Order Now Product Folder Support & Community Tools & Software Technical Documents Reference Design LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 LM284x and LM284x-Q1 100, 300, or 600-mA 42-V Input Step-Down DC-DC Regulator in Thin SOT 1 Features 3 Description * The LM284x and LM284x-Q1 devices are PWM DCDC buck (step-down) regulators. With an input range from 4.5 V to 42 V, they are suitable for a wide range of applications, such as power conditioning from unregulated sources. They feature a low RDSON (0.9 typical) internal switch for maximum efficiency (85% typical). Operating frequency is fixed at 550 kHz (X option) and 1.25 MHz (Y option), allowing the use of small external components while still being able to have low output voltage ripple. Soft start can be implemented using the Shutdown (SHDN) pin with an external RC circuit allowing the user to tailor the soft-start time to a specific application. 1 * * * * * * * * * * * LM2840-Q1, LM2841-Q1, and LM2842-Q1 are Qualified for Automotive Applications AEC-Q100 Test Guidance With the Following: - Device Temperature Grade 1: -40C to 125C Ambient Operating Temperature - Device HBM ESD Classification Level 2 Input Voltage Range of 4.5 V to 42 V Output Current Options of 100 mA, 300 mA, and 600 mA Feedback Pin Voltage of 0.765 V 550-kHz (X) or 1.25-MHz (Y) Switching Frequency Low Shutdown IQ: 16-A Typical Short-Circuit Protected Internally Compensated Soft-Start Circuitry Small Overall Solution Size (SOT-6L Package) Create a Custom Design Using the LM2840 With the WEBENCH(R) Power Designer The LM2840 and LM2840-Q1 are optimized for up to 100 mA, the LM2841 and LM2841-Q1 for up to 300 mA, and the LM2842 and LM2842-Q1 for up to 600mA load currents. They all have a 0.765-V nominal feedback voltage. Additional features include: thermal shutdown, VIN undervoltage lockout, and gate drive undervoltage lockout. The LM284x and LM284x-Q1 are available in a low-profile SOT-6L package. * 2 Applications * * * * Device Information(1) Battery-Powered Equipment Industrial Distributed Power Applications Portable Media Players Portable Hand-Held Instruments PART NUMBER LM2840, LM2840-Q1, LM2841, LM2841-Q1, LM2842, LM2842-Q1 PACKAGE SOT (6) BODY SIZE (NOM) 1.60 mm x 2.90 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Circuit CBOOT L1 VOUT LM2840/1/2-ADJL VIN VIN CB SHDN SW GND FB D1 R1 CIN R2 COUT Copyright (c) 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 3 3 4 4 4 6 Detailed Description .............................................. 8 7.1 7.2 7.3 7.4 8 Absolute Maximum Ratings ..................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics .......................................... Typical Characteristics .............................................. Overview ................................................................... Functional Block Diagram ......................................... Feature Description................................................... Device Functional Modes.......................................... 8 8 8 9 Application and Implementation ........................ 10 8.1 Application Information............................................ 10 8.2 Typical Applications ................................................ 10 9 Power Supply Recommendations...................... 15 10 Layout................................................................... 16 10.1 Layout Guidelines ................................................. 16 10.2 Layout Example .................................................... 16 11 Device and Documentation Support ................. 17 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 11.9 Custom Design With WEBENCH(R) Tools ............. Device Support...................................................... Documentation Support ........................................ Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 17 17 17 17 17 18 18 18 18 12 Mechanical, Packaging, and Orderable Information ........................................................... 18 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision I (September 2016) to Revision J Page * Added this new text for Pin 4.................................................................................................................................................. 