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DS-LOC112-R4.0 1
LOC112
Linear Optocouplers
Part # Description
LOC112 8 Pin DIP (50/Tube)
LOC112P 8 Pin Flatpack (50/Tube)
LOC112PTR 8 Pin Flatpack (1000/Reel)
LOC112S 8 Pin Surface Mount (50/Tube)
LOC112STR 8 Pin Surface Mount (1000/Reel)
Applications
Features Description
Approvals
Ordering Information
Pin Configuration
•Modem Transformer Replacement With No
Insertion Loss
•Digital Telephone Isolation
•Power Supply Feedback Voltage/Current
•Medical Sensor Isolation
•Audio Signal Interfacing
•Isolation of Process Control Transducers
•8 Pin Flatpack or DIP Package (PCMCIA
Compatible)
•Couples Analog and Digital Signals
•Wide Bandwidth (>200kHz)
•High Gain Stability
•Low Input/Output Capacitance
•Low Power Consumption
•0.01% Servo Linearity
•THD 87dB Typical
•Machine Insertable, Wave Solderable
•Surface Mount and Tape Reel Versions Available
•VDE Compatible
The LOC112 Single Linear Optocoupler features an
infrared LED optically coupled with two
phototransistors. One feedback (input)
phototransistor is used to generate a control signal
that provides a servomechanism to the LED drive
current, thus compensating for the LEDs nonlinear
time and temperature characteristics. The other
(output) phototransistor provides an output signal that
is linear with respect to the servo LED current. The
product features wide bandwidth, high input to output
isolation and excellent servo linearity.
•UL Recognized: File Number E76270
•CSA Certified: File Number LR 43639-10
•BSI Certified:
•BS EN 60950:1992 (BS7002:1992)
Certificate #:7344
•BS EN 41003:1993
Certificate #:7344
LOC112 Pinout
Ð LED
+ LED
+V
cc1
I
1
NC
NC
+V
cc2
I
2
1
2
3
4
8
7
6
5
•The LOC112 is shipped in anti-static tubes of 50 pieces. Each
tube will contain one K3 sorted bin.
•Bin designation marked on each device (D - G).
K3 Sorted Bins
Bin D = 0.733-0.805
Bin E = 0.806-0.886
Bin F = 0.887-0.974
Bin G = 0.733-1.072
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2
LOC112
Rev. 4.0
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Conditions Symbol Min Typ Max Units
Input Characteristics @ 25°C
LED Voltage Drop IF=2-10mA VF0.9 1.2 1.4 V
Reverse LED Current VR=5V IR- - 10 µA
Reverse LED Voltage - VR--5V
Forward LED Current - IF- - 100 mA
Coupler/Detector Characteristics @ 25°C
Dark Current IF=0mA, VCC=15V ID-125nA
K1, Servo Gain (I1/IF)I
F=2-10mA, VCC=15V K1 0.004 0.007 0.030 -
K2, Forward Gain (I2/IF)I
F=2-10mA, VCC=15V K2 0.004 0.007 0.030 -
K3, Transfer Gain (K2/K1)1IF=2-10mA, VCC=15V K3 0.733 1.0 1.072 -
∆K3, Transfer Gain Linearity1IF=2-10mA ∆K3 - - 1.0 %
(non-servoed)
K3 Temperature Coefficient IF=2-10mA, Vdet=-5V ∆K3/∆T - 0.005 - %/°C
Common Mode V=20VP-P, RL=2KΩ, CMRR - 130 - dB
Rejection Ratio F=100Hz
Total Harmonic Distortion FO=350Hz, 0dBm THD -96 -87 -80 dB
Frequency Response Photoconductive Operation BW (-3dB) - 200 - kHz
Photovoltaic Operation BW (-3dB) - 40 - kHz
Input/Output Capacitance - CI/O -3-pF
Input/Output Isolation - VI/O 3750 - - VRMS
1 LOC111 and LOC112 Bins D,E,F,G.
Parameter Min Typ Max Units
Input Power Dissipation - - 1501mW
Input Control Current - - 100 mA
Peak (10ms) - - 1 A
Total Package Dissipation - - 5002mW
Isolation Voltage
Input to Output
SOIC Package 3750 - - VRMS
Operational Temperature -40 +85 °C
Storage Temperature -40 - +125 °C
Soldering Temperature - - +260 °C
(10 Seconds Max)
Flatpack Package - - +220 °C
1Derate Linearly 1.33 mW/°C
2Derate Linearly 6.67 mW/°C
Absolute Maximum Ratings (@ 25˚ C)
Electrical Characteristics
LOC112
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Rev. 4.0
PERFORMANCE DATA*
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
LOC112
LED Current (IF) vs.
