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LM6152
,
LM6154
SNOS752E –MAY 1999–REVISED SEPTEMBER 2014
LM6152/LM6154 Dual and Quad 75 MHz GBW Rail-to-Rail I/O Operational Amplifiers
1 Features 3 Description
Using patented circuit topologies, the
1• At VS= 5V, typical unless noted. LM6152/LM6154 provides new levels of speed vs.
• Greater than Rail-to-rail Input CMVR −0.2 5V to power performance in applications where low voltage
5.25 V supplies or power limitations previously made
• Rail-to-rail Output Swing 0.01 V to 4.99 V compromise necessary. With only 1.4 mA/amplifier
supply current, the 75 MHz gain bandwidth of this
• Wide Gain-bandwidth 75 MHz @ 100 kHz device supports new portable applications where
• Slew Rate higher power devices unacceptably drain battery life.
– Small Signal 5 V/µs The slew rate of the devices increases with
increasing input differential voltage, thus allowing the
– Large Signal 45 V/µs device to handle capacitive loads while maintaining
• Low Supply Current 1.4 mA/amplifier large signal amplitude.
• Wide Supply Range 2.7 V to 24 V The LM6152/LM6154 can be driven by voltages that
• Fast Settling Time of 1.1 µs for 2 V Step (to exceed both power supply rails, thus eliminating
0.01%) concerns about exceeding the common-mode voltage
• PSRR 91 dB range. The rail-to-rail output swing capability provides
the maximum possible dynamic range at the output.
• CMRR 84 dB This is particularly important when operating on low
supply voltages.
2 Applications Operating on supplies from 2.7 V to over 24 V, the
• Portable High Speed Instrumentation LM6152/LM6154 is excellent for a very wide range of
• Signal Conditioning Amplifier/ADC Buffers applications, from battery operated systems with
• Barcode Scanners large bandwidth requirements to high speed
instrumentation.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM6152 SOIC (8) 4.902 mm × 3.912 mm
LM6154 SOIC (14) 8.636 mm × 3.912 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Offset Voltage vs. Supply voltage
Supply Current vs. Supply Voltage
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM6152
,
LM6154
SNOS752E –MAY 1999–REVISED SEPTEMBER 2014
www.ti.com
Table of Contents
6.7 2.7 V DC Electrical Characteristics.......................... 7
1 Features.................................................................. 16.8 2.7 V AC Electrical Characteristics.......................... 7
2 Applications ........................................................... 16.9 24 V DC Electrical Characteristics........................... 8
3 Description............................................................. 16.10 24 V AC Electrical Characteristics......................... 8
4 Revision History..................................................... 26.11 Typical Performance Characteristics ...................... 9
5 Pin Configuration and Functions......................... 37 Application and Implementation ........................ 14
6 Specifications......................................................... 48 Device and Documentation Support.................. 16
6.1 Absolute Maximum Ratings ...................................... 48.1 Related Links .......................................................... 16
6.2 Handling Ratings....................................................... 48.2 Trademarks............................................................. 16
6.3 Recommended Operating Conditions(1) ................... 48.3 Electrostatic Discharge Caution.............................. 16
6.4 Thermal Information.................................................. 48.4 Glossary.................................................................. 16
6.5 5.0 V DC Electrical Characteristics.......................... 59 Mechanical, Packaging, and Orderable
6.6 5.0 V AC Electrical Characteristics.......................... 6Information........................................................... 16
4 Revision History
Changes from Revision D (March 2013) to Revision E Page
• Changed "Junction Temperature Range" to "Operating Temperature Range" and deleted "TJ" in Recommended
Operating Conditions ............................................................................................................................................................. 4
• Deleted TJ= 25°C for Electrical Characteristics Tables......................................................................................................... 5
Changes from Revision C (March 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 15
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5 Pin Configuration and Functions
Package D08A Package D14A
8-Pin 14-Pin
Top View Top View
Pin Functions
PIN
LM6152 LM6154 I/O DESCRIPTION
NAME D08A D14A
-IN A 2 2 I ChA Inverting Input
+IN A 3 3 I ChA Non-inverting Input
-IN B 6 6 I ChB Inverting Input
+IN B 5 5 I ChB Non-inverting Input
-IN C 9 I ChC Inverting Input
+IN C 10 I ChC Non-inverting Input
-IN D 13 I ChD Inverting Input
+IN D 12 I ChD Non-inverting Input
OUT A 1 1 O ChA Output
OUT B 7 7 O ChB Output
OUT C 8 O ChC Output
OUT D 14 O ChD Output
V-4 11 I Negative Supply
V+8 4 I Positive Supply
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6 Specifications
6.1 Absolute Maximum Ratings(1)(2)
MIN MAX UNIT
Differential Input Voltage ±15 V
(V+) + 0.3
Voltage at Input/Output Pin V
(V−)−0.3
Supply Voltage (V+−V−) 35 V
Current at Input Pin ±10 mA
Current at Output Pin (3) ±25 mA
Current at Power Supply Pin 50 mA
Lead Temperature (soldering, 10 sec) 260 °C
Junction Temperature (4) 150 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(4) The maximum power dissipation is a function of TJ(MAX) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX)–T A)/RθJA. All numbers apply for packages soldered directly into a PC board.
