of the XC164CS is directly clocked via a separate clock driver with the prescaled on-chip main oscillator frequency (fRTC = fOSCm/32). It is therefore independent from the selected clock generation mode of the XC164CS. The RTC basically consists of a chain of divider blocks: * * * a selectable 8:1 divider (on - off) the reloadable 16-bit timer T14 the 32-bit RTC timer block (accessible via registers RTCH and RTCL), made of: - a reloadable 10-bit timer - a reloadable 6-bit timer - a reloadable 6-bit timer - a reloadable 10-bit timer All timers count up. Each timer can generate an interrupt request. All requests are combined to a common node request. fRTC MUX :8 Interrupt Sub Node RUN PRE CNT INT0 CNT INT1 CNT INT2 RTCINT CNT INT3 REL-Register fCNT T14REL 10 Bits 6 Bits 6 Bits 10 Bits T14 10 Bits 6 Bits 6 Bits 10 Bits T14-Register CNT-Register MCB05568 Figure 9 RTC Block Diagram Note: The registers associated with the RTC are not affected by a reset in order to maintain the correct system time even when intermediate resets are executed. Data Sheet 37 V1.1, 2006-08 XC164-32 Derivatives Functional Description The RTC module can be used for different purposes: * * * * System clock to determine the current time and date, optionally during idle mode, sleep mode, and power down mode Cyclic time based interrupt, to provide a system time tick independent of CPU frequency and other resources, e.g. to wake up regularly from idle mode 48-bit timer for long term measurements (maximum timespan is > 100 years) Alarm interrupt for wake-up on a defined time Data Sheet 38 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.10 A/D Converter For analog signal measurement, a 10-bit A/D converter with 14 multiplexed input channels and a sample and hold circuit has been integrated on-chip. It uses the method of successive approximation. The sample time (for loading the capacitors) and the conversion time is programmable (in two modes) and can thus be adjusted to the external circuitry. The A/D converter can also operate in 8-bit conversion mode, where the conversion time is further reduced. Overrun error detection/protection is provided for the conversion result register (ADDAT): either an interrupt request will be generated when the result of a previous conversion has not been read from the result register at the time the next conversion is complete, or the next conversion is suspended in such a case until the previous result has been read. For applications which require less analog input channels, the remaining channel inputs can be used as digital input port pins. The A/D converter of the XC164CS supports four different conversion modes. In the standard Single Channel conversion mode, the analog level on a specified channel is sampled once and converted to a digital result. In the Single Channel Continuous mode, the analog level on a specified channel is repeatedly sampled and converted without software intervention. In the Auto Scan mode, the analog levels on a prespecified number of channels are sequentially sampled and converted. In the Auto Scan Continuous mode, the prespecified channels are repeatedly sampled and converted. In addition, the conversion of a specific channel can be inserted (injected) into a running sequence without disturbing this sequence. This is called Channel Injection Mode. The Peripheral Event Controller (PEC) may be used to automatically store the conversion results into a table in memory for later evaluation, without requiring the overhead of entering and exiting interrupt routines for each data transfer. After each reset and also during normal operation the ADC automatically performs calibration cycles. This automatic self-calibration constantly adjusts the converter to changing operating conditions (e.g. temperature) and compensates process variations. These calibration cycles are part of the conversion cycle, so they do not affect the normal operation of the A/D converter. In order to decouple analog inputs from digital noise and to avoid input trigger noise those pins used for analog input can be disconnected from the digital IO or input stages under software control. This can be selected for each pin separately via register P5DIDIS (Port 5 Digital Input Disable). The Auto-Power-Down feature of the A/D converter minimizes the power consumption when no conversion is in progress. Data Sheet 39 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.11 Asynchronous/Synchronous Serial Interfaces (ASC0/ASC1) The Asynchronous/Synchronous Serial Interfaces ASC0/ASC1 (USARTs) provide serial communication with other microcontrollers, processors, terminals or external peripheral components. They are upward compatible with the serial ports of the Infineon 8-bit microcontroller families and support full-duplex asynchronous communication and halfduplex synchronous communication. A dedicated baud rate generator with a fractional divider precisely generates all standard baud rates without oscillator tuning. For transmission, reception, error handling, and baudrate detection 5 separate interrupt vectors are provided. In asynchronous mode, 8- or 9-bit data frames (with optional parity bit) are transmitted or received, preceded by a start bit and terminated by one or two stop bits. For multiprocessor communication, a mechanism to distinguish address from data bytes has been included (8-bit data plus wake-up bit mode). IrDA data transmissions up to 115.2 kbit/s with fixed or programmable IrDA pulse width are supported. In synchronous mode, bytes (8 bits) are transmitted or received synchronously to a shift clock which is generated by the ASC0/1. The LSB is always shifted first. In both modes, transmission and reception of data is FIFO-buffered. An autobaud detection unit allows to detect asynchronous data frames with its baudrate and mode with automatic initialization of the baudrate generator and the mode control bits. A number of optional hardware error detection capabilities has been included to increase the reliability of data transfers. A parity bit can automatically be generated on transmission or be checked on reception. Framing error detection allows to recognize data frames with missing stop bits. An overrun error will be generated, if the last character received has not been read out of the receive buffer register at the time the reception of a new character is complete. Summary of Features * * * * * Full-duplex asynchronous operating modes - 8- or 9-bit data frames, LSB first, one or two stop bits, parity generation/checking - Baudrate from 2.5 Mbit/s to 0.6 bit/s (@ 40 MHz) - Multiprocessor mode for automatic address/data byte detection - Support for IrDA data transmission/reception up to max. 115.2 kbit/s (@ 40 MHz) - Loop-back capability - Auto baudrate detection Half-duplex 8-bit synchronous operating mode at 5 Mbit/s to 406.9 bit/s (@ 40 MHz) Buffered transmitter/receiver with FIFO support (8 entries per direction) Loop-back option available for testing purposes Interrupt generation on transmitter buffer empty condition, last bit transmitted condition, receive buffer full condition, error condition (frame, parity, overrun error), start and end of an autobaud detection Data Sheet 40 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.12 High Speed Synchronous Serial Channels (SSC0/SSC1) The High Speed Synchronous Serial Channels SSC0/SSC1 support full-duplex and halfduplex synchronous communication. It may be configured so it interfaces with serially linked peripheral components, full SPI functionality is supported. A dedicated baud rate generator allows to set up all standard baud rates without oscillator tuning. For transmission, reception and error handling three separate interrupt vectors are provided. The SSC transmits or receives characters of 2 ... 16 bits length synchronously to a shift clock which can be generated by the SSC (master mode) or by an external master (slave mode). The SSC can start shifting with the LSB or with the MSB and allows the selection of shifting and latching clock edges as well as the clock polarity. A number of optional hardware error detection capabilities has been included to increase the reliability of data transfers. Transmit error and receive error supervise the correct handling of the data buffer. Phase error and baudrate error detect incorrect serial data. Summary of Features * * * * * * * Master or Slave mode operation Full-duplex or Half-duplex transfers Baudrate generation from 20 Mbit/s to 305.18 bit/s (@ 40 MHz) Flexible data format - Programmable number of data bits: 2 to 16 bits - Programmable shift direction: LSB-first or MSB-first - Programmable clock polarity: idle low or idle high - Programmable clock/data phase: data shift with leading or trailing clock edge Loop back option available for testing purposes Interrupt generation on transmitter buffer empty condition, receive buffer full condition, error condition (receive, phase, baudrate, transmit error) Three pin interface with flexible SSC pin configuration Data Sheet 41 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.13 TwinCAN Module The integrated TwinCAN module handles the completely autonomous transmission and reception of CAN frames in accordance with the CAN specification V2.0 part B (active), i.e. the on-chip TwinCAN module can receive and transmit standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers. Two Full-CAN nodes share the TwinCAN module's resources to optimize the CAN bus traffic handling and to minimize the CPU load. The module provides up to 32 message objects, which can be assigned to one of the CAN nodes and can be combined to FIFOstructures. Each object provides separate masks for acceptance filtering. The flexible combination of Full-CAN functionality and FIFO architecture reduces the efforts to fulfill the real-time requirements of complex embedded control applications. Improved CAN bus monitoring functionality as well as the number of message objects permit precise and comfortable CAN bus traffic handling. Gateway functionality allows automatic data exchange between two separate CAN bus systems, which reduces CPU load and improves the real time behavior of the entire system. The bit timing for both CAN nodes is derived from the master clock and is programmable up to a data rate of 1 Mbit/s. Each CAN node uses two pins of Port 4, Port 7, or Port 9 to interface to an external bus transceiver. The interface pins are assigned via software. TwinCAN Module Kernel Clock Control Address Decoder Interrupt Control fCAN CAN Node A CAN Node B Message Object Buffer TxDCA RxDCA Port Control TxDCB RxDCB TwinCAN Control MCB05567 Figure 10 Data Sheet TwinCAN Module Block Diagram 42 V1.1, 2006-08 XC164-32 Derivatives Functional Description Summary of Features * * * * * * * CAN functionality according to CAN specification V2.0 B active Data transfer rate up to 1 Mbit/s Flexible and powerful message transfer control and error handling capabilities Full-CAN functionality and Basic CAN functionality for each message object 32 flexible message objects - Assignment to one of the two CAN nodes - Configuration as transmit object or receive object - Concatenation to a 2-, 4-, 8-, 16-, or 32-message buffer with FIFO algorithm - Handling of frames with 11-bit or 29-bit identifiers - Individual programmable acceptance mask register for filtering for each object - Monitoring via a frame counter - Configuration for Remote Monitoring Mode Up to eight individually programmable interrupt nodes can be used CAN Analyzer Mode for bus monitoring is implemented Note: When a CAN node has the interface lines assigned to Port 4, the segment address output on Port 4 must be limited. CS lines can be used to increase the total amount of addressable external memory. Data Sheet 43 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.14 Watchdog Timer The Watchdog Timer represents one of the fail-safe mechanisms which have been implemented to prevent the controller from malfunctioning for longer periods of time. The Watchdog Timer is always enabled after a reset of the chip, and can be disabled until the EINIT instruction has been executed (compatible mode), or it can be disabled and enabled at any time by executing instructions DISWDT and ENWDT (enhanced mode). Thus, the chip's start-up procedure is always monitored. The software has to be designed to restart the Watchdog Timer before it overflows. If, due to hardware or software related failures, the software fails to do so, the Watchdog Timer overflows and generates an internal hardware reset and pulls the RSTOUT pin low in order to allow external hardware components to be reset. The Watchdog Timer is a 16-bit timer, clocked with the system clock divided by 2/4/128/256. The high byte of the Watchdog Timer register can be set to a prespecified reload value (stored in WDTREL) in order to allow further variation of the monitored time interval. Each time it is serviced by the application software, the high byte of the Watchdog Timer is reloaded and the low byte is cleared. Thus, time intervals between 13 s and 419 ms can be monitored (@ 40 MHz). The default Watchdog Timer interval after reset is 3.28 ms (@ 40 MHz). Data Sheet 44 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.15 Clock Generation The Clock Generation Unit uses a programmable on-chip PLL with multiple prescalers to generate the clock signals for the XC164CS with high flexibility. The master