PIC18F2510-I/SPREL - Microchip Technology

PIC18F2X1X/4X1X

Data Sheet

28/40/44-Pin Flash Microcontrollers

with 10-Bit A/D and nanoWatt Technology

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Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and

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Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor

and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,

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SQTP is a service mark of Microchip Technology Incorporated

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All other trademarks mentioned herein are property of their

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Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

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• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona, Gresham, Oregon and Mountain View, California. The

Company’s quality system processes and procedures are for its PIC

MCUs and dsPIC

DSCs, KEELOQ

code hopping devices, Serial

EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and

manufacture of development systems is ISO 9001:2000 certified.

PIC18F2X1X/4X1X

Power-Managed Modes:

• Run: CPU On, Peripherals On

• Idle: CPU Off, Peripherals On

• Sleep: CPU Off, Peripherals Off

• Idle mode Currents Down to 3.0 μA Typical

• Sleep mode Currents Down to 20 nA Typical

• Timer1 Oscillator: 1.8 μA, 32 kHz, 2V

• Watchdog Timer: 2.1 μA

• Two-Speed Oscillator Start-up

Peripheral Highlights:

• High-Current Sink/Source 25 mA/25 mA

• Up to 2 Capture/Compare/PWM (CCP) modules,

One with Auto-Shutdown (28-pin devices)

• Enhanced Capture/Compare/PWM (ECCP)

module (40/44-pin devices only):

- One, two or four PWM outputs

- Selectable polarity

- Programmable dead time

- Auto-shutdown and auto-restart

• Master Synchronous Serial Port (MSSP) module

Supporting 3-Wire SPI (all 4 modes) and I2C™

Master and Slave modes

• Enhanced Addressable USART module:

- Supports RS-485, RS-232 and LIN 1.2

- RS-232 operation using internal oscillator

block (no external crystal required)

- Auto-wake-up on Start bit

- Auto-Baud Detect

• 10-Bit, Up to 13-Channel Analog-to-Digital

Converter module (A/D):

- Auto-acquisition capability

- Conversion available during Sleep

• Dual Analog Comparators with Input Multiplexing

• Programmable 16-Level High/Low-Voltage

Detection (HLVD) module:

- Supports interrupt on High/Low-Voltage Detection

Flexible Oscillator Structure:

• Four Crystal modes, Up to 40 MHz

• 4x Phase Lock Loop (PLL) – Available for Crystal

and Internal Oscillators

• Two External RC modes, Up to 4 MHz

• Two External Clock modes, Up to 40 MHz

• Internal Oscillator Block:

- 8 user-selectable frequencies, from 31 kHz to

8MHz

- Provides a complete range of clock speeds

from 31 kHz to 32 MHz when used with PLL

- User-tunable to compensate for frequency drift

• Secondary Oscillator using Timer1 @ 32 kHz

• Fail-Safe Clock Monitor:

- Allows for safe shutdown if peripheral clock stops

Special Microcontroller Features:

• C Compiler Optimized Architecture:

- Optional extended instruction set designed to

optimize re-entrant code

• 100,000 Erase/Write Cycle Flash Program

Memory Typical

• Three Programmable External Interrupts

• Four Input Change Interrupts

• Priority Levels for Interrupts

• 8 x 8 Single-Cycle Hardware Multiplier

• Extended Watchdog Timer (WDT):

- Programmable period from 4 ms to 131s

• Single-Supply 5V In-Circuit Serial

Programming™ (ICSP™) via Two Pins

• In-Circuit Debug (ICD) via Two Pins

• Wide Operating Voltage Range: 2.0V to 5.5V

• Programmable Brown-out Reset (BOR) with

Software Enable Option

28/40/44-Pin Flash Microcontrollers with

10-Bit A/D and nanoWatt Technology

PIC18F2X1X/4X1X

Device

Program Memory Data

Memory I/O 10-Bit

A/D (ch)

CCP/ECCP

(PWM)

MSSP

EUSART

Comp. Timers

8/16-Bit

Flash

(bytes)

# Single-Word

Instructions

SRAM

(bytes) SPI Master

I2C™

PIC18F2410 16K 8192 768 25 10 2/0 Y Y 1 2 1/3

PIC18F2510 32K 16384 1536 25 10 2/0 Y Y 1 2 1/3

PIC18F2515 48K 24576 3968 25 10 2/0 Y Y 1 2 1/3

PIC18F2610 64K 32768 3968 25 10 2/0 Y Y 1 2 1/3

PIC18F4410 16K 8192 768 36 13 1/1 Y Y 1 2 1/3

PIC18F4510 32K 16384 1536 36 13 1/1 Y Y 1 2 1/3

PIC18F4515 48K 24576 3968 36 13 1/1 Y Y 1 2 1/3

PIC18F4610 64K 32768 3968 36 13 1/1 Y Y 1 2 1/3

PIC18F2X1X/4X1X

Pin Diagrams

14 15

MCLR/VPP/RE3

RA0/AN0

RA1/AN1

RA2/AN2/VREF-/CVREF

RA3/AN3/VREF+

RA4/T0CKI/C1OUT

RA5/AN4/SS/HLVDIN/C2OUT

VSS

OSC1/CLKI/RA7

OSC2/CLKO/RA6

RC0/T1OSO/T13CKI

RC1/T1OSI/CCP2(1)

RC2/CCP1

RC3/SCK/SCL

RB7/KBI3/PGD

RB6//KBI2/PGC

RB5/KBI1/PGM

RB4/KBI0/AN11

RB3/AN9/CCP2(1)

RB2/INT2/AN8

RB1/INT1/AN10

RB0/INT0/FLT0/AN12

VDD

VSS

RC7/RX/DT

RC6/TX/CK

RC5/SDO

RC4/SDI/SDA

28-pin SPDIP, SOIC

Note 1: RB3 is the alternate pin for CCP2 multiplexing.

10 11

12 13 14 15

232425262728

RC0/T1OSO/T13CKI

RB7/KBI3/PGD

RB6/KBI2/PGC

RB5/KBI1/PGM

RB4KBI0/AN11

RB3/AN9/CCP2(1)

RB2/INT2/AN8

RB1/INT1/AN10

RB0/INT0/FLT0/AN12

VDD

VSS

RC7/RX/DT

RC6/TX/CK

RC5/SDO

RC4/SDI/SDA

MCLR/VPP/RE3

RA0/AN0

RA1/AN1

RA2/AN2/VREF-/CVREF

RA3/AN3/VREF+

RA4/T0CKI/C1OUT

RA5/AN4/SS/HLVDIN/C2OUT

VSS

OSC1/CLKI/RA7

OSC2/CLKO/RA6

RC1/T1OSI/CCP2(1)

RC2/CCP1

RC3/SCK/SCL

28-pin QFN

PIC18F2X1X

PIC18F2410

PIC18F2510

RB7/KBI3/PGD

RB6/KBI2/PGC

RB5/KBI1/PGM

RB4/KBI0/AN11

RB3/AN9/CCP2(1)

RB2/INT2/AN8

RB1/INT1/AN10

RB0/INT0/FLT0/AN12

VDD

VSS

RD7/PSP7/P1D

RD6/PSP6/P1C

RD5/PSP5/P1B

RD4/PSP4

RC7/RX/DT

RC6/TX/CK

RC5/SDO

RC4/SDI/SDA

RD3/PSP3

RD2/PSP2

MCLR/VPP/RE3

RA0/AN0

RA1/AN1

RA2/AN2/VREF-/CVREF

RA3/AN3/VREF+

RA4/T0CKI/C1OUT

RA5/AN4/SS/HLVDIN/C2OUT

RE0/RD/AN5

RE1/WR/AN6

RE2/CS/AN7

VDD

VSS

OSC1/CLKI/RA7

OSC2/CLKO/RA6

RC0/T1OSO/T13CKI

RC1/T1OSI/CCP2(1)

RC2/CCP1/P1A

RC3/SCK/SCL

RD0/PSP0

RD1/PSP1

40-pin PDIP

PIC18F4X1X

PIC18F2X1X/4X1X

Pin Diagrams (Cont.’d)

Note 1: RB3 is the alternate pin for CCP2 multiplexing.

RA3/AN3/VREF+

RA2/AN2/VREF-/CVREF

RA1/AN1

RA0/AN0

MCLR/VPP/RE3

RB3/AN9/CCP2(1)

RB7/KBI3/PGD

RB6/KBI2/PGC

RB5/KBI1/PGM

RB4/KBI0/AN11

RC6/TX/CK

RC5/SDO

RC4/SDI/SDA

RD3/PSP3

RD2/PSP2

RD1/PSP1

RD0/PSP0

RC3/SCK/SCL

RC2/CCP1/P1A

RC1/T1OSI/CCP2(1)

RC0/T1OSO/T13CKI

OSC2/CLKO/RA6

OSC1/CLKI/RA7

VSS

VDD

RE2/CS/AN7

RE1/WR/AN6

RE0/RD/AN5

RA5/AN4/SS/HLVDIN/C2OUT

RA4/T0CKI/C1OUT

RC7/RX/DT

RD4/PSP4

RD5/PSP5/P1B

RD6/PSP6/P1C

RD7/PSP7/P1D

VSS

VDD

RB0/INT0/FLT0/AN12

RB1/INT1/AN10

RB2/INT2/AN8

44-pin QFN

RA3/AN3/VREF+

RA2/AN2/VREF-/CVREF

RA1/AN1

RA0/AN0

MCLR/VPP/RE3

RB7/KBI3/PGD

RB6/KBI2/PGC

RB5/KBI1/PGM

RB4/KBI0/AN11

RC6/TX/CK

RC5/SDO

RC4/SDI/SDA

RD3/PSP3

RD2/PSP2

RD1/PSP1

RD0/PSP0

RC3/SCK/SCL

RC2/CCP1/P1A

RC1/T1OSI/CCP2(1)

RC0/T1OSO/T13CKI

OSC2/CLKO/RA6

OSC1/CLKI/RA7

VSS

VDD

RE2/CS/AN7

RE1/WR/AN6

RE0/RD/AN5

RA5/AN4/SS/HLVDIN/C2OUT

RA4/T0CKI/C1OUT

RC7/RX/DT

RD4/PSP4

RD5/PSP5/P1B

RD6/PSP6/P1C

RD7/PSP7/P1D

VSS

VDD

RB0/INT0/FLT0/AN12

RB1/INT1/AN10

RB2/INT2/AN8

RB3/AN9/CCP2(1)

44-pin TQFP

PIC18F4X1X

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 5
PIC18F2X1X/4X1X
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 7
2.0 Oscillator Configurations ............................................................................................................................................................ 23
3.0 Power-Managed Modes ............................................................................................................................................................. 33
4.0 Reset .......................................................................................................................................................................................... 41
5.0 Memory Organization ................................................................................................................................................................. 53
6.0 Flash Program Memory.............................................................................................................................................................. 75
7.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 79
8.0 Interrupts .................................................................................................................................................................................... 81
9.0 I/O Ports ..................................................................................................................................................................................... 95
10.0 Timer0 Module ......................................................................................................................................................................... 113
11.0 Timer1 Module ......................................................................................................................................................................... 117
12.0 Timer2 Module ......................................................................................................................................................................... 123
13.0 Timer3 Module ......................................................................................................................................................................... 125
14.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 129
15.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 137
16.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 151
17.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)....................................................................................... 191
18.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 211
19.0 Comparator Module.................................................................................................................................................................. 221
20.0 Comparator Voltage Reference Module................................................................................................................................... 227
21.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 231
22.0 Special Features of the CPU.................................................................................................................................................... 237
23.0 Instruction Set Summary.......................................................................................................................................................... 257
24.0 Development Support............................................................................................................................................................... 307
25.0 Electrical Characteristics.......................................................................................................................................................... 311
26.0 DC and AC Characteristics Graphs And Tables ...................................................................................................................... 349
27.0 Packaging Information.............................................................................................................................................................. 351
Appendix A: Revision History............................................................................................................................................................. 359
Appendix B: Device Differences ........................................................................................................................................................ 359
Appendix C: Conversion Considerations ........................................................................................................................................... 360
Appendix D: Migration From Baseline to Enhanced Devices ............................................................................................................ 360
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 361
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 361
Index .................................................................................................................................................................................................  363
The Microchip Web Site..................................................................................................................................................................... 373
Customer Change Notification Service .............................................................................................................................................. 373
Customer Support .............................................................................................................................................................................. 373
Reader Response .............................................................................................................................................................................. 374
PIC18F2X1X/4X1X Product Identification System............................................................................................................................. 375

PIC18F2X1X/4X1X

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Customer Notification System

PIC18F2X1X/4X1X

1.0 DEVICE OVERVIEW

This document contains device specific information for

the following devices:

This family offers the advantages of all PIC18

microcontrollers – namely, high computational

performance at an economical price – with the addition

of high-endurance, Flash program memory. On top of

these features, the PIC18F2X1X/4X1X family introduces

design enhancements that make these microcontrollers

a logical choice for many high-performance, power

sensitive applications.

1.1 New Core Features

1.1.1 nanoWatt TECHNOLOGY

All of the devices in the PIC18F2X1X/4X1X family

incorporate a range of features that can significantly

reduce power consumption during operation. Key

items include:

•Alternate Run Modes: By clocking the controller

from the Timer1 source or the internal oscillator

block, power consumption during code execution

can be reduced by as much as 90%.

•Multiple Idle Modes: The controller can also run

with its CPU core disabled but the peripherals still

active. In these states, power consumption can be

reduced even further, to as little as 4% of normal

operation requirements.

•On-the-fly Mode Switching: The power-

managed modes are invoked by user code during

operation, allowing the user to incorporate power-

saving ideas into their application’s software

design.

•Lower Consumption in Key Modules: The

power requirements for both Timer1 and the

Watchdog Timer have been minimized. See

Section 25.0 “Electrical Characteristics” for

values.

1.1.2 MULTIPLE OSCILLATOR OPTIONS

AND FEATURES

All of the devices in the PIC18F2X1X/4X1X family offer

ten different oscillator options, allowing users a wide

range of choices in developing application hardware.

These include:

• Four Crystal modes, using crystals or ceramic

resonators

• Two External Clock modes, offering the option of

using two pins (oscillator input and a divide-by-4

clock output) or one pin (oscillator input, with the

second pin reassigned as general I/O)

• Two External RC Oscillator modes with the same

pin options as the External Clock modes

• An internal oscillator block which provides an

8 MHz clock and an INTRC source (approxi-

mately 31 kHz), as well as a range of 6 user

selectable clock frequencies, between 125 kHz to

4 MHz, for a total of 8 clock frequencies. This

option frees the two oscillator pins for use as

additional general purpose I/O.

• A Phase Lock Loop (PLL) frequency multiplier,

available to both the high-speed crystal and Inter-

nal Oscillator modes, which allows clock speeds of

up to 40 MHz. Used with the internal oscillator, the

PLL gives users a complete selection of clock

speeds, from 31 kHz to 32 MHz – all without using

an external crystal or clock circuit.

Besides its availability as a clock source, the internal

oscillator block provides a stable reference source that

gives the family additional features for robust

operation:

•Fail-Safe Clock Monitor: This option constantly

monitors the main clock source against a

reference signal provided by the internal

oscillator. If a clock failure occurs, the controller is

switched to the internal oscillator block, allowing

for continued low-speed operation or a safe

application shutdown.

•Two-Speed Start-up: This option allows the

internal oscillator to serve as the clock source

from Power-on Reset, or wake-up from Sleep

mode, until the primary clock source is available.

• PIC18F2410 • PIC18LF2410

• PIC18F2510 • PIC18LF2510

• PIC18F2515 • PIC18LF2515

• PIC18F2610 • PIC18LF2610

• PIC18F4410 • PIC18LF4410

• PIC18F4510 • PIC18LF4510

• PIC18F4515 • PIC18LF4515

• PIC18F4610 • PIC18LF4610

PIC18F2X1X/4X1X

1.2 Other Special Features

•Memory Endurance: The Flash cells for program

memory are rated to 100,000 erase/write cycles.

Data retention without refresh is conservatively

estimated to be greater than 40 years.

•Extended Instruction Set: The PIC18F2X1X/

4X1X family introduces an optional extension to

the PIC18 instruction set, which adds 8 new

instructions and an Indexed Addressing mode.

This extension, enabled as a device configuration

option, has been specifically designed to optimize

re-entrant application code originally developed in

high-level languages, such as C.

•Enhanced CCP Module: In PWM mode, this

module provides 1, 2 or 4 modulated outputs for

controlling half-bridge and full-bridge drivers.

Other features include Auto-Shutdown, for

disabling PWM outputs on interrupt or other select

conditions and Auto-Restart, to reactivate outputs

once the condition has cleared.

•Enhanced Addressable USART: This serial

communication module is capable of standard

RS-232 operation and provides support for the LIN

bus protocol. Other enhancements include auto-

matic baud rate detection and a 16-bit Baud Rate

Generator for improved resolution. When the

microcontroller is using the internal oscillator

block, the USART provides stable operation for

applications that talk to the outside world without

using an external crystal (or its accompanying

power requirement).

•10-bit A/D Converter: This module incorporates

programmable acquisition time, allowing for a

channel to be selected and a conversion to be

initiated without waiting for a sampling period and

thus, reduce code overhead.

•Extended Watchdog Timer (WDT): This

enhanced version incorporates a 16-bit prescaler,

allowing an extended time-out range that is stable

across operating voltage and temperature. See

Section 25.0 “Electrical Characteristics” for

time-out periods.

1.3 Details on Individual Family

Members

Devices in the PIC18F2X1X/4X1X family are available

in 28-pin and 40/44-pin packages. Block diagrams for

the two groups are shown in Figure 1-1 and Figure 1-2.

The devices are differentiated from each other in five

ways:

1. Flash program memory

• 16 Kbytes for PIC18F2410/4410 devices

• 32 Kbytes for PIC18F2510/4510 devices

• 48 Kbytes for PIC18F2515/4515 devices

• 64 Kbytes for PIC18F2610/4610 devices

2. A/D channels (10 for 28-pin devices, 13 for

40/44-pin devices).

3. I/O ports (3 bidirectional ports on 28-pin devices,

5 bidirectional ports on 40/44-pin devices).

4. CCP and Enhanced CCP implementation (28-pin

devices have 2 standard CCP modules; 40/44-pin

devices have one standard CCP module and one

ECCP module).

5. Parallel Slave Port (present only on 40/44-pin

devices).

All other features for devices in this family are identical.

These are summarized in Table 1-1.

The pinouts for all devices are listed in Table 1-3 and

Table 1-4.

Like all Microchip PIC18 devices, members of the

PIC18F2X1X/4X1X family are available as both

standard and low-voltage devices. Standard devices

with Flash memory, designated with an “F” in the part

number (such as PIC18F2610), accommodate an

operating VDD range of 4.2V to 5.5V. Low-voltage

parts, designated by “LF” (such as PIC18LF2610),

function over an extended VDD range of 2.0V to 5.5V.

PIC18F2X1X/4X1X

TABLE 1-1: DEVICE FEATURES (PIC18F2410/2415/2510/2515/2610)

Features PIC18F2410 PIC18F2510 PIC18F2515 PIC18F2610

Operating Frequency DC – 40 MHz DC – 40 MHz DC – 40 MHz DC – 40 MHz

Program Memory (Bytes) 16384 32768 49152 65536

Program Memory

(Instructions)

8192 16384 24576 32768

Data Memory (Bytes) 768 1536 3968 3968

Interrupt Sources 18 18 18 18

I/O Ports Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, (E)

Timers 4444

Capture/Compare/PWM Modules2222

Enhanced

Capture/Compare/PWM Modules

0000

Serial Communications MSSP,

Enhanced USART

MSSP,

Enhanced USART

MSSP,

Enhanced USART

MSSP,

Enhanced USART

Parallel Communications (PSP) No No No No

10-bit Analog-to-Digital Module 10 Input Channels 10 Input Channels 10 Input Channels 10 Input Channels

Resets (and Delays) POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

Programmable

High/Low-Voltage Detect

Yes Yes Yes Yes

Programmable

Brown-out Reset

Yes Yes Yes Yes

Instruction Set 75 Instructions;

83 with Extended

Instruction Set enabled

75 Instructions;

83 with Extended

Instruction Set enabled

75 Instructions;

83 with Extended

Instruction Set enabled

75 Instructions;

83 with Extended

Instruction Set enabled

Packages 28-pin SPDIP

28-pin SOIC

28-pin QFN

28-pin SPDIP

28-pin SOIC

28-pin QFN

28-pin SPDIP

28-pin SOIC

28-pin SPDIP

28-pin SOIC

PIC18F2X1X/4X1X

TABLE 1-2: DEVICE FEATURES (PIC18F4410/4415/4510/4515/4610)

Features PIC18F4410 PIC18F4510 PIC18F4515 PIC18F4610

Operating Frequency DC – 40 MHz DC – 40 MHz DC – 40 MHz DC – 40 MHz

Program Memory (Bytes) 16384 32768 49152 65536

Program Memory

(Instructions)

8192 16384 24576 32768

Data Memory (Bytes) 768 1536 3968 3968

Interrupt Sources 19 19 19 19

I/O Ports Ports A, B, C, D, E Ports A, B, C, D, E Ports A, B, C, D, E Ports A, B, C, D, E

Timers 4444

Capture/Compare/PWM Modules 1 1 1 1

Enhanced

Capture/Compare/PWM Modules

1111

Serial Communications MSSP,

Enhanced USART

MSSP,

Enhanced USART

MSSP,

Enhanced USART

MSSP,

Enhanced USART

Parallel Communications (PSP) Yes Yes Yes Yes

10-Bit Analog-to-Digital Module 13 Input Channels 13 Input Channels 13 Input Channels 13 Input Channels

Resets (and Delays) POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

Programmable

High/Low-Voltage Detect

Yes Yes Ye s Yes

Programmable

Brown-out Reset

Yes Yes Ye s Yes

Instruction Set 75 Instructions;

83 with Extended

Instruction Set enabled

75 Instructions;

83 with Extended

Instruction Set enabled

75 Instructions;

83 with Extended

Instruction Set enabled

75 Instructions;

83 with Extended

Instruction Set enabled

Packages 40-pin PDIP

44-pin QFN

44-pin TQFP

40-pin PDIP

44-pin QFN

44-pin TQFP

40-pin PDIP

44-pin QFN

44-pin TQFP

40-pin PDIP

44-pin QFN

44-pin TQFP

PIC18F2X1X/4X1X

FIGURE 1-1: PIC18F2410/2415/2510/2515/2610 (28-PIN) BLOCK DIAGRAM

Instruction

Decode and

Control

PORTA

PORTB

PORTC

RA4/T0CKI/C1OUT

RA5/AN4/SS/HLVDIN/C2OUT

RB0/INT0/FLT0/AN12

RC0/T1OSO/T13CKI

RC1/T1OSI/CCP2(1)

RC2/CCP1

RC3/SCK/SCL

RC4/SDI/SDA

RC5/SDO

RC6/TX/CK

RC7/RX/DT

RA3/AN3/VREF+

RA2/AN2/VREF-/CVREF

RA1/AN1

RA0/AN0

RB1/INT1/AN10

Data Latch

Data Memory

(.7, 1.5, 3.9

Address Latch

Data Address<12>

Access

BSR FSR0

FSR1

FSR2

inc/dec

logic

Address

412 4

PCH PCL

PCLATH

31 Level Stack

Program Counter

PRODLPRODH

8 x 8 Multiply

BITOP

ALU<8>

Address Latch

Program Memory

(16/32/48/64

Data Latch

Table Pointer<21>

inc/dec logic

Data Bus<8>

Table Latch

ROM Latch

RB2/INT2/AN8

RB3/AN9/CCP2(1)

PCLATU

PCU

OSC2/CLKO(3)/RA6

Note 1: CCP2 is multiplexed with RC1 when Configuration bit, CCP2MX, is set, or RB3 when CCP2MX is not set.

2: RE3 is only available when MCLR functionality is disabled.

3: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O.

Refer to Section 2.0 “Oscillator Configurations” for additional information.

RB4/KBI0/AN11

RB5/KBI1/PGM

RB6/KBI2/PGC

RB7/KBI3/PGD

EUSARTComparator MSSP 10-bit

ADC

Timer2Timer1 Timer3Timer0

CCP2

HLVD

CCP1

BOR

Instruction Bus <16>

STKPTR Bank

State Machine

Control Signals

Decode

Power-up

Timer

Oscillator

Start-up Timer

Power-on

Reset

Watchdog

Timer

OSC1(3)

OSC2(3)

VDD,

Brown-out

Reset

Internal

Oscillator

Fail-Safe

Clock Monitor

Precision

Reference

Band Gap

VSS

MCLR(2)

Block

INTRC

Oscillator

8 MHz

Oscillator

Single-Supply

Programming

In-Circuit

Debugger

T1OSO

OSC1/CLKI(3)/RA7

T1OSI

PORTE

MCLR/VPP/RE3(2)

Kbytes)

PIC18F2X1X/4X1X

FIGURE 1-2: PIC18F4410/4415/4510/4515/4610 (40/44-PIN) BLOCK DIAGRAM

Instruction

Decode and

Control

Data Latch

Data Memory

(.7, 1.5, 3.9

Address Latch

Data Address<12>

Access

BSR FSR0

FSR1

FSR2

inc/dec

logic

Address

412 4

PCH PCL

PCLATH

31 Level Stack

Program Counter

PRODLPRODH

8 x 8 Multiply

BITOP

ALU<8>

Address Latch

Program Memory

(16/32/48/64

Data Latch

Table Pointer<21>

inc/dec logic

Data Bus<8>

Table Latch

ROM Latch

PORTD

RD0/PSP0

PCLATU

PCU

PORTE

MCLR/VPP/RE3(2)

RE2/CS/AN7

RE0/RD/AN5

RE1/WR/AN6

Note 1: CCP2 is multiplexed with RC1 when Configuration bit, CCP2MX, is set, or RB3 when CCP2MX is not set.

2: RE3 is only available when MCLR functionality is disabled.

3: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O.

Refer to Section 2.0 “Oscillator Configurations” for additional information.

:RD4/PSP4

EUSARTComparator MSSP 10-bit

ADC

Timer2Timer1 Timer3Timer0

CCP2

HLVD

ECCP1

BOR

Instruction Bus <16>

STKPTR Bank

State Machine

Control Signals

Decode

Power-up

Timer

Oscillator

Start-up Timer

Power-on

Reset

Watchdog

Timer

OSC1(3)

OSC2(3)

VDD,

Brown-out

Reset

Internal

Oscillator

Fail-Safe

Clock Monitor

Precision

Reference

Band Gap

VSS

MCLR(2)

Block

INTRC

Oscillator

8 MHz

Oscillator

Single-Supply

Programming

In-Circuit

Debugger

T1OSI

T1OSO

RD5/PSP5/P1B

RD6/PSP6/P1C

RD7/PSP7/P1D

PORTA

PORTB

PORTC

RA4/T0CKI/C1OUT

RA5/AN4/SS/HLVDIN/C2OUT

RB0/INT0/FLT0/AN12

RC0/T1OSO/T13CKI

RC1/T1OSI/CCP2(1)

RC2/CCP1/P1A

RC3/SCK/SCL

RC4/SDI/SDA

RC5/SDO

RC6/TX/CK

RC7/RX/DT

RA3/AN3/VREF+

RA2/AN2/VREF-/CVREF

RA1/AN1

RA0/AN0

RB1/INT1/AN10

RB2/INT2/AN8

RB3/AN9/CCP2(1)

OSC2/CLKO(3)/RA6

RB4/KBI0/AN11

RB5/KBI1/PGM

RB6/KBI2/PGC

RB7/KBI3/PGD

OSC1/CLKI(3)/RA7

Kbytes)

PIC18F2X1X/4X1X

TABLE 1-3: PIC18F2410/2415/2510/2515/2610 PINOUT I/O DESCRIPTIONS

Pin Name

Pin Number

Type

Buffer

Type Description

SPDIP,

SOIC QFN

MCLR/VPP/RE3

MCLR

VPP

RE3

126

Master Clear (input) or programming voltage (input).

Master Clear (Reset) input. This pin is an active-low

Reset to the device.

Programming voltage input.

Digital input.

OSC1/CLKI/RA7

OSC1

CLKI

RA7

I/O

CMOS

TTL

Oscillator crystal or external clock input.

Oscillator crystal input or external clock source input.

ST buffer when configured in RC mode; CMOS otherwise.

External clock source input. Always associated with pin

function OSC1. (See related OSC1/CLKI, OSC2/CLKO

pins.)

General purpose I/O pin.

OSC2/CLKO/RA6

OSC2

CLKO

RA6

10 7

I/O

—

TTL

Oscillator crystal or clock output.

Oscillator crystal output. Connects to crystal or

resonator in Crystal Oscillator mode.

In RC mode, OSC2 pin outputs CLKO, which has 1/4 the

frequency of OSC1 and denotes the instruction cycle rate.

General purpose I/O pin.

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O=Output P =Power

Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.

2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.

PIC18F2X1X/4X1X

PORTA is a bidirectional I/O port.

RA0/AN0

RA0

AN0

227

I/O

TTL

Analog

Digital I/O.

Analog input 0.

RA1/AN1

RA1

AN1

328

I/O

TTL

Analog

Digital I/O.

Analog input 1.

RA2/AN2/VREF-/CVREF

RA2

AN2

VREF-

CVREF

I/O

TTL

Analog

Digital I/O.

Analog input 2.

A/D reference voltage (low) input.

Comparator reference voltage output.

RA3/AN3/VREF+

RA3

AN3

VREF+

I/O

TTL

Analog

Digital I/O.

Analog input 3.

A/D reference voltage (high) input.

RA4/T0CKI/C1OUT

RA4

T0CKI

C1OUT

I/O

—

Digital I/O.

Timer0 external clock input.

Comparator 1 output.

RA5/AN4/SS/HLVDIN/

C2OUT

RA5

AN4

HLVDIN

C2OUT

I/O

TTL

Analog

TTL

Analog

—

Digital I/O.

Analog input 4.

SPI slave select input.

High/Low-Voltage Detect input.

Comparator 2 output.

RA6 See the OSC2/CLKO/RA6 pin.

RA7 See the OSC1/CLKI/RA7 pin.

TABLE 1-3: PIC18F2410/2415/2510/2515/2610 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name

Pin Number

Type

Buffer

Type Description

SPDIP,

SOIC QFN

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O=Output P =Power

Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.

2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.

PIC18F2X1X/4X1X

PORTB is a bidirectional I/O port. PORTB can be software

programmed for internal weak pull-ups on all inputs.

RB0/INT0/FLT0/AN12

RB0

INT0

FLT0

AN12

21 18

I/O

TTL

Analog

Digital I/O.

External interrupt 0.

PWM Fault input for CCP1.

Analog input 12.

RB1/INT1/AN10

RB1

INT1

AN10

22 19

I/O

TTL

Analog

Digital I/O.

External interrupt 1.

Analog input 10.

RB2/INT2/AN8

RB2

INT2

AN8

23 20

I/O

TTL

Analog

Digital I/O.

External interrupt 2.

Analog input 8.

RB3/AN9/CCP2

RB3

AN9

CCP2(1)

24 21

I/O

TTL

Analog

Digital I/O.

Analog input 9.

Capture 2 input/Compare 2 output/PWM 2 output.

RB4/KBI0/AN11

RB4

KBI0

AN11

25 22

I/O

TTL

Analog

Digital I/O.

Interrupt-on-change pin.

Analog input 11.

RB5/KBI1/PGM

RB5

KBI1

PGM

26 23

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

Low-Voltage ICSP™ Programming enable pin.

RB6/KBI2/PGC

RB6

KBI2

PGC

27 24

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

In-Circuit Debugger and ICSP programming clock pin.

RB7/KBI3/PGD

RB7

KBI3

PGD

28 25

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

In-Circuit Debugger and ICSP programming data pin.

TABLE 1-3: PIC18F2410/2415/2510/2515/2610 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name

Pin Number

Type

Buffer

Type Description

SPDIP,

SOIC QFN

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O=Output P =Power

Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.

2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.

PIC18F2X1X/4X1X

PORTC is a bidirectional I/O port.

RC0/T1OSO/T13CKI

RC0

T1OSO

T13CKI

11 8

I/O

—

Digital I/O.

Timer1 oscillator output.

Timer1/Timer3 external clock input.

RC1/T1OSI/CCP2

RC1

T1OSI

CCP2(2)

12 9

I/O

Analog

Digital I/O.

Timer1 oscillator input.

Capture 2 input/Compare 2 output/PWM 2 output.

RC2/CCP1

RC2

CCP1

13 10

I/O

Digital I/O.

Capture 1 input/Compare 1 output/PWM 1 output.

RC3/SCK/SCL

RC3

SCK

SCL

14 11

I/O

Digital I/O.

Synchronous serial clock input/output for SPI mode.

Synchronous serial clock input/output for I2C™ mode.

RC4/SDI/SDA

RC4

SDI

SDA

15 12

I/O

Digital I/O.

SPI data in.

I2C data I/O.

RC5/SDO

RC5

SDO

16 13

I/O

—

Digital I/O.

SPI data out.

RC6/TX/CK

RC6

17 14

I/O

—

Digital I/O.

EUSART asynchronous transmit.

EUSART synchronous clock (see related RX/DT).

RC7/RX/DT

RC7

18 15

I/O

Digital I/O.

EUSART asynchronous receive.

EUSART synchronous data (see related TX/CK).

RE3 — — — — See MCLR/VPP/RE3 pin.

VSS 8, 19 5, 16 P — Ground reference for logic and I/O pins.

VDD 20 17 P — Positive supply for logic and I/O pins.

TABLE 1-3: PIC18F2410/2415/2510/2515/2610 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name

Pin Number

Type

Buffer

Type Description

SPDIP,

SOIC QFN

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O=Output P =Power

Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.

2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.

PIC18F2X1X/4X1X

TABLE 1-4: PIC18F4410/4415/4510/4515/4610 PINOUT I/O DESCRIPTIONS

Pin Name

Pin Number Pin

Type

Buffer

Type Description

PDIP QFN TQFP

MCLR/VPP/RE3

MCLR

VPP

RE3

11818

Master Clear (input) or programming voltage (input).

Master Clear (Reset) input. This pin is an active-low

Reset to the device.

Programming voltage input.

Digital input.

OSC1/CLKI/RA7

OSC1

CLKI

RA7

13 32 30

I/O

CMOS

TTL

Oscillator crystal or external clock input.

Oscillator crystal input or external clock source input.

ST buffer when configured in RC mode;

analog otherwise.

External clock source input. Always associated with

pin function OSC1. (See related OSC1/CLKI,

OSC2/CLKO pins.)

General purpose I/O pin.

OSC2/CLKO/RA6

OSC2

CLKO

RA6

14 33 31

I/O

—

TTL

Oscillator crystal or clock output.

Oscillator crystal output. Connects to crystal

or resonator in Crystal Oscillator mode.

In RC mode, OSC2 pin outputs CLKO, which

has 1/4 the frequency of OSC1 and denotes

the instruction cycle rate.

General purpose I/O pin.

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O=Output P =Power

Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.

2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.

PIC18F2X1X/4X1X

PORTA is a bidirectional I/O port.

RA0/AN0

RA0

AN0

21919

I/O

TTL

Analog

Digital I/O.

Analog input 0.

RA1/AN1

RA1

AN1

32020

I/O

TTL

Analog

Digital I/O.

Analog input 1.

RA2/AN2/VREF-/CVREF

RA2

AN2

VREF-

CVREF

42121

I/O

TTL

Analog

Digital I/O.

Analog input 2.

A/D reference voltage (low) input.

Comparator reference voltage output.

RA3/AN3/VREF+

RA3

AN3

VREF+

52222

I/O

TTL

Analog

Digital I/O.

Analog input 3.

A/D reference voltage (high) input.

RA4/T0CKI/C1OUT

RA4

T0CKI

C1OUT

62323

I/O

—

Digital I/O.

Timer0 external clock input.

Comparator 1 output.

RA5/AN4/SS/HLVDIN/

C2OUT

RA5

AN4

HLVDIN

C2OUT

72424

I/O

TTL

Analog

TTL

Analog

—

Digital I/O.

Analog input 4.

SPI slave select input.

High/Low-Voltage Detect input.

Comparator 2 output.

RA6 See the OSC2/CLKO/RA6 pin.

RA7 See the OSC1/CLKI/RA7 pin.

TABLE 1-4: PIC18F4410/4415/4510/4515/4610 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name

Pin Number Pin

Type

Buffer

Type Description

PDIP QFN TQFP

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O=Output P =Power

Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.

2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.

PIC18F2X1X/4X1X

PORTB is a bidirectional I/O port. PORTB can be

software programmed for internal weak pull-ups on all

inputs.

RB0/INT0/FLT0/AN12

RB0

INT0

FLT0

AN12

33 9 8

I/O

TTL

Analog

Digital I/O.

External interrupt 0.

PWM Fault input for Enhanced CCP1.

Analog input 12.

RB1/INT1/AN10

RB1

INT1

AN10

34 10 9

I/O

TTL

Analog

Digital I/O.

External interrupt 1.

Analog input 10.

RB2/INT2/AN8

RB2

INT2

AN8

35 11 10

I/O

TTL

Analog

Digital I/O.

External interrupt 2.

Analog input 8.

RB3/AN9/CCP2

RB3

AN9

CCP2(1)

36 12 11

I/O

TTL

Analog

Digital I/O.

Analog input 9.

Capture 2 input/Compare 2 output/PWM 2 output.

RB4/KBI0/AN11

RB4

KBI0

AN11

37 14 14

I/O

TTL

Analog

Digital I/O.

Interrupt-on-change pin.

Analog input 11.

RB5/KBI1/PGM

RB5

KBI1

PGM

38 15 15

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

Low-Voltage ICSP™ Programming enable pin.

RB6/KBI2/PGC

RB6

KBI2

PGC

39 16 16

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

In-Circuit Debugger and ICSP programming

clock pin.

RB7/KBI3/PGD

RB7

KBI3

PGD

40 17 17

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

In-Circuit Debugger and ICSP programming

data pin.

TABLE 1-4: PIC18F4410/4415/4510/4515/4610 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name

Pin Number Pin

Type

Buffer

Type Description

PDIP QFN TQFP

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O=Output P =Power

Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.

2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.

PIC18F2X1X/4X1X

PORTC is a bidirectional I/O port.

RC0/T1OSO/T13CKI

RC0

T1OSO

T13CKI

15 34 32

I/O

—

Digital I/O.

Timer1 oscillator output.

Timer1/Timer3 external clock input.

RC1/T1OSI/CCP2

RC1

T1OSI

CCP2(2)

16 35 35

I/O

CMOS

Digital I/O.

Timer1 oscillator input.

Capture 2 input/Compare 2 output/PWM 2 output.

RC2/CCP1/P1A

RC2

CCP1

P1A

17 36 36

I/O

—

Digital I/O.

Capture1 input/Compare1 output/PWM1 output.

Enhanced CCP1 output.

RC3/SCK/SCL

RC3

SCK

SCL

18 37 37

I/O

Digital I/O.

Synchronous serial clock input/output for

SPI mode.

Synchronous serial clock input/output for I2C™ mode.

RC4/SDI/SDA

RC4

SDI

SDA

23 42 42

I/O

Digital I/O.

SPI data in.

I2C data I/O.

RC5/SDO

RC5

SDO

24 43 43

I/O

—

Digital I/O.

SPI data out.

RC6/TX/CK

RC6

25 44 44

I/O

—

Digital I/O.

EUSART asynchronous transmit.

EUSART synchronous clock (see related RX/DT).

RC7/RX/DT

RC7

26 1 1

I/O

Digital I/O.

EUSART asynchronous receive.

EUSART synchronous data (see related TX/CK).

TABLE 1-4: PIC18F4410/4415/4510/4515/4610 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name

Pin Number Pin

Type

Buffer

Type Description

PDIP QFN TQFP

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O=Output P =Power

Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.

2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.

PIC18F2X1X/4X1X

PORTD is a bidirectional I/O port or a Parallel Slave

Port (PSP) for interfacing to a microprocessor port.

These pins have TTL input buffers when PSP module

is enabled.

RD0/PSP0

RD0

PSP0

19 38 38

I/O

TTL

Digital I/O.

Parallel Slave Port data.

RD1/PSP1

RD1

PSP1

20 39 39

I/O

TTL

Digital I/O.

Parallel Slave Port data.

RD2/PSP2

RD2

PSP2

21 40 40

I/O

TTL

Digital I/O.

Parallel Slave Port data.

RD3/PSP3

RD3

PSP3

22 41 41

I/O

TTL

Digital I/O.

Parallel Slave Port data.

RD4/PSP4

RD4

PSP4

27 2 2

I/O

TTL

Digital I/O.

Parallel Slave Port data.

RD5/PSP5/P1B

RD5

PSP5

P1B

28 3 3

I/O

TTL

—

Digital I/O.

Parallel Slave Port data.

Enhanced CCP1 output.

RD6/PSP6/P1C

RD6

PSP6

P1C

29 4 4

I/O

TTL

—

Digital I/O.

Parallel Slave Port data.

Enhanced CCP1 output.

RD7/PSP7/P1D

RD7

PSP7

P1D

30 5 5

I/O

TTL

—

Digital I/O.

Parallel Slave Port data.

Enhanced CCP1 output.

TABLE 1-4: PIC18F4410/4415/4510/4515/4610 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name

Pin Number Pin

Type

Buffer

Type Description

PDIP QFN TQFP

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O=Output P =Power

Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.

2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.

PIC18F2X1X/4X1X

PORTE is a bidirectional I/O port.

RE0/RD/AN5

RE0

AN5

82525

I/O

TTL

Analog

Digital I/O.

Read control for Parallel Slave Port

(see also WR and CS pins).

Analog input 5.

RE1/WR/AN6

RE1

AN6

92626

I/O

TTL

Analog

Digital I/O.

Write control for Parallel Slave Port

(see CS and RD pins).

Analog input 6.

RE2/CS/AN7

RE2

AN7

10 27 27

I/O

TTL

Analog

Digital I/O.

Chip select control for Parallel Slave Port

(see related RD and WR).

Analog input 7.

RE3 — — — — — See MCLR/VPP/RE3 pin.

VSS 12, 31 6, 30,

6, 29 P — Ground reference for logic and I/O pins.

VDD 11, 32 7, 8,

28, 29

7, 28 P — Positive supply for logic and I/O pins.

NC — 13 12, 13,

33, 34

— — No connect.

TABLE 1-4: PIC18F4410/4415/4510/4515/4610 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name

Pin Number Pin

Type

Buffer

Type Description

PDIP QFN TQFP

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O=Output P =Power

Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set.

2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.

PIC18F2X1X/4X1X

2.0 OSCILLATOR

CONFIGURATIONS

2.1 Oscillator Types

PIC18F2X1X/4X1X devices can be operated in ten

different oscillator modes. The user can program the

Configuration bits, FOSC3:FOSC0, in Configuration

1. LP Low-Power Crystal

2. XT Crystal/Resonator

3. HS High-Speed Crystal/Resonator

4. HSPLL High-Speed Crystal/Resonator

with PLL enabled

5. RC External Resistor/Capacitor with

FOSC/4 output on RA6

6. RCIO External Resistor/Capacitor with I/O

on RA6

7. INTIO1 Internal Oscillator with FOSC/4 output

on RA6 and I/O on RA7

8. INTIO2 Internal Oscillator with I/O on RA6

and RA7

9. EC External Clock with FOSC/4 output

10. ECIO External Clock with I/O on RA6

2.2 Crystal Oscillator/Ceramic

Resonators

In XT, LP, HS or HSPLL Oscillator modes, a crystal or

ceramic resonator is connected to the OSC1 and

OSC2 pins to establish oscillation. Figure 2-1 shows

the pin connections.

The oscillator design requires the use of a parallel cut

crystal.

FIGURE 2-1: CRYSTAL/CERAMIC

RESONATOR OPERATION

(XT, LP, HS OR HSPLL

CONFIGURATION)

TABLE 2-1: CAPACITOR SELECTION FOR

CERAMIC RESONATORS

Note: Use of a series cut crystal may give a

frequency out of the crystal manufacturer’s

specifications.

Typical Capacitor Values Used:

Mode Freq OSC1 OSC2

XT 3.58 MHz

4.19 MHz

4 MHz

15 pF

30 pF

50 pF

15 pF

30 pF

50 pF

Capacitor values are for design guidance only.

Different capacitor values may be required to produce

acceptable oscillator operation. The user should test

the performance of the oscillator over the expected

VDD and temperature range for the application.

See the notes following Table 2-2 for additional

information.

Note: When using resonators with frequencies

above 3.5 MHz, the use of HS mode,

rather than XT mode, is recommended.

HS mode may be used at any VDD for

which the controller is rated. If HS is

selected, it is possible that the gain of the

oscillator will overdrive the resonator.

Therefore, a series resistor should be

placed between the OSC2 pin and the

resonator. As a good starting point, the

recommended value of RS is 330Ω.

Note 1: See Table 2-1 and Table 2-2 for initial values of

C1 and C2.

2: A series resistor (RS) may be required for AT

strip cut crystals.

3: RF varies with the oscillator mode chosen.

C1(1)

C2(1)

XTAL

OSC2

OSC1

RF(3)

Sleep

Logic

PIC18FXXXX

RS(2)

Internal

PIC18F2X1X/4X1X

TABLE 2-2: CAPACITOR SELECTION FOR

CRYSTAL OSCILLATOR

An external clock source may also be connected to the

OSC1 pin in the HS mode, as shown in Figure 2-2.

FIGURE 2-2: EXTERNAL CLOCK INPUT

OPERATION

(HS OSCILLATOR

CONFIGURATION)

2.3 External Clock Input

The EC and ECIO Oscillator modes require an external

clock source to be connected to the OSC1 pin. There is

no oscillator start-up time required after a Power-on

Reset or after an exit from Sleep mode.

In the EC Oscillator mode, the oscillator frequency

divided by 4 is available on the OSC2 pin. This signal

may be used for test purposes or to synchronize other

logic. Figure 2-3 shows the pin connections for the EC

Oscillator mode.

FIGURE 2-3: EXTERNAL CLOCK

INPUT OPERATION

(EC CONFIGURATION)

The ECIO Oscillator mode functions like the EC mode,

except that the OSC2 pin becomes an additional

general purpose I/O pin. The I/O pin becomes bit 6 of

PORTA (RA6). Figure 2-4 shows the pin connections

for the ECIO Oscillator mode.

FIGURE 2-4: EXTERNAL CLOCK

INPUT OPERATION

(ECIO CONFIGURATION)

Osc Type Crystal

Freq

Typical Capacitor Values

Tested:

C1 C2

LP 32 kHz 30 pF 30 pF

XT 1 MHz

4 MHz

15 pF

HS 4 MHz

10 MHz

20 MHz

25 MHz

15 pF

Capacitor values are for design guidance only.

Different capacitor values may be required to produce

acceptable oscillator operation. The user should test

the performance of the oscillator over the expected

VDD and temperature range for the application.

See the notes following this table for additional

information.

Note 1: Higher capacitance increases the stability

of the oscillator but also increases the

start-up time.

2: When operating below 3V VDD, or when

using certain ceramic resonators at any

voltage, it may be necessary to use the

HS mode or switch to a crystal oscillator.

3: Since each resonator/crystal has its own

characteristics, the user should consult

the resonator/crystal manufacturer for

appropriate values of external

components.

4: Rs may be required to avoid overdriving

crystals with low drive level specification.

5: Always verify oscillator performance over

the VDD and temperature range that is

expected for the application.

OSC1

OSC2

Open

Clock from

Ext. System PIC18FXXXX

(HS Mode)

OSC1/CLKI

OSC2/CLKO

FOSC/4

Clock from

Ext. System PIC18FXXXX

OSC1/CLKI

I/O (OSC2)

RA6

Clock from

Ext. System PIC18FXXXX

PIC18F2X1X/4X1X

2.4 RC Oscillator

For timing insensitive applications, the “RC” and

“RCIO” device options offer additional cost savings.

The actual oscillator frequency is a function of several

factors:

• supply voltage

• values of the external resistor (REXT) and

capacitor (CEXT)

• operating temperature

Given the same device, operating voltage and tempera-

ture and component values, there will also be unit-to-unit

frequency variations. These are due to factors such as:

• normal manufacturing variation

• difference in lead frame capacitance between

package types (especially for low CEXT values)

• variations within the tolerance of limits of REXT

and CEXT

In the RC Oscillator mode, the oscillator frequency

divided by 4 is available on the OSC2 pin. This signal

may be used for test purposes or to synchronize other

logic. Figure 2-5 shows how the R/C combination is

connected.

FIGURE 2-5: RC OSCILLATOR MODE

The RCIO Oscillator mode (Figure 2-6) functions like

the RC mode, except that the OSC2 pin becomes an

additional general purpose I/O pin. The I/O pin

becomes bit 6 of PORTA (RA6).

FIGURE 2-6: RCIO OSCILLATOR MODE

2.5 PLL Frequency Multiplier

A Phase Locked Loop (PLL) circuit is provided as an

option for users who wish to use a lower frequency

oscillator circuit or to clock the device up to its highest

rated frequency from a crystal oscillator. This may be

useful for customers who are concerned with EMI due

to high-frequency crystals or users who require higher

clock speeds from an internal oscillator.

2.5.1 HSPLL OSCILLATOR MODE

The HSPLL mode makes use of the HS mode oscillator

for frequencies up to 10 MHz. A PLL then multiplies the

oscillator output frequency by 4 to produce an internal

clock frequency up to 40 MHz. The PLLEN bit is not

available in this oscillator mode.

The PLL is only available to the crystal oscillator when

the FOSC3:FOSC0 Configuration bits are programmed

for HSPLL mode (= 0110).

FIGURE 2-7: PLL BLOCK DIAGRAM

(HS MODE)

2.5.2 PLL AND INTOSC

The PLL is also available to the internal oscillator block

in selected oscillator modes. In this configuration, the

PLL is enabled in software and generates a clock

output of up to 32 MHz. The operation of INTOSC with

the PLL is described in Section 2.6.4 “PLL in INTOSC

Modes”.

OSC2/CLKO

CEXT

REXT

PIC18FXXXX

OSC1

FOSC/4

Internal

Clock

VDD

VSS

Recommended values: 3 kΩ ≤ REXT ≤ 100 kΩ

CEXT > 20 pF

CEXT

REXT

PIC18FXXXX

OSC1 Internal

Clock

VDD

VSS

Recommended values: 3 kΩ ≤ REXT ≤ 100 kΩ

CEXT > 20 pF

I/O (OSC2)

RA6

MUX

VCO

Loop

Filter

Crystal

Osc

OSC2

OSC1

PLL Enable

FIN

FOUT

SYSCLK

Phase

Comparator

HS Oscillator Enable

÷4

(from Configuration Register 1H)

HS Mode

PIC18F2X1X/4X1X
DS39636C-page 26 Preliminary © 2007 Microchip Technology Inc.
2.6 Internal Oscillator Block
The PIC18F2X1X/4X1X devices include an internal
oscillator block which generates two different clock
signals; either can be used as the microcontroller’s
clock source. This may eliminate the need for external
oscillator circuits on the OSC1 and/or OSC2 pins.
The main output (INTOSC) is an 8 MHz clock source,
which can be used to directly drive the device clock. It
also drives a postscaler, which can provide a range of
clock frequencies from 31 kHz to 4 MHz. The INTOSC
output is enabled when a clock frequency from 125 kHz
to 8 MHz is selected.
The other clock source is the internal RC oscillator
(INTRC), which provides a nominal 31 kHz output.
INTRC is enabled if it is selected as the device clock
source; it is also enabled automatically when any of the
following are enabled: 
• Power-up Timer
• Fail-Safe Clock Monitor
• Watchdog Timer
• Two-Speed Start-up
These features are discussed in greater detail in
Section 22.0 “Special Features of the CPU”.
The clock source frequency (INTOSC direct, INTRC
direct or INTOSC postscaler) is selected by configuring
the IRCF bits of the OSCCON register (page 30).
2.6.1 INTIO MODES
Using the internal oscillator as the clock source elimi-
nates the need for up to two external oscillator pins,
which can then be used for digital I/O. Two distinct
configurations are available:
• In INTIO1 mode, the OSC2 pin outputs FOSC/4, 
while OSC1 functions as RA7 for digital input and 
output.
• In INTIO2 mode, OSC1 functions as RA7 and 
OSC2 functions as RA6, both for digital input and 
output.
2.6.2 INTOSC OUTPUT FREQUENCY
The internal oscillator block is calibrated at the factory
to produce an INTOSC output frequency of 8.0 MHz. 
The INTRC oscillator operates independently of the
INTOSC source. Any changes in INTOSC across
voltage and temperature are not necessarily reflected
by changes in INTRC and vice versa.
2.6.3 OSCTUNE REGISTER
The internal oscillator’s output has been calibrated at
the factory but can be adjusted in the user’s applica-
tion. This is done by writing to the OSCTUNE register
(Register 2-1). The tuning sensitivity is constant
throughout the tuning range.
When the OSCTUNE register is modified, the INTOSC
frequency will begin shifting to the new frequency. The
INTRC clock will reach the new frequency within
8 clock cycles (approximately 8 * 32 μs=256μs). The
INTOSC clock will stabilize within 1 ms. Code execu-
tion continues during this shift. There is no indication
that the shift has occurred.
The OSCTUNE register also implements the INTSRC
and PLLEN bits, which control certain features of the
internal oscillator block. The INTSRC bit allows users
to select which internal oscillator provides the clock
source when the 31 kHz frequency option is selected.
This is covered in greater detail in Section 2.7.1
“Oscillator Control Register”. 
The PLLEN bit controls the operation of the frequency
multiplier, PLL, in Internal Oscillator modes.
2.6.4 PLL IN INTOSC MODES
The 4x frequency multiplier can be used with the
internal oscillator block to produce faster device clock
speeds than are normally possible with an internal
oscillator. When enabled, the PLL produces a clock
speed of up to 32 MHz.
Unlike HSPLL mode, the PLL is controlled through
software. The control bit, PLLEN (OSCTUNE<6>), is
used to enable or disable its operation. 
The PLL is available when the device is configured to
use the internal oscillator block as its primary clock
source (FOSC3:FOSC0 = 1001 or 1000). Additionally,
the PLL will only function when the selected output fre-
quency is either 4 MHz or 8 MHz (OSCCON<6:4> = 111
or 110). If both of these conditions are not met, the PLL
is disabled.
The PLLEN control bit is only functional in those
internal Oscillator modes where the PLL is available. In
all other modes, it is forced to ‘0’ and is effectively
unavailable.
2.6.5 INTOSC FREQUENCY DRIFT
The factory calibrates the internal oscillator block
output (INTOSC) for 8 MHz. However, this frequency
may drift as VDD or temperature changes, which can
affect the controller operation in a variety of ways. It is
possible to adjust the INTOSC frequency by modifying
the value in the OSCTUNE register. This has no effect
on the INTRC clock source frequency.
Tuning the INTOSC source requires knowing when to
make the adjustment, in which direction it should be
made and in some cases, how large a change is
needed. Three compensation techniques are
discussed in Section 2.6.5.1 “Compensating with
the USART”,  Section 2.6.5.2 “Compensating with
the Timers” and Section 2.6.5.3 “Compensating
with the CCP Module in Capture Mode”, but other
techniques may be used.

PIC18F2X1X/4X1X

2.6.5.1 Compensating with the USART

An adjustment may be required when the USART

begins to generate framing errors or receives data with

errors while in Asynchronous mode. Framing errors

indicate that the device clock frequency is too high; to

adjust for this, decrement the value in OSCTUNE to

reduce the clock frequency. On the other hand, errors

in data may suggest that the clock speed is too low; to

compensate, increment OSCTUNE to increase the

clock frequency.

2.6.5.2 Compensating with the Timers

This technique compares device clock speed to some

reference clock. Two timers may be used; one timer is

clocked by the peripheral clock, while the other is

clocked by a fixed reference source, such as the

Timer1 oscillator.

Both timers are cleared, but the timer clocked by the

reference generates interrupts. When an interrupt

occurs, the internally clocked timer is read and both

timers are cleared. If the internally clocked timer value

is greater than expected, then the internal oscillator

block is running too fast. To adjust for this, decrement

the OSCTUNE register.

2.6.5.3 Compensating with the CCP Module

in Capture Mode

A CCP module can use free running Timer1 (or

Timer3), clocked by the internal oscillator block and an

external event with a known period (i.e., AC power

frequency). The time of the first event is captured in the

CCPRxH:CCPRxL registers and is recorded for use

later. When the second event causes a capture, the

time of the first event is subtracted from the time of the

second event. Since the period of the external event is

known, the time difference between events can be

calculated.

If the measured time is much greater than the calcu-

lated time, the internal oscillator block is running too

fast; to compensate, decrement the OSCTUNE register.

If the measured time is much less than the calculated

time, the internal oscillator block is running too slow; to

compensate, increment the OSCTUNE register.

R/W-0 R/W-0(1) U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

INTSRC PLLEN(1) — TUN4 TUN3 TUN2 TUN1 TUN0

bit 7 bit 0

bit 7 INTSRC: Internal Oscillator Low-Frequency Source Select bit

1 = 31.25 kHz device clock derived from 8 MHz INTOSC source (divide-by-256 enabled)

0 = 31 kHz device clock derived directly from INTRC internal oscillator

bit 6 PLLEN: Frequency Multiplier PLL for INTOSC Enable bit(1)

1 = PLL enabled for INTOSC (4 MHz and 8 MHz only)

0 = PLL disabled

Note 1: Available only in certain oscillator configurations; otherwise, this bit is unavailable

and reads as ‘0’. See Section 2.6.4 “PLL in INTOSC Modes” for details.

bit 5 Unimplemented: Read as ‘0’

bit 4-0 TUN4:TUN0: Frequency Tuning bits

01111 = Maximum frequency

• •

00001

00000 = Center frequency. Oscillator module is running at the calibrated frequency.

11111

• •

10000 = Minimum frequency

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

2.7 Clock Sources and Oscillator

Switching

Like previous PIC18 devices, the PIC18F2X1X/4X1X

family includes a feature that allows the device clock

source to be switched from the main oscillator to an

alternate low-frequency clock source. PIC18F2X1X/

4X1X devices offer two alternate clock sources. When

an alternate clock source is enabled, the various

power-managed operating modes are available.

Essentially, there are three clock sources for these

devices:

• Primary oscillators

• Secondary oscillators

• Internal oscillator block

The primary oscillators include the External Crystal

and Resonator modes, the External RC modes, the

External Clock modes and the internal oscillator block.

The particular mode is defined by the FOSC3:FOSC0

Configuration bits. The details of these modes are

covered earlier in this chapter.

The secondary oscillators are those external sources

not connected to the OSC1 or OSC2 pins. These

sources may continue to operate even after the

controller is placed in a power-managed mode.

PIC18F2X1X/4X1X devices offer the Timer1 oscillator

as a secondary oscillator. This oscillator, in all power-

managed modes, is often the time base for functions

such as a real-time clock.

Most often, a 32.768 kHz watch crystal is connected

between the RC0/T1OSO/T13CKI and RC1/T1OSI

pins. Like the LP mode oscillator circuit, loading

capacitors are also connected from each pin to ground.

The Timer1 oscillator is discussed in greater detail in

Section 11.3 “Timer1 Oscillator”.

In addition to being a primary clock source, the internal

oscillator block is available as a power-managed

mode clock source. The INTRC source is also used as

the clock source for several special features, such as

the WDT and Fail-Safe Clock Monitor.

The clock sources for the PIC18F2X1X/4X1X devices

are shown in Figure 2-8. See Section 22.0 “Special

Features of the CPU” for Configuration register details.

FIGURE 2-8: PIC18F2X1X/4X1X CLOCK DIAGRAM

PIC18F2X1X/4X1X

4 x PLL

FOSC3:FOSC0

Secondary Oscillator

T1OSCEN

Enable

Oscillator

T1OSO

T1OSI

Clock Source Option

for other Modules

OSC1

OSC2

Sleep HSPLL, INTOSC/PLL

LP, XT, HS, RC, EC

T1OSC

CPU

Peripherals

IDLEN

Postscaler

MUX

8 MHz

4 MHz

2 MHz

1 MHz

500 kHz

125 kHz

250 kHz

OSCCON<6:4>

111

110

101

100

011

010

001

000

31 kHz

INTRC

Source

Internal

Oscillator

Block

WDT, PWRT, FSCM

8 MHz

Internal Oscillator

(INTOSC)

OSCCON<6:4>

Clock

Control

OSCCON<1:0>

Source

8 MHz

31 kHz (INTRC)

OSCTUNE<6>

OSCTUNE<7>

and Two-Speed Start-up

Primary Oscillator

PIC18F2X1X/4X1X

2.7.1 OSCILLATOR CONTROL REGISTER

The OSCCON register (Register 2-2) controls several

aspects of the device clock’s operation, both in full

power operation and in power-managed modes.

The System Clock Select bits, SCS1:SCS0, select the

clock source. The available clock sources are the

primary clock (defined by the FOSC3:FOSC0 Configu-

ration bits), the secondary clock (Timer1 oscillator) and

the internal oscillator block. The clock source changes

immediately after one or more of the bits is written to,

following a brief clock transition interval. The SCS bits

are cleared on all forms of Reset.

The Internal Oscillator Frequency Select bits

(IRCF2:IRCF0) select the frequency output of the

internal oscillator block to drive the device clock. The

choices are the INTRC source, the INTOSC source

(8 MHz) or one of the frequencies derived from the

INTOSC postscaler (31.25 kHz to 4 MHz). If the

internal oscillator block is supplying the device clock,

changing the states of these bits will have an immedi-

ate change on the internal oscillator’s output. On

device Resets, the default output frequency of the

internal oscillator block is set at 1 MHz.

When a nominal output frequency of 31 kHz is selected

(IRCF2:IRCF0 = 000), users may choose which inter-

nal oscillator acts as the source. This is done with the

INTSRC bit in the OSCTUNE register (OSCTUNE<7>).

Setting this bit selects INTOSC as a 31.25 kHz clock

source by enabling the divide-by-256 output of the

INTOSC postscaler. Clearing INTSRC selects INTRC

(nominally 31 kHz) as the clock source.

This option allows users to select the tunable and more

precise INTOSC as a clock source, while maintaining

power savings with a very low clock speed. Regardless

of the setting of INTSRC, INTRC always remains the

clock source for features such as the Watchdog Timer

and the Fail-Safe Clock Monitor.

The OSTS, IOFS and T1RUN bits indicate which clock

source is currently providing the device clock. The

OSTS bit indicates that the Oscillator Start-up Timer

has timed out and the primary clock is providing the

device clock in Primary Clock modes. The IOFS bit

indicates when the internal oscillator block has stabi-

lized and is providing the device clock in RC Clock

modes. The T1RUN bit (T1CON<6>) indicates when

the Timer1 oscillator is providing the device clock in

Secondary Clock modes. In power-managed modes,

only one of these three bits will be set at any time. If

none of these bits are set, the INTRC is providing the

clock or the internal oscillator block has just started and

is not yet stable.

The IDLEN bit determines if the device goes into Sleep

mode or one of the Idle modes when the SLEEP

instruction is executed.

The use of the flag and control bits in the OSCCON

“Power-Managed Modes”.

2.7.2 OSCILLATOR TRANSITIONS

PIC18F2X1X/4X1X devices contain circuitry to prevent

clock “glitches” when switching between clock sources.

A short pause in the device clock occurs during the

clock switch. The length of this pause is the sum of two

cycles of the old clock source and three to four cycles

of the new clock source. This formula assumes that the

new clock source is stable.

Clock transitions are discussed in greater detail in

Section 3.1.2 “Entering Power-Managed Modes”.

Note 1: The Timer1 oscillator must be enabled to

select the secondary clock source. The

Timer1 oscillator is enabled by setting the

T1OSCEN bit in the Timer1 Control regis-

ter (T1CON<3>). If the Timer1 oscillator

is not enabled, then any attempt to select

a secondary clock source will be ignored.

2: It is recommended that the Timer1

oscillator be operating and stable before

selecting the secondary clock source or a

very long delay may occur while the

Timer1 oscillator starts.

PIC18F2X1X/4X1X

R/W-0 R/W-1 R/W-0 R/W-0 R(1) R-0 R/W-0 R/W-0

IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0

bit 7 bit 0

bit 7 IDLEN: Idle Enable bit

1 = Device enters Idle mode on SLEEP instruction

0 = Device enters Sleep mode on SLEEP instruction

bit 6-4 IRCF2:IRCF0: Internal Oscillator Frequency Select bits

111 = 8 MHz (INTOSC drives clock directly)

110 = 4 MHz

101 = 2 MHz

100 = 1 MHz(3)

011 = 500 kHz

010 = 250 kHz

001 = 125 kHz

000 = 31 kHz (from either INTOSC/256 or INTRC directly)(2)

bit 3 OSTS: Oscillator Start-up Time-out Status bit(1)

1 = Oscillator start-up time-out timer has expired; primary oscillator is running

0 = Oscillator start-up time-out timer is running; primary oscillator is not ready

bit 2 IOFS: INTOSC Frequency Stable bit

1 = INTOSC frequency is stable

0 = INTOSC frequency is not stable

bit 1-0 SCS1:SCS0: System Clock Select bits

1x = Internal oscillator block

01 = Secondary (Timer1) oscillator

00 = Primary oscillator

Note 1: Reset state depends on state of the IESO Configuration bit.

2: Source selected by the INTSRC bit (OSCTUNE<7>), see text.

3: Default output frequency of INTOSC on Reset.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 31
PIC18F2X1X/4X1X
2.8 Effects of Power-Managed Modes 
on the Various Clock Sources
When PRI_IDLE mode is selected, the designated
primary oscillator continues to run without interruption.
For all other power-managed modes, the oscillator
using the OSC1 pin is disabled. The OSC1 pin (and
OSC2 pin, if used by the oscillator) will stop oscillating. 
In Secondary Clock modes (SEC_RUN and
SEC_IDLE), the Timer1 oscillator is operating and
providing the device clock. The Timer1 oscillator may
also run in all power-managed modes if required to
clock Timer1 or Timer3.
In Internal Oscillator modes (RC_RUN and RC_IDLE),
the internal oscillator block provides the device clock
source. The 31 kHz INTRC output can be used directly
to provide the clock and may be enabled to support
various special features, regardless of the power-
managed mode (see Section 22.2 “Watchdog Timer
(WDT)”,  Section 22.3 “Two-Speed Start-up” and
Section 22.4 “Fail-Safe Clock Monitor” for more
information on WDT, Fail-Safe Clock Monitor and Two-
Speed Start-up). The INTOSC output at 8 MHz may be
used directly to clock the device or may be divided
down by the postscaler. The INTOSC output is disabled
if the clock is provided directly from the INTRC output.
If the Sleep mode is selected, all clock sources are
stopped. Since all the transistor switching currents
have been stopped, Sleep mode achieves the lowest
current consumption of the device (only leakage
currents).
Enabling any on-chip feature that will operate during
Sleep will increase the current consumed during Sleep.
The INTRC is required to support WDT operation. The
Timer1 oscillator may be operating to support a real-
time clock. Other features may be operating that do not
require a device clock source (i.e., SSP slave, PSP,
INTn pins and others). Peripherals that may add
significant current consumption are listed in
Section 25.2 “DC Characteristics”.
2.9 Power-up Delays
Power-up delays are controlled by two timers, so that
no external Reset circuitry is required for most applica-
tions. The delays ensure that the device is kept in
Reset until the device power supply is stable under nor-
mal circumstances and the primary clock is operating
and stable. For additional information on power-up
delays, see Section 4.5 “Device Reset Timers”.
The first timer is the Power-up Timer (PWRT), which
provides a fixed delay on power-up (parameter 33,
Table 25-10). It is enabled by clearing (= 0) the
PWRTEN Configuration bit. 
The second timer is the Oscillator Start-up Timer
(OST), intended to keep the chip in Reset until the
crystal oscillator is stable (LP, XT and HS modes). The
OST does this by counting 1024 oscillator cycles
before allowing the oscillator to clock the device.
When the HSPLL Oscillator mode is selected, the
device is kept in Reset for an additional 2 ms, following
the HS mode OST delay, so the PLL can lock to the
incoming clock frequency.
There is a delay of interval T
CSD (parameter 38,
Table 25-10), following POR, while the controller
becomes ready to execute instructions. This delay runs
concurrently with any other delays. This may be the
only delay that occurs when any of the EC, RC or INTIO
modes are used as the primary clock source.
TABLE 2-3: OSC1 AND OSC2 PIN STATES IN SLEEP MODE  
Oscillator Mode OSC1 Pin OSC2 Pin
RC, INTIO1 Floating, external resistor should pull high At logic low (clock/4 output)
RCIO Floating, external resistor should pull high Configured as PORTA, bit 6
INTIO2 Configured as PORTA, bit 7 Configured as PORTA, bit 6
ECIO Floating, pulled by external clock Configured as PORTA, bit 6
EC Floating, pulled by external clock At logic low (clock/4 output)
LP, XT and HS Feedback inverter disabled at quiescent 
voltage level
Feedback inverter disabled at quiescent 
voltage level
Note: See Table 4-2 in Section 4.0 “Reset” for time-outs due to Sleep and MCLR Reset.

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

3.0 POWER-MANAGED MODES

PIC18F2X1X/4X1X devices offer a total of seven oper-

ating modes for more efficient power management.

These modes provide a variety of options for selective

power conservation in applications where resources

may be limited (i.e., battery-powered devices).

There are three categories of power-managed modes:

• Run modes

• Idle modes

• Sleep mode

These categories define which portions of the device

are clocked and sometimes, what speed. The Run and

Idle modes may use any of the three available clock

sources (primary, secondary or internal oscillator

block); the Sleep mode does not use a clock source.

The power-managed modes include several power-

saving features offered on previous PIC® devices. One

is the clock switching feature, offered in other PIC18

devices, allowing the controller to use the Timer1 oscil-

lator in place of the primary oscillator. Also included is

the Sleep mode, offered by all PIC devices, where all

device clocks are stopped.

3.1 Selecting Power-Managed Modes

Selecting a power-managed mode requires two

decisions: if the CPU is to be clocked or not and the

selection of a clock source. The IDLEN bit

(OSCCON<7>) controls CPU clocking, while the

SCS1:SCS0 bits (OSCCON<1:0>) select the clock

source. The individual modes, bit settings, clock sources

and affected modules are summarized in Table 3-1.

3.1.1 CLOCK SOURCES

The SCS1:SCS0 bits allow the selection of one of three

clock sources for power-managed modes. They are:

• the primary clock, as defined by the

FOSC3:FOSC0 Configuration bits

• the secondary clock (the Timer1 oscillator)

• the internal oscillator block (for RC modes)

3.1.2 ENTERING POWER-MANAGED

MODES

Switching from one power-managed mode to another

begins by loading the OSCCON register. The

SCS1:SCS0 bits select the clock source and determine

which Run or Idle mode is to be used. Changing these

bits causes an immediate switch to the new clock

source, assuming that it is running. The switch may

also be subject to clock transition delays. These are

discussed in Section 3.1.3 “Clock Transitions and

Status Indicators” and subsequent sections.

Entry to the power-managed Idle or Sleep modes is

triggered by the execution of a SLEEP instruction. The

actual mode that results depends on the status of the

IDLEN bit.

Depending on the current mode and the mode being

switched to, a change to a power-managed mode does

not always require setting all of these bits. Many

transitions may be done by changing the oscillator select

bits, or changing the IDLEN bit, prior to issuing a SLEEP

instruction. If the IDLEN bit is already configured

correctly, it may only be necessary to perform a SLEEP

instruction to switch to the desired mode.

TABLE 3-1: POWER-MANAGED MODES

Mode

OSCCON Bits Module Clocking

Available Clock and Oscillator Source

IDLEN(1)

<7>

SCS1:SCS0

<1:0> CPU Peripherals

Sleep 0N/A Off Off None – All clocks are disabled

PRI_RUN N/A 00 Clocked Clocked Primary – LP, XT, HS, HSPLL, RC, EC and

Internal Oscillator Block(2).

This is the normal full power execution mode.

SEC_RUN N/A 01 Clocked Clocked Secondary – Timer1 Oscillator

RC_RUN N/A 1x Clocked Clocked Internal Oscillator Block(2)

PRI_IDLE 100Off Clocked Primary – LP, XT, HS, HSPLL, RC, EC

SEC_IDLE 101Off Clocked Secondary – Timer1 Oscillator

RC_IDLE 11xOff Clocked Internal Oscillator Block(2)

Note 1: IDLEN reflects its value when the SLEEP instruction is executed.

2: Includes INTOSC and INTOSC postscaler, as well as the INTRC source.

PIC18F2X1X/4X1X

3.1.3 CLOCK TRANSITIONS AND

STATUS INDICATORS

The length of the transition between clock sources is

the sum of two cycles of the old clock source and three

to four cycles of the new clock source. This formula

assumes that the new clock source is stable.

Three bits indicate the current clock source and its

status. They are:

• OSTS (OSCCON<3>)

• IOFS (OSCCON<2>)

• T1RUN (T1CON<6>)

In general, only one of these bits will be set while in a

given power-managed mode. When the OSTS bit is

set, the primary clock is providing the device clock.

When the IOFS bit is set, the INTOSC output is

providing a stable 8 MHz clock source to a divider that

actually drives the device clock. When the T1RUN bit is

set, the Timer1 oscillator is providing the clock. If none

of these bits are set, then either the INTRC clock

source is clocking the device, or the INTOSC source is

not yet stable.

If the internal oscillator block is configured as the

primary clock source by the FOSC3:FOSC0 Configura-

tion bits, then both the OSTS and IOFS bits may be set

when in PRI_RUN or PRI_IDLE modes. This indicates

that the primary clock (INTOSC output) is generating a

stable 8 MHz output. Entering another power-managed

RC mode at the same frequency would clear the OSTS

bit.

3.1.4 MULTIPLE SLEEP COMMANDS

The power-managed mode that is invoked with the

SLEEP instruction is determined by the setting of the

IDLEN bit at the time the instruction is executed. If

another SLEEP instruction is executed, the device will

enter the power-managed mode specified by IDLEN at

that time. If IDLEN has changed, the device will enter

the new power-managed mode specified by the new

setting.

3.2 Run Modes

In the Run modes, clocks to both the core and

peripherals are active. The difference between these

modes is the clock source.

3.2.1 PRI_RUN MODE

The PRI_RUN mode is the normal, full power execution

mode of the microcontroller. This is also the default

mode upon a device Reset, unless Two-Speed Start-up

is enabled (see Section 22.3 “Two-Speed Start-up”

for details). In this mode, the OSTS bit is set. The IOFS

bit may be set if the internal oscillator block is the

primary clock source (see Section 2.7.1 “Oscillator

Control Register”).

3.2.2 SEC_RUN MODE

The SEC_RUN mode is the compatible mode to the

“clock switching” feature offered in other PIC18

devices. In this mode, the CPU and peripherals are

clocked from the Timer1 oscillator. This gives users the

option of lower power consumption while still using a

high accuracy clock source.

SEC_RUN mode is entered by setting the SCS1:SCS0

bits to ‘01’. The device clock source is switched to the

Timer1 oscillator (see Figure 3-1), the primary oscilla-

tor is shut down, the T1RUN bit (T1CON<6>) is set and

the OSTS bit is cleared.

On transitions from SEC_RUN mode to PRI_RUN, the

peripherals and CPU continue to be clocked from the

Timer1 oscillator while the primary clock is started.

When the primary clock becomes ready, a clock switch

back to the primary clock occurs (see Figure 3-2).

When the clock switch is complete, the T1RUN bit is

cleared, the OSTS bit is set and the primary clock is

providing the clock. The IDLEN and SCS bits are not

affected by the wake-up; the Timer1 oscillator

continues to run.

Note 1: Caution should be used when modifying a

single IRCF bit. If VDD is less than 3V, it is

possible to select a higher clock speed

than is supported by the low VDD.

Improper device operation may result if

the VDD/FOSC specifications are violated.

2: Executing a SLEEP instruction does not

necessarily place the device into Sleep

mode. It acts as the trigger to place the

controller into either the Sleep mode or

one of the Idle modes, depending on the

setting of the IDLEN bit.

Note: The Timer1 oscillator should already be

running prior to entering SEC_RUN mode.

If the T1OSCEN bit is not set when the

SCS1:SCS0 bits are set to ‘01’, entry to

SEC_RUN mode will not occur. If the

Timer1 oscillator is enabled but not yet

running, device clocks will be delayed until

the oscillator has started. In such situa-

tions, initial oscillator operation is far from

stable and unpredictable operation may

result.

PIC18F2X1X/4X1X

FIGURE 3-1: TRANSITION TIMING FOR ENTRY TO SEC_RUN MODE

FIGURE 3-2: TRANSITION TIMING FROM SEC_RUN MODE TO PRI_RUN MODE (HSPLL)

3.2.3 RC_RUN MODE

In RC_RUN mode, the CPU and peripherals are

clocked from the internal oscillator block using the

INTOSC multiplexer. In this mode, the primary clock is

shut down. When using the INTRC source, this mode

provides the best power conservation of all the Run

modes, while still executing code. It works well for user

applications which are not highly timing sensitive or do

not require high-speed clocks at all times.

If the primary clock source is the internal oscillator

block (either INTRC or INTOSC), there are no

distinguishable differences between PRI_RUN and

RC_RUN modes during execution. However, a clock

switch delay will occur during entry to and exit from

RC_RUN mode. Therefore, if the primary clock source

is the internal oscillator block, the use of RC_RUN

mode is not recommended.

This mode is entered by setting SCS1 to ‘1’. Although

it is ignored, it is recommended that SCS0 also be

cleared; this is to maintain software compatibility with

future devices. When the clock source is switched to

the INTOSC multiplexer (see Figure 3-3), the primary

oscillator is shut down and the OSTS bit is cleared. The

IRCF bits may be modified at any time to immediately

change the clock speed.

Q4Q3Q2

OSC1

Peripheral

Program

T1OSI

Counter

Clock

CPU

Clock

PC + 2PC

123 n-1n

Clock Transition

Q4Q3Q2 Q1 Q3Q2

PC + 4

(1)

Note 1: Clock transition typically occurs within 2-4 TOSC.

Q1 Q3 Q4

OSC1

Peripheral

Program PC

T1OSI

PLL Clock

PC + 4

Output

Q3 Q4 Q1

CPU Clock

PC + 2

Clock

Counter

Q2 Q2 Q3

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

2: Clock transition typically occurs within 2-4 TOSC.

SCS1:SCS0 bits changed

TPLL(1)

12 n-1n

Clock

OSTS bit set

Transition

(2)

TOST(1)

Note: Caution should be used when modifying a

single IRCF bit. If VDD is less than 3V, it is

possible to select a higher clock speed

than is supported by the low VDD.

Improper device operation may result if

the VDD/FOSC specifications are violated.

PIC18F2X1X/4X1X

If the IRCF bits and the INTSRC bit are all clear, the

INTOSC output is not enabled and the IOFS bit will

remain clear; there will be no indication of the current

clock source. The INTRC source is providing the

device clocks.

If the IRCF bits are changed from all clear (thus,

enabling the INTOSC output) or if INTSRC is set, the

IOFS bit becomes set after the INTOSC output

becomes stable. Clocks to the device continue while

the INTOSC source stabilizes after an interval of

TIOBST.

If the IRCF bits were previously at a non-zero value, or

if INTSRC was set before setting SCS1 and the

INTOSC source was already stable, the IOFS bit will

remain set.

On transitions from RC_RUN mode to PRI_RUN mode,

the device continues to be clocked from the INTOSC

multiplexer while the primary clock is started. When the

primary clock becomes ready, a clock switch to the

primary clock occurs (see Figure 3-4). When the clock

switch is complete, the IOFS bit is cleared, the OSTS

bit is set and the primary clock is providing the device

clock. The IDLEN and SCS bits are not affected by the

switch. The INTRC source will continue to run if either

the WDT or the Fail-Safe Clock Monitor is enabled.

FIGURE 3-3: TRANSITION TIMING TO RC_RUN MODE

FIGURE 3-4: TRANSITION TIMING FROM RC_RUN MODE TO PRI_RUN MODE

Q4Q3Q2

OSC1

Peripheral

Program

INTRC

Counter

Clock

CPU

Clock

PC + 2PC

123 n-1n

Clock Transition

Q4Q3Q2 Q1 Q3Q2

PC + 4

(1)

Note 1: Clock transition typically occurs within 2-4 TOSC.

Q1 Q3 Q4

OSC1

Peripheral

Program PC

INTOSC

PLL Clock

PC + 4

Output

Q3 Q4 Q1

CPU Clock

PC + 2

Clock

Counter

Q2 Q2 Q3

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

2: Clock transition typically occurs within 2-4 TOSC.

SCS1:SCS0 bits changed

TPLL(1)

12 n-1n

Clock

OSTS bit set

Transition

Multiplexer

(2)

TOST(1)

PIC18F2X1X/4X1X

3.3 Sleep Mode

The power-managed Sleep mode in the PIC18F2X1X/

4X1X devices is identical to the legacy Sleep mode

offered in all other PIC devices. It is entered by clearing

the IDLEN bit (the default state on device Reset) and

executing the SLEEP instruction. This shuts down the

selected oscillator (Figure 3-5). All clock source status

bits are cleared.

Entering the Sleep mode from any other mode does not

require a clock switch. This is because no clocks are

needed once the controller has entered Sleep. If the

WDT is selected, the INTRC source will continue to

operate. If the Timer1 oscillator is enabled, it will also

continue to run.

When a wake event occurs in Sleep mode (by interrupt,

Reset or WDT time-out), the device will not be clocked

until the clock source selected by the SCS1:SCS0 bits

becomes ready (see Figure 3-6), or it will be clocked

from the internal oscillator block if either the Two-

Speed Start-up or the Fail-Safe Clock Monitor are

enabled (see Section 22.0 “Special Features of the

CPU”). In either case, the OSTS bit is set when the pri-

mary clock is providing the device clocks. The IDLEN

and SCS bits are not affected by the wake-up.

3.4 Idle Modes

The Idle modes allow the controller’s CPU to be

selectively shut down while the peripherals continue to

operate. Selecting a particular Idle mode allows users

to further manage power consumption.

If the IDLEN bit is set to a ‘1’ when a SLEEP instruction is

executed, the peripherals will be clocked from the clock

source selected using the SCS1:SCS0 bits; however, the

CPU will not be clocked. The clock source status bits are

not affected. Setting IDLEN and executing a SLEEP

instruction provides a quick method of switching from a

given Run mode to its corresponding Idle mode.

If the WDT is selected, the INTRC source will continue

to operate. If the Timer1 oscillator is enabled, it will also

continue to run.

Since the CPU is not executing instructions, the only

exits from any of the Idle modes are by interrupt, WDT

time-out or a Reset. When a wake event occurs, CPU

execution is delayed by an interval of TCSD

(parameter 38, Table 25-10) while it becomes ready to

execute code. When the CPU begins executing code,

it resumes with the same clock source for the current

Idle mode. For example, when waking from RC_IDLE

mode, the internal oscillator block will clock the CPU

and peripherals (in other words, RC_RUN mode). The

IDLEN and SCS bits are not affected by the wake-up.

While in any Idle mode or the Sleep mode, a WDT time-

out will result in a WDT wake-up to the Run mode

currently specified by the SCS1:SCS0 bits.

FIGURE 3-5: TRANSITION TIMING FOR ENTRY TO SLEEP MODE

FIGURE 3-6: TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL)

Q4Q3Q2

OSC1

Peripheral

Sleep

Program

Q1Q1

Counter

Clock

CPU

Clock

PC + 2PC

Q3 Q4 Q1 Q2

OSC1

Peripheral

Program PC

PLL Clock

Q3 Q4

Output

CPU Clock

Q1 Q2 Q3 Q4 Q1 Q2

Clock

Counter PC + 6

PC + 4

Q1 Q2 Q3 Q4

Wake Event

Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

TOST(1) TPLL(1)

OSTS bit set

PC + 2

PIC18F2X1X/4X1X

3.4.1 PRI_IDLE MODE

This mode is unique among the three low-power Idle

modes, in that it does not disable the primary device

clock. For timing sensitive applications, this allows for

the fastest resumption of device operation with its more

accurate primary clock source, since the clock source

does not have to “warm up” or transition from another

oscillator.

PRI_IDLE mode is entered from PRI_RUN mode by

setting the IDLEN bit and executing a SLEEP instruc-

tion. If the device is in another Run mode, set IDLEN

first, then clear the SCS bits and execute SLEEP.

Although the CPU is disabled, the peripherals continue

to be clocked from the primary clock source specified

by the FOSC3:FOSC0 Configuration bits. The OSTS

bit remains set (see Figure 3-7).

When a wake event occurs, the CPU is clocked from the

primary clock source. A delay of interval TCSD is

required between the wake event and when code

execution starts. This is required to allow the CPU to

become ready to execute instructions. After the wake-

up, the OSTS bit remains set. The IDLEN and SCS bits

are not affected by the wake-up (see Figure 3-8).

3.4.2 SEC_IDLE MODE

In SEC_IDLE mode, the CPU is disabled but the

peripherals continue to be clocked from the Timer1

oscillator. This mode is entered from SEC_RUN by

setting the IDLEN bit and executing a SLEEP

instruction. If the device is in another Run mode, set

IDLEN first, then set SCS1:SCS0 to ‘01’ and execute

SLEEP. When the clock source is switched to the

Timer1 oscillator, the primary oscillator is shut down,

the OSTS bit is cleared and the T1RUN bit is set.

When a wake event occurs, the peripherals continue to

be clocked from the Timer1 oscillator. After an interval

of TCSD following the wake event, the CPU begins exe-

cuting code being clocked by the Timer1 oscillator. The

IDLEN and SCS bits are not affected by the wake-up;

the Timer1 oscillator continues to run (see Figure 3-8).

FIGURE 3-7: TRANSITION TIMING FOR ENTRY TO IDLE MODE

FIGURE 3-8: TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE

Note: The Timer1 oscillator should already be

running prior to entering SEC_IDLE mode.

If the T1OSCEN bit is not set when the

SLEEP instruction is executed, the SLEEP

instruction will be ignored and entry to

SEC_IDLE mode will not occur. If the

Timer1 oscillator is enabled but not yet

running, peripheral clocks will be delayed

until the oscillator has started. In such

situations, initial oscillator operation is far

from stable and unpredictable operation

may result.

Peripheral

Program PC PC + 2

OSC1

Q3 Q4 Q1

CPU Clock

Clock

Counter

OSC1

Peripheral

Program PC

CPU Clock

Q1 Q3 Q4

Clock

Counter

Wake Event

TCSD

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 39
PIC18F2X1X/4X1X
3.4.3 RC_IDLE MODE
In RC_IDLE mode, the CPU is disabled but the periph-
erals continue to be clocked from the internal oscillator
block using the INTOSC multiplexer. This mode allows
for controllable power conservation during Idle periods.
From RC_RUN, this mode is entered by setting the
IDLEN bit and executing a SLEEP instruction. If the
device is in another Run mode, first set IDLEN, then set
the SCS1 bit and execute SLEEP. Although its value is
ignored, it is recommended that SCS0 also be cleared;
this is to maintain software compatibility with future
devices. The INTOSC multiplexer may be used to
select a higher clock frequency by modifying the IRCF
bits before executing the SLEEP instruction. When the
clock source is switched to the INTOSC multiplexer, the
primary oscillator is shut down and the OSTS bit is
cleared.
If the IRCF bits are set to any non-zero value, or the
INTSRC bit is set, the INTOSC output is enabled. The
IOFS bit becomes set, after the INTOSC output
becomes stable, after an interval of TIOBST
(parameter 39, Table 25-10). Clocks to the peripherals
continue while the INTOSC source stabilizes. If the
IRCF bits were previously at a non-zero value, or
INTSRC was set before the SLEEP instruction was exe-
cuted and the INTOSC source was already stable, the
IOFS bit will remain set. If the IRCF bits and INTSRC
are all clear, the INTOSC output will not be enabled, the
IOFS bit will remain clear and there will be no indication
of the current clock source.
When a wake event occurs, the peripherals continue to
be clocked from the INTOSC multiplexer. After a delay
of TCSD following the wake event, the CPU begins
executing code being clocked by the INTOSC multi-
plexer. The IDLEN and SCS bits are not affected by the
wake-up. The INTRC source will continue to run if
either the WDT or the Fail-Safe Clock Monitor is
enabled.
3.5 Exiting Idle and Sleep Modes
An exit from Sleep mode or any of the Idle modes is
triggered by an interrupt, a Reset or a WDT time-out.
This section discusses the triggers that cause exits
from power-managed modes. The clocking subsystem
actions are discussed in each of the power-managed
modes (see Section 3.2 “Run Modes”, Section 3.3
“Sleep Mode” and Section 3.4 “Idle Modes”). 
3.5.1 EXIT BY INTERRUPT
Any of the available interrupt sources can cause the
device to exit from an Idle mode or the Sleep mode to
a Run mode. To enable this functionality, an interrupt
source must be enabled by setting its enable bit in one
of the INTCON or PIE registers. The exit sequence is
initiated when the corresponding interrupt flag bit is set.
On all exits from Idle or Sleep modes by interrupt, code
execution branches to the interrupt vector if the GIE/
GIEH bit (INTCON<7>) is set. Otherwise, code execu-
tion continues or resumes without branching (see
Section 8.0 “Interrupts”).
A fixed delay of interval TCSD following the wake event
is required when leaving Sleep and Idle modes. This
delay is required for the CPU to prepare for execution.
Instruction execution resumes on the first clock cycle
following this delay.
3.5.2 EXIT BY WDT TIME-OUT
A WDT time-out will cause different actions depending
on which power-managed mode the device is in when
the time-out occurs.
If the device is not executing code (all Idle modes and
Sleep mode), the time-out will result in an exit from the
powe-managed mode (see Section 3.2 “Run Modes”
and  Section 3.3 “Sleep Mode”). If the device is
executing code (all Run modes), the time-out will result
in a WDT Reset (see Section 22.2 “Watchdog Timer
(WDT)”). 
The WDT timer and postscaler are cleared by
executing a SLEEP or CLRWDT instruction, the loss of a
currently selected clock source (if the Fail-Safe Clock
Monitor is enabled) and modifying the IRCF bits in the
OSCCON register if the internal oscillator block is the
device clock source.
3.5.3 EXIT BY RESET
Normally, the device is held in Reset by the Oscillator
Start-up Timer (OST) until the primary clock becomes
ready. At that time, the OSTS bit is set and the device
begins executing code. If the internal oscillator block is
the new clock source, the IOFS bit is set instead. 
The exit delay time from Reset to the start of code
execution depends on both the clock sources before
and after the wake-up and the type of oscillator if the
new clock source is the primary clock. Exit delays are
summarized in Table 3-2.
Code execution can begin before the primary clock
becomes ready. If either the Two-Speed Start-up (see
Section 22.3 “Two-Speed Start-up”) or Fail-Safe
Clock Monitor (see Section 22.4 “Fail-Safe Clock
Monitor”) is enabled, the device may begin execution
as soon as the Reset source has cleared. Execution is
clocked by the INTOSC multiplexer driven by the
internal oscillator block. Execution is clocked by the
internal oscillator block until either the primary clock
becomes ready or a power-managed mode is entered
before the primary clock becomes ready; the primary
clock is then shut down.

PIC18F2X1X/4X1X

3.5.4 EXIT WITHOUT AN OSCILLATOR

START-UP DELAY

Certain exits from power-managed modes do not

invoke the OST at all. There are two cases:

• PRI_IDLE mode, where the primary clock source

is not stopped; and

• the primary clock source is not any of the LP, XT,

HS or HSPLL modes.

In these instances, the primary clock source either

does not require an oscillator start-up delay since it is

already running (PRI_IDLE), or normally does not

require an oscillator start-up delay (RC, EC and INTIO

Oscillator modes). However, a fixed delay of interval

TCSD following the wake event is still required when

leaving Sleep and Idle modes to allow the CPU to

prepare for execution. Instruction execution resumes

on the first clock cycle following this delay.

