KIT ATION EVALU E L B AVAILA 19-3435; Rev 1; 12/10 SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch Features The MAX9994 high-linearity downconversion mixer provides 8.3dB gain, +26.2dBm IIP3, and 9.7dB NF for 1400MHz to 2200MHz UMTS/WCDMA, DCS, and PCS base-station receiver applications. With a wide LO range of 1400MHz to 2000MHz, the MAX9994 can be used in either high-side or low-side LO injection architectures, depending on the RF band of interest. Higher LO applications are supported by the MAX9996, which is pin-pin and functionally compatible with the MAX9994. In addition to offering excellent linearity and noise performance, the MAX9994 also yields a high level of component integration. This device includes a doublebalanced passive mixer core, an IF amplifier, a dualinput LO selectable switch, and an LO buffer. On-chip baluns are also integrated to allow for single-ended RF and LO inputs. The MAX9994 requires a nominal LO drive of 0dBm, and supply current is guaranteed to be below 235mA. 1400MHz to 2200MHz RF Frequency Range 1400MHz to 2000MHz LO Frequency Range (MAX9994) 1900MHz to 2400MHz LO Frequency Range (MAX9996) 40MHz to 350MHz IF Frequency Range 8.3dB Conversion Gain +26.2dBm Input IP3 +12.6dBm Input 1dB Compression Point 9.7dB Noise Figure 67dBc 2RF - 2LO Spurious Rejection at PRF = -10dBm Integrated LO Buffer Integrated RF and LO Baluns for Single-Ended Inputs Low -3dBm to +3dBm LO Drive Built-In SPDT LO Switch with 45dB LO1 to LO2 Isolation and 50ns Switching Time Pin Compatible with the MAX9984/MAX9986 815MHz to 995MHz Mixers Functionally Compatible with the MAX9993 External Current-Setting Resistors Provide Option for Operating Mixer in Reduced Power/Reduced Performance Mode The MAX9994/MAX9996 are pin compatible with the MAX9984/MAX9986 815MHz to 995MHz mixers, making this entire family of downconverters ideal for applications where a common PC board layout is used for both frequency bands. The MAX9994 is also functionally compatible with the MAX9993. The MAX9994 is available in a compact, 20-pin, thin QFN package (5mm x 5mm) with an exposed pad. Electrical performance is guaranteed over the extended -40C to +85C temperature range. Ordering Information Applications UMTS/LTE Base Stations PART TEMP RANGE PIN-PACKAGE MAX9994ETP+ -40C to +85C 20 Thin QFN-EP** 5mm 5mm bulk MAX9994ETP+T -40C to +85C 20 Thin QFN-EP** 5mm 5mm T/R TD-SCDMA/TD-LTE Base Stations DCS1800/PCS1900 EDGE Base Stations cdmaOneTM and cdma2000(R) Base Stations PHS/PAS Base Stations Predistortion Receivers Fixed Broadband Wireless Access Wireless Local Loop Private Mobile Radios Military Systems **EP = Exposed pad. +Denotes a lead(Pb)-free/RoHS-compliant package. T = Tape and reel. Pin Configuration/Functional Diagram and Typical Application Circuit appear at end of data sheet. Microwave Links Digital and Spread-Spectrum Communication Systems cdma2000 is a registered trademark of Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. 1 MAX9994 General Description MAX9994 SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS VCC to GND ...........................................................-0.3V to +5.5V IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (VCC + 0.3V) TAP ........................................................................-0.3V to +1.4V LO1, LO2, LEXT to GND........................................