clock fMC is the reference clock signal, and is used for TwinCAN and is output to the external system. The CPU clock fCPU and the system clock fSYS are derived from the master clock either directly (1:1) or via a 2:1 prescaler (fSYS = fCPU = fMC / 2). See also Section 4.4.1. The on-chip oscillator can drive an external crystal or accepts an external clock signal. The oscillator clock frequency can be multiplied by the on-chip PLL (by a programmable factor) or can be divided by a programmable prescaler factor. If the bypass mode is used (direct drive or prescaler) the PLL can deliver an independent clock to monitor the clock signal generated by the on-chip oscillator. This PLL clock is independent from the XTAL1 clock. When the expected oscillator clock transitions are missing the Oscillator Watchdog (OWD) activates the PLL Unlock/OWD interrupt node and supplies the CPU with an emergency clock, the PLL clock signal. Under these circumstances the PLL will oscillate with its basic frequency. The oscillator watchdog can be disabled by switching the PLL off. This reduces power consumption, but also no interrupt request will be generated in case of a missing oscillator clock. Note: At the end of an external reset (EA = `0') the oscillator watchdog may be disabled via hardware by (externally) pulling the RD line low upon a reset, similar to the standard reset configuration. 3.16 Parallel Ports The XC164CS provides up to 79 I/O lines which are organized into six input/output ports and one input port. All port lines are bit-addressable, and all input/output lines are individually (bit-wise) programmable as inputs or outputs via direction registers. The I/O ports are true bidirectional ports which are switched to high impedance state when configured as inputs. The output drivers of some I/O ports can be configured (pin by pin) for push/pull operation or open-drain operation via control registers. During the internal reset, all port pins are configured as inputs (except for pin RSTOUT). The edge characteristics (shape) and driver characteristics (output current) of the port drivers can be selected via registers POCONx. The input threshold of some ports is selectable (TTL or CMOS like), where the special CMOS like input threshold reduces noise sensitivity due to the input hysteresis. The input threshold may be selected individually for each byte of the respective ports. All port lines have programmable alternate input or output functions associated with them. All port lines that are not used for these alternate functions may be used as general purpose IO lines. Data Sheet 45 V1.1, 2006-08 XC164-32 Derivatives Functional Description Table 7 Summary of the XC164CS's Parallel Ports Port Control Alternate Functions PORT0 Pad drivers Address/Data lines or data lines1) PORT1 Pad drivers Address lines2) Capture inputs or compare outputs, Serial interface lines Port 3 Pad drivers, Open drain, Input threshold Timer control signals, serial interface lines, Optional bus control signal BHE/WRH, System clock output CLKOUT (or FOUT) Port 4 Pad drivers, Open drain, Input threshold Segment address lines3), CS signal lines CAN interface lines4) Port 5 - Analog input channels to the A/D converter, Timer control signals Port 9 Pad drivers, Open drain, Input threshold Capture inputs or compare outputs Pad drivers, Open drain Bus control signals RD, WR/WRL, ALE, External access enable pin EA, Reset indication output RSTOUT Port 20 CAN interface lines4) 1) For multiplexed bus cycles. 2) For demultiplexed bus cycles. 3) For more than 64 Kbytes of external resources. 4) Can be assigned by software. Data Sheet 46 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.17 Power Management The XC164CS provides several means to control the power it consumes either at a given time or averaged over a certain timespan. Three mechanisms can be used (partly in parallel): * * * Power Saving Modes switch the XC164CS into a special operating mode (control via instructions). Idle Mode stops the CPU while the peripherals can continue to operate. Sleep Mode and Power Down Mode stop all clock signals and all operation (RTC may optionally continue running). Sleep Mode can be terminated by external interrupt signals. Clock Generation Management controls the distribution and the frequency of internal and external clock signals. While the clock signals for currently inactive parts of logic are disabled automatically, the user can reduce the XC164CS's CPU clock frequency which drastically reduces the consumed power. External circuitry can be controlled via the programmable frequency output FOUT. Peripheral Management permits temporary disabling of peripheral modules (control via register SYSCON3). Each peripheral can separately be disabled/enabled. The on-chip RTC supports intermittent operation of the XC164CS by generating cyclic wake-up signals. This offers full performance to quickly react on action requests while the intermittent sleep phases greatly reduce the average power consumption of the system. Data Sheet 47 V1.1, 2006-08 XC164-32 Derivatives Functional Description 3.18 Instruction Set Summary Table 8 lists the instructions of the XC164CS in a condensed way. The various addressing modes that can be used with a specific instruction, the operation of the instructions, parameters for conditional execution of instructions, and the opcodes for each instruction can be found in the "Instruction Set Manual". This document also provides a detailed description of each instruction. Table 8 Instruction Set Summary Mnemonic Description Bytes ADD(B) Add word (byte) operands 2/4 ADDC(B) Add word (byte) operands with Carry 2/4 SUB(B) Subtract word (byte) operands 2/4 SUBC(B) Subtract word (byte) operands with Carry 2/4 MUL(U) (Un)Signed multiply direct GPR by direct GPR (16- x 16-bit) 2 DIV(U) (Un)Signed divide register MDL by direct GPR (16-/16-bit) 2 DIVL(U) (Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2 CPL(B) Complement direct word (byte) GPR 2 NEG(B) Negate direct word (byte) GPR 2 AND(B) Bitwise AND, (word/byte operands) 2/4 OR(B) Bitwise OR, (word/byte operands) 2/4 XOR(B) Bitwise exclusive OR, (word/byte operands) 2/4 BCLR/BSET Clear/Set direct bit 2 BMOV(N) Move (negated) direct bit to direct bit 4 BAND/BOR/BXOR AND/OR/XOR direct bit with direct bit 4 BCMP Compare direct bit to direct bit 4 BFLDH/BFLDL Bitwise modify masked high/low byte of bit-addressable direct word memory with immediate data 4 CMP(B) Compare word (byte) operands 2/4 CMPD1/2 Compare word data to GPR and decrement GPR by 1/2 2/4 CMPI1/2 Compare word data to GPR and increment GPR by 1/2 2/4 PRIOR Determine number of shift cycles to normalize direct word GPR and store result in direct