MMBD3004/CA/CC/SE
350mW SMD Switching Diode
Small Signal Diode
Surface device type mounting
Moisture sensitivity level 1
Matte Tin(Sn) lead finish with Nickel(Ni) underplate
Pb free version and RoHS compliant
Min Max Min Max
Case :SOT-23 small outline plastic package 2.80 3.00 0.110 0.118
1.20 1.40 0.047 0.055
0.30 0.50 0.012 0.020
1.80 2.00 0.071 0.079
2.25 2.55 0.089 0.100
0.90 1.20 0.035 0.043
Part No. Package Packing
Code Packing Marking
MMBD3004 SOT-23 RF 3K / 7" Reel HC
MMBD3004CC SOT-23 RF 3K / 7" Reel PZ
MMBD3004CA SOT-23 RF 3K / 7" Reel RA
MMBD3004SE SOT-23 RF 3K / 7" Reel PY
MMBD3004 SOT-23 RFG 3K / 7" Reel HC
MMBD3004CC SOT-23 RFG 3K / 7" Reel PZ
MMBD3004CA SOT-23 RFG 3K / 7" Reel RA
MMBD3004SE SOT-23 RFG 3K / 7" Reel PY
Maximum Ratings
Pulse width= 1μs
Pulse width= 1s
may vary despending on application.
SOT-23
Note1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
Repetitive Peak Reverse Voltage
Rating at 25°C ambient temperature unless otherwise specified.
Non-Repetitive Peak Forward Surge Current
Units
mW
350
225
mA
Symbol
V
mAMean Forward Current IO
Power Dissipation
625
Type Number Value
VRRM
Repetitive Peak Forward Current IFRM
PD350
Suggested PAD Layou
t
D
E
F
Maximum Ratings and Electrical Characteristics
High temperature soldering guaranteed: 260°C/10s
Weight : 0.008gram (approximately)
Pin Configuration
Ordering Information
Marking Code : HC.PZ.RA.PY.
Features
Mechanical Data Unit (inch)
A
Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
Fast switching speed
Unit (mm)
Dimensions
Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
B
C
IFSM
4A
1
Thermal Resistance (Junction to Ambient) RθJA 357 °C/W
Junction and Storage Temperature Range TJ, TSTG -65 to + 150 °C
MMBD3004 MMBD3004CCMMBD3004CA
B
A
C
D
2.0
0.079
0.95
0.037
0.9
0.035
0.8
0.031
F
E
MMBD3004SE
Version : A11
MMBD3004/CA/CC/SE
350mW SMD Switching Diode
Small Signal Diode
Electrical Characteristics
IR=
IF=
IF=
VR=
VR=
Junction Capacitance
Tape & Reel specification
Carrier width
Carrier length
Carrier depth
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocket hole position
Punch hole position
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
Type Number
-
-
1.00
1.25
100.0
350
-
-
-
VF
CJ
Trr
Units
V
V
V
MaxMinSymbol
pF
ns
5
50.0-
VR=1V, f=1.0MHz
Forward Voltage
Reverse Breakdown Voltage 100μA
100mA
200mA
240V,Tj=150
Reverse Recovery Time IF=IR=30mA, RL=100Ω, IRR=0.1IR
V(BR)
W 8.10 ±0.20
P0 4.00 ±0.10
P1 2.00 ±0.05
T 0.229 ±0.013
F 3.50 ±0.05
1.50 ± 0.10
D 178 ± 1
d
D2 13.0 ± 0.20
E 1.75 ±0.10
Item Symbol
C 1.22 ±0.10
W1 12.30 ±0.20
D1 55 Min
B 2.77 ±0.10
Dimension(mm)
A 3.15 ±0.10
IRμAReverse Leakage Current 240V - 0.1
W1
D1D2
D
T
C
dP
1
P0
A
B
F
W
E
Direction of Feed
To
p
Cover Ta
p
e
Carieer Tape
A
ny Additional Label (If Required)
TSC label
Version : A11
MMBD3004/CA/CC/SE
350mW SMD Switching Diode
Small Signal Diode
Rating and Sharacteristic Curves
FIG 3 Admissible Power Dissipation Curve
0
50
100
150
200
250
300
350
400
0 25 50 75 100 125 150 175 200
Power Dissipation (mW)
mbient Temperature (°C)
Instantaneous Forward Voltage (V)
Ta=25°C
FIG 1 Typical Forward Characteristics
0.01
0.1
1
10
100
1000
0 0.3 0.6 0.9 1.2 1.5 1.8 2.1
Instantaneous Forward Current (mA)
Tj=25oC
Inataneous Forward Voltage (V)
0.7
0.8
0.9
1
1.1
0.01 0.1 1 10 100
CT Total Capacitance (pF)
FIG4 Typical Capacitance vs Reverse Voltage
Reverse Voltage
(V)
FIG 2 Typical Reverse Characteristics
0.001
0.01
0.1
1
10
100
1000
0 0.5 1 1.5 2 2.5 3 3.5
Instantaneous Reverse Current (mA)
Inataneous Reverse Voltage (V)
Tj=25oC
Version : A11