EC3SMA-10.000M TR
EC3SM A -10.000M TR
Series
4.0mm Epoxy Base SMD Crystal
Frequency Tolerance/Stability
±50ppm at 25°C, ±100ppm over -20°C to +70°C
Mode of Operation
AT-Cut Fundamental
Packaging Options
Tape and Reel
Nominal Frequency
10.000MHz
Load Capacitance
18pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency 10.000MHz
Frequency Tolerance/Stability ±50ppm at 25°C, ±100ppm over -20°C to +70°C
Aging at 25°C ±5ppm/year Maximum
Load Capacitance 18pF Parallel Resonant
Shunt Capacitance (C0) 7pF Maximum
Equivalent Series Resistance 70 Ohms Maximum
Mode of Operation AT-Cut Fundamental
Drive Level 1mWatts Maximum
Storage Temperature Range -40°C to +85°C
Insulation Resistance 500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test MIL-STD-883, Method 1014 Condition A
Gross Leak Test MIL-STD-883, Method 1014 Condition C
Mechanical Shock MIL-STD-202, Method 213 Condition C
Resistance to Soldering Heat MIL-STD-202, Method 210
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010
Vibration MIL-STD-883, Method 2007 Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
MARKING
ORIENTATION
4.95
MAX
12.5
MAX
1.3 ±0.1
(x4) 9.0 ±0.1
4.0
MAX
1.2 ±0.1
2.0 REF
1 2
4 3
PIN CONNECTION
1 Crystal
2 Connected to Pin 3
3 Connected to Pin 2
4 Crystal
LINE MARKING
1E10.000
E=Ecliptek Designator
www.ecliptek.com | Specification Subject to Change Without Notice | Rev R 2/19/2010 | Page 1 of 4
EC3SMA-10.000M TR
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
6.7
1.3
2.2 (X4)
2.3 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev R 2/19/2010 | Page 2 of 4
DIA 50 MIN
DIA 20.2 MIN
DIA 13.0 ±0.2
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.5 MIN
Tape & Reel Dimensions
*Compliant to EIA 481A
EC3SMA-10.000M TR
24.0 ±0.3
11.5 ±0.1
10.75 ±0.10
4.0 ±0.1
2.0 ±0.1
12.0 ±0.1 5.4 ±0.1
DIA 1.5 ±0.1
12.5
±0.1
0.40 ±0.05
4.2 ±0.1
30.4 MAX
360 MAX
Quantity Per Reel: 1,000 units
24.4 +2.0/-0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev R 2/19/2010 | Page 3 of 4
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EC3SMA-10.000M TR
Low Temperature Infrared/Convection 225°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 30 - 60 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)225°C Maximum
Target Peak Temperature (TP Target) 225°C Maximum 2 Times
Time within 5°C of actual peak (tp)80 seconds Maximum 2 Times
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev R 2/19/2010 | Page 4 of 4