word GPR 2 SHL/SHR Shift left/right direct word GPR 2 Data Sheet 48 V1.1, 2006-08 XC164-32 Derivatives Functional Description Table 8 Instruction Set Summary (cont'd) Mnemonic Description Bytes ROL/ROR Rotate left/right direct word GPR 2 ASHR Arithmetic (sign bit) shift right direct word GPR 2 MOV(B) Move word (byte) data 2/4 MOVBS/Z Move byte operand to word op. with sign/zero extension 2/4 JMPA/I/R Jump absolute/indirect/relative if condition is met 4 JMPS Jump absolute to a code segment 4 JB(C) Jump relative if direct bit is set (and clear bit) 4 JNB(S) Jump relative if direct bit is not set (and set bit) 4 CALLA/I/R Call absolute/indirect/relative subroutine if condition is met 4 CALLS Call absolute subroutine in any code segment 4 PCALL Push direct word register onto system stack and call absolute subroutine 4 TRAP Call interrupt service routine via immediate trap number 2 PUSH/POP Push/pop direct word register onto/from system stack 2 SCXT Push direct word register onto system stack and update register with word operand 4 RET(P) Return from intra-segment subroutine (and pop direct word register from system stack) 2 RETS Return from inter-segment subroutine 2 RETI Return from interrupt service subroutine 2 SBRK Software Break 2 SRST Software Reset 4 IDLE Enter Idle Mode 4 PWRDN Enter Power Down Mode (supposes NMI-pin being low) 4 SRVWDT Service Watchdog Timer 4 DISWDT/ENWDT Disable/Enable Watchdog Timer 4 EINIT End-of-Initialization Register Lock 4 ATOMIC Begin ATOMIC sequence 2 EXTR Begin EXTended Register sequence 2 EXTP(R) Begin EXTended Page (and Register) sequence 2/4 EXTS(R) Begin EXTended Segment (and Register) sequence 2/4 Data Sheet 49 V1.1, 2006-08 XC164-32 Derivatives Functional Description Table 8 Instruction Set Summary (cont'd) Mnemonic Description Bytes NOP Null operation 2 CoMUL/CoMAC Multiply (and accumulate) 4 CoADD/CoSUB Add/Subtract 4 Co(A)SHR (Arithmetic) Shift right 4 CoSHL Shift left 4 CoLOAD/STORE Load accumulator/Store MAC register 4 CoCMP Compare 4 CoMAX/MIN Maximum/Minimum 4 CoABS/CoRND Absolute value/Round accumulator 4 CoMOV Data move 4 CoNEG/NOP Negate accumulator/Null operation 4 Data Sheet 50 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters 4 Electrical Parameters 4.1 General Parameters Table 9 Absolute Maximum Ratings Parameter Symbol Limit Values Unit Notes Min. Max. TST TJ VDDI -65 150 C 1) -40 150 C under bias -0.5 3.25 V - Voltage on VDDP pins with respect to ground (VSS) VDDP -0.5 6.2 V - Voltage on any pin with respect to ground (VSS) VIN -0.5 VDDP + V 2) Input current on any pin during overload condition - -10 10 mA - Absolute sum of all input currents during overload condition - - |100| mA - Storage temperature Junction temperature Voltage on VDDI pins with respect to ground (VSS) 0.5 1) Moisture Sensitivity Level (MSL) 3, conforming to Jedec J-STD-020C for 260 C for PG-TQFP-100-5, and 240 C for P-TQFP-100-16. 2) Input pin XTAL1 belongs to the core voltage domain. Therefore, input voltages must be within the range defined for VDDI. Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the voltage on VDDP pins with respect to ground (VSS) must not exceed the values defined by the absolute maximum ratings. Data Sheet 51 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters Operating Conditions The following operating conditions must not be exceeded to ensure correct operation of the XC164CS. All parameters specified in the following sections refer to these operating conditions, unless otherwise noticed. Table 10 Operating Condition Parameters Parameter Symbol Limit Values Min. Max. Unit Notes Digital supply voltage for the core VDDI 2.35 2.7 V Active mode, fCPU = fCPUmax1)2) Digital supply voltage for IO pads VDDP 4.4 5.5 V Active mode2)3) -0.5 - V VDDP - VDDI4) V Reference voltage Supply Voltage Difference VDD Digital ground voltage VSS IOV 0 -5 5 mA Per IO pin5)6) -2 5 mA Per analog input pin5)6) Overload current coupling KOVA factor for analog inputs7) - 1.0 x 10-4 - - 1.5 x 10-3 - Overload current coupling KOVD factor for digital I/O pins7) - 5.0 x 10-3 - - 1.0 x 10-2 - Absolute sum of overload currents |IOV| - 50 mA 6) External Load Capacitance CL - 50 pF Pin drivers in default mode8) Ambient temperature TA 0 70 C SAB-XC164... -40 85 C SAF-XC164... -40 125 C SAK-XC164... Overload current IOV > 0 IOV < 0 IOV > 0 IOV < 0 1) fCPUmax = 40 MHz for devices marked ... 40F, fCPUmax = 20 MHz for devices marked ... 20F. 2) External circuitry must guarantee low-level at the RSTIN pin at least until both power supply voltages have reached the operating range. 3) The specified voltage range is allowed for operation. The range limits may be reached under extreme operating conditions. However, specified parameters, such as leakage currents, refer to the standard operating voltage range of VDDP = 4.75 V to 5.25 V. 4) This limitation must be fulfilled under all operating conditions including power-ramp-up, power-ramp-down, and power-save modes. Data Sheet 52 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters 5) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin exceeds the specified range: VOV > VDDP + 0.5 V (IOV > 0) or VOV < VSS - 0.5 V (IOV < 0). The absolute sum of input overload currents on all pins may not exceed 50 mA. The supply voltages must remain within the specified limits. Proper operation is not guaranteed if overload conditions occur on functional pins such as XTAL1, RD, WR, etc. 6) Not subject to production test - verified by design/characterization. 7) An overload current (IOV) through a pin injects a certain error current (IINJ) into the adjacent pins. This error current adds to the respective pin's leakage current (IOZ). The amount of error current depends on the overload current and is defined by the overload coupling factor KOV. The polarity of the injected error current is inverse compared to the polarity of the overload current that produces it. The total current through a pin is |ITOT| = |IOZ| + (|IOV| x KOV). The additional error current may distort the input voltage on analog inputs. 