LPC11U35FBD64/401 - NXP

1. General description

The LPC11U3x are an ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for

8/16-bit microcontroller applications, offering performance, low power, simple instruction

set and memory addressing together with reduced code size compared to existing 8/16 -bit

architectures.

The LPC11U3x operate at CPU frequencies of up to 50 MHz.

Equipped with a highly flexible and configurable full-speed USB 2.0 device controller, the

LPC11U3x brings unparalleled design flexibility and seamless integration to today’s

demanding connectivity solutions.

The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up

to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I2C-bus

interface, one RS-485/EIA-485 USART with support for synchronous mode and smart

card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC,

and up to 54 general purpose I/O pins.

The I/O Handler is a software library-supported hardware engine that can be used to add

performance, connectivity and flexibility to system designs. It is available on the

LPC11U37HFBD64/401. The I/O Handler can emulate serial interfaces such as UART,

I2C, and I2S with no or very low additional CPU load and can off-load the CPU by

performing processing-intensive functions like DMA transfers in hardware. Software

libraries for multiple I/O Handler applications are available on http://www.LPCware.com.

2. Features and benefits

System:

ARM Cortex-M0 processor, running at frequencies of up to 50 MHz.

ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).

Non-Maskable Interrupt (NMI) inpu t se lectable from several input sources.

System tick timer.

Memory:

Up to 128 kB on-chip flash program memory with sector (4 kB) and page erase

(256 byte) access.

4 kB on-chip EEPROM data memory; byte erasable and byte programmable;

on-chip API support.

Up to 12 kB SRAM data memory.

16 kB boot ROM.

LPC11U3x

32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up

to 12 kB SRAM and 4 kB EEPROM; USB device; USART

Rev. 2 — 25 November 2013 Product data sheet

Product data sheet Rev. 2 — 25 November 2013 2 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

In-System Programming (ISP) and In-Application Programming (IAP) via on-chip

bootloader software.

ROM-based USB drivers. Flash updates via USB supported.

ROM-based 32-bit integer division routines.

Debug options:

Standard JTAG (Joint Test Action Group) test interface for BSDL (Boundary Scan

Description Language).

Serial Wire Debug.

Digital peripherals:

Up to 54 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down

resistors, repeater mode, and open-drain mode.

Up to 8 GPIO pins can be selected as edge and level sensitive interrupt sources.

Two GPIO group ed inte rr upt mo du le s en ab le an inte rr up t ba sed on a

programmable pattern of input states of a group of GPIO pins.

High-current source output driver (20 mA) on one pin.

High-current sink driver (20 mA) on true open-drain pins.

Four general purpose counter/timers with a total of up to 8 capture inputs and 13

match outpu ts.

Programmable Windowed WatchDog Tim er (WWDT) with a dedicated, internal

low-power WatchDog Oscillator (WDO).

Analog peripherals:

10-bit ADC with input multiplexing among eight pins.

Serial interfaces:

USB 2.0 full-speed devic e cont ro ller.

USART with fractional baud rate generation, internal FIFO, a full modem control

handshake interface, and support for RS-485/9-bit mode and synchronous mode.

USART supports an asynchronous smart card interface (ISO 7816-3).

Two SSP controllers with FIFO and multi-protocol capabilities.

I2C-bus interface suppor tin g the full I2C-bu s specifica tion and Fast-mode Plus with

a data rate of up to 1 Mbit/s with multiple address recognition and monitor mode.

I/O Handler for hardware emulation of serial interfaces and DMA; supported through

software libraries. (LPC11U37HFBD64/401 only.)

Clock generation :

Crystal Oscillator with an operating range of 1 MHz to 25 MHz (system oscillator).

12 MHz high-frequency Internal RC oscillator (IRC) that can optionally be used as

a system clock.

Internal low-power, low-frequency W atchDog Oscillator (WDO) with programmable

frequency outp ut .

PLL allows CPU operation up to the maximum CPU rate with the system oscillator

or the IRC as clock sources.

A second, dedicated PLL is provided for USB.

Clock output function with divider that can reflect the crystal oscillator, the main

clock, the IRC, or the watchdog oscillator.

Power control:

Integrated PMU (Power Management Unit) to minimize power consumption during

Sleep, Deep-sleep, Power-down, and Deep power-down modes.

Product data sheet Rev. 2 — 25 November 2013 3 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Power profiles residing in boot ROM provide optimized performance an d minimized

power consumption for any given application through one simple function call.

Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep

power-down.

Processor wake-up fro m Deep-sle ep and Power -down modes via reset, sele ct able

GPIO pins, watchdog interrupt, or USB port activity.

Processor wake-up from Deep power-down mode using one special function pin.

Power-On Reset (POR).

Brownout detect with up to four separate thresholds for interrupt and forced reset.

Unique device serial number for identification.

Single 3.3 V power supply (1.8 V to 3.6 V).

Temperature range 40 C to +85 C.

Available as LQFP64, LQFP48, TFBGA48, and HVQFN33 packa ges.

3. Applications

4. Ordering information

Consumer peripherals Handheld scanners

Medical USB audio devices

Industrial control

Table 1. Ordering information

Type number Package

Name Description Version

LPC11U34F HN33/311 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33

terminals; body 7  7  0.85 mm n/a

LPC11U34FBD48/311 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2

LPC11U34F HN33/421 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33

terminals; body 7  7  0.85 mm n/a

LPC11U34FBD48/421 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2

LPC11U35F HN33/401 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33

terminals; body 7  7  0.85 mm n/a

LPC11U35FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2

LPC11U35FBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2

LPC11U3 5FHI33/501 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33

terminals; body 5  5  0.85 mm n/a

LPC11U35F ET48/501 TFBGA48 plastic thin fine-pitch ball grid array package; 48 balls; body 4.5  4.5

 0.7 mm SOT1155-2

LPC11U36FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2

LPC11U36FBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2

LPC11U37FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm SOT313-2

LPC11U37HFBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2

LPC11U37FBD64/501 LQFP64 plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2

Product data sheet Rev. 2 — 25 November 2013 4 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

4.1 Ordering options

[1] For general-purpose use.

[2] For I/O Handler use only.

Table 2. Ordering options

Type number

Flash in kB

EEPROM in kB

SRAM0 in kB

USB SRAM in kB

SRAM1 in kB

Total

SRAM in kB[1]

I/O Handler

USART

I2C-bus FM+

SSP

USB device

ADC channels

GPIO pins

LPC11U34FHN33/311 40 4 8 - - 8 no 1 1 2 1 8 26

LPC11U34FBD48/311 40 4 8 - - 8 no 1 1 2 1 8 40

LPC11U34FHN33/421 48 4 8 2 - 10 no 1 1 2 1 8 26

LPC11U34FBD48/421 48 4 8 2 - 10 no 1 1 2 1 8 40

LPC11U35FHN33/401 64 4 8 2 - 10 no 1 1 2 1 8 26

LPC11U35FBD48/401 64 4 8 2 - 10 no 1 1 2 1 8 40

LPC11U35FBD64/401 64 4 8 2 - 10 no 1 1 2 1 8 54

LPC11U35FHI33/501 64 4 8 2 2[1] 12 no 1 1 2 1 8 26

LPC11U35FET48/501 64 4 8 2 2[1] 12 no 1 1 2 1 8 40

LPC11U36FBD48/401 96 4 8 2 - 10 no 1 1 2 1 8 40

LPC11U36FBD64/401 96 4 8 2 - 10 no 1 1 2 1 8 54

LPC11U37FBD48/401 128 4 8 2 - 10 no 1 1 2 1 8 40

LPC11U37HFBD64/401 128 4 8 2 2[2] 10 yes 1 1 2 1 8 54

LPC11U37FBD64/501 128 4 8 2 2[1] 12 no 1 1 2 1 8 54

Product data sheet Rev. 2 — 25 November 2013 5 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

5. Block diagram

(1) Not available on HVQFN33 packages.

(2) CT16B0_CAP1, CT16B1_CAP1 available on LQFP64 packages only; CT32B0_CAP1 available on TFBGA48, LQFP48, and

LQFP64 packages only; CT32B1_CAP1 available in TFBGA48/LQFP64 packages only.

(3) LPC11U37HFBD64/401 only.

Fig 1. Block dia gram

SRAM

8/10/12 kB

ARM

CORTEX-M0

TEST/DEBUG

INTERFACE

FLASH

40/48/64/96/128 kB

HIGH-SPEED

GPIO

AHB TO APB

BRIDGE

CLOCK

GENERATION,

POWER CONTROL,

SYSTEM

FUNCTIONS

RESET

SWD, JTAG

LPC11U3x

slave

master

slave slave

ROM

16 kB

slave

AHB-LITE BUS

GPIO ports 0/1

I/O

HANDLER(3)

IOH_[20:0]

CLKOUT

IRC, WDO

SYSTEM OSCILLATOR

POR

PLL0 USB PLL

BOD

10-bit ADC

USART/

SMARTCARD INTERFACE AD[7:0]

RXD

TXD

CTS, RTS, DTR

SCLK

GPIO INTERRUPTS

32-bit COUNTER/TIMER 0

CT32B0_MAT[3:0]

CT32B0_CAP[1:0](2)

32-bit COUNTER/TIMER 1

CT32B1_MAT[3:0]

CT32B1_CAP[1:0](2)

DCD, DSR(1), RI(1)

16-bit COUNTER/TIMER 1

WINDOWED WATCHDOG

TIMER

GPIO GROUP0 INTERRUPTS

CT16B1_MAT[1:0]

16-bit COUNTER/TIMER 0

CT16B0_MAT[2:0]

CT16B0_CAP[1:0](2)

CT16B1_CAP[1:0](2)

GPIO pins

GPIO GROUP1 INTERRUPTS

GPIO pins

system bus

SSP0 SCK0, SSEL0,

MISO0, MOSI0

SSP1 SCK1, SSEL1,

MISO1, MOSI1

I2C-BUS

IOCON

SYSTEM CONTROL

PMU

SCL, SDA

XTALIN XTALOUT

USB DEVICE

CONTROLLER

USB_DP

USB_DM

USB_VBUS

USB_FTOGGLE,

USB_CONNECT

002aag345

master

slave

EEPROM

4 kB

Product data sheet Rev. 2 — 25 November 2013 6 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

6. Pinning information

6.1 Pinning

For parts LPC11U34FHN33/311, LPC11U34FHN33/421, LPC11U35FHN33/401, LPC11U35FHI33/501

Fig 2. Pin configuration (HVQFN33)