-0.3V to +0.3V RF, LO1, LO2 Input Power .............................................+12dBm RF (RF is DC shorted to GND through a balun) .................50mA Continuous Power Dissipation (TA = +70C) 20-Pin Thin QFN-EP (derate 20mW/C above +70C)..............1.8W JA (Note 1) ...................................................................+38C/W JC (Note 1) .....................................................................+8C/W Operating Temperature Range (Note 2) .....TC = -40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering 10s) ..................................+300C Soldering Temperature (reflow) .......................................+260C Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 2: TC is the temperature on the exposed pad of the package. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, VCC = +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to VCC through inductive chokes, R1 = 806, R2 = 549, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25C, unless otherwise noted.) PARAMETER SYMBOL Supply Voltage VCC Supply Current ICC LO_SEL Input Logic-Low VIL LO_SEL Input Logic-High VIH CONDITIONS MIN TYP MAX 4.75 5.00 5.25 V 206 235 mA 0.8 V 2 UNITS V RECOMMENDED AC OPERATING CONDITIONS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF Frequency Range fRF (Note 3) 1400 2200 MHz LO Frequency Range fLO (Note 3) 1400 2000 MHz IF Frequency Range fIF (Note 3) 40 350 MHz PLO (Note 3) -3 +3 dBm LO Drive Level 2 _______________________________________________________________________________________ SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch (Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, fLO = 1400MHz to 2000MHz, fIF = 200MHz, fRF > fLO, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1900MHz, fLO = 1700MHz, fIF = 200MHz, TC = +25C, unless otherwise noted.) (Notes 4, 5) PARAMETER Conversion Gain SYMBOL GC Input Third-Order Intercept Point (Note 6) TYP MAX 7.2 8.3 9.2 dB dB P1dB (Note 7) 12.6 dBm IIP3 Two tones: fRF1 = 2000MHz, fRF2 = 2001MHz, PRF = -5dBm/tone, fLO = 1800MHz, PLO = 0dBm, TA = +25C 26.2 dBm TC = -40C to +85C 0.5 dB Single sideband 9.7 dB PRF = 5dBm, fRF = 2000MHz, fLO = 1810MHz, f block = 2100MHz (Note 8) 19 dB NF Noise Figure Under-Blocking LO Drive 23.5 -3 2x2 2RF - 2LO Spurious Response at IF 3x3 LO1 to LO2 Isolation (Note 4) UNITS 0.75 Input IP3 Variation Over Temperature Noise Figure MIN TC = -40C to +85C Gain Variation Over Temperature Input Compression Point CONDITIONS PRF < +2dBm, TA = +25C (Note 6) 3RF - 3LO PRF = -10dBm +3 dBm 67 PRF = -5dBm 62 PRF = -10dBm 82 PRF = -5dBm 72 LO2 selected, 1500MHz < fLO < 1700MHz 40 52 LO1 selected, 1500MHz < fLO < 1700MHz 40 45 dBc dB Maximum LO Leakage at RF Port PLO = +3dBm -17 dBm Maximum LO Leakage at IF Port PLO = +3dBm -30 dBm 35 dB Minimum RF-to-IF Isolation LO Switching Time 50% of LOSEL to IF settled to within 2 RF Port Return Loss LO Port Return Loss IF Port Return Loss 50 ns 21 dB LO1/2 port selected, LO2/1 and IF terminated 16 LO1/2 port unselected, LO2/1 and IF terminated 26 LO driven at 0dBm, RF terminated into 50, differential 200 20 dB dB _______________________________________________________________________________________ 3 MAX9994 AC ELECTRICAL CHARACTERISTICS--fRF = 1700MHz TO 2200MHz, LOW-SIDE LO INJECTION MAX9994 SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch AC ELECTRICAL CHARACTERISTICS--fRF = 1455MHz, HIGH-SIDE LO INJECTION (Typical