8) The timing is valid for pin drivers operating in default current mode (selected after reset). Reducing the output current may lead to increased delays or reduced driving capability (CL). Parameter Interpretation The parameters listed in the following partly represent the characteristics of the XC164CS and partly its demands on the system. To aid in interpreting the parameters right, when evaluating them for a design, they are marked in column "Symbol": CC (Controller Characteristics): The logic of the XC164CS will provide signals with the respective characteristics. SR (System Requirement): The external system must provide signals with the respective characteristics to the XC164CS. Data Sheet 53 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters 4.2 Table 11 DC Parameters DC Characteristics (Operating Conditions apply)1) Parameter Symbol Limit Values Min. Max. Unit Test Condition Input low voltage TTL (all except XTAL1) VIL SR -0.5 0.2 x VDDP V - 0.1 - Input low voltage XTAL12) VILC SR -0.5 0.3 x VDDI V - Input low voltage (Special Threshold) VILS SR -0.5 0.45 x V 3) Input high voltage TTL VIH (all except XTAL1) SR 0.2 x VDDP + 0.9 VDDP VDDP + 0.5 V - Input high voltage XTAL12) VIHC SR 0.7 x VDDI VDDI + 0.5 V - Input high voltage (Special Threshold) VIHS SR 0.8 x VDDP VDDP + 0.5 V - 0.2 3) Input Hysteresis (Special Threshold) HYS 0.04 x VDDP in [V], Output low voltage VOL - V VDDP CC - - 6) Output high voltage VOH Series resistance = 0 3) 1.0 V 0.45 V CC VDDP - 1.0 - VDDP - V - V 300 nA 0 V < VIN < VDDP, TA 125 C 200 nA 0 V < VIN < VDDP, TA 85 C14) 500 nA - -10 A -100 - A - 10 A 120 - A 0.45 V < VIN < VDDP VIN = VIHmin VIN = VILmax VIN = VILmax VIN = VIHmin 0.45 Input leakage current (Port 5)7) IOZ1 Input leakage current (all other8))7) IOZ2 Configuration pull-up current9) ICPUH10) ICPUL11) ICPDL10) ICPDH11) Configuration pulldown current12) Data Sheet IOL IOLmax4) IOL IOLnom4)5) IOH IOHmax4) IOH IOHnom4)5) CC - CC - 54 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters Table 11 DC Characteristics (Operating Conditions apply)1) (cont'd) Parameter Symbol Limit Values Min. Max. Unit Test Condition Level inactive hold current13) ILHI10) - -10 A Level active hold current13) ILHA11) -100 - A VOUT = 0.5 x VDDP VOUT = 0.45 V XTAL1 input current IIL CIO CC - 20 A 0 V < VIN < VDDI CC - 10 pF - Pin capacitance14) (digital inputs/outputs) 1) Keeping signal levels within the limits specified in this table, ensures operation without overload conditions. For signal levels outside these specifications, also refer to the specification of the overload current IOV. 2) If XTAL1 is driven by a crystal, reaching an amplitude (peak to peak) of 0.4 x VDDI is sufficient. 3) This parameter is tested for P3, P4, P9. 4) The maximum deliverable output current of a port driver depends on the selected output driver mode, see Table 12, Current Limits for Port Output Drivers. The limit for pin groups must be respected. 5) As a rule, with decreasing output current the output levels approach the respective supply level (VOL VSS, VOH VDDP). However, only the levels for nominal output currents are guaranteed. 6) This specification is not valid for outputs which are switched to open drain mode. In this case the respective output will float and the voltage results from the external circuitry. 7) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. Please refer to the definition of the overload coupling factor KOV. 8) The driver of P3.15 is designed for faster switching, because this pin can deliver the reference clock for the bus interface (CLKOUT). The maximum leakage current for P3.15 is, therefore, increased to 1 A. 9) This specification is valid during Reset for configuration on RD, WR, EA, PORT0 10) The maximum current may be drawn while the respective signal line remains inactive. 11) The minimum current must be drawn to drive the respective signal line active. 12) This specification is valid during Reset for configuration on ALE. 13) This specification is valid during Reset for pins P4.3-0, which can act as CS outputs, and for P3.12. 14) Not subject to production test - verified by design/characterization. Data Sheet 55 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters Table 12 Current Limits for Port Output Drivers Port Output Driver Mode Maximum Output Current (IOLmax, -IOHmax)1) Nominal Output Current (IOLnom, -IOHnom) Strong driver 10 mA 2.5 mA Medium driver 4.0 mA 1.0 mA Weak driver 0.5 mA 0.1 mA 1) An output current above |IOXnom| may be drawn from up to three pins at the same time. For any group of 16 neighboring port output pins the total output current in each direction (IOL and -IOH) must remain below 50 mA. Table 13 Power Consumption XC164CS (Operating Conditions apply) Parameter SymLimit Values bol Min. Max. Unit Test Condition Power supply current (active) with all peripherals active IDDI - 10 + 3.0 x fCPU mA fCPU in [MHz]1)2) Pad supply current IDDP IIDX - 5 mA 3) - 10 + 1.3 x fCPU mA fCPU in [MHz]2) 128,000 x e- mA VDDI = VDDImax6) TJ in [C] 0.6 + 0.02 x fOSC + IPDL mA Idle mode supply current with all peripherals active Sleep and Power down mode supply current caused by leakage4) IPDL5) - Sleep and Power down mode IPDM7) - supply current caused by leakage and the RTC running, clocked by the main oscillator4) = 4670 / (273 + TJ) VDDI = VDDImax fOSC in [MHz] 1) During Flash programming or erase operations the supply current is increased by max. 5 mA. 2) The supply current is a function of the operating frequency. This dependency is illustrated in Figure 11. These parameters are tested at VDDImax and maximum CPU clock frequency with all outputs disconnected and all inputs at VIL or VIH. 3) The pad supply voltage pins (VDDP) mainly provides the current consumed by the pin output drivers. A small amount of current is consumed even though no outputs are driven, because the drivers' input stages are switched and also the Flash module draws some power from the VDDP supply. 4) The total supply current in Sleep and Power down mode is the sum of the temperature dependent leakage current and the frequency dependent current for RTC and main oscillator (if active). 5) This parameter is determined mainly by the transistor leakage currents. This current heavily depends on the junction temperature (see Figure 13). The junction temperature TJ is the same as the ambient temperature TA if no current flows through the port output drivers. Otherwise, the resulting temperature difference must be taken into account. Data Sheet 56 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters 6) All inputs (including pins configured as inputs) at 0 V to 0.1 V or at VDDP - 0.1 V to VDDP, all outputs (including pins configured as outputs) disconnected. This parameter is tested at 25 C and is valid for TJ 25 C. 7) This parameter is determined mainly by the current consumed by the oscillator switched to low gain mode (see Figure 12). This current, however, is influenced by the external oscillator circuitry (crystal, capacitors). The given values refer to a typical circuitry and may change in case of a not optimized external oscillator circuitry. Data Sheet 57 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters I [mA] IDDImax 140 IDDItyp 120 100 80 IIDXmax IIDXtyp 60 40 20 10 Figure 11 Data Sheet 20 30 40 fCPU [MHz] Supply/Idle Current as a Function of Operating Frequency 58 