TABLE 3-2: EXIT DELAY ON WAKE-UP BY RESET FROM SLEEP MODE OR ANY IDLE MODE

(BY CLOCK SOURCES)

Clock Source

before Wake-up

Clock Source

after Wake-up Exit Delay Clock Ready Status

bit (OSCCON)

Primary Device Clock

(PRI_IDLE mode)

LP, XT, HS

TCSD(2)

OSTS

HSPLL

EC, RC

INTRC(1) —

INTOSC(3) IOFS

T1OSC or INTRC(1)

LP, XT, HS TOST(4)

OSTS

HSPLL TOST + trc(4)

EC, RC TCSD(2)

INTOSC(2) TIOBST(5) IOFS

INTOSC(3)

LP, XT, HS TOST(5)

OSTS

HSPLL TOST + trc(4)

EC, RC TCSD(2)

INTOSC(2) None IOFS

None

(Sleep mode)

LP, XT, HS TOST(4)

OSTS

HSPLL TOST + trc(4)

EC, RC TCSD(2)

INTOSC(2) TIOBST(5) IOFS

Note 1: In this instance, refers specifically to the 31 kHz INTRC clock source.

2: TCSD (parameter 38) is a required delay when waking from Sleep and all Idle modes and runs concurrently

with any other required delays (see Section 3.4 “Idle Modes”). On Reset, INTOSC defaults to 1 MHz.

3: Includes both the INTOSC 8 MHz source and postscaler derived frequencies.

4: TOST is the Oscillator Start-up Timer (parameter 32). trc is the PLL Lock-out Timer (parameter F12); it is

also designated as TPLL.

5: Execution continues during TIOBST (parameter 39), the INTOSC stabilization period.

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 41
PIC18F2X1X/4X1X
4.0 RESET
The PIC18F2X1X/4X1X devices differentiate between
various kinds of Reset: 
a) Power-on Reset (POR) 
b) MCLR Reset during normal operation
c) MCLR Reset during power-managed modes 
d) Watchdog Timer (WDT) Reset (during 
execution)
e) Programmable Brown-out Reset (BOR) 
f) RESET Instruction
g) Stack Full Reset
h) Stack Underflow Reset
This section discusses Resets generated by MCLR,
POR and BOR and covers the operation of the various
start-up timers. Stack Reset events are covered in
Section 5.1.2.4 “Stack Full and Underflow Resets”.
WDT Resets are covered in Section 22.2 “Watchdog
Timer (WDT)”.
A simplified block diagram of the On-Chip Reset Circuit
is shown in Figure 4-1.
4.1 RCON Register
Device Reset events are tracked through the RCON
register (Register 4-1). The lower five bits of the
register indicate that a specific Reset event has
occurred. In most cases, these bits can only be cleared
by the event and must be set by the application after
the event. The state of these flag bits, taken together,
can be read to indicate the type of Reset that just
occurred. This is described in more detail in
Section 4.6 “Reset State of Registers”.
The RCON register also has control bits for setting
interrupt priority (IPEN) and software control of the
BOR (SBOREN). Interrupt priority is discussed in
Section 8.0 “Interrupts”. BOR is covered in
Section 4.4 “Brown-out Reset (BOR)”.
FIGURE 4-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
External Reset
MCLR
VDD
OSC1
WDT
Time-out
VDD Rise
Detect
OST/PWRT
INTRC
(1)
 
POR Pulse
OST
10-bit Ripple Counter
PWRT
11-bit Ripple Counter
Enable OST(2)
Enable PWRT
Note 1: This is the INTRC source from the internal oscillator block and is separate from the RC oscillator of the CLKI pin.
2: See Table 4-2 for time-out situations.
Brown-out
Reset
BOREN
RESET
Instruction
Stack
Pointer
Stack Full/Underflow Reset
Sleep
( )_IDLE
1024 Cycles
65.5 ms
32 μs
MCLRE
S
RQ
Chip_Reset

PIC18F2X1X/4X1X

R/W-0 R/W-1(1) U-0 R/W-1 R-1 R-1 R/W-0(2) R/W-0

IPEN SBOREN —RITO PD POR BOR

bit 7 bit 0

bit 7 IPEN: Interrupt Priority Enable bit

1 = Enable priority levels on interrupts

0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode)

bit 6 SBOREN: BOR Software Enable bit(1)

If BOREN1:BOREN0 = 01:

1 = BOR is enabled

0 = BOR is disabled

If BOREN1:BOREN0 = 00, 10 or 11:

Bit is disabled and read as ‘0’.

bit 5 Unimplemented: Read as ‘0’

bit 4 RI: RESET Instruction Flag bit

1 = The RESET instruction was not executed (set by firmware only)

0 = The RESET instruction was executed causing a device Reset (must be set in software after

a Brown-out Reset occurs)

bit 3 TO: Watchdog Time-out Flag bit

1 = Set by power-up, CLRWDT instruction or SLEEP instruction

0 = A WDT time-out occurred

bit 2 PD: Power-down Detection Flag bit

1 = Set by power-up or by the CLRWDT instruction

0 = Set by execution of the SLEEP instruction

bit 1 POR: Power-on Reset Status bit(2)

1 = A Power-on Reset has not occurred (set by firmware only)

0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)

bit 0 BOR: Brown-out Reset Status bit

1 = A Brown-out Reset has not occurred (set by firmware only)

0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)

Note 1: The SBOREN bit is only available when the BOREN1:BOREN0 Configuration

bits = 01; otherwise, it is disabled and reads as ‘0’. See Section 4.4 “Brown-out

Reset (BOR)”.

2: The actual Reset value of POR is determined by the type of device Reset. See the

notes following this register and Section 4.6 “Reset State of Registers” for

additional information.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

Note 1: It is recommended that the POR bit be set after a Power-on Reset has been

detected so that subsequent Power-on Resets may be detected.

2: Brown-out Reset is said to have occurred when BOR is ‘0’ and POR is ‘1’ (assuming

that POR was set to ‘1’ by software immediately after POR).

PIC18F2X1X/4X1X

4.2 Master Clear (MCLR)

The MCLR pin provides a method for triggering an

external Reset of the device. A Reset is generated by

holding the pin low. These devices have a noise filter in

the MCLR Reset path which detects and ignores small

pulses.

The MCLR pin is not driven low by any internal Resets,

including the WDT.

In PIC18F2X1X/4X1X devices, the MCLR input can be

disabled with the MCLRE Configuration bit. When

MCLR is disabled, the pin becomes a digital input. See

Section 9.5 “PORTE, TRISE and LATE Registers”

for more information.

4.3 Power-on Reset (POR)

A Power-on Reset pulse is generated on-chip

whenever VDD rises above a certain threshold. This

allows the device to start in the initialized state when

VDD is adequate for operation.

To take advantage of the POR circuitry, tie the MCLR

pin through a resistor (1 kΩ to 10 kΩ) to VDD. This will

eliminate external RC components usually needed to

create a Power-on Reset delay. A minimum rise rate for

VDD is specified (parameter D004). For a slow rise

time, see Figure 4-2.

When the device starts normal operation (i.e., exits the

Reset condition), device operating parameters (volt-

age, frequency, temperature, etc.) must be met to

ensure operation. If these conditions are not met, the

device must be held in Reset until the operating

conditions are met.

POR events are captured by the POR bit (RCON<1>).

The state of the bit is set to ‘0’ whenever a POR occurs;

it does not change for any other Reset event. POR is

not reset to ‘1’ by any hardware event. To capture

multiple events, the user manually resets the bit to ‘1’

in software following any POR.

FIGURE 4-2: EXTERNAL POWER-ON

RESET CIRCUIT (FOR

SLOW VDD POWER-UP)

Note 1: External Power-on Reset circuit is required

only if the VDD power-up slope is too slow.

The diode D helps discharge the capacitor

quickly when VDD powers down.

2: R < 40 kΩ is recommended to make sure that

the voltage drop across R does not violate

the device’s electrical specification.

3: R1 ≥ 1 kΩ will limit any current flowing into

MCLR from external capacitor C, in the event

of MCLR/VPP pin breakdown, due to

Electrostatic Discharge (ESD) or Electrical

Overstress (EOS).

VDD

MCLR

PIC18FXXXX

VDD

PIC18F2X1X/4X1X

4.4 Brown-out Reset (BOR)

PIC18F2X1X/4X1X devices implement a BOR circuit

that provides the user with a number of configuration

and power-saving options. The BOR is controlled by

the BORV1:BORV0 and BOREN1:BOREN0 Configu-

ration bits. There are a total of four BOR configurations

which are summarized in Table 4-1.

The BOR threshold is set by the BORV1:BORV0 bits. If

BOR is enabled (any values of BOREN1:BOREN0,

except ‘00’), any drop of VDD below VBOR (parameter

D005) for greater than TBOR (parameter 35) will reset

the device. A Reset may or may not occur if VDD falls

below VBOR for less than TBOR. The chip will remain in

Brown-out Reset until VDD rises above VBOR.

If the Power-up Timer is enabled, it will be invoked after

VDD rises above VBOR; it then will keep the chip in

Reset for an additional time delay, TPWRT

(parameter 33). If VDD drops below VBOR while the

Power-up Timer is running, the chip will go back into a

Brown-out Reset and the Power-up Timer will be

initialized. Once VDD rises above VBOR, the Power-up

Timer will execute the additional time delay.

BOR and the Power-on Timer (PWRT) are

independently configured. Enabling BOR Reset does

not automatically enable the PWRT.

4.4.1 SOFTWARE ENABLED BOR

When BOREN1:BOREN0 = 01, the BOR can be

enabled or disabled by the user in software. This is

done with the control bit, SBOREN (RCON<6>).

Setting SBOREN enables the BOR to function as

previously described. Clearing SBOREN disables the

BOR entirely. The SBOREN bit operates only in this

mode; otherwise it is read as ‘0’.

Placing the BOR under software control gives the user

the additional flexibility of tailoring the application to its

environment without having to reprogram the device to

change BOR configuration. It also allows the user to

tailor device power consumption in software by elimi-

nating the incremental current that the BOR consumes.

While the BOR current is typically very small, it may

have some impact in low-power applications.

4.4.2 DETECTING BOR

When BOR is enabled, the BOR bit always resets to ‘0’

on any BOR or POR event. This makes it difficult to

determine if a BOR event has occurred just by reading

the state of BOR alone. A more reliable method is to

simultaneously check the state of both POR and BOR.

This assumes that the POR bit is reset to ‘1’ in software

immediately after any POR event. If BOR is ‘0’ while

POR is ‘1’, it can be reliably assumed that a BOR event

has occurred.

4.4.3 DISABLING BOR IN SLEEP MODE

When BOREN1:BOREN0 = 10, the BOR remains

under hardware control and operates as previously

described. Whenever the device enters Sleep mode,

however, the BOR is automatically disabled. When the

device returns to any other operating mode, BOR is

automatically re-enabled.

This mode allows for applications to recover from

brown-out situations, while actively executing code,

when the device requires BOR protection the most. At

the same time, it saves additional power in Sleep mode

by eliminating the small incremental BOR current.

TABLE 4-1: BOR CONFIGURATIONS

Note: Even when BOR is under software control,

the BOR Reset voltage level is still set by

the BORV1:BORV0 Configuration bits. It

cannot be changed in software.

BOR Configuration Status of

SBOREN

(RCON<6>)

BOR Operation

BOREN1 BOREN0

00Unavailable BOR disabled; must be enabled by reprogramming the Configuration bits.

01Available BOR enabled in software; operation controlled by SBOREN.

10Unavailable BOR enabled in hardware in Run and Idle modes, disabled during

Sleep mode.

11Unavailable BOR enabled in hardware; must be disabled by reprogramming the

Configuration bits.

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 45
PIC18F2X1X/4X1X
4.5 Device Reset Timers
PIC18F2X1X/4X1X devices incorporate three separate
on-chip timers that help regulate the Power-on Reset
process. Their main function is to ensure that the
device clock is stable before code is executed. These
timers are:
• Power-up Timer (PWRT)
• Oscillator Start-up Timer (OST)
• PLL Lock Time-out
4.5.1 POWER-UP TIMER (PWRT)
The Power-up Timer (PWRT) of PIC18F2X1X/4X1X
devices is an 11-bit counter which uses the INTRC
source as the clock input. This yields an approximate
time interval of 2048 x 32 μs = 65.6 ms. While the
PWRT is counting, the device is held in Reset.
The power-up time delay depends on the INTRC clock
and will vary from chip to chip due to temperature and
process variation. See DC parameter 33 for details.
The PWRT is enabled by clearing the PWRTEN
Configuration bit. 
4.5.2 OSCILLATOR START-UP TIMER 
(OST)
The Oscillator Start-up Timer (OST) provides a 1024
oscillator cycle (from OSC1 input) delay after the
PWRT delay is over (parameter 33). This ensures that
the crystal oscillator or resonator has started and
stabilized.
The OST time-out is invoked only for XT, LP, HS and
HSPLL modes and only on Power-on Reset, or on exit
from most power-managed modes.
4.5.3 PLL LOCK TIME-OUT
With the PLL enabled in its PLL mode, the time-out
sequence following a Power-on Reset is slightly differ-
ent from other oscillator modes. A separate timer is
used to provide a fixed time-out that is sufficient for the
PLL to lock to the main oscillator frequency. This PLL
lock time-out (TPLL) is typically 2 ms and follows the
oscillator start-up time-out.
4.5.4 TIME-OUT SEQUENCE
On power-up, the time-out sequence is as follows:
1. After the POR pulse has cleared, PWRT time-out
is invoked (if enabled). 
2. Then, the OST is activated. 
The total time-out will vary based on oscillator configu-
ration and the status of the PWRT. Figure 4-3,
Figure 4-4, Figure 4-5, Figure 4-6 and Figure 4-7 all
depict time-out sequences on power-up, with the
Power-up Timer enabled and the device operating in
HS Oscillator mode. Figures 4-3 through 4-6 also
apply to devices operating in XT or LP modes. For
devices in RC mode and with the PWRT disabled, there
will be no time-out at all.
Since the time-outs occur from the POR pulse, if MCLR
is kept low long enough, all time-outs will expire. Bring-
ing MCLR high will begin execution immediately
(Figure 4-5). This is useful for testing purposes or to
synchronize more than one PIC18FXXXX device
operating in parallel.
TABLE 4-2: TIME-OUT IN VARIOUS SITUATIONS  
Oscillator
Configuration
Power-up(2) and Brown-out Exit From 
Power-Managed Mode
PWRTEN = 0PWRTEN = 1
HSPLL 66 ms(1) + 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2)
HS, XT, LP 66 ms(1) + 1024 TOSC 1024 TOSC 1024 TOSC
EC, ECIO 66 ms(1) ——
RC, RCIO 66 ms(1) ——
INTIO1, INTIO2 66 ms(1) ——
Note 1: 66 ms (65.5 ms) is the nominal Power-up Timer (PWRT) delay.
2: 2 ms is the nominal time required for the PLL to lock.

PIC18F2X1X/4X1X

FIGURE 4-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT)

FIGURE 4-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1

FIGURE 4-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2

TPWRT

TOST

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

TPWRT

TOST

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

TPWRT

TOST

PIC18F2X1X/4X1X

FIGURE 4-6: SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT)

FIGURE 4-7: TIME-OUT SEQUENCE ON POR W/PLL ENABLED (MCLR TIED TO VDD)

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

TPWRT

TOST

TPWRT

TOST

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

PLL TIME-OUT

TPLL

Note: TOST = 1024 clock cycles.

TPLL ≈ 2 ms max. First three stages of the PWRT timer.

PIC18F2X1X/4X1X

4.6 Reset State of Registers

Most registers are unaffected by a Reset. Their status

is unknown on POR and unchanged by all other

Resets. The other registers are forced to a “Reset

state” depending on the type of Reset that occurred.

Most registers are not affected by a WDT wake-up,

since this is viewed as the resumption of normal oper-

ation. Status bits from the RCON register, RI, TO, PD,

POR and BOR, are set or cleared differently in different

Reset situations, as indicated in Table 4-3. These bits

are used in software to determine the nature of the

Reset.

Table 4-4 describes the Reset states for all of the

Special Function Registers. These are categorized by

Power-on and Brown-out Resets, Master Clear and

WDT Resets and WDT wake-ups.

TABLE 4-3: STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION

FOR RCON REGISTER

Condition Program

Counter

RCON Register STKPTR Register

SBOREN RI TO PD POR BOR STKFUL STKUNF

Power-on Reset 0000h 1 11100 0 0

RESET instruction 0000h u(2) 0uuuu u u

Brown-out Reset 0000h u(2) 111u0 u u

MCLR during power-managed

Run modes

0000h u(2) u1uuu u u

MCLR during power-managed

Idle modes and Sleep mode

0000h u(2) u10uu u u

WDT time-out during full power

or power-managed Run mode

0000h u(2) u0uuu u u

MCLR during full power

execution

0000h u(2) uuuuu u u

Stack Full Reset (STVREN = 1) 0000h u(2) uuuuu 1 u

Stack Underflow Reset

(STVREN = 1)

0000h u(2) uuuuu u 1

Stack Underflow Error (not an

actual Reset, STVREN = 0)

0000h u(2) uuuuu u 1

WDT Time-out during

power-managed Idle or Sleep

modes

PC + 2 u(2) u00uu u u

Interrupt exit from

power-managed modes

PC + 2(1) u(2) uu0uu u u

Legend: u = unchanged

Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bits are set, the PC is loaded with the

interrupt vector (008h or 0018h).

2: Reset state is ‘1’ for POR and unchanged for all other Resets when software BOR is enabled

(BOREN1:BOREN0 Configuration bits = 01 and SBOREN = 1); otherwise, the Reset state is ‘0’.

PIC18F2X1X/4X1X

TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS

Power-on Reset,

Brown-out

Reset

MCLR Resets,

WDT Reset,

RESET

Instruction,

Stack Resets

Wake-up via

WDT

or Interrupt

TOSU 2410 2510 2515 2610 4410 4510 4515 4610 ---0 0000 ---0 0000 ---0 uuuu(3)

TOSH 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu(3)

TOSL 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu(3)

STKPTR 2410 2510 2515 2610 4410 4510 4515 4610 00-0 0000 uu-0 0000 uu-u uuuu(3)

PCLATU 2410 2510 2515 2610 4410 4510 4515 4610 ---0 0000 ---0 0000 ---u uuuu

PCLATH 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

PCL 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 PC + 2(2)

TBLPTRU 2410 2510 2515 2610 4410 4510 4515 4610 --00 0000 --00 0000 --uu uuuu

TBLPTRH 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

TBLPTRL 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

TABLAT 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

PRODH 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

PRODL 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

INTCON 2410 2510 2515 2610 4410 4510 4515 4610 0000 000x 0000 000u uuuu uuuu(1)

INTCON2 2410 2510 2515 2610 4410 4510 4515 4610 1111 -1-1 1111 -1-1 uuuu -u-u(1)

INTCON3 2410 2510 2515 2610 4410 4510 4515 4610 11-0 0-00 11-0 0-00 uu-u u-uu(1)

INDF0 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

POSTINC0 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

POSTDEC0 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

PREINC0 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

PLUSW0 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

FSR0H 2410 2510 2515 2610 4410 4510 4515 4610 ---- 0000 ---- 0000 ---- uuuu

FSR0L 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

WREG 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

INDF1 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

POSTINC1 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

POSTDEC1 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

PREINC1 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

PLUSW1 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cells indicate conditions do not apply for the designated device.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector

(0008h or 0018h).

3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with

the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack.

4: See Table 4-3 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When not enabled as

PORTA pins, they are disabled and read ‘0’.

PIC18F2X1X/4X1X

FSR1H 2410 2510 2515 2610 4410 4510 4515 4610 ---- 0000 ---- 0000 ---- uuuu

FSR1L 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

BSR 2410 2510 2515 2610 4410 4510 4515 4610 ---- 0000 ---- 0000 ---- uuuu

INDF2 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

POSTINC2 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

POSTDEC2 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

PREINC2 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

PLUSW2 2410 2510 2515 2610 4410 4510 4515 4610 N/A N/A N/A

FSR2H 2410 2510 2515 2610 4410 4510 4515 4610 ---- 0000 ---- 0000 ---- uuuu

FSR2L 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

STATUS 2410 2510 2515 2610 4410 4510 4515 4610 ---x xxxx ---u uuuu ---u uuuu

TMR0H 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

TMR0L 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

T0CON 2410 2510 2515 2610 4410 4510 4515 4610 1111 1111 1111 1111 uuuu uuuu

OSCCON 2410 2510 2515 2610 4410 4510 4515 4610 0100 q000 0100 q000 uuuu uuqu

HLVDCON 2410 2510 2515 2610 4410 4510 4515 4610 0-00 0101 0-00 0101 u-uu uuuu

WDTCON 2410 2510 2515 2610 4410 4510 4515 4610 ---- ---0 ---- ---0 ---- ---u

RCON(4) 2410 2510 2515 2610 4410 4510 4515 4610 0q-1 11q0 0q-q qquu uq-u qquu

TMR1H 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

TMR1L 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

T1CON 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 u0uu uuuu uuuu uuuu

TMR2 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

PR2 2410 2510 2515 2610 4410 4510 4515 4610 1111 1111 1111 1111 1111 1111

T2CON 2410 2510 2515 2610 4410 4510 4515 4610 -000 0000 -000 0000 -uuu uuuu

SSPBUF 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

SSPADD 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

SSPSTAT 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

SSPCON1 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

SSPCON2 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)

Power-on Reset,

Brown-out

Reset

MCLR Resets,

WDT Reset,

RESET

Instruction,

Stack Resets

Wake-up via

WDT

or Interrupt

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cells indicate conditions do not apply for the designated device.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector

(0008h or 0018h).

3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with

the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack.

4: See Table 4-3 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When not enabled as

PORTA pins, they are disabled and read ‘0’.

PIC18F2X1X/4X1X

ADRESH 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

ADRESL 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

ADCON0 2410 2510 2515 2610 4410 4510 4515 4610 --00 0000 --00 0000 --uu uuuu

ADCON1 2410 2510 2515 2610 4410 4510 4515 4610 --00 0qqq --00 0qqq --uu uuuu

ADCON2 2410 2510 2515 2610 4410 4510 4515 4610 0-00 0000 0-00 0000 u-uu uuuu

CCPR1H 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

CCPR1L 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

CCP1CON 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

2410 2510 2515 2610 4410 4510 4515 4610 --00 0000 --00 0000 --uu uuuu

CCPR2H 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

CCPR2L 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

CCP2CON 2410 2510 2515 2610 4410 4510 4515 4610 --00 0000 --00 0000 --uu uuuu

BAUDCON 2410 2510 2515 2610 4410 4510 4515 4610 01-0 0-00 01-0 0-00 --uu uuuu

PWM1CON 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

ECCP1AS 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

2410 2510 2515 2610 4410 4510 4515 4610 0000 00-- 0000 00-- uuuu uu--

CVRCON 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

CMCON 2410 2510 2515 2610 4410 4510 4515 4610 0000 0111 0000 0111 uuuu uuuu

TMR3H 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

TMR3L 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

T3CON 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 uuuu uuuu uuuu uuuu

SPBRGH 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

SPBRG 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

RCREG 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

TXREG 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

TXSTA 2410 2510 2515 2610 4410 4510 4515 4610 0000 0010 0000 0010 uuuu uuuu

RCSTA 2410 2510 2515 2610 4410 4510 4515 4610 0000 000x 0000 000x uuuu uuuu

TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)

Power-on Reset,

Brown-out

Reset

MCLR Resets,

WDT Reset,

RESET

Instruction,

Stack Resets

Wake-up via

WDT

or Interrupt

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cells indicate conditions do not apply for the designated device.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector

(0008h or 0018h).

3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with

the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack.

4: See Table 4-3 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When not enabled as

PORTA pins, they are disabled and read ‘0’.

PIC18F2X1X/4X1X

IPR2 2410 2510 2515 2610 4410 4510 4515 4610 11-- 1111 11-- 1111 uu-- uuuu

PIR2 2410 2510 2515 2610 4410 4510 4515 4610 00-- 0000 00-- 0000 uu-- uuuu(1)

PIE2 2410 2510 2515 2610 4410 4510 4515 4610 00-- 0000 00-- 0000 uu-- uuuu

IPR1 2410 2510 2515 2610 4410 4510 4515 4610 1111 1111 1111 1111 uuuu uuuu

2410 2510 2515 2610 4410 4510 4515 4610 -111 1111 -111 1111 -uuu uuuu

PIR1 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu(1)

2410 2510 2515 2610 4410 4510 4515 4610 -000 0000 -000 0000 -uuu uuuu(1)

PIE1 2410 2510 2515 2610 4410 4510 4515 4610 0000 0000 0000 0000 uuuu uuuu

2410 2510 2515 2610 4410 4510 4515 4610 -000 0000 -000 0000 -uuu uuuu

OSCTUNE 2410 2510 2515 2610 4410 4510 4515 4610 00-0 0000 00-0 0000 uu-u uuuu

TRISE 2410 2510 2515 2610 4410 4510 4515 4610 0000 -111 0000 -111 uuuu -uuu

TRISD 2410 2510 2515 2610 4410 4510 4515 4610 1111 1111 1111 1111 uuuu uuuu

TRISC 2410 2510 2515 2610 4410 4510 4515 4610 1111 1111 1111 1111 uuuu uuuu

TRISB 2410 2510 2515 2610 4410 4510 4515 4610 1111 1111 1111 1111 uuuu uuuu

TRISA(5) 2410 2510 2515 2610 4410 4510 4515 4610 1111 1111(5) 1111 1111(5) uuuu uuuu(5)

LATE 2410 2510 2515 2610 4410 4510 4515 4610 ---- -xxx ---- -uuu ---- -uuu

LATD 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

LATC 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

LATB 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

LATA(5) 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx(5) uuuu uuuu(5) uuuu uuuu(5)

PORTE 2410 2510 2515 2610 4410 4510 4515 4610 ---- x000 ---- x000 ---- uuuu

PORTD 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

PORTC 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

PORTB 2410 2510 2515 2610 4410 4510 4515 4610 xxxx xxxx uuuu uuuu uuuu uuuu

PORTA(5) 2410 2510 2515 2610 4410 4510 4515 4610 xx0x 0000(5) uu0u 0000(5) uuuu uuuu(5)

TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)

Power-on Reset,

Brown-out

Reset

MCLR Resets,

WDT Reset,

RESET

Instruction,

Stack Resets

Wake-up via

WDT

or Interrupt

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cells indicate conditions do not apply for the designated device.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector

(0008h or 0018h).

3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with

the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack.

4: See Table 4-3 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When not enabled as

PORTA pins, they are disabled and read ‘0’.

PIC18F2X1X/4X1X

5.0 MEMORY ORGANIZATION

There are two types of memory in PIC18F2X1X/4X1X

microcontroller devices:

• Program Memory

• Data RAM

As Harvard architecture devices, the data and program

memories use separate busses; this allows for

concurrent access of the two memory spaces.

Additional detailed information on the operation of the

Flash program memory is provided in Section 6.0

“Flash Program Memory”.

5.1 Program Memory Organization

PIC18 microcontrollers implement a 21-bit program

counter, which is capable of addressing a 2-Mbyte

program memory space. Accessing a location between

the upper boundary of the physically implemented

memory and the 2-Mbyte address will return all ‘0’s (a

NOP instruction).

The PIC18F2410/4410 and PIC18F2510 each have

16 Kbytes of Flash memory and can store up to 8,192

single-word instructions. The PIC18F2510/4510 each

have 32 Kbytes of Flash memory and can store up to

16,384 single-word instructions. The PIC18F2515/4515

each have 48 Kbytes of Flash memory and can store up

to 24,576 single-word instructions. The PIC18F2610/

4610 each have 64 Kbytes of Flash memory and can

store up to 32,768 single-word instructions.

PIC18 devices have two interrupt vectors. The Reset

vector address is at 0000h and the interrupt vector

addresses are at 0008h and 0018h.

The program memory map for PIC18F2X1X/4X1X

devices is shown in Figure 5-1.

FIGURE 5-1: PROGRAM MEMORY MAP AND STACK FOR

PIC18F2X1X/4X1X DEVICES

PC<20:0>

Stack Level 1

•

Stack Level 31

Reset Vector

Low Priority Interrupt Vector

•

CALL,RCALL,RETURN

RETFIE,RETLW

00000h

00018h

On-Chip

Program Memory

High Priority Interrupt Vector 00008h

User Memory Space

1FFFFFh

Read ‘0’

200000h

08000h

07FFFh

0C000h

0BFFFh

On-Chip

Program Memory

Read ‘0’

On-Chip

Program Memory

Read ‘0’

10000h

04000h

03FFFh

On-Chip

Program Memory

Read ‘0’

0FFFFh

PIC18F2410/4410

(16 Kbytes) (32 Kbytes) (48 Kbytes) (64 Kbytes)

PIC18F2510/4510 PIC18F2515/4515 PIC18F2610/4610

PIC18F2X1X/4X1X

5.1.1 PROGRAM COUNTER

The Program Counter (PC) specifies the address of the

instruction to fetch for execution. The PC is 21 bits wide

and is contained in three separate 8-bit registers. The

low byte, known as the PCL register, is both readable

and writable. The high byte, or PCH register, contains

the PC<15:8> bits; it is not directly readable or writable.

Updates to the PCH register are performed through the

PCLATH register. The upper byte is called PCU. This

directly readable or writable. Updates to the PCU

The contents of PCLATH and PCLATU are transferred

to the program counter by any operation that writes

PCL. Similarly, the upper two bytes of the program

counter are transferred to PCLATH and PCLATU by an

operation that reads PCL. This is useful for computed

offsets to the PC (see Section 5.1.4.1 “Computed

GOTO”).

The PC addresses bytes in the program memory. To

prevent the PC from becoming misaligned with word

instructions, the Least Significant bit of PCL is fixed to

a value of ‘0’. The PC increments by 2 to address

sequential instructions in the program memory.

The CALL, RCALL, GOTO and program branch

instructions write to the program counter directly. For

these instructions, the contents of PCLATH and

PCLATU are not transferred to the program counter.

5.1.2 RETURN ADDRESS STACK

The return address stack allows any combination of up

to 31 program calls and interrupts to occur. The PC is

pushed onto the stack when a CALL or RCALL instruc-

tion is executed or an interrupt is Acknowledged. The

PC value is pulled off the stack on a RETURN, RETLW or

a RETFIE instruction. PCLATU and PCLATH are not

affected by any of the RETURN or CALL instructions.

The stack operates as a 31-word by 21-bit RAM and a

5-bit Stack Pointer, STKPTR. The stack space is not

part of either program or data space. The Stack Pointer

is readable and writable and the address on the top of

the stack is readable and writable through the top-of-

stack Special File Registers. Data can also be pushed

to, or popped from the stack, using these registers.

A CALL type instruction causes a push onto the stack;

the Stack Pointer is first incremented and the location

pointed to by the Stack Pointer is written with the

contents of the PC (already pointing to the instruction

following the CALL). A RETURN type instruction causes

a pop from the stack; the contents of the location

pointed to by the STKPTR are transferred to the PC

and then the Stack Pointer is decremented.

The Stack Pointer is initialized to ‘00000’ after all

Resets. There is no RAM associated with the location

corresponding to a Stack Pointer value of ‘00000’; this

is only a Reset value. Status bits indicate if the stack is

full or has overflowed or has underflowed.

5.1.2.1 Top-of-Stack Access

Only the top of the return address stack (TOS) is

readable and writable. A set of three registers,

TOSU:TOSH:TOSL, hold the contents of the stack loca-

tion pointed to by the STKPTR register (Figure 5-2). This

allows users to implement a software stack if necessary.

After a CALL, RCALL or interrupt, the software can read

the pushed value by reading the TOSU:TOSH:TOSL

registers. These values can be placed on a user defined

software stack. At return time, the software can return

these values to TOSU:TOSH:TOSL and do a return.

The user must disable the global interrupt enable bits

while accessing the stack to prevent inadvertent stack

corruption.

FIGURE 5-2: RETURN ADDRESS STACK AND ASSOCIATED REGISTERS

00011

001A34h

11111

11110

11101

00010

00001

00000

00010

Return Address Stack <20:0>

To p - o f - St a c k 000D58h

TOSLTOSHTOSU

34h1Ah00h

STKPTR<4:0>

Top-of-Stack Registers Stack Pointer

PIC18F2X1X/4X1X

5.1.2.2 Return Stack Pointer (STKPTR)

The STKPTR register (Register 5-1) contains the Stack

Pointer value, the STKFUL (Stack Full) status bit and

the STKUNF (Stack Underflow) status bits. The value

of the Stack Pointer can be 0 through 31. The Stack

Pointer increments before values are pushed onto the

stack and decrements after values are popped off the

stack. On Reset, the Stack Pointer value will be zero.

The user may read and write the Stack Pointer value.

This feature can be used by a Real-Time Operating

System (RTOS) for return stack maintenance.

After the PC is pushed onto the stack 31 times (without

popping any values off the stack), the STKFUL bit is

set. The STKFUL bit is cleared by software or by a

POR.

The action that takes place when the stack becomes

full depends on the state of the STVREN (Stack Over-

flow Reset Enable) Configuration bit. (Refer to

Section 22.1 “Configuration Bits” for a description of

the device Configuration bits.) If STVREN is set

(default), the 31st push will push the (PC + 2) value

onto the stack, set the STKFUL bit and reset the

device. The STKFUL bit will remain set and the Stack

Pointer will be set to zero.

If STVREN is cleared, the STKFUL bit will be set on the

31st push and the Stack Pointer will increment to 31.

Any additional pushes will not overwrite the 31st push

and STKPTR will remain at 31.

When the stack has been popped enough times to

unload the stack, the next pop will return a value of zero

to the PC and sets the STKUNF bit, while the Stack

Pointer remains at zero. The STKUNF bit will remain

set until cleared by software or until a POR occurs.

5.1.2.3 PUSH and POP Instructions

Since the Top-of-Stack is readable and writable, the

ability to push values onto the stack and pull values off

the stack without disturbing normal program execution

is a desirable feature. The PIC18 instruction set

includes two instructions, PUSH and POP, that permit

the TOS to be manipulated under software control.

TOSU, TOSH and TOSL can be modified to place data

or a return address on the stack.

The PUSH instruction places the current PC value onto

the stack. This increments the Stack Pointer and loads

the current PC value onto the stack.

The POP instruction discards the current TOS by decre-

menting the Stack Pointer. The previous value pushed

onto the stack then becomes the TOS value.

Note: Returning a value of zero to the PC on an

underflow has the effect of vectoring the

program to the Reset vector, where the

stack conditions can be verified and

appropriate actions can be taken. This is

not the same as a Reset, as the contents

of the SFRs are not affected.

R/C-0 R/C-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

STKFUL(1) STKUNF(1) — SP4 SP3 SP2 SP1 SP0

bit 7 bit 0

bit 7 STKFUL: Stack Full Flag bit(1)

1 = Stack became full or overflowed

0 = Stack has not become full or overflowed

bit 6 STKUNF: Stack Underflow Flag bit(1)

1 = Stack underflow occurred

0 = Stack underflow did not occur

bit 5 Unimplemented: Read as ‘0’

bit 4-0 SP4:SP0: Stack Pointer Location bits

Note 1: Bit 7 and bit 6 are cleared by user software or by a POR.

Legend:

R = Readable bit W = Writable bit U = Unimplemented C = Clearable only bit

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

5.1.2.4 Stack Full and Underflow Resets

Device Resets on stack overflow and stack underflow

conditions are enabled by setting the STVREN bit in

Configuration Register 4L. When STVREN is set, a full

or underflow will set the appropriate STKFUL or

STKUNF bit and then cause a device Reset. When

STVREN is cleared, a full or underflow condition will set

the appropriate STKFUL or STKUNF bit but not cause

a device Reset. The STKFUL or STKUNF bits are

cleared by the user software or a Power-on Reset.

5.1.3 FAST REGISTER STACK

A fast register stack is provided for the STATUS,

WREG and BSR registers, to provide a “fast return”

option for interrupts. The stack for each register is only

one level deep and is neither readable nor writable. It is

loaded with the current value of the corresponding reg-

ister when the processor vectors for an interrupt. All

interrupt sources will push values into the stack regis-

ters. The values in the registers are then loaded back

into their associated registers if the RETFIE, FAST

instruction is used to return from the interrupt.

If both low and high priority interrupts are enabled, the

stack registers cannot be used reliably to return from

low priority interrupts. If a high priority interrupt occurs

while servicing a low priority interrupt, the stack register

values stored by the low priority interrupt will be

overwritten. In these cases, users must save the key

registers in software during a low priority interrupt.

If interrupt priority is not used, all interrupts may use the

fast register stack for returns from interrupt. If no inter-

rupts are used, the fast register stack can be used to

restore the STATUS, WREG and BSR registers at the

end of a subroutine call. To use the fast register stack

for a subroutine call, a CALL label, FAST instruction

must be executed to save the STATUS, WREG and

BSR registers to the fast register stack. A

RETURN, FAST instruction is then executed to restore

these registers from the fast register stack.

Example 5-1 shows a source code example that uses

the fast register stack during a subroutine call and

return.

EXAMPLE 5-1: FAST REGISTER STACK

CODE EXAMPLE

5.1.4 LOOK-UP TABLES IN PROGRAM

MEMORY

There may be programming situations that require the

creation of data structures, or look-up tables, in

program memory. For PIC18 devices, look-up tables

can be implemented in two ways:

• Computed GOTO

• Table Reads

5.1.4.1 Computed GOTO

A computed GOTO is accomplished by adding an offset

to the program counter. An example is shown in

Example 5-2.

A look-up table can be formed with an ADDWF PCL

instruction and a group of RETLW nn instructions. The

W register is loaded with an offset into the table before

executing a call to that table. The first instruction of the

called routine is the ADDWF PCL instruction. The next

instruction executed will be one of the RETLW nn

instructions that returns the value ‘nn’ to the calling

function.

The offset value (in WREG) specifies the number of

bytes that the program counter should advance and

should be multiples of 2 (LSb = 0).

In this method, only one data byte may be stored in

each instruction location and room on the return

address stack is required.

EXAMPLE 5-2: COMPUTED GOTO USING

AN OFFSET VALUE

5.1.4.2 Table Reads and Table Writes

A better method of storing data in program memory

allows two bytes of data to be stored in each instruction

location.

Look-up table data may be stored two bytes per

program word by using table reads and writes. The

Table Pointer (TBLPTR) register specifies the byte

address and the Table Latch (TABLAT) register

contains the data that is read from or written to program

memory. Data is transferred to or from program

memory one byte at a time.

Table read and table write operations are discussed

further in Section 6.1 “Table Reads”.

CALL SUB1, FAST ;STATUS, WREG, BSR

;SAVED IN FAST REGISTER

;STACK

•

SUB1 •

•

RETURN, FAST ;RESTORE VALUES SAVED

;IN FAST REGISTER STACK

MOVF OFFSET, W

CALL TABLE

ORG nn00h

TABLE ADDWF PCL

RETLW nnh

PIC18F2X1X/4X1X

5.2 PIC18 Instruction Cycle

5.2.1 CLOCKING SCHEME

The microcontroller clock input, whether from an

internal or external source, is internally divided by four

to generate four non-overlapping quadrature clocks

(Q1, Q2, Q3 and Q4). Internally, the program counter is

incremented on every Q1; the instruction is fetched

from the program memory and latched into the instruc-

tion register during Q4. The instruction is decoded and

executed during the following Q1 through Q4. The

clocks and instruction execution flow are shown in

Figure 5-3.

5.2.2 INSTRUCTION FLOW/PIPELINING

An “Instruction Cycle” consists of four Q cycles: Q1

through Q4. The instruction fetch and execute are

pipelined in such a manner that a fetch takes one

instruction cycle, while the decode and execute take

another instruction cycle. However, due to the pipe-

lining, each instruction effectively executes in one

cycle. If an instruction causes the program counter to

change (e.g., GOTO), then two cycles are required to

complete the instruction (Example 5-3).

A fetch cycle begins with the Program Counter (PC)

incrementing in Q1.

In the execution cycle, the fetched instruction is latched

into the Instruction Register (IR) in cycle Q1. This

instruction is then decoded and executed during the

Q2, Q3 and Q4 cycles. Data memory is read during Q2

(operand read) and written during Q4 (destination

write).

FIGURE 5-3: CLOCK/INSTRUCTION CYCLE

EXAMPLE 5-3: INSTRUCTION PIPELINE FLOW

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

OSC1

OSC2/CLKO

(RC mode)

PC PC + 2 PC + 4

Fetch INST (PC)

Execute INST (PC – 2)

Fetch INST (PC + 2)

Execute INST (PC)

Fetch INST (PC + 4)

Execute INST (PC + 2)

Internal

Phase

Clock

All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction

is “flushed” from the pipeline while the new instruction is being fetched and then executed.

TCY0TCY1TCY2TCY3TCY4TCY5

1. MOVLW 55h Fetch 1 Execute 1

2. MOVWF PORTB Fetch 2 Execute 2

3. BRA SUB_1 Fetch 3 Execute 3

4. BSF PORTA, BIT3 (Forced NOP) Fetch 4 Flush (NOP)

5. Instruction @ address SUB_1 Fetch SUB_1 Execute SUB_1

PIC18F2X1X/4X1X
DS39636C-page 58 Preliminary © 2007 Microchip Technology Inc.
5.2.3 INSTRUCTIONS IN PROGRAM 
MEMORY
The program memory is addressed in bytes. Instruc-
tions are stored as two bytes or four bytes in program
memory. The Least Significant Byte of an instruction
word is always stored in a program memory location
with an even address (LSb = 0). To maintain alignment
with instruction boundaries, the PC increments in steps
of 2 and the LSb will always read ‘0’ (see Section 5.1.1
“Program Counter”).
Figure 5-4 shows an example of how instruction words
are stored in the program memory.
The  CALL and GOTO instructions have the absolute
program memory address embedded into the instruc-
tion. Since instructions are always stored on word
boundaries, the data contained in the instruction is a
word address. The word address is written to PC<20:1>,
which accesses the desired byte address in program
memory. Instruction #2 in Figure 5-4 shows how the
instruction  GOTO 0006h is encoded in the program
memory. Program branch instructions, which encode a
relative address offset, operate in the same manner. The
offset value stored in a branch instruction represents the
number of single-word instructions that the PC will be
offset by. Section 23.0 “Instruction Set Summary”
provides further details of the instruction set.
FIGURE 5-4: INSTRUCTIONS IN PROGRAM MEMORY
5.2.4 TWO-WORD INSTRUCTIONS
The standard PIC18 instruction set has four two-word
instructions:  CALL,  MOVFF,  GOTO and LSFR. In all
cases, the second word of the instructions always has
‘1111’ as its four Most Significant bits; the other 12 bits
are literal data, usually a data memory address. 
The use of ‘1111’ in the 4 MSbs of an instruction spec-
ifies a special form of NOP. If the instruction is executed
in proper sequence – immediately after the first word –
the data in the second word is accessed and used by
the instruction sequence. If the first word is skipped for
some reason and the second word is executed by itself,
a NOP is executed instead. This is necessary for cases
when the two-word instruction is preceded by a condi-
tional instruction that changes the PC. Example 5-4
shows how this works.
EXAMPLE 5-4: TWO-WORD INSTRUCTIONS
Word Address
LSB = 1LSB = 0↓
Program Memory
Byte Locations  →       
000000h
000002h
000004h
000006h
Instruction 1: MOVLW 055h 0Fh 55h 000008h
Instruction 2: GOTO 0006h EFh 03h 00000Ah
F0h 00h 00000Ch
Instruction 3: MOVFF 123h, 456h C1h 23h 00000Eh
F4h 56h 000010h
000012h
000014h
Note: See  Section 5.6 “PIC18 Instruction
Execution and the Extended Instruc-
tion Set” for information on two-word
instructions in the extended instruction
set.
CASE 1:
Object Code Source Code
0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?
1100 0001 0010 0011 MOVFF REG1, REG2 ; No, skip this word
1111 0100 0101 0110 ; Execute this word as a NOP
0010 0100 0000 0000 ADDWF REG3 ; continue code
CASE 2:
Object Code Source Code
0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?
1100 0001 0010 0011 MOVFF REG1, REG2 ; Yes, execute this word
1111 0100 0101 0110 ; 2nd word of instruction
0010 0100 0000 0000 ADDWF REG3 ; continue code

PIC18F2X1X/4X1X

5.3 Data Memory Organization

The data memory in PIC18 devices is implemented as

static RAM. Figures 5-5, 5-6 and 5-7 show the data

memory organization for the PIC18F2X1X/4X1X

devices.

The data memory contains Special Function Registers

(SFRs) and General Purpose Registers (GPRs). The

SFRs are used for control and status of the controller

and peripheral functions, while GPRs are used for data

storage and scratchpad operations in the user’s

application. Any read of an unimplemented location will

read as ‘0’s.

The instruction set and architecture allow operations

across all banks. The entire data memory may be

accessed by Direct, Indirect or Indexed Addressing

modes. Addressing modes are discussed later in this

subsection.

To ensure that commonly used registers (SFRs and

select GPRs) can be accessed in a single cycle, PIC18

devices implement an Access Bank. This is a 256-byte

memory space that provides fast access to SFRs and

the lower portion of GPR Bank 0 without using the

BSR. Section 5.3.2 “Access Bank” provides a

detailed description of the Access RAM.

5.3.1 BANK SELECT REGISTER (BSR)

Large areas of data memory require an efficient

addressing scheme to make rapid access to any

address possible. Ideally, this means that an entire

address does not need to be provided for each read or

write operation. For PIC18 devices, this is accom-

plished with a RAM banking scheme. This divides the

memory space into 16 contiguous banks of 256 bytes.

Depending on the instruction, each location can be

addressed directly by its full 12-bit address, or an 8-bit

low-order address and a 4-bit Bank Pointer.

Most instructions in the PIC18 instruction set make use

of the Bank Pointer, known as the Bank Select Register

(BSR). This SFR holds the 4 Most Significant bits of a

location’s address; the instruction itself includes the

8 Least Significant bits. Only the four lower bits of the

BSR are implemented (BSR3:BSR0). The upper four

bits are unused; they will always read ‘0’ and cannot be

written to. The BSR can be loaded directly by using the

MOVLB instruction.

The value of the BSR indicates the bank in data

memory; the 8 bits in the instruction show the location

in the bank and can be thought of as an offset from the

bank’s lower boundary. The relationship between the

BSR’s value and the bank division in data memory is

shown in Figure 5-8.

Since up to 16 registers may share the same low-order

address, the user must always be careful to ensure that

the proper bank is selected before performing a data

read or write. For example, writing what should be

program data to an 8-bit address of F9h, while the BSR

is 0Fh, will end up resetting the program counter.

While any bank can be selected, only those banks that

are actually implemented can be read or written to.

Writes to unimplemented banks are ignored, while

reads from unimplemented banks will return ‘0’s. Even

so, the STATUS register will still be affected as if the

operation was successful. The data memory map in

Figure 5-5 indicates which banks are implemented.

In the core PIC18 instruction set, only the MOVFF

instruction fully specifies the 12-bit address of the

source and target registers. This instruction ignores the

BSR completely when it executes. All other instructions

include only the low-order address as an operand and

must use either the BSR or the Access Bank to locate

their target registers.

Note: The operation of some aspects of data

memory are changed when the PIC18

extended instruction set is enabled. See

Section 5.5 “Data Memory and the

Extended Instruction Set” for more

information.

PIC18F2X1X/4X1X

FIGURE 5-5: DATA MEMORY MAP FOR PIC18F2410/4410 DEVICES

Bank 0

Bank 1

Bank 14

Bank 15

Data Memory Map

BSR<3:0>

= 0000

= 0001

= 1111

080h

07Fh

F80h

FFFh

00h

7Fh

80h

FFh

Access Bank

When ‘a’ = 0:

The BSR is ignored and the

Access Bank is used.

The first 128 bytes are

general purpose RAM

(from Bank 0).

The second 128 bytes are

Special Function Registers

(from Bank 15).

When ‘a’ = 1:

The BSR specifies the Bank

used by the instruction.

F7Fh

F00h

EFFh

1FFh

100h

0FFh

000h

Access RAM

FFh

00h

FFh

00h

FFh

00h

GPR

SFR

Access RAM High

Access RAM Low

Bank 2

= 0110

= 0010

(SFRs)

2FFh

200h

3FFh

300h

4FFh

400h

5FFh

500h

6FFh

600h

7FFh

700h

8FFh

800h

9FFh

900h

AFFh

A00h

BFFh

B00h

CFFh

C00h

DFFh

D00h

E00h

Bank 3

Bank 4

Bank 5

Bank 6

Bank 7

Bank 8

Bank 9

Bank 10

Bank 11

Bank 12

Bank 13

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

GPR

FFh

00h

= 0011

= 0100

= 0101

= 0111

= 1000

= 1001

= 1010

= 1011

= 1100

= 1101

= 1110

Unused

Read 00h

Unused

PIC18F2X1X/4X1X

FIGURE 5-6: DATA MEMORY MAP FOR PIC18F2510/4510 DEVICES

Bank 0

Bank 1

Bank 14

Bank 15

Data Memory Map

BSR<3:0>

= 0000

= 0001

= 1111

080h

07Fh

F80h

FFFh

00h

7Fh

80h

FFh

Access Bank

When ‘a’ = 0:

The BSR is ignored and the

Access Bank is used.

The first 128 bytes are

general purpose RAM

(from Bank 0).

The second 128 bytes are

Special Function Registers

(from Bank 15).

When ‘a’ = 1:

The BSR specifies the Bank

used by the instruction.

F7Fh

F00h

EFFh

1FFh

100h

0FFh

000h

Access RAM

FFh

00h

FFh

00h

FFh

00h

GPR

SFR

Access RAM High

Access RAM Low

Bank 2

= 0110

= 0010

(SFRs)

2FFh

200h

3FFh

300h

4FFh

400h

5FFh

500h

6FFh

600h

7FFh

700h

8FFh

800h

9FFh

900h

AFFh

A00h

BFFh

B00h

CFFh

C00h

DFFh

D00h

E00h

Bank 3

Bank 4

Bank 5

Bank 6

Bank 7

Bank 8

Bank 9

Bank 10

Bank 11

Bank 12

Bank 13

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

GPR

FFh

00h

= 0011

= 0100

= 0101

= 0111

= 1000

= 1001

= 1010

= 1011

= 1100

= 1101

= 1110

Unused

Read 00h

Unused

GPR

PIC18F2X1X/4X1X

FIGURE 5-7: DATA MEMORY MAP FOR PIC18F2515/2610/4515/4610 DEVICES

Bank 0

Bank 1

Bank 14

Bank 15

Data Memory Map

BSR<3:0>

= 0000

= 0001

= 1111

080h

07Fh

F80h

FFFh

00h

7Fh

80h

FFh

Access Bank

When a = 0:

The BSR is ignored and the

Access Bank is used.

The first 128 bytes are

general purpose RAM

(from Bank 0).

The second 128 bytes are

Special Function Registers

(from Bank 15).

When a = 1:

The BSR specifies the Bank

used by the instruction.

F7Fh

F00h

EFFh

1FFh

100h

0FFh

000h

Access RAM

FFh

00h

FFh

00h

FFh

00h

GPR

SFR

GPR

Access RAM High

Access RAM Low

Bank 2

= 0110

= 0010

(SFRs)

2FFh

200h

3FFh

300h

4FFh

400h

5FFh

500h

6FFh

600h

7FFh

700h

8FFh

800h

9FFh

900h

AFFh

A00h

BFFh

B00h

CFFh

C00h

DFFh

D00h

E00h

Bank 3

Bank 4

Bank 5

Bank 6

Bank 7

Bank 8

Bank 9

Bank 10

Bank 11

Bank 12

Bank 13

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

GPR

FFh

00h

= 0011

= 0100

= 0101

= 0111

= 1000

= 1001

= 1010

= 1011

= 1100

= 1101

= 1110

PIC18F2X1X/4X1X

FIGURE 5-8: USE OF THE BANK SELECT REGISTER (DIRECT ADDRESSING)

5.3.2 ACCESS BANK

While the use of the BSR with an embedded 8-bit

address allows users to address the entire range of

data memory, it also means that the user must always

ensure that the correct bank is selected. Otherwise,

data may be read from or written to the wrong location.

This can be disastrous if a GPR is the intended target

of an operation, but an SFR is written to instead.

Verifying and/or changing the BSR for each read or

write to data memory can become very inefficient.

To streamline access for the most commonly used data

memory locations, the data memory is configured with

an Access Bank, which allows users to access a

mapped block of memory without specifying a BSR.

The Access Bank consists of the first 128 bytes of

memory (00h-7Fh) in Bank 0 and the last 128 bytes of

memory (80h-FFh) in Block 15. The lower half is known

as the “Access RAM” and is composed of GPRs. This

upper half is also where the device’s SFRs are

mapped. These two areas are mapped contiguously in

the Access Bank and can be addressed in a linear

fashion by an 8-bit address (Figure 5-5).

The Access Bank is used by core PIC18 instructions

that include the Access RAM bit (the ‘a’ parameter in

the instruction). When ‘a’ is equal to ‘1’, the instruction

uses the BSR and the 8-bit address included in the

opcode for the data memory address. When ‘a’ is ‘0’,

however, the instruction is forced to use the Access

Bank address map; the current value of the BSR is

ignored entirely.

Using this “forced” addressing allows the instruction to

operate on a data address in a single cycle, without

updating the BSR first. For 8-bit addresses of 80h and

above, this means that users can evaluate and operate

on SFRs more efficiently. The Access RAM below 80h

is a good place for data values that the user might need

to access rapidly, such as immediate computational

results or common program variables. Access RAM

also allows for faster and more code efficient context

saving and switching of variables.

The mapping of the Access Bank is slightly different

when the extended instruction set is enabled (XINST

Configuration bit = 1). This is discussed in more detail

in Section 5.5.3 “Mapping the Access Bank in

Indexed Literal Offset Addressing Mode”.

5.3.3 GENERAL PURPOSE REGISTER

FILE

PIC18 devices may have banked memory in the GPR

area. This is data RAM, which is available for use by all

instructions. GPRs start at the bottom of Bank 0

(address 000h) and grow upwards towards the bottom of

the SFR area. GPRs are not initialized by a Power-on

Reset and are unchanged on all other Resets.

Note 1: The Access RAM bit of the instruction can be used to force an override of the selected bank (BSR<3:0>) to

the registers of the Access Bank.

2: The MOVFF instruction embeds the entire 12-bit address in the instruction.

Data Memory

Bank Select(2)

From Opcode(2)

0000

000h

100h

200h

300h

F00h

E00h

FFFh

Bank 0

Bank 1

Bank 2

Bank 14

Bank 15

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

Bank 3

through

Bank 13

0011 1 1111 111

BSR(1)

PIC18F2X1X/4X1X

5.3.4 SPECIAL FUNCTION REGISTERS

The Special Function Registers (SFRs) are registers

used by the CPU and peripheral modules for controlling

the desired operation of the device. These registers are

implemented as static RAM. SFRs start at the top of

data memory (FFFh) and extend downward to occupy

the top half of Bank 15 (F80h to FFFh). A list of these

registers is given in Table 5-1 and Table 5-2.

The SFRs can be classified into two sets: those asso-

ciated with the “core” device functionality (ALU, Resets

and interrupts) and those related to the peripheral func-

tions. The reset and interrupt registers are described in

their respective chapters, while the ALU’s STATUS reg-

ister is described later in this section. Registers related

to the operation of a peripheral feature are described in

the chapter for that peripheral.

The SFRs are typically distributed among the

peripherals whose functions they control. Unused SFR

locations are unimplemented and read as ‘0’s.

TABLE 5-1: SPECIAL FUNCTION REGISTER MAP FOR PIC18F2X1X/4X1X DEVICES

Address Name Address Name Address Name Address Name

FFFh TOSU FDFh INDF2(1) FBFh CCPR1H F9Fh IPR1

FFEh TOSH FDEh POSTINC2(1) FBEh CCPR1L F9Eh PIR1

FFDh TOSL FDDh POSTDEC2(1) FBDh CCP1CON F9Dh PIE1

FFCh STKPTR FDCh PREINC2(1) FBCh CCPR2H F9Ch —(2)

FFBh PCLATU FDBh PLUSW2(1) FBBh CCPR2L F9Bh OSCTUNE

FFAh PCLATH FDAh FSR2H FBAh CCP2CON F9Ah —(2)

FF9h PCL FD9h FSR2L FB9h —(2) F99h —(2)

FF8h TBLPTRU FD8h STATUS FB8h BAUDCON F98h —(2)

FF7h TBLPTRH FD7h TMR0H FB7h PWM1CON(3) F97h —(2)

FF6h TBLPTRL FD6h TMR0L FB6h ECCP1AS(3) F96h TRISE(3)

FF5h TABLAT FD5h T0CON FB5h CVRCON F95h TRISD(3)

FF4h PRODH FD4h —(2) FB4h CMCON F94h TRISC

FF3h PRODL FD3h OSCCON FB3h TMR3H F93h TRISB

FF2h INTCON FD2h HLVDCON FB2h TMR3L F92h TRISA

FF1h INTCON2 FD1h WDTCON FB1h T3CON F91h —(2)

FF0h INTCON3 FD0h RCON FB0h SPBRGH F90h —(2)

FEFh INDF0(1) FCFh TMR1H FAFh SPBRG F8Fh —(2)

FEEh POSTINC0(1) FCEh TMR1L FAEh RCREG F8Eh —(2)

FEDh POSTDEC0(1) FCDh T1CON FADh TXREG F8Dh LATE(3)

FECh PREINC0(1) FCCh TMR2 FACh TXSTA F8Ch LATD(3)

FEBh PLUSW0(1) FCBh PR2 FABh RCSTA F8Bh LATC

FEAh FSR0H FCAh T2CON FAAh —(2) F8Ah LATB

FE9h FSR0L FC9h SSPBUF FA9h —(2) F89h LATA

FE8h WREG FC8h SSPADD FA8h —(2) F88h —(2)

FE7h INDF1(1) FC7h SSPSTAT FA7h —(2) F87h —(2)

FE6h POSTINC1(1) FC6h SSPCON1 FA6h —(2) F86h —(2)

FE5h POSTDEC1(1) FC5h SSPCON2 FA5h —(2) F85h —(2)

FE4h PREINC1(1) FC4h ADRESH FA4h —(2) F84h PORTE(3)

FE3h PLUSW1(1) FC3h ADRESL FA3h —(2) F83h PORTD(3)

FE2h FSR1H FC2h ADCON0 FA2h IPR2 F82h PORTC

FE1h FSR1L FC1h ADCON1 FA1h PIR2 F81h PORTB

FE0h BSR FC0h ADCON2 FA0h PIE2 F80h PORTA

Note 1: This is not a physical register.

2: Unimplemented registers are read as ‘0’.

3: This register is not available on 28-pin devices.

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 65
PIC18F2X1X/4X1X
TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2X1X/4X1X)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on 
POR, BOR
Details 
on page:
TOSU — — — Top-of-Stack Upper Byte (TOS<20:16>) ---0 0000 49, 54
TOSH Top-of-Stack High Byte (TOS<15:8>) 0000 0000 49, 54
TOSL Top-of-Stack Low Byte (TOS<7:0>) 0000 0000 49, 54
STKPTR STKFUL(6) STKUNF(6) — SP4 SP3 SP2 SP1 SP0 00-0 0000 49, 55
PCLATU — — — Holding Register for PC<20:16> ---0 0000 49, 54
PCLATH Holding Register for PC<15:8> 0000 0000 49, 54
PCL PC Low Byte (PC<7:0>) 0000 0000 49, 54
TBLPTRU —— bit 21 Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) --00 0000 49, 77
TBLPTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 0000 0000 49, 77
TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 0000 0000 49, 77
TABLAT Program Memory Table Latch 0000 0000 49, 77
PRODH Product Register High Byte xxxx xxxx 49, 79
PRODL Product Register Low Byte xxxx xxxx 49, 79
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 49, 83
INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 —TMR0IP—RBIP1111 -1-1 49, 84
INTCON3 INT2IP INT1IP —INT2IEINT1IE— INT2IF INT1IF 11-0 0-00 49, 85
INDF0 Uses contents of FSR0 to address data memory – value of FSR0 not changed (not a physical register) N/A 49, 70
POSTINC0 Uses contents of FSR0 to address data memory – value of FSR0 post-incremented (not a physical register) N/A 49, 70
POSTDEC0 Uses contents of FSR0 to address data memory – value of FSR0 post-decremented (not a physical register) N/A 49, 70
PREINC0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) N/A 49, 70
PLUSW0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) – 
value of FSR0 offset by W
N/A 49, 70
FSR0H ———— Indirect Data Memory Address Pointer 0 High Byte ---- 0000 49, 70
FSR0L Indirect Data Memory Address Pointer 0 Low Byte xxxx xxxx 49, 70
WREG Working Register xxxx xxxx 49
INDF1 Uses contents of FSR1 to address data memory – value of FSR1 not changed (not a physical register) N/A 49, 70
POSTINC1 Uses contents of FSR1 to address data memory – value of FSR1 post-incremented (not a physical register) N/A 49, 70
POSTDEC1 Uses contents of FSR1 to address data memory – value of FSR1 post-decremented (not a physical register) N/A 49, 70
PREINC1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) N/A 49, 70
PLUSW1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) – 
value of FSR1 offset by W
N/A 49, 70
FSR1H ———— Indirect Data Memory Address Pointer 1 High Byte ---- 0000 50, 70
FSR1L Indirect Data Memory Address Pointer 1 Low Byte xxxx xxxx 50, 70
BSR ———— Bank Select Register ---- 0000 50, 59
INDF2 Uses contents of FSR2 to address data memory – value of FSR2 not changed (not a physical register) N/A 50, 70
POSTINC2 Uses contents of FSR2 to address data memory – value of FSR2 post-incremented (not a physical register) N/A 50, 70
POSTDEC2 Uses contents of FSR2 to address data memory – value of FSR2 post-decremented (not a physical register) N/A 50, 70
PREINC2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) N/A 50, 70
PLUSW2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) – 
value of FSR2 offset by W
N/A 50, 70
FSR2H ———— Indirect Data Memory Address Pointer 2 High Byte ---- 0000 50, 70
FSR2L Indirect Data Memory Address Pointer 2 Low Byte xxxx xxxx 50, 70
STATUS — — —NOVZDCC---x xxxx 50, 68
Legend: x = unknown, u = unchanged, — = unimplemented, q = value depends on condition
Note 1: The SBOREN bit is only available when the BOREN1:BOREN0 Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See 
Section 4.4 “Brown-out Reset (BOR)”.
2: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices; 
individual unimplemented bits should be interpreted as ‘-’.
3: The PLLEN bit is only available in specific oscillator configuration; otherwise it is disabled and reads as ‘0’. See Section 2.6.4 “PLL in 
INTOSC Modes”.
4: The RE3 bit is only available when Master Clear Reset is disabled (MCLRE Configuration bit = 0). Otherwise, RE3 reads as ‘0’. This bit is 
read-only.
5: RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. 
When disabled, these bits read as ‘0’.
6: Bit 7 and bit 6 are cleared by user software or by a POR.

PIC18F2X1X/4X1X
DS39636C-page 66 Preliminary © 2007 Microchip Technology Inc.
TMR0H Timer0 Register High Byte 0000 0000 50, 115
TMR0L Timer0 Register Low Byte xxxx xxxx 50, 115
T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 1111 1111 50, 113
OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0100 q000 30, 50
HLVDCON VDIRMAG — IRVST HLVDEN HLVDL3 HLVDL2 HLVDL1 HLVDL0 0-00 0101 50, 231
WDTCON — — — — — — —SWDTEN--- ---0 50, 247
RCON IPEN SBOREN(1) —RITO PD POR BOR 0q-1 11q0 42, 48, 92
TMR1H Timer1 Register High Byte xxxx xxxx 50, 121
TMR1L Timer1 Register Low Bytes xxxx xxxx 50, 121
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 50, 117
TMR2 Timer2 Register 0000 0000 50, 124
PR2 Timer2 Period Register 1111 1111 50, 124
T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 50, 123
SSPBUF SSP Receive Buffer/Transmit Register xxxx xxxx 50, 159, 
160
SSPADD SSP Address Register in I2C Slave mode. SSP Baud Rate Reload Register in I2C Master mode. 0000 0000 50, 160
SSPSTAT SMP CKE D/A PSR/WUA BF 0000 0000 50, 152, 
161
SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 50, 153, 
162
SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 50, 163
ADRESH A/D Result Register High Byte xxxx xxxx 51, 220
ADRESL A/D Result Register Low Byte xxxx xxxx 51, 220
ADCON0 —— CHS3 CHS2 CHS1 CHS0 GO/DONE ADON --00 0000 51, 211
ADCON1 —— VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 --00 0qqq 51, 212
ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 0-00 0000 51, 213
CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx 51, 130
CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx 51, 130
CCP1CON P1M1(2) P1M0(2) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 51, 129, 
137
CCPR2H Capture/Compare/PWM Register 2 High Byte xxxx xxxx 51, 130
CCPR2L Capture/Compare/PWM Register 2 Low Byte xxxx xxxx 51, 130
CCP2CON —— DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 51, 129
BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 01-0 0-00 51, 194
PWM1CON PRSEN PDC6(2) PDC5(2) PDC4(2) PDC3(2) PDC2(2) PDC1(2) PDC0(2) 0000 0000 51, 146
ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(2) PSSBD0(2) 0000 0000 51, 147
CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 0000 0000 51, 227
CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 51, 221
TMR3H Timer3 Register High Byte xxxx xxxx 51, 127
TMR3L Timer3 Register Low Byte xxxx xxxx 51, 127
T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 0000 0000 51, 125
TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2X1X/4X1X) (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on 
POR, BOR
Details 
on page:
Legend: x = unknown, u = unchanged, — = unimplemented, q = value depends on condition
Note 1: The SBOREN bit is only available when the BOREN1:BOREN0 Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See 
Section 4.4 “Brown-out Reset (BOR)”.
2: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices; 
individual unimplemented bits should be interpreted as ‘-’.
3: The PLLEN bit is only available in specific oscillator configuration; otherwise it is disabled and reads as ‘0’. See Section 2.6.4 “PLL in 
INTOSC Modes”.
4: The RE3 bit is only available when Master Clear Reset is disabled (MCLRE Configuration bit = 0). Otherwise, RE3 reads as ‘0’. This bit is 
read-only.
5: RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. 
When disabled, these bits read as ‘0’.
6: Bit 7 and bit 6 are cleared by user software or by a POR.

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 67
PIC18F2X1X/4X1X
SPBRGH EUSART Baud Rate Generator Register High Byte 0000 0000 51, 195
SPBRG EUSART Baud Rate Generator Register Low Byte 0000 0000 51, 195
RCREG EUSART Receive Register 0000 0000 51, 202
TXREG EUSART Transmit Register 0000 0000 51, 200
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 51, 192
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 51, 193
IPR2 OSCFIP CMIP —— BCLIP HLVDIP TMR3IP CCP2IP 11-- 1111 52, 91
PIR2 OSCFIF CMIF —— BCLIF HLVDIF TMR3IF CCP2IF 00-- 0000 52, 87
PIE2 OSCFIE CMIE —— BCLIE HLVDIE TMR3IE CCP2IE 00-- 0000 52, 89
IPR1 PSPIP(2) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 52, 90
PIR1 PSPIF(2) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 52, 86
PIE1 PSPIE(2) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 52, 88
OSCTUNE INTSRC PLLEN(3) — TUN4 TUN3 TUN2 TUN1 TUN0 0q-0 0000 27, 52
TRISE(2) IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 0000 -111 52, 108
TRISD(2) PORTD Data Direction Control Register 1111 1111 52, 104
TRISC PORTC Data Direction Control Register 1111 1111 52, 101
TRISB PORTB Data Direction Control Register 1111 1111 52, 98
TRISA TRISA7(5) TRISA6(5) Data Direction Control Register for PORTA 1111 1111 52, 95
LATE(2) ————— PORTE Data Latch Register 
(Read and Write to Data Latch)
---- -xxx 52, 107
LATD(2) PORTD Data Latch Register (Read and Write to Data Latch) xxxx xxxx 52, 104
LATC PORTC Data Latch Register (Read and Write to Data Latch) xxxx xxxx 52, 101
LATB PORTB Data Latch Register (Read and Write to Data Latch) xxxx xxxx 52, 98
LATA LATA7(6) LATA6(6) PORTA Data Latch Register (Read and Write to Data Latch) xxxx xxxx 52, 95
PORTE ————RE3
(4) RE2(2) RE1(2) RE0(2) ---- xxxx 52, 107
PORTD(2) RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx xxxx 52, 104
PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx 52, 101
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx 52, 98
PORTA RA7(5) RA6(5) RA5 RA4 RA3 RA2 RA1 RA0 xx0x 0000 52, 95
TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2X1X/4X1X) (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on 
POR, BOR
Details 
on page:
Legend: x = unknown, u = unchanged, — = unimplemented, q = value depends on condition
Note 1: The SBOREN bit is only available when the BOREN1:BOREN0 Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See 
Section 4.4 “Brown-out Reset (BOR)”.
2: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices; 
individual unimplemented bits should be interpreted as ‘-’.
3: The PLLEN bit is only available in specific oscillator configuration; otherwise it is disabled and reads as ‘0’. See Section 2.6.4 “PLL in 
INTOSC Modes”.
4: The RE3 bit is only available when Master Clear Reset is disabled (MCLRE Configuration bit = 0). Otherwise, RE3 reads as ‘0’. This bit is 
read-only.
5: RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. 
When disabled, these bits read as ‘0’.
6: Bit 7 and bit 6 are cleared by user software or by a POR.

PIC18F2X1X/4X1X

5.3.5 STATUS REGISTER

The STATUS register, shown in Register 5-2, contains

the arithmetic status of the ALU. As with any other SFR,

it can be the operand for any instruction.

If the STATUS register is the destination for an instruc-

tion that affects the Z, DC, C, OV or N bits, the results

of the instruction are not written; instead, the status is

updated according to the instruction performed. There-

fore, the result of an instruction with the STATUS

intended. As an example, CLRF STATUS will set the Z

bit and leave the remaining Status bits unchanged

(‘000u u1uu’).

It is recommended that only BCF, BSF, SWAPF, MOVFF

and MOVWF instructions are used to alter the STATUS

C, DC, OV or N bits in the STATUS register.

For other instructions that do not affect Status bits, see

the instruction set summaries in Table 23-2 and

Table 23-3.

Note: The C and DC bits operate as the borrow

and digit borrow bits, respectively, in

subtraction.

U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x

———NOVZDCC

bit 7 bit 0

bit 7-5 Unimplemented: Read as ‘0’

bit 4 N: Negative bit

This bit is used for signed arithmetic (2’s complement). It indicates whether the result was

negative (ALU MSB = 1).

1 = Result was negative

0 = Result was positive

bit 3 OV: Overflow bit

This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the 7-bit

magnitude which causes the sign bit (bit 7 of the result) to change state.

1 = Overflow occurred for signed arithmetic (in this arithmetic operation)

0 = No overflow occurred

bit 2 Z: Zero bit

1 = The result of an arithmetic or logic operation is zero

0 = The result of an arithmetic or logic operation is not zero

bit 1 DC: Digit carry/borrow bit

For ADDWF, ADDLW, SUBLW and SUBWF instructions:

1 = A carry-out from the 4th low-order bit of the result occurred

0 = No carry-out from the 4th low-order bit of the result

Note: For borrow, the polarity is reversed. A subtraction is executed by adding the

2’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit

is loaded with either bit 4 or bit 3 of the source register.

bit 0 C: Carry/borrow bit

For ADDWF, ADDLW, SUBLW and SUBWF instructions:

1 = A carry-out from the Most Significant bit of the result occurred

0 = No carry-out from the Most Significant bit of the result occurred

Note: For borrow, the polarity is reversed. A subtraction is executed by adding the

2’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit

is loaded with either the high or low-order bit of the source register.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 69
PIC18F2X1X/4X1X
5.4 Data Addressing Modes
The data memory space can be addressed in several
ways. For most instructions, the addressing mode is
fixed. Other instructions may use up to three modes,
depending on which operands are used and whether or
not the extended instruction set is enabled.
The addressing modes are:
• Inherent
• Literal
•Direct
•Indirect
An additional addressing mode, Indexed Literal Offset,
is available when the extended instruction set is
enabled (XINST Configuration bit = 1). Its operation is
discussed in greater detail in Section 5.5.1 “Indexed
Addressing with Literal Offset”. 
5.4.1 INHERENT AND LITERAL 
ADDRESSING
Many PIC18 control instructions do not need any
argument at all; they either perform an operation that
globally affects the device or they operate implicitly on
one register. This addressing mode is known as
Inherent Addressing. Examples include SLEEP, RESET
and DAW.
Other instructions work in a similar way but require an
additional explicit argument in the opcode. This is
known as Literal Addressing mode because they
require some literal value as an argument. Examples
include ADDLW and MOVLW which, respectively, add or
move a literal value to the W register. Other examples
include  CALL and GOTO, which include a 20-bit
program memory address.
5.4.2 DIRECT ADDRESSING
Direct addressing specifies all or part of the source
and/or destination address of the operation within the
opcode itself. The options are specified by the
arguments accompanying the instruction.
In the core PIC18 instruction set, bit-oriented and byte-
oriented instructions use some version of direct
addressing by default. All of these instructions include
some 8-bit literal address as their Least Significant
Byte. This address specifies either a register address in
one of the banks of data RAM (Section 5.3.3 “General
Purpose Register File”) or a location in the Access
Bank (Section 5.3.2 “Access Bank”) as the data
source for the instruction. 
The Access RAM bit ‘a’ determines how the address is
interpreted. When ‘a’ is ‘1’, the contents of the BSR
(Section 5.3.1 “Bank Select Register (BSR)”) are
used with the address to determine the complete 12-bit
address of the register. When ‘a’ is ‘0’, the address is
interpreted as being a register in the Access Bank.
Addressing that uses the Access RAM is sometimes
also known as Direct Forced Addressing mode.
A few instructions, such as MOVFF, include the entire
12-bit address (either source or destination) in their
opcodes. In these cases, the BSR is ignored entirely.
The destination of the operation’s results is determined
by the destination bit ‘d’. When ‘d’ is ‘1’, the results are
stored back in the source register, overwriting its origi-
nal contents. When ‘d’ is ‘0’, the results are stored in
the W register. Instructions without the ‘d’ argument
have a destination that is implicit in the instruction; their
destination is either the target register being operated
on or the W register.
5.4.3 INDIRECT ADDRESSING
Indirect addressing allows the user to access a location
in data memory without giving a fixed address in the
instruction. This is done by using File Select Registers
(FSRs) as pointers to the locations to be read or written
to. Since the FSRs are themselves located in RAM as
Special File Registers, they can also be directly manip-
ulated under program control. This makes FSRs very
useful in implementing data structures, such as tables
and arrays in data memory. 
The registers for indirect addressing are also
implemented with Indirect File Operands (INDFs) that
permit automatic manipulation of the pointer value with
auto-incrementing, auto-decrementing or offsetting
with another value. This allows for efficient code, using
loops, such as the example of clearing an entire RAM
bank in Example 5-5.
EXAMPLE 5-5: HOW TO CLEAR RAM 
(BANK 1) USING 
INDIRECT ADDRESSING   
Note: The execution of some instructions in the
core PIC18 instruction set are changed
when the PIC18 extended instruction set is
enabled. See Section 5.5 “Data Memory
and the Extended Instruction Set” for
more information.
LFSR FSR0, 100h ;   
NEXT  CLRF POSTINC0 ; Clear INDF 
; register then 
; inc pointer 
BTFSS FSR0H, 1 ; All done with
; Bank1? 
BRA NEXT ; NO, clear next 
CONTINUE ; YES, continue 

PIC18F2X1X/4X1X

5.4.3.1 FSR Registers and the INDF

Operand

At the core of indirect addressing are three sets of

registers: FSR0, FSR1 and FSR2. Each represents a

pair of 8-bit registers, FSRnH and FSRnL. The four

upper bits of the FSRnH register are not used so each

FSR pair holds a 12-bit value. This represents a value

that can address the entire range of the data memory

in a linear fashion. The FSR register pairs, then, serve

as pointers to data memory locations.

Indirect addressing is accomplished with a set of

Indirect File Operands, INDF0 through INDF2. These

can be thought of as “virtual” registers: they are

mapped in the SFR space but are not physically imple-

mented. Reading or writing to a particular INDF register

actually accesses its corresponding FSR register pair.

A read from INDF1, for example, reads the data at the

address indicated by FSR1H:FSR1L. Instructions that

use the INDF registers as operands actually use the

contents of their corresponding FSR as a pointer to the

instruction’s target. The INDF operand is just a

convenient way of using the pointer.

Because indirect addressing uses a full 12-bit address,

data RAM banking is not necessary. Thus, the current

contents of the BSR and the Access RAM bit have no

effect on determining the target address.

5.4.3.2 FSR Registers and POSTINC,

POSTDEC, PREINC and PLUSW

In addition to the INDF operand, each FSR register pair

also has four additional indirect operands. Like INDF,

these are “virtual” registers that cannot be indirectly

read or written to. Accessing these registers actually

accesses the associated FSR register pair, but also

performs a specific action on its stored value. They are:

• POSTDEC: accesses the FSR value, then

automatically decrements it by 1 afterwards

• POSTINC: accesses the FSR value, then

automatically increments it by 1 afterwards

• PREINC: increments the FSR value by 1, then

uses it in the operation

• PLUSW: adds the signed value of the W register

(range of -127 to 128) to that of the FSR and uses

the new value in the operation.

In this context, accessing an INDF register uses the

value in the FSR registers without changing them. Sim-

ilarly, accessing a PLUSW register gives the FSR value

offset by that in the W register; neither value is actually

changed in the operation. Accessing the other virtual

registers changes the value of the FSR registers.

Operations on the FSRs with POSTDEC, POSTINC

and PREINC affect the entire register pair; that is, roll-

overs of the FSRnL register from FFh to 00h carry over

to the FSRnH register. On the other hand, results of

these operations do not change the value of any flags

in the STATUS register (e.g., Z, N, OV, etc.).

FIGURE 5-9: INDIRECT ADDRESSING

FSR1H:FSR1L

Data Memory

000h

100h

200h

300h

F00h

E00h

FFFh

Bank 0

Bank 1

Bank 2

Bank 14

Bank 15

Bank 3

through

Bank 13

ADDWF, INDF1, 1

Using an instruction with one of the

indirect addressing registers as the

operand....

...uses the 12-bit address stored in

the FSR pair associated with that

...to determine the data memory

location to be used in that operation.

In this case, the FSR1 pair contains

ECCh. This means the contents of

location ECCh will be added to that

of the W register and stored back in

ECCh.

xxxx1110 11001100

PIC18F2X1X/4X1X

The PLUSW register can be used to implement a form

of indexed addressing in the data memory space. By

manipulating the value in the W register, users can

reach addresses that are fixed offsets from pointer

addresses. In some applications, this can be used to

implement some powerful program control structure,

such as software stacks, inside of data memory.

5.4.3.3 Operations by FSRs on FSRs

Indirect addressing operations that target other FSRs

or virtual registers represent special cases. For exam-

ple, using an FSR to point to one of the virtual registers

will not result in successful operations. As a specific

case, assume that FSR0H:FSR0L contains FE7h, the

address of INDF1. Attempts to read the value of the

INDF1 using INDF0 as an operand will return 00h.

Attempts to write to INDF1 using INDF0 as the operand

will result in a NOP.

On the other hand, using the virtual registers to write to

an FSR pair may not occur as planned. In these cases,

the value will be written to the FSR pair but without any

incrementing or decrementing. Thus, writing to INDF2

or POSTDEC2 will write the same value to the

FSR2H:FSR2L.

Since the FSRs are physical registers mapped in the

SFR space, they can be manipulated through all direct

operations. Users should proceed cautiously when

working on these registers, particularly if their code

uses indirect addressing.

Similarly, operations by indirect addressing are gener-

ally permitted on all other SFRs. Users should exercise

the appropriate caution that they do not inadvertently

change settings that might affect the operation of the

device.

5.5 Data Memory and the Extended

Instruction Set

Enabling the PIC18 extended instruction set (XINST

Configuration bit = 1) significantly changes certain

aspects of data memory and its addressing. Specifi-

cally, the use of the Access Bank for many of the core

PIC18 instructions is different; this is due to the

introduction of a new addressing mode for the data

memory space.

What does not change is just as important. The size of

the data memory space is unchanged, as well as its

linear addressing. The SFR map remains the same.

Core PIC18 instructions can still operate in both Direct

and Indirect Addressing mode; inherent and literal

instructions do not change at all. Indirect addressing

with FSR0 and FSR1 also remain unchanged.

5.5.1 INDEXED ADDRESSING WITH

LITERAL OFFSET

Enabling the PIC18 extended instruction set changes

the behavior of indirect addressing using the FSR2

conditions, instructions that use the Access Bank – that

is, most bit-oriented and byte-oriented instructions –

can invoke a form of indexed addressing using an

offset specified in the instruction. This special address-

ing mode is known as Indexed Addressing with Literal

Offset, or Indexed Literal Offset mode.

When using the extended instruction set, this

addressing mode requires the following:

• The use of the Access Bank is forced (‘a’ = 0);

and

• The file address argument is less than or equal to

5Fh.

Under these conditions, the file address of the instruc-

tion is not interpreted as the lower byte of an address

(used with the BSR in direct addressing), or as an 8-bit

address in the Access Bank. Instead, the value is

interpreted as an offset value to an Address Pointer,

specified by FSR2. The offset and the contents of

FSR2 are added to obtain the target address of the

operation.

5.5.2 INSTRUCTIONS AFFECTED BY

INDEXED LITERAL OFFSET MODE

Any of the core PIC18 instructions that can use direct

addressing are potentially affected by the Indexed Literal

Offset Addressing mode. This includes all byte-oriented

and bit-oriented instructions, or almost one-half of the

standard PIC18 instruction set. Instructions that only use

Inherent or Literal Addressing modes are unaffected.

Additionally, byte-oriented and bit-oriented instructions

are not affected if they do not use the Access Bank

(Access RAM bit is ‘1’), or include a file address of 60h

or above. Instructions meeting these criteria will

continue to execute as before. A comparison of the

different possible addressing modes when the

extended instruction set is enabled is shown in

Figure 5-10.

Those who desire to use bit-oriented or byte-oriented

instructions in the Indexed Literal Offset mode should

note the changes to assembler syntax for this mode.

This is described in more detail in Section 23.2.1

“Extended Instruction Syntax”.

PIC18F2X1X/4X1X

FIGURE 5-10: COMPARING ADDRESSING OPTIONS FOR BIT-ORIENTED AND

BYTE-ORIENTED INSTRUCTIONS (EXTENDED INSTRUCTION SET ENABLED)

EXAMPLE INSTRUCTION: ADDWF, f, d, a (Opcode: 0010 01da ffff ffff)

When ‘a’ = 0 and f ≥ 60h:

The instruction executes in

Direct Forced mode. ‘f’ is inter-

preted as a location in the

Access RAM between 060h

and 0FFh. This is the same as

locations 060h to 07Fh

(Bank 0) and F80h to FFFh

(Bank 15) of data memory.

Locations below 60h are not

available in this addressing

mode.

When ‘a’ = 0 and f ≤ 5Fh:

The instruction executes in

Indexed Literal Offset mode. ‘f’

is interpreted as an offset to the

address value in FSR2. The

two are added together to

obtain the address of the target

address can be anywhere in

the data memory space.

Note that in this mode, the

correct syntax is now:

ADDWF [k], d

where ‘k’ is the same as ‘f’.

When ‘a’ = 1 (all values of f):

The instruction executes in

Direct mode (also known as

Direct Long mode). ‘f’ is inter-

preted as a location in one of

the 16 banks of the data

memory space. The bank is

designated by the Bank Select

can be in any implemented

bank in the data memory

space.

000h

060h

100h

F00h

F80h

FFFh

Valid range

00h

60h

80h

FFh

Data Memory

Access RAM

Bank 0

Bank 1

through

Bank 14

Bank 15

SFRs

000h

080h

100h

F00h

F80h

FFFh

Data Memory

Bank 0

Bank 1

through

Bank 14

Bank 15

SFRs

FSR2H FSR2L

ffffffff001001da

000h

080h

100h

F00h

F80h

FFFh

Data Memory

Bank 0

Bank 1

through

Bank 14

Bank 15

SFRs

for ‘f’

BSR

00000000

080h

PIC18F2X1X/4X1X

5.5.3 MAPPING THE ACCESS BANK IN

INDEXED LITERAL OFFSET

ADDRESSING MODE

The use of Indexed Literal Offset Addressing mode

effectively changes how the first 96 locations of access

RAM (00h to 5Fh) are mapped. Rather than containing

just the contents of the bottom half of Bank 0, this mode

maps the contents from Bank 0 and a user defined

“window” that can be located anywhere in the data

memory space. The value of FSR2 establishes the

lower boundary of the addresses mapped into the

window, while the upper boundary is defined by FSR2

plus 95 (5Fh). Addresses in the Access RAM above

5Fh are mapped as previously described (see

Section 5.3.2 “Access Bank”). An example of Access

Bank remapping in this addressing mode is shown in

Figure 5-11.

Remapping of the Access Bank applies

only

to opera-

tions using the Indexed Literal Offset Addressing

mode. Operations that use the BSR (Access RAM bit is

‘1’) will continue to use direct addressing as before.

5.6 PIC18 Instruction Execution and

the Extended Instruction Set

Enabling the extended instruction set adds eight

additional commands to the existing PIC18 instruction

set. These instructions are executed as described in

Section 23.2 “Extended Instruction Set”.

FIGURE 5-11: REMAPPING THE ACCESS BANK WITH INDEXED LITERAL OFFSET

ADDRESSING

Data Memory

000h

100h

200h

F80h

F00h

FFFh

Bank 1

Bank 15

Bank 2

through

Bank 14

SFRs

05Fh

ADDWF f, d, a

FSR2H:FSR2L = 120h

Locations in the region

from the FSR2 Pointer

(120h) to the pointer plus

05Fh (17Fh) are mapped

to the bottom of the

Access RAM (000h-05Fh).

Locations in Bank 0 from

060h to 07Fh are mapped,

as usual, to the middle of

the Access Bank.

Special File Registers at

F80h through FFFh are

mapped to 80h through

FFh, as usual.

Bank 0 addresses below

5Fh can still be addressed

by using the BSR.

Access Bank

00h

80h

FFh

7Fh

Bank 0

SFRs

Bank 1 “Window”

Bank 0

Window

Example Situation:

07Fh

120h

17Fh

5Fh

Bank 1

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

6.0 FLASH PROGRAM MEMORY

In PIC18F2X1X/4X1X devices, the program memory is

implemented as read-only Flash memory. It is readable

over the entire VDD range during normal operation. A

read from program memory is executed on one byte at

a time.

6.1 Table Reads

For PIC18 devices, there are two operations that allow

the processor to move bytes between the program

memory space and the data RAM: table read (TBLRD)

and table write (TBLWT).

Table read operations retrieve data from program

memory and place it into the data RAM space.

Figure 6-1 shows the operation of a table read with

program memory and data RAM.

The program memory space is 16 bits wide, while the

data RAM space is 8 bits wide. Table reads and table

writes move data between these two memory spaces

through an 8-bit register, TABLAT.

Table reads work with byte entities. A table block

containing data, rather than program instructions, is not

required to be word-aligned. Therefore, a table block can

start and end at any byte address.

Because the program memory cannot be written to or

erased under normal operation, the TBLWT operation is

not discussed here.

FIGURE 6-1: TABLE READ OPERATION

Note 1: Although it cannot be used in

PIC18F2X1X/4X1X devices in normal

operation, the TBLWT instruction is still

implemented in the instruction set.

Executing the instruction takes two

instruction cycles, but effectively results

in a NOP.

2: The TBLWT instruction is available only in

programming modes and is used during

In-Circuit Serial Programming™ (ICSP™).

Table Pointer(1)

Table Latch (8-bit)

Program Memory

TBLPTRH TBLPTRL

TABLAT

TBLPTRU

Instruction: TBLRD*

Note 1: Table Pointer register points to a byte in program memory.

Program Memory

(TBLPTR)

PIC18F2X1X/4X1X

6.2 Control Registers

Two control registers are used in conjunction with the

TBLRD instruction: the TABLAT register and the

TBLPTR register set.

6.2.1 TABLAT – TABLE LATCH REGISTER

The Table Latch (TABLAT) is an 8-bit register mapped

into the SFR space. The Table Latch register is used to

hold 8-bit data during data transfers between program

memory and data RAM.

6.2.2 TBLPTR – TABLE POINTER

The Table Pointer register (TBLPTR) addresses a byte

within the program memory. It is comprised of three

SFR registers: Table Pointer Upper Byte, Table Pointer

High Byte and Table Pointer Low Byte

(TBLPTRU:TBLPTRH:TBLPTRL). Only the lower six

bits of TBLPTRU are used with TBLPTRH and

TBLPTRL, to form a 22-bit wide pointer.

The contents of TBLPTR indicate a location in program

memory space. The low-order 21 bits allow the device

to address the full 2 Mbytes of program memory space.

The 22nd bit allows access to the configuration space,

including the Device ID, user ID locations and the

Configuration bits.

The TBLPTR register set is updated when executing a

TBLRD in one of four ways, based on the instruction’s

arguments. These are detailed in Table 6-1. These

operations on the TBLPTR only affect the low-order

21 bits.

When a TBLRD is executed, all 22 bits of the TBLPTR

determine which byte is read from program memory

into TABLAT.

TABLE 6-1: TABLE POINTER

OPERATIONS WITH TBLRD

INSTRUCTIONS

6.3 Reading the Flash Program

Memory

The TBLRD instruction is used to retrieve data from

program memory and place it into data RAM. Table

reads from program memory are performed one byte at

a time.

TBLPTR points to a byte address in program space.

Executing TBLRD places the byte pointed to into

TABLAT. In addition, TBLPTR can be modified

automatically for the next table read operation.

The internal program memory is typically organized by

words. The Least Significant bit of the address selects

between the high and low bytes of the word. Figure 6-2

shows the interface between the internal program

memory and the TABLAT.

A typical method for reading data from program memory

is shown in Example 6-1.

FIGURE 6-2: READS FROM FLASH PROGRAM MEMORY

Example Operation on Table Pointer

TBLRD* TBLPTR is not modified

TBLRD*+ TBLPTR is incremented after the read

TBLRD*- TBLPTR is decremented after the read

TBLRD+* TBLPTR is incremented before the read

(Even Byte Address)

Program Memory

(Odd Byte Address)

TBLRD TABLAT

TBLPTR = xxxxx1

FETCH

Instruction Register

(IR) Read Register

TBLPTR = xxxxx0

PIC18F2X1X/4X1X

EXAMPLE 6-1: READING A FLASH PROGRAM MEMORY WORD

TABLE 6-2: REGISTERS ASSOCIATED WITH READING PROGRAM FLASH MEMORY

MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base

MOVWF TBLPTRU ; address of the word

MOVLW CODE_ADDR_HIGH

MOVWF TBLPTRH

MOVLW CODE_ADDR_LOW

MOVWF TBLPTRL

READ_WORD

TBLRD*+ ; read into TABLAT and increment

MOVF TABLAT, W ; get data

MOVWF WORD_EVEN

TBLRD*+ ; read into TABLAT and increment

MOVF TABLAT, W ; get data

MOVF WORD_ODD

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Reset

Values on

Page

TBLPTRU —— bit 21 Program Memory Table Pointer Upper Byte

(TBLPTR<20:16>)

TBPLTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 49

TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 49

TABLAT Program Memory Table Latch 49

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash access.