Application Circuit, RF and LO ports are driven from 50 sources, fRF < fLO, VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1455MHz, fLO = 1625MHz, fIF = 170MHz, TC = +25C, LO2 is selected, unless otherwise noted.) (Note 5) PARAMETER SYMBOL Conversion Gain GC Input Third-Order Intercept Point IIP3 Input Compression Point (Note 7) IP1dB 2LO - 2RF Spurious Response 2x2 LO-to-IF Leakage CONDITIONS MIN Two tones: fRF1 = 1455MHz, fRF2 = 1456MHz, PRF = -5dBm/tone TYP MAX UNITS 8.8 dB 25.6 dBm 12.7 dBm PRF = -10dBm 71.4 PRF = -5dBm 66.4 LOSEL = LO2 -30.2 dBc dBm AC ELECTRICAL CHARACTERISTICS--fRF = 1500MHz, HIGH-SIDE LO INJECTION (Typical Application Circuit, RF and LO ports are driven from 50 sources, fRF < fLO, VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1500MHz, fLO = 1650MHz, fIF = 150MHz, TC = +25C, LO1 is selected, unless otherwise noted.) (Note 5) PARAMETER Conversion Gain Input Third-Order Intercept Point SYMBOL IIP3 Input Compression Point (Note 7) IP1dB 2LO - 2RF Spurious Response 2x2 LO-to-IF Leakage Note 3: Note 4: Note 5: Note 6: Note 7: Note 8: 4 CONDITIONS GC Two tones: fRF1 = 1500MHz, fRF2 = 1501MHz, PRF = -5dBm/tone MIN TYP MAX UNITS 8.9 dB 25.5 dBm 12.5 dBm PRF = -10dBm 70.4 PRF = -5dBm 65.4 -33.2 dBc dBm Operation outside this range is possible, but with degraded performance of some parameters. Guaranteed by design and characterization. All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit. Production tested. Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm. Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all SNR degradations in the mixer, including the LO noise as defined in Application Note 2021: Specifications and Measurement of Local Oscillator Noise in Integrated Circuit Base Station Mixers. _______________________________________________________________________________________ SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch TC = +25C MAX9994 toc02 PLO = -3dBm, 0dBm, +3dBm 8 6 1800 1950 2100 2250 2400 1650 RF FREQUENCY (MHz) INPUT IP3 vs. RF FREQUENCY 2250 1500 2400 TC = -25C 24 TC = +85C PLO = -3dBm, 0dBm 24 1800 1950 2100 2250 1650 RF FREQUENCY (MHz) 26 VCC = 4.75V 25 VCC = 5.0V, 5.25V 24 1800 1950 2100 2250 1500 2400 1650 NOISE FIGURE vs. RF FREQUENCY TC = +85C 11 PLO = -3dBm TC = +25C 9 TC = -25C 8 10 PLO = 0dBm 9 PLO = +3dBm 8 2100 2250 2400 12 11 NOISE FIGURE (dB) NOISE FIGURE (dB) 11 10 1950 NOISE FIGURE vs. RF FREQUENCY NOISE FIGURE vs. RF FREQUENCY 12 MAX9994 toc07 12 1800 RF FREQUENCY (MHz) RF FREQUENCY (MHz) 13 2400 22 1500 2400 2250 23 MAX9994 toc08 1650 2100 27 22 21 1950 INPUT IP3 vs. RF FREQUENCY 26 25 1800 28 23 22 1500 1650 RF FREQUENCY (MHz) PLO = +3dBm 27 INPUT IP3 (dBm) INPUT IP3 (dBm) 2100 INPUT IP3 vs. RF FREQUENCY 26 NOISE FIGURE (dB) 1950 28 MAX9994 toc04 TC = +25C 27 23 1800 RF FREQUENCY (MHz) 28 25 VCC = 4.75V, 5.0V, 5.25V 6 1500 INPUT IP3 (dBm) 1650 MAX9994 toc05 1500 8 7 7 6 9 MAX9994 toc06 TC = +85C 9 10 MAX9994 toc09 8 CONVERSION GAIN vs. RF FREQUENCY 11 CONVERSION GAIN (dB) 9 7 10 CONVERSION GAIN (dB) CONVERSION GAIN (dB) MAX9994 toc01 TC = -25C 10 CONVERSION GAIN vs. RF FREQUENCY 11 MAX9994 toc03 CONVERSION GAIN vs. RF FREQUENCY 11 VCC = 5.25V 10 9 VCC = 4.75V VCC = 5.0V 8 7 7 7 6 1500 1650 1800 1950 2100 RF FREQUENCY (MHz) 2250 2400 1500 1650 1800 1950 2100 RF FREQUENCY (MHz) 2250 2400 1500 1650 1800 1950 2100 2250 2400 RF FREQUENCY (MHz) _______________________________________________________________________________________ 5 MAX9994 Typical Operating Characteristics (MAX9994 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, LO is Low-Side Injected for a 200MHz IF, unless otherwise noted.) Typical Operating Characteristics (continued) (MAX9994 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, LO is Low-Side Injected for a 200MHz IF, unless otherwise noted.) 