3 * Added this new line of text in Shutdown Operation section ................................................................................................. 12 Changes from Revision H (April 2013) to Revision I Page * Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1 * Added Thermal Information table ........................................................................................................................................... 4 Changes from Revision G (April 2013) to Revision H * 2 Page Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1 Submit Documentation Feedback Copyright (c) 2009-2017, Texas Instruments Incorporated Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 www.ti.com SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 5 Pin Configuration and Functions DDC Package 6-Pin SOT Top View CB 1 6 SW GND 2 5 FB 3 4 VIN SHDN Not to scale Pin Functions PIN NO. NAME I/O DESCRIPTION 1 CB I 2 GND -- SW FET gate bias voltage. Connect CBOOT capacitor between CB and SW. 3 FB I Feedback pin: Set feedback voltage divider ratio with VOUT = VFB (1 + (R1 / R2)). Resistors must be from 100 to 10 k to avoid input bias errors. 4 SHDN I Logic level shutdown input. Pull to GND to disable the device and pull high to enable the device. If this function is not used tie to VIN . DO NOT ALLOW TO FLOAT. 5 VIN I Power input voltage pin: 4.5-V to 42-V normal operating range. 6 SW O Power FET output: Connect to inductor, diode, and CBOOT capacitor. Ground connection 6 Specifications 6.1 Absolute Maximum Ratings See (1) (2) MIN MAX UNIT VIN -0.3 45 V SHDN -0.3 (VIN + 0.3 V) < 45 V SW voltage -0.3 45 V 7 V 5 V CB voltage above SW voltage FB voltage -0.3 Power dissipation (3) Internally Limited Maximum junction temperature Storage temperature, Tstg (1) (2) (3) -65 150 C 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, RJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) - TA)/RJA. Exceeding the maximum allowable power dissipation causes excessive die temperature, and the regulator goes into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=175C (typical) and disengages at TJ= 155C (typical). 6.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) VALUE UNIT 2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Copyright (c) 2009-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 3 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 www.ti.com 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Operating junction temperature (1) Input voltage VIN MIN MAX UNIT -40 125 C 4.5 42 V 42 V SW voltage (1) All limits specified at room temperature (TA = 25C) unless otherwise specified. All room temperature limits are 100% production tested. All limits at temperature extremes are ensured through correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). 6.4 Thermal Information LM284x, LM284x-Q1 THERMAL METRIC (1) DDC (SOT) UNIT 6 PINS RJA Junction-to-ambient thermal resistance (2) (3) 121 C/W RJC(top) Junction-to-case (top) thermal resistance 94 C/W (1) (2) (3) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. The package thermal impedance is calculated in accordance to JESD 51-7. Thermal Resistances were simulated on a 4-layer, JEDEC board 6.5 Electrical Characteristics Specifications are for TJ = 25C unless otherwise specified. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 12 V. (1) (2) (3) PARAMETER TEST CONDITIONS SHDN = 0 V IQ Quiescent current Device ON, not switching Device ON, no load Switch ON resistance See ILSW Switch leakage current VIN = 42 V LM2840 (5) Switch current limit LM2841 (5) LM2842 (5) IFB (1) (2) (3) (4) (5) (6) 4 Feedback pin bias current LM284[0,1,2] (6) TYP MAX 16 TJ = -40C to 125C 40 UNIT A 1.3 TJ = -40C to 125C 1.75 1.35 TJ = -40C to 125C TJ = -40C to 125C 1.6 0 TJ = -40C to 125C 0.5 525 TJ = -40C to 125C 900 525 TJ = -40C to 125C 900 1.15 TJ = -40C to 125C 1.7 0.1 TJ = -40C to 125C mA 1.85 0.9 (4) RDSON ICL MIN 1 A mA mA A A All limits specified at room temperature (TA = 25C) unless otherwise noted. Room temperature limits are production tested. Limits at temperature extremes are ensured through correlation using standard Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL). Typical numbers are at 25C and represent the most likely norm. The part numbers in this table represent both the Q1 and non-Q1 versions of the respective parts. Includes the bond wires, RDSON from VIN pin to SW pin. Current limit at 0% duty cycle. May be lower at higher duty cycle or input voltages below 6 V. Bias currents flow into pin. Submit Documentation Feedback Copyright (c) 2009-2017, Texas Instruments Incorporated Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 www.ti.com SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 Electrical Characteristics (continued) Specifications are for TJ = 25C unless otherwise specified. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 12 V.(1)(2)(3) PARAMETER VFB FB Pin reference voltage tON(min) Minimum ON-time TEST CONDITIONS TJ = -40C to 125C See Minimum OFF-time X option, VFB = 0.5 V Switching frequency 0.747 150 110 TJ = -40C to 125C 370 104 TJ = -40C to 125C 200 Maximum duty cycle Y option On threshold VUVP Undervoltage lockout thresholds Off threshold Device ON V SHDN Shutdown threshold Device OFF VSHDN = 2.3 V (6) ISHDN Shutdown pin input bias current VSHDN = 0 V (7) UNIT V ns ns ns 550 TJ = -40C to 125C 325 750 kHz 1.5 MHz 140 1.25 TJ = -40C to 125C 0.95 Y option, VFB = 0 V X option 0.782 TJ = -40C to 125C X option, VFB = 0 V Y option, VFB = 0.5 V DMAX MAX 100 (7) Y option fSW TYP 0.765 X option tOFF(min) MIN 0.35 94% TJ = -40C to 125C 88% TJ = -40C to 125C 81% TJ = -40C to 125C 4.4 87% 3.7 V 3.5 TJ = -40C to 125C 3.25 1 TJ = -40C to 125C 2.3 V 0.9 TJ = -40C to 125C 0.3 0.05 TJ = -40C to 125C 1.5 0.02 TJ = -40C to 125C A 1.5 Minimum ON-time specified by design and simulation. Copyright (c) 2009-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 5 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 www.ti.com 6.6 Typical Characteristics The part numbers in this section represent both the Q1 and non-Q1 versions of the respective parts. 100 100 VIN = 12V VIN = 12V 80 EFFICIENCY (%) EFFICIENCY (%) 80 VIN = 36V 60 VIN = 24V 40 20 0 0.0 VIN = 36V 60 VIN = 24V 40 20 0.1 0.2 0.3 0.4 0.5 0 0.0 0.6 0.1 LM2842X 0.2 0.3 LOAD CURRENT (A) LOAD CURRENT (A) VOUT = 3.3 V LM2841X Figure 1. Efficiency vs Load Current VOUT = 3.3 V Figure 2. Efficiency vs Load Current 100 VIN = 12V 90 EFFICIENCY (%) 80 VIN = 24V 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 LOAD CURRENT (mA) LM2840X VOUT = 8 V X option Figure 3. Efficiency vs Load Current Figure 4. Switching Frequency vs Temperature SWITCH CURRENT LIMIT (mA) 800 600 400 200 0 1.0 1.6 2.2 2.8 3.4 4.0 SHDN PIN VOLTAGE (V) Soft-Start Implementation Figure 5. Input UVLO Voltage vs Temperature 6 Submit Documentation Feedback LM284[0,1] Figure 6. Switch Current Limit vs SHDN Pin Voltage Copyright (c) 2009-2017, Texas Instruments Incorporated Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 www.ti.com SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 Typical Characteristics (continued) The part numbers in this section represent both the Q1 and non-Q1 versions of the respective parts. SWITCH CURRENT LIMIT (A) 1.2 1.0 0.9 0.7 0.6 0.4 1.1 1.7 2.3 2.8 3.4 4.0 SHDN PIN VOLTAGE (V) Soft-Start Implementation LM2842 Figure 7. Switch Current Limit vs SHDN Pin Voltage Copyright (c) 2009-2017, Texas Instruments Incorporated Figure 8. SHDN Pin Current vs SHDN Pin Voltage Submit Documentation Feedback Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 7 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 www.ti.com 7 Detailed Description 7.1 Overview The LM284x and LM284x-Q1 SIMPLE SWITCHER(R) regulators are easy-to-use, non-synchronous, step-down DC-DC converters with a wide input voltage range up to 42 V. The devices are capable of delivering up to 100mA, 300-mA, or 600-mA DC load current with excellent line and load regulation. These devices are available in fixed frequency of 550 kHz and 1.25 MHz. The family requires few external components, and the pin arrangement was designed for simple, optimum PCB layout. 