MC14027B Dual J-K Flip-Flop The MC14027B dual J-K flip-flop has independent J, K, Clock (C), Set (S) and Reset (R) inputs for each flip-flop. These devices may be used in control, register, or toggle functions. * * * * * * Diode Protection on All Inputs Supply Voltage Range = 3.0 Vdc to 18 Vdc Logic Swing Independent of Fanout Logic Edge-Clocked Flip-Flop Design -- Logic state is retained indefinitely with clock level either high or low; information is transferred to the output only on the positive-going edge of the clock pulse Capable of Driving Two Low-power TTL Loads or One Low-power Schottky TTL Load Over the Rated Temperature Range Pin-for-Pin Replacement for CD4027B http://onsemi.com MARKING DIAGRAMS 16 PDIP-16 P SUFFIX CASE 648 MC14027BCP AWLYYWW 1 16 SOIC-16 D SUFFIX CASE 751B MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.) Value Unit -0.5 to +18.0 V -0.5 to VDD + 0.5 V Input or Output Current (DC or Transient) per Pin 10 mA PD Power Dissipation, per Package (Note 3.) 500 mW TA Ambient Temperature Range -55 to +125 C Tstg Storage Temperature Range -65 to +150 C TL Lead Temperature (8-Second Soldering) 260 C Symbol VDD Vin, Vout Iin, Iout Parameter DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) 2. Maximum Ratings are those values beyond which damage to the device may occur. 3. Temperature Derating: Plastic "P and D/DW" Packages: - 7.0 mW/C From 65C To 125C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS (Vin or Vout) VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. 14027B AWLYWW 1 16 SOEIAJ-16 F SUFFIX CASE 966 MC14027B ALYW 1 A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION Device Package Shipping MC14027BCP PDIP-16 2000/Box MC14027BD SOIC-16 2400/Box MC14027BDR2 SOIC-16 2500/Tape & Reel MC14027BF SOEIAJ-16 See Note 1. MC14027BFEL SOEIAJ-16 See Note 1. 1. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative. Semiconductor Components Industries, LLC, 2000 August, 2000 - Rev. 4 1 Publication Order Number: MC14027B/D MC14027B TRUTH TABLE Inputs C Outputs* J K S R Qn Qn+1 Qn+1 1 X 0 0 0 1 0 X 0 0 0 1 1 0 0 X 0 0 0 0 1 X 1 0 0 1 0 1 1 1 0 0 Qo Qo Qo X X 0 0 X Qn Qn X X X 1 0 X 1 0 X X X 0 1 X 0 1 X X X 1 1 X 1 1 X = Don't Care = Level Change = Present State * = Next State PIN ASSIGNMENT QA 1 16 VDD QA 2 15 QB CA 3 14 QB RA 4 13 CB KA 5 12 RB JA 6 11 KB SA 7 10 JB VSS 8 9 SB BLOCK DIAGRAM 7 6 J 3 C 5 K S R Q 1 Q 2 Q 15 Q 14 4 9 10 J 13 C 11 K S R 12 VDD = PIN 16 VSS = PIN 8 http://onsemi.com 2 No Change MC14027B IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIII IIII III IIIII IIIIIIIII IIIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIII IIII III III III I III III IIII III III III IIIII IIIIIIIII IIIII IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIIIIIIIIII IIIIIIIIII IIII III III III IIII III IIII III III III IIIIIIIIII IIII III IIIIIIIIIIIIIIIII III IIIIIIIIII IIII III IIIIIIIIIIIIIIIII III IIIIIIIIII IIII III IIIIIIIIIIIIIIIII III ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) Characteristic Symbol - 55C 25C 125C VDD Vdc Min Max Min Typ (4.) Max Min Max Unit Output Voltage Vin = VDD or 0 "0" Level VOL 5.0 10 15 -- -- -- 0.05 0.05 0.05 -- -- -- 0 0 0 0.05 0.05 0.05 -- -- -- 0.05 0.05 0.05 Vdc Vin = 0 or VDD "1" Level VOH 5.0 10 15 4.95 9.95 14.95 -- -- -- 4.95 9.95 14.95 5.0 10 15 -- -- -- 4.95 9.95 14.95 -- -- -- Vdc Input Voltage "0" Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) VIL 5.0 10 15 -- -- -- 1.5 3.0 4.0 -- -- -- 2.25 4.50 6.75 1.5 3.0 4.0 -- -- -- 1.5 3.0 4.0 (VO = 0.5 or 4.5 Vdc) "1" Level (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) VIH 5.0 10 15 3.5 7.0 11 -- -- -- 3.5 7.0 11 2.75 5.50 8.25 -- -- -- 3.5 7.0 11 -- -- -- 5.0 5.0 10 15 - 3.0 - 0.64 - 1.6 - 4.2 -- -- -- -- - 2.4 - 0.51 - 1.3 - 3.4 - 4.2 - 0.88 - 2.25 - 8.8 -- -- -- -- - 1.7 - 0.36 - 0.9 - 2.4 -- -- -- -- IOL 5.0 10 15 0.64 1.6 4.2 -- -- -- 0.51 1.3 3.4 0.88 2.25 8.8 -- -- -- 0.36 0.9 2.4 -- -- -- mAdc Input Current Iin 15 -- 0.1 -- 0.00001 0.1 -- 1.0 Adc Input Capacitance (Vin = 0) Cin -- -- -- -- 5.0 7.5 -- -- pF Quiescent Current (Per Package) IDD 5.0 10 15 -- -- -- 1.0 2.0 4.0 -- -- -- 0.002 0.004 0.006 1.0 2.0 4.0 -- -- -- 30 60 120 Adc IT 5.0 10 15 Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Vdc IOH Source Sink Total Supply Current (5.) (6.) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) Vdc mAdc IT = (0.8 A/kHz) f + IDD IT = (1.6 A/kHz) f + IDD IT = (2.4 A/kHz) f + IDD 4. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 5. The formulas given are for the typical characteristics only at 25C. 6. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL - 50) Vfk where: IT is in A (per package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency, and k = 0.002. http://onsemi.com 3 Adc MC14027B IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III IIIIIIIIIIIIIII IIIII IIII IIII IIII IIII III SWITCHING CHARACTERISTICS (7.) (CL = 50 pF, TA = 25C) Characteristic Symbol Output Rise and Fall Time tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 12.5 ns tTLH, tTHL Propagation Delay Times** Clock to Q, Q tPLH, tPHL = (1.7 ns/pF) CL + 90 ns tPLH, tPHL = (0.66 ns/pF) CL + 42 ns tPLH, tPHL = (0.5 ns/pF) CL + 25 ns tPLH, tPHL VDD Min Typ (8.) Max 5.0 10 15 -- -- -- 100 50 40 200 100 80 Unit ns ns 5.0 10 15 -- -- -- 175 75 50 350 150 100 Set to Q, Q tPLH, tPHL = (1.7 ns/pF) CL + 90 ns tPLH, tPHL = (0.66 ns/pF) CL + 42 ns tPLH, tPHL = (0.5 ns/pF) CL + 25 ns 5.0 10 15 -- -- -- 175 75 50 350 150 100 Reset to Q, Q tPLH, tPHL = (1.7 ns/pF) CL + 265 ns tPLH, tPHL = (0.66 ns/pF) CL + 67 ns tPLH, tPHL = (0.5 ns/pF) CL + 50 ns 5.0 10 15 -- -- -- 350 100 75 450 200 150 Setup Times tsu 5.0 10 15 140 50 35 70 25 17 -- -- -- ns Hold Times th 5.0 10 15 140 50 35 70 25 17 -- -- -- ns tWH, tWL 5.0 10 15 330 110 75 165 55 38 -- -- -- ns fcl 5.0 10 15 -- -- -- 3.0 9.0 13 1.5 4.5 6.5 MHz tTLH, tTHL 5.0 10 15 -- -- -- -- -- -- 15 5.0 4.0 s Set 5 10 15 90 45 35 10 5 3 -- -- -- Reset 5 10 15 50 25 20 - 30 - 15 - 10 -- -- -- 5.0 10 15 250 100 70 125 50 35 -- -- -- Clock Pulse Width Clock Pulse Frequency Clock Pulse Rise and Fall Time Removal Times Set and Reset Pulse Width trem ns tWH 7. The formulas given are for the typical characteristics only at 25C. 8. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. http://onsemi.com 4 ns MC14027B 20 ns 20 ns VDD 90% 50% 10% J 20 ns K 90% 50% 10% tsu 20 ns tsu th 90% 50% 10% C tWH 1 fcl tPLH tTLH VDD VSS 20 ns VDD VSS tWL tPHL 90% 50% 10% Q VSS 20 ns 20 ns 90% SET OR RESET tw VOH CLOCK VOL tTHL 20 ns 50% 10% 20 ns 90% trem 50% Q or Q 20 ns 10% tw tPLH tPHL Inputs R and S low. For the measurement of tWH, I/fcl, and PD the Inputs J and K are kept high. VDD Figure 2. Dynamic Signal Waveforms (Set, Reset, Clock, and Output) S Q C C C C C C C C R Q C C VSS VOH 50% LOGIC DIAGRAM (1/2 of Device Shown) K VDD VOL Figure 1. Dynamic Signal Waveforms (J, K, Clock, and Output) J VSS C http://onsemi.com 5 MC14027B PACKAGE DIMENSIONS PDIP-16 P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R -A- 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B F C DIM A B C D F G H J K L M S L S -T- SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M T A M 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 -B- 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 C SEATING PLANE J M D 16 PL 0.25 (0.010) MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0 10 0.51 1.01 SOIC-16 D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J -A- -T- INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0 10 0.020 0.040 M T B S A S http://onsemi.com 6 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019 MC14027B PACKAGE DIMENSIONS SOEIAJ-16 F SUFFIX PLASTIC EIAJ SOIC PACKAGE CASE 966-01 ISSUE O 16 LE 9 Q1 M E HE 1 8 L DETAIL P Z D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) http://onsemi.com 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 --0.78 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 --0.031 MC14027B ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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