65 60 55 TC = +85C 50 70 65 60 PLO = 0dBm PLO = -3dBm 50 45 1950 2100 2250 2400 1650 RF FREQUENCY (MHz) 3RF - 3LO RESPONSE vs. RF FREQUENCY 80 75 70 60 1950 2100 2250 PRF = -5dBm TC = +25C 1950 2100 85 80 75 70 PLO = -3dBm, 0dBm, +3dBm 65 2250 1650 1800 1950 2100 2250 10 12 PLO = -3dBm, 0dBm, +3dBm 1950 2100 RF FREQUENCY (MHz) 80 75 70 65 VCC = 5.25V 1500 2250 2400 VCC = 5.0V 1650 1800 1950 2100 2250 15 VCC = 5.25V 14 2400 13 12 11 VCC = 4.75V VCC = 5.0V 10 10 1800 2400 INPUT P1dB vs. RF FREQUENCY 11 1650 VCC = 4.75V 85 2400 13 TC = +25C 11 MAX9994 toc12 PRF = -5dBm 90 MAX9994 toc17 14 INPUT P1dB (dBm) 12 2250 3RF - 3LO RESPONSE vs. RF FREQUENCY INPUT P1dB vs. RF FREQUENCY 13 2100 RF FREQUENCY (MHz) 15 MAX9994 toc16 TC = +85C 1950 55 1500 2400 1800 60 INPUT P1dB vs. RF FREQUENCY 1500 1650 RF FREQUENCY (MHz) 15 TC = -25C VCC = 4.75V, 5.0V, 5.25V 95 60 RF FREQUENCY (MHz) 14 55 1500 INPUT P1dB (dBm) 1800 60 2400 55 1650 65 RF FREQUENCY (MHz) 90 55 1500 70 3RF - 3LO RESPONSE vs. RF FREQUENCY 3RF - 3LO RESPONSE (dBc) 3RF - 3LO RESPONSE (dBc) TC = +85C TC = -25C 1800 95 MAX9994 toc13 PRF = -5dBm 90 65 75 RF FREQUENCY (MHz) 95 85 80 45 1500 3RF - 3LO RESPONSE (dBc) 1800 MAX9994 toc14 1650 PRF = -5dBm 50 45 1500 6 MAX9994 toc11 PLO = +3dBm 55 85 MAX9994 toc15 TC = +25C TC = -25C PRF = -5dBm 75 90 2RF - 2LO RESPONSE (dBc) 75 70 80 2RF - 2LO RESPONSE (dBc) 2RF - 2LO RESPONSE (dBc) MAX9994 toc10 PRF = -5dBm 80 2RF - 2LO RESPONSE vs. RF FREQUENCY 2RF - 2LO RESPONSE vs. RF FREQUENCY 85 MAX9994 toc18 2RF - 2LO RESPONSE vs. RF FREQUENCY 85 INPUT P1dB (dBm) MAX9994 SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch 1500 1650 1800 1950 2100 RF FREQUENCY (MHz) 2250 2400 1500 1650 1800 1950 2100 RF FREQUENCY (MHz) _______________________________________________________________________________________ 2250 2400 SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch TC = -25C 45 TC = +85C TC = +25C 40 35 PLO = +3dBm 50 45 PLO = -3dBm PLO = 0dBm 40 1450 1600 1750 1900 2050 2200 MAX9994 toc21 55 50 45 VCC = 4.75V, 5.0V, 5.25V 40 35 35 1300 1450 1600 1750 1900 2050 1300 2200 1450 1600 1750 1900 2050 LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT vs. LO FREQUENCY -30 -30 -35 -40 TC = +25C -45 -25 LO LEAKAGE (dBm) TC = -25C PLO = -3dBm -35 -40 -45 -50 -50 -55 -55 2200 -20 MAX9994 toc24 -25 -20 -25 LO LEAKAGE (dBm) TC = +85C MAX9994 toc23 -20 MAX9994 toc22 1300 LO LEAKAGE (dBm) MAX9994 toc20 55 LO SWITCH ISOLATION (dB) MAX9994 toc19 LO SWITCH ISOLATION (dB) 55 50 LO SWITCH ISOLATION vs. LO FREQUENCY LO SWITCH ISOLATION vs. LO FREQUENCY LO SWITCH ISOLATION (dB) LO SWITCH ISOLATION vs. LO FREQUENCY VCC = 5.25V -30 -35 VCC = 5.0V -40 VCC = 4.75V -45 PLO = 0dBm -50 PLO = +3dBm -60 -60 1450 1600 1750 1900 2050 1450 1600 1750 1900 2050 1450 1600 1750 1900 2050 LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT vs. LO FREQUENCY TC = -25C, +25C, +85C -25 -30 -15 -20 PLO = -3dBm, 0dBm, +3dBm -25 1600 1750 1900 LO FREQUENCY (MHz) 2050 2200 MAX9994 toc27 -15 