7.2 Functional Block Diagram CB + + OSC SET FB + PWM Comp Error Amp + Bandgap VIN Max Duty Cycle Limit RESET Inductor Current Measurement DC LIMIT BUCK DRIVE FET Driver SW UVLO TSD UVLO Comp Soft Start Thermal Shutdown BG Voltage Regulator GND SHDN Copyright (c) 2016, Texas Instruments Incorporated 7.3 Feature Description 7.3.1 Protection The LM284x and LM284x-Q1 have dedicated protection circuitry running during normal operation to protect the IC. The thermal shutdown circuitry turns off the power device when the die temperature reaches excessive levels. The UVLO comparator protects the power device during supply power start-up and shutdown to prevent operation at voltages less than the minimum input voltage. A gate drive (CB) undervoltage lockout is included to ensure that there is enough gate drive voltage to drive the MOSFET before the device tries to start switching. The LM284x and LM284x-Q1 also feature a shutdown mode decreasing the supply current to approximately 16 A. 8 Submit Documentation Feedback Copyright (c) 2009-2017, Texas Instruments Incorporated Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 www.ti.com SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 7.4 Device Functional Modes 7.4.1 Continuous Conduction Mode The LM284x and LM284x-Q1 contain a current-mode, PWM buck regulator. A buck regulator steps the input voltage down to a lower output voltage. In continuous conduction mode (when the inductor current never reaches zero at steady-state operation), the buck regulator operates in two cycles. The power switch is connected between VIN and SW. In the first cycle of operation the transistor is closed and the diode is reverse biased. Energy is collected in the inductor and the load current is supplied by COUT and the rising current through the inductor. During the second cycle the transistor is open and the diode is forward biased due to the fact that the inductor current cannot instantaneously change direction. The energy stored in the inductor is transferred to the load and output capacitor. The ratio of these two cycles determines the output voltage. The output voltage is defined approximately as shown in Equation 1. D = VOUT / VIN D' = (1 - D) (1) where * D is the duty cycle of the switch (2) D and D' are required for design calculations. Copyright (c) 2009-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 9 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LM284x and LM284x-Q1 are step-down DC-DC regulators. It is typically used to convert a higher DC voltage to a lower DC voltage with a maximum output current of 100 mA, 300 mA, or 600 mA. The following design procedure can be used to select components for the LM284x and LM284x-Q1. Alternately, the WEBENCH(R) software may be used to generate complete designs. When generating a design, the WEBENCH software uses iterative design procedure and accesses comprehensive databases of components. See ti.com for more details 8.2 Typical Applications 8.2.1 Step-Down Converter With 3.3-V Output Voltage L1 15 PH CBOOT LM2840/1/2-ADJL C VIN B SHDN SW 4.5V to 42V IN 3.3V OUT 0.1 PF D1 MA2YD26 R1 FB GND 3.4k R2 1.02k CIN 2.2 PF COUT 10 PF Copyright (c) 2016, Texas Instruments Incorporated Figure 9. Application Circuit, 3.3-V Output at 100 mA 8.2.1.1 Design Requirements Table 1 lists the design parameters for this example. Table 1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input voltage 4.5 V to 42 V Output voltage 3.3 V Output current 0.1 A 8.2.1.2 Detailed Design Procedure 8.2.1.2.1 Custom Design With WEBENCH(R) Tools Click here to create a custom design using the LM2840 device with the WEBENCH(R) Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available: 10 Submit Documentation Feedback Copyright (c) 2009-2017, Texas Instruments Incorporated Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 www.ti.com * * * * SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 Run electrical simulations to see important waveforms and circuit performance Run thermal simulations to understand board thermal performance Export customized schematic and layout into popular CAD formats Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH. This section presents guidelines for selecting external components. 8.2.1.2.2 Setting the Output Voltage The output voltage is set using the feedback pin and a resistor divider connected to the output as shown in Typical Application Circuit. The feedback pin voltage 0.765 V, so the ratio of the feedback resistors sets the output voltage according to Equation 3: VOUT = 0.765 V (1 + (R1 / R2)) (3) Typically R2 is given as 100 to 10 k for a starting value. To solve for R1 given R2 and VOUT, use Equation 4: R1 = R2 ((VOUT / 0.765 V) - 1) (4) 8.2.1.2.3 Inductor Selection The most critical parameters for the inductor are the inductance, peak current, and the DC resistance. The inductance is related to the peak-to-peak inductor ripple current, the input and the output voltages. L= (VIN - VOUT)VOUT