002aag809

Transparent top view

PIO0_8/MISO0/CT16B0_MAT0

PIO0_20/CT16B1_CAP0

PIO0_2/SSEL0/CT16B0_CAP0

PIO0_9/MOSI0/CT16B0_MAT1

VDD SWCLK/PIO0_10/SCK0/CT16B0_MAT2

XTALOUT PIO0_22/AD6/CT16B1_MAT1/MISO1

XTALIN TDI/PIO0_11/AD0/CT32B0_MAT3

PIO0_1/CLKOUT/CT32B0_MAT2/USB_FTOGGLE TMS/PIO0_12/AD1/CT32B1_CAP0

RESET/PIO0_0 TDO/PIO0_13/AD2/CT32B1_MAT0

PIO1_19/DTR/SSEL1 TRST/PIO0_14/AD3/CT32B1_MAT1

PIO0_3/USB_VBUS

PIO0_4/SCL

PIO0_5/SDA

PIO0_21/CT16B1_MAT0/MOSI1

USB_DM

USB_DP

PIO0_6/USB_CONNECT/SCK0

PIO0_7/CTS

PIO0_19/TXD/CT32B0_MAT1

PIO0_18/RXD/CT32B0_MAT0

PIO0_17/RTS/CT32B0_CAP0/SCLK

VDD

PIO1_15/DCD/CT16B0_MAT2/SCK1

PIO0_23/AD7

PIO0_16/AD5/CT32B1_MAT3/WAKEUP

SWDIO/PIO0_15/AD4/CT32B1_MAT2

817

718

619

520

421

322

223

124

terminal 1

index area

33 VSS

Product data sheet Rev. 2 — 25 November 2013 7 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Fig 3. Pin confi gura tio n (TFBGA48)

002aag810

LPC11U35FET48/501

Transparent top view

24681357

ball A1

index area

Product data sheet Rev. 2 — 25 November 2013 8 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Fig 4. Pin configuration (LQFP48)

LPC11U34FBD48/311

LPC11U34FBD48/421

LPC11U35FBD48/401

LPC11U36FBD48/401

LPC11U37FBD48/401

PIO1_25/CT32B0_MAT1 PIO1_13/DTR/CT16B0_MAT0/TXD

PIO1_19/DTR/SSEL1 TRST/PIO0_14/AD3/CT32B1_MAT1

RESET/PIO0_0 TDO/PIO0_13/AD2/CT32B1_MAT0

PIO0_1/CLKOUT/CT32B0_MAT2/USB_FTOGGLE TMS/PIO0_12/AD1/CT32B1_CAP0

TDI/PIO0_11/AD0/CT32B0_MAT3

XTALIN PIO1_29/SCK0/CT32B0_CAP1

XTALOUT PIO0_22/AD6/CT16B1_MAT1/MISO1

SWCLK/PIO0_10/SCK0/CT16B0_MAT2

PIO0_20/CT16B1_CAP0 PIO0_9/MOSI0/CT16B0_MAT1

PIO0_2/SSEL0/CT16B0_CAP0 PIO0_8/MISO0/CT16B0_MAT0

PIO1_26/CT32B0_MAT2/RXD PIO1_21/DCD/MISO1

PIO1_27/CT32B0_MAT3/TXD PIO1_31

PIO1_20/DSR/SCK1 PIO1_16/RI/CT16B0_CAP0

PIO0_3/USB_VBUS PIO0_19/TXD/CT32B0_MAT1

PIO0_4/SCL PIO0_18/RXD/CT32B0_MAT0

PIO0_5/SDA PIO0_17/RTS/CT32B0_CAP0/SCLK

PIO0_21/CT16B1_MAT0/MOSI1 V

PIO1_23/CT16B1_MAT1/SSEL1 PIO1_15/DCD/CT16B0_MAT2/SCK1

USB_DM PIO0_23/AD7

USB_DP V

PIO1_24/CT32B0_MAT0 PIO0_16/AD5/CT32B1_MAT3/WAKEUP

PIO0_6/USB_CONNECT/SCK0 SWDIO/PIO0_15/AD4/CT32B1_MAT2

PIO0_7/CTS

PIO1_28/CT32B0_CAP0/SCLK

PIO1_22/RI/MOSI1

PIO1_14/DSR/CT16B0_MAT1/RXD

002aag811

Product data sheet Rev. 2 — 25 November 2013 9 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

See Table 3 for the full pin name.

Fig 5. Pin configuration (LQFP64)

LPC11U35FBD64/401

LPC11U36FBD64/401

LPC11U37HFBD64/401

LPC11U37FBD64/501

PIO1_0 VDD

PIO1_25 PIO1_13

PIO1_19 TRST/PIO0_14

RESET/PIO0_0 TDO/PIO0_13

PIO0_1 TMS/PIO0_12

PIO1_7 PIO1_11

VSS TDI/PIO0_11

XTALIN PIO1_29

XTALOUT PIO0_22

VDD PIO1_8

PIO0_20 SWCLK/PIO0_10

PIO1_10 PIO0_9

PIO0_2 PIO0_8

PIO1_26 PIO1_21

PIO1_27 PIO1_2

PIO1_4 VDD

PIO1_1 PIO1_6

PIO1_20 PIO1_16

PIO0_3 PIO0_19

PIO0_4 PIO0_18

PIO0_5 PIO0_17

PIO0_21 PIO1_12

PIO1_17 VDD

PIO1_23 PIO1_15

USB_DM PIO0_23

USB_DP PIO1_9

PIO1_24 VSS

PIO1_18 PIO0_16

PIO0_6 SWDIO/PIO0_15

PIO0_7 PIO1_22

PIO1_28 PIO1_3

PIO1_5 PIO1_14

002aag812

Product data sheet Rev. 2 — 25 November 2013 10 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

6.2 Pin description

Table 3 shows all pins and their assigne d dig ital or analog fu nc tion s in or de r of the GPI O

port number. The default function after reset is listed first. All port pins have internal

pull-up resistors enabled after reset except for the true open-drain pins PIO0_4 and

PIO0_5.

Every port pin has a corresponding IOCON register for programming the digital or analog

function, the pull-up/pull-down configuration, the repeater, and the open-drain modes.

The USART, counter/timer, and SSP functions are available on more than one port pin.

Table 3. Pin description

Symbol

Pin HVQFN33

Pin TFBGA48

Pin LQFP48

Pin LQFP64

Reset

state

[1]

Type Description

RESET/PIO0_0 2 C1 3 4 [2] I; PU I RESET — External reset input with 20 ns glitch filter.

A LOW-going pulse as short as 50 ns on this pin

resets the device, causing I/O ports and peripherals to

take on their default states and processor execution

to begin at address 0. This pin also serves as the

debug select input. LOW level selects the JTAG

boundary scan. HIGH level selects the ARM SWD

debug mode.

- I/O PIO0_0 — General purpose digital input/output pin.

PIO0_1/CLKOUT/

CT32B0_MAT2/

USB_FTOGGLE

3C245[3] I; PU I/O PIO0_1 — General purpose digital input/output pin. A

LOW level on this pin during reset starts the ISP

command handler or the USB device enumeration.

-OCLKOUT — Clockout pin.

-OCT32B0_MAT2 — Match output 2 for 32-bit timer 0.

-OUSB_FTOGGLE — USB 1 ms Start-of-Frame signal.

PIO0_2/SSEL0/

CT16B0_CAP0/IOH_0 8F11013

[3] I; PU I/O PIO0_2 — General purpose digital input/output pin.

- I/O SSEL0 — Slave select for SSP0.

-ICT1 6B0_CAP0 — Capture input 0 for 16-bit timer 0.

- I/O IOH_0 — I/O Handler input/output 0.

LPC11U37HFB D64/401 only.

PIO0_3/USB_VBUS/

IOH_1 9H21419

[3] I; PU I/O PIO0_3 — General purpose digital input/output pin. A

LOW level on this pin during reset starts the ISP

command handler. A HIGH level duri ng reset starts

the USB device enumeration.

-IUSB_VBUS — Monitors the presence of USB bus

power.

- I/O IOH_1 — I/O Handler input/output 1.

LPC11U37HFB D64/401 only.

Product data sheet Rev. 2 — 25 November 2013 11 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

PIO0_4/SCL/IOH_2 10 G3 15 20 [4] I; IA I/O PIO0_4 — General purpose digital input/output pin

(open-drain).

- I/O SCL — I2C-bus clock input/output (open-drain).

High-current sink only if I2C Fast-mode Plus is

selected in the I/O configuration register .

- I/O IOH_2 — I/O Handler input/output 2.

LPC11U37HFB D64/401 only.

PIO0_5/SDA/IOH_3 11 H3 16 21 [4] I; IA I/O PIO0_5 — General purpose digital input/output pin

(open-drain).

- I/O SDA — I2C-bus data input/output (open-drain).

High-current sink only if I2C Fast-mode Plus is

selected in the I/O configuration register .

- I/O IOH_3 — I/O Handler input/output 3.

LPC11U37HFB D64/401 only.

PIO0_6/USB_CONNECT/

SCK0/IOH_4 15 H6 22 29 [3] I; PU I/O PIO0_6 — General purpose digital input/output pin.

-OUSB_CONNECT — Signal used to switch an external

1.5 k resistor under software control. Used with the

SoftConnect USB feature.

- I/O SCK0 — Serial clock for SSP0.

- I/O IOH_4 — I/O Handler input/output 4.

LPC11U37HFB D64/401 only.

PIO0_7/CTS/IOH_5 16 G7 23 30 [5] I; PU I/O PIO0_7 — General purpose digital input/output pin

(high-current output driver).

-ICTS — Clear To Send in put for USART.

- I/O IOH_5 — I/O Handler input/output 5.

(LPC11U37HFB D64/401 only. )

PIO0_8/MISO0/

CT16B0_MAT0/IOH_6 17 F8 27 36 [3] I; PU I/O PIO0_8 — Ge neral purpose digital input/output pin.

- I/O MISO0 — Master In Slave Out for SSP0.

-OCT16B0_MAT0 — Match output 0 for 16-bit timer 0.

- I/O IOH_6 — I/O Handler input/output 6.

(LPC11U37HFB D64/401 only. )

PIO0_9/MOSI0/

CT16B0_MAT1/IOH_7 18 F7 28 37 [3] I; PU I/O PIO0_9 — General purpose digital input/output pin.

- I/O MOSI0 — Master Out Slave In for SSP0.

-OCT16B0_MAT1 — Match output 1 for 16-bit timer 0.

- I/O IOH_7 — I/O Handler input/output 7.

(LPC11U37HFB D64/401 only. )

SWCLK/PIO0_10/SCK0/

CT16B0_MAT2 19 E7 29 38 [3] I; PU I SWCLK — Serial wire clock and test clock TCK for

JTAG interface.

- I/O PIO0_10 — General purpose digital input/output pin.

-OSCK0 — Serial clock for SSP0.

-OCT16B0_MAT2 — Match output 2 for 16-bit timer 0.

Table 3. Pin description

Symbol

Pin HVQFN33

Pin TFBGA48

Pin LQFP48

Pin LQFP64

Reset

state

[1]

Type Description

Product data sheet Rev. 2 — 25 November 2013 12 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

TDI/PIO0_11/AD0/

CT32B0_MAT3 21 D8 32 42 [6] I; PU I TDI — Test Data In for JTAG interface.

- I/O PIO0_11 — General purpose digital input/output pin.

-IAD0 — A/D converter, in put 0.

-OCT32B0_MAT3 — Match output 3 for 32-bit timer 0.

TMS/PIO0_12/AD1/

CT32B1_CAP0 22 C7 33 44 [6] I; PU I TMS — Test Mode Select for JTAG interface.

- I/O PIO_12 — General purpose digital input/output pin.

-IAD1 — A/D converter, in put 1.

-ICT3 2B1_CAP0 — Capture input 0 for 32-bit timer 1.

TDO/PIO0_13/AD2/

CT32B1_MAT0 23 C8 34 45 [6] I; PU O TDO — Test Dat a Out for JTAG interface.

- I/O PIO0_13 — General purpose digital input/output pin.

-IAD2 — A/D converter, in put 2.

-OCT32B1_MAT0 — Match output 0 for 32-bit timer 1.

TRST/PIO0_14/AD3/

CT32B1_MAT1 24 B7 35 46 [6] I; PU I TRST — Test Reset for JTAG interface.

- I/O PIO0_14 — General purpose digital input/output pin.

-IAD3 — A/D converter, in put 3.

-OCT32B1_MAT1 — Match output 1 for 32-bit timer 1.

SWDIO/PIO0_15/AD4/

CT32B1_MAT2 25 B6 39 52 [6] I; PU I/O SWDIO — Serial wire debug input/output.

- I/O PIO0_15 — General purpose digital input/output pin.

-IAD4 — A/D converter, in put 4.

-OCT32B1_MAT2 — Match output 2 for 32-bit timer 1.

PIO0_16/AD5/

CT32B1_MAT3/IOH_8/

WAKEUP

26 A6 40 53 [6] I; PU I/O PIO0_16 — General purpose digital input/output pin.

-IAD5 — A/D converter, in put 5.

-OCT32B1_MAT3 — Match output 3 for 32-bit timer 1.

- I/O IOH_8 — I/O Handler input/output 8.

(LPC11U37HFB D64/401 only. )

-IWAKEUP — Deep power-down mode wake-up pin

with 20 ns glitch filter. Pull this pin HIGH externally

before entering Deep power-down mode, then pull

LOW to exit Deep power-down mode. A LOW-going

pulse as short as 50 ns wakes up the part.

PIO0_17/RTS/

CT32B0_CAP0/SCLK 30 A3 45 60 [3] I; PU I/O PIO0_17 — General purpose digital input/output pin.

-ORTS — Request To Send output for USART.

-ICT3 2B0_CAP0 — Capture input 0 for 32-bit timer 0.

- I/O SCLK — Serial clock input/output for USART in

synchronous mode.

PIO0_18/RXD/

CT32B0_MAT0 31 B3 46 61 [3] I; PU I/O PIO0_18 — General purpose digital input/output pin.

-IRXD — Receiver input for USART. Used in UART ISP

mode.

-OCT32B0_MAT0 — Match output 0 for 32-bit timer 0.

Table 3. Pin description

Symbol

Pin HVQFN33

Pin TFBGA48

Pin LQFP48

Pin LQFP64

Reset

state

[1]

Type Description

Product data sheet Rev. 2 — 25 November 2013 13 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

PIO0_19/TXD/

CT32B0_MAT1 32 B2 47 62 [3] I; PU I/O PIO0_19 — General purpose digital input/output pin.

-OTXD — T ransmitter output for USART. Used in UART

ISP mode.

-OCT32B0_MAT1 — Match output 1 for 32-bit timer 0.

PIO0_20/CT16B1_CAP0 7 F2 9 11 [3] I; PU I/O PIO0_20 — General purpose digital input/output pin.

-ICT1 6B1_CAP0 — Capture input 0 for 16-bit timer 1.

PIO0_21/CT16B1_MAT0/

MOSI1 12 G4 17 22 [3] I; PU I/O PIO0_21 — General purpose digital input/output pin.

-OCT16B1_MAT0 — Match output 0 for 16-bit timer 1.

- I/O MOSI1 — Master Out Slave In for SSP1.

PIO0_22/AD6/

CT16B1_MAT1/MISO1 20 E8 30 40 [6] I; PU I/O PIO0_22 — General purpose digital input/output pin.

-IAD6 — A/D converter, in put 6.

-OCT16B1_MAT1 — Match output 1 for 16-bit timer 1.

- I/O MISO1 — Master In Slave Out for SSP1.

PIO0_23/AD7/IOH_9 27 A5 42 56 [6] I; PU I/O PIO0_23 — General purpose digital input/output pin.

-IAD7 — A/D converter, in put 7.

- I/O IOH_9 — I/O Handler input/output 9.

(LPC11U37HFB D64/401 only. )

PIO1_0/CT32B1_MAT0/

IOH_10 ---1

[3] I; PU I/O PIO1_0 — General purpose digital input/o utput pin.

-OCT32B1_MAT0 — Match output 0 for 32-bit timer 1.

- I/O IOH_10 — I/O Handler input/output 10.

(LPC11U37HFB D64/401 only. )

PIO1_1/CT32B1_MAT1/

IOH_11 ---17

[3] I; PU I/O PIO1_1 — General purpose digital input/o utput pin.

-OCT32B1_MAT1 — Match output 1 for 32-bit timer 1.

- I/O IOH_11 — I/O Handler input/output 11.

(LPC11U37HFB D64/401 only. )

PIO1_2/CT32B1_MAT2/

IOH_12 ---34

[3] I; PU I/O PIO1_2 — General purpose digital input/o utput pin.

-OCT32B1_MAT2 — Match output 2 for 32-bit timer 1.

- I/O IOH_12 — I/O Handler input/output 12.

(LPC11U37HFB D64/401 only. )

PIO1_3/CT32B1_MAT3/

IOH_13 ---50

[3] I; PU I/O PIO1_3 — General purpose digital input/o utput pin.

-OCT32B1_MAT3 — Match output 3 for 32-bit timer 1.

- I/O IOH_13 — I/O Handler input/output 13.

(LPC11U37HFB D64/401 only. )

PIO1_4/CT32B1_CAP0/

IOH_14 ---16

[3] I; PU I/O PIO1_4 — General purpose digital input/o utput pin.

-ICT3 2B1_CAP0 — Capture input 0 for 32-bit timer 1.

- I/O IOH_14 — I/O Handler input/output 14.

(LPC11U37HFB D64/401 only. )

Table 3. Pin description

Symbol

Pin HVQFN33

Pin TFBGA48

Pin LQFP48

Pin LQFP64

Reset

state

[1]

Type Description

Product data sheet Rev. 2 — 25 November 2013 14 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

PIO1_5/CT32B1_CAP1

/IOH_15 -H8-32

[3] I; PU I/O PIO1_5 — General purpose digital input/o utput pin.

-ICT3 2B1_CAP1 — Capture input 1 for 32-bit timer 1.

- I/O IOH_15 — I/O Handler input/output 15.

(LPC11U37HFB D64/401 only. )

PIO1_6/IOH_16 - - - 64 [3] I; PU I/O PIO1_6 — General purpose digital input/outp ut pin.

- I/O IOH_16 — I/O Handler input/output 16.

(LPC11U37HFB D64/401 only. )

PIO1_7/IOH_17 - - - 6 [3] I; PU I/O PIO1_7 — General purpose digital input/output pin.

- I/O IOH_17 — I/O Handler input/output 17.

(LPC11U37HFB D64/401 only. )

PIO1_8/IOH_18 - - - 39 [3] I; PU I/O PIO1_8 — General purpose digital input/output pin.

- I/O IOH_18 — I/O Handler input/output 18.

(LPC11U37HFB D64/401 only. )

PIO1_9 - - - 55 [3] I; PU I/O PIO1_9 — General purpose digital input/output pin.

PIO1_10 - - - 12 [3] I; PU I/O PIO1_10 — General purpose digital input/output pin.

PIO1_11 - - - 43 [3] I; PU I/O PIO1_11 — General purpose digital input/output pin.

PIO1_12 - - - 59 [3] I; PU I/O PIO1_12 — General purpose digital input/output pin.

PIO1_13/DTR/

CT16B0_MAT0/TXD -B83647

[3] I; PU I/O PIO1_13 — General purpose digital input/output pin.

-ODTR — Data Te rminal Ready output for USART.

-OCT16B0_MAT0 — Match output 0 for 16-bit timer 0.

-OTXD — Tra nsmitter output for USART.

PIO1_14/DSR/

CT16B0_MAT1/RXD -A83749

[3] I; PU I/O PIO1_14 — General purpose digital input/output pin.

-IDSR — Data Set Ready input for USART.

-OCT16B0_MAT1 — Match output 1 for 16-bit timer 0.

-IRXD — Receiver input for USART.

PIO1_15/DCD/

CT16B0_MAT2/SCK1 28 A4 43 57 [3] I; PU I/O PIO1_15 — General purpose digital input/output pin.

IDCD — Data Carrier Detect input for USART.

-OCT16B0_MAT2 — Match output 2 for 16-bit timer 0.

- I/O SCK1 — Serial clock for SSP1.

PIO1_16/RI/

CT16B0_CAP0 -A24863

[3] I; PU I/O PIO1_16 — General purpose digital input/output pin.

-IRI — Ring Indicator input for USART.

-ICT1 6B0_CAP0 — Capture input 0 for 16-bit timer 0.

PIO1_17/CT16B0_CAP1/

RXD ---23

[3] I; PU I/O PIO1_17 — General purpose digital input/output pin.

-ICT1 6B0_CAP1 — Capture input 1 for 16-bit timer 0.

-IRXD — Receiver input for USART.

PIO1_18/CT16B1_CAP1/

TXD ---28

[3] I; PU I/O PIO1_18 — General purpose digital input/output pin.

-ICT1 6B1_CAP1 — Capture input 1 for 16-bit timer 1.

-OTXD — Tra nsmitter output for USART.

Table 3. Pin description

Symbol

Pin HVQFN33

Pin TFBGA48

Pin LQFP48

Pin LQFP64

Reset

state

[1]

Type Description

Product data sheet Rev. 2 — 25 November 2013 15 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

PIO1_19/DTR/SSEL1 1 B1 2 3 [3] I; PU I/O PIO1_19 — General purpose digital input/output pin.

-ODTR — Data Te rminal Ready output for USART.

- I/O SSEL1 — Slave select for SSP1.

PIO1_20/DSR/SCK1 - H1 13 18 [3] I; PU I/O PIO1_20 — General purpose digital input/output pin.

-IDSR — Data Set Ready input for USART.

- I/O SCK1 — Serial clock for SSP1.

PIO1_21/DCD/MISO1 - G8 26 35 [3] I; PU I/O PIO1_21 — General purpose digital input/output pin.

-IDCD — Data Carrier Detect input for USART.

- I/O MISO1 — Master In Slave Out for SSP1.

PIO1_22/RI/MOSI1 - A7 38 51 [3] I; PU I/O PIO1_22 — General purpose digital input/output pin.

-IRI — Ring Indicator input for USART.

- I/O MOSI1 — Master Out Slave In for SSP1.

PIO1_23/CT16B1_MAT1/

SSEL1 -H41824

[3] I; PU I/O PIO1_23 — General purpose digital input/output pin.

-OCT16B1_MAT1 — Match output 1 for 16-bit timer 1.

- I/O SSEL1 — Slave select for SSP1.