VCC = 5.0V -20 VCC = 4.75V -25 VCC = 5.25V -30 -30 1450 2200 -10 LO LEAKAGE AT RF PORT (dBm) -20 -10 MAX9994 toc26 MAX9994 toc25 -15 1300 1300 2200 LO FREQUENCY (MHz) -10 LO LEAKAGE AT RF PORT (dBm) -55 1300 2200 LO LEAKAGE AT RF PORT (dBm) 1300 1300 1450 1600 1750 1900 LO FREQUENCY (MHz) 2050 2200 1300 1450 1600 1750 1900 2050 2200 LO FREQUENCY (MHz) _______________________________________________________________________________________ 7 MAX9994 Typical Operating Characteristics (continued) (MAX9994 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, LO is Low-Side Injected for a 200MHz IF, unless otherwise noted.) Typical Operating Characteristics (continued) (MAX9994 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, LO is Low-Side Injected for a 200MHz IF, unless otherwise noted.) 40 TC = +25C MAX9994 toc29 PLO = 0dBm 50 45 40 PLO = -3dBm 1650 1800 1950 2100 2250 2400 VCC = 5.25V 1500 1650 1800 1950 2100 2250 1500 2400 1650 1800 1950 2100 2250 RF FREQUENCY (MHz) RF FREQUENCY (MHz) RF PORT RETURN LOSS vs. RF FREQUENCY IF PORT RETURN LOSS vs. IF FREQUENCY LO SELECTED RETURN LOSS vs. LO FREQUENCY 10 15 20 25 PLO = -3dBm, 0dBm, +3dBm 10 15 25 30 35 45 50 1950 VCC = 5.0V 40 40 1800 VCC = 5.25V 20 35 1650 2100 2250 2400 10 PLO = +3dBm 15 20 PLO = -3dBm 25 PLO = 0dBm 30 40 50 100 150 200 250 300 1300 350 1500 SUPPLY CURRENT vs. TEMPERATURE (TC) 5 230 SUPPLY CURRENT (mA) 10 15 20 PLO = -3dBm, 0dBm, +3dBm 30 MAX9994 toc35 240 MAX9994 toc34 0 1700 VCC = 5.25V 220 210 200 190 35 VCC = 5.0V VCC = 4.75V 180 40 1300 1500 1700 1900 LO FREQUENCY (MHz) 2100 2300 1900 LO FREQUENCY (MHz) IF FREQUENCY (MHz) LO UNSELECTED RETURN LOSS vs. LO FREQUENCY LO UNSELECTED RETURN LOSS (dB) 5 35 VCC = 4.75V RF FREQUENCY (MHz) 25 0 LO SELECTED RETURN LOSS (dB) IF PORT RETURN LOSS (dB) 5 2400 MAX9994 toc33 0 MAX9994 toc31 5 1500 40 RF FREQUENCY (MHz) 0 30 45 30 30 1500 VCC = 5.0V 50 35 35 TC = -25C 30 8 VCC = 4.75V 55 RF-TO-IF ISOLATION (dB) 45 60 MAX9994 toc32 RF-TO-IF ISOLATION (dB) 50 PLO = +3dBm 55 RF-TO-IF ISOLATION (dB) TC = +85C 35 60 MAX9994 toc28 60 55 RF-TO-IF ISOLATION vs. RF FREQUENCY RF-TO-IF ISOLATION vs. RF FREQUENCY MAX9994 toc30 RF-TO-IF ISOLATION vs. RF FREQUENCY RF PORT RETURN LOSS (dB) MAX9994 SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch -30 -10 10 30 50 70 90 TEMPERATURE (C) _______________________________________________________________________________________ 2100 2300 SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch 8 26 25 7 fIF FREQ VARIES WITH fRF PRF = -5dBm 2LO - 2RF RESPONSE (dBc) fIF VARIES WITH fRF PRF = -5dBm/TONE INPUT IP3 (dBm) 9 2LO - 2RF RESPONSE vs. RF FREQUENCY 80 MAX9994 toc37 MAX9994 toc36 fIF VARIES WITH fRF 24 1450 1455 1465 1460 70 60 50 1445 1450 RF FREQUENCY (MHz) 1455 1460 1465 1445 1450 RF FREQUENCY (MHz) 1465 13 12 -20 MAX9994 toc40 fIF FREQ VARIES WITH fRF 1460 LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE AT IF PORT (dBm) 14 1455 RF FREQUENCY (MHz) INPUT P1dB vs. FREQUENCY MAX9994 toc39 1445 P1dB (dBm) CONVERSION GAIN (dB) INPUT IP3 vs. RF FREQUENCY 27 MAX9994 toc38 CONVERSION GAIN vs. FREQUENCY 10 -30 -40 -50 11 1445 1450 1455 1460 RF FREQUENCY (MHz) 1465 1500 1600 1700 1800 LO FREQUENCY (MHz) _______________________________________________________________________________________ 9 MAX9994 Typical Operating Characteristics (continued) (MAX9994 Typical Application Circuit, VCC = +5V, PLO = 0dBm, LO2 selected, PRF = -5dBm, fRF = 1400MHz to 1700MHz, LO is High-Side Injected for a 170MHz IF, unless otherwise noted.) Typical Operating Characteristics (continued) (MAX9994 Typical Application Circuit, VCC = +5V, PLO = 0dBm, LO1 selected, PRF = -5dBm, fRF = 1400MHz to 1700MHz, LO is High-Side Injected for a 150MHz IF, unless otherwise noted.) 