DESCRIPTION
BACKPANEL CONNECTORS
FCI’s XCede® connector platform is designed for 20+ Gb/s
performance to provide the headroom to support future
high-speed, serial data rate requirements demanded by
next-generation equipment in data centers and service
provider networks. The use of advanced engineering
polymers in a unique 3-D resonance-damping shield
eliminates crosstalk resonances and enables very low
crosstalk across a wide frequency range. The XCede
connector delivers the lowest crosstalk of any backplane
connector available today.
XCede connectors also address requirements for higher
linear signal density at the interface of backplane and
daughter card. Signal connectors can be configured with
2, 4 or 6 differential pairs per column, providing up to 82
differential pairs/inch, suiting architectures with multiple
front or rear fabric slots and blade systems with cooling
straight through the backplane. Complementary guidance
and power modules are also included in the product range.
A wafer organizer can be used to combine groups of right-
angle signal, guidance and power modules as an integrated
daughter-card connector.
The XCede backplane header system provides the
ruggedness and long-term reliability required by today’s
systems. The wide shield contacts feature a stiffness-
enhancing rib and are advanced well ahead of the signals
for exceptional robustness and signal pin protection.
FEATURES & BENEFITS
High-speed backplane system capable of 20+ Gb/s
Use of advanced engineering materials in the shield aids in
elimination of crosstalk resonances
1.85 mm column pitch offers high linear signal density
• Configurations with 6 differential pairs/column fit 36 mm
card slot pitch and provide 82 pairs/inch
• 4 pairs/column fit 25 mm slot pitch with 55 pairs/inch
• 2 pairs/column fit 15 mm slot pitch with 27.5 pairs/inch
Two ground vias between differential pairs allow elongated
antipads to further improve impedance
Optional short compliant pin permits deeper backdrilling and
dual diameter vias to enhance return loss performance
Wide shield contacts feature a stiffening rib and are
advanced well ahead of signals for exceptional robustness
and signal pin protection
Intermateable, electrically and mechanically interchangeable
licensed second source to Amphenol TCS
XCede® is a registered trademark of Amphenol Corporation
TARGET MARKETS / APPLICATIONS
Communications
• Routers
• Switches
• Networking
• Access
• Transport
• Wireless
Data
• Servers
• Storage Systems
Industrial
Medical
Test & Measurement
XCEDE® HigH-PErformanCE
BaCkPlanE ConnECtor SyStEm
Unique resonance damping shield technology enables very low crosstalk
FCI - Americas : 1 (800) 237 2374 - Europe : 33 1 39 49 21 83 - Asia/Pacific : 65 6549 6666
www.fci.com
XCEDE® HigH-PErformanCE BaCkPlanE ConnECtor SyStEm
MATERIALS
Contacts: Copper alloy
Platings:
•Performancebasedplatingatseparableinterface
(Telecordia GR-1217 CORE Central Office)
•Tinortin-leadovernickelonpress-fittails
Housings: High temperature thermoplastic, UL 94-V0
Wafer organizer: Stainless steel
MECHANICAL PERFORMANCE
Mating force: 0.74 N maximum per signal contact
Unmating force: 0.40 N minimum per signal contact
Press-fit insertion force: 35.6 N maximum per tail
ENVIRONMENTAL
Telcordia GR-1217-CORE Central Office qualification pending
SPECIFICATIONS
Production specification: GS-12-588, (preliminary)
Application specification: GS-20-121, (preliminary)
APPROVALS AND CERTIFICATIONS
UL and CSA approvals pending
ELECTRICAL PERFORMANCE
Contact resistance: 10 mΩ maximum change from initial
reading after environmental exposure
Current rating (with < 30 oC temperature rise above
ambient):
•Signalcontact:1A/contact
•Wideshieldcontact:2A/contact
•Powercontact:6A/blade
Crosstalk performance comparison: see below
XCede High-Performance Backplane Connector System Typical High-Speed Backplane Connector System
Magnitude (dB)
Frequency (GHz)
Frequency (GHz)
-10
0
40
-30
-20
Magnitude (dB)
0 5 10 15
-60
-50
-40
0 5 10 15
0 5 10 15
-60
-50
-40
-30
-20
-10
0
Magnitude (dB)
Frequency (GHz)
Frequency (GHz)
-10
0
40
-30
-20
Magnitude (dB)
0 5 10 15
-60
-50
-40
0 5 10 15
0 5 10 15
-60
-50
-40
-30
-20
-10
0
XCede Crosstalk Performance: < -30dB beyond 10 GHz
PART NUMBERS
Lead-free part numbers are listed in the table; tin-lead versions are available upon request. Header part numbers shown
provide 2mm signal contact wipe length; versions providing 3mm wipe length are also available.
Module Description Number
of Columns
Differential Pairs
per Column Part Number
Right-angle receptacle 6 4 10091799-101LF
Right-angle receptacle 8 4 10091812-101LF
Vertical header with 3 walls, left guide & key opening 6 4 10091767-J0C-10DLF
Vertical header with 3 walls, right guide & key opening 6 4 10091767-Y0C-10DLF
Vertical header with 3 walls & left end wall 6 4 10091767-L0C-10DLF
Vertical header with 3 walls & right end wall 6 4 10091767-M0C-10DLF
Vertical header with 2 side walls 6 4 10091767-00C-10DLF
Vertical header with 4 walls 6 4 10091767-10C-10DLF
Vertical header with 3 walls, left guide & key opening 8 4 10091777-J0E-10DLF
Vertical header with 3 walls, right guide & key opening 8 4 10091777-Y0E-10DLF
Vertical header with 3 walls & left end wall 8 4 10091777-L0E-10DLF
Vertical header with 3 walls & right end wall 8 4 10091777-00E-10DLF
Vertical header with 2 side walls 8 4 10091777-00E-10DLF
Vertical header with 4 walls 8 4 10091777-10E-10DLF
For more information, contact XCede@fci.com.
ELXXCEDE0110ELT Printed on recycled paper
