OPA363
OPA2363
OPA364
OPA2364
OPA4364
1.8V, 7MHz, 90dB CMRR,
SINGLE-SUPPLY, RAIL-TO-RAIL I/O
OPERATIONAL AMPLIFIER
DESCRIPTION
The OPA363 and OPA364 families are high-performance
CMOS operational amplifiers optimized for very low voltage,
single-supply operation. These miniature, low-cost amplifiers
are designed to operate on single supplies from 1.8V (±0.9V)
to 5.5V (±2.75V). Applications include sensor amplification
and signal conditioning in battery-powered systems.
The OPA363 and OPA364 families offer excellent CMRR
without the crossover associated with traditional complimen-
tary input stages. This results in excellent performance for
driving Analog-to-Digital (A/D) converters without degrada-
tion of differential linearity and THD. The input common-
mode range includes both the negative and positive supplies.
The output voltage swing is within 10mV of the rails.
The OPA363 family includes a shutdown mode. Under logic
control, the amplifiers can be switched from normal operation
to a standby current that is less than 1µA.
The single version is available in the
Micro
SIZE SOT23-5
(SOT23-6 for shutdown) and SO-8. The dual version is
available in MSOP-8, MSOP-10, and SO-8 packages. Quad
packages are available in TSSOP-14 and SO-14 packages.
All versions are specified for operation from –40°C to +125°C.
FEATURES
●1.8V OPERATION
●
Micro
SIZE PACKAGES
●BANDWIDTH: 7MHz
●CMRR: 90dB (typical)
●SLEW RATE: 5V/µs
●LOW OFFSET: 500µV (max)
●QUIESCENT CURRENT: 750µA/Channel (max)
●SHUTDOWN MODE: < 1µA/Channel
APPLICATIONS
●SIGNAL CONDITIONING
●DATA ACQUISITION
●PROCESS CONTROL
●ACTIVE FILTERS
●TEST EQUIPMENT
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PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2002-2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SBOS259B – SEPTEMBER 2002 – REVISED FEBRUARY 2003
OPA363 OPA364 OPA2363 OPA2364
OPA4364
SOT23-5 x
SOT23-6 x
MSOP-8 x
MSOP-10 x
SO-8 x x x
TSSOP-14 x
SO-14 x
®
OPA4364
OPA2363
OPA2364
OPA
363
OPA4364
OPA363, 2363, 364, 2364, 4364
SBOS259B
2www.ti.com
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR(1) RANGE MARKING NUMBER MEDIA, QUANTITY
OPA363I SOT23-6 DBV –40°C to +125°C A40 OPA363IDBVT Tape and Reel, 250
" """"OPA363IDBVR Tape and Reel, 3000
OPA363I SO-8 D –40°C to +125°C OPA363 OPA363ID Rails, 100
" """"OPA363IDR Tape and Reel, 2500
OPA2363I MSOP-10 DGS –40°C to +125°C BHK OPA2363IDGST Tape and Reel, 250
" """"OPA2363IDGSR Tape and Reel, 2500
OPA364I SOT23-5 DBV –40°C to +125°C A41 OPA364IDBVT Tape and Reel, 250
" """"OPA364IDBVR Tape and Reel, 3000
OPA364I SO-8 D –40°C to +125°C OPA364 OPA364ID Rails, 100
" """"OPA364IDR Tape and Reel, 2500
OPA2364I MSOP-8 DGK –40°C to +125°C BHL OPA2364IDGKT Tape and Reel, 250
" """"OPA2364IDGKR Tape and Reel, 2500
OPA2364I SO-8 D –40°C to +125°C OPA2364 OPA2364ID Rails, 100
" """"OPA2364IDR Tape and Reel, 2500
OPA363AI SOT23-6 DBV –40°C to +125°C A40 OPA363AIDBVT Tape and Reel, 250
" """"OPA363AIDBVR Tape and Reel, 3000