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

7.0 8 x 8 HARDWARE MULTIPLIER

7.1 Introduction

All PIC18 devices include an 8 x 8 hardware multiplier

as part of the ALU. The multiplier performs an unsigned

operation and yields a 16-bit result that is stored in the

product register pair, PRODH:PRODL. The multiplier’s

operation does not affect any flags in the STATUS

Making multiplication a hardware operation allows it to

be completed in a single instruction cycle. This has the

advantages of higher computational throughput and

reduced code size for multiplication algorithms and

allows the PIC18 devices to be used in many applica-

tions previously reserved for digital signal processors.

A comparison of various hardware and software

multiply operations, along with the savings in memory

and execution time, is shown in Table 7-1.

7.2 Operation

Example 7-1 shows the instruction sequence for an 8 x 8

unsigned multiplication. Only one instruction is required

when one of the arguments is already loaded in the

WREG register.

Example 7-2 shows the sequence to do an 8 x 8 signed

multiplication. To account for the sign bits of the argu-

ments, each argument’s Most Significant bit (MSb) is

tested and the appropriate subtractions are done.

EXAMPLE 7-1: 8 x 8 UNSIGNED

MULTIPLY ROUTINE

EXAMPLE 7-2: 8 x 8 SIGNED MULTIPLY

ROUTINE

TABLE 7-1: PERFORMANCE COMPARISON FOR VARIOUS MULTIPLY OPERATIONS

MOVF ARG1, W ;

MULWF ARG2 ; ARG1 * ARG2 ->

; PRODH:PRODL

MOVF ARG1, W

MULWF ARG2 ; ARG1 * ARG2 ->

; PRODH:PRODL

BTFSC ARG2, SB ; Test Sign Bit

SUBWF PRODH, F ; PRODH = PRODH

; - ARG1

MOVF ARG2, W

BTFSC ARG1, SB ; Test Sign Bit

SUBWF PRODH, F ; PRODH = PRODH

; - ARG2

Routine Multiply Method

Program

Memory

(Words)

Cycles

(Max)

Time

@ 40 MHz @ 10 MHz @ 4 MHz

8 x 8 unsigned Without hardware multiply 13 69 6.9 μs27.6 μs69 μs

Hardware multiply 1 1 100 ns 400 ns 1 μs

8 x 8 signed Without hardware multiply 33 91 9.1 μs36.4 μs91 μs

Hardware multiply 6 6 600 ns 2.4 μs6 μs

16 x 16 unsigned Without hardware multiply 21 242 24.2 μs96.8 μs 242 μs

Hardware multiply 28 28 2.8 μs 11.2 μs28 μs

16 x 16 signed Without hardware multiply 52 254 25.4 μs 102.6 μs 254 μs

Hardware multiply 35 40 4.0 μs16.0 μs40 μs

PIC18F2X1X/4X1X

Example 7-3 shows the sequence to do a 16 x 16

unsigned multiplication. Equation 7-1 shows the

algorithm that is used. The 32-bit result is stored in four

registers (RES3:RES0).

EQUATION 7-1: 16 x 16 UNSIGNED

MULTIPLICATION

ALGORITHM

EXAMPLE 7-3: 16 x 16 UNSIGNED

MULTIPLY ROUTINE

Example 7-4 shows the sequence to do a 16 x 16

signed multiply. Equation 7-2 shows the algorithm

used. The 32-bit result is stored in four registers

(RES3:RES0). To account for the sign bits of the

arguments, the MSb for each argument pair is tested

and the appropriate subtractions are done.

EQUATION 7-2: 16 x 16 SIGNED

MULTIPLICATION

ALGORITHM

EXAMPLE 7-4: 16 x 16 SIGNED

MULTIPLY ROUTINE

RES3:RES0 = ARG1H:ARG1L • ARG2H:ARG2L

= (ARG1H • ARG2H • 216) +

(ARG1H • ARG2L • 28) +

(ARG1L • ARG2H • 28) +

(ARG1L • ARG2L)

MOVF ARG1L, W

MULWF ARG2L ; ARG1L * ARG2L->

; PRODH:PRODL

MOVFF PRODH, RES1 ;

MOVFF PRODL, RES0 ;

;

MOVF ARG1H, W

MULWF ARG2H ; ARG1H * ARG2H->

; PRODH:PRODL

MOVFF PRODH, RES3 ;

MOVFF PRODL, RES2 ;

;

MOVF ARG1L, W

MULWF ARG2H ; ARG1L * ARG2H->

; PRODH:PRODL

MOVF PRODL, W ;

ADDWF RES1, F ; Add cross

MOVF PRODH, W ; products

ADDWFC RES2, F ;

CLRF WREG ;

ADDWFC RES3, F ;

;

MOVF ARG1H, W ;

MULWF ARG2L ; ARG1H * ARG2L->

; PRODH:PRODL

MOVF PRODL, W ;

ADDWF RES1, F ; Add cross

MOVF PRODH, W ; products

ADDWFC RES2, F ;

CLRF WREG ;

ADDWFC RES3, F ;

RES3:RES0 = ARG1H:ARG1L • ARG2H:ARG2L

= (ARG1H • ARG2H • 216) +

(ARG1H • ARG2L • 28) +

(ARG1L • ARG2H • 28) +

(ARG1L • ARG2L) +

(-1 • ARG2H<7> • ARG1H:ARG1L • 216) +

(-1 • ARG1H<7> • ARG2H:ARG2L • 216)

MOVF ARG1L, W

MULWF ARG2L ; ARG1L * ARG2L ->

; PRODH:PRODL

MOVFF PRODH, RES1 ;

MOVFF PRODL, RES0 ;

;

MOVF ARG1H, W

MULWF ARG2H ; ARG1H * ARG2H ->

; PRODH:PRODL

MOVFF PRODH, RES3 ;

MOVFF PRODL, RES2 ;

;

MOVF ARG1L, W

MULWF ARG2H ; ARG1L * ARG2H ->

; PRODH:PRODL

MOVF PRODL, W ;

ADDWF RES1, F ; Add cross

MOVF PRODH, W ; products

ADDWFC RES2, F ;

CLRF WREG ;

ADDWFC RES3, F ;

;

MOVF ARG1H, W ;

MULWF ARG2L ; ARG1H * ARG2L ->

; PRODH:PRODL

MOVF PRODL, W ;

ADDWF RES1, F ; Add cross

MOVF PRODH, W ; products

ADDWFC RES2, F ;

CLRF WREG ;

ADDWFC RES3, F ;

;

BTFSS ARG2H, 7 ; ARG2H:ARG2L neg?

BRA SIGN_ARG1 ; no, check ARG1

MOVF ARG1L, W ;

SUBWF RES2 ;

MOVF ARG1H, W ;

SUBWFB RES3

;

SIGN_ARG1

BTFSS ARG1H, 7 ; ARG1H:ARG1L neg?

BRA CONT_CODE ; no, done

MOVF ARG2L, W ;

SUBWF RES2 ;

MOVF ARG2H, W ;

SUBWFB RES3

;

CONT_CODE

PIC18F2X1X/4X1X

8.0 INTERRUPTS

The PIC18F2X1X/4X1X devices have multiple interrupt

sources and an interrupt priority feature that allows

most interrupt sources to be assigned a high priority

level or a low priority level. The high priority interrupt

vector is at 0008h and the low priority interrupt vector is

at 0018h. High priority interrupt events will interrupt any

low priority interrupts that may be in progress.

There are ten registers which are used to control

interrupt operation. These registers are:

• RCON

•INTCON

• INTCON2

• INTCON3

• PIR1, PIR2

• PIE1, PIE2

• IPR1, IPR2

It is recommended that the Microchip header files

supplied with MPLAB® IDE be used for the symbolic bit

names in these registers. This allows the assembler/

compiler to automatically take care of the placement of

these bits within the specified register.

In general, interrupt sources have three bits to control

their operation. They are:

•Flag bit to indicate that an interrupt event

occurred

•Enable bit that allows program execution to

branch to the interrupt vector address when the

flag bit is set

•Priority bit to select high priority or low priority

The interrupt priority feature is enabled by setting the

IPEN bit (RCON<7>). When interrupt priority is

enabled, there are two bits which enable interrupts

globally. Setting the GIEH bit (INTCON<7>) enables all

interrupts that have the priority bit set (high priority).

Setting the GIEL bit (INTCON<6>) enables all

interrupts that have the priority bit cleared (low priority).

When the interrupt flag, enable bit and appropriate

global interrupt enable bit are set, the interrupt will vec-

tor immediately to address 0008h or 0018h, depending

on the priority bit setting. Individual interrupts can be

disabled through their corresponding enable bits.

When the IPEN bit is cleared (default state), the

interrupt priority feature is disabled and interrupts are

compatible with PIC® mid-range devices. In

Compatibility mode, the interrupt priority bits for each

source have no effect. INTCON<6> is the PEIE bit,

which enables/disables all peripheral interrupt sources.

INTCON<7> is the GIE bit, which enables/disables all

interrupt sources. All interrupts branch to address

0008h in Compatibility mode.

When an interrupt is responded to, the global interrupt

enable bit is cleared to disable further interrupts. If the

IPEN bit is cleared, this is the GIE bit. If interrupt priority

levels are used, this will be either the GIEH or GIEL bit.

High priority interrupt sources can interrupt a low

priority interrupt. Low priority interrupts are not

processed while high priority interrupts are in progress.

The return address is pushed onto the stack and the

PC is loaded with the interrupt vector address (0008h

or 0018h). Once in the Interrupt Service Routine, the

source(s) of the interrupt can be determined by polling

the interrupt flag bits. The interrupt flag bits must be

cleared in software before re-enabling interrupts to

avoid recursive interrupts.

The “return from interrupt” instruction, RETFIE, exits

the interrupt routine and sets the GIE bit (GIEH or GIEL

if priority levels are used), which re-enables interrupts.

For external interrupt events, such as the INT pins or

the PORTB input change interrupt, the interrupt latency

will be three to four instruction cycles. The exact

latency is the same for one or two-cycle instructions.

Individual interrupt flag bits are set, regardless of the

status of their corresponding enable bit or the GIE bit.

Note: Do not use the MOVFF instruction to modify

any of the interrupt control registers while

any interrupt is enabled. Doing so may

cause erratic microcontroller behavior.

PIC18F2X1X/4X1X

FIGURE 8-1: PIC18 INTERRUPT LOGIC

TMR0IE

GIEH/GIE

GIEL/PEIE

Wake-up if in

Interrupt to CPU

Vector to Location

0008h

INT2IF

INT2IE

INT2IP

INT1IF

INT1IE

INT1IP

TMR0IF

TMR0IE

TMR0IP

RBIF

RBIE

RBIP

IPEN

TMR0IF

TMR0IP

INT1IF

INT1IE

INT1IP

INT2IF

INT2IE

INT2IP

RBIF

RBIE

RBIP

INT0IF

INT0IE

GIEL/PEIE

Interrupt to CPU

Vector to Location

IPEN

0018h

SSPIF

SSPIE

SSPIP

SSPIF

SSPIE

SSPIP

ADIF

ADIE

ADIP

RCIF

RCIE

RCIP

Additional Peripheral Interrupts

ADIF

ADIE

ADIP

High Priority Interrupt Generation

Low Priority Interrupt Generation

RCIF

RCIE

RCIP

Additional Peripheral Interrupts

Idle or Sleep modes

GIEH/GIE

PIC18F2X1X/4X1X

8.1 INTCON Registers

The INTCON registers are readable and writable

registers, which contain various enable, priority and

flag bits.

Note: Interrupt flag bits are set when an interrupt

condition occurs regardless of the state of

its corresponding enable bit or the global

interrupt enable bit. User software should

ensure the appropriate interrupt flag bits

are clear prior to enabling an interrupt.

This feature allows for software polling.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x

GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF

bit 7 bit 0

bit 7 GIE/GIEH: Global Interrupt Enable bit

When IPEN = 0:

1 = Enables all unmasked interrupts

0 = Disables all interrupts

When IPEN = 1:

1 = Enables all high priority interrupts

0 = Disables all interrupts

bit 6 PEIE/GIEL: Peripheral Interrupt Enable bit

When IPEN = 0:

1 = Enables all unmasked peripheral interrupts

0 = Disables all peripheral interrupts

When IPEN = 1:

1 = Enables all low priority peripheral interrupts

0 = Disables all low priority peripheral interrupts

bit 5 TMR0IE: TMR0 Overflow Interrupt Enable bit

1 = Enables the TMR0 overflow interrupt

0 = Disables the TMR0 overflow interrupt

bit 4 INT0IE: INT0 External Interrupt Enable bit

1 = Enables the INT0 external interrupt

0 = Disables the INT0 external interrupt

bit 3 RBIE: RB Port Change Interrupt Enable bit

1 = Enables the RB port change interrupt

0 = Disables the RB port change interrupt

bit 2 TMR0IF: TMR0 Overflow Interrupt Flag bit

1 = TMR0 register has overflowed (must be cleared in software)

0 = TMR0 register did not overflow

bit 1 INT0IF: INT0 External Interrupt Flag bit

1 = The INT0 external interrupt occurred (must be cleared in software)

0 = The INT0 external interrupt did not occur

bit 0 RBIF: RB Port Change Interrupt Flag bit

1 = At least one of the RB7:RB4 pins changed state (must be cleared in software)

0 = None of the RB7:RB4 pins have changed state

Note: A mismatch condition will continue to set this bit. Reading PORTB will end the

mismatch condition and allow the bit to be cleared.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

R/W-1 R/W-1 R/W-1 R/W-1 U-0 R/W-1 U-0 R/W-1

RBPU INTEDG0 INTEDG1 INTEDG2 —TMR0IP—RBIP

bit 7 bit 0

bit 7 RBPU: PORTB Pull-up Enable bit

1 = All PORTB pull-ups are disabled

0 = PORTB pull-ups are enabled by individual port latch values

bit 6 INTEDG0: External Interrupt 0 Edge Select bit

1 = Interrupt on rising edge

0 = Interrupt on falling edge

bit 5 INTEDG1: External Interrupt 1 Edge Select bit

1 = Interrupt on rising edge

0 = Interrupt on falling edge

bit 4 INTEDG2: External Interrupt 2 Edge Select bit

1 = Interrupt on rising edge

0 = Interrupt on falling edge

bit 3 Unimplemented: Read as ‘0’

bit 2 TMR0IP: TMR0 Overflow Interrupt Priority bit

1 = High priority

0 = Low priority

bit 1 Unimplemented: Read as ‘0’

bit 0 RBIP: RB Port Change Interrupt Priority bit

1 = High priority

0 = Low priority

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

Note: Interrupt flag bits are set when an interrupt condition occurs regardless of the state

of its corresponding enable bit or the global interrupt enable bit. User software

should ensure the appropriate interrupt flag bits are clear prior to enabling an

interrupt. This feature allows for software polling.

PIC18F2X1X/4X1X

R/W-1 R/W-1 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0

INT2IP INT1IP —INT2IEINT1IE— INT2IF INT1IF

bit 7 bit 0

bit 7 INT2IP: INT2 External Interrupt Priority bit

1 = High priority

0 = Low priority

bit 6 INT1IP: INT1 External Interrupt Priority bit

1 = High priority

0 = Low priority

bit 5 Unimplemented: Read as ‘0’

bit 4 INT2IE: INT2 External Interrupt Enable bit

1 = Enables the INT2 external interrupt

0 = Disables the INT2 external interrupt

bit 3 INT1IE: INT1 External Interrupt Enable bit

1 = Enables the INT1 external interrupt

0 = Disables the INT1 external interrupt

bit 2 Unimplemented: Read as ‘0’

bit 1 INT2IF: INT2 External Interrupt Flag bit

1 = The INT2 external interrupt occurred (must be cleared in software)

0 = The INT2 external interrupt did not occur

bit 0 INT1IF: INT1 External Interrupt Flag bit

1 = The INT1 external interrupt occurred (must be cleared in software)

0 = The INT1 external interrupt did not occur

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state

of its corresponding enable bit or the global interrupt enable bit. User software

should ensure the appropriate interrupt flag bits are clear prior to enabling an

interrupt. This feature allows for software polling.

PIC18F2X1X/4X1X

8.2 PIR Registers

The PIR registers contain the individual flag bits for the

peripheral interrupts. Due to the number of peripheral

interrupt sources, there are two Peripheral Interrupt

Request (Flag) registers (PIR1 and PIR2).

Note 1: Interrupt flag bits are set when an interrupt

condition occurs regardless of the state of

its corresponding enable bit or the Global

Interrupt Enable bit, GIE (INTCON<7>).

2: User software should ensure the appropri-

ate interrupt flag bits are cleared prior to

enabling an interrupt and after servicing

that interrupt.

R/W-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0

PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF

bit 7 bit 0

bit 7 PSPIF: Parallel Slave Port Read/Write Interrupt Flag bit(1)

1 = A read or a write operation has taken place (must be cleared in software)

0 = No read or write has occurred

Note 1: This bit is unimplemented on 28-pin devices and is read as ‘0’.

bit 6 ADIF: A/D Converter Interrupt Flag bit

1 = An A/D conversion completed (must be cleared in software)

0 = The A/D conversion is not complete

bit 5 RCIF: EUSART Receive Interrupt Flag bit

1 = The EUSART receive buffer, RCREG, is full (cleared when RCREG is read)

0 = The EUSART receive buffer is empty

bit 4 TXIF: EUSART Transmit Interrupt Flag bit

1 = The EUSART transmit buffer, TXREG, is empty (cleared when TXREG is written)

0 = The EUSART transmit buffer is full

bit 3 SSPIF: Master Synchronous Serial Port Interrupt Flag bit

1 = The transmission/reception is complete (must be cleared in software)

0 = Waiting to transmit/receive

bit 2 CCP1IF: CCP1 Interrupt Flag bit

Capture mode:

1 = A TMR1 register capture occurred (must be cleared in software)

0 = No TMR1 register capture occurred

Compare mode:

1 = A TMR1 register compare match occurred (must be cleared in software)

0 = No TMR1 register compare match occurred

PWM mode:

Unused in this mode.

bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit

1 = TMR2 to PR2 match occurred (must be cleared in software)

0 = No TMR2 to PR2 match occurred

bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit

1 = TMR1 register overflowed (must be cleared in software)

0 = TMR1 register did not overflow

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

OSCFIF CMIF —— BCLIF HLVDIF TMR3IF CCP2IF

bit 7 bit 0

bit 7 OSCFIF: Oscillator Fail Interrupt Flag bit

1 = Device oscillator failed, clock input has changed to INTOSC (must be cleared in software)

0 = Device clock operating

bit 6 CMIF: Comparator Interrupt Flag bit

1 = Comparator input has changed (must be cleared in software)

0 = Comparator input has not changed

bit 5-4 Unimplemented: Read as ‘0’

bit 3 BCLIF: Bus Collision Interrupt Flag bit

1 = A bus collision occurred (must be cleared in software)

0 = No bus collision occurred

bit 2 HLVDIF: High/Low-Voltage Detect Interrupt Flag bit

1 = A low-voltage condition occurred (must be cleared in software)

0 = The device voltage is above the High/Low-Voltage Detect trip point

bit 1 TMR3IF: TMR3 Overflow Interrupt Flag bit

1 = TMR3 register overflowed (must be cleared in software)

0 = TMR3 register did not overflow

bit 0 CCP2IF: CCPx Interrupt Flag bit

Capture mode:

1 = A TMR1 register capture occurred (must be cleared in software)

0 = No TMR1 register capture occurred

Compare mode:

1 = A TMR1 register compare match occurred (must be cleared in software)

0 = No TMR1 register compare match occurred

PWM mode:

Unused in this mode.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

8.3 PIE Registers

The PIE registers contain the individual enable bits for

the peripheral interrupts. Due to the number of periph-

eral interrupt sources, there are two Peripheral Interrupt

Enable registers (PIE1 and PIE2). When IPEN = 0, the

PEIE bit must be set to enable any of these peripheral

interrupts.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE

bit 7 bit 0

bit 7 PSPIE: Parallel Slave Port Read/Write Interrupt Enable bit(1)

1 = Enables the PSP read/write interrupt

0 = Disables the PSP read/write interrupt

Note 1: This bit is unimplemented on 28-pin devices and is read as ‘0’.

bit 6 ADIE: A/D Converter Interrupt Enable bit

1 = Enables the A/D interrupt

0 = Disables the A/D interrupt

bit 5 RCIE: EUSART Receive Interrupt Enable bit

1 = Enables the EUSART receive interrupt

0 = Disables the EUSART receive interrupt

bit 4 TXIE: EUSART Transmit Interrupt Enable bit

1 = Enables the EUSART transmit interrupt

0 = Disables the EUSART transmit interrupt

bit 3 SSPIE: Master Synchronous Serial Port Interrupt Enable bit

1 = Enables the MSSP interrupt

0 = Disables the MSSP interrupt

bit 2 CCP1IE: CCP1 Interrupt Enable bit

1 = Enables the CCP1 interrupt

0 = Disables the CCP1 interrupt

bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit

1 = Enables the TMR2 to PR2 match interrupt

0 = Disables the TMR2 to PR2 match interrupt

bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit

1 = Enables the TMR1 overflow interrupt

0 = Disables the TMR1 overflow interrupt

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

OSCFIE CMIE —— BCLIE HLVDIE TMR3IE CCP2IE

bit 7 bit 0

bit 7 OSCFIE: Oscillator Fail Interrupt Enable bit

1 = Enabled

0 =Disabled

bit 6 CMIE: Comparator Interrupt Enable bit

1 = Enabled

0 =Disabled

bit 5-4 Unimplemented: Read as ‘0’

bit 3 BCLIE: Bus Collision Interrupt Enable bit

1 = Enabled

0 =Disabled

bit 2 HLVDIE: High/Low-Voltage Detect Interrupt Enable bit

1 = Enabled

0 =Disabled

bit 1 TMR3IE: TMR3 Overflow Interrupt Enable bit

1 = Enabled

0 =Disabled

bit 0 CCP2IE: CCP2 Interrupt Enable bit

1 = Enabled

0 =Disabled

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

8.4 IPR Registers

The IPR registers contain the individual priority bits for

the peripheral interrupts. Due to the number of periph-

eral interrupt sources, there are two Peripheral Interrupt

Priority registers (IPR1 and IPR2). Using the priority bits

requires that the Interrupt Priority Enable (IPEN) bit be

set.

R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP

bit 7 bit 0

bit 7 PSPIP: Parallel Slave Port Read/Write Interrupt Priority bit(1)

1 =High priority

0 = Low priority

Note 1: This bit is unimplemented on 28-pin devices and is read as ‘0’.

bit 6 ADIP: A/D Converter Interrupt Priority bit

1 =High priority

0 = Low priority

bit 5 RCIP: EUSART Receive Interrupt Priority bit

1 =High priority

0 = Low priority

bit 4 TXIP: EUSART Transmit Interrupt Priority bit

1 =High priority

0 = Low priority

bit 3 SSPIP: Master Synchronous Serial Port Interrupt Priority bit

1 =High priority

0 = Low priority

bit 2 CCP1IP: CCP1 Interrupt Priority bit

1 =High priority

0 = Low priority

bit 1 TMR2IP: TMR2 to PR2 Match Interrupt Priority bit

1 =High priority

0 = Low priority

bit 0 TMR1IP: TMR1 Overflow Interrupt Priority bit

1 =High priority

0 = Low priority

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

R/W-1 R/W-1 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1

OSCFIP CMIP —— BCLIP HLVDIP TMR3IP CCP2IP

bit 7 bit 0

bit 7 OSCFIP: Oscillator Fail Interrupt Priority bit

1 =High priority

0 = Low priority

bit 6 CMIP: Comparator Interrupt Priority bit

1 =High priority

0 = Low priority

bit 5-4 Unimplemented: Read as ‘0’

bit 3 BCLIP: Bus Collision Interrupt Priority bit

1 =High priority

0 = Low priority

bit 2 HLVDIP: High/Low-Voltage Detect Interrupt Priority bit

1 =High priority

0 = Low priority

bit 1 TMR3IP: TMR3 Overflow Interrupt Priority bit

1 =High priority

0 = Low priority

bit 0 CCP2IP: CCP2 Interrupt Priority bit

1 =High priority

0 = Low priority

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X
DS39636C-page 92 Preliminary © 2007 Microchip Technology Inc.
8.5 RCON Register
The RCON register contains flag bits which are used to
determine the cause of the last Reset or wake-up from
Idle or Sleep modes. RCON also contains the IPEN bit
which enables interrupt priorities.
The operation of the SBOREN bit and the Reset flag
bits is discussed in more detail in Section 4.1 “RCON
Register”.
REGISTER 8-10: RCON REGISTER               
R/W-0 R/W-1(1) U-0 R/W-1 R-1 R-1 R/W-0(1) R/W-0
IPEN SBOREN —RITO PD POR BOR
bit 7 bit 0
bit 7 IPEN: Interrupt Priority Enable bit 
1 = Enable priority levels on interrupts
0 = Disable priority levels on interrupts (PIC16XXX Compatibility mode)
bit 6 SBOREN: Software BOR Enable bit(1)
For details of bit operation, see Register 4-1.
Note 1: Actual Reset values are determined by device configuration and the nature of the
device Reset. See Register 4-1 for additional information.
bit 5 Unimplemented: Read as ‘0’ 
bit 4 RI: RESET Instruction Flag bit 
For details of bit operation, see Register 4-1.
bit 3 TO: Watchdog Time-out Flag bit 
For details of bit operation, see Register 4-1.
bit 2 PD: Power-down Detection Flag bit 
For details of bit operation, see Register 4-1.
bit 1 POR: Power-on Reset Status bit
For details of bit operation, see Register 4-1.
bit 0 BOR: Brown-out Reset Status bit 
For details of bit operation, see Register 4-1.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

8.6 INTn Pin Interrupts

External interrupts on the RB0/INT0, RB1/INT1 and

RB2/INT2 pins are edge-triggered. If the corresponding

INTEDGx bit in the INTCON2 register is set (= 1), the

interrupt is triggered by a rising edge; if the bit is clear,

the trigger is on the falling edge. When a valid edge

appears on the RBx/INTx pin, the corresponding flag

bit INTxF is set. This interrupt can be disabled by clear-

ing the corresponding enable bit INTxE. Flag bit INTxF

must be cleared in software in the Interrupt Service

Routine before re-enabling the interrupt.

All external interrupts (INT0, INT1 and INT2) can wake-

up the processor from Idle or Sleep modes if bit INTxE

was set prior to going into those modes. If the Global

Interrupt Enable bit, GIE, is set, the processor will

branch to the interrupt vector following wake-up.

Interrupt priority for INT1 and INT2 is determined by the

value contained in the interrupt priority bits, INT1IP

(INTCON3<6>) and INT2IP (INTCON3<7>). There is

no priority bit associated with INT0. It is always a high

priority interrupt source.

8.7 TMR0 Interrupt

In 8-bit mode (which is the default), an overflow in the

TMR0 register (FFh →00h) will set flag bit TMR0IF. In

16-bit mode, an overflow in the TMR0H:TMR0L regis-

ter pair (FFFFh → 0000h) will set TMR0IF. The interrupt

can be enabled/disabled by setting/clearing enable bit,

TMR0IE (INTCON<5>). Interrupt priority for Timer0 is

determined by the value contained in the interrupt

priority bit, TMR0IP (INTCON2<2>). See Section 10.0

“Timer0 Module” for further details on the Timer0

module.

8.8 PORTB Interrupt-on-Change

An input change on PORTB<7:4> sets flag bit, RBIF

(INTCON<0>). The interrupt can be enabled/disabled

by setting/clearing enable bit, RBIE (INTCON<3>).

Interrupt priority for PORTB interrupt-on-change is

determined by the value contained in the interrupt

priority bit, RBIP (INTCON2<0>).

8.9 Context Saving During Interrupts

During interrupts, the return PC address is saved on

the stack. Additionally, the WREG, STATUS and BSR

registers are saved on the fast return stack. If a fast

return from interrupt is not used (see Section 5.3

“Data Memory Organization”), the user may need to

save the WREG, STATUS and BSR registers on entry

to the Interrupt Service Routine. Depending on the

user’s application, other registers may also need to be

saved. Example 8-1 saves and restores the WREG,

STATUS and BSR registers during an Interrupt Service

Routine.

EXAMPLE 8-1: SAVING STATUS, WREG AND BSR REGISTERS IN RAM

MOVWF W_TEMP ; W_TEMP is in virtual bank

MOVFF STATUS, STATUS_TEMP ; STATUS_TEMP located anywhere

MOVFF BSR, BSR_TEMP ; BSR_TMEP located anywhere

;

; USER ISR CODE

;

MOVFF BSR_TEMP, BSR ; Restore BSR

MOVF W_TEMP, W ; Restore WREG

MOVFF STATUS_TEMP, STATUS ; Restore STATUS

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

9.0 I/O PORTS

Depending on the device selected and features

enabled, there are up to five ports available. Some pins

of the I/O ports are multiplexed with an alternate

function from the peripheral features on the device. In

general, when a peripheral is enabled, that pin may not

be used as a general purpose I/O pin.

Each port has three registers for its operation. These

registers are:

• TRIS register (data direction register)

• PORT register (reads the levels on the pins of the

device)

• LAT register (output latch)

The Data Latch (LAT register) is useful for read-modify-

write operations on the value that the I/O pins are

driving.

A simplified model of a generic I/O port, without the

interfaces to other peripherals, is shown in Figure 9-1.

FIGURE 9-1: GENERIC I/O PORT

OPERATION

9.1 PORTA, TRISA and LATA Registers

PORTA is a 8-bit wide, bidirectional port. The corre-

sponding data direction register is TRISA. Setting a

TRISA bit (= 1) will make the corresponding PORTA pin

an input (i.e., put the corresponding output driver in a

high-impedance mode). Clearing a TRISA bit (= 0) will

make the corresponding PORTA pin an output (i.e., put

the contents of the output latch on the selected pin).

Reading the PORTA register reads the status of the

pins, whereas writing to it will write to the port latch.

The Data Latch (LATA) register is also memory mapped.

Read-modify-write operations on the LATA register read

and write the latched output value for PORTA.

The RA4 pin is multiplexed with the Timer0 module

clock input and one of the comparator outputs to

become the RA4/T0CKI/C1OUT pin. Pins RA6 and

RA7 are multiplexed with the main oscillator pins; they

are enabled as oscillator or I/O pins by the selection of

the main oscillator in the Configuration register (see

Section 22.1 “Configuration Bits” for details). When

they are not used as port pins, RA6 and RA7 and their

associated TRIS and LAT bits are read as ‘0’.

The other PORTA pins are multiplexed with analog

inputs, the analog VREF+ and VREF- inputs and the com-

parator voltage reference output. The operation of pins

RA3:RA0 and RA5 as A/D converter inputs is selected

by clearing or setting the control bits in the ADCON1

Pins RA0 through RA5 may also be used as comparator

inputs or outputs by setting the appropriate bits in the

CMCON register. To use RA3:RA0 as digital inputs, it is

also necessary to turn off the comparators.

The RA4/T0CKI/C1OUT pin is a Schmitt Trigger input.

All other PORTA pins have TTL input levels and full

CMOS output drivers.

The TRISA register controls the direction of the PORTA

pins, even when they are being used as analog inputs.

The user must ensure the bits in the TRISA register are

maintained set when using them as analog inputs.

EXAMPLE 9-1: INITIALIZING PORTA

Data

Bus

WR LAT

WR TRIS

RD Port

Data Latch

TRIS Latch

RD TRIS

Input

Buffer

I/O pin(1)

RD LAT

or Port

Note 1: I/O pins have diode protection to VDD and VSS.

Note: On a Power-on Reset, RA5 and RA3:RA0

are configured as analog inputs and read

as ‘0’. RA4 is configured as a digital input.

CLRF PORTA ; Initialize PORTA by

; clearing output

; data latches

CLRF LATA ; Alternate method

; to clear output

; data latches

MOVLW 07h ; Configure A/D

MOVWF ADCON1 ; for digital inputs

MOVWF 07h ; Configure comparators

MOVWF CMCON ; for digital input

MOVLW 0CFh ; Value used to

; initialize data

; direction

MOVWF TRISA ; Set RA<3:0> as inputs

; RA<5:4> as outputs

PIC18F2X1X/4X1X

TABLE 9-1: PORTA I/O SUMMARY

Pin Function TRIS

Setting I/O I/O

Type Description

RA0/AN0 RA0 0O DIG LATA<0> data output; not affected by analog input.

1I TTL PORTA<0> data input; disabled when analog input enabled.

AN0 1I ANA A/D input channel 0 and Comparator C1- input. Default input

configuration on POR; does not affect digital output.

RA1/AN1 RA1 0O DIG LATA<1> data output; not affected by analog input.

1I TTL PORTA<1> data input; disabled when analog input enabled.

AN1 1I ANA A/D input channel 1 and comparator C2- input. Default input

configuration on POR; does not affect digital output.

RA2/AN2/

VREF-/CVREF

RA2 0O DIG LATA<2> data output; not affected by analog input. Disabled when

CVREF output enabled.

1I TTL PORTA<2> data input. Disabled when analog functions enabled;

disabled when CVREF output enabled.

AN2 1I ANA A/D input channel 2 and comparator C2+ input. Default input

configuration on POR; not affected by analog output.

VREF-1I ANA A/D and comparator voltage reference low input.

CVREF xO ANA Comparator voltage reference output. Enabling this feature disables

digital I/O.

RA3/AN3/VREF+RA30O DIG LATA<3> data output; not affected by analog input.

1I TTL PORTA<3> data input; disabled when analog input enabled.

AN3 1I ANA A/D input channel 3 and comparator C1+ input. Default input

configuration on POR.

VREF+1I ANA A/D and comparator voltage reference high input.

RA4/T0CKI/C1OUT RA4 0O DIG LATA<4> data output.

1I ST PORTA<4> data input; default configuration on POR.

T0CKI 1I ST Timer0 clock input.

C1OUT 0O DIG Comparator 1 output; takes priority over port data.

RA5/AN4/SS/

HLVDIN/C2OUT

RA5 0O DIG LATA<5> data output; not affected by analog input.

1I TTL PORTA<5> data input; disabled when analog input enabled.

AN4 1I ANA A/D input channel 4. Default configuration on POR.

SS 1I TTL Slave select input for SSP (MSSP module).

HLVDIN 1I ANA High/Low-Voltage Detect external trip point input.

C2OUT 0O DIG Comparator 2 output; takes priority over port data.

OSC2/CLKO/RA6 RA6 0O DIG LATA<6> data output. Enabled in RCIO, INTIO2 and ECIO modes only.

1I TTL PORTA<6> data input. Enabled in RCIO, INTIO2 and ECIO modes only.

OSC2 xO ANA Main oscillator feedback output connection (XT, HS and LP modes).

CLKO xO DIG System cycle clock output (FOSC/4) in RC, INTIO1 and EC Oscillator

modes.

OSC1/CLKI/RA7 RA7 0O DIG LATA<7> data output. Disabled in External Oscillator modes.

1I TTL PORTA<7> data input. Disabled in External Oscillator modes.

OSC1 xI ANA Main oscillator input connection.

CLKI xI ANA Main clock input connection.

Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;

x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).

PIC18F2X1X/4X1X

TABLE 9-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Reset

Values

on page

PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52

LATA LATA7(1) LATA6(1) PORTA Data Latch Register (Read and Write to Data Latch) 52

TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Control Register 52

ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51

CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 51

CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 51

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTA.

Note 1: RA7:RA6 and their associated latch and data direction bits are enabled as I/O pins based on oscillator

configuration; otherwise, they are read as ‘0’.

PIC18F2X1X/4X1X

9.2 PORTB, TRISB and LATB

Registers

PORTB is an 8-bit wide, bidirectional port. The

corresponding data direction register is TRISB. Setting

a TRISB bit (= 1) will make the corresponding PORTB

pin an input (i.e., put the corresponding output driver in

a high-impedance mode). Clearing a TRISB bit (= 0)

will make the corresponding PORTB pin an output (i.e.,

put the contents of the output latch on the selected pin).

The Data Latch register (LATB) is also memory

mapped. Read-modify-write operations on the LATB

PORTB.

EXAMPLE 9-2: INITIALIZING PORTB

Each of the PORTB pins has a weak internal pull-up. A

single control bit can turn on all the pull-ups. This is

performed by clearing bit, RBPU (INTCON2<7>). The

weak pull-up is automatically turned off when the port

pin is configured as an output. The pull-ups are

disabled on a Power-on Reset.

Four of the PORTB pins (RB7:RB4) have an interrupt-

on-change feature. Only pins configured as inputs can

cause this interrupt to occur (i.e., any RB7:RB4 pin

configured as an output is excluded from the interrupt-

on-change comparison). The input pins (of RB7:RB4)

are compared with the old value latched on the last

read of PORTB. The “mismatch” outputs of RB7:RB4

are ORed together to generate the RB Port Change

Interrupt with Flag bit, RBIF (INTCON<0>).

This interrupt can wake the device from the Sleep

mode, or any of the Idle modes. The user, in the

Interrupt Service Routine, can clear the interrupt in the

following manner:

a) Any read or write of PORTB (except with the

MOVFF (ANY), PORTB instruction).

b) Clear flag bit RBIF.

A mismatch condition will continue to set flag bit RBIF.

Reading PORTB will end the mismatch condition and

allow flag bit RBIF to be cleared.

The interrupt-on-change feature is recommended for

wake-up on key depression operation and operations

where PORTB is only used for the interrupt-on-change

feature. Polling of PORTB is not recommended while

using the interrupt-on-change feature.

RB3 can be configured by the Configuration bit,

CCP2MX, as the alternate peripheral pin for the CCP2

module (CCP2MX = 0).

Note: On a Power-on Reset, RB4:RB0 are

configured as analog inputs by default and

read as ‘0’; RB7:RB5 are configured as

digital inputs.

By programming the Configuration bit,

PBADEN, RB4:RB0 will alternatively be

configured as digital inputs on POR.

CLRF PORTB ; Initialize PORTB by

; clearing output

; data latches

CLRF LATB ; Alternate method

; to clear output

; data latches

MOVLW 0Fh ; Set RB<4:0> as

MOVWF ADCON1 ; digital I/O pins

; (required if config bit

; PBADEN is set)

MOVLW 0CFh ; Value used to

; initialize data

; direction

MOVWF TRISB ; Set RB<3:0> as inputs

; RB<5:4> as outputs

; RB<7:6> as inputs

PIC18F2X1X/4X1X

TABLE 9-3: PORTB I/O SUMMARY

Pin Function TRIS

Setting I/O I/O

Type Description

RB0/INT0/FLT0/

AN12

RB0 0O DIG LATB<0> data output; not affected by analog input.

1I TTL PORTB<0> data input; weak pull-up when RBPU bit is cleared.

Disabled when analog input enabled.(1)

INT0 1I ST External interrupt 0 input.

FLT0 1I ST Enhanced PWM Fault input (ECCP1 module); enabled in software.

AN12 1I ANA A/D input channel 12.(1)

RB1/INT1/AN10 RB1 0O DIG LATB<1> data output; not affected by analog input.

1I TTL PORTB<1> data input; weak pull-up when RBPU bit is cleared.

Disabled when analog input enabled.(1)

INT1 1I ST External interrupt 1 input.

AN10 1I ANA A/D input channel 10.(1)

RB2/INT2/AN8 RB2 0O DIG LATB<2> data output; not affected by analog input.

1I TTL PORTB<2> data input; weak pull-up when RBPU bit is cleared.

Disabled when analog input enabled.(1)

INT2 1I ST External interrupt 2 input.

AN8 1I ANA A/D input channel 8.(1)

RB3/AN9/CCP2 RB3 0O DIG LATB<3> data output; not affected by analog input.

1I TTL PORTB<3> data input; weak pull-up when RBPU bit is cleared.

Disabled when analog input enabled.(1)

AN9 1I ANA A/D input channel 9.(1)

CCP2(2) 0O DIG CCP2 compare and PWM output.

1I ST CCP2 capture input

RB4/KBI0/AN11 RB4 0O DIG LATB<4> data output; not affected by analog input.

1I TTL PORTB<4> data input; weak pull-up when RBPU bit is cleared.

Disabled when analog input enabled.(1)

KBI0 1I TTL Interrupt on pin change.

AN11 1I ANA A/D input channel 11.(1)

RB5/KBI1/PGM RB5 0O DIG LATB<5> data output.

1I TTL PORTB<5> data input; weak pull-up when RBPU bit is cleared.

KBI1 1I TTL Interrupt on pin change.

PGM xI ST Single-Supply Programming mode entry (ICSP™). Enabled by LVP

Configuration bit; all other pin functions disabled.

RB6/KBI2/PGC RB6 0O DIG LATB<6> data output.

1I TTL PORTB<6> data input; weak pull-up when RBPU bit is cleared.

KBI2 1I TTL Interrupt on pin change.

PGC xI ST Serial execution (ICSP) clock input for ICSP and ICD operation.(3)

RB7/KBI3/PGD RB7 0O DIG LATB<7> data output.

1I TTL PORTB<7> data input; weak pull-up when RBPU bit is cleared.

KBI3 1I TTL Interrupt on pin change.

PGD xO DIG Serial execution data output for ICSP and ICD operation.(3)

xI ST Serial execution data input for ICSP and ICD operation.(3)

Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;

x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).

Note 1: Configuration on POR is determined by the PBADEN Configuration bit. Pins are configured as analog inputs by default

when PBADEN is set and digital inputs when PBADEN is cleared.

2: Alternate assignment for CCP2 when the CCP2MX Configuration bit is ‘0’. Default assignment is RC1.

3: All other pin functions are disabled when ICSP or ICD are enabled.

PIC18F2X1X/4X1X

TABLE 9-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Reset

Values

on page

PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 52

LATB PORTB Data Latch Register (Read and Write to Data Latch) 52

TRISB PORTB Data Direction Control Register 52

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49

INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 —TMR0IP —RBIP49

INTCON3 INT2IP INT1IP —INT2IEINT1IE— INT2IF INT1IF 49

ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTB.

PIC18F2X1X/4X1X

9.3 PORTC, TRISC and LATC

Registers

PORTC is an 8-bit wide, bidirectional port. The corre-

sponding data direction register is TRISC. Setting a

TRISC bit (= 1) will make the corresponding PORTC

pin an input (i.e., put the corresponding output driver in

a high-impedance mode). Clearing a TRISC bit (= 0)

will make the corresponding PORTC pin an output (i.e.,

put the contents of the output latch on the selected pin).

The Data Latch register (LATC) is also memory

mapped. Read-modify-write operations on the LATC

PORTC.

PORTC is multiplexed with several peripheral functions

(Table 9-5). The pins have Schmitt Trigger input

buffers. RC1 is normally configured by Configuration

bit, CCP2MX, as the default peripheral pin of the CCP2

module (default/erased state, CCP2MX = 1).

When enabling peripheral functions, care should be

taken in defining TRIS bits for each PORTC pin. Some

peripherals override the TRIS bit to make a pin an output,

while other peripherals override the TRIS bit to make a

pin an input. The user should refer to the corresponding

peripheral section for additional information.

The contents of the TRISC register are affected by

peripheral overrides. Reading TRISC always returns

the current contents, even though a peripheral device

may be overriding one or more of the pins.

EXAMPLE 9-3: INITIALIZING PORTC

Note: On a Power-on Reset, these pins are

configured as digital inputs.

CLRF PORTC ; Initialize PORTC by

; clearing output

; data latches

CLRF LATC ; Alternate method

; to clear output

; data latches

MOVLW 0CFh ; Value used to

; initialize data

; direction

MOVWF TRISC ; Set RC<3:0> as inputs

; RC<5:4> as outputs

; RC<7:6> as inputs

PIC18F2X1X/4X1X

TABLE 9-5: PORTC I/O SUMMARY

Pin Function TRIS

Setting I/O I/O

Type Description

RC0/T1OSO/

T13CKI

RC0 0O DIG LATC<0> data output.

1I ST PORTC<0> data input.

T1OSO xO ANA Timer1 oscillator output; enabled when Timer1 oscillator enabled.

Disables digital I/O.

T13CKI 1I ST Timer1/Timer3 counter input.

RC1/T1OSI/CCP2 RC1 0O DIG LATC<1> data output.

1I ST PORTC<1> data input.

T1OSI xI ANA Timer1 oscillator input; enabled when Timer1 oscillator enabled.

Disables digital I/O.

CCP2(1) 0O DIG CCP2 compare and PWM output; takes priority over port data.

1I ST CCP2 capture input.

RC2/CCP1/P1A RC2 0O DIG LATC<2> data output.

1I ST PORTC<2> data input.

CCP1 0O DIG ECCP1 compare or PWM output; takes priority over port data.

1I ST ECCP1 capture input.

P1A(2) 0O DIG ECCP1 Enhanced PWM output, channel A. May be configured for

tri-state during Enhanced PWM shutdown events. Takes priority over

port data.

RC3/SCK/SCL RC3 0O DIG LATC<3> data output.

1I ST PORTC<3> data input.

SCK 0O DIG SPI clock output (MSSP module); takes priority over port data.

1I ST SPI clock input (MSSP module).

SCL 0ODIGI

2C™ clock output (MSSP module); takes priority over port data.

1II

2C/SMB I2C clock input (MSSP module); input type depends on module setting.

RC4/SDI/SDA RC4 0O DIG LATC<4> data output.

1I ST PORTC<4> data input.

SDI 1I ST SPI data input (MSSP module).

SDA 1ODIGI

2C data output (MSSP module); takes priority over port data.

1II

2C/SMB I2C data input (MSSP module); input type depends on module setting.

RC5/SDO RC5 0O DIG LATC<5> data output.

1I ST PORTC<5> data input.

SDO 0O DIG SPI data output (MSSP module); takes priority over port data.

RC6/TX/CK RC6 0O DIG LATC<6> data output.

1I ST PORTC<6> data input.

TX 1O DIG Asynchronous serial transmit data output (USART module);

takes priority over port data. User must configure as output.

CK 1O DIG Synchronous serial clock output (USART module); takes priority

over port data.

1I ST Synchronous serial clock input (USART module).

RC7/RX/DT RC7 0O DIG LATC<7> data output.

1I ST PORTC<7> data input.

RX 1I ST Asynchronous serial receive data input (USART module).

DT 1O DIG Synchronous serial data output (USART module); takes priority over

port data.

1I ST Synchronous serial data input (USART module). User must

configure as an input.

Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;

I2C/SMB = I2C/SMBus input buffer; x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).

Note 1: Default assignment for CCP2 when the CCP2MX Configuration bit is set. Alternate assignment is RB3.

2: Enhanced PWM output is available only on PIC18F4410/4415/4510/4515/4610 devices.

PIC18F2X1X/4X1X

TABLE 9-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Reset

Values

on page

PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 52

LATC PORTC Data Latch Register (Read and Write to Data Latch) 52

TRISC PORTC Data Direction Control Register 52

PIC18F2X1X/4X1X

9.4 PORTD, TRISD and LATD

Registers

PORTD is an 8-bit wide, bidirectional port. The corre-

sponding data direction register is TRISD. Setting a

TRISD bit (= 1) will make the corresponding PORTD

pin an input (i.e., put the corresponding output driver in

a high-impedance mode). Clearing a TRISD bit (= 0)

will make the corresponding PORTD pin an output (i.e.,

put the contents of the output latch on the selected pin).

The Data Latch register (LATD) is also memory

mapped. Read-modify-write operations on the LATD

PORTD.

All pins on PORTD are implemented with Schmitt

Trigger input buffers. Each pin is individually

configurable as an input or output.

Three of the PORTD pins are multiplexed with outputs

P1B, P1C and P1D of the enhanced CCP module. The

operation of these additional PWM output pins is

covered in greater detail in Section 15.0 “Enhanced

Capture/Compare/PWM (ECCP) Module”.

PORTD can also be configured as an 8-bit wide micro-

processor port (Parallel Slave Port) by setting control

bit, PSPMODE (TRISE<4>). In this mode, the input

buffers are TTL. See Section 9.6 “Parallel Slave

Port” for additional information on the Parallel Slave

Port (PSP).

EXAMPLE 9-4: INITIALIZING PORTD

Note: PORTD is only available on 40/44-pin

devices.

Note: On a Power-on Reset, these pins are

configured as digital inputs.

Note: When the enhanced PWM mode is used

with either dual or quad outputs, the PSP

functions of PORTD are automatically

disabled.

CLRF PORTD ; Initialize PORTD by

; clearing output

; data latches

CLRF LATD ; Alternate method

; to clear output

; data latches

MOVLW 0CFh ; Value used to

; initialize data

; direction

MOVWF TRISD ; Set RD<3:0> as inputs

; RD<5:4> as outputs

; RD<7:6> as inputs

PIC18F2X1X/4X1X

TABLE 9-7: PORTD I/O SUMMARY

Pin Function TRIS

Setting I/O I/O

Type Description

RD0/PSP0 RD0 0O DIG LATD<0> data output.

1I ST PORTD<0> data input.

PSP0 xO DIG PSP read data output (LATD<0>); takes priority over port data.

xI TTL PSP write data input.

RD1/PSP1 RD1 0O DIG LATD<1> data output.

1I ST PORTD<1> data input.

PSP1 xO DIG PSP read data output (LATD<1>); takes priority over port data.

xI TTL PSP write data input.

RD2/PSP2 RD2 0O DIG LATD<2> data output.

1I ST PORTD<2> data input.

PSP2 xO DIG PSP read data output (LATD<2>); takes priority over port data.

xI TTL PSP write data input.

RD3/PSP3 RD3 0O DIG LATD<3> data output.

1I ST PORTD<3> data input.

PSP3 xO DIG PSP read data output (LATD<3>); takes priority over port data.

xI TTL PSP write data input.

RD4/PSP4 RD4 0O DIG LATD<4> data output.

1I ST PORTD<4> data input.

PSP4 xO DIG PSP read data output (LATD<4>); takes priority over port data.

xI TTL PSP write data input.

RD5/PSP5/P1B RD5 0O DIG LATD<5> data output.

1I ST PORTD<5> data input.

PSP5 xO DIG PSP read data output (LATD<5>); takes priority over port data.

xI TTL PSP write data input.

P1B 0O DIG ECCP1 Enhanced PWM output, channel B; takes priority over port and

PSP data. May be configured for tri-state during Enhanced PWM

shutdown events.

RD6/PSP6/P1C RD6 0O DIG LATD<6> data output.

1I ST PORTD<6> data input.

PSP6 xO DIG PSP read data output (LATD<6>); takes priority over port data.

xI TTL PSP write data input.

P1C 0O DIG ECCP1 Enhanced PWM output, channel C; takes priority over port and

PSP data. May be configured for tri-state during Enhanced PWM

shutdown events.

RD7/PSP7/P1D RD7 0O DIG LATD<7> data output.

1I ST PORTD<7> data input.

PSP7 xO DIG PSP read data output (LATD<7>); takes priority over port data.

xI TTL PSP write data input.

P1D 0O DIG ECCP1 Enhanced PWM output, channel D; takes priority over port and

PSP data. May be configured for tri-state during Enhanced PWM

shutdown events.

Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; x = Don’t care

(TRIS bit does not affect port direction or is overridden for this option).

PIC18F2X1X/4X1X

TABLE 9-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Reset

Values

on page

PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 52

LATD PORTD Data Latch Register (Read and Write to Data Latch) 52

TRISD PORTD Data Direction Control Register 52

TRISE IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 52

CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 51

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTD.

PIC18F2X1X/4X1X

9.5 PORTE, TRISE and LATE

Registers

Depending on the particular PIC18F2X1X/4X1X device

selected, PORTE is implemented in two different ways.

For 40/44-pin devices, PORTE is a 4-bit wide port.

Three pins (RE0/RD/AN5, RE1/WR/AN6 and RE2/CS/

AN7) are individually configurable as inputs or outputs.

These pins have Schmitt Trigger input buffers. When

selected as an analog input, these pins will read as ‘0’s.

The corresponding data direction register is TRISE.

Setting a TRISE bit (= 1) will make the corresponding

PORTE pin an input (i.e., put the corresponding output

driver in a high-impedance mode). Clearing a TRISE bit

(= 0) will make the corresponding PORTE pin an output

(i.e., put the contents of the output latch on the selected

pin).

TRISE controls the direction of the RE pins, even when

they are being used as analog inputs. The user must

make sure to keep the pins configured as inputs when

using them as analog inputs.

The upper four bits of the TRISE register also control

the operation of the Parallel Slave Port. Their operation

is explained in Register 9-1.

The Data Latch register (LATE) is also memory

mapped. Read-modify-write operations on the LATE

PORTE.

The fourth pin of PORTE (MCLR/VPP/RE3) is an input

only pin. Its operation is controlled by the MCLRE Con-

figuration bit. When selected as a port pin (MCLRE = 0),

it functions as a digital input only pin; as such, it does not

have TRIS or LAT bits associated with its operation.

Otherwise, it functions as the device’s Master Clear

input. In either configuration, RE3 also functions as the

programming voltage input during programming.

EXAMPLE 9-5: INITIALIZING PORTE

9.5.1 PORTE IN 28-PIN DEVICES

For 28-pin devices, PORTE is only available when

Master Clear functionality is disabled (MCLRE = 0). In

these cases, PORTE is a single bit, input only port

comprised of RE3 only. The pin operates as previously

described.

Note: On a Power-on Reset, RE2:RE0 are

configured as analog inputs.

Note: On a Power-on Reset, RE3 is enabled as

a digital input only if Master Clear

functionality is disabled.

CLRF PORTE ; Initialize PORTE by

; clearing output

; data latches

CLRF LATE ; Alternate method

; to clear output

; data latches

MOVLW 0Ah ; Configure A/D

MOVWF ADCON1 ; for digital inputs

MOVLW 03h ; Value used to

; initialize data

; direction

MOVWF TRISE ; Set RE<0> as inputs

; RE<1> as outputs

; RE<2> as inputs

PIC18F2X1X/4X1X

R-0 R-0 R/W-0 R/W-0 U-0 R/W-1 R/W-1 R/W-1

IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0

bit 7 bit 0

bit 7 IBF: Input Buffer Full Status bit

1 = A word has been received and waiting to be read by the CPU

0 = No word has been received

bit 6 OBF: Output Buffer Full Status bit

1 = The output buffer still holds a previously written word

0 = The output buffer has been read

bit 5 IBOV: Input Buffer Overflow Detect bit (in Microprocessor mode)

1 = A write occurred when a previously input word has not been read (must be cleared in software)

0 = No overflow occurred

bit 4 PSPMODE: Parallel Slave Port Mode Select bit

1 = Parallel Slave Port mode

0 = General purpose I/O mode

bit 3 Unimplemented: Read as ‘0’

bit 2 TRISE2: RE2 Direction Control bit

1 = Input

0 = Output

bit 1 TRISE1: RE1 Direction Control bit

1 = Input

0 = Output

bit 0 TRISE0: RE0 Direction Control bit

1 = Input

0 = Output

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

TABLE 9-9: PORTE I/O SUMMARY

TABLE 9-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE

Pin Function TRIS

Setting I/O I/O

Type Description

RE0/RD/AN5 RE0 0O DIG LATE<0> data output; not affected by analog input.

1I ST PORTE<0> data input; disabled when analog input enabled.

RD 1I TTL PSP read enable input (PSP enabled).

AN5 1I ANA A/D input channel 5; default input configuration on POR.

RE1/WR/AN6 RE1 0O DIG LATE<1> data output; not affected by analog input.

1I ST PORTE<1> data input; disabled when analog input enabled.

WR 1I TTL PSP write enable input (PSP enabled).

AN6 1I ANA A/D input channel 6; default input configuration on POR.

RE2/CS/AN7 RE2 0O DIG LATE<2> data output; not affected by analog input.

1I ST PORTE<2> data input; disabled when analog input enabled.

CS 1I TTL PSP write enable input (PSP enabled).

AN7 1I ANA A/D input channel 7; default input configuration on POR.

MCLR/VPP/RE3(1) MCLR — I ST External Master Clear input; enabled when MCLRE Configuration bit is

set.

VPP — I ANA High-voltage detection; used for ICSP™ mode entry detection. Always

available, regardless of pin mode.

RE3 —(2) I ST PORTE<3> data input; enabled when MCLRE Configuration bit is

clear.

Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output;

x = Don’t care (TRIS bit does not affect port direction or is overridden for this option).

Note 1: RE3 is available on both 28-pin and 40/44-pin devices. All other PORTE pins are only implemented on 40/44-pin

devices.

2: RE3 does not have a corresponding TRIS bit to control data direction.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Reset

Values

on page

PORTE — — — —RE3

(1,2) RE2 RE1 RE0 52

LATE(2) — — — — — LATE Data Output Register 52

TRISE IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 52

ADCON1 —— VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTE.

Note 1: Implemented only when Master Clear functionality is disabled (MCLRE Configuration bit = 0).

2: RE3 is the only PORTE bit implemented on both 28-pin and 40/44-pin devices. All other bits are

implemented only when PORTE is implemented (i.e., 40/44-pin devices).

PIC18F2X1X/4X1X

9.6 Parallel Slave Port

In addition to its function as a general I/O port, PORTD

can also operate as an 8-bit wide Parallel Slave Port

(PSP) or microprocessor port. PSP operation is con-

trolled by the 4 upper bits of the TRISE register

(Register 9-1). Setting control bit, PSPMODE

(TRISE<4>), enables PSP operation as long as the

enhanced CCP module is not operating in dual output

or quad output PWM mode. In Slave mode, the port is

asynchronously readable and writable by the external

world.

The PSP can directly interface to an 8-bit micro-

processor data bus. The external microprocessor can

read or write the PORTD latch as an 8-bit latch. Setting

the control bit PSPMODE enables the PORTE I/O pins

to become control inputs for the microprocessor port.

When set, port pin RE0 is the RD input, RE1 is the WR

input and RE2 is the CS (Chip Select) input. For this

functionality, the corresponding data direction bits of

the TRISE register (TRISE<2:0>) must be configured

as inputs (set). The A/D port control bits,

PFCG3:PFCG0 (ADCON1<3:0>), must also be set to a

value in the range of ‘1010’ through ‘1111’.

A write to the PSP occurs when both the CS and WR

lines are first detected low and ends when either are

detected high. The PSPIF and IBF flag bits are both set

when the write ends.

A read from the PSP occurs when both the CS and RD

lines are first detected low. The data in PORTD is read

out and the OBF bit is clear. If the user writes new data

to PORTD to set OBF, the data is immediately read out;

however, the OBF bit is not set.

When either the CS or RD lines are detected high, the

PORTD pins return to the input state and the PSPIF bit

is set. User applications should wait for PSPIF to be set

before servicing the PSP; when this happens, the IBF

and OBF bits can be polled and the appropriate action

taken.

The timing for the control signals in Write and Read

modes is shown in Figure 9-3 and Figure 9-4,

respectively.

FIGURE 9-2: PORTD AND PORTE

BLOCK DIAGRAM

(PARALLEL SLAVE PORT)

Note: The Parallel Slave Port is only available on

40/44-pin devices.

Data Bus

WR LATD RDx pin

RD PORTD

One bit of PORTD

Set Interrupt Flag

PSPIF (PIR1<7>)

Read

Chip Select

Write

TTL

WR PORTD

RD LATD

Data Latch

Note: I/O pins have diode protection to VDD and VSS.

PORTE Pins

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 111
PIC18F2X1X/4X1X
FIGURE 9-3: PARALLEL SLAVE PORT WRITE WAVEFORMS         
FIGURE 9-4: PARALLEL SLAVE PORT READ WAVEFORMS         
TABLE 9-11: REGISTERS ASSOCIATED WITH PARALLEL SLAVE PORT     
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 52
LATD PORTD Data Latch Register (Read and Write to Data Latch) 52
TRISD PORTD Data Direction Control Register 52
PORTE — — — — RE3 RE2 RE1 RE0 52
LATE — — — — — LATE Data Output bits 52
TRISE IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 52
INTCON GIE/GIEH PEIE/GIEL TMR0IF INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
ADCON1 —— VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Parallel Slave Port.
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.
Q1 Q2 Q3 Q4
CS
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
WR
RD
IBF
OBF
PSPIF
PORTD<7:0>
Q1 Q2 Q3 Q4
CS
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
WR
IBF
PSPIF
RD
OBF
PORTD<7:0>

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

10.0 TIMER0 MODULE

The Timer0 module incorporates the following features:

• Software selectable operation as a timer or

counter in both 8-Bit or 16-Bit modes

• Readable and writable registers

• Dedicated 8-bit, software programmable

prescaler

• Selectable clock source (internal or external)

• Edge select for external clock

• Interrupt-on-overflow

The T0CON register (Register 10-1) controls all

aspects of the module’s operation, including the

prescale selection. It is both readable and writable.

A simplified block diagram of the Timer0 module in 8-Bit

mode is shown in Figure 10-1. Figure 10-2 shows a

simplified block diagram of the Timer0 module in 16-Bit

mode.

R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0

bit 7 bit 0

bit 7 TMR0ON: Timer0 On/Off Control bit

1 = Enables Timer0

0 = Stops Timer0

bit 6 T08BIT: Timer0 8-bit/16-bit Control bit

1 = Timer0 is configured as an 8-bit timer/counter

0 = Timer0 is configured as a 16-bit timer/counter

bit 5 T0CS: Timer0 Clock Source Select bit

1 = Transition on T0CKI pin

0 = Internal instruction cycle clock (CLKO)

bit 4 T0SE: Timer0 Source Edge Select bit

1 = Increment on high-to-low transition on T0CKI pin

0 = Increment on low-to-high transition on T0CKI pin

bit 3 PSA: Timer0 Prescaler Assignment bit

1 = TImer0 prescaler is NOT assigned. Timer0 clock input bypasses prescaler.

0 = Timer0 prescaler is assigned. Timer0 clock input comes from prescaler output.

bit 2-0 T0PS2:T0PS0: Timer0 Prescaler Select bits

111 = 1:256 Prescale value

110 = 1:128 Prescale value

101 = 1:64 Prescale value

100 = 1:32 Prescale value

011 = 1:16 Prescale value

010 = 1:8 Prescale value

001 = 1:4 Prescale value

000 = 1:2 Prescale value

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

10.1 Timer0 Operation

Timer0 can operate as either a timer or a counter; the

mode is selected with the T0CS bit (T0CON<5>). In

Timer mode (T0CS = 0), the module increments on

every clock by default unless a different prescaler value

is selected (see Section 10.3 “Prescaler”). If the

TMR0 register is written to, the increment is inhibited

for the following two instruction cycles. The user can

work around this by writing an adjusted value to the

TMR0 register.

The Counter mode is selected by setting the T0CS bit

(= 1). In this mode, Timer0 increments either on every

rising or falling edge of pin RA4/T0CKI. The increment-

ing edge is determined by the Timer0 Source Edge

Select bit, T0SE (T0CON<4>); clearing this bit selects

the rising edge. Restrictions on the external clock input

are discussed below.

An external clock source can be used to drive Timer0;

however, it must meet certain requirements to ensure

that the external clock can be synchronized with the

internal phase clock (T

OSC). There is a delay between

synchronization and the onset of incrementing the

timer/counter.

10.2 Timer0 Reads and Writes in

16-Bit Mode

TMR0H is not the actual high byte of Timer0 in 16-Bit

mode; it is actually a buffered version of the real high

byte of Timer0 which is not directly readable nor

writable (refer to Figure 10-2). TMR0H is updated with

the contents of the high byte of Timer0 during a read of

TMR0L. This provides the ability to read all 16 bits of

Timer0 without having to verify that the read of the high

and low byte were valid, due to a rollover between

successive reads of the high and low byte.

Similarly, a write to the high byte of Timer0 must also

take place through the TMR0H Buffer register. The high

byte is updated with the contents of TMR0H when a

write occurs to TMR0L. This allows all 16 bits of Timer0

to be updated at once.

FIGURE 10-1: TIMER0 BLOCK DIAGRAM (8-BIT MODE)

FIGURE 10-2: TIMER0 BLOCK DIAGRAM (16-BIT MODE)

Note: Upon Reset, Timer0 is enabled in 8-Bit mode with clock input from T0CKI max. prescale.

T0CKI pin

T0SE

T0CS

FOSC/4

Programmable

Prescaler

Sync with

Internal

Clocks TMR0L

(2 TCY Delay)

Internal Data Bus

PSA

T0PS2:T0PS0

Set

TMR0IF

on Overflow

Note: Upon Reset, Timer0 is enabled in 8-Bit mode with clock input from T0CKI max. prescale.

T0CKI pin

T0SE

T0CS

FOSC/4

Programmable

Prescaler

Sync with

Internal

Clocks TMR0L

(2 TCY Delay)

Internal Data Bus

PSA

T0PS2:T0PS0

Set

TMR0IF

on Overflow

TMR0

TMR0H

High Byte

Read TMR0L

Write TMR0L

PIC18F2X1X/4X1X

10.3 Prescaler

An 8-bit counter is available as a prescaler for the Timer0

module. The prescaler is not directly readable or writable;

its value is set by the PSA and T0PS2:T0PS0 bits

(T0CON<3:0>), which determine the prescaler

assignment and prescale ratio.

Clearing the PSA bit assigns the prescaler to the

Timer0 module. When it is assigned, prescale values

from 1:2 through 1:256 in power-of-2 increments are

selectable.

When assigned to the Timer0 module, all instructions

writing to the TMR0 register (e.g., CLRF TMR0, MOVWF

TMR0, BSF TMR0, etc.) clear the prescaler count.

10.3.1 SWITCHING PRESCALER

ASSIGNMENT

The prescaler assignment is fully under software

control and can be changed “on-the-fly” during program

execution.

10.4 Timer0 Interrupt

The TMR0 interrupt is generated when the TMR0

FFFFh to 0000h in 16-Bit mode. This overflow sets the

TMR0IF flag bit. The interrupt can be masked by clear-

ing the TMR0IE bit (INTCON<5>). Before re-enabling

the interrupt, the TMR0IF bit must be cleared in software

by the Interrupt Service Routine.

Since Timer0 is shut down in Sleep mode, the TMR0

interrupt cannot awaken the processor from Sleep.

TABLE 10-1: REGISTERS ASSOCIATED WITH TIMER0

Note: Writing to TMR0 when the prescaler is

assigned to Timer0 will clear the prescaler

count but will not change the prescaler

assignment.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Reset

Values

on page

TMR0L Timer0 Register, Low Byte 50

TMR0H Timer0 Register, High Byte 50

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49

T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 50

TRISA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52

Legend: Shaded cells are not used by Timer0.

Note 1: PORTA<7:6> and their direction bits are individually configured as port pins based on various primary

oscillator modes. When disabled, these bits read as ‘0’.

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

11.0 TIMER1 MODULE

The Timer1 timer/counter module incorporates these

features:

• Software selectable operation as a 16-bit timer or

counter

• Readable and writable 8-bit registers (TMR1H

and TMR1L)

• Selectable clock source (internal or external) with

device clock or Timer1 oscillator internal options

• Interrupt-on-overflow

• Reset on CCP special event trigger

• Device clock status flag (T1RUN)

A simplified block diagram of the Timer1 module is

shown in Figure 11-1. A block diagram of the module’s

operation in Read/Write mode is shown in Figure 11-2.

The module incorporates its own low-power oscillator

to provide an additional clocking option. The Timer1

oscillator can also be used as a low-power clock source

for the microcontroller in power-managed operation.

Timer1 can also be used to provide Real-Time Clock

(RTC) functionality to applications with only a minimal

addition of external components and code overhead.

Timer1 is controlled through the T1CON Control

Oscillator Enable bit (T1OSCEN). Timer1 can be

enabled or disabled by setting or clearing control bit,

TMR1ON (T1CON<0>).

R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON

bit 7 bit 0

bit 7 RD16: 16-bit Read/Write Mode Enable bit

1 = Enables register read/write of TImer1 in one 16-bit operation

0 = Enables register read/write of Timer1 in two 8-bit operations

bit 6 T1RUN: Timer1 System Clock Status bit

1 = Device clock is derived from Timer1 oscillator

0 = Device clock is derived from another source

bit 5-4 T1CKPS1:T1CKPS0: Timer1 Input Clock Prescale Select bits

11 = 1:8 Prescale value

10 = 1:4 Prescale value

01 = 1:2 Prescale value

00 = 1:1 Prescale value

bit 3 T1OSCEN: Timer1 Oscillator Enable bit

1 = Timer1 oscillator is enabled

0 = Timer1 oscillator is shut off

The oscillator inverter and feedback resistor are turned off to eliminate power drain.

bit 2 T1SYNC: Timer1 External Clock Input Synchronization Select bit

When TMR1CS = 1:

1 = Do not synchronize external clock input

0 = Synchronize external clock input

When TMR1CS = 0:

This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0.

bit 1 TMR1CS: Timer1 Clock Source Select bit

1 = External clock from pin RC0/T1OSO/T13CKI (on the rising edge)

0 = Internal clock (FOSC/4)

bit 0 TMR1ON: Timer1 On bit

1 = Enables Timer1

0 = Stops Timer1

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

11.1 Timer1 Operation

Timer1 can operate in one of these modes:

•Timer

• Synchronous Counter

• Asynchronous Counter

The operating mode is determined by the clock select

bit, TMR1CS (T1CON<1>). When TMR3CS is cleared

(= 0), Timer1 increments on every internal instruction

cycle (Fosc/4). When the bit is set, Timer1 increments

on every rising edge of the Timer1 external clock input

or the Timer1 oscillator, if enabled.

When Timer1 is enabled, the RC1/T1OSI and RC0/

T1OSO/T13CKI pins become inputs. This means the

values of TRISC<1:0> are ignored and the pins are

read as ‘0’.

FIGURE 11-1: TIMER1 BLOCK DIAGRAM

FIGURE 11-2: TIMER1 BLOCK DIAGRAM (16-BIT READ/WRITE MODE)

T1SYNC

TMR1CS

T1CKPS1:T1CKPS0

Sleep Input

T1OSCEN(1)

FOSC/4

Internal

Clock

On/Off

Prescaler

1, 2, 4, 8

Synchronize

Detect

T1OSO/T13CKI

T1OSI

TMR1ON

TMR1L Set

TMR1IF

on Overflow

TMR1

High Byte

Clear TMR1

(CCP Special Event Trigger)

Timer1 Oscillator

Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.

On/Off

Timer1

Timer1 Clock Input

T1SYNC

TMR1CS

T1CKPS1:T1CKPS0

Sleep Input

T1OSCEN(1)

FOSC/4

Internal

Clock

Prescaler

1, 2, 4, 8

Synchronize

Detect

T1OSO/T13CKI

T1OSI

Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.

TMR1L

Internal Data Bus

Set

TMR1IF

on Overflow

TMR1

TMR1H

High Byte

Read TMR1L

Write TMR1L

TMR1ON

Clear TMR1

(CCP Special Event Trigger)

Timer1 Oscillator

On/Off

Timer1

Timer1 Clock Input

PIC18F2X1X/4X1X

11.2 Timer1 16-Bit Read/Write Mode

Timer1 can be configured for 16-bit reads and writes

(see Figure 11-2). When the RD16 control bit

(T1CON<7>) is set, the address for TMR1H is mapped

to a buffer register for the high byte of Timer1. A read

from TMR1L will load the contents of the high byte of

Timer1 into the Timer1 high byte buffer. This provides

the user with the ability to accurately read all 16 bits of

Timer1 without having to determine whether a read of

the high byte, followed by a read of the low byte, has

become invalid due to a rollover between reads.

A write to the high byte of Timer1 must also take place

through the TMR1H Buffer register. The Timer1 high

byte is updated with the contents of TMR1H when a

write occurs to TMR1L. This allows a user to write all

16 bits to both the high and low bytes of Timer1 at once.

The high byte of Timer1 is not directly readable or

writable in this mode. All reads and writes must take

place through the Timer1 High Byte Buffer register.

Writes to TMR1H do not clear the Timer1 prescaler.

The prescaler is only cleared on writes to TMR1L.

11.3 Timer1 Oscillator

An on-chip crystal oscillator circuit is incorporated

between pins T1OSI (input) and T1OSO (amplifier

output). It is enabled by setting the Timer1 Oscillator

Enable bit, T1OSCEN (T1CON<3>). The oscillator is a

low-power circuit rated for 32 kHz crystals. It will

continue to run during all power-managed modes. The

circuit for a typical LP oscillator is shown in Figure 11-3.

Table 11-1 shows the capacitor selection for the Timer1

oscillator.

The user must provide a software time delay to ensure

proper start-up of the Timer1 oscillator.

FIGURE 11-3: EXTERNAL

COMPONENTS FOR THE

TIMER1 LP OSCILLATOR

TABLE 11-1: CAPACITOR SELECTION FOR

THE TIMER OSCILLATOR

11.3.1 USING TIMER1 AS A

CLOCK SOURCE

The Timer1 oscillator is also available as a clock source

in power-managed modes. By setting the clock select

bits, SCS1:SCS0 (OSCCON<1:0>), to ‘01’, the device

switches to SEC_RUN mode; both the CPU and

peripherals are clocked from the Timer1 oscillator. If the

IDLEN bit (OSCCON<7>) is cleared and a SLEEP

instruction is executed, the device enter SEC_IDLE

mode. Additional details are available in Section 3.0

“Power-Managed Modes”.

Whenever the Timer1 oscillator is providing the clock

source, the Timer1 system clock status flag, T1RUN

(T1CON<6>), is set. This can be used to determine the

controller’s current clocking mode. It can also indicate

the clock source being currently used by the Fail-Safe

Clock Monitor. If the Clock Monitor is enabled and the

Timer1 oscillator fails while providing the clock, polling

the T1RUN bit will indicate whether the clock is being

provided by the Timer1 oscillator or another source.

11.3.2 LOW-POWER TIMER1 OPTION

The Timer1 oscillator can operate at two distinct levels

of power consumption based on device configuration.

When the LPT1OSC Configuration bit is set, the Timer1

oscillator operates in a low-power mode. When

LPT1OSC is not set, Timer1 operates at a higher power

level. Power consumption for a particular mode is rela-

tively constant, regardless of the device’s operating

mode. The default Timer1 configuration is the higher

power mode.

As the low-power Timer1 mode tends to be more sen-

sitive to interference, high noise environments may

cause some oscillator instability. The low-power option

is, therefore, best suited for low noise applications

where power conservation is an important design

consideration.

Note: See the Notes with Table 11-1 for additional

information about capacitor selection.

XTAL

PIC18FXXXX

T1OSI

T1OSO

32.768 kHz

27 pF

Osc Type Freq C1 C2

LP 32 kHz 27 pF(1) 27 pF(1)

Note 1: Microchip suggests these values as a

starting point in validating the oscillator

circuit.

2: Higher capacitance increases the stability

of the oscillator but also increases the

start-up time.

3: Since each resonator/crystal has its own

characteristics, the user should consult

the resonator/crystal manufacturer for

appropriate values of external

components.

4: Capacitor values are for design guidance

only.

PIC18F2X1X/4X1X

11.3.3 TIMER1 OSCILLATOR LAYOUT

CONSIDERATIONS

The Timer1 oscillator circuit draws very little power

during operation. Due to the low-power nature of the

oscillator, it may also be sensitive to rapidly changing

signals in close proximity.

The oscillator circuit, shown in Figure 11-3, should be

located as close as possible to the microcontroller.

There should be no circuits passing within the oscillator

circuit boundaries other than VSS or VDD.

If a high-speed circuit must be located near the oscilla-

tor (such as the CCP1 pin in Output Compare or PWM

mode, or the primary oscillator using the OSC2 pin), a

grounded guard ring around the oscillator circuit, as

shown in Figure 11-4, may be helpful when used on a

single-sided PCB or in addition to a ground plane.

FIGURE 11-4: OSCILLATOR CIRCUIT

WITH GROUNDED

GUARD RING

11.4 Timer1 Interrupt

The TMR1 register pair (TMR1H:TMR1L) increments

from 0000h to FFFFh and rolls over to 0000h. The

Timer1 interrupt, if enabled, is generated on overflow,

which is latched in interrupt flag bit, TMR1IF

(PIR1<0>). This interrupt can be enabled or disabled

by setting or clearing the Timer1 Interrupt Enable bit,

TMR1IE (PIE1<0>).

11.5 Resetting Timer1 Using the CCP

Special Event Trigger

If either of the CCP modules is configured to use Timer1

and generate a Special Event Trigger in Compare mode

(CCP1M3:CCP1M0 or CCP2M3:CCP2M0 = 1011), this

signal will reset Timer1. The trigger from CCP2 will also

start an A/D conversion if the A/D module is enabled

(see Section 14.3.4 “Special Event Trigger” for more

information).

The module must be configured as either a timer or a

synchronous counter to take advantage of this feature.

When used this way, the CCPRH:CCPRL register pair

effectively becomes a period register for Timer1.

If Timer1 is running in Asynchronous Counter mode,

this Reset operation may not work.

In the event that a write to Timer1 coincides with a

special event trigger, the write operation will take

precedence.

11.6 Using Timer1 as a Real-Time Clock

Adding an external LP oscillator to Timer1 (such as the

one described in Section 11.3 “Timer1 Oscillator”

above) gives users the option to include RTC function-

ality to their applications. This is accomplished with an

inexpensive watch crystal to provide an accurate time

base and several lines of application code to calculate

the time. When operating in Sleep mode and using a

battery or supercapacitor as a power source, it can

completely eliminate the need for a separate RTC

device and battery backup.

The application code routine, RTCisr, shown in

Example 11-1, demonstrates a simple method to

increment a counter at one-second intervals using an

Interrupt Service Routine. Incrementing the TMR1

the routine, which increments the seconds counter by

one; additional counters for minutes and hours are

incremented as the previous counter overflow.

Since the register pair is 16 bits wide, counting up to

overflow the register directly from a 32.768 kHz clock

would take 2 seconds. To force the overflow at the

required one-second intervals, it is necessary to

preload it. The simplest method is to set the MSb of

TMR1H with a BSF instruction. Note that the TMR1L

introduce cumulative errors over many cycles.

For this method to be accurate, Timer1 must operate in

Asynchronous mode and the Timer1 overflow interrupt

must be enabled (PIE1<0> = 1), as shown in the

routine, RTCinit. The Timer1 oscillator must also be

enabled and running at all times.

VDD

OSC1

VSS

OSC2

RC0

RC1

RC2

Note: Not drawn to scale.

Note: The special event triggers from the CCP2

module will not set the TMR1IF interrupt

flag bit (PIR1<0>).

PIC18F2X1X/4X1X

EXAMPLE 11-1: IMPLEMENTING A REAL-TIME CLOCK USING A TIMER1 INTERRUPT SERVICE

TABLE 11-2: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER

RTCinit

MOVLW 80h ; Preload TMR1 register pair

MOVWF TMR1H ; for 1 second overflow

CLRF TMR1L

MOVLW b’00001111’ ; Configure for external clock,

MOVWF T1CON ; Asynchronous operation, external oscillator

CLRF secs ; Initialize timekeeping registers

CLRF mins ;

MOVLW .12

MOVWF hours

BSF PIE1, TMR1IE ; Enable Timer1 interrupt

RETURN

RTCisr

BSF TMR1H, 7 ; Preload for 1 sec overflow

BCF PIR1, TMR1IF ; Clear interrupt flag

INCF secs, F ; Increment seconds

MOVLW .59 ; 60 seconds elapsed?

CPFSGT secs

RETURN ; No, done

CLRF secs ; Clear seconds

INCF mins, F ; Increment minutes

MOVLW .59 ; 60 minutes elapsed?

CPFSGT mins

RETURN ; No, done

CLRF mins ; clear minutes

INCF hours, F ; Increment hours

MOVLW .23 ; 24 hours elapsed?

CPFSGT hours

RETURN ; No, done

CLRF hours ; Reset hours

RETURN ; Done

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Reset

Values

on page

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49

PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52

PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52

IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52

TMR1L Timer1 Register, Low Byte 50

TMR1H Timer1 Register, High Byte 50

T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50

Legend: Shaded cells are not used by the Timer1 module.

Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

12.0 TIMER2 MODULE

The Timer2 module timer incorporates the following

features:

• 8-bit timer and period registers (TMR2 and PR2,

respectively)

• Readable and writable (both registers)

• Software programmable prescaler (1:1, 1:4 and

1:16)

• Software programmable postscaler (1:1 through

1:16)

• Interrupt on TMR2-to-PR2 match

• Optional use as the shift clock for the MSSP

module

The module is controlled through the T2CON register

(Register 12-1), which enables or disables the timer

and configures the prescaler and postscaler. Timer2

can be shut off by clearing control bit, TMR2ON

(T2CON<2>), to minimize power consumption.

A simplified block diagram of the module is shown in

Figure 12-1.

12.1 Timer2 Operation

In normal operation, TMR2 is incremented from 00h on

each clock (FOSC/4). A 4-bit counter/prescaler on the

clock input gives direct input, divide-by-4 and divide-by-

16 prescale options; these are selected by the prescaler

control bits, T2CKPS1:T2CKPS0 (T2CON<1:0>). The

value of TMR2 is compared to that of the period register,

PR2, on each clock cycle. When the two values match,

the comparator generates a match signal as the timer

output. This signal also resets the value of TMR2 to 00h

on the next cycle and drives the output counter/

postscaler (see Section 12.2 “Timer2 Interrupt”).

The TMR2 and PR2 registers are both directly readable

and writable. The TMR2 register is cleared on any

device Reset, while the PR2 register initializes at FFh.

Both the prescaler and postscaler counters are cleared

on the following events:

• a write to the TMR2 register

• a write to the T2CON register

• any device Reset (Power-on Reset, MCLR Reset,

Watchdog Timer Reset or Brown-out Reset)

TMR2 is not cleared when T2CON is written.

U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0

bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6-3 T2OUTPS3:T2OUTPS0: Timer2 Output Postscale Select bits

0000 = 1:1 Postscale

0001 = 1:2 Postscale

•

1111 = 1:16 Postscale

bit 2 TMR2ON: Timer2 On bit

1 = Timer2 is on

0 = Timer2 is off

bit 1-0 T2CKPS1:T2CKPS0: Timer2 Clock Prescale Select bits

00 = Prescaler is 1

01 = Prescaler is 4

1x = Prescaler is 16

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X
DS39636C-page 124 Preliminary © 2007 Microchip Technology Inc.
12.2 Timer2 Interrupt
Timer2 also can generate an optional device interrupt.
The Timer2 output signal (TMR2-to-PR2 match)
provides the input for the 4-bit output counter/
postscaler. This counter generates the TMR2 match
interrupt flag which is latched in TMR2IF (PIR1<1>).
The interrupt is enabled by setting the TMR2 Match
Interrupt Enable bit, TMR2IE (PIE1<1>).
A range of 16 postscale options (from 1:1 through 1:16
inclusive) can be selected with the postscaler control
bits, T2OUTPS3:T2OUTPS0 (T2CON<6:3>).
12.3 Timer2 Output
The unscaled output of TMR2 is available primarily to
the CCP modules, where it is used as a time base for
operations in PWM mode. 
Timer2 can be optionally used as the shift clock source
for the MSSP module operating in SPI mode. Addi-
tional information is provided in Section 16.0 “Master
Synchronous Serial Port (MSSP) Module”.
FIGURE 12-1: TIMER2 BLOCK DIAGRAM       
TABLE 12-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER      
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
TMR2 Timer2 Register 50
T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 50
PR2 Timer2 Period Register 50
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer2 module.
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.
Comparator
TMR2 Output
TMR2
Postscaler
Prescaler PR2
2
FOSC/4
1:1 to 1:16
1:1, 1:4, 1:16
4
T2OUTPS3:T2OUTPS0
T2CKPS1:T2CKPS0
Set TMR2IF
Internal Data Bus
8
Reset
TMR2/PR2
8
8
(to PWM or MSSP) 
Match

PIC18F2X1X/4X1X

13.0 TIMER3 MODULE

The Timer3 module timer/counter incorporates these

features:

• Software selectable operation as a 16-bit timer or

counter

• Readable and writable 8-bit registers (TMR3H

and TMR3L)

• Selectable clock source (internal or external) with

device clock or Timer1 oscillator internal options

• Interrupt-on-overflow

• Module Reset on CCP special event trigger

A simplified block diagram of the Timer3 module is

shown in Figure 13-1. A block diagram of the module’s

operation in Read/Write mode is shown in Figure 13-2.

The Timer3 module is controlled through the T3CON

options for the CCP modules (see Section 14.1.1

“CCP Modules and Timer Resources” for more

information).

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON

bit 7 bit 0

bit 7 RD16: 16-bit Read/Write Mode Enable bit

1 = Enables register read/write of Timer3 in one 16-bit operation

0 = Enables register read/write of Timer3 in two 8-bit operations

bit 6,3 T3CCP2:T3CCP1: Timer3 and Timer1 to CCPx Enable bits

1x = Timer3 is the capture/compare clock source for the CCP modules

01 = Timer3 is the capture/compare clock source for CCP2;

Timer1 is the capture/compare clock source for CCP1

00 = Timer1 is the capture/compare clock source for the CCP modules

bit 5-4 T3CKPS1:T3CKPS0: Timer3 Input Clock Prescale Select bits

11 = 1:8 Prescale value

10 = 1:4 Prescale value

01 = 1:2 Prescale value

00 = 1:1 Prescale value

bit 2 T3SYNC: Timer3 External Clock Input Synchronization Control bit

(Not usable if the device clock comes from Timer1/Timer3.)

When TMR3CS = 1:

1 = Do not synchronize external clock input

0 = Synchronize external clock input

When TMR3CS = 0:

This bit is ignored. Timer3 uses the internal clock when TMR3CS = 0.

bit 1 TMR3CS: Timer3 Clock Source Select bit

1 = External clock input from Timer1 oscillator or T13CKI (on the rising edge after the first

falling edge)

0 = Internal clock (FOSC/4)

bit 0 TMR3ON: Timer3 On bit

1 = Enables Timer3

0 = Stops Timer3

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

13.1 Timer3 Operation

Timer3 can operate in one of three modes:

•Timer

• Synchronous Counter

• Asynchronous Counter

The operating mode is determined by the clock select

bit, TMR3CS (T3CON<1>). When TMR3CS is cleared

(= 0), Timer3 increments on every internal instruction

cycle (FOSC/4). When the bit is set, Timer3 increments

on every rising edge of the Timer1 external clock input

or the Timer1 oscillator, if enabled.

As with Timer1, the RC1/T1OSI and RC0/T1OSO/

T13CKI pins become inputs when the Timer1 oscillator

is enabled. This means the values of TRISC<1:0> are

ignored and the pins are read as ‘0’.

FIGURE 13-1: TIMER3 BLOCK DIAGRAM

FIGURE 13-2: TIMER3 BLOCK DIAGRAM (16-BIT READ/WRITE MODE)

T3SYNC

TMR3CS

T3CKPS1:T3CKPS0

Sleep Input

T1OSCEN(1)

FOSC/4

Internal

Clock

Prescaler

1, 2, 4, 8

Synchronize

Detect

T1OSO/T13CKI

T1OSI

TMR3ON

TMR3L Set

TMR3IF

on Overflow

TMR3

High Byte

Timer1 Oscillator

Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.

On/Off

Timer3

CCP1/CCP2 Special Event Trigger

CCP1/CCP2 Select from T3CON<6,3>

Clear TMR3

Timer1 Clock Input

T3SYNC

TMR3CS

T3CKPS1:T3CKPS0

Sleep Input

T1OSCEN(1)

FOSC/4

Internal

Clock

Prescaler

1, 2, 4, 8

Synchronize

Detect

T13CKI/T1OSO

T1OSI

Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain.

TMR3L

Internal Data Bus

Set

TMR3IF

on Overflow

TMR3

TMR3H

High Byte

Read TMR1L

Write TMR1L

TMR3ON

CCP1/CCP2 Special Event Trigger

Timer1 Oscillator

On/Off

Timer3

Timer1 Clock Input

CCP1/CCP2 Select from T3CON<6,3>

Clear TMR3

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 127
PIC18F2X1X/4X1X
13.2 Timer3 16-Bit Read/Write Mode
Timer3 can be configured for 16-bit reads and writes
(see Figure 13-2). When the RD16 control bit
(T3CON<7>) is set, the address for TMR3H is mapped
to a buffer register for the high byte of Timer3. A read
from TMR3L will load the contents of the high byte of
Timer3 into the Timer3 High Byte Buffer register. This
provides the user with the ability to accurately read all
16 bits of Timer1 without having to determine whether
a read of the high byte, followed by a read of the low
byte, has become invalid due to a rollover between
reads.
A write to the high byte of Timer3 must also take place
through the TMR3H Buffer register. The Timer3 high
byte is updated with the contents of TMR3H when a
write occurs to TMR3L. This allows a user to write all
16 bits to both the high and low bytes of Timer3 at once.
The high byte of Timer3 is not directly readable or
writable in this mode. All reads and writes must take
place through the Timer3 High Byte Buffer register. 
Writes to TMR3H do not clear the Timer3 prescaler.
The prescaler is only cleared on writes to TMR3L.
13.3 Using the Timer1 Oscillator as the 
Timer3 Clock Source
The Timer1 internal oscillator may be used as the clock
source for Timer3. The Timer1 oscillator is enabled by
setting the T1OSCEN (T1CON<3>) bit. To use it as the
Timer3 clock source, the TMR3CS bit must also be set.
As previously noted, this also configures Timer3 to
increment on every rising edge of the oscillator source.
The Timer1 oscillator is described in Section 11.0
“Timer1 Module”.
13.4 Timer3 Interrupt
The TMR3 register pair (TMR3H:TMR3L) increments
from 0000h to FFFFh and overflows to 0000h. The
Timer3 interrupt, if enabled, is generated on overflow
and is latched in interrupt flag bit, TMR3IF (PIR2<1>).
This interrupt can be enabled or disabled by setting or
clearing the Timer3 Interrupt Enable bit, TMR3IE
(PIE2<1>).
13.5 Resetting Timer3 Using the CCP 
Special Event Trigger
If either of the CCP modules is configured to use Timer3
and to generate a special event trigger in Compare mode
(CCP1M3:CCP1M0 or CCP2M3:CCP2M0 = 1011), this
signal will reset Timer3. It will also start an A/D conversion
if the A/D module is enabled (see Section 14.3.4
“Special Event Trigger” for more information). 
The module must be configured as either a timer or
synchronous counter to take advantage of this feature.
When used this way, the CCPR2H:CCPR2L register
pair effectively becomes a period register for Timer3.
If Timer3 is running in Asynchronous Counter mode,
the Reset operation may not work. 
In the event that a write to Timer3 coincides with a
special event trigger from a CCP module, the write will
take precedence. 
TABLE 13-1: REGISTERS ASSOCIATED WITH TIMER3 AS A TIMER/COUNTER        
Note: The special event triggers from the CCP2
module will not set the TMR3IF interrupt
flag bit (PIR1<0>). 
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR2 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF 52
PIE2 OSCFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE 52
IPR2 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP 52
TMR3L Timer3 Register, Low Byte 51
TMR3H Timer3 Register, High Byte 51
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50
T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 51
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer3 module.

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

14.0 CAPTURE/COMPARE/PWM

(CCP) MODULES

PIC18F2X1X/4X1X devices all have two CCP

(Capture/Compare/PWM) modules. Each module con-

tains a 16-bit register which can operate as a 16-bit

Capture register, a 16-bit Compare register or a PWM

Master/Slave Duty Cycle register.

In 28-pin devices, the two standard CCP modules

(CCP1 and CCP2) operate as described in this chapter.

In 40/44-pin devices, CCP1 is implemented as an

Enhanced CCP module with standard Capture and

Compare modes and Enhanced PWM modes. The

ECCP implementation is discussed in Section 15.0

“Enhanced Capture/Compare/PWM (ECCP)

Module”.

The Capture and Compare operations described in this

chapter apply to all standard and Enhanced CCP

modules.

