SURFACE MOUNT 5.0 Watt ZENER DIODES
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SCOTTSDALE DIVISION
SMBG5333 thru SMBG5388B, e3
SMBJ5333 thru SMBJ5388B, e3
SMBG(J)533–5388B, e3
DESCRIPTION APPEARANCE
The SMBJ5333-5388B or SMBG5333-5388B series of surface mount 5.0
watt Zeners provides voltage regulation in a selection from 3.3 to 200 volts
with different tolerances as identified by suffix letter on the part number. It is
equivalent to the JEDEC registered 1N5333 thru 1N5388B with identical
electrical characteristics and testing as well as RoHS Compliant with an e3
suffix. It is available in J-bend design (SMBJ) with the DO-214AA package
for greater PC board mounting density or in Gull-wing design (SMBG) in the
DO-215AA for visible solder connections. These plastic encapsulated
Zeners have a moisture classification of Level 1 with no dry pack required
and are also available in military equivalent screening levels by adding a
prefix identifier as further described in the Features section. Microsemi also
offers numerous other Zener products to meet higher and lower power
applications.
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLIC ATIONS / BENEFITS
• Surface mount equivalent to 1N5333 to 1N5388B
• Ideal for high-density and low-profile mounting
• Zener voltage available 3.3V to 200V
• Standard voltage tolerances are plus/minus 5% with
B suffix and 10 % with A suffix identification
• Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
• Options for screening in accordance with MIL-PRF-19500
for JAN, JANTX, and JANTXV are available by adding
MQ, MX, or MV prefixes respectively to part numbers.
• RoHS compliant devices available by adding an “e3” suffix
• Regulates voltage over a broad operating
current and temperature range
• Wide selection from 3.3 to 200 V
• Nonsensitive to ESD
• Withstands high surge stresses
• Minimal changes of voltage versus current as
specified by voltage regulation (ΔVZ)
• High specified maximum current (IZM) when
adequately heat sinking
• Moisture classification is Level 1 with no dry
pack required per IPC/JEDEC J-STD-020B
MAXIMUM RAT ING S
MECHANICAL AND PACKAGING
• Power dissipation at 25ºC: 5.0 watts (also see
derating in Figure 1).
• Operating and Storage temperature: -65ºC to
+150ºC
• Thermal Resistan ce: 25 ºC/W junctio n to lead, or
90ºC/W junction to ambient when mo unted on FR4
PC board (1oz Cu) with recommended fo otprint (see
last page)
• Steady-State Power: 5 watts at TL < 25oC, or 1.38
watts at TA = 25ºC when mounted on FR4 PC board
with recommended footpri nt (also see Figure 1)
• Forward voltage @1.0 A: 1.2 volts (maximum)
• Solder Temperatures: 260 ºC for 10 s (maximum)
• CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
• TERMINALS: Gull-wing or C-bend (m odified J-
bend) tin-lead or RoHS compliant annealed
matte-Tin plating solderable per MIL -STD-750,
method 2026
• POLARITY: Cathode indicated by band. Diode
to be operated with the banded end positive
with respect to the opposite end.
• MARKING: Part number without SMBx prefix
(e.g. 5333B, 5333Be3, MX5348C, 5376 D, etc.)
• TAPE & REEL option: Standard per EIA-481-1-
A with 12 mm tape, 750 per 7 inch reel or 2500
per 13 inch reel (add “TR” suffix to part numbe r)
• WEIGHT: 0.1 grams
• See package dimensions on last page
Microsemi
Scottsdale Division Page 1
Copyright © 2007
6-21-2007 REV E 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503