OPA363AI SO-8 D –40°C to +125°C OPA363A OPA363AID Rails, 100
" """"OPA363AIDR Tape and Reel, 2500
OPA2363AI MSOP-10 DGS –40°C to +125°C BHK OPA2363AIDGST Tape and Reel, 250
" """"OPA2363AIDGSR Tape and Reel, 2500
OPA364AI SOT23-5 DBV –40°C to +125°C A41 OPA364AIDBVT Tape and Reel, 250
" """"OPA364AIDBVR Tape and Reel, 3000
OPA364AI SO-8 D –40°C to +125°C OPA364A OPA364AID Rails, 100
" """"OPA364AIDR Tape and Reel, 2500
OPA2364AI SO-8 D –40°C to +125°C OPA2634A OPA2364AID Rails, 100
" """"OPA2364AIDR Tape and Reel, 2500
OPA2364AI MSOP-8 DGK –40°C to +125°C BHL OPA2364AIDGKT Tape and Reel, 250
" """"OPA2364AIDGKR Tape and Reel, 2500
OPA4364AI SO-14 D –40°C to +125°C OPA4364A OPA4364AID Rails, 58
" """"OPA4364AIDR Tape and Reel, 2500
OPA4364AI TSSOP-14 PW –40°C to +125°C OPA4364A OPA4364AIPWT Tape and Reel, 250
" """"OPA4364AIPWR Tape and Reel, 2500
NOTES: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper han-
dling and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
Supply Voltage ................................................................................. +5.5V
Signal Input Terminals, Voltage(2) ........................... –0.5V to (V+) + 0.5V
Current(2) .................................................. ±10mA
Enable Input ...............................................................(V–) – 0.5V to 5.5V
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature ..................................................–40°C to +150°C
Storage Temperature .....................................................–65°C to +150°C
Junction Temperature.................................................................... +150°C
Lead Temperature (soldering, 10s)............................................... +300°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may de-
grade device reliability. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those specified is
not implied. (2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less. (3) Short-circuit to ground one amplifier
per package.
PACKAGE/ORDERING INFORMATION
ABSOLUTE MAXIMUM RATINGS(1)
OPA363, 2363, 364, 2364, 4364
SBOS259B 3
www.ti.com
PIN CONFIGURATIONS
Top View
1
2
3
4
5
10
9
8
7
6
+V
VOUT B
–In B
+In B
Enable B
VOUT A
–In A
+In A
–V
Enable A
OPA2363
MSOP-10
B
A
1
2
3
4
8
7
6
5
V+
Out B
–In B
+In B
Out A
–In A
+In A
V–
OPA2364
MSOP-8, SO-8
1
2
3
4
8
7
6
5
Enable
V+
VOUT
NC(1)
NC
–In
+In
V–
OPA363
SO-8
1
2
3
4
8
7
6
5
NC
V+
V
OUT
NC
NC
–In
+In
V–
OPA364
SO-8
1
2
3
5
4
V+
–In
V
OUT
V–
+In
OPA364
(1)
SOT23-5
A41
1
2
3
6
5
4
V+
Enable
–In
VOUT
V–
+In
OPA363(1)
A40
SOT23-6
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
OUT
D
–In D
+In D
V–
+In C
–In C
V
OUT
C
V
OUT
A
–In A
+In A
V+
+In B
–In B
V
OUT
B
OPA4364
SO-14, TSSOP-14
BC
D
A
NOTE: (1) Orient according to marking.
NC = No Internal Connection.
OPA363, 2363, 364, 2364, 4364
SBOS259B
4www.ti.com
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/ 2, and VOUT = VS/2, VCM = VS/ 2, unless otherwise noted.