Note: Throughout this section and Section 15.0

“Enhanced Capture/Compare/PWM (ECCP)

Module”, references to the register and bit

names for CCP modules are referred to gener-

ically by the use of ‘x’ or ‘y’ in place of the

specific module number. Thus, “CCPxCON”

might refer to the control register for CCP1,

CCP2 or ECCP1. “CCPxCON” is used

throughout these sections to refer to the

module control register, regardless of whether

the CCP module is a standard or Enhanced

implementation.

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— DCxB1 DCxB0 CCPxM3 CCPxM2 CCPxM1 CCPxM0

bit 7 bit 0

bit 7-6 Unimplemented: Read as ‘0’

bit 5-4 DCxB1:DCxB0: PWM Duty Cycle bit 1 and bit 0 for CCP Module x

Capture mode:

Unused.

Compare mode:

Unused.

PWM mode:

These bits are the two LSbs (bit 1 and bit 0) of the 10-bit PWM duty cycle. The eight MSbs

(DCx9:DCx2) of the duty cycle are found in CCPRxL.

bit 3-0 CCPxM3:CCPxM0: CCP Module x Mode Select bits

0000 = Capture/Compare/PWM disabled (resets CCP module)

0001 = Reserved

0010 = Compare mode, toggle output on match (CCPIF bit is set)

0011 = Reserved

0100 = Capture mode, every falling edge

0101 = Capture mode, every rising edge

0110 = Capture mode, every 4th rising edge

0111 = Capture mode, every 16th rising edge

1000 = Compare mode: initialize CCP pin low; on compare match, force CCP pin high

(CCPIF bit is set)

1001 = Compare mode: initialize CCP pin high; on compare match, force CCP pin low

(CCPIF bit is set)

1010 = Compare mode: generate software interrupt on compare match (CCPIF bit is set,

CCP pin reflects I/O state)

1011 = Compare mode: trigger special event, reset timer, start A/D conversion on

CCP2 match (CCPxIF bit is set)

11xx =PWM mode

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

14.1 CCP Module Configuration

Each Capture/Compare/PWM module is associated

with a control register (generically, CCPxCON) and a

data register (CCPRx). The data register, in turn, is

comprised of two 8-bit registers: CCPRxL (low byte)

and CCPRxH (high byte). All registers are both

readable and writable.

14.1.1 CCP MODULES AND TIMER

RESOURCES

The CCP modules utilize Timers 1, 2 or 3, depending

on the mode selected. Timer1 and Timer3 are available

to modules in Capture or Compare modes, while

Timer2 is available for modules in PWM mode.

TABLE 14-1: CCP MODE – TIMER

RESOURCE

The assignment of a particular timer to a module is

determined by the Timer-to-CCP enable bits in the

T3CON register (Register 13-1). Both modules may be

active at any given time and may share the same timer

resource if they are configured to operate in the same

mode (Capture/Compare or PWM) at the same time. The

interactions between the two modules are summarized in

Figure 14-1 and Figure 14-2. In Timer1 in Asynchronous

Counter mode, the capture operation will not work.

14.1.2 CCP2 PIN ASSIGNMENT

The pin assignment for CCP2 (Capture input, Compare

and PWM output) can change, based on device config-

uration. The CCP2MX Configuration bit determines

which pin CCP2 is multiplexed to. By default, it is

assigned to RC1 (CCP2MX = 1). If the Configuration bit

is cleared, CCP2 is multiplexed with RB3.

Changing the pin assignment of CCP2 does not auto-

matically change any requirements for configuring the

port pin. Users must always verify that the appropriate

TRIS register is configured correctly for CCP2

operation, regardless of where it is located.

TABLE 14-2: INTERACTIONS BETWEEN CCP1 AND CCP2 FOR TIMER RESOURCES

CCP/ECCP Mode Timer Resource

Capture

Compare

PWM

Timer1 or Timer3

Timer2

CCP1 Mode CCP2 Mode Interaction

Capture Capture Each module can use TMR1 or TMR3 as the time base. The time base can be different

for each CCP.

Capture Compare CCP2 can be configured for the special event trigger to reset TMR1 or TMR3

(depending upon which time base is used). Automatic A/D conversions on trigger event

can also be done. Operation of CCP1 could be affected if it is using the same timer as a

time base.

Compare Capture CCP1 can be configured for the special event trigger to reset TMR1 or TMR3 (depending

upon which time base is used). Operation of CCP2 could be affected if it is using the

same timer as a time base.

Compare Compare Either module can be configured for the Special Event Trigger to reset the time base.

Automatic A/D conversions on CCP2 trigger event can be done. Conflicts may occur if

both modules are using the same time base.

Capture PWM(1) None

Compare PWM(1) None

PWM(1) Capture None

PWM(1) Compare None

PWM(1) PWM Both PWMs will have the same frequency and update rate (TMR2 interrupt).

Note 1: Includes standard and Enhanced PWM operation.

PIC18F2X1X/4X1X

14.2 Capture Mode

In Capture mode, the CCPRxH:CCPRxL register pair

captures the 16-bit value of the TMR1 or TMR3

registers when an event occurs on the corresponding

CCPx pin. An event is defined as one of the following:

• every falling edge

• every rising edge

• every 4th rising edge

• every 16th rising edge

The event is selected by the mode select bits,

CCPxM3:CCPxM0 (CCPxCON<3:0>). When a capture

is made, the interrupt request flag bit, CCPxIF, is set; it

must be cleared in software. If another capture occurs

before the value in register CCPRx is read, the old

captured value is overwritten by the new captured value.

14.2.1 CCP PIN CONFIGURATION

In Capture mode, the appropriate CCPx pin should be

configured as an input by setting the corresponding

TRIS direction bit.

14.2.2 TIMER1/TIMER3 MODE SELECTION

The timers that are to be used with the capture feature

(Timer1 and/or Timer3) must be running in Timer mode or

Synchronized Counter mode. In Asynchronous Counter

mode, the capture operation will not work. The timer to be

used with each CCP module is selected in the T3CON

Resources”).

14.2.3 SOFTWARE INTERRUPT

When the Capture mode is changed, a false capture

interrupt may be generated. The user should keep the

CCPxIE interrupt enable bit clear to avoid false inter-

rupts. The interrupt flag bit, CCPxIF, should also be

cleared following any such change in operating mode.

14.2.4 CCP PRESCALER

There are four prescaler settings in Capture mode; they

are specified as part of the operating mode selected by

the mode select bits (CCPxM3:CCPxM0). Whenever

the CCP module is turned off or Capture mode is dis-

abled, the prescaler counter is cleared. This means

that any Reset will clear the prescaler counter.

Switching from one capture prescaler to another may

generate an interrupt. Also, the prescaler counter will

not be cleared; therefore, the first capture may be from

a non-zero prescaler. Example 14-1 shows the

recommended method for switching between capture

prescalers. This example also clears the prescaler

counter and will not generate the “false” interrupt.

EXAMPLE 14-1: CHANGING BETWEEN

CAPTURE PRESCALERS

(CCP2 SHOWN)

FIGURE 14-1: CAPTURE MODE OPERATION BLOCK DIAGRAM

Note: If RB3/CCP2 or RC1/CCP2 is configured

as an output, a write to the port can cause

a capture condition.

CLRF CCP2CON ; Turn CCP module off

MOVLW NEW_CAPT_PS ; Load WREG with the

; new prescaler mode

; value and CCP ON

MOVWF CCP2CON ; Load CCP2CON with

; this value

CCPR1H CCPR1L

TMR1H TMR1L

Set CCP1IF

TMR3

Enable

Q1:Q4

CCP1CON<3:0>

CCP1 pin

Prescaler

÷ 1, 4, 16

and

Edge Detect

TMR1

Enable

T3CCP2

CCPR2H CCPR2L

TMR1H TMR1L

Set CCP2IF

TMR3

Enable

CCP2CON<3:0>

CCP2 pin

Prescaler

÷ 1, 4, 16

TMR3H TMR3L

TMR1

Enable

T3CCP2

T3CCP1

T3CCP2

T3CCP1

TMR3H TMR3L

and

Edge Detect

PIC18F2X1X/4X1X

14.3 Compare Mode

In Compare mode, the 16-bit CCPRx register value is

constantly compared against either the TMR1 or TMR3

can be:

• driven high

• driven low

• toggled (high-to-low or low-to-high)

• remain unchanged (that is, reflects the state of the

I/O latch)

The action on the pin is based on the value of the mode

select bits (CCPxM3:CCPxM0). At the same time, the

interrupt flag bit CCPxIF is set.

14.3.1 CCP PIN CONFIGURATION

The user must configure the CCPx pin as an output by

clearing the appropriate TRIS bit.

14.3.2 TIMER1/TIMER3 MODE SELECTION

Timer1 and/or Timer3 must be running in Timer mode

or Synchronized Counter mode if the CCP module is

using the compare feature. In Asynchronous Counter

mode, the compare operation may not work.

14.3.3 SOFTWARE INTERRUPT MODE

When the Generate Software Interrupt mode is chosen

(CCPxM3:CCPxM0 = 1010), the corresponding CCPx

pin is not affected. Only a CCP interrupt is generated,

if enabled and the CCPxIE bit is set.

14.3.4 SPECIAL EVENT TRIGGER

Both CCP modules are equipped with a special event

trigger. This is an internal hardware signal generated

in Compare mode to trigger actions by other modules.

The special event trigger is enabled by selecting the

Compare Special Event Trigger mode

(CCPxM3:CCPxM0 = 1011).

For either CCP module, the special event trigger resets

the timer register pair for whichever timer resource is

currently assigned as the module’s time base. This

allows the CCPRx registers to serve as a programma-

ble period register for either timer.

The special event trigger for CCP2 can also start an A/D

conversion. In order to do this, the A/D converter must

already be enabled.

FIGURE 14-2: COMPARE MODE OPERATION BLOCK DIAGRAM

Note: Clearing the CCP2CON register will force

the RB3 or RC1 compare output latch

(depending on device configuration) to the

default low level. This is not the PORTB or

PORTC I/O data latch.

CCPR1H CCPR1L

TMR1H TMR1L

Comparator Q

Output

Logic

Special Event Trigger

Set CCP1IF

CCP1 pin

TRIS

CCP1CON<3:0>

Output Enable

TMR3H TMR3L

CCPR2H CCPR2L

Comparator

T3CCP2

T3CCP1

Set CCP2IF

Compare

(Timer1/Timer3 Reset)

Output

Logic

Special Event Trigger

CCP2 pin

TRIS

CCP2CON<3:0>

Output Enable

(Timer1/Timer3 Reset, A/D Trigger)

Match

Compare

Match

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 133
PIC18F2X1X/4X1X
TABLE 14-3: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE, TIMER1 AND TIMER3    
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
RCON IPEN SBOREN(2) —RI TO PD POR BOR 48
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
PIR2 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF 52
PIE2 OSCFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE 52
IPR2 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP 52
TRISB PORTB Data Direction Control Register 52
TRISC PORTC Data Direction Control Register 52
TMR1L Timer1 Register Low Byte 50
TMR1H Timer1 Register High Byte 50
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50
TMR3H Timer3 Register High Byte 51
TMR3L Timer3 Register Low Byte 51
T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 51
CCPR1L Capture/Compare/PWM Register 1 Low Byte 51
CCPR1H Capture/Compare/PWM Register 1 High Byte 51
CCP1CON P1M1(1) P1M0(1) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 51
CCPR2L Capture/Compare/PWM Register 2 Low Byte 51
CCPR2H Capture/Compare/PWM Register 2 High Byte 51
CCP2CON — — DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 51
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by Capture/Compare, Timer1 or Timer3.
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.
2: The SBOREN bit is only available when the BOREN1:BOREN0 Configuration bits = 01; otherwise, it is 
disabled and reads as ‘0’. See Section 4.4 “Brown-out Reset (BOR)”.

PIC18F2X1X/4X1X

14.4 PWM Mode

In Pulse-Width Modulation (PWM) mode, the CCPx pin

produces up to a 10-bit resolution PWM output. Since

the CCP2 pin is multiplexed with a PORTB or PORTC

data latch, the appropriate TRIS bit must be cleared to

make the CCP2 pin an output.

Figure 14-3 shows a simplified block diagram of the

CCP module in PWM mode.

For a step-by-step procedure on how to set up the CCP

module for PWM operation, see Section 14.4.4

“Setup for PWM Operation”.

FIGURE 14-3: SIMPLIFIED PWM BLOCK

DIAGRAM

A PWM output (Figure 14-4) has a time base (period)

and a time that the output stays high (duty cycle).

The frequency of the PWM is the inverse of the

period (1/period).

FIGURE 14-4: PWM OUTPUT

14.4.1 PWM PERIOD

The PWM period is specified by writing to the PR2

following formula:

EQUATION 14-1:

PWM frequency is defined as 1/[PWM period].

When TMR2 is equal to PR2, the following three events

occur on the next increment cycle:

•TMR2 is cleared

• The CCPx pin is set (exception: if PWM duty

cycle = 0%, the CCPx pin will not be set)

• The PWM duty cycle is latched from CCPRxL into

CCPRxH

14.4.2 PWM DUTY CYCLE

The PWM duty cycle is specified by writing to the

CCPRxL register and to the CCPxCON<5:4> bits. Up

to 10-bit resolution is available. The CCPRxL contains

the eight MSbs and the CCPxCON<5:4> contains the

two LSbs. This 10-bit value is represented by

CCPRxL:CCPxCON<5:4>. The following equation is

used to calculate the PWM duty cycle in time:

EQUATION 14-2:

CCPRxL and CCPxCON<5:4> can be written to at any

time but the duty cycle value is not latched into

CCPR2H until after a match between PR2 and TMR2

occurs (i.e., the period is complete). In PWM mode,

CCPRxH is a read-only register.

Note: Clearing the CCP2CON register will force

the RB3 or RC1 output latch (depending

on device configuration) to the default

low level. This is not the PORTB or

PORTC I/O data latch.

CCPRxL

CCPRxH (Slave)

Comparator

TMR2

Comparator

PR2

(Note 1)

Duty Cycle Registers CCPxCON<5:4>

Clear Timer,

CCP1 pin and

latch D.C.

Note 1: The 8-bit TMR2 value is concatenated with 2-bit

internal Q clock, or 2 bits of the prescaler, to create the

10-bit time base.

CCPx Output

Corresponding

TRIS bit

Period

Duty Cycle

TMR2 = PR2

TMR2 = Duty Cycle

TMR2 = PR2

Note: The Timer2 postscalers (see Section 12.0

“Timer2 Module”) are not used in the

determination of the PWM frequency. The

postscaler could be used to have a servo

update rate at a different frequency than

the PWM output.

PWM Period = [(PR2) + 1] • 4 • TOSC •

(TMR2 Prescale Value)

PWM Duty Cycle = (CCPRXL:CCPXCON<5:4>) •

TOSC • (TMR2 Prescale Value)

PIC18F2X1X/4X1X

The CCPRxH register and a 2-bit internal latch are

used to double-buffer the PWM duty cycle. This

double-buffering is essential for glitchless PWM

operation.

When the CCPRxH and 2-bit latch match TMR2,

concatenated with an internal 2-bit Q clock or 2 bits of

the TMR2 prescaler, the CCPx pin is cleared.

The maximum PWM resolution (bits) for a given PWM

frequency is given by the equation:

EQUATION 14-3:

TABLE 14-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz

14.4.3 PWM AUTO-SHUTDOWN

(CCP1 ONLY)

The PWM auto-shutdown features of the Enhanced

CCP module are also available to CCP1 in 28-pin

devices. The operation of this feature is

discussed in detail in Section 15.4.7 “Enhanced

PWM Auto-Shutdown”.

Auto-shutdown features are not available for CCP2.

14.4.4 SETUP FOR PWM OPERATION

The following steps should be taken when configuring

the CCP module for PWM operation:

1. Set the PWM period by writing to the PR2

2. Set the PWM duty cycle by writing to the

CCPRxL register and CCPxCON<5:4> bits.

3. Make the CCPx pin an output by clearing the

appropriate TRIS bit.

4. Set the TMR2 prescale value, then enable

Timer2 by writing to T2CON.

5. Configure the CCPx module for PWM operation.

Note: If the PWM duty cycle value is longer than

the PWM period, the CCP2 pin will not be

cleared.

FOSC

FPWM

---------------

⎝⎠

⎛⎞

log

2()log

----------------------------- bits=

PWM Resolution (max)

PWM Frequency 2.44 kHz 9.77 kHz 39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz

Timer Prescaler (1, 4, 16)1641111

PR2 Value FFh FFh FFh 3Fh 1Fh 17h

Maximum Resolution (bits) 10 10 10 8 7 6.58

PIC18F2X1X/4X1X
DS39636C-page 136 Preliminary © 2007 Microchip Technology Inc.
TABLE 14-5: REGISTERS ASSOCIATED WITH PWM AND TIMER2     
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
RCON IPEN SBOREN(2) —RI TO PD POR BOR 48
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
TRISB PORTB Data Direction Control Register 52
TRISC PORTC Data Direction Control Register 52
TMR2 Timer2 Register 50
PR2 Timer2 Period Register 50
T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 50
CCPR1L Capture/Compare/PWM Register 1 Low Byte 51
CCPR1H Capture/Compare/PWM Register 1 High Byte 51
CCP1CON P1M1(1) P1M0(1) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 51
CCPR2L Capture/Compare/PWM Register 2 Low Byte 51
CCPR2H Capture/Compare/PWM Register 2 High Byte 51
CCP2CON —— DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 51
ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(1) PSSBD0(1) 51
PWM1CON PRSEN PDC6(1) PDC5(1) PDC4(1) PDC3(1) PDC2(1) PDC1(1) PDC0(1) 51
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PWM or Timer2.
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.
2: The SBOREN bit is only available when the BOREN1:BOREN0 Configuration bits = 01; otherwise, it is 
disabled and reads as ‘0’. See Section 4.4 “Brown-out Reset (BOR)”.

PIC18F2X1X/4X1X

15.0 ENHANCED CAPTURE/

COMPARE/PWM (ECCP)

MODULE

In PIC18F4410/4415/4510/4515/4610 devices, CCP1

is implemented as a standard CCP module with

enhanced PWM capabilities. These include the

provision for 2 or 4 output channels, user selectable

polarity, dead-band control and automatic shutdown

and restart. The Enhanced features are discussed in

detail in Section 15.4 “Enhanced PWM Mode”.

Capture, Compare and single-output PWM functions of

the ECCP module are the same as described for the

standard CCP module.

The control register for the Enhanced CCP module is

shown in Register 15-1. It differs from the CCPxCON

registers in PIC18F2410/2415/2510/2515/2610

devices in that the two Most Significant bits are

implemented to control PWM functionality.

Note: The ECCP module is implemented only in

40/44-pin devices.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0

bit 7 bit 0

bit 7-6 P1M1:P1M0: Enhanced PWM Output Configuration bits

If CCP1M3:CCP1M2 = 00, 01, 10:

xx = P1A assigned as Capture/Compare input/output; P1B, P1C, P1D assigned as port pins

If CCP1M3:CCP1M2 = 11:

00 = Single output: P1A modulated; P1B, P1C, P1D assigned as port pins

01 = Full-bridge output forward: P1D modulated; P1A active; P1B, P1C inactive

10 = Half-bridge output: P1A, P1B modulated with dead-band control; P1C, P1D assigned

as port pins

11 = Full-bridge output reverse: P1B modulated; P1C active; P1A, P1D inactive

bit 5-4 DC1B1:DC1B0: PWM Duty Cycle bit 1 and bit 0

Capture mode:

Unused.

Compare mode:

Unused.

PWM mode:

These bits are the two LSbs of the 10-bit PWM duty cycle. The eight MSbs of the duty cycle are

found in CCPR1L.

bit 3-0 CCP1M3:CCP1M0: Enhanced CCP Mode Select bits

0000 = Capture/Compare/PWM off (resets ECCP module)

0001 = Reserved

0010 = Compare mode, toggle output on match

0011 = Capture mode

0100 = Capture mode, every falling edge

0101 = Capture mode, every rising edge

0110 = Capture mode, every 4th rising edge

0111 = Capture mode, every 16th rising edge

1000 = Compare mode, initialize CCP1 pin low, set output on compare match (set CCP1IF)

1001 = Compare mode, initialize CCP1 pin high, clear output on compare match (set CCP1IF)

1010 = Compare mode, generate software interrupt only, CCP1 pin reverts to I/O state

1011 = Compare mode, trigger special event (ECCP resets TMR1 or TMR3, sets CC1IF bit)

1100 = PWM mode; P1A, P1C active-high; P1B, P1D active-high

1101 = PWM mode; P1A, P1C active-high; P1B, P1D active-low

1110 = PWM mode; P1A, P1C active-low; P1B, P1D active-high

1111 = PWM mode; P1A, P1C active-low; P1B, P1D active-low

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X
DS39636C-page 138 Preliminary © 2007 Microchip Technology Inc.
In addition to the expanded range of modes available
through the CCP1CON and ECCP1AS registers, the
ECCP module has an additional register associated
with Enhanced PWM operation and auto-shutdown
features. This register is:
• PWM1CON (PWM Configuration register) 
15.1 ECCP Outputs and Configuration 
The Enhanced CCP module may have up to four PWM
outputs, depending on the selected operating mode.
These outputs, designated P1A through P1D, are
multiplexed with I/O pins on PORTC and PORTD. The
outputs that are active depend on the CCP operating
mode selected. The pin assignments are summarized
in Table 15-1.
To configure the I/O pins as PWM outputs, the proper
PWM mode must be selected by setting the
P1M1:P1M0 and CCP1M3:CCP1M0 bits. The
appropriate TRISC and TRISD direction bits for the port
pins must also be set as outputs.
15.1.1 ECCP MODULES AND TIMER 
RESOURCES
Like the standard CCP modules, the ECCP module can
utilize Timers 1, 2 or 3, depending on the mode
selected. Timer1 and Timer3 are available for modules
in Capture or Compare modes, while Timer2 is
available for modules in PWM mode. Interactions
between the standard and Enhanced CCP modules are
identical to those described for standard CCP modules.
Additional details on timer resources are provided in
Section 14.1.1 “CCP Modules and Timer
Resources”.
15.2 Capture and Compare Modes
Except for the operation of the special event trigger
discussed below, the Capture and Compare modes of
the ECCP module are identical in operation to that of
CCP2. These are discussed in detail in Section 14.2
“Capture Mode” and Section 14.3 “Compare
Mode”. No changes are required when moving
between 28-pin and 40/44-pin devices.
15.2.1 SPECIAL EVENT TRIGGER
The special event trigger output of ECCP1 resets the
TMR1 or TMR3 register pair, depending on which timer
resource is currently selected. This allows the CCPR1
register to effectively be a 16-bit programmable period
register for Timer1 or Timer3.    
15.3 Standard PWM Mode
When configured in Single Output mode, the ECCP
module functions identically to the standard CCP
module in PWM mode, as described in Section 14.4
“PWM Mode”. This is also sometimes referred to as
“Compatible CCP” mode, as in Table 15-1.
TABLE 15-1: PIN ASSIGNMENTS FOR VARIOUS ECCP1 MODES  
Note: When setting up single output PWM
operations, users are free to use either of
the processes described in Section 14.4.4
“Setup for PWM Operation” or
Section 15.4.9 “Setup for PWM Opera-
tion”. The latter is more generic and will
work for either single or multi-output PWM.
ECCP Mode CCP1CON
Configuration RC2 RD5 RD6 RD7
All 40/44-pin devices:
Compatible CCP 00xx 11xx CCP1 RD5/PSP5 RD6/PSP6 RD7/PSP7
Dual PWM 10xx 11xx P1A P1B RD6/PSP6 RD7/PSP7
Quad PWM x1xx 11xx P1A P1B P1C P1D
Legend: x = Don’t care. Shaded cells indicate pin assignments not used by ECCP1 in a given mode.

PIC18F2X1X/4X1X

15.4 Enhanced PWM Mode

The Enhanced PWM mode provides additional PWM

output options for a broader range of control applica-

tions. The module is a backward compatible version of

the standard CCP module and offers up to four outputs,

designated P1A through P1D. Users are also able to

select the polarity of the signal (either active-high or

active-low). The module’s output mode and polarity are

configured by setting the P1M1:P1M0 and

CCP1M3:CCP1M0 bits of the CCP1CON register.

Figure 15-1 shows a simplified block diagram of PWM

operation. All control registers are double-buffered and

are loaded at the beginning of a new PWM cycle (the

period boundary when Timer2 resets) in order to

prevent glitches on any of the outputs. The exception is

the PWM Delay register, PWM1CON, which is loaded

at either the duty cycle boundary or the period bound-

ary (whichever comes first). Because of the buffering,

the module waits until the assigned timer resets instead

of starting immediately. This means that Enhanced

PWM waveforms do not exactly match the standard

PWM waveforms, but are instead offset by one full

instruction cycle (4 TOSC).

As before, the user must manually configure the

appropriate TRIS bits for output.

15.4.1 PWM PERIOD

The PWM period is specified by writing to the PR2

following equation.

EQUATION 15-1:

PWM frequency is defined as 1/[PWM period]. When

TMR2 is equal to PR2, the following three events occur

on the next increment cycle:

•TMR2 is cleared

• The CCP1 pin is set (if PWM duty cycle = 0%, the

CCP1 pin will not be set)

• The PWM duty cycle is copied from CCPR1L into

CCPR1H

FIGURE 15-1: SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODULE

Note: The Timer2 postscaler (see Section 12.0

“Timer2 Module”) is not used in the

determination of the PWM frequency. The

postscaler could be used to have a servo

update rate at a different frequency than

the PWM output.

PWM Period = [(PR2) + 1] • 4 • TOSC •

(TMR2 Prescale Value)

CCPR1L

CCPR1H (Slave)

Comparator

TMR2

Comparator

PR2

(Note 1)

Duty Cycle Registers CCP1CON<5:4>

Clear Timer,

set CCP1 pin and

latch D.C.

Note: The 8-bit TMR2 register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler, to create the 10-bit time

base.

TRISx<x>

CCP1/P1A

TRISx<x>

P1B

TRISx<x>

P1D

Output

Controller

P1M1<1:0>

CCP1M<3:0>

PWM1CON

CCP1/P1A

P1B

P1C

P1D

P1C

PIC18F2X1X/4X1X

15.4.2 PWM DUTY CYCLE

The PWM duty cycle is specified by writing to the

CCPR1L register and to the CCP1CON<5:4> bits. Up

to 10-bit resolution is available. The CCPR1L contains

the eight MSbs and the CCP1CON<5:4> contains the

two LSbs. This 10-bit value is represented by

CCPR1L:CCP1CON<5:4>. The PWM duty cycle is

calculated by the following equation.

EQUATION 15-2:

CCPR1L and CCP1CON<5:4> can be written to at any

time, but the duty cycle value is not copied into

CCPR1H until a match between PR2 and TMR2 occurs

(i.e., the period is complete). In PWM mode, CCPR1H

is a read-only register.

The CCPR1H register and a 2-bit internal latch are

used to double-buffer the PWM duty cycle. This

double-buffering is essential for glitchless PWM

operation. When the CCPR1H and 2-bit latch match

TMR2, concatenated with an internal 2-bit Q clock or

two bits of the TMR2 prescaler, the CCP1 pin is

cleared. The maximum PWM resolution (bits) for a

given PWM frequency is given by the following

equation.

EQUATION 15-3:

15.4.3 PWM OUTPUT CONFIGURATIONS

The P1M1:P1M0 bits in the CCP1CON register allow

one of four configurations:

• Single Output

• Half-Bridge Output

• Full-Bridge Output, Forward mode

• Full-Bridge Output, Reverse mode

The Single Output mode is the standard PWM mode

discussed in Section 15.4 “Enhanced PWM Mode”.

The Half-Bridge and Full-Bridge Output modes are

covered in detail in the sections that follow.

The general relationship of the outputs in all

configurations is summarized in Figure 15-2.

TABLE 15-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz

PWM Duty Cycle = (CCPR1L:CCP1CON<5:4>) •

TOSC • (TMR2 Prescale Value)

Note: If the PWM duty cycle value is longer than

the PWM period, the CCP1 pin will not be

cleared.

()

PWM Resolution (max) =

FOSC

FPWM

log

log(2) bits

PWM Frequency 2.44 kHz 9.77 kHz 39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz

Timer Prescaler (1, 4, 16)1641111

PR2 Value FFh FFh FFh 3Fh 1Fh 17h

Maximum Resolution (bits) 10 10 10 8 7 6.58

PIC18F2X1X/4X1X

FIGURE 15-2: PWM OUTPUT RELATIONSHIPS (ACTIVE-HIGH STATE)

FIGURE 15-3: PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE)

Period

SIGNAL

PR2 + 1

CCP1CON

<7:6>

P1A Modulated

P1B Modulated

P1A Active

P1B Inactive

P1C Inactive

P1D Modulated

P1A Inactive

P1B Modulated

P1C Active

P1D Inactive

Duty

Cycle

(Single Output)

(Half-Bridge)

(Full-Bridge,

Forward)

(Full-Bridge,

Reverse)

Delay(1) Delay(1)

Period

SIGNAL PR2 + 1

CCP1CON

<7:6>

P1A Modulated

P1B Modulated

P1A Active

P1B Inactive

P1C Inactive

P1D Modulated

P1A Inactive

P1B Modulated

P1C Active

P1D Inactive

Duty

Cycle

(Single Output)

(Half-Bridge)

(Full-Bridge,

Forward)

(Full-Bridge,

Reverse)

Delay(1) Delay(1)

Relationships:

• Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value)

• Duty Cycle = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)

• Delay = 4 * TOSC * (ECCPDEL<6:0>)

Note 1: Dead-band delay is programmed using the PWM1CON register (Section 15.4.6 “Programmable

Dead-Band Delay”).

PIC18F2X1X/4X1X

15.4.4 HALF-BRIDGE MODE

In the Half-Bridge Output mode, two pins are used as

outputs to drive push-pull loads. The PWM output

signal is output on the P1A pin, while the complemen-

tary PWM output signal is output on the P1B pin

(Figure 15-4). This mode can be used for half-bridge

applications, as shown in Figure 15-5, or for full-bridge

applications where four power switches are being

modulated with two PWM signals.

In Half-Bridge Output mode, the programmable dead-

band delay can be used to prevent shoot-through

current in half-bridge power devices. The value of bits

PDC6:PDC0 sets the number of instruction cycles

before the output is driven active. If the value is greater

than the duty cycle, the corresponding output remains

inactive during the entire cycle. See Section 15.4.6

“Programmable Dead-Band Delay” for more details

of the dead-band delay operations.

Since the P1A and P1B outputs are multiplexed with

the PORTC<2> and PORTD<5> data latches, the

TRISC<2> and TRISD<5> bits must be cleared to

configure P1A and P1B as outputs.

FIGURE 15-4: HALF-BRIDGE PWM

OUTPUT

FIGURE 15-5: EXAMPLES OF HALF-BRIDGE OUTPUT MODE APPLICATIONS

Period

Duty Cycle

(1)

P1A(2)

P1B(2)

td = Dead-Band Delay

Period

(1) (1)

Note 1: At this time, the TMR2 register is equal to the

PR2 register.

2: Output signals are shown as active-high.

PIC18F4X1X

P1A

P1B

FET

Driver

FET

Driver

V+

V-

Load

FET

Driver

FET

Driver

V+

V-

Load

FET

Driver

FET

Driver

PIC18F4X1X

P1A

P1B

Standard Half-Bridge Circuit (“Push-Pull”)

Half-Bridge Output Driving a Full-Bridge Circuit

PIC18F2X1X/4X1X

15.4.5 FULL-BRIDGE MODE

In Full-Bridge Output mode, four pins are used as

outputs; however, only two outputs are active at a time.

In the Forward mode, pin P1A is continuously active

and pin P1D is modulated. In the Reverse mode, pin

P1C is continuously active and pin P1B is modulated.

These are illustrated in Figure 15-6.

P1A, P1B, P1C and P1D outputs are multiplexed with

the PORTC<2> and PORTD<7:5> data latches. The

TRISC<2> and TRISD<7:5> bits must be cleared to

make the P1A, P1B, P1C and P1D pins outputs.

FIGURE 15-6: FULL-BRIDGE PWM OUTPUT

Period

Duty Cycle

P1A(2)

P1B(2)

P1C(2)

P1D(2)

Forward Mode

(1)

Period

Duty Cycle

P1A(2)

P1C(2)

P1D(2)

P1B(2)

Reverse Mode

(1)

Note 1: At this time, the TMR2 register is equal to the PR2 register.

Note 2: Output signal is shown as active-high.

PIC18F2X1X/4X1X

FIGURE 15-7: EXAMPLE OF FULL-BRIDGE APPLICATION

15.4.5.1 Direction Change in Full-Bridge Mode

In the Full-Bridge Output mode, the P1M1 bit in the

CCP1CON register allows user to control the forward/

reverse direction. When the application firmware

changes this direction control bit, the module will

assume the new direction on the next PWM cycle.

Just before the end of the current PWM period, the

modulated outputs (P1B and P1D) are placed in their

inactive state, while the unmodulated outputs (P1A and

P1C) are switched to drive in the opposite direction.

This occurs in a time interval of 4 TOSC * (Timer2

Prescale Value) before the next PWM period begins.

The Timer2 prescaler will be either 1, 4 or 16, depend-

ing on the value of the T2CKPS bit (T2CON<1:0>).

During the interval from the switch of the unmodulated

outputs to the beginning of the next period, the

modulated outputs (P1B and P1D) remain inactive.

This relationship is shown in Figure 15-8.

Note that in the Full-Bridge Output mode, the CCP1

module does not provide any dead-band delay. In

general, since only one output is modulated at all times,

dead-band delay is not required. However, there is a

situation where a dead-band delay might be required.

This situation occurs when both of the following

conditions are true:

1. The direction of the PWM output changes when

the duty cycle of the output is at or near 100%.

2. The turn-off time of the power switch, including

the power device and driver circuit, is greater

than the turn-on time.

Figure 15-9 shows an example where the PWM

direction changes from forward to reverse at a near

100% duty cycle. At time t1, the outputs P1A and P1D

become inactive, while output P1C becomes active. In

this example, since the turn-off time of the power

devices is longer than the turn-on time, a shoot-through

current may flow through power devices, QC and QD

(see Figure 15-7), for the duration of ‘t’. The same

phenomenon will occur to power devices, QA and QB,

for PWM direction change from reverse to forward.

If changing PWM direction at high duty cycle is required

for an application, one of the following requirements

must be met:

1. Reduce PWM for a PWM period before

changing directions.

2. Use switch drivers that can drive the switches off

faster than they can drive them on.

Other options to prevent shoot-through current may

exist.

P1A

P1C

FET

Driver

FET

Driver

V+

V-

Load

FET

Driver

FET

Driver

P1B

P1D

QB QD

PIC18F4X1X

PIC18F2X1X/4X1X

FIGURE 15-8: PWM DIRECTION CHANGE

FIGURE 15-9: PWM DIRECTION CHANGE AT NEAR 100% DUTY CYCLE

Period(1)

SIGNAL

Note 1: The direction bit in the CCP1 Control register (CCP1CON<7>) is written any time during the PWM cycle.

2: When changing directions, the P1A and P1C signals switch before the end of the current PWM cycle at intervals

of 4 TOSC, 16 TOSC or 64 TOSC, depending on the Timer2 prescaler value. The modulated P1B and P1D signals

are inactive at this time.

Period

(Note 2)

P1A (Active-High)

P1B (Active-High)

P1C (Active-High)

P1D (Active-High)

Forward Period Reverse Period

P1A(1)

tON(2)

tOFF(3)

t = tOFF – tON(2,3)

P1B(1)

P1C(1)

P1D(1)

External Switch D(1)

Potential

Shoot-Through

Current(1)

Note 1: All signals are shown as active-high.

2: tON is the turn-on delay of power switch QC and its driver.

3: tOFF is the turn-off delay of power switch QD and its driver.

External Switch C(1)

PIC18F2X1X/4X1X

15.4.6 PROGRAMMABLE DEAD-BAND

DELAY

In half-bridge applications where all power switches are

modulated at the PWM frequency at all times, the

power switches normally require more time to turn off

than to turn on. If both the upper and lower power

switches are switched at the same time (one turned on

and the other turned off), both switches may be on for

a short period of time until one switch completely turns

off. During this brief interval, a very high current (

shoot-

through current

) may flow through both power

switches, shorting the bridge supply. To avoid this

potentially destructive shoot-through current from

flowing during switching, turning on either of the power

switches is normally delayed to allow the other switch

to completely turn off.

In the Half-Bridge Output mode, a digitally program-

mable dead-band delay is available to avoid shoot-

through current from destroying the bridge power

switches. The delay occurs at the signal transition from

the non-active state to the active state. See Figure 15-4

for illustration. Bits PDC6:PDC0 of the PWM1CON

microcontroller instruction cycles (TCY or 4 TOSC).

These bits are not available on 28-pin devices as the

standard CCP module does not support half-bridge

operation.

15.4.7 ENHANCED PWM AUTO-SHUTDOWN

When the CCP1 is programmed for any of the Enhanced

PWM modes, the active output pins may be configured

for auto-shutdown. Auto-shutdown immediately places

the Enhanced PWM output pins into a defined shutdown

state when a shutdown event occurs.

A shutdown event can be caused by either of the

comparator modules, a low level on the Fault input pin

(FLT0) or any combination of these three sources. The

comparators may be used to monitor a voltage input

proportional to a current being monitored in the bridge

circuit. If the voltage exceeds a threshold, the

comparator switches state and triggers a shutdown.

Alternatively, a low digital signal on FLT0 can also trigger

a shutdown. The auto-shutdown feature can be disabled

by not selecting any auto-shutdown sources. The auto-

shutdown sources to be used are selected using the

ECCPAS2:ECCPAS0 bits (bits<6:4> of the ECCP1AS

When a shutdown occurs, the output pins are

asynchronously placed in their shutdown states,

specified by the PSSAC1:PSSAC0 and

PSSBD1:PSSBD0 bits (ECCPAS3:ECCPAS0). Each

pin pair (P1A/P1C and P1B/P1D) may be set to drive

high, drive low or be tri-stated (not driving). The

ECCPASE bit (ECCPAS<7>) is also set to hold the

Enhanced PWM outputs in their shutdown states.

The ECCPASE bit is set by hardware when a shutdown

event occurs. If automatic restarts are not enabled, the

ECCPASE bit is cleared by firmware when the cause of

the shutdown clears. If automatic restarts are enabled,

the ECCPASE bit is automatically cleared when the

cause of the auto-shutdown has cleared.

If the ECCPASE bit is set when a PWM period begins,

the PWM outputs remain in their shutdown state for that

entire PWM period. When the ECCPASE bit is cleared,

the PWM outputs will return to normal operation at the

beginning of the next PWM period.

Note: Programmable dead-band delay is not

implemented in 28-pin devices with

standard CCP modules.

Note: Writing to the ECCPASE bit is disabled

while a shutdown condition is active.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PRSEN PDC6(1) PDC5(1) PDC4(1) PDC3(1) PDC2(1) PDC1(1) PDC0(1)

bit 7 bit 0

bit 7 PRSEN: PWM Restart Enable bit

1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event

goes away; the PWM restarts automatically

0 = Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM

bit 6-0 PDC6:PDC0: PWM Delay Count bits(1)

Delay time, in number of FOSC/4 (4 * TOSC) cycles, between the scheduled and actual time for

a PWM signal to transition to active.

Note 1: Unimplemented on 28-pin devices and read as ‘0’.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

CONTROL REGISTER

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(1) PSSBD0(1)

bit 7 bit 0

bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit

1 = A shutdown event has occurred; ECCP outputs are in shutdown state

0 = ECCP outputs are operating

bit 6-4 ECCPAS2:ECCPAS0: ECCP Auto-Shutdown Source Select bits

111 = FLT0 or Comparator 1 or Comparator 2

110 = FLT0 or Comparator 2

101 = FLT0 or Comparator 1

100 =FLT0

011 = Either Comparator 1 or 2

010 = Comparator 2 output

001 = Comparator 1 output

000 = Auto-shutdown is disabled

bit 3-2 PSSAC1:PSSAC0: Pins A and C Shutdown State Control bits

1x = Pins A and C are tri-state (40/44-pin devices);

PWM output is tri-state (28-pin devices)

01 = Drive Pins A and C to ‘1’

00 = Drive Pins A and C to ‘0’

bit 1-0 PSSBD1:PSSBD0: Pins B and D Shutdown State Control bits(1)

1x = Pins B and D tri-state

01 = Drive Pins B and D to ‘1’

00 = Drive Pins B and D to ‘0’

Note 1: Unimplemented on 28-pin devices and read as ‘0’.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

15.4.7.1 Auto-Shutdown and

Automatic Restart

The auto-shutdown feature can be configured to allow

automatic restarts of the module following a shutdown

event. This is enabled by setting the PRSEN bit of the

PWM1CON register (PWM1CON<7>).

In Shutdown mode with PRSEN = 1 (Figure 15-10), the

ECCPASE bit will remain set for as long as the cause

of the shutdown continues. When the shutdown condi-

tion clears, the ECCP1ASE bit is cleared. If PRSEN = 0

(Figure 15-11), once a shutdown condition occurs, the

ECCPASE bit will remain set until it is cleared by firm-

ware. Once ECCPASE is cleared, the Enhanced PWM

will resume at the beginning of the next PWM period.

Independent of the PRSEN bit setting, if the auto-

shutdown source is one of the comparators, the

shutdown condition is a level. The ECCPASE bit

cannot be cleared as long as the cause of the shutdown

persists.

The Auto-Shutdown mode can be forced by writing a ‘1’

to the ECCPASE bit.

15.4.8 START-UP CONSIDERATIONS

When the ECCP module is used in the PWM mode, the

application hardware must use the proper external pull-

up and/or pull-down resistors on the PWM output pins.

When the microcontroller is released from Reset, all of

the I/O pins are in the high-impedance state. The external

circuits must keep the power switch devices in the off

state until the microcontroller drives the I/O pins with the

proper signal levels, or activates the PWM output(s).

The CCP1M1:CCP1M0 bits (CCP1CON<1:0>) allow

the user to choose whether the PWM output signals are

active-high or active-low for each pair of PWM output

pins (P1A/P1C and P1B/P1D). The PWM output

polarities must be selected before the PWM pins are

configured as outputs. Changing the polarity configura-

tion while the PWM pins are configured as outputs is

not recommended, since it may result in damage to the

application circuits.

The P1A, P1B, P1C and P1D output latches may not be

in the proper states when the PWM module is initialized.

Enabling the PWM pins for output at the same time as

the ECCP module may cause damage to the applica-

tion circuit. The ECCP module must be enabled in the

proper output mode and complete a full PWM cycle

before configuring the PWM pins as outputs. The com-

pletion of a full PWM cycle is indicated by the TMR2IF

bit being set as the second PWM period begins.

FIGURE 15-10: PWM AUTO-SHUTDOWN (PRSEN = 1, AUTO-RESTART ENABLED)

FIGURE 15-11: PWM AUTO-SHUTDOWN (PRSEN = 0, AUTO-RESTART DISABLED)

Note: Writing to the ECCPASE bit is disabled

while a shutdown condition is active.

Shutdown

PWM

ECCPASE bit

Activity

Event

PWM Period PWM Period PWM Period

Duty Cycle

Dead Time

Duty Cycle

Dead Time

Duty Cycle

Dead Time

Shutdown

PWM

ECCPASE bit

Activity

Event

PWM Period PWM Period PWM Period

ECCPASE

Cleared by Firmware

Duty Cycle

Dead Time

Duty Cycle Duty Cycle

Dead TimeDead Time

PIC18F2X1X/4X1X

15.4.9 SETUP FOR PWM OPERATION

The following steps should be taken when configuring

the ECCP module for PWM operation:

1. Configure the PWM pins, P1A and P1B (and

P1C and P1D, if used), as inputs by setting the

corresponding TRIS bits.

2. Set the PWM period by loading the PR2 register.

3. If auto-shutdown is required:

• Disable auto-shutdown (ECCP1AS = 0)

• Configure source (FLT0, Comparator 1 or

Comparator 2)

• Wait for non-shutdown condition

4. Configure the ECCP module for the desired

PWM mode and configuration by loading the

CCP1CON register with the appropriate values:

• Select one of the available output

configurations and direction with the

P1M1:P1M0 bits.

• Select the polarities of the PWM output

signals with the CCP1M3:CCP1M0 bits.

5. Set the PWM duty cycle by loading the CCPR1L

6. For Half-Bridge Output mode, set the dead-

band delay by loading ECCPDEL<6:0> with the

appropriate value.

7. If auto-shutdown operation is required, load the

ECCP1AS register:

• Select the auto-shutdown sources using the

ECCPAS2:ECCPAS0 bits.

• Select the shutdown states of the PWM

output pins using the PSSAC1:PSSAC0 and

PSSBD1:PSSBD0 bits.

• Set the ECCPASE bit (ECCPAS<7>).

• Configure the comparators using the CMCON

• Configure the comparator inputs as analog

inputs.

8. If auto-restart operation is required, set the

PRSEN bit (ECCPDEL<7>).

9. Configure and start TMR2:

• Clear the TMR2 interrupt flag bit by clearing

the TMR2IF bit (PIR1<1>).

• Set the TMR2 prescale value by loading the

T2CKPS bits (T2CON<1:0>).

• Enable Timer2 by setting the TMR2ON bit

(T2CON<2>).

10. Enable PWM outputs after a new PWM cycle

has started:

• Wait until TMRn overflows (TMRnIF bit is set).

• Enable the CCP1/P1A, P1B, P1C and/or P1D

pin outputs by clearing the respective TRIS

bits.

• Clear the ECCPASE bit (ECCPAS<7>).

15.4.10 OPERATION IN POWER-MANAGED

MODES

In Sleep mode, all clock sources are disabled. Timer2

will not increment and the state of the module will not

change. If the ECCP pin is driving a value, it will

continue to drive that value. When the device wakes

up, it will continue from this state. If Two-Speed Start-

ups are enabled, the initial start-up frequency from

INTOSC and the postscaler may not be stable

immediately.

In PRI_IDLE mode, the primary clock will continue to

clock the ECCP module without change. In all other

power-managed modes, the selected power-managed

mode clock will clock Timer2. Other power-managed

mode clocks will most likely be different than the

primary clock frequency.

15.4.10.1 Operation with Fail-Safe

Clock Monitor

If the Fail-Safe Clock Monitor is enabled, a clock failure

will force the device into the power-managed RC_RUN

mode and the OSCFIF bit (PIR2<7>) will be set. The

ECCP will then be clocked from the internal oscillator

clock source, which may have a different clock

frequency than the primary clock.

See the previous section for additional details.

15.4.11 EFFECTS OF A RESET

Both Power-on Reset and subsequent Resets will force

all ports to Input mode and the CCP registers to their

Reset states.

This forces the Enhanced CCP module to reset to a

state compatible with the standard CCP module.

PIC18F2X1X/4X1X
DS39636C-page 150 Preliminary © 2007 Microchip Technology Inc.
TABLE 15-3: REGISTERS ASSOCIATED WITH ECCP1 MODULE AND TIMER1 TO TIMER3     
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
RCON IPEN SBOREN(2) —RI TO PD POR BOR 48
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
PIR2 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF 52
PIE2 OSCFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE 52
IPR2 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP 52
TRISB PORTB Data Direction Control Register 52
TRISC PORTC Data Direction Control Register 52
TRISD PORTD Data Direction Control Register 52
TMR1L Timer1 Register Low Byte 50
TMR1H Timer1 Register High Byte 50
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50
TMR2 Timer2 Register 50
T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 50
PR2 Timer2 Period Register 50
TMR3L Timer3 Register Low Byte 51
TMR3H Timer3 Register High Byte 51
T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 51
CCPR1L Capture/Compare/PWM Register 1 Low Byte 51
CCPR1H Capture/Compare/PWM Register 1 High Byte 51
CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 51
ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(1) PSSBD0(1) 51
PWM1CON PRSEN PDC6(1) PDC5(1) PDC4(1) PDC3(1) PDC2(1) PDC1(1) PDC0(1) 51
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during ECCP operation.
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.
2: The SBOREN bit is only available when the BOREN1:BOREN0 Configuration bits = 01; otherwise, it is disabled 
and reads as ‘0’. See Section 4.4 “Brown-out Reset (BOR)”.

PIC18F2X1X/4X1X

16.0 MASTER SYNCHRONOUS

SERIAL PORT (MSSP)

MODULE

16.1 MSSP Module Overview

The Master Synchronous Serial Port (MSSP) module is

a serial interface, useful for communicating with other

peripheral or microcontroller devices. These peripheral

devices may be serial EEPROMs, shift registers,

display drivers, A/D converters, etc. The MSSP module

can operate in one of two modes:

• Serial Peripheral Interface (SPI)

• Inter-Integrated Circuit (I2C)

- Full Master mode

- Slave mode (with general address call)

The I2C interface supports the following modes in

hardware:

•Master mode

• Multi-Master mode

• Slave mode

16.2 Control Registers

The MSSP module has three associated registers.

These include a status register (SSPSTAT) and two

control registers (SSPCON1 and SSPCON2). The use

of these registers and their individual Configuration bits

differ significantly depending on whether the MSSP

module is operated in SPI or I2C mode.

Additional details are provided under the individual

sections.

16.3 SPI Mode

The SPI mode allows 8 bits of data to be synchronously

transmitted and received simultaneously. All four SPI

modes are supported. To accomplish communication,

typically three pins are used:

• Serial Data Out (SDO) – RC5/SDO

• Serial Data In (SDI) – RC4/SDI/SDA

• Serial Clock (SCK) – RC3/SCK/SCL

Additionally, a fourth pin may be used when in a Slave

mode of operation:

• Slave Select (SS) – RA5/SS

Figure 16-1 shows the block diagram of the MSSP

module when operating in SPI mode.

FIGURE 16-1: MSSP BLOCK DIAGRAM

(SPI MODE)

( )

Read Write

Internal

Data Bus

SSPSR reg

SSPM3:SSPM0

bit 0 Shift

Clock

SS Control

Enable

Edge

Select

Clock Select

TMR2 Output

TOSC

Prescaler

4, 16, 64

Edge

Select

Data to TX/RX in SSPSR

TRIS bit

SMP:CKE

RC5/SDO

SSPBUF reg

RC4/SDI/SDA

RA5/AN4/SS/

RC3/SCK/

SCL

HLVDIN/C2OUT

PIC18F2X1X/4X1X

16.3.1 REGISTERS

The MSSP module has four registers for SPI mode

operation. These are:

• MSSP Control Register 1 (SSPCON1)

• MSSP Status Register (SSPSTAT)

• Serial Receive/Transmit Buffer Register

(SSPBUF)

• MSSP Shift Register (SSPSR) – Not directly

accessible

SSPCON1 and SSPSTAT are the control and status

registers in SPI mode operation. The SSPCON1

the SSPSTAT are read-only. The upper two bits of the

SSPSTAT are read/write.

SSPSR is the shift register used for shifting data in or

out. SSPBUF is the buffer register to which data bytes

are written to or read from.

In receive operations, SSPSR and SSPBUF together

create a double-buffered receiver. When SSPSR

receives a complete byte, it is transferred to SSPBUF

and the SSPIF interrupt is set.

During transmission, the SSPBUF is not double-

buffered. A write to SSPBUF will write to both SSPBUF

and SSPSR.

R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0

SMP CKE D/A PSR/WUA BF

bit 7 bit 0

bit 7 SMP: Sample bit

SPI Master mode:

1 = Input data sampled at end of data output time

0 = Input data sampled at middle of data output time

SPI Slave mode:

SMP must be cleared when SPI operation is used in Slave mode.

bit 6 CKE: SPI Clock Select bit

1 = Transmit occurs on transition from active to Idle clock state

0 = Transmit occurs on transition from Idle to active clock state

Note: Polarity of clock state is set by the CKP bit (SSPCON1<4>).

bit 5 D/A: Data/Address bit

Used in I2C mode only.

bit 4 P: Stop bit

Used in I2C mode only. This bit is cleared when the MSSP module is disabled; SSPEN is

cleared.

bit 3 S: Start bit

Used in I2C mode only.

bit 2 R/W: Read/Write bit Information

Used in I2C mode only.

bit 1 UA: Update Address bit

Used in I2C mode only.

bit 0 BF: Buffer Full Status bit (Receive mode only)

1 = Receive complete, SSPBUF is full

0 = Receive not complete, SSPBUF is empty

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0

bit 7 bit 0

bit 7 WCOL: Write Collision Detect bit (Transmit mode only)

1 = The SSPBUF register is written while it is still transmitting the previous word

(must be cleared in software)

0 = No collision

bit 6 SSPOV: Receive Overflow Indicator bit

SPI Slave mode:

1 = A new byte is received while the SSPBUF register is still holding the previous data. In case

of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode. The user

must read the SSPBUF, even if only transmitting data, to avoid setting overflow (must be

cleared in software).

0 = No overflow

Note: In Master mode, the overflow bit is not set since each new reception (and

transmission) is initiated by writing to the SSPBUF register.

bit 5 SSPEN: Synchronous Serial Port Enable bit

1 = Enables serial port and configures SCK, SDO, SDI and SS as serial port pins

0 = Disables serial port and configures these pins as I/O port pins

Note: When enabled, these pins must be properly configured as input or output.

bit 4 CKP: Clock Polarity Select bit

1 = Idle state for clock is a high level

0 = Idle state for clock is a low level

bit 3-0 SSPM3:SSPM0: Synchronous Serial Port Mode Select bits

0101 = SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as I/O pin

0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled

0011 = SPI Master mode, clock = TMR2 output/2

0010 = SPI Master mode, clock = FOSC/64

0001 = SPI Master mode, clock = FOSC/16

0000 = SPI Master mode, clock = FOSC/4

Note: Bit combinations not specifically listed here are either reserved or implemented in

I2C mode only.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

16.3.2 OPERATION

When initializing SPI operation, several options need to

be specified. This is done by programming the

appropriate control bits (SSPCON1<5:0> and

SSPSTAT<7:6>). These control bits allow the following

to be specified:

• Master mode (SCK is the clock output)

• Slave mode (SCK is the clock input)

• Clock Polarity (Idle state of SCK)

• Data Input Sample Phase (middle or end of data

output time)

• Clock Edge (output data on rising/falling edge of

SCK)

• Clock Rate (Master mode only)

• Slave Select mode (Slave mode only)

The MSSP consists of a Transmit/Receive Shift regis-

ter (SSPSR) and a Buffer register (SSPBUF). The

SSPSR shifts the data in and out of the device, MSb

first. The SSPBUF holds the data that was written to the

SSPSR until the received data is ready. Once the 8 bits

of data have been received, that byte is moved to the

SSPBUF register. Then, the Buffer Full detect bit, BF

(SSPSTAT<0>) and the interrupt flag bit, SSPIF, are

set. This double-buffering of the received data

(SSPBUF) allows the next byte to start reception before

reading the data that was just received. Any write to the

SSPBUF register during transmission/reception of data

will be ignored and the write collision detect bit, WCOL

(SSPCON1<7>), will be set. User software must clear

the WCOL bit so that it can be determined if the follow-

ing write(s) to the SSPBUF register completed

successfully.

When the application software is expecting to receive

valid data, the SSPBUF should be read before the next

byte of data to transfer is written to the SSPBUF. The

Buffer Full bit, BF (SSPSTAT<0>), indicates when

SSPBUF has been loaded with the received data

(transmission is complete). When the SSPBUF is read,

the BF bit is cleared. This data may be irrelevant if the

SPI interface is only a transmitter. Generally, the MSSP

interrupt is used to determine when the transmission/

reception has completed. The SSPBUF must be read

and/or written. If the interrupt method is not going to be

used, then software polling can be done to ensure that

a write collision does not occur. Example 16-1 shows

the loading of the SSPBUF (SSPSR) for data

transmission.

The SSPSR is not directly readable or writable and can

only be accessed by addressing the SSPBUF register.

Additionally, the MSSP Status register (SSPSTAT)

indicates the various status conditions.

EXAMPLE 16-1: LOADING THE SSPBUF (SSPSR) REGISTER

LOOP BTFSS SSPSTAT, BF ;Has data been received (transmit complete)?

BRA LOOP ;No

MOVF SSPBUF, W ;WREG reg = contents of SSPBUF

MOVWF RXDATA ;Save in user RAM, if data is meaningful

MOVF TXDATA, W ;W reg = contents of TXDATA

MOVWF SSPBUF ;New data to xmit

PIC18F2X1X/4X1X

16.3.3 ENABLING SPI I/O

To enable the serial port, SSP Enable bit, SSPEN

(SSPCON1<5>), must be set. To reset or reconfigure

SPI mode, clear the SSPEN bit, reinitialize the

SSPCON registers and then set the SSPEN bit. This

configures the SDI, SDO, SCK and SS pins as serial

port pins. For the pins to behave as the serial port func-

tion, some must have their data direction bits (in the

TRIS register) appropriately programmed as follows:

• SDI is automatically controlled by the SPI module

• SDO must have TRISC<5> bit cleared

• SCK (Master mode) must have TRISC<3> bit

cleared

• SCK (Slave mode) must have TRISC<3> bit set

•SS

must have TRISA<5> bit set

Any serial port function that is not desired may be

overridden by programming the corresponding Data

Direction (TRIS) register to the opposite value.

16.3.4 TYPICAL CONNECTION

Figure 16-2 shows a typical connection between two

microcontrollers. The master controller (Processor 1)

initiates the data transfer by sending the SCK signal.

Data is shifted out of both shift registers on their pro-

grammed clock edge and latched on the opposite edge

of the clock. Both processors should be programmed to

the same Clock Polarity (CKP), then both controllers

would send and receive data at the same time.

Whether the data is meaningful (or dummy data)

depends on the application software. This leads to

three scenarios for data transmission:

• Master sends data – Slave sends dummy data

• Master sends data – Slave sends data

• Master sends dummy data – Slave sends data

FIGURE 16-2: SPI MASTER/SLAVE CONNECTION

Serial Input Buffer

(SSPBUF)

Shift Register

(SSPSR)

MSb LSb

SDO

SDI

PROCESSOR 1

SCK

SPI Master SSPM3:SSPM0 = 00xxb

Serial Input Buffer

(SSPBUF)

Shift Register

(SSPSR)

LSb

MSb

SDI

SDO

PROCESSOR 2

SCK

SPI Slave SSPM3:SSPM0 = 010xb

Serial Clock

PIC18F2X1X/4X1X

16.3.5 MASTER MODE

The master can initiate the data transfer at any time

because it controls the SCK. The master determines

when the slave (Processor 2, Figure 16-2) is to

broadcast data by the software protocol.

In Master mode, the data is transmitted/received as

soon as the SSPBUF register is written to. If the SPI

interface is only going to receive, the SDO output could

be disabled (programmed as an input). The SSPSR

SDI pin at the programmed clock rate. As each byte is

received, it will be loaded into the SSPBUF register as

if a normal received byte (interrupts and status bits

appropriately set). This could be useful in receiver

applications as a “Line Activity Monitor” mode.

The clock polarity is selected by appropriately

programming the CKP bit (SSPCON1<4>). This then,

would give waveforms for SPI communication as

shown in Figure 16-3, Figure 16-5 and Figure 16-6,

where the MSB is transmitted first. In Master mode, the

SPI clock rate (bit rate) is user programmable to be one

of the following:

•F

OSC/4 (or TCY)

•FOSC/16 (or 4 • TCY)

•F

OSC/64 (or 16 • TCY)

• Timer2 output/2

This allows a maximum data rate (at 40 MHz) of

10.00 Mbps.

Figure 16-3 shows the waveforms for Master mode.

When the CKE bit is set, the SDO data is valid before

there is a clock edge on SCK. The change of the input

sample is shown based on the state of the SMP bit. The

time when the SSPBUF is loaded with the received

data is shown.

FIGURE 16-3: SPI MODE WAVEFORM (MASTER MODE)

SCK

(CKP = 0

SCK

(CKP = 1

SCK

(CKP = 0

SCK

(CKP = 1

4 Clock

Modes

Input

Sample

Input

Sample

SDI

bit 7 bit 0

SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0

bit 7

SDI

SSPIF

(SMP = 1)

(SMP = 0)

(SMP = 1)

CKE = 1)

CKE = 0)

CKE = 1)

CKE = 0)

(SMP = 0)

Write to

SSPBUF

SSPSR to

SSPBUF

SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0

(CKE = 0)

(CKE = 1)

Next Q4 Cycle

after Q2↓

bit 0

PIC18F2X1X/4X1X

16.3.6 SLAVE MODE

In Slave mode, the data is transmitted and received as

the external clock pulses appear on SCK. When the

last bit is latched, the SSPIF interrupt flag bit is set.

Before enabling the module in SPI Slave mode, the

clock line must match the proper Idle state. The clock

line can be observed by reading the SCK pin. The Idle

state is determined by the CKP bit (SSPCON1<4>).

While in Slave mode, the external clock is supplied by

the external clock source on the SCK pin. This external

clock must meet the minimum high and low times as

specified in the electrical specifications.

While in Sleep mode, the slave can transmit/receive

data. When a byte is received, the device will wake-up

from Sleep.

16.3.7 SLAVE SELECT

SYNCHRONIZATION

The SS pin allows a Synchronous Slave mode. The

SPI operation must be in Slave mode with SS pin

control enabled (SSPCON1<3:0> = 04h). When the SS

pin is low, transmission and reception are enabled and

the SDO pin is driven. When the SS pin goes high, the

SDO pin is no longer driven, even if in the middle of a

transmitted byte and becomes a floating output.

External pull-up/pull-down resistors may be desirable

depending on the application.

When the SPI module resets, the bit counter is forced

to ‘0’. This can be done by either forcing the SS pin to

a high level or clearing the SSPEN bit.

To emulate two-wire communication, the SDO pin can

be connected to the SDI pin. When the SPI module

needs to operate as a receiver, the SDO pin can be

configured as an input. This disables transmissions

from the SDO. The SDI can always be left as an input

(SDI function) since it cannot create a bus conflict.

FIGURE 16-4: SLAVE SYNCHRONIZATION WAVEFORM

Note 1: When the SPI operation is in Slave mode

with SS pin control enabled

(SSPCON<3:0> = 0100), the SPI module

will reset if the SS pin is set to VDD.

2: If the SPI operation is used in Slave mode

with CKE set, then the SS pin control

must be enabled.

SCK

(CKP = 1

SCK

(CKP = 0

Input

Sample

SDI

bit 7

SDO bit 7 bit 6 bit 7

SSPIF

Interrupt

(SMP = 0)

CKE = 0)

(SMP = 0)

Write to

SSPBUF

SSPSR to

SSPBUF

Flag

bit 0

bit 7

bit 0

Next Q4 Cycle

after Q2↓

PIC18F2X1X/4X1X

FIGURE 16-5: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0)

FIGURE 16-6: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1)

SCK

(CKP = 1

SCK

(CKP = 0

Input

Sample

SDI

bit 7

SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0

SSPIF

Interrupt

(SMP = 0)

CKE = 0)

(SMP = 0)

Write to

SSPBUF

SSPSR to

SSPBUF

Flag

Optional

Next Q4 Cycle

after Q2↓

bit 0

SCK

(CKP = 1

SCK

(CKP = 0

Input

Sample

SDI

bit 7 bit 0

SDO bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0

SSPIF

Interrupt

(SMP = 0)

CKE = 1)

(SMP = 0)

Write to

SSPBUF

SSPSR to

SSPBUF

Flag

Not Optional

Next Q4 Cycle

after Q2↓

bit 7

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 159
PIC18F2X1X/4X1X
16.3.8 OPERATION IN POWER-MANAGED 
MODES
In SPI Master mode, module clocks may be operating
at a different speed than when in full power mode. In
the case of the Sleep mode, all clocks are halted.
In Idle modes, a clock is provided to the peripherals.
That clock should be from the primary clock source, the
secondary clock (Timer1 oscillator at 32.768 kHz) or
the INTOSC source. See Section 2.7 “Clock Sources
and Oscillator Switching” for additional information.
In most cases, the speed that the master clocks SPI
data is not important; however, this should be
evaluated for each system.
If MSSP interrupts are enabled, they can wake the
controller from Sleep mode, or one of the Idle modes,
when the master completes sending data. If an exit
from Sleep or Idle mode is not desired, MSSP
interrupts should be disabled.
If the Sleep mode is selected, all module clocks are
halted and the transmission/reception will remain in
that state until the devices wakes. After the device
returns to Run mode, the module will resume
transmitting and receiving data.
In SPI Slave mode, the SPI Transmit/Receive Shift
register operates asynchronously to the device. This
allows the device to be placed in any power-managed
mode and data to be shifted into the SPI Transmit/
Receive Shift register. When all 8 bits have been
received, the MSSP interrupt flag bit will be set and if
enabled, will wake the device.
16.3.9 EFFECTS OF A RESET
A Reset disables the MSSP module and terminates the
current transfer.
16.3.10 BUS MODE COMPATIBILITY
Table 16-1 shows the compatibility between the
standard SPI modes and the states of the CKP and
CKE control bits. 
TABLE 16-1: SPI BUS MODES          
There is also an SMP bit which controls when the data
is sampled.
TABLE 16-2: REGISTERS ASSOCIATED WITH SPI OPERATION       
Standard SPI Mode 
Terminology
Control Bits State
CKP CKE
0, 0 0 1
0, 1 0 0
1, 0 1 1
1, 1 1 0
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
TRISA TRISA7(2) TRISA6(2) PORTA Data Direction Control Register 52
TRISC PORTC Data Direction Control Register 52
SSPBUF SSP Receive Buffer/Transmit Register 50
SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 50
SSPSTAT SMP CKE D/A P S R/W UA BF 50
Legend: Shaded cells are not used by the MSSP in SPI mode.
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.
2: PORTA<7:6> and their direction bits are individually configured as port pins based on various primary 
oscillator modes. When disabled, these bits read as ‘0’.

PIC18F2X1X/4X1X

16.4 I2C Mode

The MSSP module in I2C mode fully implements all

master and slave functions (including general call

support) and provides interrupts on Start and Stop bits

in hardware to determine a free bus (multi-master

function). The MSSP module implements the standard

mode specifications, as well as 7-bit and 10-bit

addressing.

Two pins are used for data transfer:

• Serial clock (SCL) – RC3/SCK/SCL

• Serial data (SDA) – RC4/SDI/SDA

The user must configure these pins as inputs or outputs

through the TRISC<4:3> bits.

FIGURE 16-7: MSSP BLOCK DIAGRAM

(I2C™ MODE)

16.4.1 REGISTERS

The MSSP module has six registers for I2C operation.

These are:

• MSSP Control Register 1 (SSPCON1)

• MSSP Control Register 2 (SSPCON2)

• MSSP Status Register (SSPSTAT)

• Serial Receive/Transmit Buffer Register

(SSPBUF)

• MSSP Shift Register (SSPSR) – Not directly

accessible

• MSSP Address Register (SSPADD)

SSPCON1, SSPCON2 and SSPSTAT are the control

and status registers in I2C mode operation. The

SSPCON1 and SSPCON2 registers are readable and

writable. The lower 6 bits of the SSPSTAT are read-only.

The upper two bits of the SSPSTAT are read/write.

SSPSR is the shift register used for shifting data in or

out. SSPBUF is the buffer register to which data bytes

are written to or read from.

SSPADD register holds the slave device address when

the SSP is configured in I2C Slave mode. When the

SSP is configured in Master mode, the lower seven bits

of SSPADD act as the Baud Rate Generator reload

value.

In receive operations, SSPSR and SSPBUF together

create a double-buffered receiver. When SSPSR

receives a complete byte, it is transferred to SSPBUF

and the SSPIF interrupt is set.

During transmission, the SSPBUF is not double-

buffered. A write to SSPBUF will write to both SSPBUF

and SSPSR.

Read Write

SSPSR reg

Match Detect

SSPADD reg

Start and

Stop bit Detect

SSPBUF reg

Internal

Data Bus

Addr Match

Set, Reset

S, P bits

(SSPSTAT reg)

RC3/SCK/SCL

RC4/SDI/

Shift

Clock

MSb

SDA LSb

PIC18F2X1X/4X1X

R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0

SMP CKE D/A PSR/WUA BF

bit 7 bit 0

bit 7 SMP: Slew Rate Control bit

In Master or Slave mode:

1 = Slew rate control disabled for Standard Speed mode (100 kHz and 1 MHz)

0 = Slew rate control enabled for High-Speed mode (400 kHz)

bit 6 CKE: SMBus Select bit

In Master or Slave mode:

1 = Enable SMBus specific inputs

0 = Disable SMBus specific inputs

bit 5 D/A: Data/Address bit

In Master mode:

Reserved.

In Slave mode:

1 = Indicates that the last byte received or transmitted was data

0 = Indicates that the last byte received or transmitted was address

bit 4 P: Stop bit

1 = Indicates that a Stop bit has been detected last

0 = Stop bit was not detected last

Note: This bit is cleared on Reset and when SSPEN is cleared.

bit 3 S: Start bit

1 = Indicates that a Start bit has been detected last

0 = Start bit was not detected last

Note: This bit is cleared on Reset and when SSPEN is cleared.

bit 2 R/W: Read/Write bit Information (I2C mode only)

In Slave mode:

1 = Read

0 = Write

Note: This bit holds the R/W bit information following the last address match. This bit is only

valid from the address match to the next Start bit, Stop bit or not ACK bit.

In Master mode:

1 = Transmit is in progress

0 = Transmit is not in progress

Note: ORing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is

in Active mode.

bit 1 UA: Update Address bit (10-Bit Slave mode only)

1 = Indicates that the user needs to update the address in the SSPADD register

0 = Address does not need to be updated

bit 0 BF: Buffer Full Status bit

In Transmit mode:

1 = SSPBUF is full

0 = SSPBUF is empty

In Receive mode:

1 = SSPBUF is full (does not include the ACK and Stop bits)

0 = SSPBUF is empty (does not include the ACK and Stop bits)

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0

bit 7 bit 0

bit 7 WCOL: Write Collision Detect bit

In Master Transmit mode:

1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a

transmission to be started (must be cleared in software)

0 = No collision

In Slave Transmit mode:

1 = The SSPBUF register is written while it is still transmitting the previous word (must be

cleared in software)

0 = No collision

In Receive mode (Master or Slave modes):

This is a “don’t care” bit.

bit 6 SSPOV: Receive Overflow Indicator bit

In Receive mode:

1 = A byte is received while the SSPBUF register is still holding the previous byte (must be

cleared in software)

0 = No overflow

In Transmit mode:

This is a “don’t care” bit in Transmit mode.

bit 5 SSPEN: Synchronous Serial Port Enable bit

1 = Enables the serial port and configures the SDA and SCL pins as the serial port pins

0 = Disables serial port and configures these pins as I/O port pins

Note: When enabled, the SDA and SCL pins must be properly configured as input or

output.

bit 4 CKP: SCK Release Control bit

In Slave mode:

1 = Release clock

0 = Holds clock low (clock stretch), used to ensure data setup time

In Master mode:

Unused in this mode.

bit 3-0 SSPM3:SSPM0: Synchronous Serial Port Mode Select bits

1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled

1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled

1011 = I2C Firmware Controlled Master mode (Slave Idle)

1000 = I2C Master mode, clock = FOSC/(4 * (SSPADD + 1))

0111 = I2C Slave mode, 10-bit address

0110 = I2C Slave mode, 7-bit address

Bit combinations not specifically listed here are either reserved or implemented in SPI mode only.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

GCEN ACKSTAT ACKDT ACKEN(1) RCEN(1) PEN(1) RSEN(1) SEN(1)

bit 7 bit 0

bit 7 GCEN: General Call Enable bit (Slave mode only)

1 = Enable interrupt when a general call address (0000h) is received in the SSPSR

0 = General call address disabled

bit 6 ACKSTAT: Acknowledge Status bit (Master Transmit mode only)

1 = Acknowledge was not received from slave

0 = Acknowledge was received from slave

bit 5 ACKDT: Acknowledge Data bit (Master Receive mode only)

1 = Not Acknowledge

0 = Acknowledge

Note: Value that will be transmitted when the user initiates an Acknowledge sequence at

the end of a receive.

bit 4 ACKEN: Acknowledge Sequence Enable bit (Master Receive mode only)(1)

1 = Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit.

Automatically cleared by hardware.

0 = Acknowledge sequence Idle

bit 3 RCEN: Receive Enable bit (Master mode only)(1)

1 = Enables Receive mode for I2C operation

0 = Receive Idle

bit 2 PEN: Stop Condition Enable bit (Master mode only)(1)

1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware.

0 = Stop condition Idle

bit 1 RSEN: Repeated Start Condition Enable bit (Master mode only)(1)

1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware.

0 = Repeated Start condition Idle

bit 0 SEN: Start Condition Enable/Stretch Enable bit(1)

In Master mode:

1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware.

0 = Start condition Idle

In Slave mode:

1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled)

0 = Clock stretching is disabled

Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode,

these bits may not be set (no spooling) and the SSPBUF may not be written (or

writes to the SSPBUF are disabled).

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

16.4.2 OPERATION

The MSSP module functions are enabled by setting

MSSP Enable bit, SSPEN (SSPCON<5>).

The SSPCON1 register allows control of the I2C

operation. Four mode selection bits (SSPCON<3:0>)

allow one of the following I2C modes to be selected:

•I

2C Master mode clock

•I

2C Slave mode (7-bit address)

•I

2C Slave mode (10-bit address)

•I

2C Slave mode (7-bit address) with Start and

Stop bit interrupts enabled

•I

2C Slave mode (10-bit address) with Start and

Stop bit interrupts enabled

•I

2C Firmware Controlled Master mode, slave is

Idle

Selection of any I2C mode with the SSPEN bit set,

forces the SCL and SDA pins to be open-drain,

provided these pins are programmed to inputs by

setting the appropriate TRISC bits. To ensure proper

operation of the module, pull-up resistors must be

provided externally to the SCL and SDA pins.

16.4.3 SLAVE MODE

In Slave mode, the SCL and SDA pins must be config-

ured as inputs (TRISC<4:3> set). The MSSP module

will override the input state with the output data when

required (slave-transmitter).

The I2C Slave mode hardware will always generate an

interrupt on an address match. Through the mode

select bits, the user can also choose to interrupt on

Start and Stop bits

When an address is matched, or the data transfer after

an address match is received, the hardware automati-

cally will generate the Acknowledge (ACK) pulse and

load the SSPBUF register with the received value

currently in the SSPSR register.

Any combination of the following conditions will cause

the MSSP module not to give this ACK pulse:

• The Buffer Full bit, BF (SSPSTAT<0>), was set

before the transfer was received.

• The overflow bit, SSPOV (SSPCON<6>), was set

before the transfer was received.

In this case, the SSPSR register value is not loaded

into the SSPBUF, but bit SSPIF (PIR1<3>) is set. The

BF bit is cleared by reading the SSPBUF register, while

bit SSPOV is cleared through software.

The SCL clock input must have a minimum high and

low for proper operation. The high and low times of the

I2C specification, as well as the requirement of the

MSSP module, are shown in timing parameter 100 and

parameter 101.

16.4.3.1 Addressing

Once the MSSP module has been enabled, it waits for

a Start condition to occur. Following the Start condition,

the 8-bits are shifted into the SSPSR register. All

incoming bits are sampled with the rising edge of the

clock (SCL) line. The value of register SSPSR<7:1> is

compared to the value of the SSPADD register. The

address is compared on the falling edge of the eighth

clock (SCL) pulse. If the addresses match and the BF

and SSPOV bits are clear, the following events occur:

1. The SSPSR register value is loaded into the

SSPBUF register.

2. The Buffer Full bit, BF, is set.

3. An ACK pulse is generated.

4. MSSP Interrupt Flag bit, SSPIF (PIR1<3>), is

set (interrupt is generated, if enabled) on the

falling edge of the ninth SCL pulse.

In 10-Bit Address mode, two address bytes need to be

received by the slave. The five Most Significant bits

(MSbs) of the first address byte specify if this is a 10-bit

address. Bit R/W (SSPSTAT<2>) must specify a write so

the slave device will receive the second address byte.

For a 10-bit address, the first byte would equal ‘11110

A9 A8 0’, where ‘A9’ and ‘A8’ are the two MSbs of the

address. The sequence of events for 10-bit address is as

follows, with steps 7 through 9 for the slave-transmitter:

1. Receive first (high) byte of address (bits SSPIF,

BF and UA (SSPSTAT<1>) are set).

2. Update the SSPADD register with second (low)

byte of address (clears bit UA and releases the

SCL line).

3. Read the SSPBUF register (clears bit BF) and

clear flag bit SSPIF.

4. Receive second (low) byte of address (bits

SSPIF, BF and UA are set).

5. Update the SSPADD register with the first (high)

byte of address. If match releases SCL line, this

will clear bit UA.

6. Read the SSPBUF register (clears bit BF) and

clear flag bit SSPIF.

7. Receive Repeated Start condition.

8. Receive first (high) byte of address (bits SSPIF

and BF are set).

9. Read the SSPBUF register (clears bit BF) and

clear flag bit SSPIF.

PIC18F2X1X/4X1X

16.4.3.2 Reception

When the R/W bit of the address byte is clear and an

address match occurs, the R/W bit of the SSPSTAT

the SSPBUF register and the SDA line is held low

(ACK).

When the address byte overflow condition exists, then

the no Acknowledge (ACK) pulse is given. An overflow

condition is defined as either bit BF (SSPSTAT<0>) is

set, or bit SSPOV (SSPCON1<6>) is set.

An MSSP interrupt is generated for each data transfer

byte. Flag bit, SSPIF (PIR1<3>), must be cleared in

software. The SSPSTAT register is used to determine

the status of the byte.

If SEN is enabled (SSPCON2<0> = 1), RC3/SCK/SCL

will be held low (clock stretch) following each data

transfer. The clock must be released by setting bit CKP

(SSPCON<4>). See Section 16.4.4 “Clock Stretching”

for more detail.

16.4.3.3 Transmission

When the R/W bit of the incoming address byte is set

and an address match occurs, the R/W bit of the

SSPSTAT register is set. The received address is

loaded into the SSPBUF register. The ACK pulse will

be sent on the ninth bit and pin RC3/SCK/SCL is held

low regardless of SEN (see Section 16.4.4 “Clock

Stretching” for more detail). By stretching the clock,

the master will be unable to assert another clock pulse

until the slave is done preparing the transmit data. The

transmit data must be loaded into the SSPBUF register

which also loads the SSPSR register. Then pin RC3/

SCK/SCL should be enabled by setting bit CKP

(SSPCON1<4>). The eight data bits are shifted out on

the falling edge of the SCL input. This ensures that the

SDA signal is valid during the SCL high time

(Figure 16-9).

The ACK pulse from the master-receiver is latched on

the rising edge of the ninth SCL input pulse. If the SDA

line is high (not ACK), then the data transfer is com-

plete. In this case, when the ACK is latched by the

slave, the slave logic is reset (resets SSPSTAT regis-

ter) and the slave monitors for another occurrence of

the Start bit. If the SDA line was low (ACK), the next

transmit data must be loaded into the SSPBUF register.

Again, pin RC3/SCK/SCL must be enabled by setting

bit CKP.

An MSSP interrupt is generated for each data transfer

byte. The SSPIF bit must be cleared in software and

the SSPSTAT register is used to determine the status

of the byte. The SSPIF bit is set on the falling edge of

the ninth clock pulse.

PIC18F2X1X/4X1X

FIGURE 16-8: I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 7-BIT ADDRESS)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

SSPOV (SSPCON1<6>)

S1234567891 2345678912345 789 P

A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0

ACK

Receiving Data

ACK

Receiving Data

R/W = 0

ACK

Receiving Address

Cleared in software

SSPBUF is read

Bus master

terminates

transfer

SSPOV is set

because SSPBUF is

still full. ACK is not sent.

(PIR1<3>)

CKP (CKP does not reset to ‘0’ when SEN = ‘0’)

PIC18F2X1X/4X1X

FIGURE 16-9: I2C™ SLAVE MODE TIMING (TRANSMISSION, 7-BIT ADDRESS)

SDA

SCL

SSPIF (PIR1<3>)

(SSPSTAT<0>)

A6 A5 A4 A3 A2 A1 D6 D5 D4 D3 D2 D1 D0

1 2 3 4 5 6 7 8 2 3 4 5 6 7 8 9

SSPBUF is written in software

Cleared in software

From SSPIF ISR

Data in

sampled

ACK

Transmitting Data

R/W = 0

ACK

Receiving Address

A7 D7

9 1

D6 D5 D4 D3 D2 D1 D0

2 3 4 5 6 7 8 9

SSPBUF is written in software

Cleared in software

From SSPIF ISR

Transmitting Data

CKP

ACK

CKP is set in software CKP is set in software

SCL held low

while CPU

responds to SSPIF

PIC18F2X1X/4X1X

FIGURE 16-10: I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 10-BIT ADDRESS)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

S123456789 123456789 12345 789 P

1 1 1 1 0 A9A8 A7 A6A5A4A3A2A1A0 D7 D6D5D4D3 D1D0

Receive Data Byte

ACK

R/W = 0

ACK

Receive First Byte of Address

Cleared in software

(PIR1<3>)

Cleared in software

Receive Second Byte of Address

Cleared by hardware

when SSPADD is updated

with low byte of address

UA (SSPSTAT<1>)

Clock is held low until

update of SSPADD has

taken place

UA is set indicating that

the SSPADD needs to be

updated

UA is set indicating that

SSPADD needs to be

updated

Cleared by hardware when

SSPADD is updated with high

byte of address

SSPBUF is written with

contents of SSPSR

Dummy read of SSPBUF

to clear BF flag

ACK

CKP

12345 789

D7 D6 D5 D4 D3 D1 D0

Receive Data Byte

Bus master

terminates

transfer

ACK

Cleared in software Cleared in software

SSPOV (SSPCON1<6>)

SSPOV is set

because SSPBUF is

still full. ACK is not sent.

(CKP does not reset to ‘0’ when SEN = 0)

Clock is held low until

update of SSPADD has

taken place

PIC18F2X1X/4X1X

FIGURE 16-11: I2C™ SLAVE MODE TIMING (TRANSMISSION, 10-BIT ADDRESS)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

S1234 5 6789 1 23 45 678 9 12345 7 89 P

1 1 1 1 0 A9A8 A7 A6A5A4A3A2A1 A0 1 1 1 1 0 A8

R/W=1

ACK

R/W = 0

ACK

Receive First Byte of Address

Cleared in software

Bus master

terminates

transfer

(PIR1<3>)

Receive Second Byte of Address

Cleared by hardware when

SSPADD is updated with low

byte of address

UA (SSPSTAT<1>)

Clock is held low until

update of SSPADD has

taken place

UA is set indicating that

the SSPADD needs to be

updated

UA is set indicating that

SSPADD needs to be

updated

Cleared by hardware when

SSPADD is updated with high

byte of address.

SSPBUF is written with

contents of SSPSR

Dummy read of SSPBUF

to clear BF flag

Receive First Byte of Address

12345 789

D7 D6 D5 D4 D3 D1

ACK

Transmitting Data Byte

Dummy read of SSPBUF

to clear BF flag

Cleared in software

Write of SSPBUF

initiates transmit

Cleared in software

Completion of

clears BF flag

CKP (SSPCON1<4>)

CKP is set in software

CKP is automatically cleared in hardware, holding SCL low

Clock is held low until

update of SSPADD has

taken place

data transmission

Clock is held low until

CKP is set to ‘1’

BF flag is clear

third address sequence

at the end of the

PIC18F2X1X/4X1X

16.4.4 CLOCK STRETCHING

Both 7-bit and 10-Bit Slave modes implement

automatic clock stretching during a transmit sequence.

The SEN bit (SSPCON2<0>) allows clock stretching to

be enabled during receives. Setting SEN will cause

the SCL pin to be held low at the end of each data

receive sequence.

16.4.4.1 Clock Stretching for 7-Bit Slave

Receive Mode (SEN = 1)

In 7-Bit Slave Receive mode, on the falling edge of the

ninth clock at the end of the ACK sequence if the BF

bit is set, the CKP bit in the SSPCON1 register is

automatically cleared, forcing the SCL output to be

held low. The CKP being cleared to ‘0’ will assert the

SCL line low. The CKP bit must be set in the user’s

ISR before reception is allowed to continue. By holding

the SCL line low, the user has time to service the ISR

and read the contents of the SSPBUF before the

master device can initiate another receive sequence.

This will prevent buffer overruns from occurring (see

Figure 16-13).

16.4.4.2 Clock Stretching for 10-Bit Slave

Receive Mode (SEN = 1)

In 10-Bit Slave Receive mode during the address

sequence, clock stretching automatically takes place

but CKP is not cleared. During this time, if the UA bit is

set after the ninth clock, clock stretching is initiated.

The UA bit is set after receiving the upper byte of the

10-bit address and following the receive of the second

byte of the 10-bit address with the R/W bit cleared to

‘0’. The release of the clock line occurs upon updating

SSPADD. Clock stretching will occur on each data

receive sequence as described in 7-Bit Slave mode.

16.4.4.3 Clock Stretching for 7-Bit Slave

Transmit Mode

7-Bit Slave Transmit mode implements clock stretch-

ing by clearing the CKP bit after the falling edge of the

ninth clock if the BF bit is clear. This occurs regardless

of the state of the SEN bit.

The user’s ISR must set the CKP bit before transmis-

sion is allowed to continue. By holding the SCL line

low, the user has time to service the ISR and load the

contents of the SSPBUF before the master device can

initiate another transmit sequence (see Figure 16-9).

16.4.4.4 Clock Stretching for 10-Bit Slave

Transmit Mode

In 10-Bit Slave Transmit mode, clock stretching is

controlled during the first two address sequences by

the state of the UA bit, just as it is in 10-Bit Slave

Receive mode. The first two addresses are followed

by a third address sequence which contains the high-

order bits of the 10-bit address and the R/W bit set to

‘1’. After the third address sequence is performed, the

UA bit is not set, the module is now configured in

Transmit mode and clock stretching is controlled by

the BF flag as in 7-Bit Slave Transmit mode (see

Figure 16-11).

Note 1: If the user reads the contents of the

SSPBUF before the falling edge of the

ninth clock, thus clearing the BF bit, the

CKP bit will not be cleared and clock

stretching will not occur.

2: The CKP bit can be set in software

regardless of the state of the BF bit. The

user should be careful to clear the BF bit

in the ISR before the next receive

sequence in order to prevent an overflow

condition.

Note: If the user polls the UA bit and clears it by

updating the SSPADD register before the

falling edge of the ninth clock occurs and if

the user hasn’t cleared the BF bit by read-

ing the SSPBUF register before that time,

then the CKP bit will still NOT be asserted

low. Clock stretching on the basis of the

state of the BF bit only occurs during a

data sequence, not an address sequence.

Note 1: If the user loads the contents of SSPBUF,

setting the BF bit before the falling edge of

the ninth clock, the CKP bit will not be

cleared and clock stretching will not occur.

2: The CKP bit can be set in software

regardless of the state of the BF bit.

PIC18F2X1X/4X1X

16.4.4.5 Clock Synchronization and

the CKP bit

When the CKP bit is cleared, the SCL output is forced

to ‘0’. However, clearing the CKP bit will not assert the

SCL output low until the SCL output is already

sampled low. Therefore, the CKP bit will not assert the

SCL line until an external I2C master device has

already asserted the SCL line. The SCL output will

remain low until the CKP bit is set and all other

devices on the I2C bus have deasserted SCL. This

ensures that a write to the CKP bit will not violate the

minimum high time requirement for SCL (see

Figure 16-12).

FIGURE 16-12: CLOCK SYNCHRONIZATION TIMING

SDA

SCL

DX – 1DX

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

SSPCON

CKP

Master device

deasserts clock

Master device

asserts clock

PIC18F2X1X/4X1X

FIGURE 16-13: I2C™ SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 7-BIT ADDRESS)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

SSPOV (SSPCON1<6>)

S1 2 345 6 7 89 1 234 5 67 89 1 23 45 7 89 P

A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0

ACK

Receiving Data

ACK

Receiving Data

R/W = 0

ACK

Receiving Address

Cleared in software

SSPBUF is read

Bus master

terminates

transfer

SSPOV is set

because SSPBUF is

still full. ACK is not sent.

(PIR1<3>)

CKP

written

to ‘1’ in

If BF is cleared

prior to the falling

edge of the 9th clock,

CKP will not be reset

to ‘0’ and no clock

stretching will occur

software

Clock is held low until

CKP is set to ‘1’

Clock is not held low

because buffer full bit is

clear prior to falling edge

of 9th clock

Clock is not held low

because ACK =

BF is set after falling

edge of the 9th clock,

CKP is reset to ‘0’ and

clock stretching occurs

PIC18F2X1X/4X1X

FIGURE 16-14: I2C™ SLAVE MODE TIMING SEN = 1 (RECEPTION, 10-BIT ADDRESS)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

S123456789 123456789 12345 789 P

1 1 1 1 0 A9A8 A7 A6A5A4A3A2A1A0 D7D6D5D4D3 D1D0

Receive Data Byte

ACK

R/W = 0

ACK

Receive First Byte of Address

Cleared in software

(PIR1<3>)

Cleared in software

Receive Second Byte of Address

Cleared by hardware when

SSPADD is updated with low

byte of address after falling edge

UA (SSPSTAT<1>)

Clock is held low until

update of SSPADD has

taken place

UA is set indicating that

the SSPADD needs to be

updated

UA is set indicating that

SSPADD needs to be

updated

Cleared by hardware when

SSPADD is updated with high

byte of address after falling edge

SSPBUF is written with

contents of SSPSR

Dummy read of SSPBUF

to clear BF flag

ACK

CKP

12345 789

D7 D6 D5 D4 D3 D1 D0

Receive Data Byte

Bus master

terminates

transfer

ACK

Cleared in software Cleared in software

SSPOV (SSPCON1<6>)

CKP written to

‘

’

Note: An update of the SSPADD register before

the falling edge of the ninth clock will have

no effect on UA and UA will remain set.

Note: An update of the SSPADD

edge of the ninth clock will

have no effect on UA and

UA will remain set.

in software

Clock is held low until

update of SSPADD has

taken place

of ninth clock

SSPOV is set

because SSPBUF is

still full. ACK is not sent.

Dummy read of SSPBUF

to clear BF flag

Clock is held low until

CKP is set to

‘

’

Clock is not held low

because ACK =

PIC18F2X1X/4X1X

16.4.5 GENERAL CALL ADDRESS

SUPPORT

The addressing procedure for the I2C bus is such that

the first byte after the Start condition usually deter-

mines which device will be the slave addressed by the

master. The exception is the general call address which

can address all devices. When this address is used, all

devices should, in theory, respond with an

Acknowledge.

The general call address is one of eight addresses

reserved for specific purposes by the I2C protocol. It

consists of all ‘0’s with R/W = 0.

The general call address is recognized when the

General Call Enable bit (GCEN) is enabled

(SSPCON2<7> set). Following a Start bit detect, 8 bits

are shifted into the SSPSR and the address is

compared against the SSPADD. It is also compared to

the general call address and fixed in hardware.

If the general call address matches, the SSPSR is

transferred to the SSPBUF, the BF flag bit is set (eighth

bit) and on the falling edge of the ninth bit (ACK bit), the

SSPIF interrupt flag bit is set.

When the interrupt is serviced, the source for the

interrupt can be checked by reading the contents of the

SSPBUF. The value can be used to determine if the

address was device specific or a general call address.

In 10-Bit Address mode, the SSPADD is required to be

updated for the second half of the address to match

and the UA bit is set (SSPSTAT<1>). If the general call

address is sampled when the GCEN bit is set, while the

slave is configured in 10-Bit Address mode, then the

second half of the address is not necessary, the UA bit

will not be set and the slave will begin receiving data

after the Acknowledge (Figure 16-15).