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters I [mA] 3.0 2.0 IPDMmax IPDMtyp 1.0 0.1 4 Figure 12 8 12 16 fOSC [MHz] Sleep and Power Down Supply Current due to RTC and Oscillator Running, as a Function of Oscillator Frequency IPDL [mA] 1.5 1.0 0.5 -50 Figure 13 Data Sheet 0 50 100 150 TJ [C] Sleep and Power Down Leakage Supply Current as a Function of Temperature 59 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters 4.3 Table 14 Analog/Digital Converter Parameters A/D Converter Characteristics (Operating Conditions apply) Parameter Symbol Limit Values Min. Analog reference supply VAREF SR 4.5 Max. Unit Test Condition VDDP V 1) VSS + 0.1 VAREF V - V 2) 20 MHz 3) + 0.1 VAGND Analog input voltage range VAIN Basic clock frequency fBC Conversion time for 10-bit tC10P result4) tC10 Conversion time for 8-bit tC8P result4) tC8 Calibration time after reset tCAL SR VSS - 0.1 CC 484 11,696 tBC 5) Total unadjusted error TUE CC - 2 LSB 1) Total capacitance of an analog input CAINT CC - 15 pF 6) Switched capacitance of an analog input CAINS CC - 10 pF 6) Resistance of the analog input path RAIN CC - 2 k 6) Total capacitance of the reference input CAREFT CC - 20 pF 6) Switched capacitance of the reference input CAREFS CC - 15 pF 6) Resistance of the reference input path RAREF 1 k 6) Analog reference ground SR VAGND 0.5 CC 52 x tBC + tS + 6 x tSYS - Post-calibr. on CC 40 x tBC + tS + 6 x tSYS - Post-calibr. off CC 44 x tBC + tS + 6 x tSYS - Post-calibr. on CC 32 x tBC + tS + 6 x tSYS - Post-calibr. off CC - 1) TUE is tested at VAREF = VDDP + 0.1 V, VAGND = 0 V. It is verified by design for all other voltages within the defined voltage range. If the analog reference supply voltage drops below 4.5 V (i.e. VAREF 4.0 V) or exceeds the power supply voltage by up to 0.2 V (i.e. VAREF = VDDP + 0.2 V) the maximum TUE is increased to 3 LSB. This range is not subject to production test. The specified TUE is guaranteed only, if the absolute sum of input overload currents on Port 5 pins (see IOV specification) does not exceed 10 mA, and if VAREF and VAGND remain stable during the respective period of time. During the reset calibration sequence the maximum TUE may be 4 LSB. 2) VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in these cases will be X000H or X3FFH, respectively. Data Sheet 60 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters 3) The limit values for fBC must not be exceeded when selecting the peripheral frequency and the ADCTC setting. 4) This parameter includes the sample time tS, the time for determining the digital result and the time to load the result register with the conversion result (tSYS = 1/fSYS). Values for the basic clock tBC depend on programming and can be taken from Table 15. When the post-calibration is switched off, the conversion time is reduced by 12 x tBC. 5) The actual duration of the reset calibration depends on the noise on the reference signal. Conversions executed during the reset calibration increase the calibration time. The TUE for those conversions may be increased. 6) Not subject to production test - verified by design/characterization. The given parameter values cover the complete operating range. Under relaxed operating conditions (temperature, supply voltage) reduced values can be used for calculations. At room temperature and nominal supply voltage the following typical values can be used: CAINTtyp = 12 pF, CAINStyp = 7 pF, RAINtyp = 1.5 k, CAREFTtyp = 15 pF, CAREFStyp = 13 pF, RAREFtyp = 0.7 k. RSource V AIN R AIN, On C AINT - C AINS C Ext A/D Converter CAINS MCS05570 Figure 14 Data Sheet Equivalent Circuitry for Analog Inputs 61 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters Sample time and conversion time of the XC164CS's A/D Converter are programmable. In compatibility mode, the above timing can be calculated using Table 15. The limit values for fBC must not be exceeded when selecting ADCTC. Table 15 A/D Converter Computation Table1) ADCON.15|14 (ADCTC) A/D Converter Basic Clock fBC ADCON.13|12 (ADSTC) 00 fSYS / 4 fSYS / 2 fSYS / 16 fSYS / 8 00 01 10 11 01 10 11 Sample Time tS tBC x 8 tBC x 16 tBC x 32 tBC x 64 1) These selections are available in compatibility mode. An improved mechanism to control the ADC input clock can be selected. Converter Timing Example: Assumptions: Basic clock Sample time fSYS fBC tS = 40 MHz (i.e. tSYS = 25 ns), ADCTC = `01', ADSTC = `00' = fSYS / 2 = 20 MHz, i.e. tBC = 50 ns = tBC x 8 = 400 ns Conversion 10-bit: With post-calibr. tC10P = 52 x tBC + tS + 6 x tSYS = (2600 + 400 + 150) ns = 3.15 s tC10 = 40 x tBC + tS + 6 x tSYS = (2000 + 400 + 150) ns = 2.55 s With post-calibr. tC8P = 44 x tBC + tS + 6 x tSYS = (2200 + 400 + 150) ns = 2.75 s Post-calibr. off Conversion 8-bit: Post-calibr. off Data Sheet tC8 = 32 x tBC + tS + 6 x tSYS = (1600 + 400 + 150) ns = 2.15 s 62 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters 4.4 AC Parameters 4.4.1 Definition of Internal Timing The internal operation of the XC164CS is controlled by the internal master clock fMC. The master clock signal fMC can be generated from the oscillator clock signal fOSC via different mechanisms. The duration of master clock periods (TCMs) and their variation (and also the derived external timing) depend on the used mechanism to generate fMC. This influence must be regarded when calculating the timings for the XC164CS. Phase Locked Loop Operation (1:N) f OSC f MC TCM Direct Clock Drive (1:1) f OSC f MC TCM Prescaler Operation (N:1) f OSC f MC TCM MCT05555 Figure 15 Generation Mechanisms for the Master Clock Note: The example for PLL operation shown in Figure 15 refers to a PLL factor of 1:4, the example for prescaler operation refers to a divider factor of 2:1. The used mechanism to generate the master clock is selected by register PLLCON. Data Sheet 63 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters CPU and EBC are clocked with the CPU clock signal fCPU. The CPU clock can have the same frequency as the master clock (fCPU = fMC) or can be the master clock divided by two: fCPU = fMC / 2. This factor is selected by bit CPSYS in register SYSCON1. The specification of the external timing (AC Characteristics) depends on the period of the CPU clock, called "TCP". The other peripherals are supplied with the system clock signal fSYS which has the same frequency as the CPU clock signal fCPU. Bypass Operation When bypass operation is configured (PLLCTRL = 0xB) the master clock is derived from the internal oscillator (input clock signal XTAL1) through the input- and outputprescalers: fMC = fOSC / ((PLLIDIV+1) x (PLLODIV+1)). If both divider factors are selected as `1' (PLLIDIV = PLLODIV = `0') the frequency of fMC directly follows the frequency