BAW56SRAZ - NEXPERIA - Pdf.Support

BAW56SRA

Quad high-speed switching diodes

14 September 2018 Product data sheet

1. General description

Quad high-speed switching diodes with common anode configurations encapsulated in a leadless

ultra small DFN1412-6 (SOT1268) Surface-Mounted Device (SMD) plastic package.

2. Features and benefits

•High switching speed: trr ≤ 4 ns

•Low leakage current

•Reverse voltage VR ≤ 90 V

•Low capacitance Cd ≤ 2 pF

•Ultra small SMD plastic package

•AEC-Q101 qualified

3. Applications

•High-speed switching

•General-purpose switching

4. Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Per diode

IFforward current single diode loaded; Tamb = 25 °C [1] - - 375 mA

IRreverse current VR = 80 V; pulsed; Tj = 25 °C - - 0.5 µA

VFforward voltage IF = 150 mA; tp ≤ 300 µs; δ ≤ 0.02;

Tj = 25 °C

- - 1.25 V

VRreverse voltage Tj = 25 °C - - 90 V

trr reverse recovery time IF = 10 mA; IR = 10 mA; RL = 100 Ω;

IR(meas) = 1 mA; Tamb = 25 °C

- - 4 ns

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

Nexperia BAW56SRA

Quad high-speed switching diodes

5. Pinning information

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphic symbol

1 K1 cathode (diode 1)

2 K2 cathode (diode 2)

3 A3,4 com. anode (diodes 3, 4)

4 K3 cathode (diode 3)

5 K4 cathode (diode 4)

6 A1,2 com. anode (diodes 1, 2)

7 A1,2 com. anode (diodes 1, 2)

8 A3,4 com. anode (diodes 3, 4)

Transparent top view

1 6

DFN1412-6

(SOT1268)

aaa-026796

A3,4 K3

A1,2

6. Ordering information

Table 3. Ordering information

PackageType number

Name Description Version

BAW56SRA DFN1412-6 plastic, thermal enhanced ultra thin small outline package; no

leads; 6 terminals; 1.4 mm x 1.2 mm x 0.47 mm body

SOT1268

7. Marking

Table 4. Marking codes

Type number Marking code

BAW56SRA A2

Product data sheet 14 September 2018 2 / 11

Nexperia BAW56SRA

Quad high-speed switching diodes

8. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

VRreverse voltage Tj = 25 °C - 90 V

single diode loaded; Tamb = 25 °C [1] - 375 mAIFforward current

double diodes loaded; Tamb = 25 °C [1] - 220 mA

tp = 100 µs; Tj(init) = 25 °C; square wave - 4 A

tp = 1 ms; Tj(init) = 25 °C; square wave - 1.5 A

IFSM non-repetitive peak

forward current

tp = 1 s; Tj(init) = 25 °C; square wave - 0.5 A

IFRM repetitive peak forward

current

tp ≤ 0.5 ms; δ ≤ 0.25 - 1 A

Per device; one diode loaded

[1] - 410 mWPtot total power dissipation Tamb ≤ 25 °C

[2] - 610 mW

Tjjunction temperature - 150 °C

Tamb ambient temperature -55 150 °C

Tstg storage temperature -65 150 °C

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated mounting pad for cathode 1cm2.

Tamb (°C)

17512525 150100500 75

aaa-026770

0.2

0.1

0.3

0.4

(A)

(1)

(2)

(1) single diode loaded

(2) double diode loaded

Fig. 1. Forward current as a function of ambient temperature; derating curve

Product data sheet 14 September 2018 3 / 11

Nexperia BAW56SRA

Quad high-speed switching diodes

9. Thermal characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

[1] - - 305 K/WRth(j-a) thermal resistance from

junction to ambient

in free air

[2] - - 205 K/W

Rth(j-sp) thermal resistance from

junction to solder point

[3] - - 40 K/W

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for cathode 1cm2.