OPAx363, OPAx364
PARAMETER CONDITION MIN TYP MAX UNITS
OFFSET VOLTAGE
Input Offset Voltage, OPA363I, OPA364I VOS VS = +5V 500 µV
OPA2363I, OPA2364I 900 µV
OPA363AI, OPA364AI, OPA2363AI, OPA2364AI, OPA4364AI 1 2.5 mV
Drift dVOS /dT 3 µV/°C
vs Power Supply PSRR VS = 1.8V to 5.5V, VCM = 0 80 330 µV/V
Channel Separation, dc 1µV/V
INPUT BIAS CURRENT
Input Bias Current IB±1±10 pA
over Temperature See Typical Characteristics
Input Offset Current IOS ±1±10 pA
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz en10 µVp-p
Input Voltage Noise Density, f = 10kHz en17 nV/√Hz
Input Current Noise Density, f = 10kHz in0.6 fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range VCM (V–) – 0.1 (V+) + 0.1 V
Common-Mode Rejection Ratio CMRR (V–) – 0.1V < VCM < (V+) + 0.1V 74 90 dB
INPUT CAPACITANCE
Differential 2pF
Common-Mode 3pF
OPEN-LOOP GAIN
R
L
= 10kΩ, 100mV < V
O
< (V+) – 100mV
Open-Loop Voltage Gain AOL 94 100 dB
OPA4364AI 90 dB
over Temperature VS = +1.8V to +5.5V 86 dB
FREQUENCY RESPONSE CL = 100pF
Gain Bandwidth Product GBW 7 MHz
Slew Rate SR G = +1 5 V/µs
Settling Time, 0.1% tSVS = +5V, 4V Step, G = +1 1 µs
0.01% VS = +5V, 4V Step, G = +1 1.5 µs
Overload Recovery Time VIN • Gain > VS0.8 µs
Total Harmonic Distortion + Noise THD+N VS = +5V, G = +1, f = 20Hz to 20kHz 0.002 %
OUTPUT
Voltage Output Swing from Rail RL = 10kΩ10 20 mV
over Temperature RL = 10kΩ20 mV
Short-Circuit Current ISC See Typical Characteristics mA
Capacitive Load Drive CLOAD See Typical Characteristics
SHUTDOWN (for OPAx363)
tOFF 1µs
tON(1) 20 µs
VL (shutdown) (V–) + 0.8 V
VH (amplifier is active) 0.75 (V+) 5.5 V
IQSD 0.9 µA
POWER SUPPLY
Specified Voltage Range VS1.8 5.5 V
Operating Voltage Range 1.8 to 5.5 V
Quiescent Current (per amplifier) IQVS = +1.8V 650 750 µA
VS = +3.6V 850 1000 µA
VS = +5.5V 1.1 1.4 mA
TEMPERATURE RANGE
Specified Range –40 +125 °C
Operating Range –40 +150 °C
Storage Range –65 +150 °C
Thermal Resistance
θ
JA
SOT23-5, SOT23-6 200 °C/W
MSOP-8, MSOP-10, SO-8 150 °C/W
TSSOP-14, SO-14 100 °C/W
NOTE: (1) Part is considered enabled when input offset voltage returns to specified range.
OPA363, 2363, 364, 2364, 4364
SBOS259B 5
www.ti.com
TYPICAL CHARACTERISTICS
At TCASE = +25°C, RL = 10kΩ, and connected to VS/2, VOUT = VS/2, VCM = V S/ 2, unless otherwise noted.
1.4
1.2
1.0
0.8
0.6
0.4
QUIESCENT CURRENT vs SUPPLY VOLTAGE
Supply Voltage (V)
Quiescent Current (mA)
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Per Amplifier
1
0.1
0.01
0.001
0.0001
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
Frequency (Hz)
THD+N (%)
10 100 1k 10k 100k
G = 10, R
L
= 2kΩ
G = 10, R
L
= 10kΩ
G = 1, R
L
= 10kΩ
G = 1, R
L
= 2kΩ
(V
S
= 5V, V
OUT
= 1Vrms)
100
90
80
70
60
50
40
30
20
10
0
COMMON-MODE REJECTION RATIO vs FREQUENCY
Frequency (Hz)
CMRR (dB)
10 1k100 100k10k 1M 10M
100
80
60
40
20
0
POWER-SUPPLY REJECTION RATIO
vs FREQUENCY
Frequency (Hz)
PSRR (dB)
1 10 100 1k 10k 100k 10M1M
1
0.1
0.01
0.001
0.0001
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
Frequency (Hz)
THD+N (%)
10 100 1k 10k 100k
G = 10, RL = 2kΩ
VS = 1.8V
VOUT = –10dBv G = 10, RL = 2kΩ
VS = 5V
G = 10, RL = 10kΩ
VS = 1.8V, 5V
G = 1, RL = 2kΩ
VS = 1.8V G = 1,
RL = 2kΩ
VS = 5V
G = 1,
RL = 10kΩ
VS = 1.8V, 5V
120
100
80
60
40
20
0
–20
OPEN-LOOP GAIN/PHASE vs FREQUENCY
Frequency (Hz)
Voltage Gain (dB)
0
–30
–60
–90
–120
–150
–180
Phase (°)
10 100 1k 10k 100k 1M 10M 100M
OPA363, 2363, 364, 2364, 4364
SBOS259B
6www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TCASE = +25°C, RL = 10kΩ, and connected to VS/2, VOUT = VS/2, VCM = VS/ 2, unless otherwise noted.