PIO1_24/CT32B0_MAT0 - G6 21 27 [3] I; PU I/O PIO1_24 — General purpose digital input/output pin.

-OCT32B0_MAT0 — Match output 0 for 32-bit timer 0.

PIO1_25/CT32B0_MAT1 - A1 1 2 [3] I; PU I/O PIO1_25 — General purpose digital input/output pin.

-OCT32B0_MAT1 — Match output 1 for 32-bit timer 0.

PIO1_26/CT32B0_MAT2/

RXD/IOH_19 -G21114

[3] I; PU I/O PIO1_26 — General purpose digital input/output pin.

-OCT32B0_MAT2 — Match output 2 for 32-bit timer 0.

-IRXD — Receiver input for USART.

- I/O IOH_19 — I/O Handler input/output 19.

(LPC11U37HFB D64/401 only. )

PIO1_27/CT32B0_MAT3/

TXD/IOH_20 -G11215

[3] I; PU I/O PIO1_27 — General purpose digital input/output pin.

-OCT32B0_MAT3 — Match output 3 for 32-bit timer 0.

-OTXD — Tra nsmitter output for USART.

- I/O IOH_20 — I/O Handler input/output 20.

(LPC11U37HFB D64/401 only. )

PIO1_28/CT32B0_CAP0/

SCLK -H72431

[3] I; PU I/O PIO1_28 — General purpose digital input/output pin.

-ICT3 2B0_CAP0 — Capture input 0 for 32-bit timer 0.

- I/O SCLK — Serial clock input/output for USART in

synchronous mode.

PIO1_29/SCK0/

CT32B0_CAP1 -D73141

[3] I; PU I/O PIO1_29 — General purpose digital input/output pin.

- I/O SCK0 — Serial clock for SSP0.

-ICT3 2B0_CAP1 — Capture input 1 for 32-bit timer 0.

PIO1_31 - - 25 - [3] I; PU I/O PIO1_31 — General purpose digital input/output pin.

USB_DM 13 G5 19 25 [7] F-USB_DM — USB bidirectional D line.

Table 3. Pin description

Symbol

Pin HVQFN33

Pin TFBGA48

Pin LQFP48

Pin LQFP64

Reset

state

[1]

Type Description

Product data sheet Rev. 2 — 25 November 2013 16 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

[1] Pin state at reset for default function: I = Input; O = Output; PU = internal pull-up enabled; IA = inactive, no pull-up/down enabled;

F = floating; If the pins are not used, tie floating pins to ground or power to minimize power consumption.

[2] 5 V tolerant pad. RESET functionality is not available in Deep power-down mode. Use the WAKEUP pin to reset the chip and wake up

from Deep power-down mode. An external pull-up resistor is required on this pin for the Deep power-down mode. See Figure 32 for the

reset pad configuration.

[3] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis (see Figure 31).

[4] I2C-bus pins compliant with the I2C-bus specification for I2C standard mode, I2C Fast-mode, and I2C Fast-mode Plus.

[5] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis (see Figure 31);

includes high-current output driver.

[6] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, configurable hysteresis, and analog input.

When configured as a ADC input, digital section of the pad is disabled and the pin is not 5 V tolerant (see Figure 31); includes digital

input glitch filter.

[7] Pad provides USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode

only). This pad is not 5 V tolerant.

[8] When the system oscillator is not used, connect XTALIN and XTALOUT as follows: XTALIN can be left floating or ca n be grounded

(grounding is preferred to reduce susceptib ility to noise). Leave XTALOUT floating.

7. Functional description

7.1 On-chip flash programming memory

The LPC11U3x contain up to 128 kB on-chip flash program memory. The flash can be

programmed using In-System Programming (ISP) or In-Application Programming (IAP)

via the on-chip boot loader software.

The flash memor y is divide d int o 4 kB sect ors with each sector consisting of 16 pages.

Individual pages can be erased using the IAP erase page command.

7.2 EEPROM

The LPC11U3x contain 4 kB of on-chip byte-erasable and byte-programmable EEPROM

data memor y . The EEPROM can be pr ogrammed using In-Application Programming (I AP)

via the on-chip boot loader software.

USB_DP 14 H5 20 26 [7] F-USB_DP — USB bidirectional D+ line.

XTALIN 4 D1 6 8 [8] - - Input to the oscillator circuit and internal clock

generator circuits. Input voltage must not exceed

1.8 V.

XTALOUT 5 E1 7 9 [8] - - Output from the oscillator amplifier.

VDD 6;

29 B4;

E2 8;

44 10;

33;

48;

- - Supply voltage to the internal regulator, the external

rail, and the ADC. Also used as the ADC reference

voltage.

VSS 33 B5;

D2 5;

41 7;

54 - - Ground.

Table 3. Pin description

Symbol

Pin HVQFN33

Pin TFBGA48

Pin LQFP48

Pin LQFP64

Reset

state

[1]

Type Description

Product data sheet Rev. 2 — 25 November 2013 17 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

7.3 SRAM

The LPC11U3x contain a total of 8 kB, 10 kB, or 12 kB on-chip static RAM memory.

On the LPC11U37HFBD64/401, the 2 kB SRAM1 region at location 0x2000 0000 to

0x2000 07FFF is used for the I/O Handler software library. Do not use this memory

location for data or other user code.

7.4 On-chip ROM

The on-chip ROM contains the boot loader and the following Applicatio n Prog ra m min g

Interfaces (APIs):

•In-System Programming (ISP) and In-Application Programming (IAP) support for flash

including IAP erase page command.

•IAP support for EEPROM

•USB API

•Power profiles for configuring power consumption and PLL settings

•32-bit integer division routines

7.5 Memory map

The LPC11U3x incorporates several distinct memory regions, shown in the following

figures. Figure 6 shows the overall map of the entire address space from the user

program viewpoint following reset. The interrupt vector area supports address remapping.

The AHB (Advance d High-performance Bus) peripheral area is 2 MB in size and is divided

to allow for up to 128 peripherals. The APB (Advanced Peripheral Bus) peripheral area is

512 kB in size and is divided to allow for up to 32 peripherals. Each peripheral of either

type is allocated 16 kB of space. This ad d ressing scheme allows simplifying the address

decoding for each peripheral.

Product data sheet Rev. 2 — 25 November 2013 18 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

7.6 Nested Vectored Interrupt Controller (NVIC)

The Nested Vectored Interrupt Controller (NVIC) is part of the Cortex-M0. The tight

coupling to the CPU allows for low interrupt latency and ef ficient processing of late ar riving

interrupts.

7.6.1 Features

•Controls system exceptions and peripheral interrupts.

•In the LPC11U3x, the NVIC supports 24 vectored interrupts.

Fig 6. LPC11U3x memory map

APB peripherals

0x4000 4000

0x4000 8000

0x4000 C000

0x4001 0000

0x4001 8000

0x4002 0000

0x4002 8000

0x4003 8000

0x4003 C000

0x4004 0000

0x4004 4000

0x4004 8000

0x4004 C000

0x4005 8000

0x4005 C000

0x4006 0000

0x4006 4000

0x4008 0000

0x4002 4000

0x4001 C000

0x4001 4000

0x4000 0000

WWDT

32-bit counter/timer 0

32-bit counter/timer 1

ADC

USART/SMART CARD

PMU

C-bus

20 - 21 reserved

10 - 13 reserved

reserved

25 - 31 reserved

reserved

0x0000 0000

0 GB

0.5 GB

4 GB

1 GB

0x1000 0000

0x1FFF 0000

0x1FFF 4000

0x2000 0000

0x5000 0000

0x5000 4000

0xFFFF FFFF

reserved

2 kB USB RAM (LPC11U34/421

LPC11U35/401/501

LPC11U36/401/501

LPC11U37/401/501,

LPC11U37H/401)

reserved

0x4000 0000

0x4008 0000

0x4008 4000

APB peripherals

USB

GPIO

0x2000 4000

0x2000 4800

0x1000 2000

8 kB SRAM0 (LPC11U3x)

LPC11U3x

0x0000 A000

40 kB on-chip flash (LPC11U34/311)

0x0000 C000

48 kB on-chip flash (LPC11U34/421)

0x0001 0000

64 kB on-chip flash (LPC11U35)

0x0001 8000

96 kB on-chip flash (LPC11U36)

0x0002 0000

128 kB on-chip flash (LPC11U37/7H)

16 kB boot ROM

0x0000 0000

0x0000 00C0

active interrupt vectors

002aag813

reserved

SSP0

SSP1

16-bit counter/timer 1

16-bit counter/timer 0

IOCON

system control

19 GPIO interrupts

23 GPIO GROUP0 INT

24 GPIO GROUP1 INT

flash/EEPROM controller

0xE000 0000

0xE010 0000

private peripheral bus

2 kB SRAM1 (LPC11U35/501

LPC11U37/501)

I/O Handler code area

for LPC11U37HFBD64/401

0x2000 0800

Product data sheet Rev. 2 — 25 November 2013 19 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

•Four programmable interrupt priority levels, with hardware priority level masking.

•Software interrupt generation.

7.6.2 Interrupt sources

Each peripheral de vice has one interrupt line conn ected to the NVIC but can have seve ral

interrupt flags. Individual interrupt flags can also represent more than one interrupt

source.

7.7 IOCON block

The IOCON block allows selected pins of the microcontroller to have more than one

function. Configuration registers control the multiplexers to allow connection between the

pin and the on-chip peripherals.

Connect peripherals to the appropriate pins before activating the peripheral and before

enabling any related interrupt. Activity of any enabled peripheral function that is not

mapped to a related pin is treated as undefined.

7.7.1 Features

•Programmable pull-up, pull-down, or repeater mode.

•All GPIO pins (except PIO0_4 and PIO0_5) are pulle d up to 3.3 V (VDD = 3.3 V) if their

pull-up resistor is enabled.

•Programmable pseudo open-drain mode.

•Programmable 10 ns glitch filter on pins PIO0_22, PIO0_23, and PIO0_11 to

PIO0_16. The glitch filter is turned on by default.

•Programmable hysteresis.

•Programmable input inverter.

7.8 General-Purpose Input/Output GPIO

The GPIO registe rs con tro l de vice pin fu nct ion s tha t ar e no t co nn ec te d to a sp ecific

peripheral function. Pins can be dynamically configured as inputs or outputs. Multiple

outputs can be set or cleared in one write operation.

LPC11U3x use accelerated GPIO functions:

•GPIO registers are a dedicated AHB peripheral so that the fastest possible I/O timing

can be achieved .

•Entire port value can be written in one instruction.

Any GPIO pin providing a digital function can be programmed to generate an interrupt on

a level, a rising or falling edge, or both.

The GPIO block consists of three parts:

1. The GPIO ports.

2. The GPIO pin interrupt block to control eight GPIO pins selected as pin interrupts.

3. Two GPIO group interrupt blocks to control two combined interrupts from all GPIO

pins.

Product data sheet Rev. 2 — 25 November 2013 20 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

7.8.1 Features

•GPIO pins can be configured as input or output by software.

•All GPIO pins default to inputs with interrupt disabled at reset.