FIGURE 16-15: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE

(7 OR 10-BIT ADDRESS MODE)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

SSPOV (SSPCON1<6>)

Cleared in software

SSPBUF is read

R/W = 0

ACK

General Call Address

Address is compared to General Call Address

GCEN (SSPCON2<7>)

Receiving Data ACK

123456789123456789

D7 D6 D5 D4 D3 D2 D1 D0

after ACK, set interrupt

‘0’

‘1’

PIC18F2X1X/4X1X

16.4.6 MASTER MODE

Master mode is enabled by setting and clearing the

appropriate SSPM bits in SSPCON1 and by setting the

SSPEN bit. In Master mode, the SCL and SDA lines

are manipulated by the MSSP hardware.

Master mode of operation is supported by interrupt

generation on the detection of the Start and Stop

conditions. The Stop (P) and Start (S) bits are cleared

from a Reset or when the MSSP module is disabled.

Control of the I2C bus may be taken when the P bit is

set, or the bus is Idle, with both the S and P bits clear.

In Firmware Controlled Master mode, user code

conducts all I2C bus operations based on Start and

Stop bit conditions.

Once Master mode is enabled, the user has six

options.

1. Assert a Start condition on SDA and SCL.

2. Assert a Repeated Start condition on SDA and

SCL.

3. Write to the SSPBUF register initiating

transmission of data/address.

4. Configure the I2C port to receive data.

5. Generate an Acknowledge condition at the end

of a received byte of data.

6. Generate a Stop condition on SDA and SCL.

The following events will cause the SSP Interrupt Flag

bit, SSPIF, to be set (SSP interrupt, if enabled):

• Start condition

• Stop condition

• Data transfer byte transmitted/received

• Acknowledge transmit

• Repeated Start

FIGURE 16-16: MSSP BLOCK DIAGRAM (I2C™ MASTER MODE)

Note: The MSSP module, when configured in

I2C Master mode, does not allow queueing

of events. For instance, the user is not

allowed to initiate a Start condition and

immediately write the SSPBUF register to

initiate transmission before the Start condi-

tion is complete. In this case, the SSPBUF

will not be written to and the WCOL bit will

be set, indicating that a write to the

SSPBUF did not occur.

Read Write

SSPSR

Start bit, Stop bit,

SSPBUF

Internal

Data Bus

Set/Reset, S, P, WCOL (SSPSTAT)

Shift

Clock

MSb LSb

SDA

Acknowledge

Generate

Stop bit Detect

Write Collision Detect

Clock Arbitration

State Counter for

end of XMIT/RCV

SCL

SCL In

Bus Collision

SDA In

Receive Enable

Clock Cntl

Clock Arbitrate/WCOL Detect

(hold off clock source)

SSPADD<6:0>

Baud

Set SSPIF, BCLIF

Reset ACKSTAT, PEN (SSPCON2)

Rate

Generator

SSPM3:SSPM0

Start bit Detect

PIC18F2X1X/4X1X

16.4.6.1 I2C Master Mode Operation

The master device generates all of the serial clock

pulses and the Start and Stop conditions. A transfer is

ended with a Stop condition or with a Repeated Start

condition. Since the Repeated Start condition is also

the beginning of the next serial transfer, the I2C bus will

not be released.

In Master Transmitter mode, serial data is output

through SDA, while SCL outputs the serial clock. The

first byte transmitted contains the slave address of the

receiving device (7 bits) and the Read/Write (R/W) bit.

In this case, the R/W bit will be logic ‘0’. Serial data is

transmitted 8 bits at a time. After each byte is transmit-

ted, an Acknowledge bit is received. Start and Stop

conditions are output to indicate the beginning and the

end of a serial transfer.

In Master Receive mode, the first byte transmitted

contains the slave address of the transmitting device

(7 bits) and the R/W bit. In this case, the R/W bit will be

logic ‘1’. Thus, the first byte transmitted is a 7-bit slave

address followed by a ‘1’ to indicate the receive bit.

Serial data is received via SDA, while SCL outputs the

serial clock. Serial data is received 8 bits at a time. After

each byte is received, an Acknowledge bit is transmit-

ted. Start and Stop conditions indicate the beginning

and end of transmission.

The Baud Rate Generator used for the SPI mode oper-

ation is used to set the SCL clock frequency for either

100 kHz, 400 kHz or 1 MHz I2C operation. See

Section 16.4.7 “Baud Rate” for more detail.

A typical transmit sequence would go as follows:

1. The user generates a Start condition by setting

the Start Enable bit, SEN (SSPCON2<0>).

2. SSPIF is set. The MSSP module will wait the

required start time before any other operation

takes place.

3. The user loads the SSPBUF with the slave

address to transmit.

4. Address is shifted out the SDA pin until all 8 bits

are transmitted.

5. The MSSP module shifts in the ACK bit from the

slave device and writes its value into the

SSPCON2 register (SSPCON2<6>).

6. The MSSP module generates an interrupt at the

end of the ninth clock cycle by setting the SSPIF

bit.

7. The user loads the SSPBUF with eight bits of

data.

8. Data is shifted out the SDA pin until all 8 bits are

transmitted.

9. The MSSP module shifts in the ACK bit from the

slave device and writes its value into the

SSPCON2 register (SSPCON2<6>).

10. The MSSP module generates an interrupt at the

end of the ninth clock cycle by setting the SSPIF

bit.

11. The user generates a Stop condition by setting

the Stop Enable bit, PEN (SSPCON2<2>).

12. Interrupt is generated once the Stop condition is

complete.

PIC18F2X1X/4X1X

16.4.7 BAUD RATE

In I2C Master mode, the Baud Rate Generator (BRG)

reload value is placed in the lower 7 bits of the

SSPADD register (Figure 16-17). When a write occurs

to SSPBUF, the Baud Rate Generator will automatically

begin counting. The BRG counts down to ‘0’ and stops

until another reload has taken place. The BRG count is

decremented twice per instruction cycle (T

CY) on the

Q2 and Q4 clocks. In I2C Master mode, the BRG is

reloaded automatically.

Once the given operation is complete (i.e., transmis-

sion of the last data bit is followed by ACK), the internal

clock will automatically stop counting and the SCL pin

will remain in its last state.

Table 16-3 demonstrates clock rates based on

instruction cycles and the BRG value loaded into

SSPADD.

FIGURE 16-17: BAUD RATE GENERATOR BLOCK DIAGRAM

TABLE 16-3: I2C™ CLOCK RATE W/BRG

SSPM3:SSPM0

BRG Down Counter

CLKO FOSC/4

SSPADD<6:0>

SSPM3:SSPM0

SCL

Reload

Control

Reload

FOSC FCY FCY * 2 BRG Value FSCL

(2 Rollovers of BRG)

40 MHz 10 MHz 20 MHz 18h 400 kHz(1)

40 MHz 10 MHz 20 MHz 1Fh 312.5 kHz

40 MHz 10 MHz 20 MHz 63h 100 kHz

16 MHz 4 MHz 8 MHz 09h 400 kHz(1)

16 MHz 4 MHz 8 MHz 0Ch 308 kHz

16 MHz 4 MHz 8 MHz 27h 100 kHz

4 MHz 1 MHz 2 MHz 02h 333 kHz(1)

4 MHz 1 MHz 2 MHz 09h 100 kHz

4 MHz 1 MHz 2 MHz 00h 1 MHz(1)

Note 1: The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than

100 kHz) in all details, but may be used with care where higher rates are required by the application.

PIC18F2X1X/4X1X

16.4.7.1 Clock Arbitration

Clock arbitration occurs when the master, during any

receive, transmit or Repeated Start/Stop condition,

deasserts the SCL pin (SCL allowed to float high).

When the SCL pin is allowed to float high, the Baud

Rate Generator (BRG) is suspended from counting

until the SCL pin is actually sampled high. When the

SCL pin is sampled high, the Baud Rate Generator is

reloaded with the contents of SSPADD<6:0> and

begins counting. This ensures that the SCL high time

will always be at least one BRG rollover count in the

event that the clock is held low by an external device

(Figure 16-18).

FIGURE 16-18: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION

SDA

SCL

SCL deasserted but slave holds

DX – 1DX

BRG

SCL is sampled high, reload takes

place and BRG starts its count

03h 02h 01h 00h (hold off) 03h 02h

Reload

BRG

Value

SCL low (clock arbitration)

SCL allowed to transition high

BRG decrements on

Q2 and Q4 cycles

PIC18F2X1X/4X1X

16.4.8 I2C MASTER MODE START

CONDITION TIMING

To initiate a Start condition, the user sets the Start

Enable bit, SEN (SSPCON2<0>). If the SDA and SCL

pins are sampled high, the Baud Rate Generator is

reloaded with the contents of SSPADD<6:0> and starts

its count. If SCL and SDA are both sampled high when

the Baud Rate Generator times out (TBRG), the SDA

pin is driven low. The action of the SDA being driven

low while SCL is high is the Start condition and causes

the S bit (SSPSTAT<3>) to be set. Following this, the

Baud Rate Generator is reloaded with the contents of

SSPADD<6:0> and resumes its count. When the Baud

Rate Generator times out (TBRG), the SEN bit

(SSPCON2<0>) will be automatically cleared by

hardware; the Baud Rate Generator is suspended,

leaving the SDA line held low and the Start condition is

complete.

16.4.8.1 WCOL Status Flag

If the user writes the SSPBUF when a Start sequence

is in progress, the WCOL is set and the contents of the

buffer are unchanged (the write doesn’t occur).

FIGURE 16-19: FIRST START BIT TIMING

Note: If at the beginning of the Start condition,

the SDA and SCL pins are already sam-

pled low, or if during the Start condition, the

SCL line is sampled low before the SDA

line is driven low, a bus collision occurs,

the Bus Collision Interrupt Flag, BCLIF, is

set, the Start condition is aborted and the

I2C module is reset into its Idle state.

Note: Because queueing of events is not

allowed, writing to the lower 5 bits of

SSPCON2 is disabled until the Start

condition is complete.

SDA

SCL

TBRG

1st bit 2nd bit

TBRG

SDA = 1, At completion of Start bit,

SCL = 1

Write to SSPBUF occurs here

TBRG

hardware clears SEN bit

TBRG

Write to SEN bit occurs here Set S bit (SSPSTAT<3>)

and sets SSPIF bit

PIC18F2X1X/4X1X

16.4.9 I2C MASTER MODE REPEATED

START CONDITION TIMING

A Repeated Start condition occurs when the RSEN bit

(SSPCON2<1>) is programmed high and the I2C logic

module is in the Idle state. When the RSEN bit is set,

the SCL pin is asserted low. When the SCL pin is sam-

pled low, the Baud Rate Generator is loaded with the

contents of SSPADD<5:0> and begins counting. The

SDA pin is released (brought high) for one Baud Rate

Generator count (TBRG). When the Baud Rate Genera-

tor times out, if SDA is sampled high, the SCL pin will

be deasserted (brought high). When SCL is sampled

high, the Baud Rate Generator is reloaded with the

contents of SSPADD<6:0> and begins counting. SDA

and SCL must be sampled high for one TBRG. This

action is then followed by assertion of the SDA pin

(SDA = 0) for one TBRG while SCL is high. Following

this, the RSEN bit (SSPCON2<1>) will be automatically

cleared and the Baud Rate Generator will not be

reloaded, leaving the SDA pin held low. As soon as a

Start condition is detected on the SDA and SCL pins,

the S bit (SSPSTAT<3>) will be set. The SSPIF bit will

not be set until the Baud Rate Generator has timed out.

Immediately following the SSPIF bit getting set, the user

may write the SSPBUF with the 7-bit address in 7-Bit

Address mode or the default first address in 10-Bit

Address mode. After the first eight bits are transmitted

and an ACK is received, the user may then transmit an

additional eight bits of address (10-Bit Address mode) or

eight bits of data (7-Bit Address mode).

16.4.9.1 WCOL Status Flag

If the user writes the SSPBUF when a Repeated Start

sequence is in progress, the WCOL is set and the

contents of the buffer are unchanged (the write doesn’t

occur).

FIGURE 16-20: REPEAT START CONDITION WAVEFORM

Note 1: If RSEN is programmed while any other

event is in progress, it will not take effect.

2: A bus collision during the Repeated Start

condition occurs if:

• SDA is sampled low when SCL goes

from low-to-high.

• SCL goes low before SDA is

asserted low. This may indicate that

another master is attempting to

transmit a data ‘1’.

Note: Because queueing of events is not

allowed, writing of the lower 5 bits of

SSPCON2 is disabled until the Repeated

Start condition is complete.

SDA

SCL

Sr = Repeated Start

Write to SSPCON2

Write to SSPBUF occurs here

on falling edge of ninth clock,

end of Xmit

At completion of Start bit,

hardware clears RSEN bit

1st bit

S bit set by hardware

TBRG

SDA = 1,

SCL (no change).

SCL = 1

occurs here.

TBRG TBRG TBRG

and sets SSPIF

RSEN bit set by hardware

PIC18F2X1X/4X1X

16.4.10 I2C MASTER MODE

TRANSMISSION

Transmission of a data byte, a 7-bit address or the

other half of a 10-bit address is accomplished by simply

writing a value to the SSPBUF register. This action will

set the Buffer Full flag bit, BF and allow the Baud Rate

Generator to begin counting and start the next trans-

mission. Each bit of address/data will be shifted out

onto the SDA pin after the falling edge of SCL is

asserted (see data hold time specification

parameter 106). SCL is held low for one Baud Rate

Generator rollover count (TBRG). Data should be valid

before SCL is released high (see data setup time spec-

ification parameter 107). When the SCL pin is released

high, it is held that way for TBRG. The data on the SDA

pin must remain stable for that duration and some hold

time after the next falling edge of SCL. After the eighth

bit is shifted out (the falling edge of the eighth clock),

the BF flag is cleared and the master releases SDA.

This allows the slave device being addressed to

respond with an ACK bit during the ninth bit time if an

address match occurred, or if data was received

properly. The status of ACK is written into the ACKDT

bit on the falling edge of the ninth clock. If the master

receives an Acknowledge, the Acknowledge Status bit,

ACKSTAT, is cleared. If not, the bit is set. After the ninth

clock, the SSPIF bit is set and the master clock (Baud

Rate Generator) is suspended until the next data byte

is loaded into the SSPBUF, leaving SCL low and SDA

unchanged (Figure 16-21).

After the write to the SSPBUF, each bit of the address

will be shifted out on the falling edge of SCL until all

seven address bits and the R/W bit are completed. On

the falling edge of the eighth clock, the master will

deassert the SDA pin, allowing the slave to respond

with an Acknowledge. On the falling edge of the ninth

clock, the master will sample the SDA pin to see if the

address was recognized by a slave. The status of the

ACK bit is loaded into the ACKSTAT status bit

(SSPCON2<6>). Following the falling edge of the ninth

clock transmission of the address, the SSPIF is set, the

BF flag is cleared and the Baud Rate Generator is

turned off until another write to the SSPBUF takes

place, holding SCL low and allowing SDA to float.

16.4.10.1 BF Status Flag

In Transmit mode, the BF bit (SSPSTAT<0>) is set

when the CPU writes to SSPBUF and is cleared when

all 8 bits are shifted out.

16.4.10.2 WCOL Status Flag

If the user writes the SSPBUF when a transmit is

already in progress (i.e., SSPSR is still shifting out a

data byte), the WCOL is set and the contents of the

buffer are unchanged (the write doesn’t occur).

WCOL must be cleared in software.

16.4.10.3 ACKSTAT Status Flag

In Transmit mode, the ACKSTAT bit (SSPCON2<6>) is

cleared when the slave has sent an Acknowledge

(ACK =0) and is set when the slave does not Acknowl-

edge (ACK = 1). A slave sends an Acknowledge when

it has recognized its address (including a general call),

or when the slave has properly received its data.

16.4.11 I2C MASTER MODE RECEPTION

Master mode reception is enabled by programming the

Receive Enable bit, RCEN (SSPCON2<3>).

The Baud Rate Generator begins counting and on each

rollover, the state of the SCL pin changes (high-to-low/

low-to-high) and data is shifted into the SSPSR. After

the falling edge of the eighth clock, the receive enable

flag is automatically cleared, the contents of the

SSPSR are loaded into the SSPBUF, the BF flag bit is

set, the SSPIF flag bit is set and the Baud Rate Gener-

ator is suspended from counting, holding SCL low. The

MSSP is now in Idle state awaiting the next command.

When the buffer is read by the CPU, the BF flag bit is

automatically cleared. The user can then send an

Acknowledge bit at the end of reception by setting the

Acknowledge Sequence Enable bit, ACKEN

(SSPCON2<4>).

16.4.11.1 BF Status Flag

In receive operation, the BF bit is set when an address

or data byte is loaded into SSPBUF from SSPSR. It is

cleared when the SSPBUF register is read.

16.4.11.2 SSPOV Status Flag

In receive operation, the SSPOV bit is set when 8 bits

are received into the SSPSR and the BF flag bit is

already set from a previous reception.

16.4.11.3 WCOL Status Flag

If the user writes the SSPBUF when a receive is

already in progress (i.e., SSPSR is still shifting in a data

byte), the WCOL bit is set and the contents of the buffer

are unchanged (the write doesn’t occur).

Note: The MSSP module must be in an Idle state

before the RCEN bit is set or the RCEN bit

will be disregarded.

PIC18F2X1X/4X1X

FIGURE 16-21: I2C™ MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

SEN

A7 A6 A5 A4 A3 A2 A1 ACK = ‘0’ D7D6D5D4D3D2D1D0

ACK

Transmitting Data or Second Half

R/W = 0

Transmit Address to Slave

123456789 123456789 P

Cleared in software service routine

SSPBUF is written in software

from SSP interrupt

After Start condition, SEN cleared by hardware

SSPBUF written with 7-bit address and R/W,

start transmit

SCL held low

while CPU

responds to SSPIF

SEN = 0

of 10-bit Address

Write SSPCON2<0> SEN = 1

Start condition begins From slave, clear ACKSTAT bit SSPCON2<6>

ACKSTAT in

SSPCON2 = 1

Cleared in software

SSPBUF written

PEN

R/W

Cleared in software

PIC18F2X1X/4X1X

FIGURE 16-22: I2C™ MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS)

D3D4

D6D7

A7 A6 A5 A4 A3 A2 A1

SDA

SCL 12

345678912345 678 9 12 3 4

Bus master

terminates

transfer

ACK

Receiving Data from Slave

D3D4

D6D7

ACK

R/W = 0

Transmit Address to Slave

SSPIF

ACK is not sent

Write to SSPCON2<0> (SEN = 1)

Write to SSPBUF occurs here, ACK from Slave

Master configured as a receiver

by programming SSPCON2<3> (RCEN = 1)

PEN bit = 1

written here

Data shifted in on falling edge of CLK

Cleared in software

start XMIT

SEN = 0

SSPOV

SDA = 0, SCL = 1

while CPU

(SSPSTAT<0>)

ACK

Cleared in software

Set SSPIF interrupt

at end of receive

Set P bit

(SSPSTAT<4>)

and SSPIF

ACK from Master

Set SSPIF at end

Set SSPIF interrupt

at end of Acknowledge

sequence

Set SSPIF interrupt

at end of Acknow-

ledge sequence

of receive

Set ACKEN, start Acknowledge sequence

SDA = ACKDT = 1

RCEN cleared

automatically

RCEN = 1, start

next receive

Write to SSPCON2<4>

to start Acknowledge sequence

SDA = ACKDT (SSPCON2<5>) = 0

RCEN cleared

automatically

responds to SSPIF

ACKEN

Begin Start condition

Cleared in software

SDA = ACKDT = 0

Cleared in

software

Last bit is shifted into SSPSR and

contents are unloaded into SSPBUF

SSPOV is set because

SSPBUF is still full

PIC18F2X1X/4X1X

16.4.12 ACKNOWLEDGE SEQUENCE

TIMING

An Acknowledge sequence is enabled by setting the

Acknowledge Sequence Enable bit, ACKEN

(SSPCON2<4>). When this bit is set, the SCL pin is

pulled low and the contents of the Acknowledge data bit

are presented on the SDA pin. If the user wishes to gen-

erate an Acknowledge, then the ACKDT bit should be

cleared. If not, the user should set the ACKDT bit before

starting an Acknowledge sequence. The Baud Rate

Generator then counts for one rollover period (TBRG)

and the SCL pin is deasserted (pulled high). When the

SCL pin is sampled high (clock arbitration), the Baud

Rate Generator counts for TBRG. The SCL pin is then

pulled low. Following this, the ACKEN bit is automatically

cleared, the Baud Rate Generator is turned off and the

MSSP module then goes into Idle mode (Figure 16-23).

16.4.12.1 WCOL Status Flag

If the user writes the SSPBUF when an Acknowledge

sequence is in progress, then WCOL is set and the

contents of the buffer are unchanged (the write doesn’t

occur).

16.4.13 STOP CONDITION TIMING

A Stop bit is asserted on the SDA pin at the end of a

receive/transmit by setting the Stop Sequence Enable

bit, PEN (SSPCON2<2>). At the end of a receive/

transmit, the SCL line is held low after the falling edge

of the ninth clock. When the PEN bit is set, the master

will assert the SDA line low. When the SDA line is sam-

pled low, the Baud Rate Generator is reloaded and

counts down to ‘0’. When the Baud Rate Generator

times out, the SCL pin will be brought high and one

TBRG (Baud Rate Generator rollover count) later, the

SDA pin will be deasserted. When the SDA pin is sam-

pled high while SCL is high, the P bit (SSPSTAT<4>) is

set. A TBRG later, the PEN bit is cleared and the SSPIF

bit is set (Figure 16-24).

16.4.13.1 WCOL Status Flag

If the user writes the SSPBUF when a Stop sequence

is in progress, then the WCOL bit is set and the

contents of the buffer are unchanged (the write doesn’t

occur).

FIGURE 16-23: ACKNOWLEDGE SEQUENCE WAVEFORM

FIGURE 16-24: STOP CONDITION RECEIVE OR TRANSMIT MODE

Note: TBRG = one Baud Rate Generator period.

SDA

SCL

SSPIF set at

Acknowledge sequence starts here,

write to SSPCON2 ACKEN automatically cleared

Cleared in

TBRG TBRG

the end of receive

ACKEN = 1, ACKDT = 0

SSPIF

software SSPIF set at the end

of Acknowledge sequence

Cleared in

software

ACK

SCL

SDA

SDA asserted low before rising edge of clock

Write to SSPCON2,

set PEN

Falling edge of

SCL = 1 for TBRG, followed by SDA = 1 for TBRG

9th clock

SCL brought high after TBRG

Note: TBRG = one Baud Rate Generator period.

TBRG TBRG

after SDA sampled high. P bit (SSPSTAT<4>) is set.

TBRG

to setup Stop condition

ACK

TBRG

PEN bit (SSPCON2<2>) is cleared by

hardware and the SSPIF bit is set

PIC18F2X1X/4X1X

16.4.14 SLEEP OPERATION

While in Sleep mode, the I2C module can receive

addresses or data and when an address match or

complete byte transfer occurs, wake the processor

from Sleep (if the MSSP interrupt is enabled).

16.4.15 EFFECTS OF A RESET

A Reset disables the MSSP module and terminates the

current transfer.

16.4.16 MULTI-MASTER MODE

In Multi-Master mode, the interrupt generation on the

detection of the Start and Stop conditions allows the

determination of when the bus is free. The Stop (P) and

Start (S) bits are cleared from a Reset or when the

MSSP module is disabled. Control of the I2C bus may

be taken when the P bit (SSPSTAT<4>) is set, or the

bus is Idle, with both the S and P bits clear. When the

bus is busy, enabling the SSP interrupt will generate

the interrupt when the Stop condition occurs.

In multi-master operation, the SDA line must be

monitored for arbitration to see if the signal level is the

expected output level. This check is performed in

hardware with the result placed in the BCLIF bit.

The states where arbitration can be lost are:

• Address Transfer

• Data Transfer

• A Start Condition

• A Repeated Start Condition

• An Acknowledge Condition

16.4.17 MULTI -MASTER COMMUNICATION,

BUS COLLISION AND BUS

ARBITRATION

Multi-Master mode support is achieved by bus arbitra-

tion. When the master outputs address/data bits onto

the SDA pin, arbitration takes place when the master

outputs a ‘1’ on SDA, by letting SDA float high and

another master asserts a ‘0’. When the SCL pin floats

high, data should be stable. If the expected data on

SDA is a ‘1’ and the data sampled on the SDA pin = 0,

then a bus collision has taken place. The master will set

the Bus Collision Interrupt Flag, BCLIF and reset the

I2C port to its Idle state (Figure 16-25).

If a transmit was in progress when the bus collision

occurred, the transmission is halted, the BF flag is

cleared, the SDA and SCL lines are deasserted and the

SSPBUF can be written to. When the user services the

bus collision Interrupt Service Routine and if the I2C

bus is free, the user can resume communication by

asserting a Start condition.

If a Start, Repeated Start, Stop or Acknowledge

condition was in progress when the bus collision

occurred, the condition is aborted, the SDA and SCL

lines are deasserted and the respective control bits in

the SSPCON2 register are cleared. When the user ser-

vices the bus collision Interrupt Service Routine and if

the I2C bus is free, the user can resume communication

by asserting a Start condition.

The master will continue to monitor the SDA and SCL

pins. If a Stop condition occurs, the SSPIF bit will be set.

A write to the SSPBUF will start the transmission of

data at the first data bit regardless of where the

transmitter left off when the bus collision occurred.

In Multi-Master mode, the interrupt generation on the

detection of Start and Stop conditions allows the deter-

mination of when the bus is free. Control of the I2C bus

can be taken when the P bit is set in the SSPSTAT

cleared.

FIGURE 16-25: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE

SDA

SCL

BCLIF

SDA released

SDA line pulled low

by another source

Sample SDA. While SCL is high,

data doesn’t match what is driven

Bus collision has occurred.

Set bus collision

interrupt (BCLIF)

by the master.

by master

Data changes

while SCL = 0

PIC18F2X1X/4X1X

16.4.17.1 Bus Collision During a Start

Condition

During a Start condition, a bus collision occurs if:

a) SDA or SCL are sampled low at the beginning of

the Start condition (Figure 16-26).

b) SCL is sampled low before SDA is asserted low

(Figure 16-27).

During a Start condition, both the SDA and the SCL

pins are monitored.

If the SDA pin is already low, or the SCL pin is already

low, then all of the following occur:

• the Start condition is aborted,

• the BCLIF flag is set and

• the MSSP module is reset to its Idle state

(Figure 16-26).

The Start condition begins with the SDA and SCL pins

deasserted. When the SDA pin is sampled high, the

Baud Rate Generator is loaded from SSPADD<6:0>

and counts down to 0. If the SCL pin is sampled low

while SDA is high, a bus collision occurs because it is

assumed that another master is attempting to drive a

data ‘1’ during the Start condition.

If the SDA pin is sampled low during this count, the

BRG is reset and the SDA line is asserted early

(Figure 16-28). If, however, a ‘1’ is sampled on the SDA

pin, the SDA pin is asserted low at the end of the BRG

count. The Baud Rate Generator is then reloaded and

counts down to 0; if the SCL pin is sampled as ‘0’

during this time, a bus collision does not occur. At the

end of the BRG count, the SCL pin is asserted low.

FIGURE 16-26: BUS COLLISION DURING START CONDITION (SDA ONLY)

Note: The reason that bus collision is not a factor

during a Start condition is that no two bus

masters can assert a Start condition at the

exact same time. Therefore, one master

will always assert SDA before the other.

This condition does not cause a bus

collision because the two masters must be

allowed to arbitrate the first address

following the Start condition. If the address

is the same, arbitration must be allowed to

continue into the data portion, Repeated

Start or Stop conditions.

SDA

SCL

SEN

SDA sampled low before

SDA goes low before the SEN bit is set.

S bit and SSPIF set because

SSP module reset into Idle state.

SEN cleared automatically because of bus collision.

S bit and SSPIF set because

Set SEN, enable Start

condition if SDA = 1, SCL = 1

SDA = 0, SCL = 1.

BCLIF

SSPIF

SDA = 0, SCL = 1.

SSPIF and BCLIF are

cleared in software

SSPIF and BCLIF are

cleared in software

Set BCLIF,

Start condition. Set BCLIF.

PIC18F2X1X/4X1X

FIGURE 16-27: BUS COLLISION DURING START CONDITION (SCL = 0)

FIGURE 16-28: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION

SDA

SCL

SEN bus collision occurs. Set BCLIF.

SCL = 0 before SDA = 0,

Set SEN, enable Start

sequence if SDA = 1, SCL = 1

TBRG TBRG

SDA = 0, SCL = 1

BCLIF

SSPIF

Interrupt cleared

in software

bus collision occurs. Set BCLIF.

SCL = 0 before BRG time-out,

‘0’‘0’

SDA

SCL

SEN

Set S

Less than TBRG TBRG

SDA = 0, SCL = 1

BCLIF

SSPIF

Interrupts cleared

in software

set SSPIF

SDA = 0, SCL = 1,

SCL pulled low after BRG

time-out

Set SSPIF

‘0’

SDA pulled low by other master.

Reset BRG and assert SDA.

Set SEN, enable START

sequence if SDA = 1, SCL = 1

PIC18F2X1X/4X1X

16.4.17.2 Bus Collision During a Repeated

Start Condition

During a Repeated Start condition, a bus collision

occurs if:

a) A low level is sampled on SDA when SCL goes

from low level to high level.

b) SCL goes low before SDA is asserted low,

indicating that another master is attempting to

transmit a data ‘1’.

When the user deasserts SDA and the pin is allowed to

float high, the BRG is loaded with SSPADD<6:0> and

counts down to 0. The SCL pin is then deasserted and

when sampled high, the SDA pin is sampled.

If SDA is low, a bus collision has occurred (i.e., another

master is attempting to transmit a data ‘0’, Figure 16-29).

If SDA is sampled high, the BRG is reloaded and begins

counting. If SDA goes from high-to-low before the BRG

times out, no bus collision occurs because no two

masters can assert SDA at exactly the same time.

If SCL goes from high-to-low before the BRG times out

and SDA has not already been asserted, a bus collision

occurs. In this case, another master is attempting to

transmit a data ‘1’ during the Repeated Start condition,

see Figure 16-30.

If, at the end of the BRG time-out, both SCL and SDA

are still high, the SDA pin is driven low and the BRG is

reloaded and begins counting. At the end of the count,

regardless of the status of the SCL pin, the SCL pin is

driven low and the Repeated Start condition is

complete.

FIGURE 16-29: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)

FIGURE 16-30: BUS COLLISION DURING REPEATED START CONDITION (CASE 2)

SDA

SCL

RSEN

BCLIF

SSPIF

Sample SDA when SCL goes high.

If SDA = 0, set BCLIF and release SDA and SCL.

Cleared in software

‘0’

SDA

SCL

BCLIF

RSEN

SSPIF

Interrupt cleared

in software

SCL goes low before SDA,

set BCLIF. Release SDA and SCL.

TBRG TBRG

‘0’

PIC18F2X1X/4X1X

16.4.17.3 Bus Collision During a Stop

Condition

Bus collision occurs during a Stop condition if:

a) After the SDA pin has been deasserted and

allowed to float high, SDA is sampled low after

the BRG has timed out.

b) After the SCL pin is deasserted, SCL is sampled

low before SDA goes high.

The Stop condition begins with SDA asserted low.

When SDA is sampled low, the SCL pin is allowed to

float. When the pin is sampled high (clock arbitration),

the Baud Rate Generator is loaded with SSPADD<6:0>

and counts down to 0. After the BRG times out, SDA is

sampled. If SDA is sampled low, a bus collision has

occurred. This is due to another master attempting to

drive a data ‘0’ (Figure 16-31). If the SCL pin is

sampled low before SDA is allowed to float high, a bus

collision occurs. This is another case of another master

attempting to drive a data ‘0’ (Figure 16-32).

FIGURE 16-31: BUS COLLISION DURING A STOP CONDITION (CASE 1)

FIGURE 16-32: BUS COLLISION DURING A STOP CONDITION (CASE 2)

SDA

SCL

BCLIF

PEN

SSPIF

TBRG TBRG TBRG

SDA asserted low

SDA sampled

low after TBRG,

set BCLIF

‘0’

SDA

SCL

BCLIF

PEN

SSPIF

TBRG TBRG TBRG

Assert SDA SCL goes low before SDA goes high,

set BCLIF

‘0’

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

17.0 ENHANCED UNIVERSAL

SYNCHRONOUS RECEIVER

TRANSMITTER (EUSART)

The Enhanced Universal Synchronous Asynchronous

Receiver Transmitter (EUSART) module is one of the

two serial I/O modules. (Generically, the USART is also

known as a Serial Communications Interface or SCI.)

The EUSART can be configured as a full-duplex

asynchronous system that can communicate with

peripheral devices, such as CRT terminals and

personal computers. It can also be configured as a half-

duplex synchronous system that can communicate

with peripheral devices, such as A/D or D/A integrated

circuits, serial EEPROMs, etc.

The Enhanced USART module implements additional

features, including automatic baud rate detection and

calibration, automatic wake-up on Sync Break recep-

tion and 12-bit Break character transmit. These make it

ideally suited for use in Local Interconnect Network bus

(LIN bus) systems.

The EUSART can be configured in the following

modes:

• Asynchronous (full duplex) with:

- Auto-wake-up on character reception

- Auto-baud calibration

- 12-bit Break character transmission

• Synchronous – Master (half duplex) with

selectable clock polarity

• Synchronous – Slave (half duplex) with selectable

clock polarity

The pins of the Enhanced USART are multiplexed with

PORTC. In order to configure RC6/TX/CK and

RC7/RX/DT as a USART:

• bit SPEN (RCSTA<7>) must be set (= 1)

• bit TRISC<7> must be set (= 1)

• bit TRISC<6> must be set (= 1)

The operation of the Enhanced USART module is

controlled through three registers:

• Transmit Status and Control (TXSTA)

• Receive Status and Control (RCSTA)

• Baud Rate Control (BAUDCON)

These are detailed on the following pages in

respectively.

Note: The EUSART control will automatically

reconfigure the pin from input to output as

needed.

PIC18F2X1X/4X1X

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-1 R/W-0

CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D

bit 7 bit 0

bit 7 CSRC: Clock Source Select bit

Asynchronous mode:

Don’t care.

Synchronous mode:

1 = Master mode (clock generated internally from BRG)

0 = Slave mode (clock from external source)

bit 6 TX9: 9-bit Transmit Enable bit

1 = Selects 9-bit transmission

0 = Selects 8-bit transmission

bit 5 TXEN: Transmit Enable bit

1 = Transmit enabled

0 = Transmit disabled

Note: SREN/CREN overrides TXEN in Sync mode.

bit 4 SYNC: EUSART Mode Select bit

1 = Synchronous mode

0 = Asynchronous mode

bit 3 SENDB: Send Break Character bit

Asynchronous mode:

1 = Send Sync Break on next transmission (cleared by hardware upon completion)

0 = Sync Break transmission completed

Synchronous mode:

Don’t care.

bit 2 BRGH: High Baud Rate Select bit

Asynchronous mode:

1 = High speed

0 = Low speed

Synchronous mode:

Unused in this mode.

bit 1 TRMT: Transmit Shift Register Status bit

1 = TSR empty

0 = TSR full

bit 0 TX9D: 9th bit of Transmit Data

Can be address/data bit or a parity bit.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x

SPEN RX9 SREN CREN ADDEN FERR OERR RX9D

bit 7 bit 0

bit 7 SPEN: Serial Port Enable bit

1 = Serial port enabled (configures RX/DT and TX/CK pins as serial port pins)

0 = Serial port disabled (held in Reset)

bit 6 RX9: 9-bit Receive Enable bit

1 = Selects 9-bit reception

0 = Selects 8-bit reception

bit 5 SREN: Single Receive Enable bit

Asynchronous mode:

Don’t care.

Synchronous mode – Master:

1 = Enables single receive

0 = Disables single receive

This bit is cleared after reception is complete.

Synchronous mode – Slave:

Don’t care.

bit 4 CREN: Continuous Receive Enable bit

Asynchronous mode:

1 = Enables receiver

0 = Disables receiver

Synchronous mode:

1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN)

0 = Disables continuous receive

bit 3 ADDEN: Address Detect Enable bit

Asynchronous mode 9-bit (RX9 = 1):

1 = Enables address detection, enables interrupt and loads the receive buffer when RSR<8>

is set

0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit

Asynchronous mode 9-bit (RX9 = 0):

Don’t care.

bit 2 FERR: Framing Error bit

1 = Framing error (can be updated by reading RCREG register and receiving next valid byte)

0 = No framing error

bit 1 OERR: Overrun Error bit

1 = Overrun error (can be cleared by clearing bit CREN)

0 = No overrun error

bit 0 RX9D: 9th bit of Received Data

This can be address/data bit or a parity bit and must be calculated by user firmware.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

R/W-0 R-1 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0

ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN

bit 7 bit 0

bit 7 ABDOVF: Auto-Baud Acquisition Rollover Status bit

1 = A BRG rollover has occurred during Auto-Baud Rate Detect mode

(must be cleared in software)

0 = No BRG rollover has occurred

bit 6 RCIDL: Receive Operation Idle Status bit

1 = Receive operation is Idle

0 = Receive operation is active

bit 5 Unimplemented: Read as ‘0’

bit 4 SCKP: Synchronous Clock Polarity Select bit

Asynchronous mode:

Unused in this mode.

Synchronous mode:

1 = Idle state for clock (CK) is a high level

0 = Idle state for clock (CK) is a low level

bit 3 BRG16: 16-bit Baud Rate Register Enable bit

1 = 16-bit Baud Rate Generator – SPBRGH and SPBRG

0 = 8-bit Baud Rate Generator – SPBRG only (Compatible mode), SPBRGH value ignored

bit 2 Unimplemented: Read as ‘0’

bit 1 WUE: Wake-up Enable bit

Asynchronous mode:

1 = EUSART will continue to sample the RX pin – interrupt generated on falling edge; bit

cleared in hardware on following rising edge

0 = RX pin not monitored or rising edge detected

Synchronous mode:

Unused in this mode.

bit 0 ABDEN: Auto-Baud Detect Enable bit

Asynchronous mode:

1 = Enable baud rate measurement on the next character. Requires reception of a Sync field

(55h); cleared in hardware upon completion

0 = Baud rate measurement disabled or completed

Synchronous mode:

Unused in this mode.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 195
PIC18F2X1X/4X1X
17.1  Baud Rate Generator (BRG)
The BRG is a dedicated 8-bit or 16-bit generator that
supports both the Asynchronous and Synchronous
modes of the EUSART. By default, the BRG operates
in 8-Bit mode; setting the BRG16 bit (BAUDCON<3>)
selects 16-Bit mode.
The SPBRGH:SPBRG register pair controls the period
of a free running timer. In Asynchronous mode, bits
BRGH (TXSTA<2>) and BRG16 (BAUDCON<3>) also
control the baud rate. In Synchronous mode, BRGH is
ignored. Table 17-1 shows the formula for computation
of the baud rate for different EUSART modes which
only apply in Master mode (internally generated clock).
Given the desired baud rate and FOSC, the nearest
integer value for the SPBRGH:SPBRG registers can be
calculated using the formulas in Table 17-1. From this,
the error in baud rate can be determined. An example
calculation is shown in Example 17-1. Typical baud
rates and error values for the various Asynchronous
modes are shown in Table 17-2. It may be
advantageous to use the high baud rate (BRGH = 1) or
the 16-bit BRG to reduce the baud rate error, or
achieve a slow baud rate for a fast oscillator frequency.
Writing a new value to the SPBRGH:SPBRG registers
causes the BRG timer to be reset (or cleared). This
ensures the BRG does not wait for a timer overflow
before outputting the new baud rate.
17.1.1 OPERATION IN POWER-MANAGED 
MODES
The device clock is used to generate the desired baud
rate. When one of the power-managed modes is
entered, the new clock source may be operating at a
different frequency. This may require an adjustment to
the value in the SPBRG register pair.
17.1.2 SAMPLING
The data on the RX pin is sampled three times by a
majority detect circuit to determine if a high or a low
level is present at the RX pin.
TABLE 17-1: BAUD RATE FORMULAS
EXAMPLE 17-1: CALCULATING BAUD RATE ERROR           
TABLE 17-2: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR      
Configuration Bits BRG/EUSART Mode Baud Rate Formula
SYNC BRG16 BRGH
000 8-bit/Asynchronous FOSC/[64 (n + 1)]
001 8-bit/Asynchronous FOSC/[16 (n + 1)]
010 16-bit/Asynchronous
011 16-bit/Asynchronous
FOSC/[4 (n + 1)]10x 8-bit/Synchronous
11x 16-bit/Synchronous
Legend: x = Don’t care, n = value of SPBRGH:SPBRG register pair
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values 
on page
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
BAUDCON ABDOVF RCIDL —SCKP BRG16 —WUE ABDEN 51
SPBRGH EUSART Baud Rate Generator Register, High Byte 51
SPBRG EUSART Baud Rate Generator Register, Low Byte 51
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the BRG.
For a device wi th FOSC of 16 MHz, de sired baud rate  of 9600, Asynchronous mode,  8-bit B RG:
Desire d Baud Rate =  FOSC/(64 ([SPBRGH:SPBRG] + 1)) 
Solving for SPBRGH:SPBRG:
X=((F
OSC/Desired Baud Rate)/64) – 1
= ((16000000/9600)/64) – 1 
= [25.042] = 25 
Calcu lated Baud Rate = 16 000000/ (64 (25 + 1)) 
= 9615 
Error = (Calcu lated Baud Rate – Desired Baud Rate)/Desired Baud Rate
= (96 15  – 9600)/9600 = 0. 16 % 

PIC18F2X1X/4X1X

TABLE 17-3: BAUD RATES FOR ASYNCHRONOUS MODES

BAUD

RATE

(K)

SYNC = 0, BRGH = 0, BRG16 = 0

FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3————————————

1.2 — — — 1.221 1.73 255 1.202 0.16 129 1201 -0.16 103

2.4 2.441 1.73 255 2.404 0.16 129 2.404 0.16 64 2403 -0.16 51

9.6 9.615 0.16 64 9.766 1.73 31 9.766 1.73 15 9615 -0.16 12

19.2 19.531 1.73 31 19.531 1.73 15 19.531 1.73 7 — — —

57.6 56.818 -1.36 10 62.500 8.51 4 52.083 -9.58 2 — — —

115.2 125.000 8.51 4 104.167 -9.58 2 78.125 -32.18 1 — — —

BAUD

RATE

(K)

SYNC = 0, BRGH = 0, BRG16 = 0

FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 0.300 0.16 207 300 -0.16 103 300 -0.16 51

1.2 1.202 0.16 51 1201 -0.16 25 1201 -0.16 12

2.4 2.404 0.16 25 2403 -0.16 12 — — —

9.6 8.929 -6.99 6 — — — — — —

19.2 20.833 8.51 2 — — — — — —

57.6 62.500 8.51 0 — — — — — —

115.2 62.500 -45.75 0 — — — — — —

BAUD

RATE

(K)

SYNC = 0, BRGH = 1, BRG16 = 0

FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3————————————

1.2————————————

2.4 — — — — — — 2.441 1.73 255 2403 -0.16 207

9.6 9.766 1.73 255 9.615 0.16 129 9.615 0.16 64 9615 -0.16 51

19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19230 -0.16 25

57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55555 3.55 8

115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — —

BAUD

RATE

(K)

SYNC = 0, BRGH = 1, BRG16 = 0

FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 — — — — — — 300 -0.16 207

1.2 1.202 0.16 207 1201 -0.16 103 1201 -0.16 51

2.4 2.404 0.16 103 2403 -0.16 51 2403 -0.16 25

9.6 9.615 0.16 25 9615 -0.16 12 — — —

19.2 19.231 0.16 12 — — — — — —

57.6 62.500 8.51 3 — — — — — —

115.2 125.000 8.51 1 — — — — — —

PIC18F2X1X/4X1X

BAUD

RATE

(K)

SYNC = 0, BRGH = 0, BRG16 = 1

FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 0.300 0.00 8332 0.300 0.02 4165 0.300 0.02 2082 300 -0.04 1665

1.2 1.200 0.02 2082 1.200 -0.03 1041 1.200 -0.03 520 1201 -0.16 415

2.4 2.402 0.06 1040 2.399 -0.03 520 2.404 0.16 259 2403 -0.16 207

9.6 9.615 0.16 259 9.615 0.16 129 9.615 0.16 64 9615 -0.16 51

19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19230 -0.16 25

57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55555 3.55 8

115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — —

BAUD

RATE

(K)

SYNC = 0, BRGH = 0, BRG16 = 1

FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 0.300 0.04 832 300 -0.16 415 300 -0.16 207

1.2 1.202 0.16 207 1201 -0.16 103 1201 -0.16 51

2.4 2.404 0.16 103 2403 -0.16 51 2403 -0.16 25

9.6 9.615 0.16 25 9615 -0.16 12 — — —

19.2 19.231 0.16 12 — — — — — —

57.6 62.500 8.51 3 — — — — — —

115.2 125.000 8.51 1 — — — — — —

BAUD

RATE

(K)

SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1

FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 0.300 0.00 33332 0.300 0.00 16665 0.300 0.00 8332 300 -0.01 6665

1.2 1.200 0.00 8332 1.200 0.02 4165 1.200 0.02 2082 1200 -0.04 1665

2.4 2.400 0.02 4165 2.400 0.02 2082 2.402 0.06 1040 2400 -0.04 832

9.6 9.606 0.06 1040 9.596 -0.03 520 9.615 0.16 259 9615 -0.16 207

19.2 19.193 -0.03 520 19.231 0.16 259 19.231 0.16 129 19230 -0.16 103

57.6 57.803 0.35 172 57.471 -0.22 86 58.140 0.94 42 57142 0.79 34

115.2 114.943 -0.22 86 116.279 0.94 42 113.636 -1.36 21 117647 -2.12 16

BAUD

RATE

(K)

SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1

FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 0.300 0.01 3332 300 -0.04 1665 300 -0.04 832

1.2 1.200 0.04 832 1201 -0.16 415 1201 -0.16 207

2.4 2.404 0.16 415 2403 -0.16 207 2403 -0.16 103

9.6 9.615 0.16 103 9615 -0.16 51 9615 -0.16 25

19.2 19.231 0.16 51 19230 -0.16 25 19230 -0.16 12

57.6 58.824 2.12 16 55555 3.55 8 — — —

115.2 111.111 -3.55 8 — — — — — —

TABLE 17-3: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)

PIC18F2X1X/4X1X

17.1.3 AUTO-BAUD RATE DETECT

The Enhanced USART module supports the automatic

detection and calibration of baud rate. This feature is

active only in Asynchronous mode and while the WUE

bit is clear.

The automatic baud rate measurement sequence

(Figure 17-1) begins whenever a Start bit is received

and the ABDEN bit is set. The calculation is

self-averaging.

In the Auto-Baud Rate Detect (ABD) mode, the clock to

the BRG is reversed. Rather than the BRG clocking the

incoming RX signal, the RX signal is timing the BRG. In

ABD mode, the internal Baud Rate Generator is used

as a counter to time the bit period of the incoming serial

byte stream.

Once the ABDEN bit is set, the state machine will clear

the BRG and look for a Start bit. The Auto-Baud Rate

Detect must receive a byte with the value 55h (ASCII

“U”, which is also the LIN bus Sync character) in order to

calculate the proper bit rate. The measurement is taken

over both a low and a high bit time in order to minimize

any effects caused by asymmetry of the incoming signal.

After a Start bit, the SPBRG begins counting up, using

the preselected clock source on the first rising edge of

RX. After eight bits on the RX pin or the fifth rising edge,

an accumulated value totalling the proper BRG period is

left in the SPBRGH:SPBRG register pair. Once the 5th

edge is seen (this should correspond to the Stop bit), the

ABDEN bit is automatically cleared.

If a rollover of the BRG occurs (an overflow from FFFFh

to 0000h), the event is trapped by the ABDOVF status

bit (BAUDCON<7>). It is set in hardware by BRG roll-

overs and can be set or cleared by the user in software.

ABD mode remains active after rollover events and the

ABDEN bit remains set (Figure 17-2).

While calibrating the baud rate period, the BRG

registers are clocked at 1/8th the preconfigured clock

rate. Note that the BRG clock will be configured by the

BRG16 and BRGH bits. Independent of the BRG16 bit

setting, both the SPBRG and SPBRGH will be used as

a 16-bit counter. This allows the user to verify that no

carry occurred for 8-Bit modes by checking for 00h in

the SPBRGH register. Refer to Table 17-4 for counter

clock rates to the BRG.

While the ABD sequence takes place, the EUSART

state machine is held in Idle. The RCIF interrupt is set

once the fifth rising edge on RX is detected. The value

in the RCREG needs to be read to clear the RCIF

interrupt. The contents of RCREG should be discarded.

TABLE 17-4: BRG COUNTER

CLOCK RATES

17.1.3.1 ABD and EUSART Transmission

Since the BRG clock is reversed during ABD acquisi-

tion, the EUSART transmitter cannot be used during

ABD. This means that whenever the ABDEN bit is set,

TXREG cannot be written to. Users should also ensure

that ABDEN does not become set during a transmit

sequence. Failing to do this may result in unpredictable

EUSART operation.

Note 1: If the WUE bit is set with the ABDEN bit,

Auto-Baud Rate Detection will occur on

the byte

following

the Break character.

2: It is up to the user to determine that the

incoming character baud rate is within the

range of the selected BRG clock source.

Some combinations of oscillator frequency

and EUSART baud rates are not possible

due to bit error rates. Overall system

timing and communication baud rates

must be taken into consideration when

using the Auto-Baud Rate Detection

feature.

BRG16 BRGH BRG Counter Clock

00 FOSC/512

01 FOSC/128

10 FOSC/128

11 FOSC/32

Note: During the ABD sequence, SPBRG and

SPBRGH are both used as a 16-bit

counter, independent of BRG16 setting.

PIC18F2X1X/4X1X

FIGURE 17-1: AUTOMATIC BAUD RATE CALCULATION

FIGURE 17-2: BRG OVERFLOW SEQUENCE

BRG Value

RX pin

ABDEN bit

RCIF bit

Bit 0 Bit 1

(Interrupt)

Read

RCREG

BRG Clock

Start

Auto-Cleared

Set by User

XXXXh 0000h

Edge #1

Bit 2 Bit 3

Edge #2

Bit 4 Bit 5

Edge #3

Bit 6 Bit 7

Edge #4

Stop Bit

Edge #5

001Ch

Note: The ABD sequence requires the EUSART module to be configured in Asynchronous mode and WUE = 0.

SPBRG XXXXh 1Ch

SPBRGH XXXXh 00h

Start Bit 0

XXXXh 0000h 0000h

FFFFh

BRG Clock

ABDEN bit

RX pin

ABDOVF bit

BRG Value

PIC18F2X1X/4X1X

17.2 EUSART Asynchronous Mode

The Asynchronous mode of operation is selected by

clearing the SYNC bit (TXSTA<4>). In this mode, the

EUSART uses standard Non-Return-to-Zero (NRZ)

format (one Start bit, eight or nine data bits and one Stop

bit). The most common data format is 8 bits. An on-chip

dedicated 8-bit/16-bit Baud Rate Generator can be used

to derive standard baud rate frequencies from the

oscillator.

The EUSART transmits and receives the LSb first. The

EUSART’s transmitter and receiver are functionally

independent but use the same data format and baud

rate. The Baud Rate Generator produces a clock, either

x16 or x64 of the bit shift rate depending on the BRGH

and BRG16 bits (TXSTA<2> and BAUDCON<3>). Parity

is not supported by the hardware but can be

implemented in software and stored as the 9th data bit.

When operating in Asynchronous mode, the EUSART

module consists of the following important elements:

• Baud Rate Generator

• Sampling Circuit

• Asynchronous Transmitter

• Asynchronous Receiver

• Auto-Wake-up on Sync Break Character

• 12-bit Break Character Transmit

• Auto-Baud Rate Detection

17.2.1 EUSART ASYNCHRONOUS

TRANSMITTER

The EUSART transmitter block diagram is shown in

Figure 17-3. The heart of the transmitter is the Transmit

(Serial) Shift Register (TSR). The Shift register obtains

its data from the Read/Write Transmit Buffer register,

TXREG. The TXREG register is loaded with data in

software. The TSR register is not loaded until the Stop

bit has been transmitted from the previous load. As

soon as the Stop bit is transmitted, the TSR is loaded

with new data from the TXREG register (if available).

Once the TXREG register transfers the data to the TSR

CY), the TXREG register is empty

and the TXIF flag bit (PIR1<4>) is set. This interrupt can

be enabled or disabled by setting or clearing the interrupt

enable bit, TXIE (PIE1<4>). TXIF will be set regardless of

the state of TXIE; it cannot be cleared in software. TXIF

is also not cleared immediately upon loading TXREG, but

becomes valid in the second instruction cycle following

the load instruction. Polling TXIF immediately following a

load of TXREG will return invalid results.

While TXIF indicates the status of the TXREG register,

another bit, TRMT (TXSTA<1>), shows the status of

the TSR register. TRMT is a read-only bit which is set

when the TSR register is empty. No interrupt logic is

tied to this bit so the user has to poll this bit in order to

determine if the TSR register is empty.

To set up an Asynchronous Transmission:

1. Initialize the SPBRGH:SPBRG registers for the

appropriate baud rate. Set or clear the BRGH

and BRG16 bits, as required, to achieve the

desired baud rate.

2. Enable the asynchronous serial port by clearing

bit SYNC and setting bit SPEN.

3. If interrupts are desired, set enable bit TXIE.

4. If 9-bit transmission is desired, set transmit bit

TX9. Can be used as address/data bit.

5. Enable the transmission by setting bit TXEN

which will also set bit TXIF.

6. If 9-bit transmission is selected, the ninth bit

should be loaded in bit TX9D.

7. Load data to the TXREG register (starts

transmission).

8. If using interrupts, ensure that the GIE and PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

FIGURE 17-3: EUSART TRANSMIT BLOCK DIAGRAM

Note 1: The TSR register is not mapped in data

memory so it is not available to the user.

2: Flag bit TXIF is set when enable bit TXEN

is set.

TXIF

TXIE

Interrupt

TXEN Baud Rate CLK

SPBRG

Baud Rate Generator TX9D

MSb LSb

Data Bus

TXREG Register

TSR Register

(8) 0

TX9

TRMT SPEN

TX pin

Pin Buffer

and Control

• • •

SPBRGH

BRG16

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 201
PIC18F2X1X/4X1X
FIGURE 17-4: ASYNCHRONOUS TRANSMISSION       
FIGURE 17-5: ASYNCHRONOUS TRANSMISSION (BACK TO BACK)        
TABLE 17-5: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION       
Word 1
Word 1
Transmit Shift Reg
Start bit bit 0 bit 1 bit 7/8
Write to TXREG
BRG Output
(Shift Clock)
TX
TXIF bit
(Transmit Buffer
Reg. Empty Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
1 TCY
 (pin)
Word 1
Stop bit
Transmit Shift Reg.
Write to TXREG
BRG Output
(Shift Clock)
TX
TXIF bit
(Interrupt Reg. Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
Word 1 Word 2
Word 1 Word 2
Stop bit Start bit
Transmit Shift Reg.
Word 1 Word 2
bit 0 bit 1 bit 7/8 bit 0
Note: This timing diagram shows two consecutive transmissions.
1 TCY
1 TCY
(pin) Start bit
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
TXREG EUSART Transmit Register 51
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
BAUDCON ABDOVF RCIDL —SCKP BRG16 —WUE ABDEN 51
SPBRGH EUSART Baud Rate Generator Register, High Byte 51
SPBRG EUSART Baud Rate Generator Register, Low Byte 51
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous transmission.
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.

PIC18F2X1X/4X1X

17.2.2 EUSART ASYNCHRONOUS

RECEIVER

The receiver block diagram is shown in Figure 17-6.

The data is received on the RX pin and drives the data

recovery block. The data recovery block is actually a

high-speed shifter operating at x16 times the baud rate,

whereas the main receive serial shifter operates at the

bit rate or at FOSC. This mode would typically be used

in RS-232 systems.

To set up an Asynchronous Reception:

1. Initialize the SPBRGH:SPBRG registers for the

appropriate baud rate. Set or clear the BRGH

and BRG16 bits, as required, to achieve the

desired baud rate.

2. Enable the asynchronous serial port by clearing

bit SYNC and setting bit SPEN.

3. If interrupts are desired, set enable bit RCIE.

4. If 9-bit reception is desired, set bit RX9.

5. Enable the reception by setting bit CREN.

6. Flag bit RCIF will be set when reception is

complete and an interrupt will be generated if

enable bit RCIE was set.

7. Read the RCSTA register to get the 9th bit (if

enabled) and determine if any error occurred

during reception.

8. Read the 8-bit received data by reading the

RCREG register.

9. If any error occurred, clear the error by clearing

enable bit CREN.

10. If using interrupts, ensure that the GIE and PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

17.2.3 SETTING UP 9-BIT MODE WITH

ADDRESS DETECT

This mode would typically be used in RS-485 systems.

To set up an Asynchronous Reception with Address

Detect Enable:

1. Initialize the SPBRGH:SPBRG registers for the

appropriate baud rate. Set or clear the BRGH

and BRG16 bits, as required, to achieve the

desired baud rate.

2. Enable the asynchronous serial port by clearing

the SYNC bit and setting the SPEN bit.

3. If interrupts are required, set the RCEN bit and

select the desired priority level with the RCIP bit.

4. Set the RX9 bit to enable 9-bit reception.

5. Set the ADDEN bit to enable address detect.

6. Enable reception by setting the CREN bit.

7. The RCIF bit will be set when reception is

complete. The interrupt will be Acknowledged if

the RCIE and GIE bits are set.

8. Read the RCSTA register to determine if any

error occurred during reception, as well as read

bit 9 of data (if applicable).

9. Read RCREG to determine if the device is being

addressed.

10. If any error occurred, clear the CREN bit.

11. If the device has been addressed, clear the

ADDEN bit to allow all received data into the

receive buffer and interrupt the CPU.

FIGURE 17-6: EUSART RECEIVE BLOCK DIAGRAM

x64 Baud Rate CLK

Baud Rate Generator

Pin Buffer

and Control

SPEN

Data

Recovery

CREN OERR FERR

RSR Register

MSb LSb

RX9D RCREG Register

FIFO

Interrupt RCIF

RCIE

Data Bus

÷ 64

÷ 16

Stop Start

(8) 7 1 0

RX9

• • •

SPBRGSPBRGH

BRG16

÷ 4

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 203
PIC18F2X1X/4X1X
FIGURE 17-7: ASYNCHRONOUS RECEPTION          
TABLE 17-6: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Start
bit bit 7/8
bit 1bit 0 bit 7/8 bit 0Stop
bit
Start
bit
Start
bit
bit 7/8 Stop
bit
RX (pin)
Rcv Buffer Reg
Rcv Shift Reg
Read Rcv
Buffer Reg
RCREG
RCIF
(Interrupt Flag)
OERR bit
CREN
Word 1
RCREG
Word 2
RCREG
Stop
bit
Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word causing
the OERR (overrun) bit to be set.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
RCREG EUSART Receive Register 51
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
BAUDCON ABDOVF RCIDL —SCKP BRG16 — WUE ABDEN 51
SPBRGH EUSART Baud Rate Generator Register, High Byte 51
SPBRG EUSART Baud Rate Generator Register, Low Byte 51
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous reception.
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.

PIC18F2X1X/4X1X

17.2.4 AUTO-WAKE-UP ON SYNC BREAK

CHARACTER

During Sleep mode, all clocks to the EUSART are

suspended. Because of this, the Baud Rate Generator

is inactive and a proper byte reception cannot be per-

formed. The auto-wake-up feature allows the controller

to wake-up due to activity on the RX/DT line while the

EUSART is operating in Asynchronous mode.

The auto-wake-up feature is enabled by setting the

WUE bit (BAUDCON<1>). Once set, the typical receive

sequence on RX/DT is disabled and the EUSART

remains in an Idle state, monitoring for a wake-up event

independent of the CPU mode. A wake-up event con-

sists of a high-to-low transition on the RX/DT line. (This

coincides with the start of a Sync Break or a Wake-up

Signal character for the LIN protocol.)

Following a wake-up event, the module generates an

RCIF interrupt. The interrupt is generated synchro-

nously to the Q clocks in normal operating modes

(Figure 17-8) and asynchronously, if the device is in

Sleep mode (Figure 17-9). The interrupt condition is

cleared by reading the RCREG register.

The WUE bit is automatically cleared once a low-to-high

transition is observed on the RX line following the wake-

up event. At this point, the EUSART module is in Idle

mode and returns to normal operation. This signals to

the user that the Sync Break event is over.

17.2.4.1 Special Considerations Using

Auto-Wake-up

Since auto-wake-up functions by sensing rising edge

transitions on RX/DT, information with any state

changes before the Stop bit may signal a false end-of-

character and cause data or framing errors. To work

properly, therefore, the initial character in the transmis-

sion must be all ‘0’s. This can be 00h (8 bytes) for

standard RS-232 devices or 000h (12 bits) for LIN bus.

Oscillator start-up time must also be considered,

especially in applications using oscillators with longer

start-up intervals (i.e., XT or HS mode). The Sync

Break (or Wake-up Signal) character must be of

sufficient length and be followed by a sufficient interval

to allow enough time for the selected oscillator to start

and provide proper initialization of the EUSART.

17.2.4.2 Special Considerations Using

the WUE Bit

The timing of WUE and RCIF events may cause some

confusion when it comes to determining the validity of

received data. As noted, setting the WUE bit places the

EUSART in an Idle mode. The wake-up event causes

a receive interrupt by setting the RCIF bit. The WUE bit

is cleared after this when a rising edge is seen on

RX/DT. The interrupt condition is then cleared by

reading the RCREG register. Ordinarily, the data in

RCREG will be dummy data and should be

discarded.

The fact that the WUE bit has been cleared (or is still

set) and the RCIF flag is set should not be used as an

indicator of the integrity of the data in RCREG. Users

should consider implementing a parallel method in

firmware to verify received data integrity.

To assure that no actual data is lost, check the RCIDL

bit to verify that a receive operation is not in process. If

a receive operation is not occurring, the WUE bit may

then be set just prior to entering the Sleep mode.

FIGURE 17-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING NORMAL OPERATION

FIGURE 17-9: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

OSC1

WUE bit(1)

RX/DT Line

RCIF

Note 1: The EUSART remains in Idle while the WUE bit is set.

Bit set by user

Cleared due to user read of RCREG

Auto-Cleared

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

OSC1

WUE bit(2)

RX/DT Line

RCIF

Cleared due to user read of RCREG

Sleep Command Executed

Note 1: If the wake-up event requires long oscillator warm-up time, the auto-clear of the WUE bit can occur before the oscillator is ready. This

sequence should not depend on the presence of Q clocks.

2: The EUSART remains in Idle while the WUE bit is set.

Sleep Ends

Note 1

Auto-Cleared

Bit set by user

PIC18F2X1X/4X1X

17.2.5 BREAK CHARACTER SEQUENCE

The EUSART module has the capability of sending the

special Break character sequences that are required by

the LIN bus standard. The Break character transmit

consists of a Start bit, followed by twelve ‘0’ bits and a

Stop bit. The frame Break character is sent whenever

the SENDB and TXEN bits (TXSTA<3> and

TXSTA<5>) are set while the Transmit Shift register is

loaded with data. Note that the value of data written to

TXREG will be ignored and all ‘0’s will be transmitted.

The SENDB bit is automatically reset by hardware after

the corresponding Stop bit is sent. This allows the user

to preload the transmit FIFO with the next transmit byte

following the Break character (typically, the Sync

character in the LIN specification).

Note that the data value written to the TXREG for the

Break character is ignored. The write simply serves the

purpose of initiating the proper sequence.

The TRMT bit indicates when the transmit operation is

active or Idle, just as it does during normal transmis-

sion. See Figure 17-10 for the timing of the Break

character sequence.

17.2.5.1 Break and Sync Transmit Sequence

The following sequence will send a message frame

header made up of a Break, followed by an Auto-Baud

Sync byte. This sequence is typical of a LIN bus

master.

1. Configure the EUSART for the desired mode.

2. Set the TXEN and SENDB bits to set up the

Break character.

3. Load the TXREG with a dummy character to

initiate transmission (the value is ignored).

4. Write ‘55h’ to TXREG to load the Sync character

into the transmit FIFO buffer.

5. After the Break has been sent, the SENDB bit is

reset by hardware. The Sync character now

transmits in the preconfigured mode.

When the TXREG becomes empty, as indicated by the

TXIF, the next data byte can be written to TXREG.

17.2.6 RECEIVING A BREAK CHARACTER

The Enhanced USART module can receive a Break

character in two ways.

The first method forces configuration of the baud rate

at a frequency of 9/13 the typical speed. This allows for

the Stop bit transition to be at the correct sampling

location (13 bits for Break versus Start bit and 8 data

bits for typical data).

The second method uses the auto-wake-up feature

described in Section 17.2.4 “Auto-Wake-up on Sync

Break Character”. By enabling this feature, the

EUSART will sample the next two transitions on RX/DT,

cause an RCIF interrupt and receive the next data byte

followed by another interrupt.

Note that following a Break character, the user will

typically want to enable the Auto-Baud Rate Detect

feature. For both methods, the user can set the ABD bit

once the TXIF interrupt is observed.

FIGURE 17-10: SEND BREAK CHARACTER SEQUENCE

Write to TXREG

BRG Output

(Shift Clock)

Start Bit Bit 0 Bit 1 Bit 11 Stop Bit

Break

TXIF bit

(Transmit Buffer

Reg. Empty Flag)

TX (pin)

TRMT bit

(Transmit Shift

Reg. Empty Flag)

SENDB

(Transmit Shift

Reg. Empty Flag)

SENDB sampled here Auto-Cleared

Dummy Write

PIC18F2X1X/4X1X

17.3 EUSART Synchronous

Master Mode

The Synchronous Master mode is entered by setting

the CSRC bit (TXSTA<7>). In this mode, the data is

transmitted in a half-duplex manner (i.e., transmission

and reception do not occur at the same time). When

transmitting data, the reception is inhibited and vice

versa. Synchronous mode is entered by setting bit

SYNC (TXSTA<4>). In addition, enable bit SPEN

(RCSTA<7>) is set in order to configure the TX and RX

pins to CK (clock) and DT (data) lines, respectively.

The Master mode indicates that the processor trans-

mits the master clock on the CK line. Clock polarity is

selected with the SCKP bit (BAUDCON<4>); setting

SCKP sets the Idle state on CK as high, while clearing

the bit sets the Idle state as low. This option is provided

to support Microwire devices with this module.

17.3.1 EUSART SYNCHRONOUS MASTER

TRANSMISSION

The EUSART transmitter block diagram is shown in

Figure 17-3. The heart of the transmitter is the Transmit

(Serial) Shift Register (TSR). The Shift register obtains

its data from the Read/Write Transmit Buffer register,

TXREG. The TXREG register is loaded with data in

software. The TSR register is not loaded until the last

bit has been transmitted from the previous load. As

soon as the last bit is transmitted, the TSR is loaded

with new data from the TXREG (if available).

Once the TXREG register transfers the data to the TSR

CY), the TXREG is empty and

the TXIF flag bit (PIR1<4>) is set. The interrupt can be

enabled or disabled by setting or clearing the interrupt

enable bit, TXIE (PIE1<4>). TXIF is set regardless of

the state of enable bit TXIE; it cannot be cleared in

software. It will reset only when new data is loaded into

the TXREG register.

While flag bit TXIF indicates the status of the TXREG

status of the TSR register. TRMT is a read-only bit which

is set when the TSR is empty. No interrupt logic is tied to

this bit so the user has to poll this bit in order to deter-

mine if the TSR register is empty. The TSR is not

mapped in data memory so it is not available to the user.

To set up a Synchronous Master Transmission:

1. Initialize the SPBRGH:SPBRG registers for the

appropriate baud rate. Set or clear the BRG16

bit, as required, to achieve the desired baud rate.

2. Enable the synchronous master serial port by

setting bits SYNC, SPEN and CSRC.

3. If interrupts are desired, set enable bit TXIE.

4. If 9-bit transmission is desired, set bit TX9.

5. Enable the transmission by setting bit TXEN.

6. If 9-bit transmission is selected, the ninth bit

should be loaded in bit TX9D.

7. Start transmission by loading data to the TXREG

8. If using interrupts, ensure that the GIE and PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

FIGURE 17-11: SYNCHRONOUS TRANSMISSION

bit 0 bit 1 bit 7

Word 1

Q1 Q2 Q3Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

bit 2 bit 0 bit 1 bit 7

RC7/RX/DT

RC6/TX/CK pin

Write to

TXREG Reg

TXIF bit

(Interrupt Flag)

TXEN bit ‘1’ ‘1’

Word 2

TRMT bit

Write Word 1 Write Word 2

Note: Sync Master mode, SPBRG = 0, continuous transmission of two 8-bit words.

RC6/TX/CK pin

(SCKP = 0)

(SCKP = 1)

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 207
PIC18F2X1X/4X1X
FIGURE 17-12: SYNCHRONOUS TRANSMISSION (THROUGH TXEN)       
TABLE 17-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION       
RC7/RX/DT pin
RC6/TX/CK pin
Write to
TXREG reg
TXIF bit
TRMT bit
bit 0 bit 1 bit 2 bit 6 bit 7
TXEN bit
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
TXREG EUSART Transmit Register 51
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
BAUDCON ABDOVF RCIDL —SCKPBRG16—WUE ABDEN 51
SPBRGH EUSART Baud Rate Generator Register, High Byte 51
SPBRG EUSART Baud Rate Generator Register, Low Byte 51
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master transmission.
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.

PIC18F2X1X/4X1X
DS39636C-page 208 Preliminary © 2007 Microchip Technology Inc.
17.3.2 EUSART SYNCHRONOUS 
MASTER RECEPTION
Once Synchronous mode is selected, reception is
enabled by setting either the Single Receive Enable bit,
SREN (RCSTA<5>), or the Continuous Receive
Enable bit, CREN (RCSTA<4>). Data is sampled on the
RX pin on the falling edge of the clock.
If enable bit SREN is set, only a single word is received.
If enable bit CREN is set, the reception is continuous
until CREN is cleared. If both bits are set, then CREN
takes precedence.
To set up a Synchronous Master Reception:
1. Initialize the SPBRGH:SPBRG registers for the
appropriate baud rate. Set or clear the BRG16
bit, as required, to achieve the desired baud rate.
2. Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC.
3. Ensure bits CREN and SREN are clear.
4. If interrupts are desired, set enable bit RCIE.
5. If 9-bit reception is desired, set bit RX9.
6. If a single reception is required, set bit SREN.
For continuous reception, set bit CREN.
7. Interrupt flag bit RCIF will be set when reception
is complete and an interrupt will be generated if
the enable bit RCIE was set.
8. Read the RCSTA register to get the 9th bit (if
enabled) and determine if any error occurred
during reception.
9. Read the 8-bit received data by reading the
RCREG register.
10. If any error occurred, clear the error by clearing
bit CREN.
11. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
FIGURE 17-13: SYNCHRONOUS RECEPTION (MASTER MODE, SREN)       
TABLE 17-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION       
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
Reset 
Values on 
page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
RCREG EUSART Receive Register 51
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
BAUDCON ABDOVF RCIDL — SCKP BRG16 —WUE ABDEN 51
SPBRGH EUSART Baud Rate Generator Register, High Byte 51
SPBRG EUSART Baud Rate Generator Register, Low Byte 51
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master reception.
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.
CREN bit
RC7/RX/DT
RC7/TX/CK pin
Write to
bit SREN
SREN bit
RCIF bit
(Interrupt)
Read
RXREG
Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
‘
0
’
bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7
‘
0
’
Q1 Q2 Q3 Q4
Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0.
RC7/TX/CK pin
pin
(SCKP = 0)
(SCKP = 1)

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 209
PIC18F2X1X/4X1X
17.4 EUSART Synchronous 
Slave Mode
Synchronous Slave mode is entered by clearing bit,
CSRC (TXSTA<7>). This mode differs from the
Synchronous Master mode in that the shift clock is sup-
plied externally at the CK pin (instead of being supplied
internally in Master mode). This allows the device to
transfer or receive data while in any low-power mode. 
17.4.1 EUSART SYNCHRONOUS 
SLAVE TRANSMIT
The operation of the Synchronous Master and Slave
modes are identical, except in the case of the Sleep
mode.
If two words are written to the TXREG and then the
SLEEP instruction is executed, the following will occur:
a) The first word will immediately transfer to the
TSR register and transmit. 
b) The second word will remain in the TXREG
register. 
c) Flag bit TXIF will not be set. 
d) When the first word has been shifted out of TSR,
the TXREG register will transfer the second
word to the TSR and flag bit TXIF will now be
set. 
e) If enable bit TXIE is set, the interrupt will wake the
chip from Sleep. If the global interrupt is enabled,
the program will branch to the interrupt vector.
To set up a Synchronous Slave Transmission:
1. Enable the synchronous slave serial port by
setting bits SYNC and SPEN and clearing bit
CSRC.
2. Clear bits CREN and SREN.
3. If interrupts are desired, set enable bit TXIE.
4. If 9-bit transmission is desired, set bit TX9.
5. Enable the transmission by setting enable bit
TXEN.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit TX9D.
7. Start transmission by loading data to the
TXREGx register.
8. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
TABLE 17-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION       
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
TXREG EUSART Transmit Register 51
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
BAUDCON ABDOVF RCIDL — SCKP BRG16 —WUE ABDEN 51
SPBRGH EUSART Baud Rate Generator Register, High Byte 51
SPBRG EUSART Baud Rate Generator Register, Low Byte 51
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave transmission.
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.

PIC18F2X1X/4X1X
DS39636C-page 210 Preliminary © 2007 Microchip Technology Inc.
17.4.2 EUSART SYNCHRONOUS SLAVE 
RECEPTION
The operation of the Synchronous Master and Slave
modes is identical, except in the case of Sleep, or any
Idle mode and bit SREN, which is a “don’t care” in
Slave mode.
If receive is enabled by setting the CREN bit prior to
entering Sleep or any Idle mode, then a word may be
received while in this low-power mode. Once the word
is received, the RSR register will transfer the data to the
RCREG register; if the RCIE enable bit is set, the inter-
rupt generated will wake the chip from the low-power
mode. If the global interrupt is enabled, the program will
branch to the interrupt vector.
To set up a Synchronous Slave Reception:
1. Enable the synchronous master serial port by
setting bits SYNC and SPEN and clearing bit
CSRC.
2. If interrupts are desired, set enable bit RCIE.
3. If 9-bit reception is desired, set bit RX9.
4. To enable reception, set enable bit CREN.
5. Flag bit RCIF will be set when reception is
complete. An interrupt will be generated if
enable bit RCIE was set.
6. Read the RCSTA register to get the 9th bit (if
enabled) and determine if any error occurred
during reception.
7. Read the 8-bit received data by reading the
RCREG register.
8. If any error occurred, clear the error by clearing
bit CREN.
9. If using interrupts, ensure that the GIE and PEIE
bits in the INTCON register (INTCON<7:6>) are
set.
TABLE 17-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION      
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51
RCREG EUSART Receive Register 51
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51
BAUDCON ABDOVF RCIDL —SCKPBRG16—WUE ABDEN 51
SPBRGH EUSART Baud Rate Generator Register, High Byte 51
SPBRG EUSART Baud Rate Generator Register, Low Byte 51
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception.
Note 1: These bits are unimplemented on 28-pin devices and read as ‘0’.

PIC18F2X1X/4X1X

18.0 10-BIT ANALOG-TO-DIGITAL

CONVERTER (A/D) MODULE

The Analog-to-Digital (A/D) converter module has

10 inputs for the 28-pin devices and 13 for the 40/44-pin

devices. This module allows conversion of an analog

input signal to a corresponding 10-bit digital number.

The module has five registers:

• A/D Result High Register (ADRESH)

• A/D Result Low Register (ADRESL)

• A/D Control Register 0 (ADCON0)

• A/D Control Register 1 (ADCON1)

• A/D Control Register 2 (ADCON2)

The ADCON0 register, shown in Register 18-1,

controls the operation of the A/D module. The

ADCON1 register, shown in Register 18-2, configures

the functions of the port pins. The ADCON2 register,

shown in Register 18-3, configures the A/D clock

source, programmed acquisition time and justification.

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— CHS3 CHS2 CHS1 CHS0 GO/DONE ADON

bit 7 bit 0

bit 7-6 Unimplemented: Read as ‘0’

bit 5-2 CHS3:CHS0: Analog Channel Select bits

0000 = Channel 0 (AN0)

0001 = Channel 1 (AN1)

0010 = Channel 2 (AN2)

0011 = Channel 3 (AN3)

0100 = Channel 4 (AN4)

0101 = Channel 5 (AN5)(1,2)

0110 = Channel 6 (AN6)(1,2)

0111 = Channel 7 (AN7)(1,2)

1000 = Channel 8 (AN8)

1001 = Channel 9 (AN9)

1010 = Channel 10 (AN10)

1011 = Channel 11 (AN11)

1100 = Channel 12 (AN12

1101 = Unimplemented(2)

1110 = Unimplemented(2)

1111 = Unimplemented(2)

Note 1: These channels are not implemented on 28-pin devices.

2: Performing a conversion on unimplemented channels will return a floating input

measurement.

bit 1 GO/DONE: A/D Conversion Status bit

When ADON = 1:

1 = A/D conversion in progress

0 = A/D Idle

bit 0 ADON: A/D On bit

1 = A/D converter module is enabled

0 = A/D converter module is disabled

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

U-0 U-0 R/W-0 R/W-0 R/W-0(1) R/W(1) R/W(1) R/W(1)

—— VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0

bit 7 bit 0

bit 7-6 Unimplemented: Read as ‘0’

bit 5 VCFG1: Voltage Reference Configuration bit (VREF- source)

1 =V

REF- (AN2)

0 =V

bit 4 VCFG0: Voltage Reference Configuration bit (VREF+ source)

1 =VREF+ (AN3)

0 =V

bit 3-0 PCFG3:PCFG0: A/D Port Configuration Control bits:

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

A = Analog input D = Digital I/O

Note 1: The POR value of the PCFG bits depends on the value of the PBADEN

Configuration bit. When PBADEN = 1, PCFG<3:0> = 0000; when PBADEN = 0,

PCFG<3:0> = 0111.

2: AN5 through AN7 are available only on 40/44-pin devices.

PCFG3:

PCFG0

AN12

AN11

AN10

AN9

AN8

AN7(2)

AN6(2)

AN5(2)

AN4

AN3

AN2

AN1

AN0

0000(1) A A AAAAAAAAAAA

0001 A A AAAAAAAAAAA

0010 A A AAAAAAAAAAA

0011 DA AAAAAAAAAAA

0100 DD AAAAAAAAAAA

0101 DDDAAAAAAAAAA

0110 DDDDAAAAAAAAA

0111(1) DDDDDAAAAAAAA

1000 DDDDDDAAAAAAA

1001 D D DDDDDAAAAAA

1010 D D DDDDDDAAAAA

1011 D D DDDDDDDAAAA

1100 D D DDDDDDDDAAA

1101 D D DDDDDDDDDAA

1110 D D DDDDDDDDDDA

1111 D D DDDDDDDDDDD

PIC18F2X1X/4X1X

R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0

bit 7 bit 0

bit 7 ADFM: A/D Result Format Select bit

1 = Right justified

0 = Left justified

bit 6 Unimplemented: Read as ‘0’

bit 5-3 ACQT2:ACQT0: A/D Acquisition Time Select bits

111 = 20 T

110 = 16 TAD

101 = 12 TAD

100 = 8 TAD

011 = 6 TAD

010 = 4 TAD

001 = 2 TAD

000 = 0 TAD(1)

bit 2-0 ADCS2:ADCS0: A/D Conversion Clock Select bits

111 = FRC (clock derived from A/D RC oscillator)(1)

110 = FOSC/64

101 = FOSC/16

100 = FOSC/4

011 = FRC (clock derived from A/D RC oscillator)(1)

010 = FOSC/32

001 = FOSC/8

000 = FOSC/2

Note 1: If the A/D FRC clock source is selected, a delay of one TCY (instruction cycle) is

added before the A/D clock starts. This allows the SLEEP instruction to be executed

before starting a conversion.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

The analog reference voltage is software selectable

to either the device’s positive and negative supply

voltage (VDD and VSS), or the voltage level on the

RA3/AN3/VREF+ and RA2/AN2/VREF-/CVREF pins.

The A/D converter has a unique feature of being able

to operate while the device is in Sleep mode. To oper-

ate in Sleep, the A/D conversion clock must be derived

from the A/D’s internal RC oscillator.

The output of the sample and hold is the input into the

converter, which generates the result via successive

approximation.

A device Reset forces all registers to their Reset state.

This forces the A/D module to be turned off and any

conversion in progress is aborted.

Each port pin associated with the A/D converter can

be configured as an analog input, or as a digital I/O.

The ADRESH and ADRESL registers contain the

result of the A/D conversion. When the A/D

conversion is complete, the result is loaded into the

ADRESH:ADRESL register pair, the GO/DONE bit

(ADCON0 register) is cleared and A/D Interrupt Flag

bit ADIF is set. The block diagram of the A/D module

is shown in Figure 18-1.

FIGURE 18-1: A/D BLOCK DIAGRAM

(Input Voltage)

VAIN

VREF+

Reference

Voltage

VDD

VCFG1:VCFG0

CHS3:CHS0

AN7(1)

AN6(1)

AN5(1)

AN4

AN3

AN2

AN1

AN0

0111

0110

0101

0100

0011

0010

0001

0000

10-bit

Converter

VREF-

VSS

A/D

AN12

AN11

AN10

AN9

AN8

1100

1011

1010

1001

1000

Note 1: Channels AN5 through AN7 are not available on 28-pin devices.

2: I/O pins have diode protection to VDD and VSS.

PIC18F2X1X/4X1X

The value in the ADRESH:ADRESL registers is not

modified for a Power-on Reset. The ADRESH:ADRESL

registers will contain unknown data after a Power-on

Reset.

After the A/D module has been configured as desired,

the selected channel must be acquired before the con-

version is started. The analog input channels must

have their corresponding TRIS bits selected as an

input. To determine acquisition time, see Section 18.1

“A/D Acquisition Requirements”. After this acquisi-

tion time has elapsed, the A/D conversion can be

started. An acquisition time can be programmed to

occur between setting the GO/DONE bit and the actual

start of the conversion.

To perform an A/D conversion, do the following steps:

1. Configure the A/D module:

• Configure analog pins, voltage reference and

digital I/O (ADCON1)

• Select A/D input channel (ADCON0)

• Select A/D acquisition time (ADCON2)

• Select A/D conversion clock (ADCON2)

• Turn on A/D module (ADCON0)

2. Configure A/D interrupt (if desired):

• Clear ADIF bit

• Set ADIE bit

• Set GIE bit

3. Wait the required acquisition time (if required).

4. Start conversion:

• Set GO/DONE bit (ADCON0 register)

5. Wait for A/D conversion to complete, by either:

• Polling for the GO/DONE bit to be cleared

• Waiting for the A/D interrupt

6. Read A/D Result registers (ADRESH:ADRESL);

clear bit ADIF, if required.

7. For next conversion, go to step 1 or step 2, as

required. The A/D conversion time per bit is

defined as T

AD. A minimum wait of 2 TAD is

required before the next acquisition starts.

FIGURE 18-2: A/D TRANSFER FUNCTION

FIGURE 18-3: ANALOG INPUT MODEL

Digital Code Output

3FEh

003h

002h

001h

000h

0.5 LSB

1 LSB

1.5 LSB

2 LSB

2.5 LSB

1022 LSB

1022.5 LSB

3 LSB

Analog Input Voltage

3FFh

1023 LSB

1023.5 LSB

VAIN CPIN

Rs ANx

5 pF

VT = 0.6V

VT = 0.6V ILEAKAGE

RIC ≤ 1k

Sampling

Switch

SS RSS

CHOLD = 25 pF

VSS

VDD

± 100 nA

Legend: CPIN

ILEAKAGE

RIC

CHOLD

= input capacitance

= threshold voltage

= leakage current at the pin due to

= interconnect resistance

= sampling switch

= sample/hold capacitance (from DAC)

various junctions

= sampling switch resistanceRSS

VDD

Sampling Switch

1234

(kΩ)

PIC18F2X1X/4X1X

18.1 A/D Acquisition Requirements

For the A/D converter to meet its specified accuracy,

the charge holding capacitor (CHOLD) must be allowed

to fully charge to the input channel voltage level. The

analog input model is shown in Figure 18-3. The

source impedance (RS) and the internal sampling

switch (RSS) impedance directly affect the time

required to charge the capacitor CHOLD. The sampling

switch (RSS) impedance varies over the device voltage

(VDD). The source impedance affects the offset voltage

at the analog input (due to pin leakage current). The

maximum recommended impedance for analog

sources is 2.5 kΩ. After the analog input channel is

selected (changed), the channel must be sampled for

at least the minimum acquisition time before starting a

conversion.

To calculate the minimum acquisition time,

Equation 18-1 may be used. This equation assumes

that 1/2 LSb error is used (1024 steps for the A/D). The

1/2 LSb error is the maximum error allowed for the A/D

to meet its specified resolution.

Example 18-3 shows the calculation of the minimum

required acquisition time TACQ. This calculation is

based on the following application system

assumptions:

CHOLD = 25 pF

Rs = 2.5 kΩ

Conversion Error ≤1/2 LSb

VDD =5V → Rss = 2 kΩ

Temperature = 85°C (system max.)

EQUATION 18-1: ACQUISITION TIME

EQUATION 18-2: A/D MINIMUM CHARGING TIME

EQUATION 18-3: CALCULATING THE MINIMUM REQUIRED ACQUISITION TIME

Note: When the conversion is started, the

holding capacitor is disconnected from the

input pin.

TACQ = Amplifier Settling Tim e + Holding Capacitor Charging Time + Temperature Coefficient

AMP + TC + TCOFF

VHOLD = (VREF – (VREF/ 2048)) • (1 – e(-TC/CHOLD(RIC + RSS + RS)))

TC = -(CHOLD)(RIC + RSS + RS) ln(1/2048)

TACQ =TAMP + TC + TCOFF

TAMP =0.2 μs

TCOFF = (Tem p – 25 °C)(0.02 μs/°C)

(85°C – 25°C)(0.02 μs/°C)

1.2 μs

Temperature coefficient is only required for temperatures > 25°C. Below 25°C, TCOFF = 0 ms.

TC = -(CHOLD)(RIC + RSS + R S) ln(1/2047)

-(25 pF) (1 kΩ + 2 kΩ + 2.5 kΩ) ln(0.0004883)

1.05 μs

TACQ =0.2 μs + 1 μs + 1.2 μs

2.4 μs

PIC18F2X1X/4X1X

18.2 Selecting and Configuring

Acquisition Time

The ADCON2 register allows the user to select an

acquisition time that occurs each time the GO/DONE

bit is set. It also gives users the option to use an

automatically determined acquisition time.

Acquisition time may be set with the ACQT2:ACQT0

bits (ADCON2<5:3>), which provides a range of 2 to

20 TAD. When the GO/DONE bit is set, the A/D module

continues to sample the input for the selected acquisi-

tion time, then automatically begins a conversion.

Since the acquisition time is programmed, there may

be no need to wait for an acquisition time between

selecting a channel and setting the GO/DONE bit.

Manual acquisition is selected when

ACQT2:ACQT0 = 000. When the GO/DONE bit is set,

sampling is stopped and a conversion begins. The user

is responsible for ensuring the required acquisition time

has passed between selecting the desired input channel

and setting the GO/DONE bit. This option is also the

default Reset state of the ACQT2:ACQT0 bits and is

compatible with devices that do not offer programmable

acquisition times.

In either case, when the conversion is completed, the

GO/DONE bit is cleared, the ADIF flag is set and the

A/D begins sampling the currently selected channel

again. If an acquisition time is programmed, there is

nothing to indicate if the acquisition time has ended or

if the conversion has begun.

18.3 Selecting the A/D Conversion

Clock

The A/D conversion time per bit is defined as TAD. The

A/D conversion requires 11 TAD per 10-bit conversion.

The source of the A/D conversion clock is software

selectable. There are seven possible options for T

AD:

•2 T

OSC

•4 TOSC

•8 TOSC

•16 TOSC

•32 TOSC

•64 TOSC

• Internal RC Oscillator

For correct A/D conversions, the A/D conversion clock

(TAD) must be as short as possible, but greater than the

minimum TAD (see parameter 130 for more

information).

Table 18-1 shows the resultant T

AD times derived from

the device operating frequencies and the A/D clock

source selected.

TABLE 18-1: TAD vs. DEVICE OPERATING FREQUENCIES

AD Clock Source (TAD) Maximum Device Frequency

Operation ADCS2:ADCS0 PIC18FXXXX PIC18LFXXXX(4)

2 T

OSC 000 2.86 MHz 1.43 kHz

4 TOSC 100 5.71 MHz 2.86 MHz

8 T

OSC 001 11.43 MHz 5.72 MHz

16 TOSC 101 22.86 MHz 11.43 MHz

32 T

OSC 010 40.0 MHz 22.86 MHz

64 T

OSC 110 40.0 MHz 22.86 MHz

RC(3) x11 1.00 MHz(1) 1.00 MHz(2)

Note 1: The RC source has a typical TAD time of 0.9 μs.

2: The RC source has a typical TAD time of 1.2 μs.

3: For device frequencies above 1 MHz, the device must be in Sleep for the entire conversion or the A/D

accuracy may be out of specification.

4: Low-power (PIC18LFXXXX) devices only.

PIC18F2X1X/4X1X

18.4 Operation in Power-Managed

Modes

The selection of the automatic acquisition time and A/

D conversion clock is determined in part by the clock

source and frequency while in a power-managed

mode.

If the A/D is expected to operate while the device is in

a power-managed mode, the ACQT2:ACQT0 and

ADCS2:ADCS0 bits in ADCON2 should be updated in

accordance with the clock source to be used in that

mode. After entering the mode, an A/D acquisition or

conversion may be started. Once started, the device

should continue to be clocked by the same clock

source until the conversion has been completed.

If desired, the device may be placed into the

corresponding Idle mode during the conversion. If the

device clock frequency is less than 1 MHz, the A/D RC

clock source should be selected.

Operation in the Sleep mode requires the A/D FRC

clock to be selected. If bits ACQT2:ACQT0 are set to

‘000’ and a conversion is started, the conversion will be

delayed one instruction cycle to allow execution of the

SLEEP instruction and entry to Sleep mode. The IDLEN

bit (OSCCON<7>) must have already been cleared

prior to starting the conversion.

18.5 Configuring Analog Port Pins

The ADCON1, TRISA, TRISB and TRISE registers all

configure the A/D port pins. The port pins needed as

analog inputs must have their corresponding TRIS bits

set (input). If the TRIS bit is cleared (output), the digital

output level (VOH or VOL) will be converted.

The A/D operation is independent of the state of the

CHS3:CHS0 bits and the TRIS bits.

Note 1: When reading the Port register, all pins

configured as analog input channels will

read as cleared (a low level). Pins config-

ured as digital inputs will convert as

analog inputs. Analog levels on a digitally

configured input will be accurately

converted.

2: Analog levels on any pin defined as a

digital input may cause the digital input

buffer to consume current out of the

device’s specification limits.

3: The PBADEN bit in Configuration

reset as analog or digital pins by control-

ling how the PCFG0 bits in ADCON1 are

reset.

PIC18F2X1X/4X1X

18.6 A/D Conversions

Figure 18-4 shows the operation of the A/D converter

after the GO bit has been set and the ACQT2:ACQT0

bits are cleared. A conversion is started after the follow-

ing instruction to allow entry into Sleep mode before the

conversion begins.

Figure 18-5 shows the operation of the A/D converter

after the GO bit has been set and the ACQT2:ACQT0

bits are set to ‘010’ and selecting a 4 T

AD acquisition

time before the conversion starts.