120
100
80
60
40
20
0
SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE
Supply Voltage (V)
Short-Circuit Current (mA)
1.5 2.0
+I
SC
–I
SC
2.5 3.0 3.5 4.0 4.5 5.0 5.5
1000
100
10
INPUT VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY
Frequency (Hz)
Input Voltage Noise (nV/√Hz)
10 100 1k 10k 100k
3
2
1
0
–1
–2
–3
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
Output Current (mA)
Output Voltage (V)
0±10 ±20 ±30 ±40 ±50 ±60 ±70 ±80 ±90 ±100
T
A
= –40°C
V
S
= ±2.5V V
S
= ±1.65V
V
S
= ±0.9V
V
S
= ±2.5V V
S
= ±1.65V
T
A
= +25°C
T
A
= +125°C
10k
1k
100
10
1
INPUT OFFSET CURRENT vs TEMPERATURE
Temperature (°C)
Input Offset Current (pA)
–50 –25 0 25 50 75 100 125
INPUT BIAS CURRENT vs TEMPERATURE
Temperature (°C)
Input Bias Current (pA)
–50 –25 0 25 50 75 100 125
10k
1k
100
10
1
4
2
0
–2
–4
–6
–8
–10
INPUT BIAS CURRENT
vs INPUT COMMON-MODE VOLTAGE
Common-Mode Voltage (V)
Input Bias Current (pA)
–0.5 0.5 1.5 2.5 3.5 4.5 5.5
V
CM
= +5.1V
V
CM
= –0.1V
OPA363, 2363, 364, 2364, 4364
SBOS259B 7
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TCASE = +25°C, RL = 10kΩ, and connected to VS/2, VOUT = VS/2, VCM = V S/ 2, unless otherwise noted.
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
Load Capacitance (pF)
100
G = +1
1k
Overshoot (%)
60
50
40
30
20
10
0
G = +10
SETTLING TIME vs CLOSED-LOOP GAIN
Closed-Loop Gain (V/V)
110
0.01%
100
Settling Time (µs)
100
10
1
0.1
0.1%
OFFSET DRIFT DISTRIBUTION
Offset Voltage Drift (µV/°C)
0
Percent of Amplifiers (%)
20
15
10
5
0123456789> 10
OUTPUT ENABLE CHARACTERISTIC
(VS = 5V, VOUT = 20kHz Sinusoid)
VOUT
VENABLE
50µs/div
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Offset Voltage (mV)
Percent of Amplifiers (%)
16
14
12
10
8
6
4
2
0
Typical Production
Distribution of
Packaged Units
OPA36xAI
0 1.0 2.0 2.5–2.5 –2.0 –1.0
CHANNEL SEPARATION vs FREQUENCY
Frequency (Hz)
10 10k 100k 1M100 1k 10M
Channel Separation (dB)
130
120
110
100
90
80
70
60
50
40
OPA363, 2363, 364, 2364, 4364
SBOS259B
8www.ti.com
APPLICATIONS INFORMATION
The OPA363 and OPA364 series op amps are rail-to-rail
operational amplifiers with excellent CMRR, low noise, low
offset, and wide bandwidth on supply voltages as low as
±0.9V. The OPA363 features an additional pin for shutdown/
enable function. These families do not exhibit phase reversal
and are unity-gain stable. Specified over the industrial tem-
perature range of –40°C to +125°C, the OPA363 and OPA364
families offer precision performance for a wide range of
applications.
RAIL-TO-RAIL INPUT
The OPA363 and OPA364 feature excellent rail-to-rail opera-
tion, with supply voltages as low as ±0.9V. The input com-
mon-mode voltage range of the OPA363 and OPA364 family
extends 100mV beyond supply rails. The unique input topol-
ogy of the OPA363 and OPA364 eliminates the input offset
transition region typical of most rail-to-rail complimentary
stage operational amplifiers, allowing the OPA363 and
OPA364 to provide superior common-mode performance
over the entire common-mode input range, as seen in Figure 1.
This feature prevents degradation of the differential linearity
error and THD when driving A/D converters. A simplified
schematic of the OPA363 and OPA364 is shown in Figure 2.
OPERATING VOLTAGE
The OPA363 and OPA364 series op amp parameters are fully
specified from +1.8V to +5.5V. Single 0.1µF bypass capaci-
tors should be placed across supply pins and as close to the
part as possible. Supply voltages higher than 5.5V (absolute
maximum) may cause permanent damage to the amplifier.
