DS16005 Rev. 11 - 2 1 of 3 S3A/B-S3M/B
www.diodes.com ãDiodes Incorporated
S3A/B - S3M/B
3.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
Features
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
A, B, D, G, J, K, M Designates SMC Package
Dim SMB SMC
Min Max Min Max
A3.30 3.94 5.59 6.22
B4.06 4.57 6.60 7.11
C1.96 2.21 2.75 3.18
D0.15 0.31 0.15 0.31
E5.00 5.59 7.75 8.13
G0.10 0.20 0.10 0.20
H0.76 1.52 0.76 1.52
J2.00 2.62 2.00 2.62
All Dimensions in mm
A
B
C
D
G
H
E
J
Maximum Ratings and Electrical Characteristics @ TA= 25°C unless otherwise specified
·Glass Passivated Die Construction
·Low Forward Voltage Drop and High Current Capability
·Surge Overload Rating to 100A Peak
·Ideally Suited for Automatic Assembly
·Lead Free Finish/RoHS Compliant (Note 3)
Mechanical Data
·Case: SMB/SMC
·Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
·Moisture sensitivity: Level 1 per J-STD-020C
·Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208
·Polarity: Cathode Band or Cathode Notch
·Marking: Type Number & Date Code, See Page 2
·Ordering Information: See Page 2
·Weight: SMB 0.093 grams (approximate)
SMC 0.21 grams (approximate)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic Symbol S3
A/AB
S3
B/BB
S3
D/DB
S3
G/GB
S3
J/JB
S3
K/KB
S3
M/MB Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
50 100 200 400 600 800 1000 V
RMS Reverse Voltage VR(RMS) 30 70 140 280 420 560 700 V
Average Rectified Output Current @ TT= 75°C IO3.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)
IFSM 100 A
Forward Voltage @ IF= 3.0A VFM 1.15 V
Peak Reverse Current @ TA= 25°C
at Rated DC Blocking Voltage @ TA= 125 °C IRM 10
250 µA
Typical Total Capacitance (Note 1) CT40 pF
Typical Thermal Resistance Junction to Terminal
(Note 2) RqJT 10 °C/W
Operating and Storage Temperature Range Tj, TSTG -65 to +150 °C
Notes: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
2. Thermal resistance: Junction to Terminal, unit mounted on PC board with 5.0 mm2(0.013 mm thick) copper pad as heat sink.
3. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7
.
SPICE MODELS: S3A S3B S3D S3G S3K S3M S3AB S3BB S3DB S3GB S3KB S3MB