LED Forward Voltage (VF)
LED Forward Voltage (V)
LED Current (mA)
1
35
30
25
20
15
10
5
01.1 1.2 1.3 1.4
LOC112
LED Current (IF) vs.
LED Forward Voltage (VF)
LED Forward Voltage (V)
LED Current (mA)
1
100
10
1
0.1 1.1 1.2 1.3 1.4
LOC112
Servo Gain vs.
LED Current & Temperature
LED Current (mA)
Servo Gain
0.014
0.012
0.010
0.008
0.006
0.004
0.002
002468 1210
0°C
25°C
50°C
70°C
85°C
LOC112
Servo-Photocurrent vs.
LED Current & Temperature
LED Current (mA)
Servo-Photocurrent (µA)
140
120
100
80
60
40
20
002468 1210
0°C
25°C
50°C
70°C
85°C
LOC112
Normalized Servo-Photocurrent vs.
LED Current & Temperature
LED Current (mA)
Normalized Servo-Photocurrent
1.4
1.2
1.0
0.8
0.6
0.4
0.2
002468 1210
0°C
25°C
50°C
70°C
85°C
LOC112
Typical LED Forward Voltage Drop vs.
Temperature
Temperature (°C)
LED Forward Voltage Drop (V)
-40
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9 -15 10 35 60 85
10mA
20mA
5mA
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4
LOC112
Rev. 4.0
Dimensions
mm
(inches)
MECHANICAL DIMENSIONS
4.445 ± 0.127
(0.175 ± 0.005) 3.302
(0.130)
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
8.077 ± 0.127
(0.318 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.254 TYP.
(0.010 TYP.)
0.635 TYP.
(0.025 TYP.)
8 Pin DIP Surface Mount (“S” Suffix)
9.652 ± 0.381
(0.380 ± 0.015)
PC Board Pattern
(Top View)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
8-0.800 DIA.
(8-0.031 DIA.)
7.239 TYP.
(0.285 TYP.)
3.302
(0.130)
7.620 ± 0.254
(0.300 ± 0.010)
9.144 TYP.
(0.360 TYP.)
6.350 ± 0.127
(0.250 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
8.077 ± 0.127
(0.318 ± 0.005 )
8 Pin DIP Through Hole (Standard)
PC Board Pattern
(Top View)
2.540 ± 0.127
(0.100 ± 0.005)
8.305 ± 0.127
(0.327 ± 0.005)
1.905 ± 0.127
(0.075 ± 0.005)
1.498 ± 0.127
(0.059 ± 0.005)
PC Board Pattern
(Top View)
2.540
±
0.127
(0.100
±
0.005)
8.763 ± 0.127
(0.345 ± 0.005)
1.193
(0.047)
0.787
(0.031)
8 Pin Flatpack (“P” Suffix)
7.620 ± 0.254
(0.300 ± 0.010)
2.159 TYP.
(0.085 TYP.)
2.286 MAX.
(0.090 MAX.)
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
8.077 ± 0.127
(0.318 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
0.203
(0.008)
0.635 ± 0.127
(0.025 ± 0.005)
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions
at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and
disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support
or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make
changes to its products at any time without notice.
Specification: DS-LOC112-R4.0
©Copyright 2003, Clare, Inc.
OptoMOS®is a registered trademark of Clare, Inc.
All rights reserved. Printed in USA.
5/6/03
For additional information please visit our website at: www.clare.com
Dimensions
mm
(inches)
MECHANICAL DIMENSIONS
Tape and Reel Packaging for 8 Pin Flatpack Package
User Direction of Feed
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
18
K
1
= 2.00
(0.079)
Top Cover
Tape
K
0
= 2.70
(0.106)
P = 12.00
(0.472)
W = 16.30 max
(0.642 max)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
NOTE:
Tape dimensions not shown, comply with JEDEC Standard EIA-481-2