DS91C180TMAX - Texas Instruments High-Performance Analog

CLK1A (8 KHz)

CLK1B (8 KHz)

CLK2A (19.44 MHz)

CLK2B (19.44 MHz)

CLK3A (User Defined up to 100 MHz)

CLK3B (User Defined up to 100 MHz)

80W RT

ATCA Backplane

Slot Card N Slot Card N+1

MLVDS Drivers/Receivers

DS91C180, DS91D180

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SNLS158M –MARCH 2006–REVISED APRIL 2013

DS91D180/DS91C180 100 MHz M-LVDS Line Driver/Receiver Pair

Check for Samples: DS91C180,DS91D180

1FEATURES DESCRIPTION

The DS91D180 and DS91C180 are 100 MHz M-

2• DC to 100+ MHz / 200+ Mbps Low Power, Low LVDS (Multipoint Low Voltage Differential Signaling)

EMI Operation line driver/receiver pairs designed for applications

• Optimal for ATCA, uTCA Clock Distribution that utilize multipoint networks (e.g. clock distribution

Networks in ATCA and uTCA based systems). M-LVDS is a

bus interface standard (TIA/EIA-899) optimized for

• Meets or Exceeds TIA/EIA-899 M-LVDS multidrop networks. Controlled edge rates, tight input

Standard receiver thresholds and increased drive strength are

• Wide Input Common Mode Voltage for sone of the key enhancments that make M-LVDS

Increased Noise Immunity devices an ideal choice for distributing signals via

• DS91D180 has Type 1 Receiver Input multipoint networks.

• DS91C180 has Type 2 Receiver Input for Fail- The DS91D180/DS91C180 driver input accepts

Safe Functionality LVTTL/LVCMOS signals and converts them to

differential M-LVDS signal levels. The

• Industrial Temperature Range DS91D180/DS91C180 receiver accepts low voltage

• Space Saving SOIC-14 Package (JEDEC MS- differential signals (LVDS, B-LVDS, M-LVDS, LV-

012) PECL and CML) and converts them to 3V LVCMOS

signals. The DS91D180 device has a M-LVDS type 1

receiver input with no offset.The DS91C180 device

has a type 2 receiver input which enable failsafe

functionality.

Typical Application in an ATCA Clock Distribution Network

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

xxx

High High

Low Low

0 V

2.4 V

-2.4 V

50 mV

-50 mV

150 mV

Transition Region

Type 1 Type 2

VID

DS91C180, DS91D180

SNLS158M –MARCH 2006–REVISED APRIL 2013

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Figure 1. Connection Diagram

Top View

See Package Number D0014A

Logic Diagram

M-LVDS Receiver Types

The EIA/TIA-899 M-LVDS standard specifies two different types of receiver input stages. A type 1 receiver has a

conventional threshold that is centered at the midpoint of the input amplitude, VID/2. A type 2 receiver has a built

in offset that is 100mV greater than VID/2. The type 2 receiver offset acts as a failsafe circuit where open or short

circuits at the input will always result in the output stage being driven to a low logic state.

Figure 2. M-LVDS Receiver Input Thresholds

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Product Folder Links: DS91C180 DS91D180

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SNLS158M –MARCH 2006–REVISED APRIL 2013

Absolute Maximum Ratings (1)(2)

Supply Voltage, VCC −0.3V to +4V

Control Input Voltages −0.3V to (VCC + 0.3V)

Driver Input Voltage −0.3V to (VCC + 0.3V)

Driver Output Voltages −1.8V to +4.1V

Receiver Input Voltages −1.8V to +4.1V

Receiver Output Voltage −0.3V to (VCC + 0.3V)

Maximum Package Power Dissipation at +25°C SOIC Package 1.1 W

Derate SOIC Package 8.8 mW/°C above +25°C

Thermal Resistance (4-Layer, 2 oz. Cu, JEDEC) θJA 113.7 °C/W

θJC 36.9 °C/W

Maximum Junction Temperature 150°C

Storage Temperature Range −65°C to +150°C

Lead Temperature (Soldering, 4 seconds) 260°C

ESD Ratings: (HBM 1.5kΩ, 100pF) ≥5 kV

(EIAJ 0Ω, 200pF) ≥250 V

(CDM 0Ω, 0pF) ≥1000 V

(1) “Absolute Maximum Ratings” are those beyond which the safety of the device cannot be ensured. They are not meant to imply that the

device should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device operation.