8 7 fIF VARIES WITH fRF PRF = -5dBm 2LO - 2RF RESPONSE (dBc) fIF VARIES WITH fRF PRF = -5dBm/TONE INPUT IP3 (dBm) 9 80 MAX9994 toc42 MAX9994 toc41 fIF VARIES WITH fRF 26 25 1479 1529 1579 70 60 50 24 1429 1501 1496 RF FREQUENCY (MHz) 1506 1501 1496 1511 LO LEAKAGE AT IF PORT vs. LO FREQUENCY P1dB (dBm) 13 12 -20 MAX9994 toc45 fIF VARIES WITH fRF LO LEAKAGE AT IF PORT (dBm) MAX9994 toc44 14 1506 RF FREQUENCY (MHz) RF FREQUENCY (MHz) INPUT P1dB vs. RF FREQUENCY -30 -40 -50 11 1496 1501 1506 RF FREQUENCY (MHz) 10 2LO - 2RF RESPONSE vs. RF FREQUENCY INPUT IP3 vs. RF FREQUENCY 27 MAX9994 toc43 CONVERSION GAIN vs. FREQUENCY 10 CONVERSION GAIN (dB) MAX9994 SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch 1511 1500 1600 1700 1800 LO FREQUENCY (MHz) ______________________________________________________________________________________ 1511 SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch PIN NAME FUNCTION 1, 6, 8, 14 VCC 2 RF Single-Ended 50 RF Input. This port is internally matched and DC shorted to GND through a balun. Requires an external DC-blocking capacitor. 3 TAP Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the Typical Application Circuit. 4, 5, 10, 12, 13, 17 GND Ground 7 LOBIAS 9 LOSEL 11 LO1 15 LO2 Local Oscillator Input 2. Drive LOSEL high to select LO2. 16 LEXT External Inductor Connection. Connect a low-ESR, 10nH inductor from LEXT to GND. This inductor carries approximately 100mA DC current. 18, 19 IF-, IF+ 20 IFBIAS -- EP Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the Typical Application Circuit. Bias Resistor for Internal LO Buffer. Connect a 549 1% resistor from LOBIAS to the power supply. Local Oscillator Select. Logic control input for selecting LO1 or LO2. Local Oscillator Input 1. Drive LOSEL low to select LO1. Differential IF Outputs. Each output requires external bias to VCC through an RF choke (see the Typical Application Circuit). IF Bias Resistor Connection for IF Amplifier. Connect an 806 resistor from IFBIAS to GND. Exposed Pad. Solder the exposed pad to the ground plane using multiple vias. Detailed Description The MAX9994 high-linearity downconversion mixer provides 8.3dB of conversion gain and 26.2dBm of IIP3, with a typical 9.7dB noise figure. The integrated baluns and matching circuitry allow for 50 single-ended interfaces to the RF and the two LO ports. A single-pole, double-throw (SPDT) switch provides 50ns switching time between the two LO inputs with 45dB of LO-to-LO isolation. Furthermore, the integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the MAX9994's inputs to a range of -3dBm to +3dBm. The IF port incorporates a differential output, which is ideal for providing enhanced IIP2 performance. Specifications are guaranteed over broad frequency ranges to allow for use in WCDMA, TD-SCDMA, LTE, TD-LTE, cdma2000, and 2G/2.5G/3G DCS1800 and PCS1900 base stations. The MAX9994 is specified to operate over a 1400MHz to 2200MHz RF frequency range, a 1400MHz to 2000MHz LO frequency range, and a 40MHz to 350MHz IF frequency range. Operation beyond