Clearing the GO/DONE bit during a conversion will

abort the current conversion. The A/D Result register

pair will NOT be updated with the partially completed

A/D conversion sample. This means the

ADRESH:ADRESL registers will continue to contain

the value of the last completed conversion (or the last

value written to the ADRESH:ADRESL registers).

After the A/D conversion is completed or aborted, a

AD wait is required before the next acquisition can be

started. After this wait, acquisition on the selected

channel is automatically started.

18.7 Discharge

The discharge phase is used to initialize the value of

the capacitor array. The array is discharged before

every sample. This feature helps to optimize the unity-

gain amplifier, as the circuit always needs to charge the

capacitor array, rather than charge/discharge based on

previous measure values.

FIGURE 18-4: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 000, TACQ = 0)

FIGURE 18-5: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 010, TACQ = 4 TAD)

Note: The GO/DONE bit should NOT be set in

the same instruction that turns on the A/D.

TAD1TAD2TAD3TAD4 TAD5TAD6 TAD7TAD8 TAD11

Set GO bit

Holding capacitor is disconnected from analog input (typically 100 ns)

TAD9 TAD10

TCY - TAD

ADRESH:ADRESL is loaded, GO bit is cleared,

ADIF bit is set, holding capacitor is connected to analog input.

Conversion starts

b9 b6 b5 b4 b3 b2 b1

b8 b7

On the following cycle:

TAD1

Discharge

1234567811

Set GO bit

(Holding capacitor is disconnected)

910

Conversion starts

123 4

(Holding capacitor continues

acquiring input)

TACQT Cycles TAD Cycles

Automatic

Acquisition

Time

b0b9 b6 b5 b4 b3 b2 b1

b8 b7

ADRESH:ADRESL is loaded, GO bit is cleared,

ADIF bit is set, holding capacitor is connected to analog input.

On the following cycle:

TAD1

Discharge

PIC18F2X1X/4X1X
DS39636C-page 220 Preliminary © 2007 Microchip Technology Inc.
18.8 Use of the CCP2 Trigger
An A/D conversion can be started by the special event
trigger of the CCP2 module. This requires that the
CCP2M3:CCP2M0 bits (CCP2CON<3:0>) be pro-
grammed as ‘1011’ and that the A/D module is enabled
(ADON bit is set). When the trigger occurs, the GO/
DONE bit will be set, starting the A/D acquisition and
conversion and the Timer1 (or Timer3) counter will be
reset to zero. Timer1 (or Timer3) is reset to automati-
cally repeat the A/D acquisition period with minimal
software overhead (moving ADRESH:ADRESL to the
desired location). The appropriate analog input
channel must be selected and the minimum acquisition
period is either timed by the user, or an appropriate
TACQ time selected before the special event trigger sets
the GO/DONE bit (starts a conversion).
If the A/D module is not enabled (ADON is cleared), the
special event trigger will be ignored by the A/D module
but will still reset the Timer1 (or Timer3) counter.
 
TABLE 18-2: REGISTERS ASSOCIATED WITH A/D OPERATION     
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49
PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52
PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52
IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52
PIR2 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF 52
PIE2 OSCFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE 52
IPR2 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP 52
ADRESH  A/D Result Register, High Byte 51
ADRESL  A/D Result Register, Low Byte 51
ADCON0 —— CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 51
ADCON1 —— VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51
ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 51
PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52
TRISA TRISA7(2) TRISA6(2) PORTA Data Direction Control Register 52
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 52
TRISB PORTB Data Direction Control Register 52
LATB PORTB Data Latch Register (Read and Write to Data Latch) 52
PORTE(4) — — — —RE3
(3) RE2 RE1 RE0 52
TRISE(4) IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 52
LATE(4) — — — — — PORTE Data Latch Register 52
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for A/D conversion.
Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear.
2: PORTA<7:6> and their direction bits are individually configured as port pins based on various primary 
oscillator modes. When disabled, these bits read as ‘0’.
3: RE3 port bit is available only as an input pin when the MCLRE Configuration bit is ‘0’.
4: These registers are not implemented on 28-pin devices.

PIC18F2X1X/4X1X

19.0 COMPARATOR MODULE

The analog comparator module contains two compara-

tors that can be configured in a variety of ways. The

inputs can be selected from the analog inputs multiplexed

with pins RA0 through RA5, as well as the on-chip volt-

age reference (see Section 20.0 “Comparator Voltage

Reference Module”). The digital outputs (normal or

inverted) are available at the pin level and can also be

read through the control register.

The CMCON register (Register 19-1) selects the

comparator input and output configuration. Block

diagrams of the various comparator configurations are

shown in Figure 19-1.

R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1

C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0

bit 7 bit 0

bit 7 C2OUT: Comparator 2 Output bit

When C2INV = 0:

1 = C2 VIN+ > C2 VIN-

0 = C2 VIN+ < C2 VIN-

When C2INV = 1:

1 = C2 VIN+ < C2 VIN-

0 = C2 VIN+ > C2 VIN-

bit 6 C1OUT: Comparator 1 Output bit

When C1INV = 0:

1 = C1 VIN+ > C1 VIN-

0 = C1 VIN+ < C1 VIN-

When C1INV = 1:

1 = C1 VIN+ < C1 VIN-

0 = C1 VIN+ > C1 VIN-

bit 5 C2INV: Comparator 2 Output Inversion bit

1 = C2 output inverted

0 = C2 output not inverted

bit 4 C1INV: Comparator 1 Output Inversion bit

1 = C1 output inverted

0 = C1 output not inverted

bit 3 CIS: Comparator Input Switch bit

When CM2:CM0 = 110:

1 =C1 VIN+ connects to RA3/AN3/VREF+

C2 VIN+ connects to RA2/AN2/VREF-/CVREF

0 =C1 VIN- connects to RA0/AN0

C2 VIN- connects to RA1/AN1

bit 2-0 CM2:CM0: Comparator Mode bits

Figure 19-1 shows the Comparator modes and the CM2:CM0 bit settings.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

19.1 Comparator Configuration

There are eight modes of operation for the compara-

tors, shown in Figure 19-1. Bits CM2:CM0 of the

CMCON register are used to select these modes. The

TRISA register controls the data direction of the com-

parator pins for each mode. If the Comparator mode is

changed, the comparator output level may not be valid

for the specified mode change delay shown in

Section 25.0 “Electrical Characteristics”.

FIGURE 19-1: COMPARATOR I/O OPERATING MODES

Note: Comparator interrupts should be disabled

during a Comparator mode change;

otherwise, a false interrupt may occur.

RA0/AN0 VIN-

VIN+

RA3/AN3/ Off (Read as ‘0’)

Comparators Reset

CM2:CM0 = 000

RA1/AN1 VIN-

VIN+

RA2/AN2/ Off (Read as ‘0’)

VIN-

VIN+C1OUT

Two Independent Comparators

CM2:CM0 = 010

VIN-

VIN+C2OUT

VIN-

VIN+C1OUT

Two Common Reference Comparators

CM2:CM0 = 100

VIN-

VIN+C2OUT

VIN-

VIN+Off (Read as ‘0’)

One Independent Comparator with Output

CM2:CM0 = 001

VIN-

VIN+C1OUT

VIN-

VIN+Off (Read as ‘0’)

Comparators Off (POR Default Value)

CM2:CM0 = 111

VIN-

VIN+Off (Read as ‘0’)

VIN-

VIN+C1OUT

Four Inputs Multiplexed to Two Comparators

CM2:CM0 = 110

VIN-

VIN+C2OUT

From VREF Module

CIS = 0

CIS = 1

CIS = 0

CIS = 1

VIN-

VIN+C1OUT

Two Common Reference Comparators with Outputs

CM2:CM0 = 101

VIN-

VIN+C2OUT

A = Analog Input, port reads zeros always D = Digital Input CIS (CMCON<3>) is the Comparator Input Switch

CVREF

VIN-

VIN+C1OUT

Two Independent Comparators with Outputs

CM2:CM0 = 011

VIN-

VIN+C2OUT

RA5/AN4/SS/HLVDIN/C2OUT*

RA4/T0CKI/C1OUT*

VREF+

VREF-/CVREF

RA0/AN0

RA3/AN3/

RA1/AN1

RA2/AN2/

VREF+

VREF-/CVREF

RA0/AN0

RA3/AN3/

RA1/AN1

RA2/AN2/

VREF+

VREF-/CVREF

RA0/AN0

RA3/AN3/

RA1/AN1

RA2/AN2/

VREF+

VREF-/CVREF

RA0/AN0

RA3/AN3/

RA1/AN1

RA2/AN2/

VREF+

VREF-/CVREF

RA0/AN0

RA3/AN3/

RA1/AN1

RA2/AN2/

VREF+

VREF-/CVREF

RA0/AN0

RA3/AN3/

VREF+

RA1/AN1

RA2/AN2/

VREF-/CVREF

RA4/T0CKI/C1OUT*

RA5/AN4/SS/HLVDIN/C2OUT*

RA0/AN0

RA3/AN3/

VREF+

RA1/AN1

RA2/AN2/

VREF-/CVREF

RA4/T0CKI/C1OUT*

* Setting the TRISA<5:4> bits will disable the comparator outputs by configuring the pins as inputs.

PIC18F2X1X/4X1X

19.2 Comparator Operation

A single comparator is shown in Figure 19-2, along with

the relationship between the analog input levels and

the digital output. When the analog input at VIN+ is less

than the analog input VIN-, the output of the comparator

is a digital low level. When the analog input at VIN+ is

greater than the analog input VIN-, the output of the

comparator is a digital high level. The shaded areas of

the output of the comparator in Figure 19-2 represent

the uncertainty, due to input offsets and response time.

19.3 Comparator Reference

Depending on the comparator operating mode, either

an external or internal voltage reference may be used.

The analog signal present at VIN- is compared to the

signal at VIN+ and the digital output of the comparator

is adjusted accordingly (Figure 19-2).

FIGURE 19-2: SINGLE COMPARATOR

19.3.1 EXTERNAL REFERENCE SIGNAL

When external voltage references are used, the

comparator module can be configured to have the com-

parators operate from the same or different reference

sources. However, threshold detector applications may

require the same reference. The reference signal must

be between VSS and VDD and can be applied to either

pin of the comparator(s).

19.3.2 INTERNAL REFERENCE SIGNAL

The comparator module also allows the selection of an

internally generated voltage reference from the

comparator voltage reference module. This module is

described in more detail in Section 20.0 “Comparator

Voltage Reference Module”.

The internal reference is only available in the mode

where four inputs are multiplexed to two comparators

(CM2:CM0 = 110). In this mode, the internal voltage

reference is applied to the VIN+ pin of both

comparators.

19.4 Comparator Response Time

Response time is the minimum time, after selecting a

new reference voltage or input source, before the

comparator output has a valid level. If the internal

reference is changed, the maximum delay of the

internal voltage reference must be considered when

using the comparator outputs. Otherwise, the

maximum delay of the comparators should be used

(see Section 25.0 “Electrical Characteristics”).

19.5 Comparator Outputs

The comparator outputs are read through the CMCON

outputs may also be directly output to the RA4 and RA5

I/O pins. When enabled, multiplexors in the output path

of the RA4 and RA5 pins will switch and the output of

each pin will be the unsynchronized output of the

comparator. The uncertainty of each of the

comparators is related to the input offset voltage and

the response time given in the specifications.

Figure 19-3 shows the comparator output block

diagram.

The TRISA bits will still function as an output enable/

disable for the RA4 and RA5 pins while in this mode.

The polarity of the comparator outputs can be changed

using the C2INV and C1INV bits (CMCON<4:5>).

–

VIN+

VIN-

Output

VIN-

VIN+

Note 1: When reading the Port register, all pins

configured as analog inputs will read as a

‘0’. Pins configured as digital inputs will

convert an analog input according to the

Schmitt Trigger input specification.

2: Analog levels on any pin defined as a

digital input may cause the input buffer to

consume more current than is specified.

PIC18F2X1X/4X1X

FIGURE 19-3: COMPARATOR OUTPUT BLOCK DIAGRAM

19.6 Comparator Interrupts

The comparator interrupt flag is set whenever there is

a change in the output value of either comparator.

Software will need to maintain information about the

status of the output bits, as read from CMCON<7:6>, to

determine the actual change that occurred. The CMIF

bit (PIR2<6>) is the Comparator Interrupt Flag. The

CMIF bit must be reset by clearing it. Since it is also

possible to write a ‘1’ to this register, a simulated

interrupt may be initiated.

Both the CMIE bit (PIE2<6>) and the PEIE bit

(INTCON<6>) must be set to enable the interrupt. In

addition, the GIE bit (INTCON<7>) must also be set. If

any of these bits are clear, the interrupt is not enabled,

though the CMIF bit will still be set if an interrupt

condition occurs.

The user, in the Interrupt Service Routine, can clear the

interrupt in the following manner:

a) Any read or write of CMCON will end the

mismatch condition.

b) Clear flag bit CMIF.

A mismatch condition will continue to set flag bit CMIF.

Reading CMCON will end the mismatch condition and

allow flag bit CMIF to be cleared.

19.7 Comparator Operation

During Sleep

When a comparator is active and the device is placed

in Sleep mode, the comparator remains active and the

interrupt is functional if enabled. This interrupt will

wake-up the device from Sleep mode, when enabled.

Each operational comparator will consume additional

current, as shown in the comparator specifications. To

minimize power consumption while in Sleep mode, turn

off the comparators (CM2:CM0 = 111) before entering

Sleep. If the device wakes up from Sleep, the contents

of the CMCON register are not affected.

19.8 Effects of a Reset

A device Reset forces the CMCON register to its Reset

state, causing the comparator modules to be turned off

(CM2:CM0 = 111). However, the input pins (RA0

through RA3) are configured as analog inputs by

default on device Reset. The I/O configuration for these

pins is determined by the setting of the PCFG3:PCFG0

bits (ADCON1<3:0>). Therefore, device current is

minimized when analog inputs are present at Reset

time.

To RA4 or

RA5 pin

Bus

Data

Set

MULTIPLEX

CMIF

bit

Port pins

Read CMCON

Reset

From

other

Comparator

CxINV

EN CL

Note: If a change in the CMCON register

(C1OUT or C2OUT) should occur when a

read operation is being executed (start of

the Q2 cycle), then the CMIF (PIR

registers) interrupt flag may not get set.

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 225
PIC18F2X1X/4X1X
19.9 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 19-4. Since the analog pins are connected to a
digital output, they have reverse biased diodes to VDD
and VSS. The analog input, therefore, must be between
VSS and VDD. If the input voltage deviates from this
range by more than 0.6V in either direction, one of the
diodes is forward biased and a latch-up condition may
occur. A maximum source impedance of 10 kΩ is
recommended for the analog sources. Any external
component connected to an analog input pin, such as
a capacitor or a Zener diode, should have very little
leakage current.
FIGURE 19-4: COMPARATOR ANALOG INPUT MODEL        
TABLE 19-1: REGISTERS ASSOCIATED WITH COMPARATOR MODULE  
VA
RS < 10k
AIN
CPIN
5 pF
VDD
VT = 0.6V
VT = 0.6V
RIC
ILEAKAGE
±500 nA
VSS
Legend: CPIN = Input Capacitance
VT= Threshold Voltage
ILEAKAGE =  Leakage Current at the pin due to various junctions
RIC = Interconnect Resistance
RS= Source Impedance
VA = Analog Voltage
Comparator
Input
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset 
Values 
on page
CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 51
CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 51
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 52
PIR2 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF 52
PIE2 OCSFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE 52
IPR2 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP 52
PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52
LATA LATA7(1) LATA6(1) PORTA Data Latch Register (Read and Write to Data Latch) 52
TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Control Register 52
Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the comparator module.
Note 1: PORTA<7:6> and their direction and latch bits are individually configured as port pins based on various 
primary oscillator modes. When disabled, these bits read as ‘0’.

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

20.0 COMPARATOR VOLTAGE

REFERENCE MODULE

The comparator voltage reference is a 16-tap resistor

ladder network that provides a selectable reference

voltage. Although its primary purpose is to provide a

reference for the analog comparators, it may also be

used independently of them.

A block diagram of the module is shown in Figure 20-1.

The resistor ladder is segmented to provide two ranges

of CVREF values and has a power-down function to

conserve power when the reference is not being used.

The module’s supply reference can be provided from

either device VDD/VSS or an external voltage reference.

20.1 Configuring the Comparator

Voltage Reference

The voltage reference module is controlled through the

CVRCON register (Register 20-1). The comparator

voltage reference provides two ranges of output

voltage, each with 16 distinct levels. The range to be

used is selected by the CVRR bit (CVRCON<5>). The

primary difference between the ranges is the size of the

steps selected by the CVREF selection bits

(CVR3:CVR0), with one range offering finer resolution.

The equations used to calculate the output of the

comparator voltage reference are as follows:

If CVRR = 1:

CVREF = ((CVR3:CVR0)/24) x CVRSRC

If CVRR = 0:

CVREF = (CVRSRC x 1/4) + (((CVR3:CVR0)/32) x

CVRSRC)

The comparator reference supply voltage can come

from either VDD and VSS, or the external VREF+ and

VREF- that are multiplexed with RA2 and RA3. The

voltage source is selected by the CVRSS bit

(CVRCON<4>).

The settling time of the comparator voltage reference

must be considered when changing the CVREF

output (see Table 25-3 in Section 25.0 “Electrical

Characteristics”).

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

CVREN CVROE(1) CVRR CVRSS CVR3 CVR2 CVR1 CVR0

bit 7 bit 0

bit 7 CVREN: Comparator Voltage Reference Enable bit

1 =CV

REF circuit powered on

0 =CV

REF circuit powered down

bit 6 CVROE: Comparator VREF Output Enable bit(1)

1 =CVREF voltage level is also output on the RA2/AN2/VREF-/CVREF pin

0 =CV

REF voltage is disconnected from the RA2/AN2/VREF-/CVREF pin

Note 1: CVROE overrides the TRISA<2> bit setting.

bit 5 CVRR: Comparator VREF Range Selection bit

1 = 0 to 0.667 CVRSRC, with CVRSRC/24 step size (low range)

0 = 0.25 CVRSRC to 0.75 CVRSRC, with CVRSRC/32 step size (high range)

bit 4 CVRSS: Comparator VREF Source Selection bit

1 = Comparator reference source, CVRSRC = (VREF+) – (VREF-)

0 = Comparator reference source, CVRSRC = VDD – VSS

bit 3-0 CVR3:CVR0: Comparator VREF Value Selection bits (0 ≤ (CVR3:CVR0) ≤ 15)

When CVRR = 1:

CVREF = ((CVR3:CVR0)/24) • (CVRSRC)

When CVRR = 0:

CVREF = (CVRSRC/4) + ((CVR3:CVR0)/32) • (CVRSRC)

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

FIGURE 20-1: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM

20.2 Voltage Reference Accuracy/Error

The full range of voltage reference cannot be realized

due to the construction of the module. The transistors

on the top and bottom of the resistor ladder network

(Figure 20-1) keep CVREF from approaching the refer-

ence source rails. The voltage reference is derived

from the reference source; therefore, the CVREF output

changes with fluctuations in that source. The tested

absolute accuracy of the voltage reference can be

found in Section 25.0 “Electrical Characteristics”.

20.3 Operation During Sleep

When the device wakes up from Sleep through an

interrupt or a Watchdog Timer time-out, the contents of

the CVRCON register are not affected. To minimize

current consumption in Sleep mode, the voltage

reference should be disabled.

20.4 Effects of a Reset

A device Reset disables the voltage reference by

clearing bit CVREN (CVRCON<7>). This Reset also

disconnects the reference from the RA2 pin by clearing

bit CVROE (CVRCON<6>) and selects the high-voltage

range by clearing bit CVRR (CVRCON<5>). The CVR

value select bits are also cleared.

20.5 Connection Considerations

The voltage reference module operates independently

of the comparator module. The output of the reference

generator may be connected to the RA2 pin if the

CVROE bit is set. Enabling the voltage reference out-

put onto RA2 when it is configured as a digital input will

increase current consumption. Connecting RA2 as a

digital output with CVRSS enabled will also increase

current consumption.

The RA2 pin can be used as a simple D/A output with

limited drive capability. Due to the limited current drive

capability, a buffer must be used on the voltage

reference output for external connections to VREF.

Figure 20-2 shows an example buffering technique.

16-to-1 MUX

CVR3:CVR0

CVREN

CVRSS = 0

VDD

VREF+CVRSS = 1

CVRSS = 0

VREF-CVRSS = 1

16 Steps

CVRR

CVREF

PIC18F2X1X/4X1X

FIGURE 20-2: COMPARATOR VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE

TABLE 20-1: REGISTERS ASSOCIATED WITH COMPARATOR VOLTAGE REFERENCE

CVREF Output

–

CVREF

Module

Voltage

Reference

Output

Impedance

R(1)

RA2

Note 1: R is dependent upon the voltage reference configuration bits, CVRCON<3:0> and CVRCON<5>.

PIC18FXXXX

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Reset

Values

on page

CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 51

CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 51

TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Control Register 52

Legend: Shaded cells are not used with the comparator voltage reference.

Note 1: PORTA pins are enabled based on oscillator configuration.

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

21.0 HIGH/LOW-VOLTAGE DETECT

(HLVD)

PIC18F2X1X/4X1X devices have a High/Low-Voltage

Detect module (HLVD). This is a programmable circuit

that allows the user to specify both a device voltage trip

point and the direction of change from that point. If the

device experiences an excursion past the trip point in

that direction, an interrupt flag is set. If the interrupt is

enabled, the program execution will branch to the inter-

rupt vector address and the software can then respond

to the interrupt.

The High/Low-Voltage Detect Control register

(Register 21-1) completely controls the operation of the

HLVD module. This allows the circuitry to be “turned

off” by the user under software control, which

minimizes the current consumption for the device.

The block diagram for the HLVD module is shown in

Figure 21-1.

R/W-0 U-0 R-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1

VDIRMAG — IRVST HLVDEN HLVDL3 HLVDL2 HLVDL1 HLVDL0

bit 7 bit 0

bit 7 VDIRMAG: Voltage Direction Magnitude Select bit

1 = Event occurs when voltage equals or exceeds trip point (HLVDL3:HLDVL0)

0 = Event occurs when voltage equals or falls below trip point (HLVDL3:HLVDL0)

bit 6 Unimplemented: Read as ‘0’

bit 5 IRVST: Internal Reference Voltage Stable Flag bit

1 = Indicates that the voltage detect logic will generate the interrupt flag at the specified voltage

range

0 = Indicates that the voltage detect logic will not generate the interrupt flag at the specified

voltage range and the HLVD interrupt should not be enabled

bit 4 HLVDEN: High/Low-Voltage Detect Power Enable bit

1 = HLVD enabled

0 = HLVD disabled

bit 3-0 HLVDL3:HLVDL0: Voltage Detection Limit bits

1111 = External analog input is used (input comes from the HLVDIN pin)

1110 = Maximum setting

0000 = Minimum setting

Note: See Table 25-4 in Section 25.0 “Electrical Characteristics” for the specifications.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2X1X/4X1X

The module is enabled by setting the HLVDEN bit.

Each time that the HLVD module is enabled, the

circuitry requires some time to stabilize. The IRVST bit

is a read-only bit and is used to indicate when the circuit

is stable. The module can only generate an interrupt

after the circuit is stable and IRVST is set.

The VDIRMAG bit determines the overall operation of

the module. When VDIRMAG is cleared, the module

monitors for drops in VDD below a predetermined set

point. When the bit is set, the module monitors for rises

in VDD above the set point.

21.1 Operation

When the HLVD module is enabled, a comparator uses

an internally generated reference voltage as the set

point. The set point is compared with the trip point,

where each node in the resistor divider represents a

trip point voltage. The “trip point” voltage is the voltage

level at which the device detects a high or low-voltage

event, depending on the configuration of the module.

When the supply voltage is equal to the trip point, the

voltage tapped off of the resistor array is equal to the

internal reference voltage generated by the voltage

reference module. The comparator then generates an

interrupt signal by setting the HLVDIF bit.

The trip point voltage is software programmable to any

one of 16 values. The trip point is selected by

programming the HLVDL3:HLVDL0 bits

(HLVDCON<3:0>).

The HLVD module has an additional feature that allows

the user to supply the trip voltage to the module from an

external source. This mode is enabled when bits

HLVDL3:HLVDL0 are set to ‘1111’. In this state, the

comparator input is multiplexed from the external input

pin, HLVDIN. This gives users flexibility because it

allows them to configure the High/Low-Voltage Detect

interrupt to occur at any voltage in the valid operating

range.

FIGURE 21-1: HLVD MODULE BLOCK DIAGRAM (WITH EXTERNAL INPUT)

Set

VDD

16 to 1 MUX

HLVDEN

HLVDCON

HLVDIN

HLVDL3:HLVDL0

HLVDIN

VDD

Externally Generated

Trip Point

HLVDIF

HLVDEN

BOREN

Internal Voltage

Reference

VDIRMAG

PIC18F2X1X/4X1X

21.2 HLVD Setup

The following steps are needed to set up the HLVD

module:

1. Disable the module by clearing the HLVDEN bit

(HLVDCON<4>).

2. Write the value to the HLVDL3:HLVDL0 bits that

selects the desired HLVD trip point.

3. Set the VDIRMAG bit to detect high voltage

(VDIRMAG = 1) or low voltage (VDIRMAG = 0).

4. Enable the HLVD module by setting the

HLVDEN bit.

5. Clear the HLVD interrupt flag (PIR2<2>), which

may have been set from a previous interrupt.

6. Enable the HLVD interrupt if interrupts are

desired by setting the HLVDIE and GIE bits

(PIE<2> and INTCON<7>). An interrupt will not

be generated until the IRVST bit is set.

21.3 Current Consumption

When the module is enabled, the HLVD comparator

and voltage divider are enabled and will consume static

current. The total current consumption, when enabled,

is specified in electrical specification parameter D022B.

Depending on the application, the HLVD module does

not need to be operating constantly. To decrease the

current requirements, the HLVD circuitry may only

need to be enabled for short periods where the voltage

is checked. After doing the check, the HLVD module

may be disabled.

21.4 HLVD Start-up Time

The internal reference voltage of the HLVD module,

specified in electrical specification parameter D420,

may be used by other internal circuitry, such as the

Programmable Brown-out Reset. If the HLVD or other

circuits using the voltage reference are disabled to

lower the device’s current consumption, the reference

voltage circuit will require time to become stable before

a low or high-voltage condition can be reliably

detected. This start-up time, TIRVST, is an interval that

is independent of device clock speed. It is specified in

electrical specification parameter 36.

The HLVD interrupt flag is not enabled until TIRVST has

expired and a stable reference voltage is reached. For

this reason, brief excursions beyond the set point may

not be detected during this interval. Refer to

Figure 21-2 or Figure 21-3.

FIGURE 21-2: LOW-VOLTAGE DETECT OPERATION (VDIRMAG = 0)

VLVD

VDD

HLVDIF

VLVD

VDD

Enable HLVD

TIVRST

HLVDIF may not be set

Enable HLVD

HLVDIF

HLVDIF cleared in software

HLVDIF cleared in software,

CASE 1:

CASE 2:

HLVDIF remains set since HLVD condition still exists

TIVRST

Internal Reference is stable

IRVST

PIC18F2X1X/4X1X

FIGURE 21-3: HIGH-VOLTAGE DETECT OPERATION (VDIRMAG = 1)

21.5 Applications

In many applications, the ability to detect a drop below

or rise above a particular threshold is desirable. For

example, the HLVD module could be periodically

enabled to detect a Universal Serial Bus (USB) attach

or detach. This assumes the device is powered by a

lower voltage source than the USB when detached. An

attach would indicate a high-voltage detect from, for

example, 3.3V to 5V (the voltage on USB) and vice

versa for a detach. This feature could save a design a

few extra components and an attach signal (input pin).

For general battery applications, Figure 21-4 shows a

possible voltage curve. Over time, the device voltage

decreases. When the device voltage reaches voltage

VA, the HLVD logic generates an interrupt at time TA.

The interrupt could cause the execution of an ISR,

which would allow the application to perform “house-

keeping tasks” and perform a controlled shutdown

before the device voltage exits the valid operating

range at TB. The HLVD thus would give the application

a time window, represented by the difference between

TA and TB, to safely exit.

FIGURE 21-4: TYPICAL

HIGH/LOW-VOLTAGE

DETECT APPLICATION

VLVD

VDD

HLVDIF

VLVD

VDD

Enable HLVD

TIVRST

HLVDIF may not be set

Enable HLVD

HLVDIF

HLVDIF cleared in software

HLVDIF cleared in software,

CASE 1:

CASE 2:

HLVDIF remains set since HLVD condition still exists

TIVRST

IRVST

Internal Reference is stable

IRVST

Time

Voltage

TATB

VA = HLVD trip point

VB = Minimum valid device

operating voltage

Legend:

PIC18F2X1X/4X1X

21.6 Operation During Sleep

When enabled, the HLVD circuitry continues to operate

during Sleep. If the device voltage crosses the trip

point, the HLVDIF bit will be set and the device will

wake-up from Sleep. Device execution will continue

from the interrupt vector address if interrupts have

been globally enabled.

21.7 Effects of a Reset

A device Reset forces all registers to their Reset state.

This forces the HLVD module to be turned off.

TABLE 21-1: REGISTERS ASSOCIATED WITH HIGH/LOW-VOLTAGE DETECT MODULE

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Reset

Values

on Page

HLVDCON VDIRMAG — IRVST HLVDEN HLVDL3 HLVDL2 HLVDL1 HLVDL0 50

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49

PIR2 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF 52

PIE2 OCSFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE 52

IPR2 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP 52

Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the HLVD module.

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

22.0 SPECIAL FEATURES OF

THE CPU

PIC18F2X1X/4X1X devices include several features

intended to maximize reliability and minimize cost

through elimination of external components. These are:

• Oscillator Selection

• Resets:

- Power-on Reset (POR)

- Power-up Timer (PWRT)

- Oscillator Start-up Timer (OST)

- Brown-out Reset (BOR)

• Interrupts

• Watchdog Timer (WDT)

• Fail-Safe Clock Monitor

• Two-Speed Start-up

• Code Protection

• ID Locations

• In-Circuit Serial Programming

The oscillator can be configured for the application

depending on frequency, power, accuracy and cost. All

of the options are discussed in detail in Section 2.0

“Oscillator Configurations”.

A complete discussion of device Resets and interrupts

is available in previous sections of this data sheet.

In addition to their Power-up and Oscillator Start-up

Timers provided for Resets, PIC18F2X1X/4X1X

devices have a Watchdog Timer, which is either

permanently enabled via the Configuration bits or

software controlled (if configured as disabled).

The inclusion of an internal RC oscillator also provides

the additional benefits of a Fail-Safe Clock Monitor

(FSCM) and Two-Speed Start-up. FSCM provides for

background monitoring of the peripheral clock and

automatic switchover in the event of its failure. Two-

Speed Start-up enables code to be executed almost

immediately on start-up, while the primary clock source

completes its start-up delays.

All of these features are enabled and configured by

setting the appropriate Configuration register bits.

22.1 Configuration Bits

The Configuration bits can be programmed (read as

‘0’) or left unprogrammed (read as ‘1’) to select various

device configurations. These bits are mapped starting

at program memory location 300000h.

The user will note that address 300000h is beyond the

user program memory space. In fact, it belongs to the

configuration memory space (300000h-3FFFFFh), which

can only be accessed using table reads.

TABLE 22-1: CONFIGURATION BITS AND DEVICE IDs

File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Default/

Unprogrammed

Value

300001h CONFIG1H IESO FCMEN ——FOSC3FOSC2FOSC1FOSC000-- 0111

300002h CONFIG2L — — — BORV1 BORV0 BOREN1 BOREN0 PWRTEN ---1 1111

300003h CONFIG2H — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN ---1 1111

300005h CONFIG3H MCLRE — — — — LPT1OSC PBADEN CCP2MX 1--- -011

300006h CONFIG4L DEBUG XINST — — —LVP—STVREN10-- -1-1

300008h CONFIG5L — — — —CP3

(1,2) CP2(1) CP1 CP0 ---- 1111

300009h CONFIG5H —CPB— — — — — — -1-- ----

30000Ah CONFIG6L — — — —WRT3

(1,2) WRT2(1) WRT1 WRT0 ---- 1111

30000Bh CONFIG6H — WRTB WRTC — — — — — -11- ----

30000Ch CONFIG7L — — — —EBTR3

(1,2) EBTR2(1) EBTR1 EBTR0 ---- 1111

30000Dh CONFIG7H —EBTRB— — — — — — -1-- ----

3FFFFEh DEVID1(3) DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 xxxx xxxx(3)

3FFFFFh DEVID2(3) DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 0000 1100

Legend: x = unknown, u = unchanged, — = unimplemented, q = value depends on condition.

Shaded cells are unimplemented, read as ‘0’.

Note 1: Unimplemented in PIC18F2410/4410 devices; maintain this bit set.

2: Unimplemented in PIC18F2515/4515 devices, maintain this bit set.

3: See Register 22-14 for DEVID1 values. DEVID registers are read-only and cannot be programmed by the user.

PIC18F2X1X/4X1X

R/P-0 R/P-0 U-0 U-0 R/P-0 R/P-1 R/P-1 R/P-1

IESO FCMEN —— FOSC3 FOSC2 FOSC1 FOSC0

bit 7 bit 0

bit 7 IESO: Internal/External Oscillator Switchover bit

1 = Oscillator Switchover mode enabled

0 = Oscillator Switchover mode disabled

bit 6 FCMEN: Fail-Safe Clock Monitor Enable bit

1 = Fail-Safe Clock Monitor enabled

0 = Fail-Safe Clock Monitor disabled

bit 5-4 Unimplemented: Read as ‘0’

bit 3-0 FOSC3:FOSC0: Oscillator Selection bits

11xx = External RC oscillator, CLKO function on RA6

101x = External RC oscillator, CLKO function on RA6

1001 = Internal oscillator block, CLKO function on RA6, port function on RA7

1000 = Internal oscillator block, port function on RA6 and RA7

0111 = External RC oscillator, port function on RA6

0110 = HS oscillator, PLL enabled (Clock Frequency = 4 x FOSC1)

0101 = EC oscillator, port function on RA6

0100 = EC oscillator, CLKO function on RA6

0011 = External RC oscillator, CLKO function on RA6

0010 = HS oscillator

0001 = XT oscillator

0000 = LP oscillator

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2X1X/4X1X

U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1

— — —BORV1

(1) BORV0(1) BOREN1(2) BOREN0(2) PWRTEN(2)

bit 7 bit 0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-3 BORV1:BORV0: Brown-out Reset Voltage bits(1)

11 = Minimum setting

00 = Maximum setting

bit 2-1 BOREN1:BOREN0: Brown-out Reset Enable bits(2)

11 = Brown-out Reset enabled in hardware only (SBOREN is disabled)

10 = Brown-out Reset enabled in hardware only and disabled in Sleep mode

(SBOREN is disabled)

01 = Brown-out Reset enabled and controlled by software (SBOREN is enabled)

00 = Brown-out Reset disabled in hardware and software

bit 0 PWRTEN: Power-up Timer Enable bit(2)

1 = PWRT disabled

0 = PWRT enabled

Note 1: See Section 25.1 “DC Characteristics” for the specifications.

2: The Power-up Timer is decoupled from Brown-out Reset, allowing these features to

be independently controlled.

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2X1X/4X1X

U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1

— — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN

bit 7 bit 0

bit 7-5 Unimplemented: Read as ‘0’

bit 4-1 WDTPS3:WDTPS0: Watchdog Timer Postscale Select bits

1111 = 1:32,768

1110 = 1:16,384

1101 = 1:8,192

1100 = 1:4,096

1011 = 1:2,048

1010 = 1:1,024

1001 = 1:512

1000 = 1:256

0111 = 1:128

0110 = 1:64

0101 = 1:32

0100 = 1:16

0011 = 1:8

0010 = 1:4

0001 = 1:2

0000 = 1:1

bit 0 WDTEN: Watchdog Timer Enable bit

1 = WDT enabled

0 = WDT disabled (control is placed on the SWDTEN bit)

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2X1X/4X1X

R/P-1 U-0 U-0 U-0 U-0 R/P-0 R/P-1 R/P-1

MCLRE ———— LPT1OSC PBADEN CCP2MX

bit 7 bit 0

bit 7 MCLRE: MCLR Pin Enable bit

1 = MCLR pin enabled; RE3 input pin disabled

0 = RE3 input pin enabled; MCLR disabled

bit 6-3 Unimplemented: Read as ‘0’

bit 2 LPT1OSC: Low-Power Timer1 Oscillator Enable bit

1 = Timer1 configured for low-power operation

0 = Timer1 configured for higher power operation

bit 1 PBADEN: PORTB A/D Enable bit

(Affects ADCON1 Reset state. ADCON1 controls PORTB<4:0> pin configuration.)

1 = PORTB<4:0> pins are configured as analog input channels on Reset

0 = PORTB<4:0> pins are configured as digital I/O on Reset

bit 0 CCP2MX: CCP2 Mux bit

1 = CCP2 input/output is multiplexed with RC1

0 = CCP2 input/output is multiplexed with RB3

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

R/P-1 R/P-0 U-0 U-0 U-0 R/P-1 U-0 R/P-1

DEBUG XINST — — —LVP—STVREN

bit 7 bit 0

bit 7 DEBUG: Background Debugger Enable bit

1 = Background debugger disabled, RB6 and RB7 configured as general purpose I/O pins

0 = Background debugger enabled, RB6 and RB7 are dedicated to In-Circuit Debug

bit 6 XINST: Extended Instruction Set Enable bit

1 = Instruction set extension and Indexed Addressing mode enabled

0 = Instruction set extension and Indexed Addressing mode disabled (Legacy mode)

bit 5-3 Unimplemented: Read as ‘0’

bit 2 LVP: Single-Supply ICSP Enable bit

1 = Single-Supply ICSP enabled

0 = Single-Supply ICSP disabled

bit 1 Unimplemented: Read as ‘0’

bit 0 STVREN: Stack Full/Underflow Reset Enable bit

1 = Stack full/underflow will cause Reset

0 = Stack full/underflow will not cause Reset

Legend:

R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2X1X/4X1X

U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1

————CP3

(1,2) CP2(1) CP1 CP0

bit 7 bit 0

bit 7-4 Unimplemented: Read as ‘0’

bit 3 CP3: Code Protection bit(1,2)

1 = Block 3 (006000-007FFFh) not code-protected(3)

0 = Block 3 (006000-007FFFh) code-protected(3)

1 = Block 3 (00C000-00FFFFh) not code-protected(4)

0 = Block 3 (00C000-00FFFFh) code-protected(4)

bit 2 CP2: Code Protection bit(1)

1 = Block 2 (004000-005FFFh) not code-protected(3)

0 = Block 2 (004000-005FFFh) code-protected(3)

1 = Block 2 (008000-00BFFFh) not code-protected(4)

0 = Block 2 (008000-00BFFFh) code-protected(4)

bit 1 CP1: Code Protection bit

1 = Block 1 (002000-003FFFh) not code-protected(3)

0 = Block 1 (002000-003FFFh) code-protected(3)

1 = Block 1 (004000-007FFFh) not code-protected(4)

0 = Block 1 (004000-007FFFh) code-protected(4)

bit 0 CP0: Code Protection bit

1 = Block 0 (000800-001FFFh) not code-protected(3)

0 = Block 0 (000800-001FFFh) code-protected(3)

1 = Block 0 (000800-003FFFh) not code-protected(4)

0 = Block 0 (000800-003FFFh) code-protected(4)

Note 1: Unimplemented in PIC18F2410/4410 devices; maintain this bit set.

2: Unimplemented in PIC18F2515/4515 devices; maintain this bit set.

3: Address range for 16K and 32K devices.

4: Address range for 48K and 64K devices.

Legend:

R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

U-0 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0

—CPB— — — — — —

bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6 CPB: Boot Block Code Protection bit

1 = Boot block (000000-0007FFh) not code-protected

0 = Boot block (000000-0007FFh) code-protected

bit 5-0 Unimplemented: Read as ‘0’

Legend:

R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2X1X/4X1X

U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1

— — — —WRT3

(1,2) WRT2(1) WRT1 WRT0

bit 7 bit 0

bit 7-4 Unimplemented: Read as ‘0’

bit 3 WRT3: Write Protection bit(1,2)

1 = Block 3 (006000-007FFFh) not write-protected(3)

0 = Block 3 (006000-007FFFh) write-protected(3)

1 = Block 3 (00C000-00FFFFh) not write-protected(4)

0 = Block 3 (00C000-00FFFFh) write-protected(4)

bit 2 WRT2: Write Protection bit(1)

1 = Block 2 (004000-005FFFh) not write-protected(3)

0 = Block 2 (004000-005FFFh) write-protected(3)

1 = Block 2 (008000-00BFFFh) not write-protected(4)

0 = Block 2 (008000-00BFFFh) write-protected(4)

bit 1 WRT1: Write Protection bit

1 = Block 1 (002000-003FFFh) not write-protected(3)

0 = Block 1 (002000-003FFFh) write-protected(3)

1 = Block 1 (004000-007FFFh) not write-protected(4)

0 = Block 1 (004000-007FFFh) write-protected(4)

bit 0 WRT0: Write Protection bit

1 = Block 0 (000800-001FFFh) not write-protected(3)

0 = Block 0 (000800-001FFFh) write-protected(3)

1 = Block 0 (000800-003FFFh) not write-protected(4)

0 = Block 0 (000800-003FFFh) write-protected(4)

Note 1: Unimplemented in PIC18F2410/4410 devices; maintain this bit set.

2: Unimplemented in PIC18F2515/4515 devices; maintain this bit set.

3: Address range for 16K and 32K devices.

4: Address range for 48K and 64K devices.

Legend:

R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

U-0 R/C-1 R-1 U-0 U-0 U-0 U-0 U-0

—WRTBWRTC

(1) — — — — —

bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6 WRTB: Boot Block Write Protection bit

1 = Boot block (000000-0007FFh) not write-protected

0 = Boot block (000000-0007FFh) write-protected

bit 5 WRTC: Configuration Register Write Protection bit(1)

1 = Configuration registers (300000-3000FFh) not write-protected

0 = Configuration registers (300000-3000FFh) write-protected

Note 1: This bit is read-only in Normal Execution mode; it can be written only in Program mode.

bit 4-0 Unimplemented: Read as ‘0’

Legend:

R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2X1X/4X1X

U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1

— — — — EBTR3(1,2) EBTR2(1) EBTR1 EBTR0

bit 7 bit 0

bit 7-4 Unimplemented: Read as ‘0’

bit 3 EBTR3: Table Read Protection bit(1,2)

1 = Block 3 (006000-007FFFh) not protected from table reads executed in other blocks(3)

0 = Block 3 (006000-007FFFh) protected from table reads executed in other blocks(3)

1 = Block 3 (00C000-00FFFFh) not protected from table reads executed in other blocks(4)

0 = Block 3 (00C000-00FFFFh) protected from table reads executed in other blocks(4)

bit 2 EBTR2: Table Read Protection bit(1)

1 = Block 2 (004000-005FFFh) not protected from table reads executed in other blocks(3)

0 = Block 2 (004000-005FFFh) protected from table reads executed in other blocks(3)

1 = Block 2 (008000-00BFFFh) not protected from table reads executed in other blocks(4)

0 = Block 2 (008000-00BFFFh) protected from table reads executed in other blocks(4)

bit 1 EBTR1: Table Read Protection bit

1 = Block 1 (002000-003FFFh) not protected from table reads executed in other blocks(3)

0 = Block 1 (002000-003FFFh) protected from table reads executed in other blocks(3)

1 = Block 1 (004000-007FFFh) not protected from table reads executed in other blocks(4)

0 = Block 1 (004000-007FFFh) protected from table reads executed in other blocks(4)

bit 0 EBTR0: Table Read Protection bit

1 = Block 0 (000800-001FFFh) not protected from table reads executed in other blocks(3)

0 = Block 0 (000800-001FFFh) protected from table reads executed in other blocks(3)

1 = Block 0 (000800-003FFFh) not protected from table reads executed in other blocks(4)

0 = Block 0 (000800-003FFFh) protected from table reads executed in other blocks(4)

Note 1: Unimplemented in PIC18F2410/4410 devices; maintain this bit set.

2: Unimplemented in PIC18F2515/4515 devices; maintain this bit set.

3: Address range for 16K and 32K devices.

4: Address range for 48K and 64K devices.

Legend:

R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

U-0 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0

— EBTRB — — — — — —

bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6 EBTRB: Boot Block Table Read Protection bit

1 = Boot block (000000-0007FFh) not protected from table reads executed in other blocks

0 = Boot block (000000-0007FFh) protected from table reads executed in other blocks

bit 5-0 Unimplemented: Read as ‘0’

Legend:

R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2X1X/4X1X

RRRRRRRR

DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0

bit 7 bit 0

bit 7-5 DEV2:DEV0: Device ID bits

011 = PIC18F2410

001 = PIC18F2510

111 = PIC18F2515

101 = PIC18F2610

111 = PIC18F4410

101 = PIC18F4510

011 = PIC18F4515

001 = PIC18F4610

bit 4-0 REV4:REV0: Revision ID bits

These bits are used to indicate the device revision.

Legend:

R = Read-only bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

RRRRRRRR

DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3

bit 7 bit 0

bit 7-0 DEV10:DEV3: Device ID bits

These bits are used with the DEV2:DEV0 bits in the Device ID Register 1 to identify the

part number.

0000 1100 = PIC18F4610/2610/4515/2515 devices

0001 0001 = PIC18F2510/2410 devices

0000 1100 = PIC18F4510/4410 devices

Note: These values for DEV10:DEV3 may be shared with other devices. The specific

device is always identified by using the entire DEV10:DEV0 bit sequence.

Legend:

R = Read-only bit P = Programmable bit U = Unimplemented bit, read as ‘0’

-n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2X1X/4X1X

22.2 Watchdog Timer (WDT)

For PIC18F2X1X/4X1X devices, the WDT is driven by

the INTRC source. When the WDT is enabled, the

clock source is also enabled. The nominal WDT period

is 4 ms and has the same stability as the INTRC

oscillator.

The 4 ms period of the WDT is multiplied by a 16-bit

postscaler. Any output of the WDT postscaler is

selected by a multiplexer, controlled by bits in Configu-

ration Register 2H. Available periods range from 4 ms

to 131.072 seconds (2.18 minutes). The WDT and

postscaler are cleared when any of the following events

occur: a SLEEP or CLRWDT instruction is executed, the

IRCF bits (OSCCON<6:4>) are changed or a clock

failure has occurred.

22.2.1 CONTROL REGISTER

readable and writable register which contains a control

bit that allows software to override the WDT Configura-

tion bit, but only if the Configuration bit has disabled the

WDT.

FIGURE 22-1: WDT BLOCK DIAGRAM

Note 1: The CLRWDT and SLEEP instructions

clear the WDT and postscaler counts

when executed.

2: Changing the setting of the IRCF bits

(OSCCON<6:4>) clears the WDT and

postscaler counts.

3: When a CLRWDT instruction is executed,

the postscaler count will be cleared.

INTRC Source

WDT

Wake-up From

Reset

WDT Counter

Programmable Postscaler

1:1 to 1:32,768

Enable WDT

WDTPS<3:0>

SWDTEN

WDTEN

CLRWDT

Power-Managed

Reset

All Device Resets

Sleep

÷128

Change on IRCF bits

Modes

PIC18F2X1X/4X1X

TABLE 22-2: SUMMARY OF WATCHDOG TIMER REGISTERS

U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0

— — — — — — —SWDTEN

(1)

bit 7 bit 0

bit 7-1 Unimplemented: Read as ‘0’

bit 0 SWDTEN: Software Controlled Watchdog Timer Enable bit(1)

1 = Watchdog Timer is on

0 = Watchdog Timer is off

Note 1: This bit has no effect if the Configuration bit, WDTEN, is enabled.

Legend:

R = Readable bit W = Writable bit

U = Unimplemented bit, read as ‘0’ -n = Value at POR

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Reset

Values

on page

RCON IPEN SBOREN(1) —RI TO PD POR BOR 48

WDTCON — — — — — — —SWDTEN

(2) 50

Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Watchdog Timer.

Note 1: The SBOREN bit is only available when the BOREN1:BOREN0 Configuration bits = 01; otherwise, it is

disabled and reads as ‘0’. See Section 4.4 “Brown-out Reset (BOR)”.

2: This bit has no effect if the Configuration bit, WDTEN, is enabled.

PIC18F2X1X/4X1X

22.3 Two-Speed Start-up

The Two-Speed Start-up feature helps to minimize the

latency period from oscillator start-up to code execution

by allowing the microcontroller to use the INTOSC

oscillator as a clock source until the primary clock

source is available. It is enabled by setting the IESO

Configuration bit.

Two-Speed Start-up should be enabled only if the

Primary Oscillator mode is LP, XT, HS or HSPLL

(Crystal-Based modes). Other sources do not require

an OST start-up delay; for these, Two-Speed Start-up

should be disabled.

When enabled, Resets and wake-ups from Sleep mode

cause the device to configure itself to run from the

internal oscillator block as the clock source, following

the time-out of the Power-up Timer after a Power-on

Reset is enabled. This allows almost immediate code

execution while the primary oscillator starts and the

OST is running. Once the OST times out, the device

automatically switches to PRI_RUN mode.

To use a higher clock speed on wake-up, the INTOSC

or postscaler clock sources can be selected to provide

a higher clock speed by setting bits IRCF2:IRCF0

immediately after Reset. For wake-ups from Sleep, the

INTOSC or postscaler clock sources can be selected

by setting the IRCF2:IRCF0 bits prior to entering Sleep

mode.

In all other power-managed modes, Two-Speed Start-

up is not used. The device will be clocked by the

currently selected clock source until the primary clock

source becomes available. The setting of the IESO bit

is ignored.

22.3.1 SPECIAL CONSIDERATIONS FOR

USING TWO-SPEED START-UP

While using the INTOSC oscillator in Two-Speed Start-

up, the device still obeys the normal command

sequences for entering power-managed modes,

including multiple SLEEP instructions (refer to

Section 3.1.4 “Multiple Sleep Commands”). In

practice, this means that user code can change the

SCS1:SCS0 bit settings or issue SLEEP instructions

before the OST times out. This would allow an

application to briefly wake-up, perform routine

“housekeeping” tasks and return to Sleep before the

device starts to operate from the primary oscillator.

User code can also check if the primary clock source is

currently providing the device clocking by checking the

status of the OSTS bit (OSCCON<3>). If the bit is set,

the primary oscillator is providing the clock. Otherwise,

the internal oscillator block is providing the clock during

wake-up from Reset or Sleep mode.

FIGURE 22-2: TIMING TRANSITION FOR TWO-SPEED START-UP (INTOSC TO HSPLL)

Q1 Q3 Q4

OSC1

Peripheral

Program PC PC + 2

INTOSC

PLL Clock

PC + 6

Output

Q3 Q4 Q1

CPU Clock

PC + 4

Clock

Counter

Q2 Q2 Q3

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

2: Clock transition typically occurs within 2-4 TOSC.

Wake from Interrupt Event

TPLL(1)

12 n-1n

Clock

OSTS bit Set

Transition(2)

Multiplexer

TOST(1)

PIC18F2X1X/4X1X

22.4 Fail-Safe Clock Monitor

The Fail-Safe Clock Monitor (FSCM) allows the

microcontroller to continue operation in the event of an

external oscillator failure by automatically switching the

device clock to the internal oscillator block. The FSCM

function is enabled by setting the FCMEN Configuration

bit.

When FSCM is enabled, the INTRC oscillator runs at

all times to monitor clocks to peripherals and provide a

backup clock in the event of a clock failure. Clock

monitoring (shown in Figure 22-3) is accomplished by

creating a sample clock signal, which is the INTRC out-

put divided by 64. This allows ample time between

FSCM sample clocks for a peripheral clock edge to

occur. The peripheral device clock and the sample

clock are presented as inputs to the Clock Monitor latch

(CM). The CM is set on the falling edge of the device

clock source, but cleared on the rising edge of the

sample clock.

FIGURE 22-3: FSCM BLOCK DIAGRAM

Clock failure is tested for on the falling edge of the

sample clock. If a sample clock falling edge occurs

while CM is still set, a clock failure has been detected

(Figure 22-4). This causes the following:

• the FSCM generates an oscillator fail interrupt by

setting bit OSCFIF (PIR2<7>);

• the device clock source is switched to the internal

oscillator block (OSCCON is not updated to show

the current clock source – this is the fail-safe

condition); and

•the WDT is reset.

During switchover, the postscaler frequency from the

internal oscillator block may not be sufficiently stable

for timing sensitive applications. In these cases, it may

be desirable to select another clock configuration and

enter an alternate power-managed mode. This can be

done to attempt a partial recovery or execute a

controlled shutdown. See Section 3.1.4 “Multiple

Sleep Commands” and Section 22.3.1 “Special

Considerations for Using Two-Speed Start-up” for

more details.

To use a higher clock speed on wake-up, the INTOSC

or postscaler clock sources can be selected to provide

a higher clock speed by setting bits, IRCF2:IRCF0,

immediately after Reset. For wake-ups from Sleep, the

INTOSC or postscaler clock sources can be selected

by setting the IRCF2:IRCF0 bits prior to entering Sleep

mode.

The FSCM will detect failures of the primary or second-

ary clock sources only. If the internal oscillator block

fails, no failure would be detected, nor would any action

be possible.

22.4.1 FSCM AND THE WATCHDOG TIMER

Both the FSCM and the WDT are clocked by the

INTRC oscillator. Since the WDT operates with a

separate divider and counter, disabling the WDT has

no effect on the operation of the INTRC oscillator when

the FSCM is enabled.

As already noted, the clock source is switched to the

INTOSC clock when a clock failure is detected.

Depending on the frequency selected by the

IRCF2:IRCF0 bits, this may mean a substantial change

in the speed of code execution. If the WDT is enabled

with a small prescale value, a decrease in clock speed

allows a WDT time-out to occur and a subsequent

device Reset. For this reason, fail-safe clock events

also reset the WDT and postscaler, allowing it to start

timing from when execution speed was changed and

decreasing the likelihood of an erroneous time-out.

22.4.2 EXITING FAIL-SAFE OPERATION

The fail-safe condition is terminated by either a device

Reset or by entering a power-managed mode. On

Reset, the controller starts the primary clock source

specified in Configuration Register 1H (with any

required start-up delays that are required for the oscil-

lator mode, such as OST or PLL timer). The INTOSC

multiplexer provides the device clock until the primary

clock source becomes ready (similar to a Two-Speed

Start-up). The clock source is then switched to the pri-

mary clock (indicated by the OSTS bit in the OSCCON

then resumes monitoring the peripheral clock.

The primary clock source may never become ready

during start-up. In this case, operation is clocked by the

INTOSC multiplexer. The OSCCON register will remain

in its Reset state until a power-managed mode is

entered.

Peripheral

INTRC ÷ 64

(32 μs) 488 Hz

(2.048 ms)

Clock Monitor

Latch (CM)

(edge-triggered)

Clock

Failure

Detected

Source

Clock

PIC18F2X1X/4X1X

FIGURE 22-4: FSCM TIMING DIAGRAM

22.4.3 FSCM INTERRUPTS IN

POWER-MANAGED MODES

By entering a power-managed mode, the clock

multiplexer selects the clock source selected by the

OSCCON register. Fail-Safe Monitoring of the power-

managed clock source resumes in the power-managed

mode.

If an oscillator failure occurs during power-managed

operation, the subsequent events depend on whether

or not the oscillator failure interrupt is enabled. If

enabled (OSCFIF = 1), code execution will be clocked

by the INTOSC multiplexer. An automatic transition

back to the failed clock source will not occur.

If the interrupt is disabled, subsequent interrupts while

in Idle mode will cause the CPU to begin executing

instructions while being clocked by the INTOSC

source.

22.4.4 POR OR WAKE FROM SLEEP

The FSCM is designed to detect oscillator failure at any

point after the device has exited Power-on Reset

(POR) or low-power Sleep mode. When the primary

device clock is EC, RC or INTRC modes, monitoring

can begin immediately following these events.

For oscillator modes involving a crystal or resonator

(HS, HSPLL, LP or XT), the situation is somewhat

different. Since the oscillator may require a start-up

time considerably longer than the FCSM sample clock

time, a false clock failure may be detected. To prevent

this, the internal oscillator block is automatically config-

ured as the device clock and functions until the primary

clock is stable (the OST and PLL timers have timed

out). This is identical to Two-Speed Start-up mode.

Once the primary clock is stable, the INTRC returns to

its role as the FSCM source.

As noted in Section 22.3.1 “Special Considerations

for Using Two-Speed Start-up”, it is also possible to

select another clock configuration and enter an

alternate power-managed mode while waiting for the

primary clock to become stable. When the new power-

managed mode is selected, the primary clock is

disabled.

OSCFIF

CM Output

Device

Clock

Output

Sample Clock

Failure

Detected

Oscillator

Failure

Note: The device clock is normally at a much higher frequency than the sample clock. The relative frequencies in this

example have been chosen for clarity.

(Q)

CM Test CM Test CM Test

Note: The same logic that prevents false oscilla-

tor failure interrupts on POR or wake from

Sleep, will also prevent the detection of

the oscillator’s failure to start at all follow-

ing these events. This can be avoided by

monitoring the OSTS bit and using a

timing routine to determine if the oscillator

is taking too long to start. Even so, no

oscillator failure interrupt will be flagged.

PIC18F2X1X/4X1X

22.5 Program Verification and

Code Protection

The overall structure of the code protection on the

PIC18 Flash devices differs significantly from other

PIC® devices.

The user program memory is divided into five blocks.

One of these is a boot block of 2 Kbytes. The remainder

of the memory is divided into four blocks on binary

boundaries.

Each of the five blocks has three code protection bits

associated with them. They are:

• Code-Protect bit (CPn)

• Write-Protect bit (WRTn)

• External Block Table Read bit (EBTRn)

Figure 22-5 shows the program memory organization

for 16- and 32-Kbyte devices and the specific code

protection bit associated with each block.

Figure 22-6 shows the program memory organization

for 48 and 64-Kbyte devices and the specific code

protection bit associated with each block. The actual

locations of the bits are summarized in Table 22-3.

FIGURE 22-5: CODE-PROTECTED PROGRAM MEMORY FOR PIC18F2410/2510/4410/4510

MEMORY SIZE/DEVICE

Block Code Protection

Controlled By:

16 Kbytes

(PIC18F2410/4410)

32 Kbytes

(PIC18F2510/4510)

Address

Range

Boot Block Boot Block 000000h

0007FFh CPB, WRTB, EBTRB

Block 0 Block 0

000800h

001FFFh

CP0, WRT0, EBTR0

Block 1 Block 1

002000h

003FFFh

CP1, WRT1, EBTR1

Unimplemented

Read ‘0’s

Block 2

004000h

005FFFh

CP2, WRT2, EBTR2

Block 3

006000h

007FFFh

CP3, WRT3, EBTR3

Unimplemented

Read ‘0’s

1FFFFFh

(Unimplemented Memory Space)

PIC18F2X1X/4X1X

FIGURE 22-6: CODE-PROTECTED PROGRAM MEMORY FOR PIC18F2515/2610/4515/4610

TABLE 22-3: SUMMARY OF CODE PROTECTION REGISTERS

File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

300008h CONFIG5L ————CP3

(1,2) CP2(1) CP1 CP0

300009h CONFIG5H —CPB— — — — — —

30000Ah CONFIG6L ————WRT3

(1,2) WRT2(1) WRT1 WRT0

30000Bh CONFIG6H — WRTB WRTC — — — — —

30000Ch CONFIG7L ————EBTR3

(1,2) EBTR2(1) EBTR1 EBTR0

30000Dh CONFIG7H —EBTRB— — — — — —

Legend: Shaded cells are unimplemented.

Note 1: Unimplemented in PIC18F2410/4410 devices; maintain this bit set.

2: Unimplemented in PIC18F2515/4515 devices; maintain this bit set.

MEMORY SIZE/DEVICE

Block Code Protection

Controlled By:

48 Kbytes

(PIC18F2515/4515)

64 Kbytes

(PIC18F2610/4610)

Address

Range

Boot Block Boot Block 000000h

0007FFh CPB, WRTB, EBTRB

Block 0 Block 0

000800h

003FFFh

CP0, WRT0, EBTR0

Block 1 Block 1

004000h

007FFFh

CP1, WRT1, EBTR1

Block 2 Block 2

008000h

00BFFFh

CP2, WRT2, EBTR2

Unimplemented

Read ‘0’s

Block 3

00C000h

00FFFFh

CP3, WRT3, EBTR3

Unimplemented

Read ‘0’s

010000h

1FFFFFh

(Unimplemented Memory Space)

PIC18F2X1X/4X1X

22.5.1 PROGRAM MEMORY

CODE PROTECTION

The program memory may be read to or written from

any location using the table read and table write

instructions. The Device ID may be read with table

reads. The Configuration registers may be read and

written with the table read and table write instructions.

In Normal Execution mode, the CPn bits have no direct

effect. CPn bits inhibit external reads and writes. The

EBTRn bits control table reads. For a block of user

memory with the EBTRn bit set to ‘0’, a table read

instruction that executes from within that block is

allowed to read. A table read instruction that executes

from a location outside of that block is not allowed to

read and will result in reading ‘0’s. Figures 22-7

through 22-10 illustrate table write and table read

protection.

FIGURE 22-7: EXTERNAL BLOCK TABLE READ (EBTRn) DISALLOWED

(16-KBYTE AND 32-KBYTE DEVICES)

Note: Code protection bits may only be written to

a ‘0’ from a ‘1’ state. It is not possible to

write a ‘1’ to a bit in the ‘0’ state. Code

protection bits are only set to ‘1’ by a full

chip erase or block erase function. The full

chip erase and block erase functions can

only be initiated via ICSP or an external

programmer.

WRTB, EBTRB = 11

WRT0, EBTR0 = 10

WRT1, EBTR1 = 11

WRT2, EBTR2 = 11

WRT3, EBTR3 = 11

TBLRD*

TBLPTR = 0008FFh

PC = 003FFEh

Results: All table reads from external blocks to Blockn are disabled whenever EBTRn = 0.

TABLAT register returns a value of ‘0’.

000000h

0007FFh

000800h

001FFFh

002000h

003FFFh

004000h

005FFFh

006000h

007FFFh

PIC18F2X1X/4X1X

FIGURE 22-8: EXTERNAL BLOCK TABLE READ (EBTRn) ALLOWED

(16-KBYTE AND 32-KBYTE DEVICES)

FIGURE 22-9: EXTERNAL BLOCK TABLE READ (EBTRn) DISALLOWED

(48-KBYTE AND 64-KBYTE DEVICES)

WRTB, EBTRB = 11

WRT0, EBTR0 = 10

WRT1, EBTR1 = 11

WRT2, EBTR2 = 11

WRT3, EBTR3 = 11

TBLRD*

TBLPTR = 0008FFh

PC = 001FFEh

Results: Table reads permitted within Blockn, even when EBTRBn = 0.

TABLAT register returns the value of the data at the location TBLPTR.

000000h

0007FFh

000800h

001FFFh

002000h

003FFFh

004000h

005FFFh

006000h

007FFFh

WRTB, EBTRB = 11

WRT0, EBTR0 = 10

WRT1, EBTR1 = 11

WRT2, EBTR2 = 11

WRT3, EBTR3 = 11

TBLRD*

TBLPTR = 0008FFh

PC = 003FFEh

Results: All table reads from external blocks to Blockn are disabled whenever EBTRn = 0.

TABLAT register returns a value of ‘0’.

000000h

0007FFh

000800h

003FFFh

004000h

007FFFh

008000h

00BFFFh

00C000h

00FFFFh

PIC18F2X1X/4X1X

FIGURE 22-10: EXTERNAL BLOCK TABLE READ (EBTRn) ALLOWED

(48-KBYTE AND 64-KBYTE DEVICES)

22.5.2 CONFIGURATION REGISTER

PROTECTION

The Configuration registers can be write-protected.

The WRTC bit controls protection of the Configuration

registers. In Normal Execution mode, the WRTC bit is

readable only. WRTC can only be written via ICSP or

an external programmer.

22.6 ID Locations

Eight memory locations (200000h-200007h) are

designated as ID locations, where the user can store

checksum or other code identification numbers. These

locations are both readable and writable during normal

execution through the TBLRD instruction; during

program/verify these locations are readable and

writable. The ID locations can be read when the device

is code-protected.

22.7 In-Circuit Serial Programming

PIC18F2X1X/4X1X microcontrollers can be serially

programmed while in the end application circuit. This is

simply done with two lines for clock and data and three

other lines for power, ground and the programming

voltage. This allows customers to manufacture boards

with unprogrammed devices and then program the

microcontroller just before shipping the product. This

also allows the most recent firmware or a custom

firmware to be programmed.

22.8 In-Circuit Debugger

When the DEBUG Configuration bit is programmed to

a ‘0’, the In-Circuit Debugger functionality is enabled.

This function allows simple debugging functions when

used with MPLAB® IDE. When the microcontroller has

this feature enabled, some resources are not available

for general use. Table 22-4 shows which resources are

required by the background debugger.

TABLE 22-4: DEBUGGER RESOURCES

To use the In-Circuit Debugger function of the micro-

controller, the design must implement In-Circuit Serial

Programming connections to MCLR/VPP/RE3, VDD,

VSS, RB7 and RB6. This will interface to the In-Circuit

Debugger module available from Microchip or one of

the third party development tool companies.

WRTB, EBTRB = 11

WRT0, EBTR0 = 10

WRT1, EBTR1 = 11

WRT2, EBTR2 = 11

WRT3, EBTR3 = 11

TBLRD*

TBLPTR = 0008FFh

PC = 001FFEh

Results: Table reads permitted within Blockn, even when EBTRBn = 0.

TABLAT register returns the value of the data at the location TBLPTR.

000000h

0007FFh

000800h

003FFFh

004000h

007FFFh

008000h

00BFFFh

00C000h

00FFFFh

I/O pins: RB6, RB7

Stack: 2 levels

Program Memory: 512 bytes

Data Memory: 10 bytes

PIC18F2X1X/4X1X

22.9 Single-Supply ICSP Programming

The LVP Configuration bit enables Single-Supply ICSP

Programming (formerly known as Low-Voltage ICSP

Programming or LVP). When Single-Supply Program-

ming is enabled, the microcontroller can be programmed

without requiring high voltage being applied to the

MCLR/VPP/RE3 pin, but the RB5/KBI1/PGM pin is then

dedicated to controlling Program mode entry and is not

available as a general purpose I/O pin.

While programming, using Single-Supply Program-

ming mode, VDD is applied to the MCLR/VPP/RE3 pin

as in Normal Execution mode. To enter Programming

mode, VDD is applied to the PGM pin.

If Single-Supply ICSP Programming mode will not be

used, the LVP bit can be cleared. RB5/KBI1/PGM then

becomes available as the digital I/O pin, RB5. The LVP

bit may be set or cleared only when using standard

high-voltage programming (VIHH applied to the MCLR/

VPP/RE3 pin). Once LVP has been disabled, only the

standard high-voltage programming is available and

must be used to program the device.

Memory that is not code-protected can be erased using

either a block erase, or erased row by row, then written

at any specified VDD. If code-protected memory is to be

erased, a block erase is required. If a block erase is to

be performed when using Low-Voltage Programming,

the device must be supplied with VDD of 4.5V to 5.5V.

Note 1: High-voltage programming is always

available, regardless of the state of the

LVP bit or the PGM pin, by applying VIHH

to the MCLR pin.

2: By default, Single-Supply ICSP is

enabled in unprogrammed devices (as

supplied from Microchip) and erased

devices.

3: When Single-Supply Programming is

enabled, the RB5 pin can no longer be

used as a general purpose I/O pin.

4: When LVP is enabled, externally pull the

PGM pin to VSS to allow normal program

execution.

PIC18F2X1X/4X1X

23.0 INSTRUCTION SET SUMMARY

PIC18F2X1X/4X1X devices incorporate the standard

set of 75 PIC18 core instructions, as well as an

extended set of 8 new instructions for the optimization

of code that is recursive or that utilizes a software

stack. The extended set is discussed later in this

section.

23.1 Standard Instruction Set

The standard PIC18 instruction set adds many

enhancements to the previous PIC® MCU instruction

sets, while maintaining an easy migration from these

PIC MCU instruction sets. Most instructions are a

single program memory word (16 bits), but there are

four instructions that require two program memory

locations.

Each single-word instruction is a 16-bit word divided

into an opcode, which specifies the instruction type and

one or more operands, which further specify the

operation of the instruction.

The instruction set is highly orthogonal and is grouped

into four basic categories:

•Byte-oriented operations

•Bit-oriented operations

•Literal operations

•Control operations

The PIC18 instruction set summary in Table 23-2 lists

byte-oriented, bit-oriented, literal and control

operations. Table 23-1 shows the opcode field

descriptions.

Most byte-oriented instructions have three operands:

1. The file register (specified by ‘f’)

2. The destination of the result (specified by ‘d’)

3. The accessed memory (specified by ‘a’)

The file register designator ‘f’ specifies which file regis-

ter is to be used by the instruction. The destination

designator ‘d’ specifies where the result of the opera-

tion is to be placed. If ‘d’ is zero, the result is placed in

the WREG register. If ‘d’ is one, the result is placed in

the file register specified in the instruction.

All bit-oriented instructions have three operands:

1. The file register (specified by ‘f’)

2. The bit in the file register (specified by ‘b’)

3. The accessed memory (specified by ‘a’)

The bit field designator ‘b’ selects the number of the bit

affected by the operation, while the file register desig-

nator ‘f’ represents the number of the file in which the

bit is located.

The literal instructions may use some of the following

operands:

• A literal value to be loaded into a file register

(specified by ‘k’)

• The desired FSR register to load the literal value

into (specified by ‘f’)

• No operand required

(specified by ‘—’)

The control instructions may use some of the following

operands:

• A program memory address (specified by ‘n’)

• The mode of the CALL or RETURN instructions

(specified by ‘s’)

• The mode of the table read and table write

instructions (specified by ‘m’)

• No operand required

(specified by ‘—’)

All instructions are a single word, except for four

double-word instructions. These instructions were

made double-word to contain the required information

in 32 bits. In the second word, the 4 MSbs are ‘1’s. If

this second word is executed as an instruction (by

itself), it will execute as a NOP.

All single-word instructions are executed in a single

instruction cycle, unless a conditional test is true or the

program counter is changed as a result of the instruc-

tion. In these cases, the execution takes two instruction

cycles, with the additional instruction cycle(s) executed

as a NOP.

The double-word instructions execute in two instruction

cycles.

One instruction cycle consists of four oscillator periods.

Thus, for an oscillator frequency of 4 MHz, the normal

instruction execution time is 1 μs. If a conditional test is

true, or the program counter is changed as a result of

an instruction, the instruction execution time is 2 μs.

Two-word branch instructions (if true) would take 3 μs.

Figure 23-1 shows the general formats that the instruc-

tions can have. All examples use the convention ‘nnh’

to represent a hexadecimal number.

The Instruction Set Summary, shown in Table 23-2,

lists the standard instructions recognized by the

Microchip MPASM™ Assembler.

Section 23.1.1 “Standard Instruction Set” provides

a description of each instruction.

PIC18F2X1X/4X1X

TABLE 23-1: OPCODE FIELD DESCRIPTIONS

Field Description

aRAM access bit

a = 0: RAM location in Access RAM (BSR register is ignored)

a = 1: RAM bank is specified by BSR register

bbb Bit address within an 8-bit file register (0 to 7).

BSR Bank Select Register. Used to select the current RAM bank.

C, DC, Z, OV, N ALU Status bits: Carry, Digit Carry, Zero, Overflow, Negative.

dDestination select bit

d = 0: store result in WREG

d = 1: store result in file register f

dest Destination: either the WREG register or the specified register file location.

f8-bit Register file address (00h to FFh) or 2-bit FSR designator (0h to 3h).

fs12-bit Register file address (000h to FFFh). This is the source address.

fd12-bit Register file address (000h to FFFh). This is the destination address.

GIE Global Interrupt Enable bit.

kLiteral field, constant data or label (may be either an 8-bit, 12-bit or a 20-bit value).

label Label name.

mm The mode of the TBLPTR register for the table read and table write instructions.

Only used with table read and table write instructions:

*No change to register (such as TBLPTR with table reads and writes)

*+ Post-Increment register (such as TBLPTR with table reads and writes)

*- Post-Decrement register (such as TBLPTR with table reads and writes)

+* Pre-Increment register (such as TBLPTR with table reads and writes)

nThe relative address (2’s complement number) for relative branch instructions or the direct address for

call/branch and return instructions.

PC Program Counter.

PCL Program Counter Low Byte.

PCH Program Counter High Byte.

PCLATH Program Counter High Byte Latch.

PCLATU Program Counter Upper Byte Latch.

PD Power-down bit.

PRODH Product of Multiply High Byte.

PRODL Product of Multiply Low Byte.

sFast Call/Return mode select bit

s = 0: do not update into/from shadow registers

s = 1: certain registers loaded into/from shadow registers (Fast mode)

TBLPTR 21-bit Table Pointer (points to a Program Memory location).

TABLAT 8-bit Table Latch.

TO Time-out bit.

TOS Top-of-Stack.

uUnused or unchanged.

WDT Watchdog Timer.

WREG Working register (accumulator).

xDon’t care (‘0’ or ‘1’). The assembler will generate code with x = 0. It is the recommended form of use for

compatibility with all Microchip software tools.

zs7-bit offset value for indirect addressing of register files (source).

zd7-bit offset value for indirect addressing of register files (destination).

{ } Optional argument.

[text] Indicates an indexed address.

(text) The contents of text.

[expr]<n> Specifies bit n of the register indicated by the pointer expr.

→Assigned to.

< > Register bit field.

∈In the set of.

italics User defined term (font is Courier).

PIC18F2X1X/4X1X

FIGURE 23-1: GENERAL FORMAT FOR INSTRUCTIONS

Byte-oriented file register operations

15 10 9 8 7 0

d = 0 for result destination to be WREG register

OPCODE d a f (FILE #)

d = 1 for result destination to be file register (f)

a = 0 to force Access Bank

Bit-oriented file register operations

15 12 11 9 8 7 0

OPCODE b (BIT #) a f (FILE #)

b = 3-bit position of bit in file register (f)

Literal operations

15 8 7 0

OPCODE k (literal)

k = 8-bit immediate value

Byte to Byte move operations (2-word)

15 12 11 0

OPCODE f (Source FILE #)

CALL, GOTO and Branch operations

15 8 7 0

OPCODE n<7:0> (literal)

n = 20-bit immediate value

a = 1 for BSR to select bank

f = 8-bit file register address

a = 0 to force Access Bank

a = 1 for BSR to select bank

f = 8-bit file register address

15 12 11 0

1111 n<19:8> (literal)

15 12 11 0

1111 f (Destination FILE #)

f = 12-bit file register address

Control operations

Example Instruction

ADDWF MYREG, W, B

MOVFF MYREG1, MYREG2

BSF MYREG, bit, B

MOVLW 7Fh

GOTO Label

15 8 7 0

OPCODE n<7:0> (literal)

15 12 11 0

1111 n<19:8> (literal)

CALL MYFUNC

15 11 10 0

OPCODE n<10:0> (literal)

S = Fast bit

BRA MYFUNC

15 8 7 0

OPCODE n<7:0> (literal) BC MYFUNC

PIC18F2X1X/4X1X

TABLE 23-2: PIC18FXXXX INSTRUCTION SET

Mnemonic,

Operands Description Cycles

16-Bit Instruction Word Status

Affected Notes

MSb LSb

BYTE-ORIENTED OPERATIONS

ADDWF

ADDWFC

ANDWF

CLRF

COMF

CPFSEQ

CPFSGT

CPFSLT

DECF

DECFSZ

DCFSNZ

INCF

INCFSZ

INFSNZ

IORWF

MOVF

MOVFF

MOVWF

MULWF

NEGF

RLCF

RLNCF

RRCF

RRNCF

SETF

SUBFWB

SUBWF

SUBWFB

SWAPF

TSTFSZ

XORWF

f, d, a

f, a

f, d, a

f, a

f, d, a

fs, fd

f, a

f, d, a

f, a

f, d, a

f, a

f, d, a

Add WREG and f

Add WREG and Carry bit to f

AND WREG with f

Clear f

Complement f

Compare f with WREG, skip =

Compare f with WREG, skip >

Compare f with WREG, skip <

Decrement f

Decrement f, Skip if 0

Decrement f, Skip if Not 0

Increment f

Increment f, Skip if 0

Increment f, Skip if Not 0

Inclusive OR WREG with f

Move f

Move fs (source) to 1st word

fd (destination) 2nd word

Move WREG to f

Multiply WREG with f

Negate f

Rotate Left f through Carry

Rotate Left f (No Carry)

Rotate Right f through Carry

Rotate Right f (No Carry)

Set f

Subtract f from WREG with

borrow

Subtract WREG from f

Subtract WREG from f with

borrow

Swap nibbles in f

Test f, skip if 0

Exclusive OR WREG with f

1 (2 or 3)

0010

0001

0110

0001

0110

0000

0010

0100

0010

0011

0100

0001

0101

1100

1111

0110

0000

0110

0011

0100

0011

0100

0110

0101

0011

0110

0001

01da

00da

01da

101a

11da

001a

010a

000a

01da

11da

10da

11da

10da

00da

ffff

111a

001a

110a

01da

00da

100a

01da

11da

10da

011a

10da

ffff

C, DC, Z, OV, N

Z, N

None

C, DC, Z, OV, N

None

C, DC, Z, OV, N

None

Z, N

None

C, DC, Z, OV, N

C, Z, N

Z, N

C, Z, N

Z, N

None

C, DC, Z, OV, N

None

Z, N

1, 2

1,2

1, 2

1, 2, 3, 4

1, 2

1, 2, 3, 4

1, 2

Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that

value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is

driven low by an external device, the data will be written back with a ‘0’.

2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared

if assigned.

3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second

cycle is executed as a NOP.

4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP

unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all

program memory locations have a valid instruction.

PIC18F2X1X/4X1X

BIT-ORIENTED OPERATIONS

BCF

BSF

BTFSC

BTFSS

BTG

f, b, a

f, d, a

Bit Clear f

Bit Set f

Bit Test f, Skip if Clear

Bit Test f, Skip if Set

Bit Toggle f

1 (2 or 3)

1001

1000

1011

1010

0111

bbba

ffff

None

1, 2

3, 4

1, 2

CONTROL OPERATIONS

BNC

BNN

BNOV

BNZ

BOV

BRA

CALL

CLRWDT

DAW

GOTO

NOP

POP

PUSH

RCALL

RESET

RETFIE

RETLW

RETURN

SLEEP

n, s

—

Branch if Carry

Branch if Negative

Branch if Not Carry

Branch if Not Negative

Branch if Not Overflow

Branch if Not Zero

Branch if Overflow

Branch Unconditionally

Branch if Zero

Call subroutine 1st word

2nd word

Clear Watchdog Timer

Decimal Adjust WREG

Go to address 1st word

2nd word

No Operation

Pop top of return stack (TOS)

Push top of return stack (TOS)

Relative Call

Software device Reset

Return from interrupt enable

Return with literal in WREG

Return from Subroutine

Go into Standby mode

1 (2)

1110

1101

1110

1111

0000

1110

1111

0000

1111

0000

1101

0000

0010

0110

0011

0111

0101

0001

0100

0nnn

0000

110s

kkkk

0000

1111

kkkk

0000

xxxx

0000

1nnn

0000

1100

0000

nnnn

kkkk

0000

kkkk

0000

xxxx

0000

nnnn

1111

0001

kkkk

0001

0000

nnnn

kkkk

0100

0111

kkkk

0000

xxxx

0110

0101

nnnn

1111

000s

kkkk

001s

0011

None

TO, PD

None

All

GIE/GIEH,

PEIE/GIEL

None

TO, PD

TABLE 23-2: PIC18FXXXX INSTRUCTION SET (CONTINUED)

Mnemonic,

Operands Description Cycles

16-Bit Instruction Word Status

Affected Notes

MSb LSb

Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that

value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is

driven low by an external device, the data will be written back with a ‘0’.

2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared

if assigned.

3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second

cycle is executed as a NOP.

4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP

unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all

program memory locations have a valid instruction.

PIC18F2X1X/4X1X

LITERAL OPERATIONS

ADDLW

ANDLW

IORLW

LFSR

MOVLB

MOVLW

MULLW

RETLW

SUBLW

XORLW

f, k

Add literal and WREG

AND literal with WREG

Inclusive OR literal with WREG

Move literal (12-bit) 2nd word

to FSR(f) 1st word

Move literal to BSR<3:0>

Move literal to WREG

Multiply literal with WREG

Return with literal in WREG

Subtract WREG from literal

Exclusive OR literal with WREG

0000

1110

1111

0000

1111

1011

1001

1110

0000

0001

1110

1101

1100

1000

1010

kkkk

00ff

kkkk

0000

kkkk

C, DC, Z, OV, N

Z, N

None

C, DC, Z, OV, N

Z, N

DATA MEMORY ↔ PROGRAM MEMORY OPERATIONS

TBLRD*

TBLRD*+

TBLRD*-

TBLRD+*

TBLWT*

TBLWT*+

TBLWT*-

TBLWT+*

Table Read

Table Read with post-increment

Table Read with post-decrement

Table Read with pre-increment

Table Write

Table Write with post-increment

Table Write with post-decrement

Table Write with pre-increment

0000

1000

1001

1010

1011

1100

1101

1110

1111

None

TABLE 23-2: PIC18FXXXX INSTRUCTION SET (CONTINUED)

Mnemonic,

Operands Description Cycles

16-Bit Instruction Word Status

Affected Notes

MSb LSb

Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that

value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is

driven low by an external device, the data will be written back with a ‘0’.

2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared

if assigned.

3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second

cycle is executed as a NOP.

4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP

unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all

program memory locations have a valid instruction.

PIC18F2X1X/4X1X

23.1.1 STANDARD INSTRUCTION SET

ADDLW ADD Literal to W

Syntax: ADDLW k

Operands: 0 ≤ k ≤ 255

Operation: (W) + k → W

Status Affected: N, OV, C, DC, Z

Encoding: 0000 1111 kkkk kkkk

Description: The contents of W are added to the

8-bit literal ‘k’ and the result is placed in

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write to W

Example: ADDLW 15h

Before Instruction

W = 10h

After Instruction

W = 25h

ADDWF ADD W to f

Syntax: ADDWF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (W) + (f) → dest

Status Affected: N, OV, C, DC, Z

Encoding: 0010 01da ffff ffff

Description: Add W to register ‘f’. If ‘d’ is ‘0’, the

result is stored in W. If ‘d’ is ‘1’, the

result is stored back in register ‘f’

(default).

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: ADDWF REG, 0, 0

Before Instruction

W = 17h

REG = 0C2h

After Instruction

W = 0D9h

REG = 0C2h

Note: All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in

symbolic addressing. If a label is used, the instruction format then becomes: {label} instruction argument(s).

PIC18F2X1X/4X1X

ADDWFC ADD W and Carry bit to f

Syntax: ADDWFC f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (W) + (f) + (C) → dest

Status Affected: N,OV, C, DC, Z

Encoding: 0010 00da ffff ffff

Description: Add W, the Carry flag and data memory

location ‘f’. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed in data memory location ‘f’.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: ADDWFC REG, 0, 1

Before Instruction

Carry bit = 1

REG = 02h

W=4Dh

After Instruction

Carry bit = 0

REG = 02h

W = 50h

ANDLW AND Literal with W

Syntax: ANDLW k

Operands: 0 ≤ k ≤ 255

Operation: (W) .AND. k → W

Status Affected: N, Z

Encoding: 0000 1011 kkkk kkkk

Description: The contents of W are AND’ed with the

8-bit literal ‘k’. The result is placed in W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’

Process

Data

Write to W

Example: ANDLW 05Fh

Before Instruction

W=A3h

After Instruction

W = 03h

PIC18F2X1X/4X1X

ANDWF AND W with f

Syntax: ANDWF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (W) .AND. (f) → dest

Status Affected: N, Z

Encoding: 0001 01da ffff ffff

Description: The contents of W are AND’ed with

in W. If ‘d’ is ‘1’, the result is stored back

in register ‘f’ (default).

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: ANDWF REG, 0, 0

Before Instruction

W = 17h

REG = C2h

After Instruction

W = 02h

REG = C2h

BC Branch if Carry

Syntax: BC n

Operands: -128 ≤ n ≤ 127

Operation: if Carry bit is ‘1’

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1110 0010 nnnn nnnn

Description: If the Carry bit is ‘1’, then the program

will branch.

The 2’s complement number ‘2n’ is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to PC

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BC 5

Before Instruction

PC = address (HERE)

After Instruction

If Carry = 1;

PC = address (HERE + 12)

If Carry = 0;

PC = address (HERE + 2)

PIC18F2X1X/4X1X

BCF Bit Clear f

Syntax: BCF f, b {,a}

Operands: 0 ≤ f ≤ 255

0 ≤ b ≤ 7

a ∈ [0,1]

Operation: 0 → f

Status Affected: None

Encoding: 1001 bbba ffff ffff

Description: Bit ‘b’ in register ‘f’ is cleared.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: BCF FLAG_REG, 7, 0

Before Instruction

FLAG_REG = C7h

After Instruction

FLAG_REG = 47h

BN Branch if Negative

Syntax: BN n

Operands: -128 ≤ n ≤ 127

Operation: if Negative bit is ‘1’

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1110 0110 nnnn nnnn

Description: If the Negative bit is ‘1’, then the

program will branch.

The 2’s complement number ‘2n’ is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to PC

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BN Jump

Before Instruction

PC = address (HERE)

After Instruction

If Negative = 1;

PC = address (Jump)

If Negative = 0;

PC = address (HERE + 2)

PIC18F2X1X/4X1X

BNC Branch if Not Carry

Syntax: BNC n

Operands: -128 ≤ n ≤ 127

Operation: if Carry bit is ‘0’

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1110 0011 nnnn nnnn

Description: If the Carry bit is ‘0’, then the program

will branch.

The 2’s complement number ‘2n’ is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to PC

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BNC Jump

Before Instruction

PC = address (HERE)

After Instruction

If Carry = 0;

PC = address (Jump)

If Carry = 1;

PC = address (HERE + 2)

BNN Branch if Not Negative

Syntax: BNN n

Operands: -128 ≤ n ≤ 127

Operation: if Negative bit is ‘0’

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1110 0111 nnnn nnnn

Description: If the Negative bit is ‘0’, then the

program will branch.

The 2’s complement number ‘2n’ is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to PC

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BNN Jump

Before Instruction

PC = address (HERE)

After Instruction

If Negative = 0;

PC = address (Jump)

If Negative = 1;

PC = address (HERE + 2)

PIC18F2X1X/4X1X

BNOV Branch if Not Overflow

Syntax: BNOV n

Operands: -128 ≤ n ≤ 127

Operation: if Overflow bit is ‘0’

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1110 0101 nnnn nnnn

Description: If the Overflow bit is ‘0’, then the

program will branch.

The 2’s complement number ‘2n’ is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to PC

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BNOV Jump

Before Instruction

PC = address (HERE)

After Instruction

If Overflow = 0;

PC = address (Jump)

If Overflow = 1;

PC = address (HERE + 2)

BNZ Branch if Not Zero

Syntax: BNZ n

Operands: -128 ≤ n ≤ 127

Operation: if Zero bit is ‘0’

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1110 0001 nnnn nnnn

Description: If the Zero bit is ‘0’, then the program

will branch.

The 2’s complement number ‘2n’ is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to PC

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BNZ Jump

Before Instruction

PC = address (HERE)

After Instruction

If Zero = 0;

PC = address (Jump)

If Zero = 1;

PC = address (HERE + 2)

PIC18F2X1X/4X1X

BRA Unconditional Branch

Syntax: BRA n

Operands: -1024 ≤ n ≤ 1023

Operation: (PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1101 0nnn nnnn nnnn

Description: Add the 2’s complement number ‘2n’ to

the PC. Since the PC will have incre-

mented to fetch the next instruction, the

new address will be PC + 2 + 2n. This

instruction is a two-cycle instruction.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to PC

operation

Example: HERE BRA Jump

Before Instruction

PC = address (HERE)

After Instruction

PC = address (Jump)

BSF Bit Set f

Syntax: BSF f, b {,a}

Operands: 0 ≤ f ≤ 255

0 ≤ b ≤ 7

a ∈ [0,1]

Operation: 1 → f

Status Affected: None

Encoding: 1000 bbba ffff ffff

Description: Bit ‘b’ in register ‘f’ is set.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: BSF FLAG_REG, 7, 1

Before Instruction

FLAG_REG = 0Ah

After Instruction

FLAG_REG = 8Ah

PIC18F2X1X/4X1X

BTFSC Bit Test File, Skip if Clear

Syntax: BTFSC f, b {,a}

Operands: 0 ≤ f ≤ 255

0 ≤ b ≤ 7

a ∈ [0,1]

Operation: skip if (f) = 0

Status Affected: None

Encoding: 1011 bbba ffff ffff

Description: If bit ‘b’ in register ‘f’ is ‘0’, then the next

instruction is skipped. If bit ‘b’ is ‘0’, then

the next instruction fetched during the

current instruction execution is discarded

and a NOP is executed instead, making

this a two-cycle instruction.

If ‘a’ is ‘0’, the Access Bank is selected. If

‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates in

Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh).

See Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

operation

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE

FALSE

TRUE

BTFSC

FLAG, 1, 0

Before Instruction

PC = address (HERE)

After Instruction

If FLAG<1> = 0;

PC = address (TRUE)

If FLAG<1> = 1;

PC = address (FALSE)

BTFSS Bit Test File, Skip if Set

Syntax: BTFSS f, b {,a}

Operands: 0 ≤ f ≤ 255

0 ≤ b < 7

a ∈ [0,1]

Operation: skip if (f) = 1

Status Affected: None

Encoding: 1010 bbba ffff ffff

Description: If bit ‘b’ in register ‘f’ is ‘1’, then the next

instruction is skipped. If bit ‘b’ is ‘1’, then

the next instruction fetched during the

current instruction execution is discarded

and a NOP is executed instead, making

this a two-cycle instruction.

If ‘a’ is ‘0’, the Access Bank is selected. If

‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh).

See Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

operation

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE

FALSE

TRUE

BTFSS

FLAG, 1, 0

Before Instruction

PC = address (HERE)

After Instruction

If FLAG<1> = 0;

PC = address (FALSE)

If FLAG<1> = 1;

PC = address (TRUE)

PIC18F2X1X/4X1X

BTG Bit Toggle f

Syntax: BTG f, b {,a}

Operands: 0 ≤ f ≤ 255

0 ≤ b < 7

a ∈ [0,1]

Operation: (f) → f

Status Affected: None

Encoding: 0111 bbba ffff ffff

Description: Bit ‘b’ in data memory location ‘f’ is

inverted.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: BTG PORTC, 4, 0

Before Instruction:

PORTC = 0111 0101 [75h]

After Instruction:

PORTC = 0110 0101 [65h]

BOV Branch if Overflow

Syntax: BOV n

Operands: -128 ≤ n ≤ 127

Operation: if Overflow bit is ‘1’

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1110 0100 nnnn nnnn

Description: If the Overflow bit is ‘1’, then the

program will branch.

The 2’s complement number ‘2n’ is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to PC

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BOV Jump

Before Instruction

PC = address (HERE)

After Instruction

If Overflow = 1;

PC = address (Jump)

If Overflow = 0;

PC = address (HERE + 2)

PIC18F2X1X/4X1X

BZ Branch if Zero

Syntax: BZ n

Operands: -128 ≤ n ≤ 127

Operation: if Zero bit is ‘1’

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1110 0000 nnnn nnnn

Description: If the Zero bit is ‘1’, then the program

will branch.