6.2 Handling Ratings MIN MAX UNIT
Tstg Storage temperature range -65 +150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2500
V(ESD) Electrostatic discharge V
pins(1)
(1) JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process. Human body model
is 1.5 kΩin series with 100 pF
6.3 Recommended Operating Conditions(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Supply Voltage 2.7 ≤V+≤24 V
Operating Temperature Range, LM6152,LM6154 0 +70 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
6.4 Thermal Information D08A D14A
THERMAL METRIC(1) UNIT
8 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 193°C/W 126°C/W °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 5.0 V DC Electrical Characteristics
Unless otherwise specified, all limits are ensured for V+= 5.0V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2. Boldface
limits apply at the temperature extremes. LM6154BC
LM6152AC
PARAMETER TEST CONDITIONS TYP(1) LM6152BC UNIT
LIMIT(2) LIMIT(2)
VOS Input Offset Voltage 2 5 mV
0.54 4 7 max
TCVOS Input Offset Voltage Average Drift 10 µV/°C
IBInput Bias Current 0V ≤VCM ≤5V 500 980 980 nA max
750 1500 1500
IOS Input Offset Current 32 100 100 nA max
40 160 160
RIN Input Resistance, CM 0V ≤VCM ≤4V 30 MΩ
CMRR Common Mode Rejection Ratio 0V ≤VCM ≤4V 94 70 70 dB
min
0V ≤VCM ≤5V 84 60 60
PSRR Power Supply Rejection Ratio 5V ≤V+≤24V dB
91 80 80 min
VCM Input Common-Mode Voltage Range Low −0.25 0 0 V
High 5.25 5.0 5.0 V
AVLarge Signal Voltage Gain RL= 10 kΩV/mV
214 50 50 min
VOOutput Swing RL= 100 kΩ0.02 0.02 V
0.006 0.03 0.03 max
4.97 4.97 V
4.992 4.96 4.96 min
RL= 2 kΩ0.10 0.10 V
0.04 0.12 0.12 max
4.80 4.80 V
4.89 4.70 4.70 min
ISC Output Short Circuit Current Sourcing 3 3 mA
2.5 2.5 min
6.2 27 27 mA
17 17 max
Sinking 7 7 mA
5 5 min
16.9 mA
40 40 max
ISSupply Current Per Amplifier 2 2 mA
1.4 2.25 2.25 max
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
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6.6 5.0 V AC Electrical Characteristics
Unless otherwise specified, all limits ensured for V+= 5.0V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2. Boldface limits
apply at the temperature extremes. LM6154BC
LM6152AC
PARAMETER TEST CONDITIONS TYP(1) LM6152BC UNIT
LIMIT(2) LIMIT(2)
SR Slew Rate ±4V Step @ VS= ±6V, 24 24 V/µs
30
RS< 1 kΩ15 15 min
GBW Gain-Bandwidth Product f = 100 kHz 75 MHz
Amp-to-Amp Isolation RL= 10 kΩ125 dB
enInput-Referred Voltage Noise f = 1 kHz 9 nV/√Hz
inInput-Referred Current Noise f = 1 kHz 0.34 pA/√Hz
T.H.D Total Harmonic Distortion f = 100 kHz, RL= 10 kΩdBc
−65
AV=−1, VO= 2.5 VPP
ts Settling Time 2V Step to 0.01% 1.1 µs
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
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6.7 2.7 V DC Electrical Characteristics
Unless otherwise specified, all limits are ensured for V+= 2.7V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2. Boldface
limits apply at the temperature extremes. LM6154BC
LM6152AC
PARAMETER TEST CONDITIONS TYP(1) LM6152BC UNIT
LIMIT(2) LIMIT(2)
VOS Input Offset Voltage 2 5 mV
0.8 5 8 max
TCVOS Input Offset Voltage Average Drift 10 µV/°C
IBInput Bias Current 500 nA
IOS Input Offset Current 50 nA
RIN Input Resistance, CM 0V ≤VCM ≤1.8V 30 MΩ
CMRR Common Mode Rejection Ratio 0V ≤VCM ≤1.8V 88 dB
0V ≤VCM ≤2.7V 78
PSRR Power Supply Rejection Ratio 3V ≤V+≤5V 69 dB
VCM Input Common-Mode Voltage Range Low −0.25 0 0 V
High 2.95 2.7 2.7 V
AVLarge Signal Voltage Gain RL= 10 kΩ5.5 V/mV
VOOutput Swing RL= 10 kΩ0.07 0.07 V
0.032 0.11 0.11 max
2.64 2.64 V
2.68 2.62 2.62 min
ISSupply Current Per Amplifier 1.35 mA
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
6.8 2.7 V AC Electrical Characteristics