these ranges is possible; see the Typical Operating Characteristics for additional details. With a wide LO range of 1400MHz to 2000MHz, the MAX9994 can be used in either high-side or low-side LO injection architectures, depending on the RF band of interest. Higher LO applications are supported by the MAX9996, which is pin-pin and functionally compatible with the MAX9994. RF Input and Balun The MAX9994 RF input is internally matched to 50, requiring no external matching components. A DCblocking capacitor is required because the input is internally DC shorted to ground through the on-chip balun. Input return loss is typically 21dB over the entire 1700MHz to 2200MHz RF frequency range. LO Inputs, Buffer, and Balun The MAX9994 can be used for either high-side or lowside injection applications with a 1400MHz to 2000MHz LO frequency range. For a device with a 1900MHz to 2400MHz LO frequency range, refer to the MAX9996 data sheet. As an added feature, the MAX9994 includes an internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is ______________________________________________________________________________________ 11 MAX9994 Pin Description MAX9994 SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch switched in. LO switching time is typically less than 50ns, which is more than adequate for virtually all GSM applications. If frequency hopping is not employed, set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic-high selects LO2, logic-low selects LO1. LO1 and LO2 inputs are internally matched to 50, requiring only a 22pF DC blocking capacitor. A two-stage internal LO buffer allows a wide input power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm. The on-chip low-loss balun, along with an LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip. High-Linearity Mixer The core of the MAX9994 is a double-balanced, highperformance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2RF - 2LO rejection, and NF performance is typically 26.2dBm, 67dBc, and 9.7dB, respectively. Differential IF Output Amplifier The MAX9994 mixer has a 40MHz to 350MHz IF frequency range. The differential, open-collector IF output ports require external pullup inductors to VCC. Note that these differential outputs are ideal for providing enhanced 2RF - 2LO rejection performance. Singleended IF applications require a 4:1 balun to transform the 200 differential output impedance to a 50 singleended output. After the balun, the IF return loss is better than 15dB. Applications Information Input and Output Matching The RF and LO inputs are internally matched to 50. No matching components are required. Return loss at the RF port is typically 21dB over the 1700MHz to 2200MHz input range, and the return loss at the LO port is typically better than 14dB (1400MHz to 2000MHz). RF and LO inputs require only DC-blocking capacitors for interfacing. The IF output impedance is 200 (differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance down to a 50 singleended output (see the Typical Application Circuit). 