The 2’s complement number ‘2n’ is

added to the PC. Since the PC will have

incremented to fetch the next

instruction, the new address will be

PC + 2 + 2n. This instruction is then a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

Write to PC

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Process

Data

operation

Example: HERE BZ Jump

Before Instruction

PC = address (HERE)

After Instruction

If Zero = 1;

PC = address (Jump)

If Zero = 0;

PC = address (HERE + 2)

CALL Subroutine Call

Syntax: CALL k {,s}

Operands: 0 ≤ k ≤ 1048575

s ∈ [0,1]

Operation: (PC) + 4 → TOS,

k → PC<20:1>,

if s = 1

(W) → WS,

(STATUS) → STATUSS,

(BSR) → BSRS

Status Affected: None

Encoding:

1st word (k<7:0>)

2nd word(k<19:8>)

1110

1111

110s

k19kkk

k7kkk

kkkk

kkkk0

kkkk8

Description: Subroutine call of entire 2-Mbyte

memory range. First, return address

(PC + 4) is pushed onto the return

stack. If ‘s’ = 1, the W, STATUS and

BSR registers are also pushed into their

respective shadow registers, WS,

STATUSS and BSRS. If ‘s’ = 0, no

update occurs (default). Then, the

20-bit value ‘k’ is loaded into PC<20:1>.

CALL is a two-cycle instruction.

Words: 2

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’<7:0>,

Push PC to

stack

Read literal

‘k’<19:8>,

Write to PC

operation

Example: HERE CALL THERE,1

Before Instruction

PC = address (HERE)

After Instruction

PC = address (THERE)

TOS = address (HERE + 4)

WS = W

BSRS = BSR

STATUSS = STATUS

PIC18F2X1X/4X1X

CLRF Clear f

Syntax: CLRF f {,a}

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: 000h → f

1 → Z

Status Affected: Z

Encoding: 0110 101a ffff ffff

Description: Clears the contents of the specified

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: CLRF FLAG_REG,1

Before Instruction

FLAG_REG = 5Ah

After Instruction

FLAG_REG = 00h

CLRWDT Clear Watchdog Timer

Syntax: CLRWDT

Operands: None

Operation: 000h → WDT,

000h → WDT postscaler,

1 → TO,

1 → PD

Status Affected: TO, PD

Encoding: 0000 0000 0000 0100

Description: CLRWDT instruction resets the

Watchdog Timer. It also resets the

postscaler of the WDT. Status bits TO

and PD are set.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

Process

Data

operation

Example: CLRWDT

Before Instruction

WDT Counter = ?

After Instruction

WDT Counter = 00h

WDT Postscaler = 0

TO =1

PD =1

PIC18F2X1X/4X1X

COMF Complement f

Syntax: COMF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: → dest

Status Affected: N, Z

Encoding: 0001 11da ffff ffff

Description: The contents of register ‘f’ are

complemented. If ‘d’ is ‘0’, the result is

stored in W. If ‘d’ is ‘1’, the result is

stored back in register ‘f’ (default).

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: COMF REG, 0, 0

Before Instruction

REG = 13h

After Instruction

REG = 13h

W=ECh

(f)

CPFSEQ Compare f with W, Skip if f = W

Syntax: CPFSEQ f {,a}

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: (f) – (W),

skip if (f) = (W)

(unsigned comparison)

Status Affected: None

Encoding: 0110 001a ffff ffff

Description: Compares the contents of data memory

location ‘f’ to the contents of W by

performing an unsigned subtraction.

If ‘f’ = W, then the fetched instruction is

discarded and a NOP is executed

instead, making this a two-cycle

instruction.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

operation

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE CPFSEQ REG, 0

NEQUAL :

EQUAL :

Before Instruction

PC Address = HERE

W=?

REG = ?

After Instruction

If REG = W;

PC = Address (EQUAL)

If REG ≠ W;

PC = Address (NEQUAL)

PIC18F2X1X/4X1X

CPFSGT Compare f with W, Skip if f > W

Syntax: CPFSGT f {,a}

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: (f) − (W),

skip if (f) > (W)

(unsigned comparison)

Status Affected: None

Encoding: 0110 010a ffff ffff

Description: Compares the contents of data memory

location ‘f’ to the contents of the W by

performing an unsigned subtraction.

If the contents of ‘f’ are greater than the

contents of WREG, then the fetched

instruction is discarded and a NOP is

executed instead, making this a

two-cycle instruction.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

operation

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE CPFSGT REG, 0

NGREATER :

GREATER :

Before Instruction

PC = Address (HERE)

W= ?

After Instruction

If REG > W;

PC = Address (GREATER)

If REG ≤ W;

PC = Address (NGREATER)

CPFSLT Compare f with W, Skip if f < W

Syntax: CPFSLT f {,a}

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: (f) – (W),

skip if (f) < (W)

(unsigned comparison)

Status Affected: None

Encoding: 0110 000a ffff ffff

Description: Compares the contents of data memory

location ‘f’ to the contents of W by

performing an unsigned subtraction.

If the contents of ‘f’ are less than the

contents of W, then the fetched

instruction is discarded and a NOP is

executed instead, making this a

two-cycle instruction.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

operation

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE CPFSLT REG, 1

NLESS :

LESS :

Before Instruction

PC = Address (HERE)

W= ?

After Instruction

If REG < W;

PC = Address (LESS)

If REG ≥ W;

PC = Address (NLESS)

PIC18F2X1X/4X1X

DAW Decimal Adjust W Register

Syntax: DAW

Operands: None

Operation: If [W<3:0> > 9] or [DC = 1] then

(W<3:0>) + 6 → W<3:0>;

else

(W<3:0>) → W<3:0>;

If [W<7:4> + DC > 9] or [C = 1] then

(W<7:4>) + 6 + DC → W<7:4> ;

else

(W<7:4>) + DC → W<7:4>

Status Affected: C

Encoding: 0000 0000 0000 0111

Description: DAW adjusts the eight-bit value in W,

resulting from the earlier addition of two

variables (each in packed BCD format)

and produces a correct packed BCD

result.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example 1:

DAW

Before Instruction

W=A5h

C=0

DC = 0

After Instruction

W = 05h

C=1

DC = 0

Example 2:

Before Instruction

W=CEh

C=0

DC = 0

After Instruction

W = 34h

C=1

DC = 0

DECF Decrement f

Syntax: DECF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) – 1 → dest

Status Affected: C, DC, N, OV, Z

Encoding: 0000 01da ffff ffff

Description: Decrement register ‘f’. If ‘d’ is ‘0’, the

result is stored in W. If ‘d’ is ‘1’, the

result is stored back in register ‘f’

(default).

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: DECF CNT, 1, 0

Before Instruction

CNT = 01h

Z=0

After Instruction

CNT = 00h

Z=1

PIC18F2X1X/4X1X

DECFSZ Decrement f, Skip if 0

Syntax: DECFSZ f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) – 1 → dest,

skip if result = 0

Status Affected: None

Encoding: 0010 11da ffff ffff

Description: The contents of register ‘f’ are

decremented. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed back in register ‘f’ (default).

If the result is ‘0’, the next instruction,

which is already fetched, is discarded

and a NOP is executed instead, making

it a two-cycle instruction.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE DECFSZ CNT, 1, 1

GOTO LOOP

CONTINUE

Before Instruction

PC = Address (HERE)

After Instruction

CNT = CNT – 1

If CNT = 0;

PC = Address (CONTINUE)

If CNT ≠0;

PC = Address (HERE + 2)

DCFSNZ Decrement f, Skip if not 0

Syntax: DCFSNZ f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) – 1 → dest,

skip if result ≠ 0

Status Affected: None

Encoding: 0100 11da ffff ffff

Description: The contents of register ‘f’ are

decremented. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed back in register ‘f’ (default).

If the result is not ‘0’, the next

instruction, which is already fetched, is

discarded and a NOP is executed

instead, making it a two-cycle

instruction.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE DCFSNZ TEMP, 1, 0

ZERO :

NZERO :

Before Instruction

TEMP = ?

After Instruction

TEMP = TEMP – 1,

If TEMP = 0;

PC = Address (ZERO)

If TEMP ≠0;

PC = Address (NZERO)

PIC18F2X1X/4X1X

GOTO Unconditional Branch

Syntax: GOTO k

Operands: 0 ≤ k ≤ 1048575

Operation: k → PC<20:1>

Status Affected: None

Encoding:

1st word (k<7:0>)

2nd word(k<19:8>)

1110

1111

k19kkk

k7kkk

kkkk

kkkk0

kkkk8

Description: GOTO allows an unconditional branch

anywhere within entire

2-Mbyte memory range. The 20-bit

value ‘k’ is loaded into PC<20:1>.

GOTO is always a two-cycle

instruction.

Words: 2

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’<7:0>,

operation

Read literal

‘k’<19:8>,

Write to PC

operation

Example: GOTO THERE

After Instruction

PC = Address (THERE)

INCF Increment f

Syntax: INCF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) + 1 → dest

Status Affected: C, DC, N, OV, Z

Encoding: 0010 10da ffff ffff

Description: The contents of register ‘f’ are

incremented. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed back in register ‘f’ (default).

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: INCF CNT, 1, 0

Before Instruction

CNT = FFh

Z=0

C=?

DC = ?

After Instruction

CNT = 00h

Z=1

C=1

DC = 1

PIC18F2X1X/4X1X

INCFSZ Increment f, Skip if 0

Syntax: INCFSZ f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) + 1 → dest,

skip if result = 0

Status Affected: None

Encoding: 0011 11da ffff ffff

Description: The contents of register ‘f’ are

incremented. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed back in register ‘f’. (default)

If the result is ‘0’, the next instruction,

which is already fetched, is discarded

and a NOP is executed instead, making

it a two-cycle instruction.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE INCFSZ CNT, 1, 0

NZERO :

ZERO :

Before Instruction

PC = Address (HERE)

After Instruction

CNT = CNT + 1

If CNT = 0;

PC = Address (ZERO)

If CNT ≠0;

PC = Address (NZERO)

INFSNZ Increment f, Skip if not 0

Syntax: INFSNZ f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) + 1 → dest,

skip if result ≠ 0

Status Affected: None

Encoding: 0100 10da ffff ffff

Description: The contents of register ‘f’ are

incremented. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed back in register ‘f’ (default).

If the result is not ‘0’, the next

instruction, which is already fetched, is

discarded and a NOP is executed

instead, making it a two-cycle

instruction.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE INFSNZ REG, 1, 0

ZERO

NZERO

Before Instruction

PC = Address (HERE)

After Instruction

REG = REG + 1

If REG ≠0;

PC = Address (NZERO)

If REG = 0;

PC = Address (ZERO)

PIC18F2X1X/4X1X

IORLW Inclusive OR Literal with W

Syntax: IORLW k

Operands: 0 ≤ k ≤ 255

Operation: (W) .OR. k → W

Status Affected: N, Z

Encoding: 0000 1001 kkkk kkkk

Description: The contents of W are ORed with the

eight-bit literal ‘k’. The result is placed

in W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write to W

Example: IORLW 35h

Before Instruction

W=9Ah

After Instruction

W=BFh

IORWF Inclusive OR W with f

Syntax: IORWF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (W) .OR. (f) → dest

Status Affected: N, Z

Encoding: 0001 00da ffff ffff

Description: Inclusive OR W with register ‘f’. If ‘d’ is

‘0’, the result is placed in W. If ‘d’ is ‘1’,

the result is placed back in register ‘f’

(default).

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: IORWF RESULT, 0, 1

Before Instruction

RESULT = 13h

W = 91h

After Instruction

RESULT = 13h

W = 93h

PIC18F2X1X/4X1X

LFSR Load FSR

Syntax: LFSR f, k

Operands: 0 ≤ f ≤ 2

0 ≤ k ≤ 4095

Operation: k → FSRf

Status Affected: None

Encoding: 1110

1111

1110

0000

00ff

k7kkk

k11kkk

kkkk

Description: The 12-bit literal ‘k’ is loaded into the

File Select Register pointed to by ‘f’.

Words: 2

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’ MSB

Process

Data

Write

literal ‘k’

MSB to

FSRfH

Decode Read literal

‘k’ LSB

Process

Data

Write literal

‘k’ to FSRfL

Example: LFSR 2, 3ABh

After Instruction

FSR2H = 03h

FSR2L = ABh

MOVF Move f

Syntax: MOVF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: f → dest

Status Affected: N, Z

Encoding: 0101 00da ffff ffff

Description: The contents of register ‘f’ are moved to

a destination dependent upon the

status of ‘d’. If ‘d’ is ‘0’, the result is

placed in W. If ‘d’ is ‘1’, the result is

placed back in register ‘f’ (default).

Location ‘f’ can be anywhere in the

256-byte bank.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write W

Example: MOVF REG, 0, 0

Before Instruction

REG = 22h

W=FFh

After Instruction

REG = 22h

W = 22h

PIC18F2X1X/4X1X

MOVFF Move f to f

Syntax: MOVFF fs,fd

Operands: 0 ≤ fs ≤ 4095

0 ≤ fd ≤ 4095

Operation: (fs) → fd

Status Affected: None

Encoding:

1st word (source)

2nd word (destin.)

1100

1111

ffff

ffffs

ffffd

Description: The contents of source register ‘fs’ are

moved to destination register ‘fd’.

Location of source ‘fs’ can be anywhere

in the 4096-byte data space (000h to

FFFh) and location of destination ‘fd’

can also be anywhere from 000h to

FFFh.

Either source or destination can be W

(a useful special situation).

MOVFF is particularly useful for

transferring a data memory location to a

peripheral register (such as the transmit

buffer or an I/O port).

The MOVFF instruction cannot use the

PCL, TOSU, TOSH or TOSL as the

destination register.

Words: 2

Cycles: 2 (3)

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

(src)

Process

Data

operation

Decode No

operation

No dummy

read

operation

Write

(dest)

Example: MOVFF REG1, REG2

Before Instruction

REG1 = 33h

REG2 = 11h

After Instruction

REG1 = 33h

REG2 = 33h

MOVLB Move Literal to Low Nibble in BSR

Syntax: MOVLW k

Operands: 0 ≤ k ≤ 255

Operation: k → BSR

Status Affected: None

Encoding: 0000 0001 kkkk kkkk

Description: The eight-bit literal ‘k’ is loaded into the

Bank Select Register (BSR). The value

of BSR<7:4> always remains ‘0’,

regardless of the value of k7:k4.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write literal

‘k’ to BSR

Example: MOVLB 5

Before Instruction

BSR Register = 02h

After Instruction

BSR Register = 05h

PIC18F2X1X/4X1X

MOVLW Move Literal to W

Syntax: MOVLW k

Operands: 0 ≤ k ≤ 255

Operation: k → W

Status Affected: None

Encoding: 0000 1110 kkkk kkkk

Description: The eight-bit literal ‘k’ is loaded into W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write to W

Example: MOVLW 5Ah

After Instruction

W=5Ah

MOVWF Move W to f

Syntax: MOVWF f {,a}

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: (W) → f

Status Affected: None

Encoding: 0110 111a ffff ffff

Description: Move data from W to register ‘f’.

Location ‘f’ can be anywhere in the

256-byte bank.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: MOVWF REG, 0

Before Instruction

W=4Fh

REG = FFh

After Instruction

W=4Fh

REG = 4Fh

PIC18F2X1X/4X1X

MULLW Multiply Literal with W

Syntax: MULLW k

Operands: 0 ≤ k ≤ 255

Operation: (W) x k → PRODH:PRODL

Status Affected: None

Encoding: 0000 1101 kkkk kkkk

Description: An unsigned multiplication is carried

out between the contents of W and the

8-bit literal ‘k’. The 16-bit result is

placed in PRODH:PRODL register pair.

PRODH contains the high byte.

W is unchanged.

None of the status flags are affected.

Note that neither overflow nor carry is

possible in this operation. A zero result

is possible but not detected.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write

registers

PRODH:

PRODL

Example: MULLW 0C4h

Before Instruction

W=E2h

PRODH = ?

PRODL = ?

After Instruction

W=E2h

PRODH = ADh

PRODL = 08h

MULWF Multiply W with f

Syntax: MULWF f {,a}

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: (W) x (f) → PRODH:PRODL

Status Affected: None

Encoding: 0000 001a ffff ffff

Description: An unsigned multiplication is carried

out between the contents of W and the

result is stored in the PRODH:PRODL

high byte. Both W and ‘f’ are

unchanged.

None of the status flags are affected.

Note that neither overflow nor carry is

possible in this operation. A zero

result is possible but not detected.

If ‘a’ is ‘0’, the Access Bank is

selected. If ‘a’ is ‘1’, the BSR is used

to select the GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction

operates in Indexed Literal Offset

Addressing mode whenever

f ≤ 95 (5Fh). See Section 23.2.3

“Byte-Oriented and Bit-Oriented

Instructions in Indexed Literal Offset

Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

registers

PRODH:

PRODL

Example: MULWF REG, 1

Before Instruction

W=C4h

REG = B5h

PRODH = ?

PRODL = ?

After Instruction

W=C4h

REG = B5h

PRODH = 8Ah

PRODL = 94h

PIC18F2X1X/4X1X

NEGF Negate f

Syntax: NEGF f {,a}

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: ( f ) + 1 → f

Status Affected: N, OV, C, DC, Z

Encoding: 0110 110a ffff ffff

Description: Location ‘f’ is negated using two’s

complement. The result is placed in the

data memory location ‘f’.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: NEGF REG, 1

Before Instruction

REG = 0011 1010 [3Ah]

After Instruction

REG = 1100 0110 [C6h]

NOP No Operation

Syntax: NOP

Operands: None

Operation: No operation

Status Affected: None

Encoding: 0000

1111

0000

xxxx

0000

xxxx

0000

xxxx

Description: No operation.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

Example:

None.

PIC18F2X1X/4X1X

POP Pop Top of Return Stack

Syntax: POP

Operands: None

Operation: (TOS) → bit bucket

Status Affected: None

Encoding: 0000 0000 0000 0110

Description: The TOS value is pulled off the return

stack and is discarded. The TOS value

then becomes the previous value that

was pushed onto the return stack.

This instruction is provided to enable

the user to properly manage the return

stack to incorporate a software stack.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

POP TOS

value

operation

Example: POP

GOTO NEW

Before Instruction

TOS = 0031A2h

Stack (1 level down) = 014332h

After Instruction

TOS = 014332h

PC = NEW

PUSH Push Top of Return Stack

Syntax: PUSH

Operands: None

Operation: (PC + 2) → TOS

Status Affected: None

Encoding: 0000 0000 0000 0101

Description: The PC + 2 is pushed onto the top of

the return stack. The previous TOS

value is pushed down on the stack.

This instruction allows implementing a

software stack by modifying TOS and

then pushing it onto the return stack.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode PUSH

PC + 2 onto

return stack

operation

Example: PUSH

Before Instruction

TOS = 345Ah

PC = 0124h

After Instruction

PC = 0126h

TOS = 0126h

Stack (1 level down) = 345Ah

PIC18F2X1X/4X1X

RCALL Relative Call

Syntax: RCALL n

Operands: -1024 ≤ n ≤ 1023

Operation: (PC) + 2 → TOS,

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1101 1nnn nnnn nnnn

Description: Subroutine call with a jump up to 1K

from the current location. First, return

address (PC+2) is pushed onto the

stack. Then, add the 2’s complement

number ‘2n’ to the PC. Since the PC will

have incremented to fetch the next

instruction, the new address will be

PC+2+2n. This instruction is a

two-cycle instruction.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Push PC to

stack

Process

Data

Write to PC

operation

Example: HERE RCALL Jump

Before Instruction

PC = Address (HERE)

After Instruction

PC = Address (Jump)

TOS = Address (HERE + 2)

RESET Reset

Syntax: RESET

Operands: None

Operation: Reset all registers and flags that are

affected by a MCLR Reset.

Status Affected: All

Encoding: 0000 0000 1111 1111

Description: This instruction provides a way to

execute a MCLR Reset in software.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Start

Reset

operation

Example: RESET

After Instruction

Registers = Reset Value

Flags* = Reset Value

PIC18F2X1X/4X1X

RETFIE Return from Interrupt

Syntax: RETFIE {s}

Operands: s ∈ [0,1]

Operation: (TOS) → PC,

1 → GIE/GIEH or PEIE/GIEL,

if s = 1

(WS) → W,

(STATUSS) → STATUS,

(BSRS) → BSR,

PCLATU, PCLATH are unchanged.

Status Affected: GIE/GIEH, PEIE/GIEL.

Encoding: 0000 0000 0001 000s

Description: Return from Interrupt. Stack is popped

and Top-of-Stack (TOS) is loaded into

the PC. Interrupts are enabled by

setting either the high or low priority

global interrupt enable bit. If ‘s’ = 1, the

contents of the shadow registers WS,

STATUSS and BSRS are loaded into

their corresponding registers, W,

STATUS and BSR. If ‘s’ = 0, no update

of these registers occurs (default).

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

POP PC

from stack

Set GIEH or

GIEL

operation

Example: RETFIE 1

After Interrupt

PC = TOS

W=WS

BSR = BSRS

STATUS = STATUSS

GIE/GIEH, PEIE/GIEL = 1

RETLW Return Literal to W

Syntax: RETLW k

Operands: 0 ≤ k ≤ 255

Operation: k → W,

(TOS) → PC,

PCLATU, PCLATH are unchanged

Status Affected: None

Encoding: 0000 1100 kkkk kkkk

Description: W is loaded with the eight-bit literal ‘k’.

The program counter is loaded from the

top of the stack (the return address).

The high address latch (PCLATH)

remains unchanged.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

POP PC

from stack,

Write to W

operation

Example:

CALL TABLE ; W contains table

; offset value

; W now has

; table value

TABLE

ADDWF PCL ; W = offset

RETLW k0 ; Begin table

RETLW k1 ;

RETLW kn ; End of table

Before Instruction

W = 07h

After Instruction

W = value of kn

PIC18F2X1X/4X1X

RETURN Return from Subroutine

Syntax: RETURN {s}

Operands: s ∈ [0,1]

Operation: (TOS) → PC,

if s = 1

(WS) → W,

(STATUSS) → STATUS,

(BSRS) → BSR,

PCLATU, PCLATH are unchanged

Status Affected: None

Encoding: 0000 0000 0001 001s

Description: Return from subroutine. The stack is

popped and the top of the stack (TOS)

is loaded into the program counter. If

‘s’= 1, the contents of the shadow

registers WS, STATUSS and BSRS are

loaded into their corresponding

registers, W, STATUS and BSR. If

‘s’ = 0, no update of these registers

occurs (default).

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

Process

Data

POP PC

from stack

operation

Example: RETURN

After Instruction:

PC = TOS

RLCF Rotate Left f through Carry

Syntax: RLCF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f<n>) → dest<n + 1>,

(f<7>) → C,

Status Affected: C, N, Z

Encoding: 0011 01da ffff ffff

Description: The contents of register ‘f’ are rotated

one bit to the left through the Carry

flag. If ‘d’ is ‘0’, the result is placed in

W. If ‘d’ is ‘1’, the result is stored back

in register ‘f’ (default).

If ‘a’ is ‘0’, the Access Bank is

selected. If ‘a’ is ‘1’, the BSR is used to

select the GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction

operates in Indexed Literal Offset

Addressing mode whenever

f ≤ 95 (5Fh). See Section 23.2.3

“Byte-Oriented and Bit-Oriented

Instructions in Indexed Literal Offset

Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: RLCF REG, 0, 0

Before Instruction

REG = 1110 0110

C=0

After Instruction

REG = 1110 0110

W=1100 1100

C=1

Cregister f

PIC18F2X1X/4X1X

RLNCF Rotate Left f (no carry)

Syntax: RLNCF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f<n>) → dest<n + 1>,

(f<7>) → dest<0>

Status Affected: N, Z

Encoding: 0100 01da ffff ffff

Description: The contents of register ‘f’ are rotated

one bit to the left. If ‘d’ is ‘0’, the result

is placed in W. If ‘d’ is ‘1’, the result is

stored back in register ‘f’ (default).

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: RLNCF REG, 1, 0

Before Instruction

REG = 1010 1011

After Instruction

REG = 0101 0111

RRCF Rotate Right f through Carry

Syntax: RRCF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f<n>) → dest<n – 1>,

(f<0>) → C,

Status Affected: C, N, Z

Encoding: 0011 00da ffff ffff

Description: The contents of register ‘f’ are rotated

one bit to the right through the Carry

flag. If ‘d’ is ‘0’, the result is placed in W.

If ‘d’ is ‘1’, the result is placed back in

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: RRCF REG, 0, 0

Before Instruction

REG = 1110 0110

C=0

After Instruction

REG = 1110 0110

W=0111 0011

C=0

Cregister f

PIC18F2X1X/4X1X

RRNCF Rotate Right f (no carry)

Syntax: RRNCF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f<n>) → dest<n – 1>,

(f<0>) → dest<7>

Status Affected: N, Z

Encoding: 0100 00da ffff ffff

Description: The contents of register ‘f’ are rotated

one bit to the right. If ‘d’ is ‘0’, the result

is placed in W. If ‘d’ is ‘1’, the result is

placed back in register ‘f’ (default).

If ‘a’ is ‘0’, the Access Bank will be

selected, overriding the BSR value. If ‘a’

is ‘1’, then the bank will be selected as

per the BSR value (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example 1: RRNCF REG, 1, 0

Before Instruction

REG = 1101 0111

After Instruction

REG = 1110 1011

Example 2: RRNCF REG, 0, 0

Before Instruction

W=?

REG = 1101 0111

After Instruction

W=1110 1011

REG = 1101 0111

SETF Set f

Syntax: SETF f {,a}

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: FFh → f

Status Affected: None

Encoding: 0110 100a ffff ffff

Description: The contents of the specified register

are set to FFh.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write

Example: SETF REG,1

Before Instruction

REG = 5Ah

After Instruction

REG = FFh

PIC18F2X1X/4X1X

SLEEP Enter Sleep mode

Syntax: SLEEP

Operands: None

Operation: 00h → WDT,

0 → WDT postscaler,

1 → TO,

0 → PD

Status Affected: TO, PD

Encoding: 0000 0000 0000 0011

Description: The Power-Down Status bit (PD) is

cleared. The Time-out Status bit (TO)

is set. Watchdog Timer and its

postscaler are cleared.

The processor is put into Sleep mode

with the oscillator stopped.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

Process

Data

Go to

Sleep

Example: SLEEP

Before Instruction

TO =?

PD =?

After Instruction

TO =1 †

PD =0

† If WDT causes wake-up, this bit is cleared.

SUBFWB Subtract f from W with Borrow

Syntax: SUBFWB f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (W) – (f) – (C) → dest

Status Affected: N, OV, C, DC, Z

Encoding: 0101 01da ffff ffff

Description: Subtract register ‘f’ and Carry flag

(borrow) from W (2’s complement

method). If ‘d’ is ‘0’, the result is stored

in W. If ‘d’ is ‘1’, the result is stored in

If ‘a’ is ‘0’, the Access Bank is

selected. If ‘a’ is ‘1’, the BSR is used

to select the GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction

operates in Indexed Literal Offset

Addressing mode whenever

f ≤ 95 (5Fh). See Section 23.2.3

“Byte-Oriented and Bit-Oriented

Instructions in Indexed Literal Offset

Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example 1: SUBFWB REG, 1, 0

Before Instruction

REG = 3

W=2

C=1

After Instruction

REG = FF

W=2

C=0

Z=0

N = 1 ; result is negative

Example 2: SUBFWB REG, 0, 0

Before Instruction

REG = 2

W=5

C=1

After Instruction

REG = 2

W=3

C=1

Z=0

N = 0 ; result is positive

Example 3: SUBFWB REG, 1, 0

Before Instruction

REG = 1

W=2

C=0

After Instruction

REG = 0

W=2

C=1

Z = 1 ; result is zero

N=0

PIC18F2X1X/4X1X

SUBLW Subtract W from Literal

Syntax: SUBLW k

Operands: 0 ≤ k ≤ 255

Operation: k – (W) → W

Status Affected: N, OV, C, DC, Z

Encoding: 0000 1000 kkkk kkkk

Description W is subtracted from the eight-bit

literal ‘k’. The result is placed in W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write to W

Example 1: SUBLW 02h

Before Instruction

W = 01h

C=?

After Instruction

W = 01h

C = 1 ; result is positive

Z=0

N=0

Example 2: SUBLW 02h

Before Instruction

W = 02h

C=?

After Instruction

W = 00h

C = 1 ; result is zero

Z=1

N=0

Example 3: SUBLW 02h

Before Instruction

W = 03h

C=?

After Instruction

W = FFh ; (2’s complement)

C = 0 ; result is negative

Z=0

N=1

SUBWF Subtract W from f

Syntax: SUBWF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) – (W) → dest

Status Affected: N, OV, C, DC, Z

Encoding: 0101 11da ffff ffff

Description: Subtract W from register ‘f’ (2’s

complement method). If ‘d’ is ‘0’, the

result is stored in W. If ‘d’ is ‘1’, the

result is stored back in register ‘f’

(default).

If ‘a’ is ‘0’, the Access Bank is

selected. If ‘a’ is ‘1’, the BSR is used

to select the GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction

operates in Indexed Literal Offset

Addressing mode whenever

f ≤ 95 (5Fh). See Section 23.2.3

“Byte-Oriented and Bit-Oriented

Instructions in Indexed Literal Offset

Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example 1: SUBWF REG, 1, 0

Before Instruction

REG = 3

W=2

C=?

After Instruction

REG = 1

W=2

C = 1 ; result is positive

Z=0

N=0

Example 2: SUBWF REG, 0, 0

Before Instruction

REG = 2

W=2

C=?

After Instruction

REG = 2

W=0

C = 1 ; result is zero

Z=1

N=0

Example 3: SUBWF REG, 1, 0

Before Instruction

REG = 1

W=2

C=?

After Instruction

REG = FFh ;(2’s complement)

W=2

C = 0 ; result is negative

Z=0

N=1

PIC18F2X1X/4X1X

SUBWFB Subtract W from f with Borrow

Syntax: SUBWFB f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) – (W) – (C) → dest

Status Affected: N, OV, C, DC, Z

Encoding: 0101 10da ffff ffff

Description: Subtract W and the Carry flag (borrow)

from register ‘f’ (2’s complement

method). If ‘d’ is ‘0’, the result is stored

in W. If ‘d’ is ‘1’, the result is stored back

in register ‘f’ (default).

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example 1: SUBWFB REG, 1, 0

Before Instruction

REG = 19h (0001 1001)

W=0Dh (0000 1101)

C=1

After Instruction

REG = 0Ch (0000 1011)

W=0Dh (0000 1101)

C=1

Z=0

N = 0 ; result is positive

Example 2: SUBWFB REG, 0, 0

Before Instruction

REG = 1Bh (0001 1011)

W=1Ah (0001 1010)

C=0

After Instruction

REG = 1Bh (0001 1011)

W = 00h

C=1

Z = 1 ; result is zero

N=0

Example 3: SUBWFB REG, 1, 0

Before Instruction

REG = 03h (0000 0011)

W=0Eh (0000 1101)

C=1

After Instruction

REG = F5h (1111 0100)

; [2’s comp]

W=0Eh (0000 1101)

C=0

Z=0

N = 1 ; result is negative

SWAPF Swap f

Syntax: SWAPF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f<3:0>) → dest<7:4>,

(f<7:4>) → dest<3:0>

Status Affected: None

Encoding: 0011 10da ffff ffff

Description: The upper and lower nibbles of register

‘f’ are exchanged. If ‘d’ is ‘0’, the result

is placed in W. If ‘d’ is ‘1’, the result is

placed in register ‘f’ (default).

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: SWAPF REG, 1, 0

Before Instruction

REG = 53h

After Instruction

REG = 35h

PIC18F2X1X/4X1X

TBLRD Table Read

Syntax: TBLRD ( *; *+; *-; +*)

Operands: None

Operation: if TBLRD *,

(Prog Mem (TBLPTR)) → TABLAT;

TBLPTR – No Change;

if TBLRD *+,

(Prog Mem (TBLPTR)) → TABLAT;

(TBLPTR) + 1 → TBLPTR;

if TBLRD *-,

(Prog Mem (TBLPTR)) → TABLAT;

(TBLPTR) – 1 → TBLPTR;

if TBLRD +*,

(TBLPTR) + 1 → TBLPTR;

(Prog Mem (TBLPTR)) → TABLAT;

Status Affected: None

Encoding: 0000 0000 0000 10nn

nn=0 *

=1 *+

=2 *-

=3 +*

Description: This instruction is used to read the contents

of Program Memory (P.M.). To address the

program memory, a pointer called Table

Pointer (TBLPTR) is used.

The TBLPTR (a 21-bit pointer) points to

each byte in the program memory. TBLPTR

has a 2-Mbyte address range.

TBLPTR[0] = 0: Least Significant Byte

of Program Memory

Word

TBLPTR[0] = 1: Most Significant Byte

of Program Memory

Word

The TBLRD instruction can modify the value

of TBLPTR as follows:

• no change

• post-increment

• post-decrement

• pre-increment

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

No operation

(Read Program

Memory)

operation

No operation

(Write TABLAT)

TBLRD Table Read (Continued)

Example 1: TBLRD *+ ;

Before Instruction

TABLAT = 55h

TBLPTR = 00A356h

MEMORY (00A356h) = 34h

After Instruction

TABLAT = 34h

TBLPTR = 00A357h

Example 2: TBLRD +* ;

Before Instruction

TABLAT = AAh

TBLPTR = 01A357h

MEMORY (01A357h) = 12h

MEMORY (01A358h) = 34h

After Instruction

TABLAT = 34h

TBLPTR = 01A358h

PIC18F2X1X/4X1X

TBLWT Table Write

Syntax: TBLWT ( *; *+; *-; +*)

Operands: None

Operation: if TBLWT*,

(TABLAT) → Holding Register;

TBLPTR – No Change;

if TBLWT*+,

(TABLAT) → Holding Register;

(TBLPTR) + 1 → TBLPTR;

if TBLWT*-,

(TABLAT) → Holding Register;

(TBLPTR) – 1 → TBLPTR;

if TBLWT+*,

(TBLPTR) + 1 → TBLPTR;

(TABLAT) → Holding Register;

Status Affected: None

Encoding: 0000 0000 0000 11nn

nn=0 *

=1 *+

=2 *-

=3 +*

Description: This instruction uses the 3 LSBs of

TBLPTR to determine which of the

8 holding registers the TABLAT is written

to. The holding registers are used to

program the contents of Program

Memory (P.M.). (Refer to Section 6.0

“Flash Program Memory” for additional

details on programming Flash memory.)

The TBLPTR (a 21-bit pointer) points to

each byte in the program memory.

TBLPTR has a 2-MByte address range.

The LSb of the TBLPTR selects which

byte of the program memory location to

access.

TBLPTR[0] = 0: Least Significant

Byte of Program

Memory Word

TBLPTR[0] = 1: Most Significant

Byte of Program

Memory Word

The TBLWT instruction can modify the

value of TBLPTR as follows:

• no change

• post-increment

• post-decrement

• pre-increment

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation

(Read

TABLAT)

operation

(Write to

Holding

TBLWT Table Write (Continued)

Example 1: TBLWT *+;

Before Instruction

TABLAT = 55h

TBLPTR = 00A356h

HOLDING REGISTER

(00A356h) = FFh

After Instructions (table write completion)

TABLAT = 55h

TBLPTR = 00A357h

HOLDING REGISTER

(00A356h) = 55h

Example 2: TBLWT +*;

Before Instruction

TABLAT = 34h

TBLPTR = 01389Ah

HOLDING REGISTER

(01389Ah) = FFh

HOLDING REGISTER

(01389Bh) = FFh

After Instruction (table write completion)

TABLAT = 34h

TBLPTR = 01389Bh

HOLDING REGISTER

(01389Ah) = FFh

HOLDING REGISTER

(01389Bh) = 34h

PIC18F2X1X/4X1X

TSTFSZ Test f, Skip if 0

Syntax: TSTFSZ f {,a}

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: skip if f = 0

Status Affected: None

Encoding: 0110 011a ffff ffff

Description: If ‘f’ = 0, the next instruction fetched

during the current instruction execution

is discarded and a NOP is executed,

making this a two-cycle instruction.

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

operation

If skip:

Q1 Q2 Q3 Q4

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation

Example: HERE TSTFSZ CNT, 1

NZERO :

ZERO :

Before Instruction

PC = Address (HERE)

After Instruction

If CNT = 00h,

PC = Address (ZERO)

If CNT ≠00h,

PC = Address (NZERO)

XORLW Exclusive OR Literal with W

Syntax: XORLW k

Operands: 0 ≤ k ≤ 255

Operation: (W) .XOR. k → W

Status Affected: N, Z

Encoding: 0000 1010 kkkk kkkk

Description: The contents of W are XORed with

the 8-bit literal ‘k’. The result is placed

in W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write to W

Example: XORLW 0AFh

Before Instruction

W=B5h

After Instruction

W=1Ah

PIC18F2X1X/4X1X

XORWF Exclusive OR W with f

Syntax: XORWF f {,d {,a}}

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (W) .XOR. (f) → dest

Status Affected: N, Z

Encoding: 0001 10da ffff ffff

Description: Exclusive OR the contents of W with

in W. If ‘d’ is ‘1’, the result is stored back

in the register ‘f’ (default).

If ‘a’ is ‘0’, the Access Bank is selected.

If ‘a’ is ‘1’, the BSR is used to select the

GPR bank (default).

If ‘a’ is ‘0’ and the extended instruction

set is enabled, this instruction operates

in Indexed Literal Offset Addressing

mode whenever f ≤ 95 (5Fh). See

Section 23.2.3 “Byte-Oriented and

Bit-Oriented Instructions in Indexed

Literal Offset Mode” for details.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: XORWF REG, 1, 0

Before Instruction

REG = AFh

W=B5h

After Instruction

REG = 1Ah

W=B5h

PIC18F2X1X/4X1X

23.2 Extended Instruction Set

In addition to the standard 75 instructions of the PIC18

instruction set, PIC18F2X1X/4X1X devices also

provide an optional extension to the core CPU function-

ality. The added features include eight additional

instructions that augment indirect and indexed

addressing operations and the implementation of

Indexed Literal Offset Addressing mode for many of the

standard PIC18 instructions.

The additional features of the extended instruction set

are disabled by default. To enable them, users must set

the XINST Configuration bit.

The instructions in the extended set (with the exception

of CALLW, MOVSF and MOVSS) can all be classified as

literal operations, which either manipulate the File

Select Registers, or use them for indexed addressing.

Two of the instructions, ADDFSR and SUBFSR, each

have an additional special instantiation for using FSR2.

These versions (ADDULNK and SUBULNK) allow for

automatic return after execution.

The extended instructions are specifically implemented

to optimize re-entrant program code (that is, code that

is recursive or that uses a software stack) written in

high-level languages, particularly C. Among other

things, they allow users working in high-level

languages to perform certain operations on data

structures more efficiently. These include:

• Dynamic allocation and deallocation of software

stack space when entering and leaving

subroutines

• Function Pointer invocation

• Software Stack Pointer manipulation

• Manipulation of variables located in a software

stack

A summary of the instructions in the extended instruc-

tion set is provided in Table 23-3. Detailed descriptions

are provided in Section 23.2.2 “Extended Instruction

Set”. The opcode field descriptions in Table 23-1

(page 258) apply to both the standard and extended

PIC18 instruction sets.

23.2.1 EXTENDED INSTRUCTION SYNTAX

Most of the extended instructions use indexed

arguments, using one of the File Select Registers and

some offset to specify a source or destination register.

When an argument for an instruction serves as part of

indexed addressing, it is enclosed in square brackets

(“[ ]”). This is done to indicate that the argument is used

as an index or offset. The MPASM™ Assembler will

flag an error if it determines that an index or offset value

is not bracketed.

When the extended instruction set is enabled, brackets

are also used to indicate index arguments in byte-

oriented and bit-oriented instructions. This is in addition

to other changes in their syntax. For more details, see

Section 23.2.3.1 “Extended Instruction Syntax with

Standard PIC18 Commands”.

TABLE 23-3: EXTENSIONS TO THE PIC18 INSTRUCTION SET

Note: The instruction set extension and the

Indexed Literal Offset Addressing mode

were designed for optimizing applications

written in C. The user may likely never use

these instructions directly in assembler.

The syntax for these commands is pro-

vided as a reference for users who may be

reviewing code that has been generated

by a compiler.

Note: In the past, square brackets have been

used to denote optional arguments in the

PIC18 and earlier instruction sets. In this

text and going forward, optional

arguments are denoted by braces (“{ }”).

Mnemonic,

Operands Description Cycles

16-Bit Instruction Word Status

Affected

MSb LSb

ADDFSR

ADDULNK

CALLW

MOVSF

MOVSS

PUSHL

SUBFSR

SUBULNK

f, k

zs, fd

zs, zd

f, k

Add literal to FSR

Add literal to FSR2 and return

Call subroutine using WREG

Move zs (source) to 1st word

fd (destination) 2nd word

Move zs (source) to 1st word

zd (destination) 2nd word

Store literal at FSR2,

decrement FSR2

Subtract literal from FSR

Subtract literal from FSR2 and

return

1110

0000

1110

1111

1110

1111

1110

1000

0000

1011

ffff

1011

xxxx

1010

1001

ffkk

11kk

0001

0zzz

ffff

1zzz

xzzz

kkkk

ffkk

11kk

kkkk

0100

zzzz

ffff

zzzz

kkkk

None

PIC18F2X1X/4X1X

23.2.2 EXTENDED INSTRUCTION SET

ADDFSR Add Literal to FSR

Syntax: ADDFSR f, k

Operands: 0 ≤ k ≤ 63

f ∈ [ 0, 1, 2 ]

Operation: FSR(f) + k → FSR(f)

Status Affected: None

Encoding: 1110 1000 ffkk kkkk

Description: The 6-bit literal ‘k’ is added to the

contents of the FSR specified by ‘f’.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write to

FSR

Example: ADDFSR 2, 23h

Before Instruction

FSR2 = 03FFh

After Instruction

FSR2 = 0422h

ADDULNK Add Literal to FSR2 and Return

Syntax: ADDULNK k

Operands: 0 ≤ k ≤ 63

Operation: FSR2 + k → FSR2,

(TOS) → PC

Status Affected: None

Encoding: 1110 1000 11kk kkkk

Description: The 6-bit literal ‘k’ is added to the

contents of FSR2. A RETURN is then

executed by loading the PC with the

TOS.

The instruction takes two cycles to

execute; a NOP is performed during

the second cycle.

This may be thought of as a special

case of the ADDFSR instruction,

where f = 3 (binary ‘11’); it operates

only on FSR2.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’

Process

Data

Write to

FSR

Operation

Example: ADDULNK 23h

Before Instruction

FSR2 = 03FFh

PC = 0100h

After Instruction

FSR2 = 0422h

PC = (TOS)

Note: All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in

symbolic addressing. If a label is used, the instruction syntax then becomes: {label} instruction argument(s).

PIC18F2X1X/4X1X

CALLW Subroutine Call Using WREG

Syntax: CALLW

Operands: None

Operation: (PC + 2) → TOS,

(W) → PCL,

(PCLATH) → PCH,

(PCLATU) → PCU

Status Affected: None

Encoding: 0000 0000 0001 0100

Description First, the return address (PC + 2) is

pushed onto the return stack. Next, the

contents of W are written to PCL; the

existing value is discarded. Then the

contents of PCLATH and PCLATU are

latched into PCH and PCU,

respectively. The second cycle is

executed as a NOP instruction while the

new next instruction is fetched.

Unlike CALL, there is no option to

update W, STATUS or BSR.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

WREG

Push PC to

stack

operation

Example: HERE CALLW

Before Instruction

PC = address (HERE)

PCLATH = 10h

PCLATU = 00h

W = 06h

After Instruction

PC = 001006h

TOS = address (HERE + 2)

PCLATH = 10h

PCLATU = 00h

W = 06h

MOVSF Move Indexed to f

Syntax: MOVSF [zs], fd

Operands: 0 ≤ zs ≤ 127

0 ≤ fd ≤ 4095

Operation: ((FSR2) + zs) → fd

Status Affected: None

Encoding:

1st word (source)

2nd word (destin.)

1110

1111

1011

ffff

0zzz

ffff

zzzzs

ffffd

Description: The contents of the source register are

moved to destination register ‘fd’. The

actual address of the source register is

determined by adding the 7-bit literal

offset ‘zs’ in the first word to the value of

FSR2. The address of the destination

‘fd’ in the second word. Both addresses

can be anywhere in the 4096-byte data

space (000h to FFFh).

The MOVSF instruction cannot use the

PCL, TOSU, TOSH or TOSL as the

destination register.

If the resultant source address points to

an indirect addressing register, the

value returned will be 00h.

Words: 2

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Determine

source addr

Determine

source addr

Read

source reg

Decode No

operation

No dummy

read

operation

Write

(dest)

Example: MOVSF [05h], REG2

Before Instruction

FSR2 = 80h

Contents

of 85h = 33h

REG2 = 11h

After Instruction

FSR2 = 80h

Contents

of 85h = 33h

REG2 = 33h

PIC18F2X1X/4X1X

MOVSS Move Indexed to Indexed

Syntax: MOVSS [zs], [zd]

Operands: 0 ≤ zs ≤ 127

0 ≤ zd ≤ 127

Operation: ((FSR2) + zs) → ((FSR2) + zd)

Status Affected: None

Encoding:

1st word (source)

2nd word (dest.)

1110

1111

1011

xxxx

1zzz

xzzz

zzzzs

zzzzd

Description The contents of the source register are

moved to the destination register. The

addresses of the source and destination

registers are determined by adding the

7-bit literal offsets ‘zs’ or ‘zd’,

respectively, to the value of FSR2. Both

registers can be located anywhere in

the 4096-byte data memory space

(000h to FFFh).

The MOVSS instruction cannot use the

PCL, TOSU, TOSH or TOSL as the

destination register.

If the resultant source address points to

an indirect addressing register, the

value returned will be 00h. If the

resultant destination address points to

an indirect addressing register, the

instruction will execute as a NOP.

Words: 2

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Determine

source addr

Determine

source addr

Read

source reg

Decode Determine

dest addr

Determine

dest addr

Write

to dest reg

Example: MOVSS [05h], [06h]

Before Instruction

FSR2 = 80h

Contents

of 85h = 33h

Contents

of 86h = 11h

After Instruction

FSR2 = 80h

Contents

of 85h = 33h

Contents

of 86h = 33h

PUSHL

Store Literal at FSR2, Decrement FSR2

Syntax: PUSHL k

Operands: 0 ≤ k ≤ 255

Operation: k → (FSR2),

FSR2 – 1 → FSR2

Status Affected: None

Encoding: 1111 1010 kkkk kkkk

Description: The 8-bit literal ‘k’ is written to the data

memory address specified by FSR2. FSR2

is decremented by 1 after the operation.

This instruction allows users to push values

onto a software stack.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read ‘k’ Process

data

Write to

destination

Example: PUSHL 08h

Before Instruction

FSR2H:FSR2L = 01ECh

Memory (01ECh) = 00h

After Instruction

FSR2H:FSR2L = 01EBh

Memory (01ECh) = 08h

PIC18F2X1X/4X1X

SUBFSR Subtract Literal from FSR

Syntax: SUBFSR f, k

Operands: 0 ≤ k ≤ 63

f ∈ [ 0, 1, 2 ]

Operation: FSR(f) – k → FSRf

Status Affected: None

Encoding: 1110 1001 ffkk kkkk

Description: The 6-bit literal ‘k’ is subtracted from

the contents of the FSR specified by

‘f’.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: SUBFSR 2, 23h

Before Instruction

FSR2 = 03FFh

After Instruction

FSR2 = 03DCh

SUBULNK

Subtract Literal from FSR2 and Return

Syntax: SUBULNK k

Operands: 0 ≤ k ≤ 63

Operation: FSR2 – k → FSR2

(TOS) → PC

Status Affected: None

Encoding: 1110 1001 11kk kkkk

Description: The 6-bit literal ‘k’ is subtracted from the

contents of the FSR2. A RETURN is then

executed by loading the PC with the TOS.

The instruction takes two cycles to

execute; a NOP is performed during the

second cycle.

This may be thought of as a special case of

the SUBFSR instruction, where f = 3 (binary

‘11’); it operates only on FSR2.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Operation

Example: SUBULNK 23h

Before Instruction

FSR2 = 03FFh

PC = 0100h

After Instruction

FSR2 = 03DCh

PC = (TOS)

PIC18F2X1X/4X1X

23.2.3 BYTE-ORIENTED AND

BIT-ORIENTED INSTRUCTIONS IN

INDEXED LITERAL OFFSET MODE

In addition to eight new commands in the extended set,

enabling the extended instruction set also enables

Indexed Literal Offset Addressing mode (Section 5.5.1

“Indexed Addressing with Literal Offset”). This has

a significant impact on the way that many commands of

the standard PIC18 instruction set are interpreted.

When the extended set is disabled, addresses embed-

ded in opcodes are treated as literal memory locations:

either as a location in the Access Bank (‘a’ = 0) or in a

GPR bank designated by the BSR (‘a’ = 1). When the

extended instruction set is enabled and ‘a’ = 0,

however, a file register argument of 5Fh or less is

interpreted as an offset from the pointer value in FSR2

and not as a literal address. For practical purposes, this

means that all instructions that use the Access RAM bit

as an argument – that is, all byte-oriented and bit-

oriented instructions, or almost half of the core PIC18

instructions – may behave differently when the

extended instruction set is enabled.

When the content of FSR2 is 00h, the boundaries of the

Access RAM are essentially remapped to their original

values. This may be useful in creating backward

compatible code. If this technique is used, it may be

necessary to save the value of FSR2 and restore it

when moving back and forth between C and assembly

routines in order to preserve the Stack Pointer. Users

must also keep in mind the syntax requirements of the

extended instruction set (see Section 23.2.3.1

“Extended Instruction Syntax with Standard PIC18

Commands”).

Although the Indexed Literal Offset Addressing mode

can be very useful for dynamic stack and pointer

manipulation, it can also be very annoying if a simple

arithmetic operation is carried out on the wrong

programming must keep in mind that when the

extended instruction set is enabled, register addresses

of 5Fh or less are used for Indexed Literal Offset

Addressing.

Representative examples of typical byte-oriented and

bit-oriented instructions in the Indexed Literal Offset

Addressing mode are provided on the following page to

show how execution is affected. The operand condi-

tions shown in the examples are applicable to all

instructions of these types.

23.2.3.1 Extended Instruction Syntax with

Standard PIC18 Commands

When the extended instruction set is enabled, the file

bit-oriented commands is replaced with the literal offset

value, ‘k’. As already noted, this occurs only when ‘f’ is

less than or equal to 5Fh. When an offset value is used,

it must be indicated by square brackets (“[ ]”). As with

the extended instructions, the use of brackets indicates

to the compiler that the value is to be interpreted as an

index or an offset. Omitting the brackets, or using a

value greater than 5Fh within brackets, will generate an

error in the MPASM Assembler.

If the index argument is properly bracketed for Indexed

Literal Offset Addressing, the Access RAM argument is

never specified; it will automatically be assumed to be

‘0’. This is in contrast to standard operation (extended

instruction set disabled) when ‘a’ is set on the basis of

the target address. Declaring the Access RAM bit in

this mode will also generate an error in the MPASM

Assembler.

The destination argument, ‘d’, functions as before.

In the latest versions of the MPASM Assembler,

language support for the extended instruction set must

be explicitly invoked. This is done with either the

command line option, /y, or the PE directive in the

source listing.

23.2.4 CONSIDERATIONS WHEN

ENABLING THE EXTENDED

INSTRUCTION SET

It is important to note that the extensions to the instruc-

tion set may not be beneficial to all users. In particular,

users who are not writing code that uses a software

stack may not benefit from using the extensions to the

instruction set.

Additionally, the Indexed Literal Offset Addressing

mode may create issues with legacy applications

written to the PIC18 assembler. This is because

instructions in the legacy code may attempt to address

registers in the Access Bank below 5Fh. Since these

addresses are interpreted as literal offsets to FSR2

when the instruction set extension is enabled, the

application may read or write to the wrong data

addresses.

When porting an application to the PIC18F2X1X/4X1X,

it is very important to consider the type of code. A large,

re-entrant application that is written in ‘C’ and would

benefit from efficient compilation will do well when

using the instruction set extensions. Legacy applica-

tions that heavily use the Access Bank will most likely

not benefit from using the extended instruction set.

Note: Enabling the PIC18 instruction set

extension may cause legacy applications

to behave erratically or fail entirely.

PIC18F2X1X/4X1X

ADDWF Add W to Indexed

(Indexed Literal Offset mode)

Syntax: ADDWF [k] {,d}

Operands: 0 ≤ k ≤ 95

d ∈ [0,1]

Operation: (W) + ((FSR2) + k) → dest

Status Affected: N, OV, C, DC, Z

Encoding: 0010 01d0 kkkk kkkk

Description: The contents of W are added to the

contents of the register indicated by

FSR2, offset by the value ‘k’.

If ‘d’ is ‘0’, the result is stored in W. If ‘d’

is ‘1’, the result is stored back in

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read ‘k’ Process

Data

Write to

destination

Example: ADDWF [OFST] ,0

Before Instruction

W = 17h

OFST = 2Ch

FSR2 = 0A00h

Contents

of 0A2Ch = 20h

After Instruction

W = 37h

Contents

of 0A2Ch = 20h

BSF Bit Set Indexed

(Indexed Literal Offset mode)

Syntax: BSF [k], b

Operands: 0 ≤ f ≤ 95

0 ≤ b ≤ 7

Operation: 1 → ((FSR2) + k)

Status Affected: None

Encoding: 1000 bbb0 kkkk kkkk

Description: Bit ‘b’ of the register indicated by FSR2,

offset by the value ‘k’, is set.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Process

Data

Write to

destination

Example: BSF [FLAG_OFST], 7

Before Instruction

FLAG_OFST = 0Ah

FSR2 = 0A00h

Contents

of 0A0Ah = 55h

After Instruction

Contents

of 0A0Ah = D5h

SETF Set Indexed

(Indexed Literal Offset mode)

Syntax: SETF [k]

Operands: 0 ≤ k ≤ 95

Operation: FFh → ((FSR2) + k)

Status Affected: None

Encoding: 0110 1000 kkkk kkkk

Description: The contents of the register indicated by

FSR2, offset by ‘k’, are set to FFh.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read ‘k’ Process

Data

Write

Example: SETF [OFST]

Before Instruction

OFST = 2Ch

FSR2 = 0A00h

Contents

of 0A2Ch = 00h

After Instruction

Contents

of 0A2Ch = FFh

PIC18F2X1X/4X1X

23.2.5 SPECIAL CONSIDERATIONS WITH

MICROCHIP MPLAB® IDE TOOLS

The latest versions of Microchip’s software tools have

been designed to fully support the extended instruction

set of the PIC18F2X1X/4X1X family of devices. This

includes the MPLAB C18 C compiler, MPASM

assembly language and MPLAB Integrated

Development Environment (IDE).

When selecting a target device for software

development, MPLAB IDE will automatically set default

Configuration bits for that device. The default setting for

the XINST Configuration bit is ‘0’, disabling the

extended instruction set and Indexed Literal Offset

Addressing mode. For proper execution of applications

developed to take advantage of the extended

instruction set, XINST must be set during

programming.

To develop software for the extended instruction set,

the user must enable support for the instructions and

the Indexed Addressing mode in their language tool(s).

Depending on the environment being used, this may be

done in several ways:

• A menu option, or dialog box within the

environment, that allows the user to configure the

language tool and its settings for the project

• A command line option

• A directive in the source code

These options vary between different compilers,

assemblers and development environments. Users are

encouraged to review the documentation accompany-

ing their development systems for the appropriate

information.

PIC18F2X1X/4X1X

24.0 DEVELOPMENT SUPPORT

The PIC® microcontrollers are supported with a full

range of hardware and software development tools:

• Integrated Development Environment

- MPLAB® IDE Software

• Assemblers/Compilers/Linkers

- MPASMTM Assembler

- MPLAB C18 and MPLAB C30 C Compilers

-MPLINK

TM Object Linker/

MPLIBTM Object Librarian

- MPLAB ASM30 Assembler/Linker/Library

• Simulators

- MPLAB SIM Software Simulator

•Emulators

- MPLAB ICE 2000 In-Circuit Emulator

- MPLAB REAL ICE™ In-Circuit Emulator

• In-Circuit Debugger

- MPLAB ICD 2

• Device Programmers

- PICSTART® Plus Development Programmer

- MPLAB PM3 Device Programmer

- PICkit™ 2 Development Programmer

• Low-Cost Demonstration and Development

Boards and Evaluation Kits

24.1 MPLAB Integrated Development

Environment Software

The MPLAB IDE software brings an ease of software

development previously unseen in the 8/16-bit micro-

controller market. The MPLAB IDE is a Windows®

operating system-based application that contains:

• A single graphical interface to all debugging tools

- Simulator

- Programmer (sold separately)

- Emulator (sold separately)

- In-Circuit Debugger (sold separately)

• A full-featured editor with color-coded context

• A multiple project manager

• Customizable data windows with direct edit of

contents

• High-level source code debugging

• Visual device initializer for easy register

initialization

• Mouse over variable inspection

• Drag and drop variables from source to watch

windows

• Extensive on-line help

• Integration of select third party tools, such as

HI-TECH Software C Compilers and IAR

C Compilers

The MPLAB IDE allows you to:

• Edit your source files (either assembly or C)

• One touch assemble (or compile) and download

to PIC MCU emulator and simulator tools

(automatically updates all project information)

• Debug using:

- Source files (assembly or C)

- Mixed assembly and C

- Machine code

MPLAB IDE supports multiple debugging tools in a

single development paradigm, from the cost-effective

simulators, through low-cost in-circuit debuggers, to

full-featured emulators. This eliminates the learning

curve when upgrading to tools with increased flexibility

and power.

PIC18F2X1X/4X1X

24.2 MPASM Assembler

The MPASM Assembler is a full-featured, universal

macro assembler for all PIC MCUs.

The MPASM Assembler generates relocatable object

files for the MPLINK Object Linker, Intel® standard HEX

files, MAP files to detail memory usage and symbol

reference, absolute LST files that contain source lines

and generated machine code and COFF files for

debugging.

The MPASM Assembler features include:

• Integration into MPLAB IDE projects

• User-defined macros to streamline

assembly code

• Conditional assembly for multi-purpose

source files

• Directives that allow complete control over the

assembly process

24.3 MPLAB C18 and MPLAB C30

C Compilers

The MPLAB C18 and MPLAB C30 Code Development

Systems are complete ANSI C compilers for

Microchip’s PIC18 and PIC24 families of microcontrol-

lers and the dsPIC30 and dsPIC33 family of digital sig-

nal controllers. These compilers provide powerful

integration capabilities, superior code optimization and

ease of use not found with other compilers.

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

24.4 MPLINK Object Linker/

MPLIB Object Librarian

The MPLINK Object Linker combines relocatable

objects created by the MPASM Assembler and the

MPLAB C18 C Compiler. It can link relocatable objects

from precompiled libraries, using directives from a

linker script.

The MPLIB Object Librarian manages the creation and

modification of library files of precompiled code. When

a routine from a library is called from a source file, only

the modules that contain that routine will be linked in

with the application. This allows large libraries to be

used efficiently in many different applications.

The object linker/library features include:

• Efficient linking of single libraries instead of many

smaller files

• Enhanced code maintainability by grouping

related modules together

• Flexible creation of libraries with easy module

listing, replacement, deletion and extraction

24.5 MPLAB ASM30 Assembler, Linker

and Librarian

MPLAB ASM30 Assembler produces relocatable

machine code from symbolic assembly language for

dsPIC30F devices. MPLAB C30 C Compiler uses the

assembler to produce its object file. The assembler

generates relocatable object files that can then be

archived or linked with other relocatable object files and

archives to create an executable file. Notable features

of the assembler include:

• Support for the entire dsPIC30F instruction set

• Support for fixed-point and floating-point data

• Command line interface

• Rich directive set

• Flexible macro language

• MPLAB IDE compatibility

24.6 MPLAB SIM Software Simulator

The MPLAB SIM Software Simulator allows code

development in a PC-hosted environment by simulat-

ing the PIC MCUs and dsPIC® DSCs on an instruction

level. On any given instruction, the data areas can be

examined or modified and stimuli can be applied from

a comprehensive stimulus controller. Registers can be

logged to files for further run-time analysis. The trace

buffer and logic analyzer display extend the power of

the simulator to record and track program execution,

actions on I/O, most peripherals and internal registers.

The MPLAB SIM Software Simulator fully supports

symbolic debugging using the MPLAB C18 and

MPLAB C30 C Compilers, and the MPASM and

MPLAB ASM30 Assemblers. The software simulator

offers the flexibility to develop and debug code outside

of the hardware laboratory environment, making it an

excellent, economical software development tool.

PIC18F2X1X/4X1X

24.7 MPLAB ICE 2000

High-Performance

In-Circuit Emulator

The MPLAB ICE 2000 In-Circuit Emulator is intended

to provide the product development engineer with a

complete microcontroller design tool set for PIC

microcontrollers. Software control of the MPLAB ICE

2000 In-Circuit Emulator is advanced by the MPLAB

Integrated Development Environment, which allows

editing, building, downloading and source debugging

from a single environment.

The MPLAB ICE 2000 is a full-featured emulator

system with enhanced trace, trigger and data monitor-

ing features. Interchangeable processor modules allow

the system to be easily reconfigured for emulation of

different processors. The architecture of the MPLAB

ICE 2000 In-Circuit Emulator allows expansion to

support new PIC microcontrollers.

The MPLAB ICE 2000 In-Circuit Emulator system has

been designed as a real-time emulation system with

advanced features that are typically found on more

expensive development tools. The PC platform and

Microsoft® Windows® 32-bit operating system were

chosen to best make these features available in a

simple, unified application.

24.8 MPLAB REAL ICE In-Circuit

Emulator System

MPLAB REAL ICE In-Circuit Emulator System is

Microchip’s next generation high-speed emulator for

Microchip Flash DSC® and MCU devices. It debugs and

programs PIC® and dsPIC® Flash microcontrollers with

the easy-to-use, powerful graphical user interface of the

MPLAB Integrated Development Environment (IDE),

included with each kit.

The MPLAB REAL ICE probe is connected to the design

engineer’s PC using a high-speed USB 2.0 interface and

is connected to the target with either a connector

compatible with the popular MPLAB ICD 2 system

(RJ11) or with the new high speed, noise tolerant, low-

voltage differential signal (LVDS) interconnection

(CAT5).

MPLAB REAL ICE is field upgradeable through future

firmware downloads in MPLAB IDE. In upcoming

releases of MPLAB IDE, new devices will be supported,

and new features will be added, such as software break-

points and assembly code trace. MPLAB REAL ICE

offers significant advantages over competitive emulators

including low-cost, full-speed emulation, real-time

variable watches, trace analysis, complex breakpoints, a

ruggedized probe interface and long (up to three meters)

interconnection cables.

24.9 MPLAB ICD 2 In-Circuit Debugger

Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a

powerful, low-cost, run-time development tool,

connecting to the host PC via an RS-232 or high-speed

USB interface. This tool is based on the Flash PIC

MCUs and can be used to develop for these and other

PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes

the in-circuit debugging capability built into the Flash

devices. This feature, along with Microchip’s In-Circuit

Serial ProgrammingTM (ICSPTM) protocol, offers cost-

effective, in-circuit Flash debugging from the graphical

user interface of the MPLAB Integrated Development

Environment. This enables a designer to develop and

debug source code by setting breakpoints, single step-

ping and watching variables, and CPU status and

peripheral registers. Running at full speed enables

testing hardware and applications in real time. MPLAB

ICD 2 also serves as a development programmer for

selected PIC devices.

24.10 MPLAB PM3 Device Programmer

The MPLAB PM3 Device Programmer is a universal,

CE compliant device programmer with programmable

voltage verification at VDDMIN and VDDMAX for

maximum reliability. It features a large LCD display

(128 x 64) for menus and error messages and a modu-

lar, detachable socket assembly to support various

package types. The ICSP™ cable assembly is included

as a standard item. In Stand-Alone mode, the MPLAB

PM3 Device Programmer can read, verify and program

PIC devices without a PC connection. It can also set

code protection in this mode. The MPLAB PM3

connects to the host PC via an RS-232 or USB cable.

The MPLAB PM3 has high-speed communications and

optimized algorithms for quick programming of large

memory devices and incorporates an SD/MMC card for

file storage and secure data applications.

PIC18F2X1X/4X1X

24.11 PICSTART Plus Development

Programmer

The PICSTART Plus Development Programmer is an

easy-to-use, low-cost, prototype programmer. It

connects to the PC via a COM (RS-232) port. MPLAB

Integrated Development Environment software makes

using the programmer simple and efficient. The

PICSTART Plus Development Programmer supports

most PIC devices in DIP packages up to 40 pins.

Larger pin count devices, such as the PIC16C92X and

PIC17C76X, may be supported with an adapter socket.

The PICSTART Plus Development Programmer is CE

compliant.

24.12 PICkit 2 Development Programmer

The PICkit™ 2 Development Programmer is a low-cost

programmer and selected Flash device debugger with

an easy-to-use interface for programming many of

Microchip’s baseline, mid-range and PIC18F families of

Flash memory microcontrollers. The PICkit 2 Starter Kit

includes a prototyping development board, twelve

sequential lessons, software and HI-TECH’s PICC™

Lite C compiler, and is designed to help get up to speed

quickly using PIC® microcontrollers. The kit provides

everything needed to program, evaluate and develop

applications using Microchip’s powerful, mid-range

Flash memory family of microcontrollers.

24.13 Demonstration, Development and

Evaluation Boards

A wide variety of demonstration, development and

evaluation boards for various PIC MCUs and dsPIC

DSCs allows quick application development on fully func-

tional systems. Most boards include prototyping areas for

adding custom circuitry and provide application firmware

and source code for examination and modification.

The boards support a variety of features, including LEDs,

temperature sensors, switches, speakers, RS-232

interfaces, LCD displays, potentiometers and additional

EEPROM memory.

The demonstration and development boards can be

used in teaching environments, for prototyping custom

circuits and for learning about various microcontroller

applications.

In addition to the PICDEM™ and dsPICDEM™ demon-

stration/development board series of circuits, Microchip

has a line of evaluation kits and demonstration software

for analog filter design, KEELOQ® security ICs, CAN,

IrDA®, PowerSmart® battery management, SEEVAL®

evaluation system, Sigma-Delta ADC, flow rate

sensing, plus many more.

Check the Microchip web page (www.microchip.com)

and the latest

“Product Selector Guide”

(DS00148) for

the complete list of demonstration, development and

evaluation kits.

PIC18F2X1X/4X1X

25.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings(†)

Ambient temperature under bias.............................................................................................................-40°C to +125°C

Storage temperature .............................................................................................................................. -65°C to +150°C

Voltage on any pin with respect to VSS (except VDD and MCLR) ................................................... -0.3V to (VDD + 0.3V)

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V

Voltage on MCLR with respect to VSS (Note 2) ......................................................................................... 0V to +13.25V

Total power dissipation (Note 1) ...............................................................................................................................1.0W

Maximum current out of VSS pin ...........................................................................................................................300 mA

Maximum current into VDD pin ..............................................................................................................................250 mA

Input clamp current, IIK (VI < 0 or VI > VDD)...................................................................................................................... ±20 mA

Output clamp current, IOK (VO < 0 or VO > VDD).............................................................................................................. ±20 mA

Maximum output current sunk by any I/O pin..........................................................................................................25 mA

Maximum output current sourced by any I/O pin ....................................................................................................25 mA

Maximum current sunk by all ports .......................................................................................................................200 mA

Maximum current sourced by all ports ..................................................................................................................200 mA

Note 1: Power dissipation is calculated as follows:

Pdis = VDD x {IDD – ∑ IOH} + ∑ {(VDD – VOH) x IOH} + ∑(VOL x IOL)

2: Voltage spikes below VSS at the MCLR/VPP/RE3 pin, inducing currents greater than 80 mA, may cause

latch-up. Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP/

RE3 pin, rather than pulling this pin directly to VSS.

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

PIC18F2X1X/4X1X

FIGURE 25-1: PIC18F2X1X/4X1X VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

FIGURE 25-2: PIC18F2X1X/4X1X VOLTAGE-FREQUENCY GRAPH (EXTENDED)

Frequency

Voltage

6.0V

5.5V

4.5V

4.0V

2.0V

40 MHz

5.0V

3.5V

3.0V

2.5V

PIC18F2X1X/4X1X

4.2V

Frequency

Voltage

6.0V

5.5V

4.5V

4.0V

2.0V

25 MHz

5.0V

3.5V

3.0V

2.5V

PIC18F2X1X/4X1X

4.2V

PIC18F2X1X/4X1X

FIGURE 25-3: PIC18LF2X1X/4X1X VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

Frequency

Voltage

6.0V

5.5V

4.5V

4.0V

2.0V

40 MHz

5.0V

3.5V

3.0V

2.5V

PIC18LF2X1X/4X1X

FMAX = (16.36 MHz/V) (VDDAPPMIN – 2.0V) + 4 MHz

Note: VDDAPPMIN is the minimum voltage of the PIC® device in the application.

4 MHz

4.2V

PIC18F2X1X/4X1X

25.1 DC Characteristics: Supply Voltage

PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2X1X/4X1X

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

D001 VDD Supply Voltage

PIC18LF2X1X/4X1X 2.0 — 5.5 V HS, XT, RC and LP Oscillator mode

PIC18F2X1X/4X1X 4.2 —5.5 V

D002 VDR RAM Data Retention

Voltage(1)

1.5 — — V

D003 VPOR VDD Start Voltage

to ensure internal

Power-on Reset signal

— — 0.7 V See section on Power-on Reset for details

D004 SVDD VDD Rise Rate

to ensure internal

Power-on Reset signal

0.05 — — V/ms See section on Power-on Reset for details

VBOR Brown-out Reset Voltage

D005 PIC18LF2X1X/4X1X

BORV1:BORV0 = 11 NA 2.05 2.16 V

BORV1:BORV0 = 10 2.65 2.79 2.93 V

D005 All devices

BORV1:BORV0 = 01 4.11 4.33 4.55 V

BORV1:BORV0 = 00 4.36 4.59 4.82 V

Legend: Shading of rows is to assist in readability of the table.

Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data.

PIC18F2X1X/4X1X

25.2 DC Characteristics: Power-Down and Supply Current

PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2X1X/4X1X

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

ParamNo. Device Typ Max Units Conditions

Power-down Current (IPD)(1)

PIC18LF2X1X/4X1X 0.1 950 nA -40°C VDD = 2.0V,

(Sleep mode)

0.1 1.0 μA +25°C

0.2 5 μA +85°C

PIC18LF2X1X/4X1X 0.1 1.4 μA-40°C VDD = 3.0V,

(Sleep mode)

0.1 2 μA +25°C

0.3 8 μA +85°C

All devices 0.1 1.9 μA-40°C

VDD = 5.0V,

(Sleep mode)

0.1 2.0 μA +25°C

0.4 15 μA +85°C

Extended devices only 10 120 μA +125°C

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured

with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that

add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin

loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: Low-power Timer1 oscillator selected.

5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less

than the sum of both specifications.

PIC18F2X1X/4X1X

Supply Current (IDD)(2,3)

PIC18LF2X1X/4X1X 15 31.5 μA-40°C

VDD = 2.0V

FOSC = 31 kHz

(RC_RUN mode,

INTRC source)

15 30 μA+25°C

15 28.5 μA+85°C

PIC18LF2X1X/4X1X 40 63 μA-40°C

VDD = 3.0V35 60 μA+25°C

30 57 μA+85°C

All devices 105 168 μA-40°C

VDD = 5.0V

90 160 μA+25°C

80 152 μA+85°C

Extended devices only 80 250 μA +125°C

PIC18LF2X1X/4X1X 0.32 1 mA -40°C

VDD = 2.0V

FOSC = 1 MHz

(RC_RUN mode,

INTOSC source)

0.33 1 mA +25°C

0.33 1 mA +85°C

PIC18LF2X1X/4X1X 0.6 1.3 mA -40°C

VDD = 3.0V0.55 1.2 mA +25°C

0.6 1.1 mA +85°C

All devices 1.1 2.3 mA -40°C

VDD = 5.0V

1.1 2.2 mA +25°C

1.0 2.1 mA +85°C

Extended devices only 1 3.3 mA +125°C

25.2 DC Characteristics: Power-Down and Supply Current

PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial) (Continued)

PIC18LF2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2X1X/4X1X

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

ParamNo. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured

with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that

add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin

loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: Low-power Timer1 oscillator selected.

5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less

than the sum of both specifications.

PIC18F2X1X/4X1X

Supply Current (IDD)(2,3)

PIC18LF2X1X/4X1X 0.8 2.1 μA-40°C

VDD = 2.0V

FOSC = 4 MHz

(RC_RUN mode,

INTOSC source)

0.8 2.0 μA+25°C

0.8 1.9 μA+85°C

PIC18LF2X1X/4X1X 1.3 3.0 mA -40°C

VDD = 3.0V1.3 3.0 mA +25°C

1.3 3.0 mA +85°C

All devices 2.5 5.3 mA -40°C

VDD = 5.0V

2.5 5.0 mA +25°C

2.5 4.8 mA +85°C

Extended devices only 2.5 10 mA +125°C

PIC18LF2X1X/4X1X 2.9 8 μA-40°C

VDD = 2.0V

FOSC = 31 kHz

(RC_IDLE mode,

INTRC source)

3.1 8 μA+25°C

3.6 11 μA+85°C

PIC18LF2X1X/4X1X 4.5 11 μA-40°C

VDD = 3.0V4.8 11 μA+25°C

5.8 15 μA+85°C

All devices 9.2 16 μA-40°C

VDD = 5.0V

9.8 16 μA+25°C

11.4 36 μA+85°C

Extended devices only 21 180 μA +125°C

25.2 DC Characteristics: Power-Down and Supply Current

PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial) (Continued)

PIC18LF2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2X1X/4X1X

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

ParamNo. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured

with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that

add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin

loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: Low-power Timer1 oscillator selected.

5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less

than the sum of both specifications.

PIC18F2X1X/4X1X

Supply Current (IDD)(2,3)

PIC18LF2X1X/4X1X 165 350 μA-40°C

VDD = 2.0V

FOSC = 1 MHz

(RC_IDLE mode,

INTOSC source)

175 350 μA+25°C

190 350 μA+85°C

PIC18LF2X1X/4X1X 250 500 μA-40°C

VDD = 3.0V270 500 μA+25°C

290 500 μA+85°C

All devices 500 1 mA -40°C

VDD = 5.0V

520 1 mA +25°C

550 1 mA +85°C

Extended devices only 0.6 2.9 mA +125°C

PIC18LF2X1X/4X1X 340 500 μA-40°C

VDD = 2.0V

FOSC = 4 MHz

(RC_IDLE mode,

INTOSC source)

350 500 μA+25°C

360 500 μA+85°C

PIC18LF2X1X/4X1X 520 900 μA-40°C

VDD = 3.0V540 900 μA+25°C

580 900 μA+85°C

All devices 1.0 1.6 mA -40°C

VDD = 5.0V

1.1 1.5 mA +25°C

1.1 1.4 mA +85°C

Extended devices only 1.1 5.0 mA +125°C

25.2 DC Characteristics: Power-Down and Supply Current

PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial) (Continued)

PIC18LF2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2X1X/4X1X

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

ParamNo. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured

with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that

add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin

loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: Low-power Timer1 oscillator selected.

5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less

than the sum of both specifications.

PIC18F2X1X/4X1X

Supply Current (IDD)(2,3)

PIC18LF2X1X/4X1X 250 500 μA-40°C

VDD = 2.0V

FOSC = 1 MHZ

(PRI_RUN,

EC oscillator)

260 500 μA+25°C

250 500 μA+85°C

PIC18LF2X1X/4X1X 550 650 μA-40°C

VDD = 3.0V480 650 μA+25°C

460 650 μA+85°C

All devices 1.2 1.6 mA -40°C

VDD = 5.0V

1.1 1.5 mA +25°C

1.0 1.4 mA +85°C

Extended devices only 1.0 3.5 mA +125°C

PIC18LF2X1X/4X1X 0.72 2.0 mA -40°C

VDD = 2.0V

FOSC = 4 MHz

(PRI_RUN,

EC oscillator)

0.74 2.0 mA +25°C

0.74 2.0 mA +85°C

PIC18LF2X1X/4X1X 1.3 3.0 mA -40°C

VDD = 3.0V1.3 3.0 mA +25°C

1.3 3.0 mA +85°C

All devices 2.7 6.0 mA -40°C

VDD = 5.0V

2.6 6.0 mA +25°C

2.5 6.0 mA +85°C

Extended devices only 2.6 7.0 mA +125°C

Extended devices only 8.4 21 mA +125°C VDD = 4.2V FOSC = 25 MHz

(PRI_RUN,

EC oscillator)

11 28 mA +125°C VDD = 5.0V

All devices 15 35 mA -40°C

VDD = 4.2V

FOSC = 40 MHZ

(PRI_RUN,

EC oscillator)

16 35 mA +25°C

16 35 mA +85°C

All devices 21 40 mA -40°C

VDD = 5.0V21 40 mA +25°C

21 40 mA +85°C

25.2 DC Characteristics: Power-Down and Supply Current

PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial) (Continued)

PIC18LF2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2X1X/4X1X

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

ParamNo. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured

with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that

add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin

loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: Low-power Timer1 oscillator selected.

5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less

than the sum of both specifications.

PIC18F2X1X/4X1X

Supply Current (IDD)(2,3)

All devices 7.5 16 mA -40°C

VDD = 4.2V FOSC = 4 MHZ

(PRI_RUN HS+PLL)

7.4 15 mA +25°C

7.3 14 mA +85°C

Extended devices only 8.0 25 mA +125°C

All devices 10 21 mA -40°C

VDD = 5.0V FOSC = 4 MHZ

(PRI_RUN HS+PLL)

10 20 mA +25°C

9.7 19 mA +85°C

Extended devices only 10 35 mA +125°C

All devices 17 35 mA -40°C

VDD = 4.2V FOSC = 10 MHZ

(PRI_RUN HS+PLL)

17 35 mA +25°C

17 35 mA +85°C

All devices 23 40 mA -40°C

VDD = 5.0V FOSC = 10 MHZ

(PRI_RUN HS+PLL)

23 40 mA +25°C

23 40 mA +85°C

25.2 DC Characteristics: Power-Down and Supply Current

PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial) (Continued)

PIC18LF2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2X1X/4X1X

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

ParamNo. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured

with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that

add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin

loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: Low-power Timer1 oscillator selected.

5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less

than the sum of both specifications.

PIC18F2X1X/4X1X

Supply Current (IDD)(2,3)

PIC18LF2X1X/4X1X 65 130 μA-40°C

VDD = 2.0V

FOSC = 1 MHz

(PRI_IDLE mode,

EC oscillator)

65 120 μA+25°C

70 115 μA+85°C

PIC18LF2X1X/4X1X 120 270 μA-40°C

VDD = 3.0V120 250 μA+25°C

130 240 μA+85°C

All devices 300 480 μA-40°C

VDD = 5.0V

240 450 μA+25°C

300 430 μA+85°C

Extended devices only 320 900 μA +125°C

PIC18LF2X1X/4X1X 260 475 μA-40°C

VDD = 2.0V

FOSC = 4 MHz

(PRI_IDLE mode,

EC oscillator)

255 450 μA+25°C

270 430 μA+85°C

PIC18LF2X1X/4X1X 420 900 μA-40°C

VDD = 3.0V430 850 μA+25°C

450 810 μA+85°C

All devices 0.9 1.5 mA -40°C

VDD = 5.0V

0.9 1.4 mA +25°C

0.9 1.3 mA +85°C

Extended devices only 1 1.2 mA +125°C

Extended devices only 2.8 7.0 mA +125°C VDD = 4.2V FOSC = 25 MHz

(PRI_IDLE mode,

EC oscillator)

4.3 11 mA +125°C VDD = 5.0V

All devices 6.0 16 mA -40°C

VDD = 4.2V

FOSC = 40 MHz

(PRI_IDLE mode,

EC oscillator)

6.2 16 mA +25°C

6.6 16 mA +85°C

All devices 8.1 18 mA -40°C

VDD = 5.0V9.1 18 mA +25°C

8.3 18 mA +85°C

25.2 DC Characteristics: Power-Down and Supply Current

PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial) (Continued)

PIC18LF2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2X1X/4X1X

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

ParamNo. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured

with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that

add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin

loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: Low-power Timer1 oscillator selected.

5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less

than the sum of both specifications.

PIC18F2X1X/4X1X

Supply Current (IDD)(2,3)

PIC18LF2X1X/4X1X 14 40 μA-40°C

VDD = 2.0V

FOSC = 32 kHz(4)

(SEC_RUN mode,

Timer1 as clock)

15 40 μA+25°C

16 40 μA+85°C

PIC18LF2X1X/4X1X 40 74 μA-40°C

VDD = 3.0V35 70 μA+25°C

31 67 μA+85°C

All devices 99 150 μA-40°C

VDD = 5.0V81 150 μA+25°C

75 150 μA+85°C

PIC18LF2X1X/4X1X 2.5 12 μA-40°C

VDD = 2.0V

FOSC = 32 kHz(4)

(SEC_IDLE mode,

Timer1 as clock)

3.7 12 μA+25°C

4.5 12 μA+85°C

PIC18LF2X1X/4X1X 5.0 15 μA-40°C

VDD = 3.0V5.4 15 μA+25°C

6.3 15 μA+85°C

All devices 8.5 25 μA-40°C

VDD = 5.0V9.0 25 μA+25°C

10.5 36 μA+85°C

25.2 DC Characteristics: Power-Down and Supply Current

PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial) (Continued)

PIC18LF2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2X1X/4X1X

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

ParamNo. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured

with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that

add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin

loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: Low-power Timer1 oscillator selected.

5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less

than the sum of both specifications.

PIC18F2X1X/4X1X

Module Differential Currents (ΔIWDT, ΔIBOR, ΔILVD, ΔIOSCB, ΔIAD)

D022

(ΔIWDT)

Watchdog Timer 1.3 3.8 μA-40°C

VDD = 2.0V1.4 3.8 μA+25°C

2.0 3.8 μA+85°C

1.9 4.6 μA-40°C

VDD = 3.0V2.0 4.6 μA+25°C

2.8 4.6 μA+85°C

4.0 10 μA-40°C

VDD = 5.0V

5.5 10 μA+25°C

5.6 10 μA+85°C

13 13 μA +125°C

D022A

(ΔIBOR)

Brown-out Reset(5) 35 40 μA -40°C to +85°C VDD = 3.0V

40 45 μA -40°C to +85°C

VDD = 5.0V

55 45 μA -40°C to +125°C

05μA -40°C to +125°C Sleep mode,

BOREN1:BOREN0 = 10

D022B

(ΔILVD)

High/Low-Voltage

Detect(5) 22 38 μA -40°C to +85°C VDD = 2.0V

25 40 μA-40°C to +85°C V

DD = 3.0V

29 45 μA -40°C to +85°C VDD = 5.0V

30 45 μA -40°C to +125°C

D025

(ΔIOSCB)

Timer1 Oscillator 2.1 4.5 μA-40°C

VDD = 2.0V 32 kHz on Timer1(4)

1.8 4.5 μA+25°C

2.1 4.5 μA+85°C

2.2 6.0 μA-40°C

VDD = 3.0V 32 kHz on Timer1(4)

2.6 6.0 μA+25°C

2.9 6.0 μA+85°C

3.0 8.0 μA-40°C

VDD = 5.0V 32 kHz on Timer1(4)

3.2 8.0 μA+25°C

3.4 8.0 μA+85°C

D026

(ΔIAD)

A/D Converter 1.0 2.0 μA -40°C to +85°C VDD = 2.0V

A/D on, not converting

1.0 2.0 μA -40°C to +85°C VDD = 3.0V

1.0 2.0 μA -40°C to +85°C VDD = 5.0V

2.0 8.0 μA -40°C to +125°C

25.2 DC Characteristics: Power-Down and Supply Current

PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial) (Continued)

PIC18LF2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2X1X/4X1X

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

ParamNo. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured

with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that

add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin

loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have

an impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: Low-power Timer1 oscillator selected.

5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less

than the sum of both specifications.

PIC18F2X1X/4X1X

25.3 DC Characteristics: PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial)

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Param

No. Symbol Characteristic Min Max Units Conditions

VIL Input Low Voltage

I/O ports:

D030 with TTL buffer VSS 0.15 VDD VVDD < 4.5V

D030A — 0.8 V 4.5V ≤ VDD ≤ 5.5V

D031 with Schmitt Trigger buffer

RC3 and RC4

VSS

0.2 VDD

0.3 VDD

D032 MCLR VSS 0.2 VDD V

D033 OSC1 VSS 0.3 VDD V HS, HSPLL modes

D033A

D033B

D034

OSC1

T13CKI

VSS

0.2 VDD

0.3 VDD

RC, EC modes(1)

XT, LP modes

VIH Input High Voltage

I/O ports:

D040 with TTL buffer 0.25 VDD + 0.8V VDD VVDD < 4.5V

D040A 2.0 VDD V4.5V ≤ VDD ≤ 5.5V

D041 with Schmitt Trigger buffer

RC3 and RC4

0.8 VDD

0.7 VDD

VDD

D042 MCLR 0.8 VDD VDD V

D043 OSC1 0.7 VDD VDD V HS, HSPLL modes

D043A

D043B

D043C

D044

OSC1

T13CKI

0.8 VDD

0.9 VDD

1.6

VDD

EC mode

RC mode(1)

XT, LP modes

IIL Input Leakage Current(2,3)

D060 I/O ports — ±1μAVSS ≤ VPIN ≤ VDD,

Pin at high-impedance

D061 MCLR —±5μAVss ≤ VPIN ≤ VDD

D063 OSC1 — ±5μAVss ≤ VPIN ≤ VDD

IPU Weak Pull-up Current

D070 IPURB PORTB weak pull-up current 50 400 μAVDD = 5V, VPIN = VSS

Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the

PIC® device be driven with an external clock while in RC mode.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Negative current is defined as current sourced by the pin.

4: Parameter is characterized but not tested.

PIC18F2X1X/4X1X

VOL Output Low Voltage

D080 I/O ports — 0.6 V IOL = 8.5 mA, VDD = 4.5V,

-40°C to +85°C

D083 OSC2/CLKO

(RC, RCIO, EC, ECIO modes)

—0.6VI

OL = 1.6 mA, VDD = 4.5V,

-40°C to +85°C

VOH Output High Voltage(3)

D090 I/O ports VDD – 0.7 — V IOH = -3.0 mA, VDD = 4.5V,

-40°C to +85°C

D092 OSC2/CLKO

(RC, RCIO, EC, ECIO modes)

VDD – 0.7 — V IOH = -1.3 mA, VDD = 4.5V,

-40°C to +85°C

Capacitive Loading Specs

on Output Pins

D100(4) COSC2 OSC2 pin —15 pF In XT, HS and LP modes

when external clock is

used to drive OSC1

D101 CIO All I/O pins and OSC2

(in RC mode)

— 50 pF To meet the AC Timing

Specifications

D102 CBSCL, SDA — 400 pF I2C™ Specification

25.3 DC Characteristics: PIC18F2X1X/4X1X (Industrial)

PIC18LF2X1X/4X1X (Industrial) (Continued)

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Param

No. Symbol Characteristic Min Max Units Conditions

Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the

PIC® device be driven with an external clock while in RC mode.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Negative current is defined as current sourced by the pin.

4: Parameter is characterized but not tested.

PIC18F2X1X/4X1X

TABLE 25-1: MEMORY PROGRAMMING REQUIREMENTS

DC Characteristics Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ T

A ≤ +85°C for industrial

Param

No. Sym Characteristic Min Typ† Max Units Conditions

Internal Program Memory

Programming Specifications(1)

D110 VPP Voltage on MCLR/VPP/RE3 pin VDD + 4 — 12.5 V (Note 2)

D113 IDDP Supply Current during

Programming

—10—mA

Program Flash Memory

D130 EPCell Endurance 10K 100K —E/W -40°C to +85°C

D131 VPR VDD for Read VMIN —5.5 V VMIN = Minimum operating

voltage

D132 VIE VDD for Block Erase 4.5 —5.5 V Using ICSP™ port

D132A VIW VDD for Externally Timed Erase

or Write

4.5 —5.5 V Using ICSP port

D133 TIE ICSP Block Erase Cycle Time — 4 — ms VDD > 4.5V

D133A TIW ICSP Erase or Write Cycle Time

(externally timed)

1——msVDD > 4.5V

D134 TRETD Characteristic Retention 40 100 — Year Provided no other

specifications are violated

† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

Note 1: These specifications are for programming the on-chip program memory through the use of table write

instructions.

2: Required only if Single-Supply programming is disabled.

PIC18F2X1X/4X1X

TABLE 25-2: COMPARATOR SPECIFICATIONS

TABLE 25-3: VOLTAGE REFERENCE SPECIFICATIONS

Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C (unless otherwise stated).

Param

No. Sym Characteristics Min Typ Max Units Comments

D300 VIOFF Input Offset Voltage — ± 5.0 ± 10 mV

D301 VICM Input Common Mode Voltage* 0 — VDD – 1.5 V

D302 CMRR Common Mode Rejection Ratio* 55 — — dB

300 TRESP Response Time(1)* — 150 400 ns PIC18FXXXX

300A — 150 600 ns PIC18LFXXXX,

VDD = 2.0V

301 TMC2OV Comparator Mode Change to

Output Valid*

—— 10μs

* These parameters are characterized but not tested.

Note 1: Response time measured with one comparator input at (VDD – 1.5)/2, while the other input transitions

from VSS to VDD.

Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C (unless otherwise stated).

Param

No. Sym Characteristics Min Typ Max Units Comments

D310 VRES Resolution VDD/24 — VDD/32 LSb

D311 VRAA Absolute Accuracy — — 1/2 LSb

D312 VRUR Unit Resistor Value (R)* — 2k — Ω

310 TSET Settling Time(1)*— — 10 μs

* These parameters are characterized but not tested.

Note 1: Settling time measured while CVRR = 1 and CVR3:CVR0 transitions from ‘0000’ to ‘1111’.

PIC18F2X1X/4X1X

FIGURE 25-4: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS

TABLE 25-4: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS

VLVD

HLVDIF(1)

VDD

(HLVDIF set by hardware)

(HLVDIF can be

cleared in software)

Note 1: VDIRMAG = 0.

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Param

No. Symbol Characteristic Min Typ† Max Units Conditions

D420 HLVD Voltage on VDD

Transition High to Low

LVV = 0000 2.06 2.17 2.28 V

LVV = 0001 2.12 2.23 2.34 V

LVV = 0010 2.24 2.36 2.48 V

LVV = 0011 2.32 2.44 2.56 V

LVV = 0100 2.47 2.60 2.73 V

LVV = 0101 2.65 2.79 2.93 V

LVV = 0110 2.74 2.89 3.04 V

LVV = 0111 2.96 3.12 3.28 V

LVV = 1000 3.22 3.39 3.56 V

LVV = 1001 3.37 3.55 3.73 V

LVV = 1010 3.52 3.71 3.90 V

LVV = 1011 3.70 3.90 4.10 V

LVV = 1100 3.90 4.11 4.32 V

LVV = 1101 4.11 4.33 4.55 V

LVV = 1110 4.36 4.59 4.82 V

† Production tested at T

AMB = 25°C. Specifications over temperature limits ensured by characterization.