•Pin registers allow pins to be sensed and set individually.

•Up to eight GPIO pins can be selected from all GPIO pins to create an edge- or

level-sensitive GPIO interrupt request.

•Any pin or pins in each port can trigger a port interrupt.

7.9 USB interface

The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a

host and one or more (up to 127) peripherals. The host controller allocates the USB

bandwidth to attached devices through a token-based protocol. The bus supports

hot-plugging and dynamic configuration of the devices. The host controller initiates all

transactions.

The LPC11U3x USB interface consists of a full-speed device controller with on-chip PHY

(PHYsical layer) for device functions.

Remark: Configure the LPC11U3x in default power mode with the power profiles before

using the USB (see Section 7.18.5.1). Do not use the USB with the part in performance,

efficiency, or low-power mode.

7.9.1 Full-speed USB device controller

The device controller enables 12 Mbit/s data exchange with a USB Host controller. It

consists of a register interface, serial interface engine, and endpoint buffer memory. The

serial interface engine decodes the USB data stream and writes data to the appropriate

endpoint buffer. The status of a completed USB transfer or error condition is indicated via

status registers. If enabled, an interrupt is generated.

7.9.1.1 Features

•Dedicated USB PLL available.

•Fully compliant with USB 2.0 specification (full speed).

•Supports 10 physical (5 logical) endpoints including one control endpoint.

•Single and double buffering supported.

•Each non-control endpoint supports bulk, interrupt, or isochronous endpoint types.

•Supports wake-up from Deep-sleep mode and Power-down mode on USB activity

and remote wake-up.

•Supports SoftConnect.

7.10 I/O Handler (LPC11U37HFBD64/401 only)

The I/O Handler is a software library-supported hardware engine for emulating serial

interfaces and off-loading the CPU for processing-intensive functio ns. The I/O Handler

can emulate, among others, DMA and serial interfaces such as UART, I2C, or I2S with no

or very low additional CPU load. The software libraries are available with supporting

Product data sheet Rev. 2 — 25 November 2013 21 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

application notes from NXP (see http://www.LPCware.com.) LPCXpres so , Keil, and IAR

IDEs are supported. I/O Handler library code must be executed fro m the memory area

0x2000 0000 to 0x2000 07FF. This memory is not available for other use.

For application examples, see Section 11.8 “I/O Handler software library applications”.

Each I/O Handler libra ry us es a sp ecif ic sub se t of I/O Han dle r pin s and in som e case s

other pins and peripherals such as the counter/timers.

7.11 USART

The LPC11U3x contains one USART.

The USART includes full modem control, support for synchronous mode, and a smart

card interface. The RS-485/9-bit mode allows both software address detection and

automatic address detection using 9-bit mode.

The USART uses a fractional baud rate generator. Standard baud rates such as

115200 Bd can be achieved with any crystal frequency above 2 MHz.

7.11.1 Features

•Maximum USART data bit rate of 3.125 Mbit/s.

•16 byte receive and tran sm it FI FO s.

•Register locations conform to 16C550 industry standard.

•Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.

•Built-in fractional baud rate generator covering wide range of baud rates without a

need for external crystals of particular values.

•Fractional divider for baud rate control, auto baud capabilities and FIFO control

mechanism that enables software flow control implementation.

•Support for RS-4 85 /9 -b it mo d e.

•Support for modem control.

•Support for synchronous mode.

•Includes smart card interface.

7.12 SSP serial I/O controller

The SSP controllers operate on a SSP, 4-wire SSI, or Microwire bus. The controller can

interact with multiple masters and slaves on the bus. Only a sing le mas ter an d a sing le

slave can communicate on the bus during a given data transfer. The SSP supports full

duplex transfers, with frames of 4 bit to 16 bit of data flowing from the master to the slave

and from the slave to the master. In practice, often only one of these data flows carries

meaningful data.

7.12.1 Features

•Maximum SSP speed of 25 Mbit/s (master) or 4.17 Mbit/s (slave) (in SSP mode)

•Compatible with Motorola SPI (Serial Peripheral Interface), 4-wire Texas Instruments

SSI (Serial Synchronous Interface), and National Semiconductor Microwire buses

•Synchronous serial communication

•Master or slave operation

Product data sheet Rev. 2 — 25 November 2013 22 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

•8-frame FIFOs for both transmit and receive

•4-bit to 16-bit frame

7.13 I2C-bus serial I/O controller

The LPC11U3x contain one I2C-bus controller.

The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial CLock line

(SCL) and a Serial DAta line (SDA). Each device is recognized by a unique address and

can operate as either a r eceiver-o nly device ( e.g., an LCD driver) or a tra nsmitter with the

capability to both receive and send information (such as memory). Transmitters and/or

receivers can oper ate in eithe r master or sl ave mo de, dependin g on wheth er the chip has

to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, and

more than one bus master connected to the interface ca n be con tro lle d the bu s.

7.13.1 Features

•The I2C-interface is an I2C-bus compliant interface with open-drain pins. The I2C-bus

interface supports Fast-mode Plus with bit rates up to 1 Mbit/s.

•Easy to configure as master, slave, or master/slave.

•Programmable clocks allow versatile rate control.

•Bidirectional data transfer between masters and slaves.

•Multi-master bus (no central master).

•Arbitration between simultaneously transmitting masters without corruption of serial

data on the bus.

•Serial clock synchronization allows devices with different bit rates to communicate via

one serial bus.

•Serial clock synchronization can be used as a handshake mech anism to suspend and

resume serial transfer.

•The I2C-bus can be used for test and diagnostic purpose s.

•The I2C-bus controller support s multiple ad dress recognition and a bus monitor mode.

7.14 10-bit ADC

The LPC1 1U3x contains one ADC. It is a single 10-bit successive approximation ADC with

eight channels.

7.14.1 Features

•10-bit successive approximation ADC.

•Input multiplexing among 8 pins.

•Power-down mode.

•Measurement range 0 V to VDD.

•10-bit conver sio n time  2.44 s (up to 400 kSamples/s).

•Burst conversion mode for single or multiple inputs.

•Optional conversion on transition of input pin or timer match signal.

•Individual result registers for each ADC channel to reduce interrupt overhead.

Product data sheet Rev. 2 — 25 November 2013 23 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

7.15 General purpose external event counter/timers

The LPC11U3x includes two 32-bit counter/timers and two 16-bit counter/timers. The

counter/timer is designed to count cycles of the system derived clock. It can optionally

generate interrupts or perform other actions at specified timer values, based on four

match registers. Each counter/timer also includes one capture input to tr ap the timer value

when an input signal transitions, optionally generating an interrupt.

7.15.1 Features

•A 32-bit/16-bit timer/counter with a programmable 32-bit/16-bit prescaler.

•Counter or timer op er a tion .

•Up to two capture channels per timer, that can t ake a snapshot of the timer value

when an input signal transitions. A capture event can also generate an interrupt.

•Four match registers per timer tha t allow :

–Continuous operation with optional interrupt generation on match.

–Stop timer on match with optional interrupt generation.

–Reset timer on match with optional interrupt generation.

•Up to four external outputs corresponding to match registers, with the following

capabilities:

–Set LOW on match.

–Set HIGH on match.

–Toggle on match.

–Do nothing on match.

•The timer and prescaler can be configured to be cleared on a designated capture

event. This feature permits easy pulse-width measurement by clearing the timer on

the leading edge of an input pulse and capturing the timer value on the trailing edge.

7.16 System tick timer

The ARM Cortex-M0 includes a system tick timer (SYSTICK) that is intended to generate

a dedicated SYSTICK exc ep tion at a fixed time interval (typically 10 ms).

7.17 Windowed WatchDog Timer (WWDT)

The purpose of the WWDT is to prevent an unre sponsive system state. If software fails to

update the watchdog within a programmable time window, the watchdog resets the

microcontroller

7.17.1 Features

•Internally resets chip if not periodically reloaded during the programmable time-out

period.

•Optional windowed operation requires reload to occur between a minimum and

maximum time period, both programmable.

•Optional warning interrupt can be g enerated at a programmable time before watchdog

time-out.

Product data sheet Rev. 2 — 25 November 2013 24 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

•Software enables the WWDT, but a hardware reset or a watchdog reset/interrupt is

required to disable the WWDT.

•Incorrect feed sequence causes reset or interrupt, if enabled.

•Flag to indicate watchdog reset.

•Programmable 24-bit timer with internal prescaler.

•Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 224 4) in

multiples of Tcy(WDCLK) 4.

•The W atchdog Clock (WDCLK) source can be selected from the IRC or the dedica ted

watchdog oscillator (WDO). The clock source selection provides a wide range of

potential timing choices of watchdog operation under different power conditions.

7.18 Clocking and power control

7.18.1 Integrated oscillators

The LPC11U3x include three independent oscillators: the system oscillator, the Internal

RC oscillator (IRC), and the watchdog oscillator. Each oscillator can be used for more

than one purpose as required in a particular application.

Following reset, the LPC11U3x operates from the internal RC oscillator until software

switches to a different clock source. The IRC allows the system to operate without any

external crystal and the bootloader code to operate at a known frequency.

See Figure 7 for an overview of the LPC11U3x clock generation.

Product data sheet Rev. 2 — 25 November 2013 25 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

7.18.1.1 Internal RC oscillator

The IRC can be used as the clock source for the WDT, and/or as the clock that drives the

system PLL and then the CPU. The nominal IRC frequency is 12 MHz.

Upon power-up, any chip reset, or wa ke-up fr om Deep power-down mode, the LPC11U3x

use the IRC as the clock source. Software can later switch to one of the other available

clock sources.

Fig 7. LPC11U3x clocking gen e ra tion block diagram

system oscillator

watchdog oscillator

IRC oscillator

USB PLL

USBPLLCLKSEL

(USB clock select)

SYSTEM CLOCK

DIVIDER

SYSAHBCLKCTRLn

(AHB clock enable)

CPU, system control,

PMU

memories,

peripheral clocks

SSP0 PERIPHERAL

CLOCK DIVIDER SSP0

SSP1 PERIPHERAL

CLOCK DIVIDER SSP1

USART PERIPHERAL

CLOCK DIVIDER UART

WDT

WDCLKSEL

(WDT clock select)

USB 48 MHz CLOCK

DIVIDER USB

USBUEN

(USB clock update enable)

watchdog oscillator

IRC oscillator

system oscillator CLKOUT PIN CLOCK

DIVIDER CLKOUT pin

CLKOUTUEN

(CLKOUT update enable)

002aaf892

system clock

SYSTEM PLL

IRC oscillator

system oscillator

watchdog oscillator

MAINCLKSEL

(main clock select)

SYSPLLCLKSEL

(system PLL clock select)

main clock

IRC oscillator

Product data sheet Rev. 2 — 25 November 2013 26 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

7.18.1.2 System oscillator

The system oscillator can be used as the clock source for the CPU, with or without using

the PLL. On the LPC11U3x, use the system oscillator to provide the clock source to USB.

The system oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be

boosted to a higher frequency, up to the maximum CPU operating frequency, by the

system PLL.