12 Bias Resistors Bias currents for the LO buffer and the IF amplifier are optimized by fine tuning resistors R1 and R2. If reduced current is required at the expense of performance, contact the factory for details. If the 1% bias resistor values are not readily available, substitute standard 5% values. LEXT Inductor Short LEXT to ground using a 0 resistor. For applications requiring improved RF-to-IF and LO-to-IF isolation, a 10nH inductor (L3) can be used in place of the 0 resistor. However, in order to ensure stable operation, the mixer IF ports must be presented with a low common-mode load impedance. Contact the factory for details. Since approximately 100mA flows through LEXT, it is important to use a low-DCR wire-wound inductor. Layout Considerations A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed pad MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lower level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX9994 evaluation kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com. Power-Supply Bypassing Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin and TAP with the capacitors shown in the Typical Application Circuit; see Table 1. Place the TAP bypass capacitor to ground within 100 mils of the TAP pin. Exposed Pad RF/Thermal Considerations The exposed pad (EP) of the MAX9994's 20-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PCB on which the MAX9994 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a lowinductance path to electrical ground. The EP MUST be soldered to a ground plane on the PCB, either directly or through an array of plated via holes. ______________________________________________________________________________________ SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9994 Table 1. Component List Referring to the Typical Application Circuit COMPONENT VALUE C1 4pF Microwave capacitor (0603) DESCRIPTION C2, C6, C7, C8, C10, C12 22pF Microwave capacitors (0603) C3, C5, C9, C11 0.01F Microwave capacitors (0603) C4 10pF Microwave capacitor (0603) C13, C14 150pF Microwave capacitors (0603) Microwave capacitor (0402) C15 150pF L1, L2 470nH Wire-wound high-Q inductors (0805) L3 10nH Wire-wound high-Q inductor (0603) R1 806 1% resistor (0603) R2 549 1% resistor (0603) R3 7.15 1% resistor (1206) T1 4:1 balun IF balun U1 MAX9994 Maxim IC 16 LEXT 17 GND 18 IF- 19 IF+ + 20 IFBIAS Pin Configuration/Functional Diagram VCC 1 15 LO2 RF 2 MAX9994 14 VCC 11 LO1 VCC VCC GND 10 GND 5 LOSEL 9 12 GND 8 GND 4 LOBIAS 7 13 GND 6 TAP 3 ______________________________________________________________________________________ 13 SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9994 Typical Application Circuit VCC T1 3 IF OUTPUT 6 R3 L1 2 L2 C3 C2 VCC RF C5 TAP C4 GND LEXT C12 1 15 C1 RF INPUT 16 IF18 19 IF+ IFBIAS L3 20 VCC 4 1 C15 R1 GND C14 17 C13 MAX9994 2 14 3 13 4 12 5 11 LO2 LO2 INPUT VCC VCC C11 GND GND LO1 INPUT 10 LO1 GND 9 LOSEL 8 VCC VCC LOBIAS 6 7 C10 GND R2 VCC C6 LOSEL INPUT C7 C8 VCC C9 Chip Information PROCESS: SiGe BiCMOS 14 Package Information For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 20 TQFN-EP T2055+3 21-0140 90-0008 ______________________________________________________________________________________ SiGe High-Linearity, 1400MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch REVISION NUMBER REVISION DATE 0 10/04 Initial release 1 12/10 Updated Title, General Description, Ordering Information, Absolute Maximum Ratings, Electrical Characteristics, Typical Operating Characteristics, Pin Description, General Description, and Applications Information sections DESCRIPTION PAGES CHANGED -- 1-12 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 15 (c) 2010 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc. MAX9994 Revision History