VIN x IRIPPLE x fSW (5) A higher value of ripple current reduces inductance, but increases the conductance loss, core loss, and current stress for the inductor and switch devices. It also requires a bigger output capacitor for the same output voltage ripple requirement. A reasonable value is setting the ripple current to be 30% of the DC output current. Because the ripple current increases with the input voltage, the maximum input voltage is always used to determine the inductance. The DC resistance of the inductor is a key parameter for the efficiency. Lower DC resistance is available with a bigger winding area. A good tradeoff between the efficiency and the core size is letting the inductor copper loss equal 2% of the output power. See Selecting Inductors for Buck Converters for more information on selecting inductors. A good starting point for most applications is a 10 H to 22 H with 1.1 A or greater current rating for the LM2842 and LM2842-Q1 or a 0.7 A or greater current rating for the LM284x and LM284x-Q1. Using such a rating enables the device to current limit without saturating the inductor. This is preferable to the device going into thermal shutdown mode and the possibility of damaging the inductor if the output is shorted to ground or other long-term overload. Table 2. Recommended Inductors MANUFACTURER INDUCTOR CONTACT INFORMATION Coilcraft LPS4018, DO1608C, DO3308, and LPO2506 series www.coilcraft.com 800-3222645 MuRata LQH55D and LQH66S series www.murata.com Coiltronics MP2 and MP2A series www.cooperbussman.com 8.2.1.2.4 Input Capacitor A low ESR ceramic capacitor (c)IN) is needed between the VIN pin and GND pin. This capacitor prevents large voltage transients from appearing at the input. Use a 2.2-F to 10-F value with X5R or X7R dielectric. Depending on construction, a ceramic capacitor's value can decrease up to 50% of its nominal value when rated voltage is applied. Consult with the capacitor manufacturer's data sheet for information on capacitor derating over voltage and temperature. 8.2.1.2.5 Output Capacitor The selection of COUT is driven by the maximum allowable output voltage ripple. The output ripple in the constant frequency, PWM mode is approximated by Equation 6. VRIPPLE = IRIPPLE (ESR + (1 / (8fSWCOUT))) Copyright (c) 2009-2017, Texas Instruments Incorporated (6) Submit Documentation Feedback Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 11 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 www.ti.com The ESR term usually plays the dominant role in determining the voltage ripple. Low-ESR ceramic capacitors are recommended. Capacitors in the range of 22 F to 100 F are a good starting point with an ESR of 0.1 or less. Table 3. Recommended Input and Output Capacitors MANUFACTURER CAPACITOR CONTACT INFORMATION Vishay Sprague 293D, 592D, and 595D series tantalum www.vishay.com 407-324-4140 Taiyo Yuden High capacitance MLCC ceramic www.t-yuden.com 408-573-4150 Cornell Dubilier ESRD seriec Polymer Aluminum Electrolytic SPV and AFK series V-chip series www.cde.com MuRata High capacitance MLCC ceramic www.murata.com 8.2.1.2.6 Bootstrap Capacitor A 0.15-F ceramic capacitor or larger is recommended for the bootstrap capacitor (c)BOOT). For applications where the input voltage is less than twice the output voltage a larger capacitor is recommended, generally 0.15 F to 1 F to ensure plenty of gate drive for the internal switches and a consistently low RDSON. 8.2.1.2.7 Soft-Start Components The LM284x and LM284x-Q1 have circuitry that is used in conjunction with the SHDN pin to limit the inrush current on start-up of the DC-DC switching regulator. The SHDN pin in conjunction with a RC filter is used to tailor the soft start for a specific application. When a voltage applied to the SHDN pin is between 0 V and up to 2.3 V it causes the cycle-by-cycle current limit in the power stage to be modulated for minimum current limit at 0 V up to the rated current limit at 2.3 V. Thus controlling the output rise time and inrush current at start-up. The resistor value must be selected so the current injected into the SHDN pin is greater then the leakage current of the SHDN pin (1.5 A) when the voltage at SHDN is equal or greater then 2.3 V. 8.2.1.2.8 Shutdown Operation The SHDN pin of the LM284x and LM284x-Q1 is designed so that it may be controlled using 2.3 V or higher logic signals. If the shutdown function is not to be used the SHDN pin may be tied to VIN. This input should not be allowed to float The maximum voltage to the SHDN pin should not exceed 42 V. If the use of a higher voltage is desired due to system or other constraints it may be used; however, a 100 k or larger resistor is recommended between the applied voltage and the SHDN pin to protect the device. 