of fOSC so the high and low time of fMC is defined by the duty cycle of the input clock fOSC. The lowest master clock frequency is achieved by selecting the maximum values for both divider factors: fMC = fOSC / ((3 + 1) x (14 + 1)) = fOSC / 60. Phase Locked Loop (PLL) When PLL operation is configured (PLLCTRL = 11B) the on-chip phase locked loop is enabled and provides the master clock. The PLL multiplies the input frequency by the factor F (fMC = fOSC x F) which results from the input divider, the multiplication factor, and the output divider (F = PLLMUL+1 / (PLLIDIV+1 x PLLODIV+1)). The PLL circuit synchronizes the master clock to the input clock. This synchronization is done smoothly, i.e. the master clock frequency does not change abruptly. Due to this adaptation to the input clock the frequency of fMC is constantly adjusted so it is locked to fOSC. The slight variation causes a jitter of fMC which also affects the duration of individual TCMs. The timing listed in the AC Characteristics refers to TCPs. Because fCPU is derived from fMC, the timing must be calculated using the minimum TCP possible under the respective circumstances. The actual minimum value for TCP depends on the jitter of the PLL. As the PLL is constantly adjusting its output frequency so it corresponds to the applied input frequency (crystal or oscillator) the relative deviation for periods of more than one TCP is lower than for one single TCP (see formula and Figure 16). This is especially important for bus cycles using waitstates and e.g. for the operation of timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train Data Sheet 64 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter is negligible. The value of the accumulated PLL jitter depends on the number of consecutive VCO output cycles within the respective timeframe. The VCO output clock is divided by the output prescaler (K = PLLODIV+1) to generate the master clock signal fMC. Therefore, the number of VCO cycles can be represented as K x N, where N is the number of consecutive fMC cycles (TCM). For a period of N x TCM the accumulated PLL jitter is defined by the deviation DN: DN [ns] = (1.5 + 6.32 x N / fMC); fMC in [MHz], N = number of consecutive TCMs. So, for a period of 3 TCMs @ 20 MHz and K = 12: D3 = (1.5 + 6.32 x 3 / 20) = 2.448 ns. This formula is applicable for K x N < 95. For longer periods the K x N = 95 value can be used. This steady value can be approximated by: DNmax [ns] = (1.5 + 600 / (K x fMC)). Acc. jitter DN K = 12 K=8 K = 15 K = 10 ns 8 K=6 K=5 7 6 5 10 MHz 20 MHz 4 3 2 1 0 40 MHz 0 1 5 10 15 20 25 N MCD05566 Figure 16 Approximated Accumulated PLL Jitter Note: The bold lines indicate the minimum accumulated jitter which can be achieved by selecting the maximum possible output prescaler factor K. Different frequency bands can be selected for the VCO, so the operation of the PLL can be adjusted to a wide range of input and output frequencies: Data Sheet 65 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters Table 16 VCO Bands for PLL Operation1) PLLCON.PLLVB VCO Frequency Range Base Frequency Range 00 100 ... 150 MHz 20 ... 80 MHz 01 150 ... 200 MHz 40 ... 130 MHz 10 200 ... 250 MHz 60 ... 180 MHz 11 Reserved 1) Not subject to production test - verified by design/characterization. Data Sheet 66 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters 4.4.2 On-chip Flash Operation The XC164CS's Flash module delivers data within a fixed access time (see Table 17). Accesses to the Flash module are controlled by the PMI and take 1 + WS clock cycles, where WS is the number of Flash access waitstates selected via bitfield WSFLASH in register IMBCTRL. The resulting duration of the access phase must cover the access time tACC of the Flash array. Therefore, the required Flash waitstates depend on the available speed grade as well as on the actual system frequency. Note: The Flash access waitstates only affect non-sequential accesses. Due to prefetching mechanisms, the performance for sequential accesses (depending on the software structure) is only partially influenced by waitstates. In typical applications, eliminating one waitstate increases the average performance by 5% ... 15%. Table 17 Flash Characteristics (Operating Conditions apply) Parameter Symbol Flash module access time (Standard) Flash module access time (Grade A) Programming time per 128-byte block Erase time per sector tACC tACC tPR tER Limit Values Unit Min. Typ. Max. CC - - 701) ns CC - - 501) ns 5 ms 500 ms CC CC - - 2 2) 200 2) 1) The actual access time is also influenced by the system frequency, so the frequency ranges are not fully linear. See Table 18. 2) Programming and erase time depends on the system frequency. Typical values are valid for 40 MHz. Example: For an operating frequency of 40 MHz (clock cycle = 25 ns), Standard devices must be operated with 2 waitstates: ((2 + 1) x 25 ns) 70 ns. Grade A devices can be operated with 1 waitstate: ((1 + 1) x 25 ns) 50 ns. Table 18 indicates the interrelation of waitstates, system frequency, and speed grade. Table 18 Flash Access Waitstates Required Waitstates Frequency Range for Standard Flash Speed Frequency Range for Flash Speed Grade A 0 WS (WSFLASH = 00B) fCPU 16 MHz fCPU 28 MHz fCPU 40 MHz fCPU 20 MHz fCPU 40 MHz fCPU 40 MHz 1 WS (WSFLASH = 01B) 2 WS (WSFLASH = 10B) Note: The maximum achievable system frequency is limited by the properties of the respective derivative, i.e. 40 MHz (or 20 MHz for xxx-32F20F devices). Data Sheet 67 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters 4.4.3 Table 19 External Clock Drive XTAL1 External Clock Drive Characteristics (Operating Conditions apply) Parameter Symbol tOSC t1 t2 t3 t4 Oscillator period High time2) Low time2) Rise time2) Fall time2) Limit Values Unit Min. Max. SR 25 2501) ns SR 6 - ns SR 6 - ns SR - 8 ns SR - 8 ns 1) The maximum limit is only relevant for PLL operation to ensure the minimum input frequency for the PLL. 2) The clock input signal must reach the defined levels VILC and VIHC. t3 t1 t4 V IHC V ILC 0.5 V DDI t2 t OSC MCT05572 Figure 17 External Clock Drive XTAL1 Note: If the on-chip oscillator is used together with a crystal or a ceramic resonator, the oscillator frequency is limited to a range of 4 MHz to 16 MHz. It is strongly recommended to measure the oscillation allowance (negative resistance) in the final target system (layout) to determine the optimum parameters for the oscillator operation. Please refer to the limits specified by the crystal supplier. When driven by an external clock signal it will accept the specified frequency range. Operation at lower input frequencies is possible but is verified by design only (not subject to production test). Data Sheet 