(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

Recommended Operating Conditions Min Typ Max Units

Supply Voltage, VCC 3.0 3.3 3.6 V

Voltage at Any Bus Terminal (Separate or Common-Mode) −1.4 +3.8 V

Differential Input Voltage VID 2.4 V

High Level Input Voltage VIH 2.0 VCC V

Low Level Input Voltage VIL 0 0.8 V

Operating Free Air Temperature TA−40 +25 +85 °C

Electrical Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified. (1)(2)(3)(4)

Symbol Parameter Conditions Min Typ Max Units

M-LVDS Driver

|VYZ| Differential output voltage magnitude RL= 50Ω, CL= 5pF 480 650 mV

Figure 3 and Figure 5

ΔVYZ Change in differential output voltage magnitude −50 0 +50 mV

between logic states

VOS(SS) Steady-state common-mode output voltage RL= 50Ω, CL= 5pF 0.3 1.8 2.1 V

Figure 3 and Figure 4

|ΔVOS(SS)| Change in steady-state common-mode output voltage 0 +50 mV

between logic states

VOS(PP) Peak-to-peak common-mode output voltage (VOS(pp) @ 500KHz clock) 143 mV

VY(OC) Maximum steady-state open-circuit output voltage Figure 6 0 2.4 V

VZ(OC) Maximum steady-state open-circuit output voltage 0 2.4 V

VP(H) Voltage overshoot, low-to-high level output RL= 50Ω, CL= 5pF, 1.2VSS V

CD= 0.5pF

VP(L) Voltage overshoot, high-to-low level output −0.2VSS V

Figure 8 and Figure 9(5)

IIH High-level input current (LVTTL inputs) VIH = 2.0V -15 15 μA

(1) All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless

otherwise specified.

(2) All typicals are given for VCC = 3.3V and TA= 25°C.

(3) The algebraic convention, in which the least positive (most negative) limit is designated as minimum, is used in this datasheet.

(4) CLincludes fixture capacitance and CDincludes probe capacitance.

(5) Not production tested. Ensured by a statistical analysis on a sample basis at the time of characterization.

Product Folder Links: DS91C180 DS91D180

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Electrical Characteristics (continued)

Over recommended operating supply and temperature ranges unless otherwise specified. (1)(2)(3)(4)

Symbol Parameter Conditions Min Typ Max Units

IIL Low-level input current (LVTTL inputs) VIL = 0.8V -15 15 μA

VIKL Input Clamp Voltage (LVTTL inputs) IIN = -18 mA -1.5 V

IOS Differential short-circuit output current Figure 7 -43 43 mA

M-LVDS Receiver

VIT+ Positive-going differential input voltage threshold See Function Tables Type 1 20 50 mV

Type 2 94 150 mV

VIT−Negative-going differential input voltage threshold See Function Tables Type 1 −50 20 mV

Type 2 50 94 mV

VOH High-level output voltage IOH =−8mA 2.4 2.7 V

VOL Low-level output voltage IOL = 8mA 0.28 0.4 V

IOZ TRI-STATE output current VO= 0V or 3.6V −10 10 μA

IOSR Short circuit Rrceiver output current (LVTTL Output) VO= 0V -90 -48 mA

M-LVDS Bus (Input and Output) Pins

IA, IYReceiver input or driver high-impedance output VA,Y = 3.8V, VB,Z = 1.2V, 32 µA

current DE = GND

VA,Y = 0V or 2.4V, VB,Z = 1.2V, DE −20 +20 µA

= GND

VA,Y =−1.4V, VB,Z = 1.2V, −32 µA

DE = GND

IB, IZReceiver input or driver high-impedance output VB,Z = 3.8V, VA,Y = 1.2V, 32 µA

current DE = GND

VB,Z = 0V or 2.4V, VA,Y = 1.2V, DE −20 +20 µA

= GND

VB,Z =−1.4V, VA,Y = 1.2V, −32 µA

DE = GND

IAB, IYZ Receiver input or driver high-impedance output VA,Y = VB,Z,−1.4V ≤V≤3.8V, DE −4 +4 µA

differential current (IA−IBor IY−IZ) = GND

IA(OFF), Receiver input or driver high-impedance output VA,Y = 3.8V, VB,Z = 1.2V,

IY(OFF) power-off current DE = 0V 32 µA

0V ≤VCC ≤1.5V

VA,Y = 0V or 2.4V, VB,Z = 1.2V,

DE = 0V −20 +20 µA

0V ≤VCC ≤1.5V

VA,Y =−1.4V, VB,Z = 1.2V,

DE = 0V −32 µA

0V ≤VCC ≤1.5V

IB(OFF), Receiver input or driver high-impedance output VB,Z = 3.8V, VA,Y = 1.2V,