PIC18F2X1X/4X1X

25.4 AC (Timing) Characteristics

25.4.1 TIMING PARAMETER SYMBOLOGY

The timing parameter symbols have been created

using one of the following formats:

1. TppS2ppS 3. TCC:ST (I2C specifications only)

2. TppS 4. Ts (I2C specifications only)

F Frequency T Time

Lowercase letters (pp) and their meanings:

cc CCP1 osc OSC1

ck CLKO rd RD

cs CS rw RD or WR

di SDI sc SCK

do SDO ss SS

dt Data in t0 T0CKI

io I/O port t1 T13CKI

mc MCLR wr WR

Uppercase letters and their meanings:

F Fall P Period

HHigh RRise

I Invalid (High-impedance) V Valid

L Low Z High-impedance

I2C only

AA output access High High

BUF Bus free Low Low

TCC:ST (I2C specifications only)

HD Hold SU Setup

DAT DATA input hold STO Stop condition

STA Start condition

PIC18F2X1X/4X1X

25.4.2 TIMING CONDITIONS

The temperature and voltages specified in Table 25-5

apply to all timing specifications unless otherwise

noted. Figure 25-5 specifies the load conditions for the

timing specifications.

TABLE 25-5: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

FIGURE 25-5: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

Note: Because of space limitations, the generic

terms “PIC18FXXXX” and “PIC18LFXXXX”

are used throughout this section to refer to

the PIC18F2X1X/4X1X and PIC18LF2X1X/

4X1X families of devices specifically and

only those devices.

AC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Operating voltage VDD range as described in DC spec Section 25.1 and

Section 25.3.

LF parts operate for industrial temperatures only.

VDD/2

VSS

RL=464Ω

CL= 50 pF for all pins except OSC2/CLKO

and including D and E outputs as ports

Load Condition 1 Load Condition 2

PIC18F2X1X/4X1X

25.4.3 TIMING DIAGRAMS AND SPECIFICATIONS

FIGURE 25-6: EXTERNAL CLOCK TIMING (ALL MODES EXCEPT PLL)

TABLE 25-6: EXTERNAL CLOCK TIMING REQUIREMENTS

OSC1

CLKO

Q4 Q1 Q2 Q3 Q4 Q1

3344

Param.

No. Symbol Characteristic Min Max Units Conditions

1A FOSC External CLKI Frequency(1) DC 1 MHz XT, RC Oscillator mode

DC 20 MHz HS Oscillator mode

DC 31.25 kHz LP Oscillator mode

Oscillator Frequency(1) DC 4 MHz RC Oscillator mode

0.1 4 MHz XT Oscillator mode

4 20 MHz HS Oscillator mode

5 200 kHz LP Oscillator mode

OSC External CLKI Period(1) 1000 — ns XT, RC Oscillator mode

50 — ns HS Oscillator mode

32 — μs LP Oscillator mode

Oscillator Period(1) 250 — ns RC Oscillator mode

250 1 μs XT Oscillator mode

100 250 ns HS Oscillator mode

50 250 ns HS Oscillator mode

5—μs LP Oscillator mode

CY Instruction Cycle Time(1) 100 — ns TCY = 4/FOSC, Industrial

160 — ns T

CY = 4/FOSC, Extended

OSL,

TOSH

External Clock in (OSC1)

High or Low Time

30 — ns XT Oscillator mode

2.5 — μs LP Oscillator mode

10 — ns HS Oscillator mode

OSR,

TOSF

External Clock in (OSC1)

Rise or Fall Time

— 20 ns XT Oscillator mode

— 50 ns LP Oscillator mode

— 7.5 ns HS Oscillator mode

Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations

except PLL. All specified values are based on characterization data for that particular oscillator type under

standard operating conditions with the device executing code. Exceeding these specified limits may result

in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested

to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock

input is used, the “max.” cycle time limit is “DC” (no clock) for all devices.

PIC18F2X1X/4X1X

TABLE 25-7: PLL CLOCK TIMING SPECIFICATIONS (VDD = 4.2V TO 5.5V)

TABLE 25-8: AC CHARACTERISTICS: INTERNAL RC ACCURACY

PIC18F2X1X/4X1X (INDUSTRIAL)

PIC18LF2X1X/4X1X (INDUSTRIAL)

Param

No. Sym Characteristic Min Typ† Max Units Conditions

F10 FOSC Oscillator Frequency Range 4 — 10 MHz HS mode only

F11 FSYS On-Chip VCO System Frequency 16 — 40 MHz HS mode only

F12 trc PLL Start-up Time (Lock Time) — — 2 ms

F13 ΔCLK CLKO Stability (Jitter) -2 — +2 %

† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

PIC18LF2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2X1X/4X1X

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

Param

No. Device Min Typ Max Units Conditions

INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz, 31 kHz(1)

PIC18LF2X1X/4X1X -2 +/-1 2 % +25°C VDD = 2.7-3.3V

-5 — 5 % -10°C to +85°C VDD = 2.7-3.3V

-10 +/-1 10 % -40°C to +85°C VDD = 2.7-3.3V

PIC18F2X1X/4X1X -2 +/-1 2 % +25°C VDD = 4.5-5.5V

-5 — 5 % -10°C to +85°C VDD = 4.5-5.5V

-10 +/-1 10 %-40°C to +85°C VDD = 4.5-5.5V

INTRC Accuracy @ Freq = 31 kHz(2)

PIC18LF2X1X/4X1X 26.562 — 35.938 kHz -40°C to +85°C VDD = 2.7-3.3V

PIC18F2X1X/4X1X 26.562 —35.938 kHz -40°C to +85°C VDD = 4.5-5.5V

Legend: Shading of rows is to assist in readability of the table.

Note 1: Frequency calibrated at 25°C. OSCTUNE register can be used to compensate for temperature drift.

2: INTRC frequency after calibration.

3: Change of INTRC frequency as VDD changes.

PIC18F2X1X/4X1X

FIGURE 25-7: CLKO AND I/O TIMING

TABLE 25-9: CLKO AND I/O TIMING REQUIREMENTS

Note: Refer to Figure 25-5 for load conditions.

OSC1

CLKO

I/O pin

(Input)

I/O pin

(Output)

Q4 Q1 Q2 Q3

20, 21

19 18

Old Value New Value

Param

No. Symbol Characteristic Min Typ Max Units Conditions

10 TosH2ckL OSC1 ↑ to CLKO ↓ — 75 200 ns (Note 1)

11 TosH2ckH OSC1 ↑ to CLKO ↑ — 75 200 ns (Note 1)

12 TckR CLKO Rise Time — 35 100 ns (Note 1)

13 TckF CLKO Fall Time — 35 100 ns (Note 1)

14 TckL2ioV CLKO ↓ to Port Out Valid — — 0.5 T

CY + 20 ns (Note 1)

15 TioV2ckH Port In Valid before CLKO ↑ 0.25 T

CY + 25 — — ns (Note 1)

16 TckH2ioI Port In Hold after CLKO ↑ 0——ns(Note 1)

17 TosH2ioV OSC1 ↑ (Q1 cycle) to Port Out Valid — 50 150 ns

18 TosH2ioI OSC1 ↑ (Q2 cycle) to

Port Input Invalid

(I/O in hold time)

PIC18FXXXX 100 — — ns

18A PIC18LFXXXX 200 — — ns VDD = 2.0V

19 TioV2osH Port Input Valid to OSC1 ↑ (I/O in setup time) 0 — — ns

20 TioR Port Output Rise Time PIC18FXXXX — 10 25 ns

20A PIC18LFXXXX — — 60 ns VDD = 2.0V

21 TioF Port Output Fall Time PIC18FXXXX — 10 25 ns

21A PIC18LFXXXX — — 60 ns VDD = 2.0V

22† TINP INTx pin High or Low Time TCY ——ns

23† TRBP RB7:RB4 Change INTx High or Low Time TCY ——ns

† These parameters are asynchronous events not related to any internal clock edges.

Note 1: Measurements are taken in RC mode, where CLKO output is 4 x TOSC.

PIC18F2X1X/4X1X

FIGURE 25-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND

POWER-UP TIMER TIMING

FIGURE 25-9: BROWN-OUT RESET TIMING

TABLE 25-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER

AND BROWN-OUT RESET REQUIREMENTS

Param.

No. Symbol Characteristic Min Typ Max Units Conditions

30 TmcL MCLR Pulse Width (low) 2 — — μs

31 TWDT Watchdog Timer Time-out Period

(no postscaler)

3.4 4.0 4.6 ms

32 TOST Oscillation Start-up Timer Period 1024 TOSC — 1024 TOSC —TOSC = OSC1 period

33 TPWRT Power-up Timer Period 55.6 65.5 75 ms

34 TIOZ I/O High-Impedance from MCLR

Low or Watchdog Timer Reset

—2—μs

35 TBOR Brown-out Reset Pulse Width 200 — — μsVDD ≤ BVDD (see D005)

36 TIVRST Time for Internal Reference

Voltage to become Stable

—2050 μs

37 TLVD High/Low-Voltage Detect Pulse Width 200 — — μsVDD ≤ VLVD

38 TCSD CPU Start-up Time — 10 — μs

39 TIOBST Time for INTOSC to Stabilize — 1 — μs

VDD

MCLR

Internal

POR

PWRT

Time-out

OSC

Time-out

Internal

Reset

Watchdog

Timer

Reset

I/O pins

Note: Refer to Figure 25-5 for load conditions.

VDD BVDD

VIRVST

Enable Internal

Internal Reference 36

Reference Voltage

Voltage Stable

PIC18F2X1X/4X1X

FIGURE 25-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS

TABLE 25-11: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS

Note: Refer to Figure 25-5 for load conditions.

T0CKI

T1OSO/T13CKI

TMR0 or

TMR1

Param

No. Symbol Characteristic Min Max Units Conditions

40 Tt0H T0CKI High Pulse Width No prescaler 0.5 T

CY + 20 — ns

With prescaler 10 — ns

41 Tt0L T0CKI Low Pulse Width No prescaler 0.5 TCY + 20 — ns

With prescaler 10 — ns

42 Tt0P T0CKI Period No prescaler TCY + 10 — ns

With prescaler Greater of:

20 ns or

(TCY + 40)/N

— ns N = prescale

value

(1, 2, 4,..., 256)

45 Tt1H T13CKI

High Time

Synchronous, no prescaler 0.5 TCY + 20 — ns

Synchronous,

with prescaler

PIC18FXXXX 10 — ns

PIC18LFXXXX 25 — ns VDD = 2.0V

Asynchronous PIC18FXXXX 30 — ns

PIC18LFXXXX 50 — ns VDD = 2.0V

46 Tt1L T13CKI

Low Time

Synchronous, no prescaler 0.5 TCY + 5 — ns

Synchronous,

with prescaler

PIC18FXXXX 10 — ns

PIC18LFXXXX 25 — ns VDD = 2.0V

Asynchronous PIC18FXXXX 30 — ns

PIC18LFXXXX 50 — ns VDD = 2.0V

47 Tt1P T13CKI

Input

Period

Synchronous Greater of:

20 ns or

(TCY + 40)/N

— ns N = prescale

value (1, 2, 4, 8)

Asynchronous 60 — ns

Ft1 T13CKI Oscillator Input Frequency Range DC 50 kHz

48 Tcke2tmrI Delay from External T13CKI Clock Edge to

Timer Increment

2 T

OSC 7 TOSC —

PIC18F2X1X/4X1X

FIGURE 25-11: CAPTURE/COMPARE/PWM TIMINGS (ALL CCP MODULES)

TABLE 25-12: CAPTURE/COMPARE/PWM REQUIREMENTS (ALL CCP MODULES)

Note: Refer to Figure 25-5 for load conditions.

CCPx

(Capture Mode)

50 51

CCPx

53 54

(Compare or PWM Mode)

Param

No. Symbol Characteristic Min Max Units Conditions

50 TccL CCPx Input Low

Time

No prescaler 0.5 TCY + 20 — ns

With

prescaler

PIC18FXXXX 10 — ns

PIC18LFXXXX 20 — ns VDD = 2.0V

51 TccH CCPx Input

High Time

No prescaler 0.5 TCY + 20 — ns

With

prescaler

PIC18FXXXX 10 — ns

PIC18LFXXXX 20 — ns VDD = 2.0V

52 TccP CCPx Input Period 3 TCY + 40

—nsN = prescale

value (1, 4 or 16)

53 TccR CCPx Output Fall Time PIC18FXXXX — 25 ns

PIC18LFXXXX — 45 ns VDD = 2.0V

54 TccF CCPx Output Fall Time PIC18FXXXX — 25 ns

PIC18LFXXXX — 45 ns VDD = 2.0V

PIC18F2X1X/4X1X

FIGURE 25-12: PARALLEL SLAVE PORT TIMING (PIC18F4410/4415/4510/4515/4610)

TABLE 25-13: PARALLEL SLAVE PORT REQUIREMENTS (PIC18F4410/4415/4510/4515/4610)

Note: Refer to Figure 25-5 for load conditions.

RE2/CS

RE0/RD

RE1/WR

RD7:RD0

Param.

No. Symbol Characteristic Min Max Units Conditions

62 TdtV2wrH Data In Valid before WR ↑ or CS ↑ (setup time) 20 — ns

63 TwrH2dtI WR ↑ or CS ↑ to Data–In

Invalid (hold time)

PIC18FXXXX 20 — ns

PIC18LFXXXX 35 — ns VDD = 2.0V

64 TrdL2dtV RD ↓ and CS ↓ to Data–Out Valid — 80 ns

65 TrdH2dtI RD ↑ or CS ↓ to Data–Out Invalid 10 30 ns

66 TibfINH Inhibit of the IBF Flag bit being Cleared from

WR ↑ or CS ↑

—3 T

PIC18F2X1X/4X1X

FIGURE 25-13: EXAMPLE SPI MASTER MODE TIMING (CKE = 0)

TABLE 25-14: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0)

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

71 72

75, 76

MSb LSb

bit 6 - - - - - -1

MSb In LSb In

bit 6 - - - -1

Note: Refer to Figure 25-5 for load conditions.

Param

No. Symbol Characteristic Min Max Units Conditions

70 TssL2scH,

TssL2 s cL

SS ↓ to SCK ↓ or SCK ↑ Input TCY —ns

71 TscH SCK Input High Time

(Slave mode)

Continuous 1.25 TCY + 30 — ns

71A Single Byte 40 — ns (Note 1)

72 TscL SCK Input Low Time

(Slave mode)

Continuous 1.25 TCY + 30 — ns

72A Single Byte 40 — ns (Note 1)

73 TdiV2scH,

TdiV2scL

Setup Time of SDI Data Input to SCK Edge 100 — ns

73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge

of Byte 2

1.5 TCY + 40 — ns (Note 2)

74 TscH2diL,

TscL2diL

Hold Time of SDI Data Input to SCK Edge 100 — ns

75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns

PIC18LFXXXX — 45 ns VDD = 2.0V

76 TdoF SDO Data Output Fall Time — 25 ns

78 TscR SCK Output Rise Time

(Master mode)

PIC18FXXXX — 25 ns

PIC18LFXXXX — 45 ns VDD = 2.0V

79 TscF SCK Output Fall Time (Master mode) — 25 ns

80 TscH2doV,

TscL2doV

SDO Data Output Valid after

SCK Edge

PIC18FXXXX — 50 ns

PIC18LFXXXX — 100 ns VDD = 2.0V

Note 1: Requires the use of Parameter #73A.

2: Only if Parameter #71A and #72A are used.

PIC18F2X1X/4X1X

FIGURE 25-14: EXAMPLE SPI MASTER MODE TIMING (CKE = 1)

TABLE 25-15: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1)

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

71 72

75, 76

MSb

MSb In

bit 6 - - - - - -1

LSb In

bit 6 - - - -1

LSb

Note: Refer to Figure 25-5 for load conditions.

Param.

No. Symbol Characteristic Min Max Units Conditions

71 TscH SCK Input High Time

(Slave mode)

Continuous 1.25 T

CY + 30 — ns

71A Single Byte 40 — ns (Note 1)

72 TscL SCK Input Low Time

(Slave mode)

Continuous 1.25 T

CY + 30 — ns

72A Single Byte 40 — ns (Note 1)

73 TdiV2scH,

TdiV2scL

Setup Time of SDI Data Input to SCK Edge 100 — ns

73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge

of Byte 2

1.5 TCY + 40 — ns (Note 2)

74 TscH2diL,

Ts c L 2 d i L

Hold Time of SDI Data Input to SCK Edge 100 — ns

75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns

PIC18LFXXXX 45 ns VDD = 2.0V

76 TdoF SDO Data Output Fall Time — 25 ns

78 TscR SCK Output Rise Time

(Master mode)

PIC18FXXXX — 25 ns

PIC18LFXXXX 45 ns VDD = 2.0V

79 TscF SCK Output Fall Time (Master mode) — 25 ns

80 TscH2doV,

TscL2doV

SDO Data Output Valid after

SCK Edge

PIC18FXXXX — 50 ns

PIC18LFXXXX 100 ns VDD = 2.0V

81 TdoV2scH,

TdoV2scL

SDO Data Output Setup to SCK Edge TCY —ns

Note 1: Requires the use of Parameter #73A.

2: Only if Parameter #71A and #72A are used.

PIC18F2X1X/4X1X

FIGURE 25-15: EXAMPLE SPI SLAVE MODE TIMING (CKE = 0)

TABLE 25-16: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING, CKE = 0)

Param

No. Symbol Characteristic Min Max Units Conditions

70 TssL2scH,

Ts s L 2s cL

SS ↓ to SCK ↓ or SCK ↑ Input TCY —ns

71 TscH SCK Input High Time

(Slave mode)

Continuous 1.25 TCY + 30 — ns

71A Single Byte 40 — ns (Note 1)

72 TscL SCK Input Low Time

(Slave mode)

Continuous 1.25 TCY + 30 — ns

72A Single Byte 40 — ns (Note 1)

73 TdiV2scH,

TdiV2scL

Setup Time of SDI Data Input to SCK Edge 100 — ns

73A Tb2b Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2)

74 TscH2diL,

Ts c L 2 d iL

Hold Time of SDI Data Input to SCK Edge 100 — ns

75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns

PIC18LFXXXX 45 ns VDD = 2.0V

76 TdoF SDO Data Output Fall Time — 25 ns

77 TssH2doZ SS↑ to SDO Output High-Impedance 10 50 ns

78 TscR SCK Output Rise Time (Master mode) PIC18FXXXX — 25 ns

PIC18LFXXXX 45 ns VDD = 2.0V

79 TscF SCK Output Fall Time (Master mode) — 25 ns

80 TscH2doV,

TscL2doV

SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns

PIC18LFXXXX 100 ns VDD = 2.0V

83 TscH2ssH,

Ts c L 2s sH

SS ↑ after SCK edge 1.5 TCY + 40 — ns

Note 1: Requires the use of Parameter #73A.

2: Only if Parameter #71A and #72A are used.

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

71 72

73 74

75, 76 77

SDI

MSb LSb

bit 6 - - - - - -1

bit 6 - - - -1 LSb In

Note: Refer to Figure 25-5 for load conditions.

MSb In

PIC18F2X1X/4X1X

FIGURE 25-16: EXAMPLE SPI SLAVE MODE TIMING (CKE = 1)

TABLE 25-17: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1)

Param

No. Symbol Characteristic Min Max Units Conditions

70 TssL2scH,

TssL2scL

SS ↓ to SCK ↓ or SCK ↑ Input TCY —ns

71 TscH SCK Input High Time

(Slave mode)

Continuous 1.25 TCY + 30 — ns

71A Single Byte 40 — ns (Note 1)

72 TscL SCK Input Low Time

(Slave mode)

Continuous 1.25 TCY + 30 — ns

72A Single Byte 40 — ns (Note 1)

73A Tb2b Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2)

74 TscH2diL,

TscL2diL

Hold Time of SDI Data Input to SCK Edge 100 — ns

75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns

PIC18LFXXXX 45 ns VDD = 2.0V

76 TdoF SDO Data Output Fall Time — 25 ns

77 TssH2doZ SS↑ to SDO Output High-Impedance 10 50 ns

78 TscR SCK Output Rise Time

(Master mode)

PIC18FXXXX — 25 ns

PIC18LFXXXX — 45 ns VDD = 2.0V

79 TscF SCK Output Fall Time (Master mode) — 25 ns

80 TscH2doV,

TscL2doV

SDO Data Output Valid after SCK

Edge

PIC18FXXXX — 50 ns

PIC18LFXXXX — 100 ns VDD = 2.0V

82 TssL2doV SDO Data Output Valid after SS ↓

Edge

PIC18FXXXX — 50 ns

PIC18LFXXXX — 100 ns VDD = 2.0V

83 TscH2ssH,

TscL2ssH

SS ↑ after SCK Edge 1.5 TCY + 40 — ns

Note 1: Requires the use of Parameter #73A.

2: Only if Parameter #71A and #72A are used.

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

71 72

SDI

75, 76

MSb bit 6 - - - - - -1 LSb

MSb In bit 6 - - - -1 LSb In

Note: Refer to Figure 25-5 for load conditions.

PIC18F2X1X/4X1X

FIGURE 25-17: I2C™ BUS START/STOP BITS TIMING

TABLE 25-18: I2C™ BUS START/STOP BITS REQUIREMENTS (SLAVE MODE)

FIGURE 25-18: I2C™ BUS DATA TIMING

Note: Refer to Figure 25-5 for load conditions.

SCL

SDA

Start

Condition

Stop

Condition

Param.

No. Symbol Characteristic Min Max Units Conditions

90 TSU:STA Start Condition 100 kHz mode 4700 — ns Only relevant for Repeated

Start condition

Setup Time 400 kHz mode 600 —

91 THD:STA Start Condition 100 kHz mode 4000 — ns After this period, the first

clock pulse is generated

Hold Time 400 kHz mode 600 —

92 TSU:STO Stop Condition 100 kHz mode 4700 — ns

Setup Time 400 kHz mode 600 —

93 THD:STO Stop Condition 100 kHz mode 4000 — ns

Hold Time 400 kHz mode 600 —

Note: Refer to Figure 25-5 for load conditions.

91 92

100

101

103

106 107

109 109

110

102

SCL

SDA

Out

PIC18F2X1X/4X1X

TABLE 25-19: I2C™ BUS DATA REQUIREMENTS (SLAVE MODE)

Param.

No. Symbol Characteristic Min Max Units Conditions

100 THIGH Clock High Time 100 kHz mode 4.0 — μs

400 kHz mode 0.6 — μs

SSP module 1.5 TCY —

101 TLOW Clock Low Time 100 kHz mode 4.7 — μs

400 kHz mode 1.3 — μs

SSP module 1.5 TCY —

102 TRSDA and SCL Rise

Time

100 kHz mode — 1000 ns

400 kHz mode 20 + 0.1 CB300 ns CB is specified to be from

10 to 400 pF

103 TFSDA and SCL Fall

Time

100 kHz mode — 300 ns

400 kHz mode 20 + 0.1 CB300 ns CB is specified to be from

10 to 400 pF

90 TSU:STA Start Condition

Setup Time

100 kHz mode 4.7 — μs Only relevant for Repeated

Start condition

400 kHz mode 0.6 — μs

91 THD:STA Start Condition

Hold Time

100 kHz mode 4.0 — μs After this period, the first

clock pulse is generated

400 kHz mode 0.6 — μs

106 THD:DAT Data Input Hold

Time

100 kHz mode 0 — ns

400 kHz mode 0 0.9 μs

107 TSU:DAT Data Input Setup

Time

100 kHz mode 250 — ns (Note 2)

400 kHz mode 100 — ns

92 TSU:STO Stop Condition

Setup Time

100 kHz mode 4.7 — μs

400 kHz mode 0.6 — μs

109 TAA Output Valid from

Clock

100 kHz mode — 3500 ns (Note 1)

400 kHz mode — — ns

110 TBUF Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be free

before a new transmission

can start

400 kHz mode 1.3 — μs

D102 CBBus Capacitive Loading — 400 pF

Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region

(min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

2: A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement

TSU:DAT ≥250 ns must then be met. This will automatically be the case if the device does not stretch the

LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must

output the next data bit to the SDA line, TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the

Standard mode I2C bus specification), before the SCL line is released.

PIC18F2X1X/4X1X

FIGURE 25-19: MASTER SSP I2C™ BUS START/STOP BITS TIMING WAVEFORMS

TABLE 25-20: MASTER SSP I2C™ BUS START/STOP BITS REQUIREMENTS

FIGURE 25-20: MASTER SSP I2C™ BUS DATA TIMING

Note: Refer to Figure 25-5 for load conditions.

91 93

SCL

SDA

Start

Condition

Stop

Condition

90 92

Param.

No. Symbol Characteristic Min Max Units Conditions

90 TSU:STA Start Condition 100 kHz mode 2(TOSC)(BRG + 1) — ns Only relevant for

Repeated Start

condition

Setup Time 400 kHz mode 2(TOSC)(BRG + 1) —

1 MHz mode(1) 2(TOSC)(BRG + 1) —

91 THD:STA Start Condition 100 kHz mode 2(TOSC)(BRG + 1) — ns After this period, the

first clock pulse is

generated

Hold Time 400 kHz mode 2(TOSC)(BRG + 1) —

1 MHz mode(1) 2(TOSC)(BRG + 1) —

92 TSU:STO Stop Condition 100 kHz mode 2(TOSC)(BRG + 1) — ns

Setup Time 400 kHz mode 2(TOSC)(BRG + 1) —

1 MHz mode(1) 2(TOSC)(BRG + 1) —

93 THD:STO Stop Condition 100 kHz mode 2(TOSC)(BRG + 1) — ns

Hold Time 400 kHz mode 2(TOSC)(BRG + 1) —

1 MHz mode(1) 2(TOSC)(BRG + 1) —

Note 1: Maximum pin capacitance = 10 pF for all I2C pins.

Note: Refer to Figure 25-5 for load conditions.

90 91 92

100

101

103

106 107

109 109 110

102

SCL

SDA

Out

PIC18F2X1X/4X1X

TABLE 25-21: MASTER SSP I2C™ BUS DATA REQUIREMENTS

Param.

No. Symbol Characteristic Min Max Units Conditions

100 THIGH Clock High Time 100 kHz mode 2(TOSC)(BRG + 1) — ms

400 kHz mode 2(TOSC)(BRG + 1) — ms

1 MHz mode(1) 2(TOSC)(BRG + 1) — ms

101 TLOW Clock Low Time 100 kHz mode 2(TOSC)(BRG + 1) — ms

400 kHz mode 2(TOSC)(BRG + 1) — ms

1 MHz mode(1) 2(TOSC)(BRG + 1) — ms

102 TRSDA and SCL

Rise Time

100 kHz mode — 1000 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(1) — 300 ns

103 TFSDA and SCL

Fall Time

100 kHz mode — 300 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB 300 ns

1 MHz mode(1) — 100 ns

90 T

SU:STA Start Condition

Setup Time

100 kHz mode 2(TOSC)(BRG + 1) — ms Only relevant for

Repeated Start

condition

400 kHz mode 2(TOSC)(BRG + 1) — ms

1 MHz mode(1) 2(TOSC)(BRG + 1) — ms

91 THD:STA Start Condition

Hold Time

100 kHz mode 2(TOSC)(BRG + 1) — ms After this period, the first

clock pulse is generated

400 kHz mode 2(TOSC)(BRG + 1) — ms

1 MHz mode(1) 2(TOSC)(BRG + 1) — ms

106 THD:DAT Data Input

Hold Time

100 kHz mode 0 — ns

400 kHz mode 0 0.9 ms

107 T

SU:DAT Data Input

Setup Time

100 kHz mode 250 — ns (Note 2)

400 kHz mode 100 — ns

92 TSU:STO Stop Condition

Setup Time

100 kHz mode 2(TOSC)(BRG + 1) — ms

400 kHz mode 2(TOSC)(BRG + 1) — ms

1 MHz mode(1) 2(TOSC)(BRG + 1) — ms

109 TAA Output Valid

from Clock

100 kHz mode — 3500 ns

400 kHz mode — 1000 ns

1 MHz mode(1) ——ns

110 TBUF Bus Free Time 100 kHz mode 4.7 — ms Time the bus must be free

before a new transmission

can start

400 kHz mode 1.3 — ms

D102 CBBus Capacitive Loading — 400 pF

Note 1: Maximum pin capacitance = 10 pF for all I2C pins.

2: A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but parameter 107 ≥250 ns

must then be met. This will automatically be the case if the device does not stretch the LOW period of the

SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit

to the SDA line, parameter 102 + parameter 107 = 1000 + 250 = 1250 ns (for 100 kHz mode), before the

SCL line is released.

PIC18F2X1X/4X1X

FIGURE 25-21: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING

TABLE 25-22: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS

FIGURE 25-22: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING

TABLE 25-23: USART SYNCHRONOUS RECEIVE REQUIREMENTS

121 121

120 122

RC6/TX/CK

RC7/RX/DT

Note: Refer to Figure 25-5 for load conditions.

Param

No. Symbol Characteristic Min Max Units Conditions

120 TckH2dtV SYNC XMIT (MASTER & SLAVE)

Clock High to Data Out Valid PIC18FXXXX — 40 ns

PIC18LFXXXX — 100 ns VDD = 2.0V

121 Tckrf Clock Out Rise Time and Fall Time

(Master mode)

PIC18FXXXX — 20 ns

PIC18LFXXXX — 50 ns VDD = 2.0V

122 Tdtrf Data Out Rise Time and Fall Time PIC18FXXXX — 20 ns

PIC18LFXXXX — 50 ns VDD = 2.0V

125

126

RC6/TX/CK

RC7/RX/DT

Note: Refer to Figure 25-5 for load conditions.

Param.

No. Symbol Characteristic Min Max Units Conditions

125 TdtV2ckl SYNC RCV (MASTER & SLAVE)

Data Hold before CK ↓ (DT hold time) 10 — ns

126 TckL2dtl Data Hold after CK ↓ (DT hold time) 15 — ns

PIC18F2X1X/4X1X

TABLE 25-24: A/D CONVERTER CHARACTERISTICS: PIC18F2X1X/4X1X (INDUSTRIAL)

PIC18LF2X1X/4X1X (INDUSTRIAL)

Param

No. Symbol Characteristic Min Typ Max Units Conditions

A01 NRResolution — — 10 bit ΔVREF ≥ 3.0V

A03 EIL Integral Linearity Error — — <±1 LSb ΔVREF ≥ 3.0V

A04 EDL Differential Linearity Error — — <±1 LSb ΔVREF ≥ 3.0V

A06 EOFF Offset Error — — <±1 LSb ΔVREF ≥ 3.0V

A07 EGN Gain Error — — <±1 LSb ΔVREF ≥ 3.0V

A10 — Monotonicity Guaranteed(1) —VSS ≤ VAIN ≤ VREF

A20 ΔVREF Reference Voltage Range

(VREFH – VREFL)

1.8

—

VDD < 3.0V

VDD ≥ 3.0V

A21 VREFH Reference Voltage High VSS —VREFH V

A22 VREFL Reference Voltage Low VSS – 0.3V — VDD – 3.0V V

A25 VAIN Analog Input Voltage VREFL —VREFH V

A30 ZAIN Recommended Impedance of

Analog Voltage Source

——2.5kΩ

A50 IREF VREF Input Current(2) —

—

150

μA

During VAIN acquisition.

During A/D conversion

cycle.

Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes.

2: VREFH current is from RA3/AN3/VREF+ pin or VDD, whichever is selected as the VREFH source.

VREFL current is from RA2/AN2/VREF-/CVREF pin or VSS, whichever is selected as the VREFL source.

PIC18F2X1X/4X1X

FIGURE 25-23: A/D CONVERSION TIMING

TABLE 25-25: A/D CONVERSION REQUIREMENTS

131

130

132

BSF ADCON0, GO

A/D CLK(1)

A/D DATA

ADRES

ADIF

SAMPLE

OLD_DATA

SAMPLING STOPPED

DONE

NEW_DATA

(Note 2)

987 21 0

Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts.

This allows the SLEEP instruction to be executed.

2: This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input.

. . . . . .

TCY

Param

No. Symbol Characteristic Min Max Units Conditions

130 TAD A/D Clock Period PIC18FXXXX 0.7 25.0(1) μsTOSC based, VREF ≥ 3.0V

PIC18LFXXXX 1.4 25.0(1) μsVDD = 2.0V;

TOSC based, VREF full range

PIC18FXXXX TBD 1 μs A/D RC mode

PIC18LFXXXX TBD 3 μsV

DD = 2.0V; A/D RC mode

131 TCNV Conversion Time

(not including acquisition time) (Note 2)

11 12 TAD

132 TACQ Acquisition Time (Note 3) 1.4

TBD

—

μs

-40°C to +85°C

0°C ≤ to ≤ +85°C

135 TSWC Switching Time from Convert → Sample — (Note 4)

TBD TDIS Discharge Time 0.2 — μs

Legend: TBD = To Be Determined

Note 1: The time of the A/D clock period is dependent on the device frequency and the TAD clock divider.

2: ADRES register may be read on the following TCY cycle.

3: The time for the holding capacitor to acquire the “New” input voltage when the voltage changes full scale

after the conversion (VDD to VSS or VSS to VDD). The source impedance (

) on the input channels is 50Ω.

4: On the following cycle of the device clock.

PIC18F2X1X/4X1X

26.0 DC AND AC

CHARACTERISTICS GRAPHS

AND TABLES

Graphs and tables are not available at this time.

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

27.0 PACKAGING INFORMATION

27.1 Package Marking Information

28-Lead SPDIP

XXXXXXXXXXXXXXXXX

YYWWNNN

Example

PIC18F2610-I/SP

0710017

28-Lead SOIC

XXXXXXXXXXXXXXXXXXXX

YYWWNNN

Example

PIC18F2610-E/SO

0710017

28-Lead QFN

XXXXXXXX

YYWWNNN

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Example

18F2510

-I/ML

0710017

PIC18F2X1X/4X1X

27.1 Package Marking Information (Continued)

44-Lead TQFP

XXXXXXXXXX

YYWWNNN

Example

PIC18F4610

-I/PT

0710017

XXXXXXXXXX

44-Lead QFN

XXXXXXXXXX

YYWWNNN

PIC18F4610

Example

-I/ML

0710017

40-Lead PDIP

XXXXXXXXXXXXXXXXXX

YYWWNNN

Example

PIC18F4610-I/P

0710017

PIC18F2X1X/4X1X

27.2 Package Details

The following sections give the technical details of the packages.

28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units INCHES

Dimension Limits MIN NOM MAX

Number of Pins N 28

Pitch e .100 BSC

Top to Seating Plane A – – .200

Molded Package Thickness A2 .120 .135 .150

Base to Seating Plane A1 .015 – –

Shoulder to Shoulder Width E .290 .310 .335

Molded Package Width E1 .240 .285 .295

Overall Length D 1.345 1.365 1.400

Tip to Seating Plane L .110 .130 .150

Lead Thickness c .008 .010 .015

Upper Lead Width b1 .040 .050 .070

Lower Lead Width b .014 .018 .022

Overall Row Spacing § eB – – .430

NOTE 1

Microchip Technology Drawing C04-070B

PIC18F2X1X/4X1X

28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 28

Pitch e 1.27 BSC

Overall Height A – – 2.65

Molded Package Thickness A2 2.05 – –

Standoff § A1 0.10 – 0.30

Overall Width E 10.30 BSC

Molded Package Width E1 7.50 BSC

Overall Length D 17.90 BSC

Chamfer (optional) h 0.25 – 0.75

Foot Length L 0.40 – 1.27

Footprint L1 1.40 REF

Foot Angle Top φ0° – 8°

Lead Thickness c 0.18 – 0.33

Lead Width b 0.31 – 0.51

Mold Draft Angle Top α5° – 15°

Mold Draft Angle Bottom β5° – 15°

NOTE 1

123

Microchip Technology Drawing C04-052B

PIC18F2X1X/4X1X

28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]

with 0.55 mm Contact Length

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package is saw singulated.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 28

Pitch e 0.65 BSC

Overall Height A 0.80 0.90 1.00

Standoff A1 0.00 0.02 0.05

Contact Thickness A3 0.20 REF

Overall Width E 6.00 BSC

Exposed Pad Width E2 3.65 3.70 4.20

Overall Length D 6.00 BSC

Exposed Pad Length D2 3.65 3.70 4.20

Contact Width b 0.23 0.30 0.35

Contact Length L 0.50 0.55 0.70

Contact-to-Exposed Pad K 0.20 – –

DEXPOSED D2

NOTE 1

TOP VIEW BOTTOM VIEW

PAD

Microchip Technology Drawing C04-105B

PIC18F2X1X/4X1X

40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units INCHES

Dimension Limits MIN NOM MAX

Number of Pins N 40

Pitch e .100 BSC

Top to Seating Plane A – – .250

Molded Package Thickness A2 .125 – .195

Base to Seating Plane A1 .015 – –

Shoulder to Shoulder Width E .590 – .625

Molded Package Width E1 .485 – .580

Overall Length D 1.980 – 2.095

Tip to Seating Plane L .115 – .200

Lead Thickness c .008 – .015

Upper Lead Width b1 .030 – .070

Lower Lead Width b .014 – .023

Overall Row Spacing § eB – – .700

NOTE 1

123

A1 b1

Microchip Technology Drawing C04-016B

PIC18F2X1X/4X1X

44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package is saw singulated.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 44

Pitch e 0.65 BSC

Overall Height A 0.80 0.90 1.00

Standoff A1 0.00 0.02 0.05

Contact Thickness A3 0.20 REF

Overall Width E 8.00 BSC

Exposed Pad Width E2 6.30 6.45 6.80

Overall Length D 8.00 BSC

Exposed Pad Length D2 6.30 6.45 6.80

Contact Width b 0.25 0.30 0.38

Contact Length L 0.30 0.40 0.50

Contact-to-Exposed Pad K 0.20 – –

DEXPOSED

PAD

NOTE 1

BOTTOM VIEW

TOP VIEW

A3A1

Microchip Technology Drawing C04-103B

PIC18F2X1X/4X1X

44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Chamfers at corners are optional; size may vary.

3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Leads N 44

Lead Pitch e 0.80 BSC

Overall Height A – – 1.20

Molded Package Thickness A2 0.95 1.00 1.05

Standoff A1 0.05 – 0.15

Foot Length L 0.45 0.60 0.75

Footprint L1 1.00 REF

Foot Angle φ0° 3.5° 7°

Overall Width E 12.00 BSC

Overall Length D 12.00 BSC

Molded Package Width E1 10.00 BSC

Molded Package Length D1 10.00 BSC

Lead Thickness c 0.09 – 0.20

Lead Width b 0.30 0.37 0.45

Mold Draft Angle Top α11° 12° 13°

Mold Draft Angle Bottom β11° 12° 13°

NOTE 1 NOTE 2

123

Microchip Technology Drawing C04-076B

PIC18F2X1X/4X1X

APPENDIX A: REVISION HISTORY

Revision A (June 2004)

Original data sheet for PIC18F2X1X/4X1X devices.

Revision B (October 2006)

Changes to Register 22-13: Device ID Register 2 and

packaging diagrams updated.

Revision C (January 2007)

Packaging diagrams updated.

APPENDIX B: DEVICE

DIFFERENCES

The differences between the devices listed in this data

sheet are shown in Table B-1 and Table B-2.

TABLE B-1: DEVICE DIFFERENCES (PIC18F2410/2415/2510/2515/2610)

TABLE B-2: DEVICE DIFFERENCES (PIC18F4410/4415/4510/4515/4610)

Features PIC18F2410 PIC18F2510 PIC18F2515 PIC18F2610

Program Memory (Bytes) 16384 32768 49152 65536

Program Memory (Instructions) 8192 16384 24576 32768

Interrupt Sources 18 18 18 18

I/O Ports Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, (E)

Capture/Compare/PWM Modules 2 2 2 2

Enhanced

Capture/Compare/PWM Modules

0000

Parallel

Communications (PSP)

No No No No

10-bit Analog-to-Digital Module 10 input channels 10 input channels 10 input channels 10 input channels

Packages 28-pin SPDIP

28-pin SOIC

28-pin QFN

28-pin SPDIP

28-pin SOIC

28-pin QFN

28-pin SPDIP

28-pin SOIC

28-pin SPDIP

28-pin SOIC

Features PIC18F4410 PIC18F4510 PIC18F4515 PIC18F4610

Program Memory (Bytes) 16384 32768 49152 65536

Program Memory (Instructions) 8192 16384 24576 32768

Interrupt Sources 19 19 19 19

I/O Ports Ports A, B, C, D, E Ports A, B, C, D, E Ports A, B, C, D, E Ports A, B, C, D, E

Capture/Compare/PWM Modules 2 2 2 2

Enhanced

Capture/Compare/PWM Modules

0000

Parallel

Communications (PSP)

Yes Yes Yes Yes

10-bit Analog-to-Digital Module 13 input channels 13 input channels 13 input channels 13 input channels

Packages 40-pin PDIP

44-pin QFN

44-pin TQFP

40-pin PDIP

44-pin QFN

44-pin TQFP

40-pin PDIP

44-pin QFN

44-pin TQFP

40-pin PDIP

44-pin QFN

44-pin TQFP

PIC18F2X1X/4X1X

APPENDIX C: CONVERSION

CONSIDERATIONS

This appendix discusses the considerations for

converting from previous versions of a device to the

ones listed in this data sheet. Typically, these changes

are due to the differences in the process technology

used. An example of this type of conversion is from a

PIC16C74A to a PIC16C74B.

Not Applicable

APPENDIX D: MIGRATION FROM

BASELINE TO

ENHANCED DEVICES

This section discusses how to migrate from a Baseline

device (i.e., PIC16C5X) to an Enhanced MCU device

(i.e., PIC18FXXX).

The following are the list of modifications over the

PIC16C5X microcontroller family:

Not Currently Available

PIC18F2X1X/4X1X

APPENDIX E: MIGRATION FROM

MID-RANGE TO

ENHANCED DEVICES

A detailed discussion of the differences between the

mid-range MCU devices (i.e., PIC16CXXX) and the

enhanced devices (i.e., PIC18FXXX) is provided in

AN716, “Migrating Designs from PIC16C74A/74B to

PIC18C442

.” The changes discussed, while device

specific, are generally applicable to all mid-range to

enhanced device migrations.

This Application Note is available as Literature Number

DS00716.

APPENDIX F: MIGRATION FROM

HIGH-END TO

ENHANCED DEVICES

A detailed discussion of the migration pathway and

differences between the high-end MCU devices (i.e.,

PIC17CXXX) and the enhanced devices (i.e.,

PIC18FXXX) is provided in

AN726, “PIC17CXXX to

PIC18CXXX Migration

.” This Application Note is

available as Literature Number DS00726.

PIC18F2X1X/4X1X

NOTES:

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 363
PIC18F2X1X/4X1X
INDEX
A
A/D ................................................................................... 211
A/D Converter Interrupt, Configuring  ....................... 215
Acquisition Requirements  ........................................ 216
ADCON0 Register .................................................... 211
ADCON1 Register .................................................... 211
ADCON2 Register .................................................... 211
ADRESH Register ............................................ 211, 214
ADRESL Register  .................................................... 211
Analog Port Pins, Configuring .................................. 218
Associated Registers  ............................................... 220
Calculating the Minimum Required 
Acquisition Time  .............................................. 216
Configuring the Module ............................................ 215
Conversion Clock (TAD) ........................................... 217
Conversion Status (GO/DONE Bit)  .......................... 214
Conversions ............................................................. 219
Converter Characteristics  ........................................ 347
Operation in Power Managed Modes  ...................... 218
Selecting and Configuring Acquisition Time  ............ 217
Special Event Trigger (CCP) .................................... 220
Special Event Trigger (ECCP)  ................................. 138
Use of the CCP2 Trigger .......................................... 220
Absolute Maximum Ratings  ............................................. 311
AC (Timing) Characteristics  ............................................. 329
Load Conditions for Device 
Timing Specifications ....................................... 330
Parameter Symbology  ............................................. 329
Temperature and Voltage Specifications ................. 330
Timing Conditions  .................................................... 330
AC Characteristics
Internal RC Accuracy  ............................................... 332
Access Bank
Mapping with Indexed Literal Offset 
Addressing Mode ............................................... 73
ACKSTAT ........................................................................ 181
ACKSTAT Status Flag  ..................................................... 181
ADCON0 Register ............................................................ 211
GO/DONE Bit ........................................................... 214
ADCON1 Register ............................................................ 211
ADCON2 Register ............................................................ 211
ADDFSR .......................................................................... 300
ADDLW ............................................................................ 263
ADDULNK ........................................................................ 300
ADDWF ............................................................................ 263
ADDWFC ......................................................................... 264
ADRESH Register ............................................................ 211
ADRESL Register  .................................................... 211, 214
Analog-to-Digital Converter. 
See
 A/D.
ANDLW ............................................................................ 264
ANDWF ............................................................................ 265
Assembler
MPASM Assembler .................................................. 308
Auto-Wake-up on Sync Break Character ......................... 204
B
Bank Select Register (BSR) ............................................... 59
Baud Rate Generator ....................................................... 177
BC .................................................................................... 265
BCF .................................................................................. 266
BF .................................................................................... 181
BF Status Flag  ................................................................. 181
Block Diagrams
A/D ........................................................................... 214
Analog Input Model .................................................. 215
Baud Rate Generator  .............................................. 177
Capture Mode Operation  ......................................... 131
Comparator Analog Input Model .............................. 225
Comparator I/O Operating Modes (Diagram)  .......... 222
Comparator Output .................................................. 224
Comparator Voltage Reference ............................... 228
Comparator Voltage Reference Output 
Buffer Example ................................................ 229
Compare Mode Operation  ....................................... 132
Device Clock .............................................................. 28
Enhanced PWM ....................................................... 139
EUSART Receive .................................................... 202
EUSART Transmit  ................................................... 200
External Power-on Reset Circuit 
(Slow VDD Power-up)  ........................................ 43
Fail-Safe Clock Monitor  ........................................... 249
Generic I/O Port ......................................................... 95
High/Low-Voltage Detect with External Input  .......... 232
Interrupt Logic ............................................................ 82
MSSP (I2C Master Mode) ........................................ 175
MSSP (I2C Mode) .................................................... 160
MSSP (SPI Mode)  ................................................... 151
On-Chip Reset Circuit ................................................ 41
PIC18F2410/2510/2515/2610 ................................... 11
PIC18F4410/4510/4515/4610 ................................... 12
PLL (HS Mode) .......................................................... 25
PORTD and PORTE (Parallel Slave Port) ............... 110
PWM Operation (Simplified)  .................................... 134
Reads from Flash Program Memory  ......................... 76
Single Comparator ................................................... 223
Table Read Operation  ............................................... 75
Timer0 in 16-Bit Mode  ............................................. 114
Timer0 in 8-Bit Mode  ............................................... 114
Timer1 ..................................................................... 118
Timer1 (16-Bit Read/Write Mode) ............................ 118
Timer2 ..................................................................... 124
Timer3 ..................................................................... 126
Timer3 (16-Bit Read/Write Mode) ............................ 126
Watchdog Timer  ...................................................... 246
BN .................................................................................... 266
BNC ................................................................................. 267
BNN ................................................................................. 267
BNOV .............................................................................. 268
BNZ ................................................................................. 268
BOR. 
See
 Brown-out Reset.
BOV ................................................................................. 271
BRA ................................................................................. 269
Break Character (12-Bit) Transmit and Receive .............. 205
BRG. 
See 
Baud Rate Generator.
Brown-out Reset (BOR) ..................................................... 44
Detecting ................................................................... 44
Disabling in Sleep Mode ............................................ 44
Software Enabled  ...................................................... 44
BSF .................................................................................. 269
BTFSC ............................................................................. 270
BTFSS ............................................................................. 270
BTG ................................................................................. 271
BZ .................................................................................... 272

PIC18F2X1X/4X1X
DS39636C-page 364 Preliminary © 2007 Microchip Technology Inc.
C
C Compilers
MPLAB C18  ............................................................. 308
MPLAB C30  ............................................................. 308
CALL ................................................................................ 272
CALLW .............................................................................301
Capture (CCP Module) ..................................................... 131
Associated Registers  ...............................................133
CCP Pin Configuration ............................................. 131
CCPRxH:CCPRxL Registers  ................................... 131
Prescaler .................................................................. 131
Software Interrupt  .................................................... 131
Timer1/Timer3 Mode Selection ................................ 131
Capture (ECCP Module)  .................................................. 138
Capture/Compare/PWM (CCP) ........................................ 129
Capture Mode. 
See
 Capture.
CCP Mode and Timer Resources  ............................ 130
CCPRxH Register  .................................................... 130
CCPRxL Register ..................................................... 130
Compare Mode. 
See
 Compare.
Interaction of Two CCP Modules  ............................. 130
Module Configuration ...............................................130
Clock Sources .................................................................... 28
Selecting the 31 kHz Source ...................................... 29
Selection Using OSCCON Register ...........................29
CLRF ................................................................................ 273
CLRWDT ..........................................................................273
Code Examples
16 x 16 Signed Multiply Routine  ................................80
16 x 16 Unsigned Multiply Routine  ............................ 80
8 x 8 Signed Multiply Routine  .................................... 79
8 x 8 Unsigned Multiply Routine  ................................79
Changing Between Capture Prescalers  ................... 131
Computed GOTO Using an Offset Value ................... 56
Fast Register Stack ....................................................56
How to Clear RAM (Bank 1) Using 
Indirect Addressing  ............................................69
Implementing a Real-Time Clock Using 
a Timer1 Interrupt Service  ............................... 121
Initializing PORTA ......................................................95
Initializing PORTB ......................................................98
Initializing PORTC .................................................... 101
Initializing PORTD .................................................... 104
Initializing PORTE .................................................... 107
Loading the SSPBUF (SSPSR) Register ................. 154
Reading a Flash Program Memory Word  .................. 77
Saving Status, WREG and 
BSR Registers in RAM ....................................... 93
Code Protection  ............................................................... 237
COMF ............................................................................... 274
Comparator ...................................................................... 221
Analog Input Connection Considerations ................. 225
Associated Registers  ...............................................225
Configuration ............................................................222
Effects of a Reset .....................................................224
Interrupts ..................................................................224
Operation ................................................................. 223
Operation During Sleep  ........................................... 224
Outputs ....................................................................223
Reference ................................................................ 223
External Signal .................................................223
Internal Signal .................................................. 223
Response Time  ........................................................ 223
Comparator Specifications  ...............................................327
Comparator Voltage Reference  ....................................... 227
Accuracy and Error .................................................. 228
Associated Registers ............................................... 229
Configuring .............................................................. 227
Connection Considerations ...................................... 228
Effects of a Reset  .................................................... 228
Operation During Sleep  ........................................... 228
Compare (CCP Module)  .................................................. 132
Associated Registers ............................................... 133
CCPRx Register  ...................................................... 132
Pin Configuration  ..................................................... 132
Software Interrupt  .................................................... 132
Special Event Trigger  .............................. 127, 132, 220
Timer1/Timer3 Mode Selection ................................ 132
Compare (ECCP Module) ................................................ 138
Special Event Trigger  .............................................. 138
Computed GOTO ............................................................... 56
Configuration Bits  ............................................................ 237
Configuration Register Protection .................................... 255
Context Saving During Interrupts ....................................... 93
Conversion Considerations .............................................. 360
CPFSEQ .......................................................................... 274
CPFSGT .......................................................................... 275
CPFSLT ........................................................................... 275
Crystal Oscillator/Ceramic Resonator ................................ 23
Customer Change Notification Service  ............................ 373
Customer Notification Service  ......................................... 373
Customer Support ............................................................ 373
D
Data Addressing Modes  .................................................... 69
Comparing Addressing Modes with the 
Extended Instruction Set Enabled  ..................... 72
Direct ......................................................................... 69
Indexed Literal Offset  ................................................ 71
Indirect ....................................................................... 69
Inherent and Literal .................................................... 69
Data Memory  ..................................................................... 59
Access Bank .............................................................. 63
and the Extended Instruction Set  .............................. 71
Bank Select Register (BSR)  ...................................... 59
General Purpose Registers  ....................................... 63
Map for PIC18F2410/4410  ........................................ 60
Map for PIC18F2510/4510  ........................................ 61
Map for PIC18F2515/2610/4515/4610  ...................... 62
Special Function Registers ........................................ 64
DAW ................................................................................ 276
DC and AC Characteristics
Graphs and Tables  .................................................. 349
DC Characteristics ........................................................... 324
Power-Down and Supply Current  ............................ 315
Supply Voltage  ........................................................ 314
DCFSNZ .......................................................................... 277
DECF ............................................................................... 276
DECFSZ .......................................................................... 277
Development Support ...................................................... 307
Device Differences ........................................................... 359
Device Overview .................................................................. 7
Details on Individual Family Members ......................... 8
New Core Features ...................................................... 7
Other Special Features ................................................ 8
Device Overview (PIC18F2410/2510/2515/2610)
Features (table)  ........................................................... 9
Device Overview (PIC18F4410/4510/4515/4610)
Features (table)  ......................................................... 10

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 365
PIC18F2X1X/4X1X
Device Reset Timers .......................................................... 45
Oscillator Start-up Timer (OST)  ................................. 45
PLL Lock Time-out ..................................................... 45
Power-up Timer (PWRT)  ........................................... 45
Direct Addressing ............................................................... 70
E
Effect on Standard PIC Instructions ........................... 71, 304
Effects of Power Managed Modes on 
Various Clock Sources ............................................... 31
Electrical Characteristics .................................................. 311
Enhanced Capture/Compare/PWM (ECCP)  .................... 137
Capture and Compare Modes .................................. 138
Capture Mode. 
See
 Capture (ECCP Module).
Outputs and Configuration  ....................................... 138
Pin Configurations for ECCP1  ................................. 138
PWM Mode. 
See
 PWM (ECCP Module).
Standard PWM Mode ............................................... 138
Timer Resources ...................................................... 138
Enhanced PWM Mode. 
See
 PWM (ECCP Module). ........ 139
Enhanced Universal Synchronous Asynchronous 
Receiver Transmitter (EUSART).
 See 
EUSART.
Equations
A/D Acquisition Time ................................................ 216
A/D Minimum Charging Time ................................... 216
Errata ................................................................................... 6
EUSART
Asynchronous Mode  ................................................ 200
12-Bit Break Transmit and Receive  ................. 205
Associated Registers, Receive  ........................ 203
Associated Registers, Transmit  ....................... 201
Auto-Wake-up on Sync Break  ......................... 204
Receiver ........................................................... 202
Setting up 9-bit Mode with 
Address Detect  ........................................ 202
Transmitter ....................................................... 200
Baud Rate Generator
Operation in Power Managed Mode  ................ 195
Baud Rate Generator (BRG) .................................... 195
Associated Registers  ....................................... 195
Auto-Baud Rate Detect .................................... 198
Baud Rate Error, Calculating  ........................... 195
Baud Rates, Asynchronous Modes  ................. 196
High Baud Rate Select (BRGH Bit)  ................. 195
Sampling .......................................................... 195
Synchronous Master Mode  ...................................... 206
Associated Registers, Receive  ........................ 208
Associated Registers, Transmit  ....................... 207
Reception ......................................................... 208
Transmission ................................................... 206
Synchronous Slave Mode  ........................................ 209
Associated Registers, Receive  ........................ 210
Associated Registers, Transmit  ....................... 209
Reception ......................................................... 210
Transmission ................................................... 209
Extended Instruction Set .................................................. 299
ADDFSR .................................................................. 300
ADDULNK ................................................................ 300
and Using MPLAB Tools .......................................... 306
CALLW ..................................................................... 301
Considerations for Use  ............................................ 304
MOVSF .................................................................... 301
MOVSS .................................................................... 302
PUSHL ..................................................................... 302
SUBFSR .................................................................. 303
SUBULNK ................................................................ 303
Syntax ...................................................................... 299
External Clock Input ........................................................... 24
F
Fail-Safe Clock Monitor  ........................................... 237, 249
Interrupts in Power Managed Modes ....................... 250
POR or Wake from Sleep  ........................................ 250
WDT During Oscillator Failure ................................. 249
Fast Register Stack  ........................................................... 56
Flash Program Memory  ..................................................... 75
Associated Registers ................................................. 77
Control Registers ....................................................... 76
Reading ..................................................................... 76
TABLAT (Table Latch) Register  ................................ 76
Table Reads and Table Writes  .................................. 75
TBLPTR (Table Pointer) Register .............................. 76
FSCM. 
See
 Fail-Safe Clock Monitor.
G
General Call Address Support  ......................................... 174
GOTO .............................................................................. 278
H
Hardware Multiplier ............................................................ 79
Introduction ................................................................ 79
Operation ................................................................... 79
Performance Comparison .......................................... 79
High/Low-Voltage Detect  ................................................. 231
Applications ............................................................. 234
Associated Registers ............................................... 235
Characteristics ......................................................... 328
Current Consumption  .............................................. 233
Effects of a Reset  .................................................... 235
Operation ................................................................. 232
During Sleep .................................................... 235
Setup ....................................................................... 233
Start-up Time ........................................................... 233
Typical Application ................................................... 234
HLVD. 
See
 High/Low-Voltage Detect. ............................. 231
I
I/O Ports  ............................................................................ 95
I2C Mode (MSSP)
Acknowledge Sequence Timing  .............................. 184
Baud Rate Generator  .............................................. 177
Bus Collision
During a Repeated Start Condition .................. 188
During a Stop Condition  .................................. 189
Clock Arbitration  ...................................................... 178
Clock Stretching  ...................................................... 170
10-Bit Slave Receive Mode (SEN = 1)  ............ 170
10-Bit Slave Transmit Mode  ............................ 170
7-Bit Slave Receive Mode (SEN = 1)  .............. 170
7-Bit Slave Transmit Mode  .............................. 170
Clock Synchronization and the 
CKP bit (SEN = 1)  ........................................... 171
Effects of a Reset  .................................................... 185
General Call Address Support ................................. 174
I2C Clock Rate w/BRG  ............................................ 177

PIC18F2X1X/4X1X
DS39636C-page 366 Preliminary © 2007 Microchip Technology Inc.
Master Mode  ............................................................ 175
Operation .........................................................176
Reception ......................................................... 181
Repeated Start Timing  ..................................... 180
Start Condition Timing  ..................................... 179
Transmission ....................................................181
Multi-Master Communication, Bus Collision 
and Arbitration .................................................. 185
Multi-Master Mode  ...................................................185
Operation ................................................................. 164
Read/Write Bit Information (R/W Bit)  ............... 164, 165
Registers ..................................................................160
Serial Clock (RC3/SCK/SCL) ...................................165
Slave Mode  ..............................................................164
Addressing ....................................................... 164
Reception ......................................................... 165
Transmission ....................................................165
Sleep Operation  ....................................................... 185
Stop Condition Timing .............................................. 184
ID Locations  ............................................................. 237, 255
INCF ................................................................................. 278
INCFSZ ............................................................................ 279
In-Circuit Debugger  .......................................................... 255
In-Circuit Serial Programming (ICSP)  ...................... 237, 255
Indexed Literal Offset Addressing
and Standard PIC18 Instructions  ............................. 304
Indexed Literal Offset Mode  ....................................... 71, 304
Indirect Addressing  ............................................................ 70
INFSNZ ............................................................................ 279
Initialization Conditions for all Registers  ...................... 49–52
Instruction Cycle ................................................................. 57
Clocking Scheme  .......................................................57
Instruction Flow/Pipelining  .................................................57
Instruction Set
ADDLW ....................................................................263
ADDWF ....................................................................263
ADDWF (Indexed Literal Offset mode)  .................... 305
ADDWFC ................................................................. 264
ANDLW ....................................................................264
ANDWF ....................................................................265
BC ............................................................................265
BCF .......................................................................... 266
BN ............................................................................266
BNC .........................................................................267
BNN .........................................................................267
BNOV .......................................................................268
BNZ .......................................................................... 268
BOV .........................................................................271
BRA .......................................................................... 269
BSF .......................................................................... 269
BSF (Indexed Literal Offset mode)  .......................... 305
BTFSC ..................................................................... 270
BTFSS ..................................................................... 270
BTG .......................................................................... 271
BZ ............................................................................272
CALL ........................................................................272
CLRF ........................................................................273
CLRWDT ..................................................................273
COMF ......................................................................274
CPFSEQ ..................................................................274
CPFSGT ..................................................................275
CPFSLT ...................................................................275
DAW .........................................................................276
DCFSNZ ..................................................................277
DECF ....................................................................... 276
DECFSZ .................................................................. 277
Firmware Instructions  .............................................. 257
General Format ........................................................ 259
GOTO ...................................................................... 278
INCF ........................................................................ 278
INCFSZ .................................................................... 279
INFSNZ .................................................................... 279
IORLW ..................................................................... 280
IORWF ..................................................................... 280
LFSR ....................................................................... 281
MOVF ...................................................................... 281
MOVFF .................................................................... 282
MOVLB .................................................................... 282
MOVLW ................................................................... 283
MOVWF ................................................................... 283
MULLW .................................................................... 284
MULWF .................................................................... 284
NEGF ....................................................................... 285
NOP ......................................................................... 285
Opcode Field Descriptions ....................................... 258
POP ......................................................................... 286
PUSH ....................................................................... 286
RCALL ..................................................................... 287
RESET ..................................................................... 287
RETFIE .................................................................... 288
RETLW .................................................................... 288
RETURN .................................................................. 289
RLCF ....................................................................... 289
RLNCF ..................................................................... 290
RRCF ....................................................................... 290
RRNCF .................................................................... 291
SETF ....................................................................... 291
SETF (Indexed Literal Offset mode)  ........................ 305
SLEEP ..................................................................... 292
Standard Instructions ............................................... 257
SUBFWB ................................................................. 292
SUBLW .................................................................... 293
SUBWF .................................................................... 293
SUBWFB ................................................................. 294
SWAPF .................................................................... 294
TBLRD ..................................................................... 295
TBLWT .................................................................... 296
TSTFSZ ................................................................... 297
XORLW ................................................................... 297
XORWF ................................................................... 298
INTCON Registers ....................................................... 83–85
Inter-Integrated Circuit. 
See
 I2C.
Internal Oscillator Block  ..................................................... 26
Adjustment ................................................................. 26
INTIO Modes  ............................................................. 26
INTOSC Frequency Drift ............................................ 26
INTOSC Output Frequency  ....................................... 26
OSCTUNE Register ................................................... 26
PLL in INTOSC Modes  .............................................. 26
Internal RC Oscillator
Use with WDT .......................................................... 246
Internet Address  .............................................................. 373
Interrupt Sources  ............................................................. 237
A/D Conversion Complete  ....................................... 215
Capture Complete (CCP) ......................................... 131
Compare Complete (CCP) ....................................... 132
Interrupt-on-Change (RB7:RB4)  ................................ 98
INTn Pin ..................................................................... 93
PORTB, Interrupt-on-Change  .................................... 93
TMR0 ......................................................................... 93

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 367
PIC18F2X1X/4X1X
TMR0 Overflow ........................................................ 115
TMR1 Overflow ........................................................ 117
TMR2 to PR2 Match (PWM)  ............................ 134, 139
TMR3 Overflow  ................................................ 125, 127
Interrupts ............................................................................ 81
Interrupts, Flag Bits
Interrupt-on-Change (RB7:RB4) Flag (RBIF Bit)  ....... 98
INTOSC, INTRC. 
See 
Internal Oscillator Block.
IORLW ............................................................................. 280
IORWF ............................................................................. 280
IPR Registers ..................................................................... 90
L
LFSR ................................................................................ 281
Low-Voltage ICSP Programming. 
See
 Single-Supply ICSP Programming.
M
Master Clear (MCLR) ......................................................... 43
Master Synchronous Serial Port (MSSP). 
See
 MSSP.
Memory Organization ......................................................... 53
Data Memory  ............................................................. 59
Program Memory  ....................................................... 53
Memory Programming Requirements  .............................. 326
Microchip Internet Web Site ............................................. 373
Migration from Baseline to Enhanced Devices  ................ 360
Migration from High-End to Enhanced Devices  ............... 361
Migration from Mid-Range to Enhanced Devices  ............ 361
MOVF ............................................................................... 281
MOVFF ............................................................................ 282
MOVLB ............................................................................ 282
MOVLW ........................................................................... 283
MOVSF ............................................................................ 301
MOVSS ............................................................................ 302
MOVWF ........................................................................... 283
MPLAB ASM30 Assembler, Linker, Librarian  .................. 308
MPLAB ICD 2 In-Circuit Debugger  .................................. 309
MPLAB ICE 2000 High-Performance 
Universal In-Circuit Emulator  ................................... 309
MPLAB Integrated Development 
Environment Software .............................................. 307
MPLAB PM3 Device Programmer  ................................... 309
MPLAB REAL ICE In-Circuit Emulator System ................ 309
MPLINK Object Linker/MPLIB Object Librarian  ............... 308
MSSP
ACK Pulse ........................................................ 164, 165
Control Registers (general) ...................................... 151
I2C Mode. 
See 
I2C Mode.
Module Overview  ..................................................... 151
SPI Master/Slave Connection  .................................. 155
SPI Mode. 
See 
SPI Mode.
SSPBUF ................................................................... 156
SSPSR ..................................................................... 156
MULLW ............................................................................ 284
MULWF ............................................................................ 284
N
NEGF ............................................................................... 285
NOP ................................................................................. 285
O
OPTION_REG Register
PSA Bit ..................................................................... 115
T0CS Bit ................................................................... 114
T0PS2:T0PS0 Bits  ................................................... 115
T0SE Bit ................................................................... 114
Oscillator Configuration  ..................................................... 23
EC .............................................................................. 23
ECIO .......................................................................... 23
HS .............................................................................. 23
HSPLL ....................................................................... 23
Internal Oscillator Block ............................................. 26
INTIO1 ....................................................................... 23
INTIO2 ....................................................................... 23
LP .............................................................................. 23
RC ............................................................................. 23
RCIO .......................................................................... 23
XT .............................................................................. 23
Oscillator Selection .......................................................... 237
Oscillator Start-up Timer (OST)  ................................... 31, 45
Oscillator Switching  ........................................................... 28
Oscillator Transitions  ......................................................... 29
Oscillator, Timer1 ..................................................... 117, 127
Oscillator, Timer3 ............................................................. 125
P
Packaging Information ..................................................... 351
Details (Diagrams) ................................................... 353
Marking .................................................................... 351
Parallel Slave Port (PSP) ......................................... 104, 110
Associated Registers ............................................... 111
CS (Chip Select) ...................................................... 110
PORTD .................................................................... 110
RD (Read Input)  ...................................................... 110
Select (PSPMODE Bit)  .................................... 104, 110
WR (Write Input) ...................................................... 110
PICSTART Plus Development Programmer .................... 310
PIE Registers ..................................................................... 88
Pin Functions
MCLR/VPP/RE3 ................................................... 13, 17
OSC1/CLKI/RA7 .................................................. 13, 17
OSC2/CLKO/RA6 ................................................ 13, 17
RA0/AN0 .............................................................. 14, 18
RA1/AN1 .............................................................. 14, 18
RA2/AN2/VREF-/CVREF ....................................... 14, 18
RA3/AN3/VREF+ .................................................. 14, 18
RA4/T0CKI/C1OUT ............................................. 14, 18
RA5/AN4/SS/HLVDIN/C2OUT ............................ 14, 18
RB0/INT0/FLT0/AN12 ......................................... 15, 19
RB1/INT1/AN10 ................................................... 15, 19
RB2/INT2/AN8 ..................................................... 15, 19
RB3/AN9/CCP2 ................................................... 15, 19
RB4/KBI0/AN11 ................................................... 15, 19
RB5/KBI1/PGM .................................................... 15, 19
RB6/KBI2/PGC .................................................... 15, 19
RB7/KBI3/PGD .................................................... 15, 19
RC0/T1OSO/T13CKI ........................................... 16, 20
RC1/T1OSI/CCP2 ............................................... 16, 20
RC2/CCP1 ................................................................. 16
RC2/CCP1/P1A ......................................................... 20
RC3/SCK/SCL ..................................................... 16, 20
RC4/SDI/SDA ...................................................... 16, 20
RC5/SDO ............................................................. 16, 20
RC6/TX/CK .......................................................... 16, 20
RC7/RX/DT .......................................................... 16, 20
RD0/PSP0 ................................................................. 21
RD1/PSP1 ................................................................. 21
RD2/PSP2 ................................................................. 21
RD3/PSP3 ................................................................. 21
RD4/PSP4 ................................................................. 21
RD5/PSP5/P1B ......................................................... 21
RD6/PSP6/P1C ......................................................... 21

PIC18F2X1X/4X1X
DS39636C-page 368 Preliminary © 2007 Microchip Technology Inc.
RD7/PSP7/P1D .......................................................... 21
RE0/RD/AN5 ..............................................................22
RE1/WR/AN6 ............................................................. 22
RE2/CS/AN7 ..............................................................22
VDD ....................................................................... 16, 22
VSS ....................................................................... 16, 22
Pinout I/O Descriptions
PIC18F2410/2510/2515/2610 .................................... 13
PIC18F4410/4510/4515/4610 .................................... 17
PIR Registers  .....................................................................86
PLL Frequency Multiplier  ................................................... 25
HSPLL Oscillator Mode .............................................. 25
Use with INTOSC ....................................................... 25
POP .................................................................................. 286
POR. 
See
 Power-on Reset.
PORTA
Associated Registers  ................................................. 97
LATA Register ............................................................ 95
PORTA Register  ........................................................ 95
TRISA Register  .......................................................... 95
PORTB
Associated Registers  ...............................................100
LATB Register ............................................................ 98
PORTB Register  ........................................................ 98
RB7:RB4 Interrupt-on-Change 
Flag (RBIF Bit)  ...................................................98
TRISB Register  .......................................................... 98
PORTC
Associated Registers  ...............................................103
LATC Register  ......................................................... 101
PORTC Register  ......................................................101
RC3/SCK/SCL Pin  ...................................................165
TRISC Register ........................................................101
PORTD
Associated Registers  ...............................................106
LATD Register  ......................................................... 104
Parallel Slave Port (PSP) Function  ..........................104
PORTD Register  ......................................................104
TRISD Register ........................................................104
PORTE
Associated Registers  ...............................................109
LATE Register ..........................................................107
PORTE Register  ...................................................... 107
PSP Mode Select (PSPMODE Bit)  .......................... 104
TRISE Register  ........................................................107
Postscaler, WDT
Assignment (PSA Bit)  ..............................................115
Rate Select (T0PS2:T0PS0 Bits)  .............................115
Switching Between Timer0 and WDT  ...................... 115
Power Managed Modes  ..................................................... 33
and A/D Operation  ................................................... 218
and EUSART Operation ........................................... 195
and Multiple Sleep Commands  .................................. 34
and PWM Operation  ................................................ 149
and SPI Operation  ................................................... 159
Clock Sources ............................................................33
Clock Transitions and Status Indicators ..................... 34
Effects on Clock Sources ...........................................31
Entering ......................................................................33
Exiting Idle and Sleep Modes  .................................... 39
by Interrupt ......................................................... 39
by Reset ............................................................. 39
by WDT Time-out ...............................................39
Without a Start-up Delay ....................................40
Idle Modes  ................................................................. 37
PRI_IDLE ........................................................... 38
RC_IDLE ........................................................... 39
SEC_IDLE ......................................................... 38
Run Modes  ................................................................ 34
PRI_RUN ........................................................... 34
RC_RUN ............................................................ 35
SEC_RUN ......................................................... 34
Selecting .................................................................... 33
Sleep Mode  ............................................................... 37
Summary (table)  ........................................................ 33
Power-on Reset (POR) ...................................................... 43
Power-up Timer (PWRT)  ........................................... 45
Time-out Sequence  ................................................... 45
Power-up Delays  ............................................................... 31
Power-up Timer (PWRT)  ................................................... 31
Prescaler
Timer2 ..................................................................... 140
Prescaler, Timer0  ............................................................ 115
Assignment (PSA Bit)  .............................................. 115
Rate Select (T0PS2:T0PS0 Bits) ............................. 115
Switching Between Timer0 and WDT  ...................... 115
Prescaler, Timer2  ............................................................ 135
PRI_IDLE Mode ................................................................. 38
PRI_RUN Mode  ................................................................. 34
Program Counter  ............................................................... 54
PCL, PCH and PCU Registers  .................................. 54
PCLATH and PCLATU Registers  .............................. 54
Program Memory
and Extended Instruction Set  .................................... 73
Code Protection  ....................................................... 253
Instructions ................................................................ 58
Two-Word .......................................................... 58
Interrupt Vector .......................................................... 53
Look-up Tables  .......................................................... 56
Map and Stack (diagram)  .......................................... 53
Reset Vector .............................................................. 53
Program Verification and Code Protection  ...................... 251
Associated Registers ............................................... 252
Programming, Device Instructions ................................... 257
PSP.
 See 
Parallel Slave Port.
Pulse-Width Modulation. 
See 
PWM (CCP Module) 
and PWM (ECCP Module).
PUSH ............................................................................... 286
PUSH and POP Instructions .............................................. 55
PUSHL ............................................................................. 302
PWM (CCP Module)
Associated Registers ............................................... 136
Auto-Shutdown (CCP1 only) .................................... 135
CCPR1H:CCPR1L Registers ................................... 139
Duty Cycle  ....................................................... 134, 140
Example Frequencies/Resolutions  .................. 135, 140
Period .............................................................. 134, 139
Setup for PWM Operation ........................................ 135
TMR2 to PR2 Match  ........................................ 134, 139
PWM (ECCP Module) ...................................................... 139
Associated Registers ............................................... 150
Direction Change in Full-Bridge 
Output Mode .................................................... 144
Effects of a Reset  .................................................... 149
Enhanced PWM Auto-Shutdown  ............................. 146
Full-Bridge Application Example .............................. 144
Full-Bridge Mode  ..................................................... 143
Half-Bridge Mode ..................................................... 142

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 369
PIC18F2X1X/4X1X
Half-Bridge Output Mode 
Applications Example  ...................................... 142
Operation in Power Managed Modes  ...................... 149
Operation with Fail-Safe Clock Monitor  ................... 149
Output Configurations  .............................................. 140
Output Relationships (Active-High) .......................... 141
Output Relationships (Active-Low) ........................... 141
Programmable Dead-Band Delay  ............................ 146
Setup for PWM Operation ........................................ 149
Start-up Considerations  ........................................... 148
Q
Q Clock  .................................................................... 135, 140
R
RAM. 
See
 Data Memory.
RBIF Bit .............................................................................. 98
RC Oscillator ...................................................................... 25
RCIO Oscillator Mode  ................................................ 25
RC_IDLE Mode .................................................................. 39
RC_RUN Mode  .................................................................. 35
RCALL ............................................................................. 287
RCON Register
Bit Status During Initialization  .................................... 48
Reader Response  ............................................................ 374
Register File ....................................................................... 63
Registers
ADCON0 (A/D Control 0) ......................................... 211
ADCON1 (A/D Control 1) ......................................... 212
ADCON2 (A/D Control 2) ......................................... 213
BAUDCON (Baud Rate Control) .............................. 194
CCP1CON (Enhanced Capture/Compare/PWM 
Control 1)  ......................................................... 137
CCPxCON (Standard Capture/Compare/PWM 
Control) ............................................................ 129
CMCON (Comparator Control)  ................................ 221
CONFIG1H (Configuration 1 High)  .......................... 238
CONFIG2H (Configuration 2 High)  .......................... 240
CONFIG2L (Configuration 2 Low) ............................ 239
CONFIG3H (Configuration 3 High)  .......................... 241
CONFIG4L (Configuration 4 Low) ............................ 241
CONFIG5H (Configuration 5 High)  .......................... 242
CONFIG5L (Configuration 5 Low) ............................ 242
CONFIG6H (Configuration 6 High)  .......................... 243
CONFIG6L (Configuration 6 Low) ............................ 243
CONFIG7H (Configuration 7 High)  .......................... 244
CONFIG7L (Configuration 7 Low) ............................ 244
CVRCON (Comparator Voltage 
Reference Control)  .......................................... 227
Device ID Register 1 ................................................ 245
Device ID Register 2 ................................................ 245
ECCP1AS (ECCP Auto-Shutdown Control) ............. 147
HLVDCON (HLVD Control) ...................................... 231
INTCON (Interrupt Control) ........................................ 83
INTCON2 (Interrupt Control 2) ................................... 84
INTCON3 (Interrupt Control 3) ................................... 85
IPR1 (Peripheral Interrupt Priority 1) .......................... 90
IPR2 (Peripheral Interrupt Priority 2) .......................... 91
OSCCON (Oscillator Control)  .................................... 30
OSCTUNE (Oscillator Tuning)  ................................... 27
PIE1 (Peripheral Interrupt Enable 1) .......................... 88
PIE2 (Peripheral Interrupt Enable 2) .......................... 89
PIR1 (Peripheral Interrupt Request (Flag) 1)  ............. 86
PIR2 (Peripheral Interrupt Request (Flag) 2)  ............. 87
PWM1CON (PWM Configuration) ............................ 146
RCON (Reset Control)  ......................................... 42, 92
RCSTA (Receive Status and Control)  ..................... 193
SSPCON1 (MSSP Control 1, I2C Mode)  ................. 162
SSPCON1 (MSSP Control 1, SPI Mode)  ................ 153
SSPCON2 (MSSP Control 2, I2C Mode)  ................. 163
SSPSTAT (MSSP Status, I2C Mode)  ...................... 161
SSPSTAT (MSSP Status, SPI Mode) ...................... 152
Status ........................................................................ 68
STKPTR (Stack Pointer) ............................................ 55
T0CON (Timer0 Control)  ......................................... 113
T1CON (Timer1 Control)  ......................................... 117
T2CON (Timer 2 Control)  ........................................ 123
T3CON (Timer3 Control)  ......................................... 125
TRISE (PORTE/PSP Control)  ................................. 108
TXSTA (Transmit Status and Control) ..................... 192
WDTCON (Watchdog Timer Control)  ...................... 247
RESET ............................................................................. 287
Reset State of Registers .................................................... 48
Resets ....................................................................... 41, 237
Brown-out Reset (BOR) ........................................... 237
Oscillator Start-up Timer (OST) ............................... 237
Power-on Reset (POR) ............................................ 237
Power-up Timer (PWRT) ......................................... 237
RETFIE ............................................................................ 288
RETLW ............................................................................ 288
RETURN .......................................................................... 289
Return Address Stack ........................................................ 54
Return Stack Pointer (STKPTR) ........................................ 55
Revision History ............................................................... 359
RLCF ............................................................................... 289
RLNCF ............................................................................. 290
RRCF ............................................................................... 290
RRNCF ............................................................................ 291
S
SCK ................................................................................. 151
SDI ................................................................................... 151
SDO ................................................................................. 151
SEC_IDLE Mode  ............................................................... 38
SEC_RUN Mode ................................................................ 34
Serial Clock, SCK  ............................................................ 151
Serial Data In (SDI) .......................................................... 151
Serial Data Out (SDO) ..................................................... 151
Serial Peripheral Interface. 
See
 SPI Mode.
SETF ............................................................................... 291
Single-Supply ICSP Programming.
Slave Select (SS) ............................................................. 151
SLEEP ............................................................................. 292
Sleep
OSC1 and OSC2 Pin States ...................................... 31
Software Simulator (MPLAB SIM)  ................................... 308
Special Event Trigger. 
See
 Compare (ECCP Mode).
Special Event Trigger. 
See
 Compare (ECCP Module).
Special Features of the CPU  ........................................... 237
Special Function Registers ................................................ 64
Map ............................................................................ 64
SPI Mode (MSSP)
Associated Registers ............................................... 159
Bus Mode Compatibility ........................................... 159
Effects of a Reset  .................................................... 159
Enabling SPI I/O ...................................................... 155
Master Mode ............................................................ 156
Master/Slave Connection  ........................................ 155
Operation ................................................................. 154
Operation in Power Managed Modes  ...................... 159
Serial Clock  ............................................................. 151
Serial Data In ........................................................... 151

PIC18F2X1X/4X1X
DS39636C-page 370 Preliminary © 2007 Microchip Technology Inc.
Serial Data Out  ........................................................ 151
Slave Mode  ..............................................................157
Slave Select  ............................................................. 151
Slave Select Synchronization  .................................. 157
SPI Clock  ................................................................. 156
Typical Connection  .................................................. 155
SS ....................................................................................151
SSPOV .............................................................................181
SSPOV Status Flag .......................................................... 181
SSPSTAT Register
R/W Bit ............................................................. 164, 165
Stack Full/Underflow Resets  .............................................. 56
SUBFSR ........................................................................... 303
SUBFWB ..........................................................................292
SUBLW ............................................................................293
SUBULNK ........................................................................303
SUBWF ............................................................................ 293
SUBWFB ..........................................................................294
SWAPF ............................................................................294
T
Table Pointer Operations (table)  ........................................ 76
Table Reads/Table Writes .................................................. 56
TBLRD .............................................................................295
TBLWT ............................................................................. 296
Time-out in Various Situations (table)  ................................45
Timer0 ..............................................................................113
16-Bit Mode Timer Reads and Writes  ...................... 114
Associated Registers  ...............................................115
Clock Source Edge Select (T0SE Bit) ...................... 114
Clock Source Select (T0CS Bit) ...............................114
Operation ................................................................. 114
Overflow Interrupt  ....................................................115
Prescaler .................................................................. 115
Prescaler. 
See
 Prescaler, Timer0.
Timer1 ..............................................................................117
16-Bit Read/Write Mode ........................................... 119
Associated Registers  ...............................................121
Interrupt ....................................................................120
Operation ................................................................. 118
Oscillator .......................................................... 117, 119
Oscillator Layout Considerations  .............................120
Overflow Interrupt  ....................................................117
Resetting, Using the CCP 
Special Event Trigger .......................................120
Special Event Trigger (ECCP)  .................................138
TMR1H Register  ...................................................... 117
TMR1L Register .......................................................117
Use as a Real-Time Clock  ....................................... 120
Timer2 ..............................................................................123
Associated Registers  ...............................................124
Interrupt ....................................................................124
Operation ................................................................. 123
Output ......................................................................124
PR2 Register .................................................... 134, 139
TMR2 to PR2 Match Interrupt  .......................... 134, 139
Timer3 ..............................................................................125
16-Bit Read/Write Mode ........................................... 127
Associated Registers  ...............................................127
Operation ................................................................. 126
Oscillator .......................................................... 125, 127
Overflow Interrupt  ............................................ 125, 127
Special Event Trigger (CCP) .................................... 127
TMR3H Register  ...................................................... 125
TMR3L Register .......................................................125
Timing Diagrams
A/D Conversion ........................................................ 348
Acknowledge Sequence  .......................................... 184
Asynchronous Reception ......................................... 203
Asynchronous Transmission .................................... 201
Asynchronous Transmission (Back to Back)  ........... 201
Automatic Baud Rate Calculation  ............................ 199
Auto-Wake-up Bit (WUE) During 
Normal Operation  ............................................ 204
Auto-Wake-up Bit (WUE) During Sleep  ................... 204
Baud Rate Generator with Clock Arbitration ............ 178
BRG Overflow Sequence ......................................... 199
BRG Reset Due to SDA Arbitration 
During Start Condition  ..................................... 187
Brown-out Reset (BOR) ........................................... 334
Bus Collision During a Repeated Start 
Condition (Case 1) ........................................... 188
Bus Collision During a Repeated Start 
Condition (Case 2) ........................................... 188
Bus Collision During a Start 
Condition (SCL = 0) ......................................... 187
Bus Collision During a Start 
Condition (SDA only)  ....................................... 186
Bus Collision During a Stop 
Condition (Case 1) ........................................... 189
Bus Collision During a Stop 
Condition (Case 2) ........................................... 189
Bus Collision for Transmit and Acknowledge  .......... 185
Capture/Compare/PWM (CCP)  ............................... 336
CLKO and I/O  .......................................................... 333
Clock Synchronization  ............................................. 171
Clock/Instruction Cycle  .............................................. 57
Example SPI Master Mode (CKE = 0)  ..................... 338
Example SPI Master Mode (CKE = 1)  ..................... 339
Example SPI Slave Mode (CKE = 0)  ....................... 340
Example SPI Slave Mode (CKE = 1)  ....................... 341
External Clock (All Modes except PLL)  ................... 331
Fail-Safe Clock Monitor  ........................................... 250
First Start Bit Timing  ................................................ 179
Full-Bridge PWM Output .......................................... 143
Half-Bridge PWM Output  ......................................... 142
High/Low-Voltage Detect Characteristics  ................ 328
High-Voltage Detect (VDIRMAG = 1)  ...................... 234
I2C Bus Data ............................................................ 342
I2C Bus Start/Stop Bits  ............................................ 342
I2C Master Mode (7 or 10-Bit Transmission)  ........... 182
I2C Master Mode (7-Bit Reception) .......................... 183
I2C Slave Mode (10-Bit Reception, SEN = 0)  .......... 168
I2C Slave Mode (10-Bit Reception, SEN = 1)  .......... 173
I2C Slave Mode (10-Bit Transmission)  .................... 169
I2C Slave Mode (7-Bit Reception, SEN = 0)  ............ 166
I2C Slave Mode (7-Bit Reception, SEN = 1)  ............ 172
I2C Slave Mode (7-Bit Transmission)  ...................... 167
I2C Slave Mode General Call Address 
Sequence (7 or 10-Bit Address Mode)  ............ 174
I2C Stop Condition Receive or 
Transmit Mode ................................................. 184
Low-Voltage Detect (VDIRMAG = 0)  ....................... 233
Master SSP I2C Bus Data ........................................ 344
Master SSP I2C Bus Start/Stop Bits  ........................ 344
Parallel Slave Port 
(PIC18F4410/4510/4515/4610) ....................... 337
Parallel Slave Port (PSP) Read ............................... 111
Parallel Slave Port (PSP) Write  ............................... 111

© 2007 Microchip Technology Inc. Preliminary DS39636C-page 371
PIC18F2X1X/4X1X
PWM Auto-Shutdown (PRSEN = 0, 
Auto-Restart Disabled)  .................................... 148
PWM Auto-Shutdown (PRSEN = 1, 
Auto-Restart Enabled)  ..................................... 148
PWM Direction Change  ........................................... 145
PWM Direction Change at Near 
100% Duty Cycle  ............................................. 145
PWM Output  ............................................................ 134
Repeat Start Condition ............................................. 180
Reset, Watchdog Timer (WDT), Oscillator Start-up 
Timer (OST), Power-up Timer (PWRT)  ........... 334
Send Break Character Sequence  ............................ 205
Slave Synchronization  ............................................. 157
Slow Rise Time (MCLR Tied to VDD, 
VDD Rise > TPWRT) ............................................ 47
SPI Mode (Master Mode) ......................................... 156
SPI Mode (Slave Mode, CKE = 0)  ........................... 158
SPI Mode (Slave Mode, CKE = 1)  ........................... 158
Synchronous Reception (Master Mode, SREN)  ...... 208
Synchronous Transmission ...................................... 206
Synchronous Transmission (Through TXEN)  .......... 207
Time-out Sequence on POR w/PLL Enabled 
(MCLR Tied to VDD) ........................................... 47
Time-out Sequence on Power-up 
(MCLR Not Tied to VDD, Case 1) ....................... 46
Time-out Sequence on Power-up 
(MCLR Not Tied to VDD, Case 2) ....................... 46
Time-out Sequence on Power-up 
(MCLR Tied to VDD, VDD Rise < TPWRT) ........... 46
Timer0 and Timer1 External Clock  .......................... 335
Transition for Entry to Idle Mode ................................ 38
Transition for Entry to SEC_RUN Mode  .................... 35
Transition for Entry to Sleep Mode  ............................ 37
Transition for Two-Speed Start-up 
(INTOSC to HSPLL)  ........................................ 248
Transition for Wake from Idle to Run Mode  ............... 38
Transition for Wake from Sleep (HSPLL) ................... 37
Transition from RC_RUN Mode to 
PRI_RUN Mode  ................................................. 36
Transition from SEC_RUN Mode to 
PRI_RUN Mode (HSPLL)  .................................. 35
Transition to RC_RUN Mode  ..................................... 36
USART Synchronous Receive (Master/Slave)  ........ 346
USART Synchronous Transmission 
(Master/Slave) ................................................. 346
Timing Diagrams and Specifications ................................ 331
A/D Conversion Requirements  ................................ 348
Capture/Compare/PWM (CCP) 
Requirements .................................................. 336
CLKO and I/O Requirements  ................................... 333
Example SPI Mode Requirements 
(Master Mode, CKE = 0)  .................................. 338
Example SPI Mode Requirements 
(Master Mode, CKE = 1)  .................................. 339
Example SPI Mode Requirements 
(Slave Mode, CKE = 0)  .................................... 340
Example SPI Mode Requirements 
(Slave Mode, CKE = 1) .................................... 341
External Clock Requirements  .................................. 331
I2C Bus Data Requirements (Slave Mode) .............. 343
Master SSP I2C Bus Data Requirements  ................ 345
Master SSP I2C Bus Start/Stop Bits 
Requirements .................................................. 344
Parallel Slave Port Requirements 
(PIC18F4410/4510/4515/4610) ....................... 337
PLL Clock  ................................................................ 332
Reset, Watchdog Timer, Oscillator Start-up 
Timer, Power-up Timer and Brown-out 
Reset Requirements ........................................ 334
Timer0 and Timer1 External Clock 
Requirements .................................................. 335
USART Synchronous Receive Requirements  ......... 346
USART Synchronous Transmission 
Requirements .................................................. 346
Top-of-Stack Access .......................................................... 54
TRISE Register
PSPMODE Bit  ......................................................... 104
TSTFSZ ........................................................................... 297
Two-Speed Start-up ................................................. 237, 248
Two-Word Instructions
Example Cases  ......................................................... 58
TXSTA Register
BRGH Bit ................................................................. 195
V
Voltage Reference Specifications .................................... 327
W
Watchdog Timer (WDT) ........................................... 237, 246
Associated Registers ............................................... 247
Control Register ....................................................... 246
During Oscillator Failure  .......................................... 249
Programming Considerations  .................................. 246
WCOL ...................................................... 179, 180, 181, 184
WCOL Status Flag ................................... 179, 180, 181, 184
WWW Address  ................................................................ 373
WWW, On-Line Support  ...................................................... 6
X
XORLW ........................................................................... 297
XORWF ........................................................................... 298

PIC18F2X1X/4X1X

NOTES:

PIC18F2X1X/4X1X

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PIC18F2X1X/4X1X

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DS39636CPIC18F2X1X/4X1X

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PIC18F2X1X/4X1X

PIC18F2X1X/4X1X PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X/XX XXX

PatternPackageTemperature

Range

Device

Device PIC18F2410/2415/2510/2515/2610(1),

PIC18F4410/4415/4510/4515/4610(1),

PIC18F2410/2415/2510/2515/2610T(2),

PIC18F4410/4415/4510/4515/4610 T(2);

VDD range 4.2V to 5.5V

PIC18LF2410/2510/2515/2610(1),

PIC18LF4410/4510/4515/4610(1),

PIC18LF2410/2510/2515/2610T(2),

PIC18LF4410/4510/4515/4610T(2);

VDD range 2.0V to 5.5V

Temperature Range I = -40°C to +85°C (Industrial)

E= -40°C to +125°C (Extended)

Package PT = TQFP (Thin Quad Flatpack)

SO = SOIC

SP = Skinny Plastic DIP

P=PDIP

ML = QFN

Pattern QTP, SQTP, Code or Special Requirements

(blank otherwise)

Examples:

a) PIC18LF4510-I/P 301 = Industrial temp., PDIP

package, Extended VDD limits, QTP pattern

#301.

b) PIC18LF2410-I/SO = Industrial temp., SOIC

package, Extended VDD limits.

c) PIC18F4410-I/P = Industrial temp., PDIP

package, normal VDD limits.

Note 1: F = Standard Voltage Range

LF = Wide Voltage Range

2: T = in tape and reel TQFP

packages only.

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WORLDWIDE SALES AND SERVICE

12/08/06