7.18.1.3 Watchdog oscillator

The watchdog oscillator can be used as a clock source that directly drives the CPU, the

watchdog timer, or the CLKOUT pin. The watchdog oscillator nominal frequency is

programmable between 9 .4 kHz and 2.3 MHz. The frequency spread over processing and

temperature is 40 % (see also Table 13).

7.18.2 System PLL and USB PLL

The LPC11U3x contain a system PLL and a dedicated PLL for generating the 48 MHz

USB clock. The system and USB PLLs are identical.

The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input

frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO).

The multiplier can be an integer value from 1 to 32. The CCO operates in the range of

156 MHz to 320 MHz. To support this frequency range, an additional divider keeps the

CCO within its frequency range while the PLL is providing the desired output frequency.

The output divider can be set to divide by 2, 4, 8, or 16 to produce the output clock. The

PLL output frequency must be lower than 100 MHz. Since the minimum output divider

value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off

and bypassed following a chip reset. Software can enable the PLL later. The program

must configure and activate the PLL, wait for the PLL to lock, and then connect to th e PLL

as a clock source. The PLL settling time is 100 s.

7.18.3 Clock output

The LPC11U3x feature a clock output function that routes the IRC oscillator, the system

oscillator, the watchdog oscillator, or the main clock to an output pin.

7.18.4 Wake-up process

The LPC11U3x begin operation by using the 12 MHz IRC oscillator as the clock source at

power-up and when awakened from Deep power-down mode . This mechanism allows

chip operation to resume quickly. If the application uses the main oscillator or the PLL,

software must enable these components and wait for them to stabilize. Only then can the

system use the PLL and main oscillator as a clock source.

7.18.5 Power control

The LPC11U 3 x sup p or t var iou s po we r con tr ol features. There ar e fo ur spe cial m od es of

processor power reduction: Sleep mode, Deep-sleep mode, Power-down mode, and

Deep power-down mode. The CPU clock rate can also be controlled as needed by

changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider

value. This power control mechanism allows a trade-of f of power versus processing speed

based on application require ments. In addition, a register is provide d for shutting down the

clocks to individual on-chip peripherals. This register allows fine-tuning of power

Product data sheet Rev. 2 — 25 November 2013 27 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

consumption by eliminating all dynamic power use in any pe ripherals that are not required

for the application. Selecte d peri pherals have their own clock divider which provides even

better power control.

7.18.5.1 Power profiles

The power consumption in Active and Sleep modes can be optimized for the application

through simple calls to the power profile. The power configuration routine configures the

LPC11U3x for one of the following power modes:

•Default mode corresponding to power configuration after reset.

•CPU performance mode corresponding to optimized processing capability.

•Efficie ncy mode corresponding to optimi zed balance of current consumption and CPU

performance.

•Low-current mode corresponding to lowest power consumption.

In addition, the power profile includes routines to select the optimal PLL settings for a

given system clock and PLL input clock.

Remark: When using the USB, configure the LPC11U3x in Default mode.

7.18.5.2 Sleep mode

When Sleep mode is entered, the clock to the core is stoppe d. Resumption from the Sleep

mode does not need any special sequence but re-enabling the clock to the ARM core.

In Sleep mode, execution of instructions is suspended until either a reset or interrupt

occurs. Peripheral functions continue operation during Sleep mode and can generate

interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic

power used by the processor itself, by memory systems and related controllers, and by

internal buses.

7.18.5.3 Deep-sleep mode

In Deep-sleep mode, the LPC11U3x is in Sleep-mode and all peripheral clocks and all

clock sources are off except for the IRC. The IRC output is disabled unless the IRC is

selected as input to the watchdog timer. In addition all analog blocks are shut down and

the flash is in stan d-by mode. In Deep-sleep m ode, the application can keep the watchdog

oscillator and the BOD circuit running for self-timed wake-up and BOD protection.

The LPC11U3x can wake up from Deep-sleep mode via reset, selected GPIO pins, a

watchdog timer interrupt, or an interrupt generating USB port activity.

Deep-sleep mode saves power and allows for short wake-up times.

7.18.5.4 Power-down mode

In Power-down mode, the LPC11U3x is in Sleep-mode and all peripheral clocks and all

clock sources are off ex cept for watchdog oscillator if selected. In addition all analog

blocks and the flash are shut down. In Power-down mode, the application can keep the

BOD circuit running for BOD protection.

The LPC11U3x can wake up from Power-down mode via reset, selected GPIO pins, a

watchdog timer interrupt, or an interrupt generating USB port activity.

Product data sheet Rev. 2 — 25 November 2013 28 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Power-down mode reduces power consumption compared to Deep-sleep mode at the

expense of longer wake-up times.

7.18.5.5 Deep power-down mode

In Deep power-down mode, power is shut off to the entire chip except for the WAKEUP

pin. The LPC11U3x can wake up from Deep power-down mode via the WAKEUP pin.

The LPC11U3x can be prevented from entering Deep power-down mode by setting a lock

bit in the PMU b lock. Locking out Deep powe r-down mode enables the app lication to keep

the watchdog timer or the BOD running at all times.

When entering Deep power-down mode, an external pull-up resistor is required on the

W AKEUP pin to hold it HIGH. Pull the RESET pin HIGH to prevent it from floating while in

Deep power-down mode.

7.18.6 System control

7.18.6.1 Reset

Reset has four sources on the LPC11U3x: the RESET pin, the Watchdog reset, power-o n

reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt

trigger input pin. Assertion of chip re set by a ny source, on ce the ope ratin g voltage attains

a usable level, starts the IRC and initializes the flash controller.

A LOW-going pulse as short as 50 ns resets the part.

When the internal Reset is removed, the processor begins executing at address 0, which

is initially the Reset vector mapped from the boot block. At that point, all of the processor

and peripheral registers have been initialized to predetermined values.

In Deep power-down mode, an external pull-up resistor is required on the RESET pin.

7.18.6.2 Brownout detection

The LPC11U3x includes up to four levels for monitoring the voltage on the VDD pin. If this

voltage falls below one of the selected levels, the BOD asserts an interrupt signal to the

NVIC. This signal can be enabled fo r interrupt in the In terrupt Enable Registe r in the NVIC

to cause a CPU interrupt. Alternatively, software can monitor the signal by reading a

dedicated statu s register. Four threshold levels can be selected to cause a forced reset of

the chip.

7.18.6.3 Code security (Code Read Protection - CRP)

CRP provides different levels of security in the system so that access to the on-chip flash

and use of the Serial Wire Debugger (SWD) and In-System Programming (ISP) can be

restricted. Programming a specific pattern into a dedicated flash location invokes CRP.

IAP commands are not affected by the CRP.

In addition, ISP entry via the PIO0_1 pin can be disabled without enabling CRP. For

details, see the LPC11Uxx user manual.

There are three levels of Code Read Protection:

Product data sheet Rev. 2 — 25 November 2013 29 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

1. CRP1 disables access to the chip via the SWD and allows partial flash update

(excluding flash sector 0) using a limited set of the ISP commands. This mode is

useful when CRP is requ ired and flash field u pdates are needed b ut all sectors cannot

be erased.

2. CRP2 disables access to the chip via the SWD and only allows full flash erase and

update using a reduced set of the ISP commands.

3. Running an application with level CRP3 selected, fully disables any acce ss to the chip

via the SWD pins and the ISP. This mode effectively disables ISP override using

PIO0_1 pin as well. If necessary, the application must provide a flash update

mechanism using IAP calls or using a call to the reinvoke ISP command to enable

flash update via the USART.

In addition to the three CRP levels, sampling of pin PIO0_1 for valid user code can be

disabled. For details, see the LPC11Uxx user manual.

7.18.6.4 APB interface

The APB peripherals are located on one APB bus.

7.18.6.5 AHBLite

The AHBLite connects the CPU bus of the ARM Cortex-M0 to the flash memory, the main

static RAM, and the ROM.

7.18.6.6 External interrupt inputs

All GPIO pins can be level or edge sensitive interrupt inputs.

CAUTION

If level three Code Read Protection (CRP3) is selected, no future factory testing can be

performed on the device.

Product data sheet Rev. 2 — 25 November 2013 30 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

7.19 Emulation and debugging

Debug functions are integrated into the ARM Cortex-M0. Serial wire debug functions are

supported in addition to a standard JTAG boundary scan. The ARM Cortex-M0 is

configured to support up to four breakpoints and two watch points.

The RESET pin selects between the JTAG boundary scan (RESET = LOW) and the ARM

SWD debug (RESET = HIGH). The ARM SWD debug port is disabled while the

LPC11U3x is in reset.

To perform boundary scan testing, follow these steps:

1. Erase any user code residing in flash.

2. Power up the part with the RESET pin pulled HIGH externally.

3. Wait for at least 250 s.

4. Pull the RESET pin LOW externally.

5. Perform boundary scan operations.

6. Once the boundary scan opera tions are completed, assert the TRST pin to enable the

SWD debug mode, and release the RESET pin (pull HIGH).

Remark: The JTAG interface cannot be used for debug purposes.

Product data sheet Rev. 2 — 25 November 2013 31 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

8. Limiting values

[1] The following applies to the limiting values:

a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive

static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated

maximum.

b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless

otherwise noted.

c) The limiting values are stress ratings only. Operating the part at these values is not recommended, and proper operation is not

guaranteed. The conditions for functional operation are specified in Table 5.

[2] Maximum/minimum voltage above the maximum operating voltage (see Table 5) and below ground that can be applied for a short time

(< 10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter lifetime of the device.

[3] See Table 6 for maximum operating voltage.

[4] VDD present or not present. Compliant with the I2C-bus standard. 5.5 V can be applied to this pin when VDD is powered down.

[5] Including voltage on outputs in 3-state mode.

[6] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined

based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details.

[7] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).[1]

Symbol Parameter Conditions Min Max Unit

VDD supply voltage (core and

external rail) [2] 0.5 +4.6 V

VIinput voltage 5 V tolerant digital I/O pins;

VDD  1.8 V [5][2] 0.5 +5.5 V

VDD = 0 V 0.5 +3.6 V

5 V tolerant open-drain pins

PIO0_4 and PIO0_5 [2][4] 0.5 +5.5

VIA analog input voltage pin configured as analog input [2]

[3] 0.5 4.6 V

IDD supply current per supply pin - 100 mA

ISS ground current per ground pin - 100 mA

Ilatch I/O latch-up current (0.5VDD) < VI < (1.5VDD);

Tj < 125 C-100mA

Tstg storage temperature non-operating [6] 65 +150 C

Tj(max) maximum junction

temperature -150C

Ptot(pack) total power dissipation (per

package) based on package heat

transfer, not device power

consumption

-1.5W

VESD electrostatic discharge

voltage human body model; all pins [7] -+6500V

Product data sheet Rev. 2 — 25 November 2013 32 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

9. Static characteristics

Table 5. Static characteristics

Tamb =





C to +85



C, unless otherwise specified.

