MANUFACTURER CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS REV.DATE
ECLIPTEK CORP. OSCILLATOR ES51C5 CERAMIC 5.0V OS1D 02/10
A B C D E F
12.0±0.2 5.5±0.1 6.5±0.1 4.0±0.1 2.0±0.1
F G H J K L
8.0±0.1 B0* 1.5 +0.1-0.0 A0* 0.30 ±0.05 K0*
TAPE
M N O P Q
1.5 MIN 50 MIN 20.2 MIN 13.0±0.2 40 MIN
R S T U V
QTY/REEL
2.5 MIN 10 MIN 18.4 MAX 180 MAX 12.4+2-0 1,000
REEL
*Compliant to EIA 481A
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
MARKING SPECIFICATIONS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
Tolerances= +0.1
Line 1: E XX.XXX
Frequency in MHz (5 Digits Maximum + Decimal)
Line 2: XX Y ZZ
Week of Year
Last Digit of Year
Ecliptek Manufacturing Identifier
800-ECLIPTEK www.ecliptek.com for latest revision Specifications subject to change without notice.
PART NUMBERING GUIDE
ES51C5 C 25 V - 13.000M TR
OPERATING TEMP. RANGE
One Letter Code Per Table 1
FREQUENCY STABILITY
Two Digit Code Per Table 1
EXTERNAL TRIM
N=None (No Connection on Pin 1)
V=Voltage Control
FREQUENCY
PACKAGING OPTIONS
Blank=Bulk
TR=Tape & Reel
Pin 1: Control Voltage or No Connection
Pin 2: Case Ground
Pin 3: Output
Pin 4: Supply Voltage
Characteristic Specification
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Flammability UL94-V0
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Vibration MIL-STD-883, Method 2007, Condition A