Many specifications apply from –40°C to +125°C. Parameters
that vary significantly with operating voltages or temperature
are shown in the Typical Characteristics.
FIGURE 1. OPA363 and OPA364 have Linear Offset Over
Entire Common-Mode Range.
FIGURE 2. Simplified Schematic.
TYPICAL CHARACTERISTICS (Cont.)
At TCASE = +25°C, RL = 10kΩ, and connected to VS/2, VOUT = VS/2, VCM = VS/ 2, unless otherwise noted.
SMALL-SIGNAL STEP RESPONSE
(CL = 100pF)
50mV/div
250ns/div
LARGE-SIGNAL STEP RESPONSE
(CL = 100pF)
1V/div
1µs/div
Common-Mode Voltage (V)
–0.2 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
V
OS
(mV)
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
–2.5
–3.0
–3.5
Competitors
OPA363 and OPA364
Regulated
Charge Pump
V
OUT
= V
CC
+1.8V
Patent Pending
Very Low Ripple
Topology
I
BIAS
V
CC
+ 1.8V
I
BIAS
I
BIAS
I
BIAS
V
S
I
BIAS
V
OUT
V
IN
–V
IN
+
OPA363, 2363, 364, 2364, 4364
SBOS259B 9
www.ti.com
ENABLE FUNCTION
The shutdown (enable) function of the OPA363 is referenced
to the negative supply voltage of the operational amplifier. A
logic level HIGH enables the op amp. A valid logic HIGH is
defined as voltage > 75% of the positive supply applied to the
enable pin. The valid logic HIGH signal can be as much as
5.5V above the negative supply, independent of the positive
supply voltage. A valid logic LOW is defined as < 0.8V above
the negative supply pin. If dual or split power supplies are
used, care should be taken to ensure logic input signals are
properly referred to the negative supply voltage. This pin
should be connected to a valid high or low voltage or driven,
not left open circuit.
The logic input is a high-impedance CMOS input. Dual op
amps are provided separate logic inputs. For battery-oper-
ated applications, this feature may be used to greatly reduce
the average current and extend battery life. The enable time
is 20µs; disable time is 1µs. When disabled, the output
assumes a high-impedance state. This allows the OPA363 to
be operated as a “gated” amplifier, or to have its output
multiplexed onto a common analog output bus.
CAPACITIVE LOAD
The OPA363 and OPA364 series op amps can drive a wide
range of capacitive loads. However, all op amps under
certain conditions may become unstable. Op amp configura-
tion, gain, and load value are just a few of the factors to
consider when determining stability. An op amp in unity-gain
configuration is the most susceptible to the effects of capaci-
tive load. The capacitive load reacts with the output resis-
tance of the op amp to create a pole in the small-signal
response, which degrades the phase margin.
In unity gain, the OPA363 and OPA364 series op amps
perform well with a pure capacitive load up to approximately
1000pF. The ESR (Equivalent Series Resistance) of the
loading capacitor may be sufficient to allow the OPA363 and
OPA364 to directly drive very large capacitive loads (> 1µF).
Increasing gain enhances the amplifier’s ability to drive more
capacitance. See the typical characteristic “Small-Signal Over-
shoot vs Capacitive Load.”
One method of improving capacitive load drive in the unity-
gain configuration is to insert a 10Ω to 20Ω resistor in series
with the output, as shown in Figure 3. This significantly
reduces ringing with large capacitive loads. However, if there
is a resistive load in parallel with the capacitive load, it
creates a voltage divider introducing a dc error at the output
and slightly reduces output swing. This error may be insignifi-
cant. For instance, with RL = 10kΩ and RS = 20Ω, there is
only about a 0.2% error at the output.
INPUT AND ESD PROTECTION
All OPA363 and OPA364 pins are static protected with
internal ESD protection diodes tied to the supplies. These
diodes will provide overdrive protection if the current is
externally limited to 10mA, as stated in the absolute maxi-
mum ratings and shown in Figure 4.
ACHIEVING OUTPUT SWING TO
THE OP AMP’S NEGATIVE RAIL
Some applications require an accurate output voltage swing
from 0V to a positive full-scale voltage. A good single supply op
amp may be able to swing within a few mV of single supply
ground, but as the output is driven toward 0V, the output stage
of the amplifier will prevent the output from reaching the
negative supply rail of the amplifier.