IZ(OFF) power-off current DE = 0V 32 µA

0V ≤VCC ≤1.5V

VB,Z = 0V or 2.4V, VA,Y = 1.2V,

DE = 0V −20 +20 µA

0V ≤VCC ≤1.5V

VB,Z =−1.4V, VA,Y = 1.2V,

DE = 0V −32 µA

0V ≤VCC ≤1.5V

IAB(OFF), Receiver input or driver high-impedance output VA,Y = VB,Z,−1.4V ≤V≤3.8V,

IYZ(OFF) power-off differential current DE = 0V −4 +4 µA

(IA(OFF) −IB(OFF) or IY(OFF) −IZ(OFF)) 0V ≤VCC ≤1.5V

CA, CBReceiver input capacitance VCC = OPEN 5.1 pF

CY, CZDriver output capacitance 8.5 pF

CAB Receiver input differential capacitance 2.5 pF

CYZ Driver output differential capacitance 5.5 pF

Product Folder Links: DS91C180 DS91D180

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SNLS158M –MARCH 2006–REVISED APRIL 2013

Electrical Characteristics (continued)

Over recommended operating supply and temperature ranges unless otherwise specified. (1)(2)(3)(4)

Symbol Parameter Conditions Min Typ Max Units

CA/B, Receiver input or driver output capacitance balance 1.0

CY/Z (CA/CBor CY/CZ)

SUPPLY CURRENT (VCC)

ICCD Driver Supply Current RL= 50Ω, DE = VCC, RE = VCC 17 29.5 mA

ICCZ TRI-STATE Supply Current DE = GND, RE = VCC 7 9.0 mA

ICCR Receiver Supply Current DE = GND, RE = GND 14 18.5 mA

ICCB Supply Current, Driver and Receiver Enabled DE = VCC, RE = GND 20 29.5 mA

Switching Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified. (1) (2)

Symbol Parameter Conditions Min Typ Max Units

DRIVER AC SPECIFICATION

tPLH Differential Propagation Delay Low to High RL= 50Ω, CL= 5 pF, 1.0 3.4 5.5 ns

tPHL Differential Propagation Delay High to Low CD= 0.5 pF 1.0 3.1 5.5 ns

tSKD1 (tsk(p)) Pulse Skew |tPLHD −tPHLD|(3) (4) Figure 8 and Figure 9 300 420 ps

tSKD3 Part-to-Part Skew (5) (4) 1.9 ns

tTLH (tr) Rise Time (4) 1.0 1.8 3.0 ns

tTHL (tf) Fall Time (4) 1.0 1.8 3.0 ns

tPZH Enable Time (Z to Active High) RL= 50Ω, CL= 5 pF, 8 ns

tPZL Enable Time (Z to Active Low ) CD= 0.5 pF 8 ns

tPLZ Disable Time (Active Low to Z) Figure 10 and Figure 11 8 ns

tPHZ Disable Time (Active High to Z) 8 ns

tJIT Random Jitter, RJ (4) 100MHz clock pattern(6) 2.5 5.5 psrms

fMAX Maximum Data Rate 200 Mbps

RECEIVER AC SPECIFICATION

tPLH Propagation Delay Low to High CL= 15 pF 2.0 4.7 7.5 ns

tPHL Propagation Delay High to Low Figure 12 Figure 13 and Figure 14 2.0 5.3 7.5 ns

tSKD1 (tsk(p)) Pulse Skew |tPLHD −tPHLD|(3)(4) 0.6 1.9 ns

tSKD3 Part-to-Part Skew (5)(4) 1.5 ns

tTLH (tr) Rise Time(4) 0.5 1.2 3.0 ns

tTHL (tf) Fall Time(4) 0.5 1.2 3.0 ns

tPZH Enable Time (Z to Active High) RL= 500Ω, CL= 15 pF 10 ns

tPZL Enable Time (Z to Active Low) Figure 15 and Figure 16 10 ns

tPLZ Disable Time (Active Low to Z) 10 ns

tPHZ Disable Time (Active High to Z) 10 ns

fMAX Maximum Data Rate 200 Mbps

(1) All typicals are given for V = 3.3V and TA= 25°C.

(2) CLincludes fixture capacitance and CDincludes probe capacitance.

(3) tSKD1, |tPLHD −tPHLD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative

going edge of the same channel.

(4) Not production tested. Ensured by a statistical analysis on a sample basis at the time of characterization.

(5) tSKD3, Part-to-Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This

specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range.

(6) Stimulus and fixture jitter has been subtracted.