Unless otherwise specified, all limits are ensured for V+= 2.7V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2. Boldface
limits apply at the temperature extremes. LM6154BC
LM6152AC
PARAMETER TEST CONDITIONS TYP(1) LM6152BC UNIT
LIMIT(2) LIMIT(2)
GBW Gain-Bandwidth Product f = 100 kHz 80 MHz
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
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6.9 24 V DC Electrical Characteristics
Unless otherwise specified, all limits are ensured for V+= 24V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2. Boldface
limits apply at the temperature extremes. LM6154BC
LM6152AC
PARAMETER TEST CONDITIONS TYP(1) LM6152BC UNIT
LIMIT(2) LIMIT(2)
VOS Input Offset Voltage 2 7 mV
0.3 4 9 max
TCVOS Input Offset Voltage Average Drift 10 µV/°C
IBInput Bias Current 500 nA
IOS Input Offset Current 32 nA
RIN Input Resistance, CM 0V ≤VCM ≤23V 60 Meg Ω
CMRR Common Mode Rejection Ratio 0V ≤VCM ≤23V 94 dB
0V ≤VCM ≤24V 84
PSRR Power Supply Rejection Ratio 0V ≤VCM ≤24V 95 dB
VCM Input Common-Mode Voltage Range Low −0.25 0 0 V
High 24.25 24 24 V
AVLarge Signal Voltage Gain RL= 10 kΩ55 V/mV
VOOutput Swing RL= 10 kΩ0.075 0.075 V
0.044 0.090 0.090 max
23.8 23.8 V
23.91 23.7 23.7 min
ISSupply Current Per Amplifier 2.25 2.25 mA
1.6 2.50 2.50 max
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
6.10 24 V AC Electrical Characteristics
Unless otherwise specified, all limits are ensured for V+= 24V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2. Boldface
limits apply at the temperature extremes. LM6154BC
LM6152AC
PARAMETER TEST CONDITIONS TYP(1) LM6152BC UNIT
LIMIT(2) LIMIT(2)
GBW Gain-Bandwidth Product f = 100 kHz 80 MHz
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
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6.11 Typical Performance Characteristics
Figure 1. Supply Current vs. Supply Voltage Figure 2. Offset Voltage vs. Supply voltage
Figure 3. Bias Current vs. Supply voltage Figure 4. Bias Current vs. VCM
Figure 5. Bias Current vs. VCM Figure 6. Bias Current vs. VCM
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Typical Performance Characteristics (continued)
Figure 7. Output Voltage vs. Source Current Figure 8. Output Voltage vs. Source Current
Figure 9. Output Voltage vs. Source Current Figure 10. Output Voltage vs. Sink Current
Figure 11. Output Voltage vs. Sink Current Figure 12. Output Voltage vs. Sink Current
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Typical Performance Characteristics (continued)
Figure 13. Crosstalk (dB) vs. Frequency Figure 14. GBWP (@ 100 kHz) vs. Supply Voltage
Figure 15. Unity Gain Frequency vs. Supply Voltage Figure 16. CMRR
for Various Loads
Figure 17. Voltage Swing vs. Frequency Figure 18. PSRR vs. Frequency
(CL= 100 pF)
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Typical Performance Characteristics (continued)
Figure 19. Open Loop Gain/Phase Figure 20. Open Loop Gain/Phase
(VS= 5V) (VS= 10V)
Figure 21. Open Loop Gain/Phase Figure 22. Noise Voltage vs. Frequency
(VS= 24V)
Figure 23. Noise Current vs. Frequency Figure 24. Voltage Error vs. Settle Time
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100k 1M
FREQUENCY (Hz)
-100
-90
-70
-60
-50
-40
-20
-10
0
HD (dBc)
-30
-80
HD2
HD3
THD
VS = ±5V
AV = -1
VIN = 5 VPP
RL = 10 k:
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Typical Performance Characteristics (continued)
Figure 25. Distortion vs. Frequency
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7 Application and Implementation
The LM6152/LM6154 is ideally suited for operation with about 10 kΩ(Feedback Resistor, RF) between the output
and the negative input terminal.