The output of the OPA363 or OPA364 can be made to swing to
ground, or slightly below, on a single supply power source. To do
so requires use of another resistor and an additional, more
negative power supply than the op amp’s negative supply. A
pulldown resistor may be connected between the output and the
additional negative supply to pull the output down below the value
that the output would otherwise achieve as shown in Figure 5.
FIGURE 3. Improving Capacitive Load Drive.
FIGURE 4. Input Current Protection.
FIGURE 5. OPA363 and OPA364 Swing to Ground.
10Ω to
20Ω
V+
V
IN
V
OUT
R
S
R
L
C
L
OPAx363
OPAx364
VOUT
RP = 10kΩ
500µA
OPA363
OPA364
VIN
V+ = +5V
Op Amp’s
Negative
Supply
Grounded
–V = –5V
(Additional
Negative Supply)
5kΩ
OPAx363
10mA max
V+
VIN
VOUT
IOVERLOAD
This technique will not work with all op amps. The output
stage of the OPA363 and OPA364 allows the output voltage
to be pulled below that of most op amps, if approximately
500µA is maintained through the output stage. To calculate
the appropriate value load resistor and negative supply,
RL = –V/500µA. The OPA363 and OPA364 have been
characterized to perform well under the described conditions,
maintaining excellent accuracy down to 0V and as low as
–10mV. Limiting and nonlinearity occur below –10mV, with
linearity returning as the output is again driven above
–10mV.
OPA363, 2363, 364, 2364, 4364
SBOS259B
10 www.ti.com
FIGURE 7. The OPA363 and OPA364 Directly Drive the
ADS8324.
FIGURE 9. OPA2363 Configured as Half of a Dual Stereo Headphone Driver.
FIGURE 8. Driving the 12-Bit A/D Converter on the MSP430.
BUFFERED REFERENCE VOLTAGE
Many single-supply applications require a mid-supply refer-
ence voltage. The OPA363 and OPA364 offer excellent
capacitive load drive capability, and can be configured to
provide a 0.9V reference voltage, as can be seen in Figure 6.
For appropriate loading considerations, see the “Capacitive
Load” section.
AUDIO APPLICATIONS
The OPA363 and OPA364 op amp family has linear offset
voltage over the entire input common-mode range. Com-
bined with low-noise, this feature makes the OPA363 and
OPA364 suitable for audio applications. Single supply 1.8V
operation allows the OPA2363 and OPA2364 to be optimal
candidates for dual stereo-headphone drivers and micro-
phone pre-amplifiers in portable stereo equipment, see Fig-
ures 9 and 10.
FIGURE 6. The OPA363 and OPA364 Provide a Stable
Reference Voltage.
V+
R1
10kΩ
R2
10kΩ
0.9V
OPAx363
OPAx364
V+
CL = 1µF
ADS8324
V+ = 1.8V
V+ = 1.8V
OPA363
OPA364
VIN
100Ω
1nF
MSP430
V+
V+
V
IN
100Ω
1nF
OPA363
OPA364
V+
V–
20kΩ
1/2
OPA2363
One of Right or Left Channel
One of Right or Left
Headphone Out
10kΩ
20kΩ
V+
V–
Internally
Biased
20kΩ
1/2
TPS6100
20kΩ
10kΩ
1µF
47pF
V–
DIRECTLY DRIVING THE ADS8324 AND
THE MSP430
The OPA363 and OPA364 series op amps are optimized for
driving medium speed (up to 100kHz) sampling A/D convert-
ers. However, they also offer excellent performance for
higher speed converters. The no crossover input stage of the
OPA363 and OPA364 directly drive A/D converters without
degradation of differential linearity and THD. They provide an
effective means of buffering the A/D converters input capaci-
tance and resulting charge injection while providing signal
gain. Figure 7 and Figure 8 show the OPA363 and OPA364
configured to drive the ADS8324 and the 12-bit
A/D converter on the MSP430.
OPA363, 2363, 364, 2364, 4364
SBOS259B 11
www.ti.com
ACTIVE FILTERING
Low harmonic distortion and noise specifications plus high
gain and slew rate make the OPA363 and OPA364 optimal
candidates for active filtering. Figure 11 shows the OPA2363
configured as a low-distortion, 3rd-order GIC (General Immit-
tance Converter) filter. Figure 12 shows the implementation
of a Sallen-Key, 3-pole, low-pass Bessel filter.