Symbol Parameter Conditions Min Typ[1] Max Unit

VDD supply voltage (core

and external rail) [2] 1.8 3.3 3.6 V

IDD supply current Active mode; VDD =3.3V;

Tamb =25C; code

while(1){}

executed from flash;

system clock = 12 MHz [3][4][5]

[6][7][8] -2-mA

system clock = 50 MHz [4][5][6]

[7][8][9] -7-mA

Sleep mode;

VDD = 3.3 V; Tamb =25C;

system clock = 12 MHz

[3][4][5]

[6][7][8] -1-mA

Deep-sleep mode; VDD = 3.3 V;

Tamb =25C[4][7] - 300 - A

Power-down mode; VDD =3.3V;

Tamb =25C-2-A

Deep power-down mode;

VDD =3.3V; T

amb =25C[10] - 220 - nA

Standard port pins, RESET

IIL LOW-level input current VI= 0 V; on-chip pull-up resistor

disabled -0.510nA

IIH HIGH-level input

current VI=V

DD; on-chip pull-down resistor

disabled -0.510nA

IOZ OFF-state output

current VO=0V; V

O=V

DD; on-chip

pull-up/down resistors disabled -0.510nA

VIinput voltage pin configured to provide a digital

function; VDD  1.8 V [11]

[12] 0- 5.0V

VDD = 0 V 0 - 3.6 V

VOoutput voltage output active 0 - VDD V

VIH HIGH-level input

voltage 0.7VDD --V

VIL LOW-level input voltage - - 0.3VDD V

Vhys hysteresis voltage - 0.4 - V

VOH HIGH-level output

voltage 2.0 V  VDD  3.6 V; IOH =4 mA VDD  0.4 - - V

1.8 V  VDD < 2.0 V; IOH =3 mA VDD  0.4 - - V

VOL LOW-level output

voltage 2.0 V  VDD  3.6 V; IOL =4 mA - - 0.4 V

1.8 V  VDD < 2.0 V; IOL =3 mA - - 0.4 V

IOH HIGH-level output

current VOH =V

DD 0.4 V;

2.0 V  VDD  3.6 V

4- - mA

1.8 V  VDD < 2.0 V 3- - mA

Product data sheet Rev. 2 — 25 November 2013 33 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

IOL LOW-level output

current VOL =0.4V

2.0 V  VDD  3.6 V 4- - mA

1.8 V  VDD < 2.0 V 3 - - mA

IOHS HIGH-level short-circuit

output current VOH =0V [13] --45 mA

IOLS LOW-level short-circuit

output current VOL =V

DD [13] --50mA

Ipd pull-down current VI= 5 V 10 50 150 A

Ipu pull-up current VI=0V;

2.0 V  VDD  3.6 V

15 50 85 A

1.8 V  VDD < 2.0 V 10 50 85 A

VDD <V

I<5V 0 0 0 A

High-drive output pin (PIO0_7)

IIL LOW-level input current VI= 0 V; on-chip pull-up resistor

disabled -0.510nA

IIH HIGH-level input

current VI=V

DD; on-chip pull-down resistor

disabled -0.510nA

IOZ OFF-state output

current VO=0V; V

O=V

DD; on-chip

pull-up/down resistors disabled -0.510nA

VIinput voltage pin configured to provide a digital

function; VDD  1.8 V [11]

[12] 0- 5.0V

VDD = 0 V 0 - 3.6 V

VOoutput voltage output active 0 - VDD V

VIH HIGH-level input

voltage 0.7VDD --V

VIL LOW-level input voltage - - 0.3VDD V

Vhys hysteresis voltage 0.4 - - V

VOH HIGH-level output

voltage 2.5 V  VDD  3.6 V; IOH =20 mA VDD  0.4 - - V

1.8 V  VDD < 2.5 V; IOH =12 mA VDD  0.4 - - V

VOL LOW-level output

voltage 2.0 V  VDD  3.6 V; IOL =4 mA - - 0.4 V

1.8 V  VDD < 2.0 V; IOL =3 mA - - 0.4 V

IOH HIGH-level output

current VOH =V

DD 0.4 V;

2.5 V  VDD  3.6 V 20 - - mA

1.8 V  VDD < 2.5 V 12 - - mA

IOL LOW-level output

current VOL =0.4V

2.0 V  VDD  3.6 V 4- - mA

1.8 V  VDD < 2.0 V 3 - - mA

IOLS LOW-level short-circuit

output current VOL =V

DD [13] --50mA

Ipd pull-down current VI= 5 V 10 50 150 A

Table 5. Static characteristics …continued

Tamb =





C to +85



C, unless otherwise specified.

Symbol Parameter Conditions Min Typ[1] Max Unit

Product data sheet Rev. 2 — 25 November 2013 34 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Ipu pull-up current VI=0V

2.0 V  VDD  3.6 V

15 50 85 A

1.8 V  VDD < 2.0 V 10 50 85 A

VDD <V

I<5V 0 0 0 A

I2C-bus pins (PIO0_4 and PIO0_5)

VIH HIGH-level input

voltage 0.7VDD --V

VIL LOW-level input voltage - - 0.3VDD V

Vhys hysteresis voltage - 0.05VDD -V

IOL LOW-level output

current VOL =0.4V; I

2C-bus pins configured

as standard mode pins

2.0 V  VDD  3.6 V

3.5 - - mA

1.8 V  VDD < 2.0 V 3 - -

IOL LOW-level output

current VOL =0.4V; I

2C-bus pins configured

as Fast-mode Plus pins

2.0 V  VDD  3.6 V

20 - - mA

1.8 V  VDD < 2.0 V 16 - -

ILI input leakage current VI=V

DD [14] -24A

VI= 5 V - 10 22 A

Oscillator pins

Vi(xtal) crystal input voltage 0.5 1.8 1.95 V

Vo(xtal) crystal output voltage 0.5 1.8 1.95 V

USB pins

IOZ OFF-state output

current 0V<V

I<3.3V [2] --10 A

VBUS bus supply voltage [2] - - 5.25 V

VDI differential input

sensitivity voltage (D+) (D)[2] 0.2 - - V

VCM differential common

mode voltage range includes VDI range [2] 0.8 - 2.5 V

Vth(rs)se singl e-ended receiver

switching threshold

voltage

[2] 0.8 - 2.0 V

VOL LOW-level output

voltage for low-/full-speed;

RL of 1.5 k to 3.6 V [2] - - 0.18 V

VOH HIGH-level output

voltage driven; for low-/full-speed;

RL of 15 k to GND [2] 2.8 - 3.5 V

Ctrans transceiver capacitance pin to GND [2] --20pF

ZDRV driver output

impedance for driver

which is not high-speed

capable

with 33  series resistor; steady state

drive [15][2] 36 - 44.1 

Table 5. Static characteristics …continued

Tamb =





C to +85



C, unless otherwise specified.

Symbol Parameter Conditions Min Typ[1] Max Unit

Product data sheet Rev. 2 — 25 November 2013 35 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.

[2] For USB operation 3.0 V  VDD  3.6 V. Guaranteed by design.

[3] IRC enabled; system oscillator disabled; system PLL disabled.

[4] IDD measurements were performed with all pins configured as GPIO outputs driven LOW and pull-up resistors disabled.

[5] BOD disabled.

[6] All peripherals disabled in the AHBCLKCTRL register. Peripheral clocks to USART, SSP0/1 disabled in the SYSCON block.

[7] USB_DP and USB_DM pulled LOW externally.

[8] Low-current mode PWR_LOW_CURRENT selected when running the set_power routine in the power profiles.

[9] IRC disabled; system oscillator enabled; system PLL enabled.

[10] WAKEUP pin pulled HIGH externally. An external pull-up resistor is required on the RESET pin for the Deep power-down mode.

[11] Including voltage on outputs in 3-state mode.

[12] 3-state outputs go into 3-state mode in Deep power-down mode.

[13] Allowed as long as the current limit does not exceed the maximum current allowed by the device.

[14] To VSS.

[15] Includes external resistors of 33 1 % on USB_DP and USB_DM.

Pin capacitance

Cio input/output

capacitance pins configured for analog function - - 7.1 pF

I2C-bus pins (PIO0_4 and PIO0_5) - - 2.5 pF

pins configured as GPIO - - 2.8 pF

Table 5. Static characteristics …continued

Tamb =





C to +85



C, unless otherwise specified.

Symbol Parameter Conditions Min Typ[1] Max Unit

Product data sheet Rev. 2 — 25 November 2013 36 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

[1] The ADC is monotonic, there are no missing codes.

[2] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 8.

[3] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after

appropriate adjustment of gain and offset errors. See Figure 8.

[4] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the

ideal curve. See Figure 8.

[5] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset

error, and the straight line which fits the ideal transfer curve. See Figure 8.

[6] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated

ADC and the ideal transfer curve. See Figure 8.

[7] Tamb = 25 C; maximum sampling frequency fs = 400 kSamples/s and analog input capacitance Cia = 1 pF.

[8] Input resistance Ri depends on the sampling frequency fs: Ri = 1 / (fs  Cia).

Table 6. ADC static characteristics

Tamb =





C to +85



C unless otherwise specified; ADC frequen cy 4.5 MHz, VDD = 2.5 V to 3.6 V.

Symbol Parameter Conditions Min Typ Max Unit

VIA analog input vol tage 0 - VDD V

Cia analog input capacitance - - 1 pF

EDdifferential linearity error [1][2] --1LSB

EL(adj) integral non-linearity [3] --1.5 LSB

EOoffset error [4] --3.5 LSB

EGgain error [5] --0.6%

ETabsolute er ror [6] --4LSB

Rvsi voltage source interface

resistance --40k

Riinput resistance [7][8] --2.5M

Product data sheet Rev. 2 — 25 November 2013 37 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

(1) Example of an actual transfer curve.

(2) The ideal transfer curve.

(3) Differential linearity error (ED).

(4) Integral non-linearity (EL(adj)).

(5) Center of a step of the actual transfer curve.

Fig 8. ADC characteristics

002aaf426

1023

1022

1021

1020

1019

(2)

(1)

10241018 1019 1020 1021 1022 1023

7123456

1018

(5)

(4)

(3)

1 LSB

(ideal)

code

out

VDD − VSS

1024

offset

error

gain

error

offset error

VIA (LSBideal)

1 LSB =

Product data sheet Rev. 2 — 25 November 2013 38 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

9.1 BOD static characteristics

[1] Interrupt levels are selected by writing the level value to the BOD control register BODCTRL, see the

LPC11Uxx user manual.

9.2 Power consumption

Power measurement s in Active, Sleep , and Deep-sleep mod es were performed under the

following conditions (see the LPC11Uxx user man u al):

•Configure all pins as GPIO with pull-up resistor disabled in the IOCON block.

•Configure GPIO pins as outputs using the GPIOnDIR registers.

•Write 0 to all GPIOnDATA registers to drive the outputs LOW.