8.2.1.2.9 Schottky Diode The breakdown voltage rating of the diode (D1) is preferred to be 25% higher than the maximum input voltage. The current rating for the diode must be equal to the maximum output current for best reliability in most applications. In cases where the duty cycle is greater than 50%, the average diode current is lower. In this case it is possible to use a diode with a lower average current rating, approximately (1 - D)IOUT; however, the peak current rating should be higher than the maximum load current. A 0.5-A to 1-A rated diode is a good starting point. 12 Submit Documentation Feedback Copyright (c) 2009-2017, Texas Instruments Incorporated Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 www.ti.com SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 8.2.1.3 Application Curves VIN = 12 V VOUT = 3.3 V T = 1 s/div IOUT = 200 mA Top trace: VOUT, 10 mV/div, AC-Coupled Bottom trace: SW, 5 V/div, DC-Coupled VIN = 12 V VOUT = 3.3 V T = 200 s/div Figure 10. Switching Node and Output Voltage Waveforms VIN = 12 V VOUT = 3.3 V T = 40 s/div IOUT = 300 mA to 200 mA to 300 mA Top trace: VOUT, 20 mV/div, AC-Coupled Bottom trace: IOUT, 100 mA/div, DC-Coupled Figure 11. Load Transient Waveforms IOUT = 50 mA Top trace: VOUT, 1V/div, DC-Coupled Bottom trace: SHDN, 2V/div, DC-Coupled Figure 12. Start-Up Waveform 8.2.2 Other Application Circuits Figure 13 to Figure 16 show application circuit examples using the LM284x and LM284x-Q1 devices. Customers must fully validate and test these circuits before implementing a design based on these examples. Unless otherwise noted, the design procedures in Step-Down Converter With 3.3-V Output Voltage are applicable to these designs. L1 15 PH CBOOT LM2840/1/2-ADJL 7V to 42V IN VIN 0.15 PF D1 MA2YD26 CB SHDN SW GND FB 5V OUT R1 5.62k CIN R2 1.02k 2.2 PF COUT 47 PF Copyright (c) 2016, Texas Instruments Incorporated Figure 13. Step-Down Converter With 5-V Output Voltage Copyright (c) 2009-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 13 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 www.ti.com L1 47 PH CBOOT LM2840/1/2-ADJL 15V to 42V IN VIN CB SHDN SW GND FB 12V OUT 0.15 PF D1 MA2YD26 R1 14.7k R2 1k CIN 2.2 PF COUT 22 PF Copyright (c) 2016, Texas Instruments Incorporated Figure 14. Step-Down Converter With 12-V Output Voltage L1 47 PH CBOOT LM2840/1/2-ADJL 18V to 42V IN VIN CB SHDN SW GND FB 15V OUT 0.15 PF D1 MA2YD26 R1 28k CIN COUT 22 PF R2 1.5k 2.2 PF Copyright (c) 2016, Texas Instruments Incorporated Figure 15. Step-Down Converter With 15-V Output Voltage L1 10 PH CBOOT LM2840/1/2-ADJL 4.5V to 12V IN VIN CB SHDN SW GND FB 0.8V OUT 0.15 PF D1 MA2YD26 R1 30.9 CIN COUT 100 PF R2 787 2.2 PF Copyright (c) 2016, Texas Instruments Incorporated Figure 16. Step-Down Converter With 0.8-V Output Voltage 14 Submit Documentation Feedback Copyright (c) 2009-2017, Texas Instruments Incorporated Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 www.ti.com SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 9 Power Supply Recommendations The LM284x and LM284x-Q1 are designed to operate from an input voltage supply range between 4 V and 42 V. This input supply must be able to withstand the maximum input current and maintain a voltage above 4.5 V. The resistance of the input supply rail must be low enough that an input current transient does not cause a drop at the device supply voltage high enough to cause a false UVLO fault triggering and system reset. If the input supply is located more than a few inches from the device, additional bulk capacitance may be required in addition to the ceramic input capacitors. Copyright (c) 2009-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 15 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 www.ti.com 10 Layout 10.1 Layout Guidelines To reduce problems with conducted noise pickup, the ground side of the feedback network should be connected directly to the GND pin with its own connection. The feedback