With RFset to this value, for most applications requiring a close loop gain of 10 or less, an additional small
compensation capacitor (CF) (see Figure 26) is recommended across RFin order to achieve a reasonable
overshoot (10%) at the output by compensating for stray capacitance across the inputs.
The optimum value for CFcan best be established experimentally with a trimmer cap in place since its value is
dependant on the supply voltage, output driving load, and the operating gain. Below, some typical values used in
an inverting configuration and driving a 10 kΩload have been tabulated for reference:
Table 1. Typical BW (−3 dB) at Various
Supply Voltage and Gains
VSCFBW (−3 dB)
GAIN
Volts pF MHz
−1 5.6 4
3−10 6.8 1.97
−100 None 0.797
−1 2.2 6.6
24 −10 4.7 2.2
−100 None 0.962
In the non-inverting configuration, the LM6152/LM6154 can be used for closed loop gains of +2 and above. In
this case, also, the compensation capacitor (CF) is recommended across RF(= 10 kΩ) for gains of 10 or less.
Figure 26. Typical Inverting Gain Circuit AV=−1
Because of the unique structure of this amplifier, when used at low closed loop gains, the realizable BW will be
much less than the GBW product would suggest.
The LM6152/LM6154 brings a new level of ease of use to op amp system design.
The greater than rail-to-rail input voltage range eliminates concern over exceeding the common-mode voltage
range. The rail-to-rail output swing provides the maximum possible dynamic range at the output. This is
particularly important when operating on low supply voltages.
The high gain-bandwidth with low supply current opens new battery powered applications where higher power
consumption previously reduced battery life to unacceptable levels.
The ability to drive large capacitive loads without oscillating functional removes this common problem.
To take advantage of these features, some ideas should be kept in mind.
The LM6152/LM6154, capacitive loads do not lead to oscillations, in all but the most extreme conditions, but they
will result in reduced bandwidth. They also cause increased settling time.
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Unlike most bipolar op amps, the unique phase reversal prevention/speed-up circuit in the input stage, causes
the slew rate to be very much a function of the input pulse amplitude. This results in a 10 to 1 increase in slew
rate when the differential input signal increases. Large fast pulses will raise the slew-rate to more than 30 V/µs.
Figure 27. Slew Rate vs. VDIFF
The speed-up action adds stability to the system when driving large capacitive loads.
A conventional op amp exhibits a fixed maximum slew-rate even though the differential input voltage rises due to
the lagging output voltage. In the LM6152/LM6154, increasing lag causes the differential input voltage to
increase but as it does, the increased slew-rate keeps the output following the input much better. This effectively
reduces phase lag. As a result, the LM6152/LM6154 can drive capacitive loads as large as 470 pF at gain of 2
and above, and not oscillate.
Capacitive loads decrease the phase margin of all op amps. This can lead to overshoot, ringing and oscillation.
This is caused by the output resistance of the amplifier and the load capacitance forming an R-C phase shift
network. The LM6152/6154 senses this phase shift and partly compensates for this effect.
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8 Device and Documentation Support
8.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
LM6152 Click here Click here Click here Click here Click here
LM6154 Click here Click here Click here Click here Click here
8.2 Trademarks
All trademarks are the property of their respective owners.
8.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
8.4 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM6152ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM61
52ACM
LM6152ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM61
52ACM
LM6152ACMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM61
52ACM
LM6152ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM61
52ACM
LM6152BCM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM61
52BCM
LM6152BCMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM61
52BCM
LM6154BCM NRND SOIC D 14 55 TBD Call TI Call TI 0 to 70 LM6154BCM
LM6154BCM/NOPB ACTIVE SOIC D 14 55 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM6154BCM
LM6154BCMX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM6154BCM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM6152ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM6152ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM6152BCMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM6154BCMX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2014
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM6152ACMX SOIC D 8 2500 367.0 367.0 35.0
LM6152ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM6152BCMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM6154BCMX/NOPB SOIC D 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2014
Pack Materials-Page 2
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