FIGURE 11. The OPA2363 as a 3rd-Order, 40kHz, Low-Pass GIC Filter.
FIGURE 10. Microphone Preamplifier.
FIGURE 12. The OPA363 or OPA364 Configured as a 3-Pole, 20kHz, Sallen-Key Filter.
R
11
3.92kΩ
R
12
3.92kΩ
C
13
1000pF
R
14
3.48kΩ
C
15
1000pF
V
OUT
V
IN
R
1
3.92kΩR
3
1.33kΩ
C
4
1000pF
1/2
OPA2363
1/2
OPA2363
3
21
6
5
7
2
36
OPA363
3.3V
49kΩ
VOUT
OPAx363
OPAx364
Clean 3.3V Supply
1µF
4kΩ
6kΩElectret
Microphone 5kΩ
VOUT
VIN = 1Vrms OPA363
150kΩ19.5kΩ
220pF
1.8kΩ
3.3nF 47pF
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA2363AIDGSR ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2363AIDGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2363AIDGST ACTIVE MSOP DGS 10 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2363AIDGSTG4 ACTIVE MSOP DGS 10 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2363IDGSR ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2363IDGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2363IDGST ACTIVE MSOP DGS 10 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2363IDGSTG4 ACTIVE MSOP DGS 10 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2364AID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2364AIDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2364AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2364AIDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2364AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2364AIDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2364AIDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2364AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2364ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA2364IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2364IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2364IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2364IDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2364IDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2364IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2364IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA363AID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA363AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA363AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA363AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA363AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA363AIDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA363ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA363IDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA363IDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA363IDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA363IDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA363IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364AID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364AIDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364AIDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364AIDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364AIDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364AIDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364AIDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA364IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4364AID ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 4
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA4364AIDG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4364AIDR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4364AIDRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4364AIPWR ACTIVE TSSOP PW 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4364AIPWRG4 ACTIVE TSSOP PW 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4364AIPWT ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4364AIPWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 5
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA4364 :
•Automotive: OPA4364-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA2363AIDGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2363AIDGST MSOP DGS 10 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2363IDGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2363IDGST MSOP DGS 10 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2364AIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2364AIDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2364AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA2364IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2364IDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2364IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA363AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
OPA363AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
OPA363IDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
OPA363IDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
OPA364AIDBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
OPA364AIDBVT SOT-23 DBV 5 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
OPA364AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA364IDBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA364IDBVT SOT-23 DBV 5 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
OPA364IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA4364AIDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
OPA4364AIPWR TSSOP PW 14 2500 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
OPA4364AIPWT TSSOP PW 14 250 180.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA2363AIDGSR MSOP DGS 10 2500 367.0 367.0 35.0
OPA2363AIDGST MSOP DGS 10 250 210.0 185.0 35.0
OPA2363IDGSR MSOP DGS 10 2500 367.0 367.0 35.0
OPA2363IDGST MSOP DGS 10 250 210.0 185.0 35.0
OPA2364AIDGKR VSSOP DGK 8 2500 367.0 367.0 35.0
OPA2364AIDGKT VSSOP DGK 8 250 210.0 185.0 35.0
OPA2364AIDR SOIC D 8 2500 367.0 367.0 35.0
OPA2364IDGKR VSSOP DGK 8 2500 367.0 367.0 35.0
OPA2364IDGKT VSSOP DGK 8 250 210.0 185.0 35.0
OPA2364IDR SOIC D 8 2500 367.0 367.0 35.0
OPA363AIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0
OPA363AIDBVT SOT-23 DBV 6 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA363IDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0
OPA363IDBVT SOT-23 DBV 6 250 210.0 185.0 35.0
OPA364AIDBVR SOT-23 DBV 5 3000 210.0 185.0 35.0
OPA364AIDBVT SOT-23 DBV 5 250 210.0 185.0 35.0
OPA364AIDR SOIC D 8 2500 367.0 367.0 35.0
OPA364IDBVR SOT-23 DBV 5 3000 210.0 185.0 35.0
OPA364IDBVT SOT-23 DBV 5 250 210.0 185.0 35.0
OPA364IDR SOIC D 8 2500 367.0 367.0 35.0
OPA4364AIDR SOIC D 14 2500 367.0 367.0 38.0
OPA4364AIPWR TSSOP PW 14 2500 367.0 367.0 35.0
OPA4364AIPWT TSSOP PW 14 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 3
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