Product Folder Links: DS91C180 DS91D180

~ 2.1V

~ 1.5V

'VOS(SS)

VOS(PP)

VOS

DS91C180, DS91D180

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Test Circuits and Waveforms

Figure 3. Differential Driver Test Circuit

Figure 4. Differential Driver Waveforms

Figure 5. Differential Driver Full Load Test Circuit

Figure 6. Differential Driver DC Open Test Circuit

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SNLS158M –MARCH 2006–REVISED APRIL 2013

Figure 7. Differential Driver Short-Circuit Test Circuit

Figure 8. Driver Propagation Delay and Transition Time Test Circuit

Figure 9. Driver Propagation Delays and Transition Time Waveforms

Figure 10. Driver TRI-STATE Delay Test Circuit

Product Folder Links: DS91C180 DS91D180

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Figure 11. Driver TRI-STATE Delay Waveforms

Figure 12. Receiver Propagation Delay and Transition Time Test Circuit

Figure 13. Type 1 Receiver Propagation Delay and Transition Time Waveforms

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SNLS158M –MARCH 2006–REVISED APRIL 2013

Figure 14. Type 2 Receiver Propagation Delay and Transition Time Waveforms

Figure 15. Receiver TRI-STATE Delay Test Circuit

Figure 16. Receiver TRI-STATE Delay Waveforms

Product Folder Links: DS91C180 DS91D180

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FUNCTION TABLES

Table 1. DS91D180/DS91C180 Transmitting(1)

Inputs Outputs

DE D Z Y

2.0V 2.0V L H

2.0V 0.8V H L

0.8V X Z Z

(1) X — Don't care condition

Z — High impedance state

Table 2. DS91D180 Receiving(1)

Inputs Output

RE A −B R

0.8V ≥+0.05V H

0.8V ≤ −0.05V L

0.8V 0V X

2.0V X Z

(1) X — Don't care condition

Z — High impedance state

Table 3. DS91C180 Receiving(1)

Inputs Output

RE A −B R

0.8V ≥+0.15V H

0.8V ≤+0.05V L

0.8V 0V L

2.0V X Z

(1) X — Don't care condition

Z — High impedance state

Table 4. DS91D180 Receiver Input Threshold Test Voltages(1)

Applied Voltages Resulting Differential Input Voltage Resulting Common-Mode Input Receiver Output

Voltage

VIA VIB VID VIC R

2.400V 0.000V 2.400V 1.200V H

0.000V 2.400V −2.400V 1.200V L

3.800V 3.750V 0.050V 3.775V H

3.750V 3.800V −0.050V 3.775V L

−1.400V −1.350V −0.050V −1.375V H

−1.350V −1.400V 0.050V −1.375V L

(1) H — High Level

L — Low Level

Output state assumes that the receiver is enabled (RE = L)

Product Folder Links: DS91C180 DS91D180

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SNLS158M –MARCH 2006–REVISED APRIL 2013

Table 5. DS91C180 Receiver Input Threshold Test Voltages(1)

Applied Voltages Resulting Differential Input Voltage Resulting Common-Mode Input Receiver Output

Voltage

VIA VIB VID VIC R

2.400V 0.000V 2.400V 1.200V H

0.000V 2.400V −2.400V 1.200V L

3.800V 3.650V 0.150V 3.725V H

3.800V 3.750V 0.050V 3.775V L

−1.250V −1.400V 0.150V −1.325V H

−1.350V −1.400V 0.050V −1.375V L

(1) H — High Level

L — Low Level

Output state assumes that the receiver is enabled (RE = L)

PIN DESCRIPTIONS

Pin No. Name Description

1, 8 NC No connect.

2 R Receiver output pin

3 RE Receiver enable pin: When RE is high, the receiver is disabled. When RE is low or open, the

receiver is enabled.

4 DE Driver enable pin: When DE is low, the driver is disabled. When DE is high, the driver is enabled.

5 D Driver input pin

6, 7 GND Ground pin

9 Y Non-inverting driver output pin

10 Z Inverting driver output pin

11 B Inverting receiver input pin

12 A Non-inverting receiver input pin

13, 14 VCC Power supply pin, +3.3V ± 0.3V

Product Folder Links: DS91C180 DS91D180

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REVISION HISTORY

Changes from Revision L (April 2013) to Revision M Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 11

Product Folder Links: DS91C180 DS91D180

PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

DS91C180TMA/NOPB ACTIVE SOIC D 14 55 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS91C180

TMA

DS91C180TMAX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS91C180

TMA

DS91D180TMA NRND SOIC D 14 55 TBD Call TI Call TI -40 to 85 DS91D180

TMA

DS91D180TMA/NOPB ACTIVE SOIC D 14 55 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS91D180

TMA

DS91D180TMAX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS91D180

TMA

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 2

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

DS91C180TMAX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1

DS91D180TMAX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

DS91C180TMAX/NOPB SOIC D 14 2500 367.0 367.0 35.0

DS91D180TMAX/NOPB SOIC D 14 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 2

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DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

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