network, resistors R1 and R2, must be kept close to the FB pin, and away from the inductor to minimize coupling noise into the feedback pin. The input bypass capacitor CIN must be placed close to the VIN pin. This reduces copper trace resistance which effects input voltage ripple of the IC. The inductor L1 must be placed close to the SW pin to reduce EMI and capacitive coupling. The output capacitor, COUT must be placed close to the junction of L1 and the diode D1. The L1, D1, and COUT trace must be as short as possible to reduce conducted and radiated noise and increase overall efficiency. The ground connection for the diode, CIN, and COUT should be as small as possible and tied to the system ground plane in only one spot (preferably at the COUT ground point) to minimize conducted noise in the system ground plane. See Layout Guidelines for Switching Power Supplies for more detail on switching power supply layout considerations. 10.2 Layout Example Figure 17. Recommended Layout 16 Submit Documentation Feedback Copyright (c) 2009-2017, Texas Instruments Incorporated Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 www.ti.com SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 11 Device and Documentation Support 11.1 Custom Design With WEBENCH(R) Tools Click here to create a custom design using the LM2840 device with the WEBENCH(R) Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available: * Run electrical simulations to see important waveforms and circuit performance * Run thermal simulations to understand board thermal performance * Export customized schematic and layout into popular CAD formats * Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH. 11.2 Device Support 11.2.1 Development Support WEBENCH Design Center 11.3 Documentation Support 11.3.1 Related Documentation For related documentation, see the following: * AN-1197 Selecting Inductors for Buck Converters (SNVA038) * AN-1149 Layout Guidelines for Switching Power Supplies (SNVA021) 11.4 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 4. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM2841 Click here Click here Click here Click here Click here LM2842 Click here Click here Click here Click here Click here LM2840 Click here Click here Click here Click here Click here LM2840-Q1 Click here Click here Click here Click here Click here LM2841-Q1 Click here Click here Click here Click here Click here LM2842-Q1 Click here Click here Click here Click here Click here 11.5 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. Copyright (c) 2009-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 17 LM2840-Q1, LM2841-Q1, LM2842-Q1 LM2841, LM2842, LM2840 SNVS540J - MARCH 2009 - REVISED FEBRUARY 2017 www.ti.com 11.6 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.7 Trademarks E2E is a trademark of Texas Instruments. WEBENCH, SIMPLE SWITCHER are registered trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 11.8 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.9 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 18 Submit Documentation Feedback Copyright (c) 2009-2017, Texas Instruments Incorporated Product Folder Links: LM2840-Q1 LM2841-Q1 LM2842-Q1 LM2841 LM2842 LM2840 PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM2840XMK-ADJL/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SE8B LM2840XMKX-ADJL/NOPB ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SE8B LM2840XQMK/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SE9B LM2840YMK-ADJL/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SF1B LM2840YQMK/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SF2B LM2840YQMKX/NOPB ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SF2B LM2841XMK-ADJL/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STFB LM2841XMKX-ADJL/NOPB ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STFB LM2841XQMK/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB1B LM2841YMK-ADJL/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STTB LM2841YMKX-ADJL/NOPB ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STTB LM2841YQMK/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB2B LM2841YQMKX/NOPB ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB2B LM2842XMK-ADJL/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STVB LM2842XMKX-ADJL/NOPB ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STVB