3M™ Thermally Conductive Acrylic Interface Pads
5589H and 5590H
3
Used to transfer heat from hot surfaces
or devices to cooler surface region of
assembled devices.
• Excellent conformability, gap lling property
that provides excellent heat ow
• Excellent environmental durability
• Range of thermal performance to 100°C
More Reliable
Devices
Cooler
For
For applications requiring gap filling and non-silicone construction
Designed with lled acrylic polymer to be used for
non-silicone applications.
Available in 240 mm × 20 meter rolls for improved
converting processing.
Lower cost solution than Silicone Thermal Interface Pads.
Important Notice: Before using this product, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated
with such use.
Warranty; Limited Remedy; Limited Liability: 3M’s product warranty is stated in its Product Literature available upon request. 3M MAKES NO OTHER WARRANTIES INCLUDING,
BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. If this product is defective within the warranty period stated
above, your exclusive remedy shall be, at 3M’s option, to replace or repair the 3M product or refund the purchase price of the 3M product. Except where prohibited by law,
3M will not be liable for any indirect, special, incidental or consequential loss or damage arising from this 3M product, regardless of the legal theory asserted.
Please recycle. Printed in USA.
© 3M 2009. All rights reserved.
Issued: 9/09 6994 (HB)
60-5002-0428-8
3
Electronics Markets Materials Division
3M Center, Building 225-3S-06
St. Paul, MN 55144-1000
www.3M.com/electronics
1-800-251-8634
3M is trademark of 3M Company.
Used under license by 3M
subsidiaries and afliates.
Selection Guide
Product
Description Adhesion/Shore 00
Softness
Thermal
Performance
Dielectric
Properties
Base
Material
Type
Product
Thick-
ness
mil (mm)
Filler
Type
Liner
Type
Adhesion Character-
ization /// Shore 00
Testing based on TM
6mm Thickness
Conductivity
(W/m-K
3M ASTM
D5470 TM)
Imped-
ance****
°C-in2/W
(°C-cm2/W)
Dielectric
Strength
KV/mm (Film
version tested)
Volume
Resistivity
(ohm/cm)
UL
Flammability
Rating
Potential Operating
Temperature Range***
(°C)
5589H*
Soft Pad
Filled
Acrylic
Polymer
40 (1.0 )
60 (1.5) Ceramic PET
No added adhesive
layer. Pad is tacky and
conformable /// Asker
C=16
2.0 1.33 (8.6)
1.67 (10.8) 21 3.4 X 1012 UL VO
Short Term
(Hours-Days): 110°C
Long Term
(Weeks-Months): 80°C
Note: *1) 3M Pad 5589H has a very low tack surface and a medium tack surface.
5590H*
Soft Pad
Filled
Acrylic
Polymer
20(0.5)
40 (1.0 )
60 (1.5)
Ceramic PET
No added adhesive
layer. Pad is tacky and
conformable /// Asker
C=30
3.0
0.46 (3.0)
0.70 (4.5)
0.95 (6.1)
33 2.7 X 1012 UL VO
Short Term
(Hours-Days): 110°C
Long Term
(Weeks-Months): 80°C
Note: *1) 3M Pad 5590H has a very low tack surface and a medium tack surface.
*** End use application testing will determine nal temperature range based on nal design and other environmental conditions. Suggested Temperature range is based on a UL-746 Test Method
or a 3M Test Method.
Application Note
If user needs to have pad adhesively held in place,
3M™ Adhesive Transfer Tape 9461P is a 1 mil high
temperature acrylic transfer adhesive that bonds well to
the 3M™ Thermally Conductive Acrylic Interface Pad and
to many metal surfaces used for dissipating
the heat.
3M™ Thermally Conductive Acrylic Interface Pads
Effect of Thermal Interface Impedance
and Device Power on Chip Temperature
110
100
90
80
70
60
50
40
30
20
10
0
Chip Temperature (°C)
Impedance (C-in2/W)
0 0.25 0.5 0.75 1 1.25 1.5 1.75 2
20W
10W
2W