68 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters 4.4.4 Testing Waveforms Output delay Output delay Hold time 2.0 V Hold time Input Signal (driven by tester) Output Signal (measured) 0.8 V 0.45 V Output timings refer to the rising edge of CLKOUT. Input timings are calculated from the time, when the input signal reaches VIH or VIL, respectively. MCD05556 Figure 18 Input Output Waveforms VLoad + 0.1 V Timing Reference Points V Load - 0.1 V V OH - 0.1 V V OL + 0.1 V For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs, but begins to float when a 100 mV change from the loaded V OH /V OL level occurs (IOH / IOL = 20 mA). MCA05565 Figure 19 Data Sheet Float Waveforms 69 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters 4.4.5 External Bus Timing Table 20 CLKOUT Reference Signal Parameter Symbol Limit Values Min. tc5 tc6 tc7 tc8 tc9 CLKOUT cycle time CLKOUT high time CLKOUT low time CLKOUT rise time CLKOUT fall time Unit Max. 40/30/251) CC ns CC 8 - ns CC 6 - ns CC - 4 ns CC - 4 ns 1) The CLKOUT cycle time is influenced by the PLL jitter (given values apply to fCPU = 25/33/40 MHz). For longer periods the relative deviation decreases (see PLL deviation formula). t C9 t C5 tC6 t C7 tC8 CLKOUT MCT05571 Figure 20 Data Sheet CLKOUT Signal Timing 70 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters Variable Memory Cycles External bus cycles of the XC164CS are executed in five subsequent cycle phases (AB, C, D, E, F). The duration of each cycle phase is programmable (via the TCONCSx registers) to adapt the external bus cycles to the respective external module (memory, peripheral, etc.). This table provides a summary of the phases and the respective choices for their duration. Table 21 Programmable Bus Cycle Phases (see timing diagrams) Bus Cycle Phase Parameter Address setup phase, the standard duration of this tpAB phase (1 ... 2 TCP) can be extended by 0 ... 3 TCP if the address window is changed tpC tpD tpE tpF Command delay phase Write Data setup/MUX Tristate phase Access phase Address/Write Data hold phase Valid Values Unit 1 ... 2 (5) TCP 0...3 TCP 0...1 TCP 1 ... 32 TCP 0...3 TCP Note: The bandwidth of a parameter (minimum and maximum value) covers the whole operating range (temperature, voltage) as well as process variations. Within a given device, however, this bandwidth is smaller than the specified range. This is also due to interdependencies between certain parameters. Some of these interdependencies are described in additional notes (see standard timing). Data Sheet 71 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters Table 22 External Bus Cycle Timing (Operating Conditions apply) Parameter Symbol Limit Values Min. Max. Unit Output valid delay for: RD, WR(L/H) tc10 CC 1 15 ns Output valid delay for: BHE, ALE tc11 CC -1 8 ns Output valid delay for: A23 ... A16, A15 ... A0 (on PORT1) tc12 CC 3 18 ns Output valid delay for: A15 ... A0 (on PORT0) tc13 CC 3 18 ns Output valid delay for: CS tc14 CC 3 16 ns Output valid delay for: D15 ... D0 (write data, MUX-mode) tc15 CC 3 19 ns Output valid delay for: D15 ... D0 (write data, DEMUX-mode) tc16 CC 2 16 ns Output hold time for: RD, WR(L/H) tc20 CC -3 4 ns Output hold time for: BHE, ALE tc21 CC 0 11 ns Output hold time for: A23 ... A16, A15 ... A0 (on PORT0) tc23 CC 1 13 ns Output hold time for: CS tc24 CC -2 4 ns Output hold time for: D15 ... D0 (write data) tc25 CC 1 13 ns Input setup time for: D15 ... D0 (read data) tc30 SR 29 - ns Input hold time D15 ... D0 (read data)1) tc31 SR -5 - ns 1) Read data are latched with the same (internal) clock edge that triggers the address change and the rising edge of RD. Therefore address changes before the end of RD have no impact on (demultiplexed) read cycles. Read data can be removed after the rising edge of RD. Note: The shaded parameters have been verified by characterization. They are not subject to production test. Data Sheet 72 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters tp AB tpC tp D tp E tp F CLKOUT tc 21 tc 11 ALE tc 11/tc 14 A23-A16, BHE, CSx High Address tc 20 tc 10 RD WR(L/H) tc 31 tc 13 AD15-AD0 (read) AD15-AD0 (write) tc 23 Low Address tc 30 Data In tc 13 tc 15 Low Address tc 25 Data Out MCT05557 Figure 21 Data Sheet Multiplexed Bus Cycle 73 V1.1, 2006-08 XC164-32 Derivatives Electrical Parameters tp AB tp C tp D tp E tp F CLKOUT tc 21 tc 11 ALE tc 11 /tc 14 A23-A0, BHE, CSx Address tc 20 tc 10 RD WR(L/H) tc 31 tc 30 D15-D0 (read) Data In tc 16 D15-D0 (write) tc 25 Data Out MCT05558 Figure 22 Data Sheet Demultiplexed Bus Cycle 74 V1.1, 2006-08 XC164-32 Derivatives Package and Reliability 5 Package and Reliability 5.1 Packaging Table 23 Package Parameters Parameter Symbol Limit Values Min. Max. Unit Notes Green Package PG-TQFP-100-5 Thermal resistance junction to case RJC - 8 K/W - Thermal resistance junction to leads RJL - 31 K/W - Standard Package P-TQFP-100-16 Thermal resistance junction to case RJC - 7 K/W - Thermal resistance junction to leads RJL - 23 K/W - Data Sheet 75 V1.1, 2006-08 XC164-32 Derivatives Package and Reliability C Seating Plane 24 x 0.5 = 12 0.22 0.05 0.08 C 100x Coplanarity 0.2 MIN. 0.6 0.15 (1) 0...7 12 H .05 0.15 +0 -0.06 0.5 1.6 MAX 0.10.05 STAND OFF 1.4 0.05 Package Outlines 0.08 M A-B D C 100x 16 0.2 A-B D 100x 141) 0.2 A-B D H 4x D 14 1) 16 B A 100 1 Index Marking 1) Does not include plastic or metal protrusion of 0.25 max. per side Figure 23 PG-TQFP-100-5 (Plastic Green Thin Quad Flat Package) Data Sheet 76 GPP05614 V1.1, 2006-08 XC164-32 Derivatives 0.5 0.22 0.05 7 MAX. H 0.6 0.15 12 C 0.08 1) 0.08 0.15 +0.05 -0.06 0.1 0.05 1.4 0.05 1.6 MAX. Package and Reliability M A-B D C 100x 16 0.2 A-B D 100x 14 1) 0.2 A-B D H 4x D 16 B 14 1) A 100 1 Index Marking 1) Does not include plastic or metal protrusion of 0.25 max. per side 2) Does not include dambar protrusion of 0.08 max. per side at max. material condition GPP09189 Figure 24 P-TQFP-100-16 (Plastic - Thin Quad Flat Package) You can find all of our packages, sorts of packing and others in our Infineon Internet Page "Products": http://www.infineon.com/products. Data Sheet 77 Dimensions in mm V1.1, 2006-08 XC164-32 Derivatives Package and Reliability 5.2 Flash Memory Parameters The data retention time of the XC164CS's Flash memory (i.e. the time after which stored data can still be retrieved) depends on the number of times the Flash memory has been erased and programmed. Table 24 Flash Parameters (XC164CS, 256 Kbytes) Parameter Data retention time Symbol tRET Flash Erase Endurance NER Data Sheet Limit Values Unit Notes Min. Max. 15 - years Max. 103 erase/program cycles 20 x 103 - - Max. data retention time 5 years 78 V1.1, 2006-08 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG