All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
SPECIFICATIONS Burn-In & Test Socket
Burn-In Socket Series
BGA Type, Open Top, Type 2
0.80 mm [.031”] Pitch
90 Pos.
Mechanical
Durability: 10’000 cycles min.
Actuation force: 2.5kgf max.
Electrical
Current Rating: 1Amp/p in min.
Dielectric Withstanding Voltage: 650V A.C for 60 sec.
Insulation Resistance: 1000M
Ω
min.
Contact Resistance: 150m
Ω
max.
Hast: Pass 85
℃
at 85% RH, 50 hours duration
Temperature cycling: Pass -55 to 125
℃
, 1000 cycles
Bake : Pass 150
℃
for 168 hours
Physical
Cover & Base & Lid: Thermoplastic, UL 94V-0
Contact: Copper alloy
Contact Plating: See “ORDERING INFORMATION”
Operating Temperature: 150
℃
max.
DRAWING
ORDERING INFORMATION
PRODUCT NO.: 2 Q 0 0 * * 3 7 - 3 3 2 * - 1 0 F
2Q009037-3325-10F 90 12.0x8.0
2Q009037-3324-10F 90 11.5x11.0
2Q009037-3321-10F 90 12.5x10.0
2Q007237-332A-10F 72 19.5x11.5
2Q007237-3321-10F 72 12.5x10.0
P/N POS.
CHIP SPEC.
Pitch
3=0.80 mm
Contact Plating
7=15µ” Gold Plating
Design Type
2=Type #2
Tail Plating
3=Au
Chip/Burn-in Board
3=BGA/PGA
LF Code
F=Lead Free
Package
1=Soft Tray
Pick-up Design
0=None
Chip Spec.
1=12.5x10.0
4=11.5x11.0
5=12.0x8.0
A
=10.5x11.5
Pin Counts
0072=72 Pos.
0090=90 Pos.
