BAT54XV2T1H - ON SEMICONDUCTOR

September, 2009 − Rev. 5

1Publication Order Number:

BAT54XV2T1/D

BAT54XV2T1

Schottky Barrier Diodes

These Schottky barrier diodes are designed for high−speed

switching applications, circuit protection, and voltage clamping.

Extremely low forward voltage reduces conduction loss. Miniature

surface mount package is excellent for hand−held and portable

applications where space is limited.

Features

•Extremely Fast Switching Speed

•Low Forward Voltage − 0.35 V (Typ) @ IF = 10 mA

•Pb−Free Package is Available

MAXIMUM RATINGS (TJ = 125°C unless otherwise noted)

Rating Symbol Value Unit

Reverse Voltage VR30 V

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Total Device Dissipation FR−5 Board,

(Note 1) TA = 25°C

Derate above 25°C

PD200

1.57

mW/°C

Thermal Resistance,

Junction−to−Ambient

RJA 635 °C/W

Junction and Storage Temperature TJ, Tstg −55 to 125 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−4 Minimum Pad.

30 VOLT

SILICON HOT−CARRIER

DETECTOR AND SWITCHING

DIODES

Preferred devices are recommended choices for future use

and best overall value.

CATHODE

ANODE

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SOD−523

CASE 502

PLASTIC

Device Package Shipping†

ORDERING INFORMATION

BAT54XV2T1 SOD−523 3000 / Tape & Reel

MARKING DIAGRAM

BAT54XV2T1G SOD−523

(Pb−Free)

3000 / Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

JV = Device Code

M = Date Code*

G= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

JVM G

BAT54XV2T5G SOD−523

(Pb−Free)

8000 / Tape & Reel

BAT54XV2T1

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ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

Reverse Breakdown Voltage

(IR = 10 A)

V(BR)R 30 − − V

Total Capacitance

(VR = 1.0 V, f = 1.0 MHz)

CT−7.6 10 pF

Reverse Leakage

(VR = 25 V)

IR−0.5 2.0 A

Forward Voltage

(IF = 0.1 mA)

VF−0.22 0.24 V

Forward Voltage

(IF = 1.0 mA)

VF−0.29 0.32 V

Forward Voltage

(IF = 10 mA)

VF−0.35 0.40 V

Forward Voltage

(IF = 30 mA)

VF−0.41 0.5 V

Forward Voltage

(IF = 100 mA)

VF−0.52 0.8 V

Reverse Recovery Time

(IF = IR = 10 mA, IR(REC) = 1.0 mA) Figure 1

trr − − 5.0 ns

Forward Current (DC) IF− − 200 mA

Repetitive Peak Forward Current IFRM − − 300 mA

Non−Repetitive Peak Forward Current

(t < 1.0 s)

IFSM − − 600 mA

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.

Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.

Notes: 3. tp » trr

+10 V 2 k

820 

0.1 F

DUT

100 H

0.1 F

50  Output

Pulse

Generator

50  Input

Sampling

Oscilloscope

tpt

10%

90%

trr t

iR(REC) = 1 mA

OUTPUT PULSE

(IF = IR = 10 mA; measured

at iR(REC) = 1 mA)

INPUT SIGNAL

Figure 1. Recovery Time Equivalent Test Circuit

BAT54XV2T1

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100

0.0 0.1

, FORWARD VOLTAGE (VOLTS)

0.2 0.3 0.4 0.5

1.0

0.1

85°C

VR, REVERSE VOLTAGE (VOLTS)

1.0

0.1

0.01 510152025

VR, REVERSE VOLTAGE (VOLTS)

051015 30

Figure 2. Forward Voltage Figure 3. Leakage Current

Figure 4. Total Capacitance

−40°C

25°C

TA = 150°C

TA = 125°C

TA = 85°C

TA = 25°C

0.6

−55°C

150°C

125°C

100

1000

2520

IR, REVERSE CURRENT (A)

, FORWARD CURRENT (mA)

, TOTAL CAPACITANCE (pF)

BAT54XV2T1

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PACKAGE DIMENSIONS

SOD−523

CASE 502−01

ISSUE D

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.40

0.0157

0.40

0.0157

1.40

0.0547

ǒmm

inchesǓ

SCALE 10:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,

1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM

THICKNESS OF BASE MATERIAL.

−T−

SEATING

PLANE

−X−

−Y−

0.08 (0.003) X Y

DIM MIN NOM MAX

MILLIMETERS

D1.10 1.20 1.30

E0.70 0.80 0.90

A0.50 0.60 0.70

b0.25 0.30 0.35

c0.07 0.14 0.20

L0.15 0.20 0.25

H1.50 1.60 1.70

0.043 0.047 0.051

0.028 0.032 0.035

0.020 0.024 0.028

0.010 0.012 0.014

0.0028 0.0055 0.0079

0.006 0.008 0.010

0.059 0.063 0.067

MIN NOM MAX

INCHES

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

BAT54XV2T1/D

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