KBP201 THRU KBP207
Features
Mechanical Data
· Glass Passivated Die Construction
· High Case Dielectric Strength of 1500V
RMS
· Low Reverse Leakage Current
· Surge Overload Rating to 65A Peak
· Ideal for Printed Circuit Board Applications
· Plastic Material - UL Flammability Classification 94V-0
Maximum Ratings And Electrical Characteristics
· Case : Molded Plastic
· Terminals : Plated Leads, Solderable per
MIL-STD-202, Method 208
· Polarity : As Marked on Body
· Approx. Weight : 1.52 grams
· Mounting Position : Any
· Marking : Type Number
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
CURRENT 2.0 Amperes
VOLTAGE 50 to 1000 Volts
Notes:
(1) Thermal resistance from junction to case per element. Unit mounted on 75 x 75 x 16mm aluminum plate heat sink.
(2) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current @ T
C
=105
Non-Repetitive Peak Forward Surge Current,
8.3ms single half-sine-wave superimposed
on rated load per element (JEDEC method)
Volts
Forward Voltage (per element) @ I
F
=2.0 A
V
RMM
V
RWM
V
R
50 Volts
Symbols Units
1.1V
FM
V
R(RMS)
2.0
Amps65I
FSM
T
j
T
STG
500
-65 to +150 ℃
Amps
Peak Reverse Current at Rated
DC Blocking Voltage
Typical Junction Capacitance
per Element (Note 2)
Operating and Storage Temperature Range
KBP
201 KBP
202 KBP
203 KBP
204 KBP
205 KBP
206 KBP
207
35
5.0
25
100
70
200
140
400
280
600
420
800
560
1000
700 Volts
μA
℃/W
pF
Io
I
RM
C
j
Rθ
JC
@ T
C
=25℃
@ T
C
=125℃
Typical Thermal Resistance (Note 1) 38
℃
KBP
Dim Min Max
A14.00 15.00
B10.50 11.50
C15.00
D4.70 5.00
E3.50 4.00
G2.30 2.50
H0.70 Typical
All Dimens ions in mm
-+
A
B
C
E
G
H
D