[3] Soldering point of anode tab.

aaa-025767

10-5 1010-2

10-4 102

10-1

tp (s)

10-3 103

102

103

Zth(j-a)

(K/W)

duty cycle = 1

0.75

0.5

0.33

0.25 0.2

0.1

0.05

0.02

0.01

FR4 PCB, standard footprint

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

aaa-025766

10-5 1010-2

10-4 102

10-1

tp (s)

10-3 103

102

103

Zth(j-a)

(K/W)

duty cycle = 1

0.01

0.02

0.05

0.1

0.33

0.2

0.25

0.5

0.75

FR4 PCB, mounting pad for cathode 1 cm²

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

Product data sheet 14 September 2018 4 / 11

Nexperia BAW56SRA

Quad high-speed switching diodes

10. Characteristics

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Per diode

IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02;

Tj = 25 °C

- - 715 mV

IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02;

Tj = 25 °C

- - 855 mV

IF = 50 mA; tp ≤ 300 µs; δ ≤ 0.02;

Tj = 25 °C

- - 1 V

VFforward voltage

IF = 150 mA; tp ≤ 300 µs; δ ≤ 0.02;

Tj = 25 °C

- - 1.25 V

VR = 25 V; pulsed; Tj = 25 °C - - 30 nA

VR = 80 V; pulsed; Tj = 25 °C - - 0.5 µA

VR = 25 V; pulsed; Tj = 150 °C - - 30 µA

IRreverse current

VR = 80 V; pulsed; Tj = 150 °C - - 150 µA

Cddiode capacitance VR = 0 V; f = 1 MHz; Tj = 25 °C - - 2 pF

trr reverse recovery time IF = 10 mA; IR = 10 mA; RL = 100 Ω;

IR(meas) = 1 mA; Tamb = 25 °C

- - 4 ns

VFRM peak forward recovery

voltage

IF = 10 mA; tr = 20 ns - - 1.75 V

aaa-020906

10-3

10-2

10-1

(A)

10-4

VF (V)

0.0 2.01.50.5 1.0

(1)

(2)

(3) (4)

(1) Tj = 150 °C

(2) Tj = 85 °C

(3) Tj = 25 °C

(4) Tj = −40 °C

Fig. 4. Forward current as a function of forward

voltage; typical values

aaa-020907

10-3

10-4

10-5

10-6

10-7

10-8

10-9

10-10

(A)

10-11

VR (V)

0 1008040 6020

(1)

(2)

(3)

(4)

(5)

(1) Tj = 150 °C

(2) Tj = 125 °C

(3) Tj = 85 °C

(4) Tj = 25 °C

(5) Tj = −40 °C

Fig. 5. Reverse current as a function of reverse

voltage; typical values

Product data sheet 14 September 2018 5 / 11

Nexperia BAW56SRA

Quad high-speed switching diodes

VR (V)

0 252010 155

aaa-020908

1.0

0.5

1.5

2.0

(pF)

0.0

f = 1MHz; Tamb = 25 °C

Fig. 6. Diode capacitance as a function of reverse

voltage; typical values

aaa-020909

tp (ms)

10-1 103

102

1 10

IFSM

(A)

10-1

Based on square wave currents.

Tamb = 25 °C

Fig. 7. Non-repetitive forward current as a function of

pulse duration; maximum values

11. Test information

trr

(1)

+ IF

output signal

trtp

10 %

90 %

input signal

V = VR + IF × RS

RS = 50 ΩIF

D.U.T.

Ri = 50 Ω

SAMPLING

OSCILLOSCOPE

mga881

(1) IR = 1 mA

Input signal: reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty cycle δ = 0.05

Oscilloscope: rise time tr = 0.35 ns

Fig. 8. Reverse recovery time test circuit and waveforms

10 %

90 %

input signal

RS = 50 Ω

Ri = 50 Ω

OSCILLOSCOPE

1 kΩ 450 Ω

D.U.T.

mga882

VFR

output signal

Input signal: forward pulse rise time tr = 20 ns; forward current pulse duration tp ≥ 100 ns; duty cycle δ ≤ 0.005

Fig. 9. Forward recovery voltage test circuit and waveforms

Quality information

This product has been qualified in accordance with the Automotive Electronics Council (AEC)

standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in

automotive applications.

