October 2006 Rev 4 1/9
9
STPS3030/CT/CG/CR
Low drop power Schottky rectifier
Main product characteristics
Features and benefits
Very small conduction losses
Negligible switching losses
Extremely fast switching
Low forward voltage drop for higher efficiency
Low thermal resistance
Avalanche capability specified
Description
Dual Schottky rectifier suited for switch mode
power supply and high frequency DC to DC
converters.
Packaged in TO-220AB, D2PAK and I2PAK, this
device is intended for use in low voltage high
frequency inverters, free-wheeling and polarity
protection applications.
j
IF(AV) 2 x 15 A
VRRM 30 V
Tj (max) 150° C
VF(max) 0.42 V
A1
K
A2
K
A1
A2
A1
A2
K
K
A1
A2
I2PAK
STPS3030CR
TO-220AB
STPS3030CT
D2PAK
STPS3030CG
www.st.com
Characteristics STPS3030CT/CG/CR
2/9
1 Characteristics
Table 1. Absolute ratings (limiting values, per diode)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 30 V
IF(RMS) RMS forward current 30 A
IF(AV) Average forward current Tc = 135° C Per diode 15 A
δ = 0.5 Per device 30
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 250 A
IRRM Peak repetitive reverse current tp = 2 µs square F= 1 kHz 1 A
IRSM Non repetitive peak reverse current tp = 100 µs square 3 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25° C 4100 W
Tstg Storage temperature range -65 to + 150 °C
TjMaximum operating junction temperature (1)
1. condition to avoid thermal runaway for a diode on its own heatsink
150 °C
dV/dt Critical rate of rise of reverse voltage (rated VR, Tj = 25° C) 10000 V/µs
Table 2. Thermal resistance
Symbol Parameter Value Unit
Rth(j-c) Junction to case TO-220AB - D2PAK - I2PAK Per diode 1.2
°C/WTo t a l 0 . 8
Rth(c) Coupling 0.4
Table 3. Static electrical characteristics (per diode)
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1)
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.26 x IF(AV) + 0.0107 IF2(RMS)
Reverse leakage current Tj = 25° C VR = VRRM
0.23 1.0 mA
Tj = 125° C 125 180
VF(1) Forward voltage drop
Tj = 25° C IF = 15 A 0.44 0.49
V
Tj = 125° C IF = 15 A 0.36 0.40
Tj = 25° C IF = 30 A 0.53 0.58
Tj = 125° C IF = 30 A 0.49 0.53
d
Ptot
dTj
-
-------------- 1
Rth j a()
--------------------------
<
STPS3030CT/CG/CR Characteristics
3/9
Figure 1. Conduction losses versus average
current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
0
1
2
3
4
5
6
7
8
9
10
0246810121416182
0
I (A)F(av)
P(W)
δ= 0.05 δ= 0.1 δ= 0.2 δ= 0.5
δ= 1
T
δ=tp/T tp
0
2
4
6
8
10
12
14
16
18
0 25 50 75 100 125 150
Tamb(°C)
Rth(j-a)=Rth(j-c)
Rth(j-a)=50°C/W
IF(av)(A)
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t)
P (1µs)
ARM p
ARM
0
0.2
0.4
0.6
0.8
1
1.2
0 25 50 75 100 125 150
T (°C)
j
P(t)
P (25°C)
ARM p
ARM
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values)
Figure 6. Relative variation of thermal
impedance junction to case versus
pulse duration
0
25
50
75
100
125
150
175
200
225
250
1.E-03 1.E-02 1.E-01 1.E+00
t(s)
TC=25°C
TC=75°C
TC=125°C
IM(A)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00
tp(s)
Zth(j-c)/Rth(j-c)
δ= 0.5
δ= 0.2
δ= 0.1
Single pulse
T
δ=tp/T tp
Characteristics STPS3030CT/CG/CR
4/9
Figure 7. Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 8. Junction capacitance versus
reverse voltage applied (typical
values)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
0 5 10 15 20 25 30
VR(V)
Tj=150°C
Tj=125°C
Tj=25°C
Tj=100°C
Tj=75°C
Tj=50°C
IR
(
mA
)
0.1
1.0
10.0
1 10 100
VR(V)
F=1MHz
Vosc=30mV
Tj=25°C
C(nF)
Figure 9. Forward voltage drop versus
forward current
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, Cu = 35 µm)
1
10
100
0.0 0.2 0.4 0.6 0.8 1.0 1.2
V (V)FM
Tj=25°C
(Maximum values)
Tj=125°C
(Maximum values)
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
Tj=125°C
(Typical values)
IFM(A)
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
S(cm²)
D²PAK
Rth(j-a)(°C/W)
STPS3030CT/CG/CR Package information
5/9
2 Package information
Epoxy meets UL94,V0
Cooling method: C
Recommended torque value: 0.55 Nm
Maximum torque value: 0.70 Nm
Table 4. I2PAK dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.035
b1 1.14 1.70 0.044 0.067
c 0.49 0.70 0.019 0.028
c2 1.23 1.32 0.048 0.052
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.195 0.203
E 10 10.40 0.394 0.409
L 13 14 0.512 0.551
L1 3.50 3.93 0.138 0.155
L2 1.27 1.40 0.050 0.055
E
L2
L1
b1
D
A1
c
c2
A
b
e
e1
L
Package information STPS3030CT/CG/CR
6/9
Figure 11. Footprint (dimensions in millimeters)
Table 5. D2PAK dimensions
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2
A
C2
D
R
A2
M
V2
C
A1
G
L
L3
L2
B
B2
E
*
* FLAT ZONE NO LESS THAN 2mm
8.90
3.70
1.30
5.08
16.90
10.30
STPS3030CT/CG/CR Package information
7/9
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 6. TO-220AB dimensions
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam 3.75 3.85 0.147 0.151
A
C
D
L7
Dia
L5
L6
L9
L4
F
H2
G
G1
L2
F2
F1
E
M
Ordering information STPS3030CT/CG/CR
8/9
3 Ordering information
4 Revision history
Ordering type Marking Package Weight Base qty Delivery
mode
STPS3030CT STPS3030CT TO-220AB 2.2 g 50 Tube
STPS3030CG STPS3030CG D2PAK 1.48 g 50 Tube
STPS3030CG-TR STPS3030CG D2PAK 1.48 g 1000 Tape and reel
STPS3030CR STPS3030CR I2PAK 1.49 g 50 Tube
Date Revision Changes
Jul-2006 3A Initial release.
16-Oct-2006 4 Reformatted to current standards. Corrected dimensions for I2PAK i n
Table 4
STPS3030CT/CG/CR
9/9
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com