2SA1203 - Toshiba - Pdf.Support

2SA1203

2011-01-19

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT process)

2SA1203

Audio Frequency Amplifier Applications

• Suitable for output stage of 3 watts amplifier

• Small flat package

• PC = 1.0 to 2.0 W (mounted on a ceramic substrate)

• Complementary to 2SC2883

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Collector-base voltage VCBO −30 V

Collector-emitter voltage VCEO −30 V

Emitter-base voltage VEBO −5 V

Collector current IC −1.5 A

Base current IB −0.3 A

PC 500

Collector power dissipation PC

(Note 1)

1000

Junction temperature Tj 150 °C

Storage temperature range Tstg −55 to 150 °C

Note 1: Mounted on a ceramic substrate (250 mm2 × 0.8 mm t)

Note 2: Using continuously under heavy loads (e.g. the application of

high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to

decrease in the reliability significantly even if the operating conditions (i.e. operating

temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Unit: mm

PW-MINI

JEDEC ―

JEITA SC-62

TOSHIBA 2-5K1A

Weight: 0.05 g (typ.)

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2SA1203

2011-01-19

Electrical Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Collector cut-off current ICBO VCB = −30 V, IE = 0 ― ― −0.1 μA

Emitter cut-off current IEBO VEB = −5 V, IC = 0 ― ― −0.1 μA

Collector-emitter breakdown voltage V (BR) CEO IC = −10 mA, IB = 0 −30 ― ― V

Emitter-base breakdown voltage V (BR) EBO IE = −1 mA, IC = 0 −5 ― ― V

DC current gain

hFE

(Note 3)

VCE = −2 V, IC = −500 mA 100 ― 320

Collector-emitter saturation voltage VCE (sat) IC = −1.5 A, IB = −0.03 A ― ― −2.0 V

Base-emitter voltage VBE VCE = −2 V, IC = −500 mA ― ― −1.0 V

Transition frequency fT VCE = −2 V, IC = −500 mA ― 120 ― MHz

Collector output capacitance Cob VCB = −10 V, IE = 0, f = 1 MHz ― ― 50 pF

Note 3: hFE classification O: 100 to 200, Y: 160 to 320

Marking

Note 4: A line beside a Lot No. identifies the indication of product Labels.

Without a line: [[Pb]]/INCLUDES > MCV

With a line: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS

compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27

January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment.

Part No. (or abbreviation code)

Lot No.

Note 4

Characteristics indicator

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2SA1203

2011-01-19

PC – Ta

Collector current IC (A)

IC – VBE

VCE (sat) – IC

Collector-emitter saturation voltage

VCE (sat) (V)

Collector current IC (mA)

DC current gain hFE

IC – VCE

Collector current IC (mA)

Collector-emitter voltage VCE (V)

Collector current IC (A)

Base-emitter voltage VBE (V)

Safe Operating Area

hFE – IC

Collector current IC (mA)

Ambient temperature Ta (°C)

Collector power dissipation PC (W)

0 −16 −8 −4

−0.8

−1.2

−12

−0.4

Common emitter

Ta = 25°C

IB = −1 mA

−10

−8

−4

−3

−2

−6

Common emitter

VCE = −2 V

−1

500

−10 −300 −3

100

−30 −100

300

1000

Ta = 100°C

−25

3000

−3000−1000

Common emitter

IC/IB = 50

−1

−0.5

−10 −300 −3

−0.1

−0.01

−30 −100

−0.3

−1

−0.05

−0.03

−3

−3000−1000

Ta = 100°C

−25

0 −1.6 −0.8−0.4

−0.8

−1.6

Common emitter

VCE = −2 V

−1.2

−0.4

−2.0

Ta = 100°C 25 −25

*: Single nonrepetitive pulse

Ta = 25°C

Curves must be derated

linearly with increase in

temperature.

Tested without a substrate.

−0.1 −3 −0.3 −30 −100

−30

−10

−100

−5

−50

IC max (pulse)*

IC max

(continuous) 100 ms*

1 ms*

10 ms*

VCEO max

−10 −1

−300

−3000

−1000

−500

DC o

eration

Ta = 25°C

0.6

0.2

0.8

0.4

1.2

1.0

120 80 100 40 6020 140 160

(1) Mounted on a ceramic

substrate (250 mm2 × 0.8 mm t)

(2) No heat sink

(1)

(2)

1 s*

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2SA1203

2011-01-19

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively “Product”) without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such

design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,

diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating

parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR

APPLICATIONS.

• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.

Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or

reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious

public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used

in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling

equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric

power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this

document.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product

or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.

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