LM2842XQMK/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB3B LM2842XQMKX/NOPB ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB3B Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 28-Feb-2017 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM2842YMK-ADJL/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STXB LM2842YMKX-ADJL/NOPB ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 STXB LM2842YQMK/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB4B LM2842YQMKX/NOPB ACTIVE SOT-23-THIN DDC 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SB4B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2017 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM2840, LM2840-Q1, LM2841, LM2841-Q1, LM2842, LM2842-Q1 : * Catalog: LM2840, LM2841, LM2842 * Automotive: LM2840-Q1, LM2841-Q1, LM2842-Q1 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 3-Mar-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ SOT23-THIN DDC 6 1000 178.0 8.4 LM2840XMKX-ADJL/NOP SOTB 23-THIN DDC 6 3000 178.0 LM2840XMK-ADJL/NOPB Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2840XQMK/NOPB SOT23-THIN DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2840YMK-ADJL/NOPB SOT23-THIN DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2840YQMK/NOPB SOT23-THIN DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2840YQMKX/NOPB SOT23-THIN DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2841XMK-ADJL/NOPB SOT23-THIN DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2841XMKX-ADJL/NOP SOTB 23-THIN DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2841XQMK/NOPB SOT23-THIN DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2841YMK-ADJL/NOPB SOT23-THIN DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 SOT- DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2841YMKX-ADJL/NOP Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 3-Mar-2017 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant B 23-THIN LM2841YQMK/NOPB SOT23-THIN DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2841YQMKX/NOPB SOT23-THIN DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842XMK-ADJL/NOPB SOT23-THIN DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842XMKX-ADJL/NOP SOTB 23-THIN DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842XQMK/NOPB SOT23-THIN DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842XQMKX/NOPB SOT23-THIN DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842YMK-ADJL/NOPB SOT23-THIN DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842YMKX-ADJL/NOP SOTB 23-THIN DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842YQMK/NOPB SOT23-THIN DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM2842YQMKX/NOPB SOT23-THIN DDC 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 *All dimensions are nominal Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 3-Mar-2017 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2840XMK-ADJL/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0 SOT-23-THIN DDC 6 3000 210.0 185.0 35.0 LM2840XMKX-ADJL/NOP B LM2840XQMK/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0 LM2840YMK-ADJL/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0 LM2840YQMK/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0 LM2840YQMKX/NOPB SOT-23-THIN DDC 6 3000 210.0 185.0 35.0 LM2841XMK-ADJL/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0 SOT-23-THIN DDC 6 3000 210.0 185.0 35.0 LM2841XQMK/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0 LM2841YMK-ADJL/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0 SOT-23-THIN DDC 6 3000 210.0 185.0 35.0 LM2841YQMK/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0 LM2841YQMKX/NOPB SOT-23-THIN DDC 6 3000 210.0 185.0 35.0 LM2842XMK-ADJL/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0 SOT-23-THIN DDC 6 3000 210.0 185.0 35.0 LM2841XMKX-ADJL/NOP B LM2841YMKX-ADJL/NOP B LM2842XMKX-ADJL/NOP B LM2842XQMK/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0 LM2842XQMKX/NOPB SOT-23-THIN DDC 6 3000 210.0 185.0 35.0 LM2842YMK-ADJL/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0 SOT-23-THIN DDC 6 3000 210.0 185.0 35.0 LM2842YQMK/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0 LM2842YQMKX/NOPB SOT-23-THIN DDC 6 3000 210.0 185.0 35.0 LM2842YMKX-ADJL/NOP B Pack Materials-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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