Product data sheet 14 September 2018 6 / 11

Nexperia BAW56SRA

Quad high-speed switching diodes

12. Package outline

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOT1268 - - -

sot1268_po

18-08-23

18-09-11

Note

1. Dimension A is including plating thickness.

0 1 mm

scale

detail X

pin 1

index area

pin 1

index area

(2×)

E A

(6×)

A B

DFN1412-6: plastic thermal enhanced ultra thin small outline package; no leads;

6 terminals; body: 1.4 x 1.2 x 0.47 mm SOT1268

Unit(1)

min

nom

max

1.35 0.43

0.195

0.145

0.245

Dimensions (mm are the original dimensions)

A1b

0.15

D D1e e1L

0.16

0.10

0.22

0.50

0.47

0.44

0.04

0.00

1.45

1.40

0.530.25

0.20

1.15

1.25

E E1

0.32

0.42

0.350.50.48 1.20 0.37

V Y Y1

0.1

(6×)

(2×)

(6×)

0.05 0.05

Fig. 10. Package outline DFN1412-6 (SOT1268)

Product data sheet 14 September 2018 7 / 11

Nexperia BAW56SRA

Quad high-speed switching diodes

13. Soldering

SOT1268Footprint information for reflow soldering of DFN1412-6 package

sot1268_fr

occupied area

solder paste

solder resist

solder lands

Issue date

Dimensions in mm

16-04-18

16-09-02

0.20.3

0.5

1.3

1.4

1.6

0.25

0.17

1.23

0.43

0.711.411.511.71

0.3 0.35

0.27

0.17

0.37

Fig. 11. Reflow soldering footprint for DFN1412-6 (SOT1268)

Product data sheet 14 September 2018 8 / 11

Nexperia BAW56SRA

Quad high-speed switching diodes

14. Revision history

Table 8. Revision history

Data sheet ID Release date Data sheet status Change notice Supersedes

BAW56SRA v.2 20180914 Product data sheet - BAW56SRA v.1

•Package outline drawing updated: Unit T added

BAW56SRA v.1 20170626 Product data sheet - -

Product data sheet 14 September 2018 9 / 11

Nexperia BAW56SRA

Quad high-speed switching diodes

15. Legal information

Data sheet status

Document status

[1][2]

Product

status [3]

Definition

Objective [short]

data sheet

Development This document contains data from

the objective specification for

product development.

Preliminary [short]

data sheet

Qualification This document contains data from

the preliminary specification.

Product [short]

data sheet

Production This document contains the product

specification.

[1] Please consult the most recently issued document before initiating or

completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the internet at https://www.nexperia.com.

Definitions

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warranties as to the accuracy or completeness of information included herein

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office. In case of any inconsistency or conflict with the short data sheet, the

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Suitability for use in automotive applications — This Nexperia product

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Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. Nexperia makes no representation

or warranty that such applications will be suitable for the specified use

without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using Nexperia products, and Nexperia accepts no liability for

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Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

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Notice: All referenced brands, product names, service names and

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Product data sheet 14 September 2018 10 / 11

Nexperia BAW56SRA

Quad high-speed switching diodes

Contents

1. General description......................................................1

2. Features and benefits.................................................. 1

3. Applications.................................................................. 1

4. Quick reference data....................................................1

5. Pinning information......................................................2

6. Ordering information....................................................2

7. Marking.......................................................................... 2

8. Limiting values............................................................. 3

9. Thermal characteristics............................................... 4

10. Characteristics............................................................ 5

11. Test information.......................................................... 6

12. Package outline.......................................................... 7

13. Soldering..................................................................... 8

14. Revision history..........................................................9

15. Legal information......................................................10

For more information, please visit: http://www.nexperia.com

For sales office addresses, please send an email to: salesaddresses@nexperia.com

Date of release: 14 September 2018

Product data sheet 14 September 2018 11 / 11