Table 7. BOD static characteristics[1]

Tamb =25



Symbol Parameter Conditions Min Typ Max Unit

Vth threshold voltage interrupt level 1

assertion - 2.22 - V

de-assertion - 2.35 - V

interrupt level 2

assertion - 2.52 - V

de-assertion - 2.66 - V

interrupt level 3

assertion - 2.80 - V

de-assertion - 2.90 - V

reset level 0

assertion - 1.46 - V

de-assertion - 1.63 - V

reset level 1

assertion - 2.06 - V

de-assertion - 2.15 - V

reset level 2

assertion - 2.35 - V

de-assertion - 2.43 - V

reset level 3

assertion - 2.63 - V

de-assertion - 2.71 - V

Product data sheet Rev. 2 — 25 November 2013 39 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Conditions: Tamb = 25 C; Active mode entered executing code

while(1){}

from flash;

internal pull-up resistors disabled; BOD disabled; all peripherals disabled in the

SYSAHBCLKCTRL register; all peripheral clocks disabled; low-current mode; USB_DP and

USB_DM pulled LOW externally.

(1) System oscillator and system PLL disabled; IRC enabled.

(2) System oscillator and system PLL enabled; IRC disabled.

Fig 9. Typical supply current versus regulator supply voltage VDD in ac tive mode

Conditions: VDD = 3.3 V; Active mode entered executing code

while(1){}

from flash; internal

pull-up resistors disabled; BOD disabled; all peripherals disabled in the SYSAHBCLKCTRL

externally.

(1) System oscillator and system PLL disabled; IRC enabled.

(2) System oscillator and system PLL enabled; IRC disabled.

Fig 10. Typical sup ply current versus tempe rature in Active mode

VDD (V)

1.8 3.63.02.4

002aag749

IDD

(mA)

12 MHz(1)

24 MHz(2)

36 MHz(2)

48 MHz(2)

temperature (°C)

-40 853510 60-15

002aag750

IDD

(mA)

12 MHz(1)

24 MHz(2)

36 MHz(2)

48 MHz(2)

Product data sheet Rev. 2 — 25 November 2013 40 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Conditions: VDD = 3.3 V; Sleep mode entered from flash; internal pull-up resistors disabled; BOD

disabled; all peripherals disabled in the SYSAHBCLKCTRL register; all peripheral clocks disabled;

low-current mode; USB_DP and USB_DM pulled LOW externally.

(1) System oscillator and system PLL disabled; IRC enabled.

(2) System oscillator and system PLL enabled; IRC disabled.

Fig 11. Typical supply current versus temperature in Sleep mode

Conditions: BOD disabled; all oscillators and analog blocks turned off in the PDSLEEPCFG

Fig 12. Typical supp ly cu rrent versus temperature in Deep-sleep mode

002aag751

temperature (°C)

-40 853510 60-15

IDD

(mA)

12 MHz(1)

36 MHz(2)

48 MHz(2)

24 MHz(2)

002aag745

temperature (°C)

-40 853510 60-15

355

375

365

385

IDD

(μA)

345

VDD = 3.6 V

VDD = 3.3 V

VDD = 2.0 V

VDD = 1.8 V

Product data sheet Rev. 2 — 25 November 2013 41 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

9.3 Peripheral power consumption

The supply current p er peripheral is measured as the differ ence in supply current between

the peripheral block enabled and the peripheral block disabled in the SYSAHBCLKCFG

and PDRUNCFG (for analog blocks) registers. All other blocks are disabled in both

registers and no code is executed. Mea sured on a typical sample at Tamb =25 C. Unless

noted otherwise, the system oscillator and PLL are running in both measurements.

The supply currents are shown for system clock frequencies of 12 MHz and 48 MHz.

Conditions: BOD disabled; all oscillators and analog blocks turned off in the PDSLEEPCFG

Fig 13. Typical supp ly cu rrent versus temperature in Power-down mode

Fig 14. Typical supply current versus temperature in Deep power-down mode

002aag746

temperature (°C)

-40 853510 60-15

IDD

(μA)

VDD = 3.6 V, 3.3 V

VDD = 2.0 V

VDD = 1.8 V

002aag747

temperature (°C)

-40 853510 60-15

0.2

0.6

0.4

0.8

IDD

(μA)

VDD = 3.6 V

VDD = 3.3 V

VDD = 2.0 V

VDD = 1.8 V

Product data sheet Rev. 2 — 25 November 2013 42 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Tabl e 8. Power consumptio n for individual analog and digital blocks

Peripheral Typical supply current in

mA Notes

n/a 12 MHz 48 MHz

IRC 0.27 - - System oscillator running; PLL off; independent

of main clock frequency.

System oscillator

at 12 MHz 0.22 - - IRC running; PLL off; independent of main clock

frequency.

Watchdog

oscillator at

500 kHz/2

0.004 - - System oscillator running ; PLL off; independent

of main clock frequency.

BOD 0.051 - - Independent of main clock frequency.

Main PLL - 0.21 - -

ADC - 0.08 0.29 -

CLKOUT - 0.12 0.47 Ma in clock divided by 4 in the CLKOUTDIV

CT16B0 - 0.02 0.06 -

CT16B1 - 0.02 0.06 -

CT32B0 - 0.02 0.07 -

CT32B1 - 0.02 0.06 -

GPIO - 0.23 0.88 GPIO pins configured as outputs and set to

LOW. Direction and pin state are maintained if

the GPIO is disabled in the SYSAHBCLKCFG

IOCONFIG - 0.03 0.10 -

I2C- 0.04 0.13 -

ROM - 0.04 0.15 -

SPI0 - 0.12 0.45 -

SPI1 - 0.12 0.45 -

UART - 0.22 0.82 -

WWDT - 0.02 0.06 Main clock selected as clock source for the

WDT.

USB --1.2 -

Product data sheet Rev. 2 — 25 November 2013 43 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

9.4 Electrical pin characteristics

Conditions: VDD = 3.3 V; on pin PIO0_7.

Fig 15. High-drive output: Typi cal HIGH-le vel output voltage VOH versus HIGH-level

output current IOH.

Conditions: VDD = 3.3 V; on pins PIO0_4 and PIO0_5.

Fig 16. I2C-bus pins (high current sink): Typical LOW-level output current IOL versus

LOW-level output voltage VOL

IOH (mA)

0 60402010 5030

002aae990

2.8

2.4

3.2

3.6

VOH

(V)

T = 85 °C

25 °C

−40 °C

VOL (V)

0 0.60.40.2

002aaf019

IOL

(mA)

T = 85 °C

25 °C

−40 °C

Product data sheet Rev. 2 — 25 November 2013 44 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Conditions: VDD = 3.3 V; standard port pins and PIO0_7.

Fig 17. Typical LOW-level output curr ent IOL versus LOW-level output voltage VOL

Conditions: VDD = 3.3 V; standard port pins.

Fig 18. Typical HIGH-level output voltage VOH versus HIGH-level output source current

IOH

VOL (V)

0 0.60.40.2

002aae991

IOL

(mA)

T = 85 °C

25 °C

−40 °C

IOH (mA)

0 24168

002aae992

2.8

2.4

3.2

3.6

VOH

(V)

T = 85 °C

25 °C

−40 °C

Product data sheet Rev. 2 — 25 November 2013 45 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Conditions: VDD = 3.3 V; standard port pins.

Fig 19. Typical pull-up current Ipu versus input voltage VI

Conditions: VDD = 3.3 V; standard port pins.

Fig 20. Typical pull-down current Ipd versus input volt age VI

VI (V)

0 54231

002aae988

−30

−50

−10

Ipu

(μA)

−70

T = 85 °C

25 °C

−40 °C

VI (V)

0 54231

002aae989

Ipd

(μA)

T = 85 °C

25 °C

−40 °C

Product data sheet Rev. 2 — 25 November 2013 46 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

10. Dynamic characteristics

10.1 Flash memory

[1] Number of program/erase cycles.

[2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash

in blocks of 256 bytes.

10.2 External clock

[1] Parameters are valid over operating temperature range unless otherwise specified.

[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply

voltages.

Table 9. Flash ch aracteristics

Tamb =





C to +85



C, unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Nendu endurance [1] 10000 100000 - cycles

tret retention time powered 10 - - years

unpowered 20 - - years

ter erase time sector or multi ple

consecutive sectors 95 100 105 ms

tprog programming time [2] 0.95 1 1.05 ms

Table 10. EEPROM characteristics

Tamb =





Cto+85



C; VDD = 2.7 V to 3.6 V. Based on JEDEC NVM qualification. Failure rate <

10 ppm for parts as specified below.

Symbol Parameter Conditions Min Typ Max Unit

Nendu endurance 100000 1000000 - cycles

tret retention time powered 100 200 - years

unpowered 150 300 - years

tprog programming

time 64 bytes - 2.9 - ms

Table 11. Dynamic characteristic: external clock

Tamb =





C to +85



C; VDD over specified ranges.[1]

Symbol Parameter Conditions Min Typ[2] Max Unit

fosc oscillator frequency 1 - 25 MHz

Tcy(clk) clock cycle time 40 - 1000 ns

tCHCX clock HIGH time Tcy(clk) 0.4 - - ns

tCLCX clock LOW time Tcy(clk) 0.4 - - ns

tCLCH clock rise time - - 5 ns

tCHCL clock fall time - - 5 ns

Product data sheet Rev. 2 — 25 November 2013 47 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

10.3 Internal oscillators

[1] Parameters are valid over operating temperature range unless otherwise specified.

[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply

voltages.

[1] Typical ratings are not guaranteed. The values listed are at nominal supply voltages.

Fig 21. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)

tCHCL tCLCX tCHCX

Tcy(clk)

tCLCH

002aaa907

Table 12. Dynamic characteristics: IRC

Tamb =





C to +85



C; 2.7 V



VDD



3.6 V[1].

Symbol Parameter Conditions Min Typ[2] Max Unit

fosc(RC) internal RC oscillator

frequency - 11.88 12 12.12 MHz

Conditions: Frequency values are typical values. 12 MHz  1 % accuracy is guaranteed for

2.7 V  VDD  3.6 V and Tamb =40 C to +85 C. Variations between parts may cause the IRC to

fall outside the 12 MHz  1 % accuracy specification for voltages below 2.7 V.

Fig 22. Internal RC oscillator frequency versus temperature

Table 13. Dynamic characteristics: Watchdog oscillator

Symbol Parameter Conditions Min Typ[1] Max Unit

fosc(int) internal oscillator

frequency DIVSEL = 0x1F, FREQSEL = 0x1

in the WDTOSCCTRL register; [2][3] -9.4-kHz

DIVSEL = 0x00, FREQSEL = 0xF

in the WDTOSCCTRL register [2][3] - 2300 - kHz

002aaf403

11.95

12.05

12.15

(MHz)

11.85

temperature (°C)

−40 853510 60−15

VDD = 3.6 V

3.3 V

3.0 V

2.7 V

2.4 V

2.0 V

Product data sheet Rev. 2 — 25 November 2013 48 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

[2] The typical frequency spread over processing and temperature (Tamb = 40 C to +85 C) is 40 %.

[3] See the LPC11Uxx user manual.

10.4 I/O pins

[1] Applies to standard port pins and RESET pin.

10.5 I2C-bus

[1] See the I2C-bus specification UM10204 for details.

[2] Parameters are valid over operating temperature range unless otherwise specified.

[3] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge.

[4] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the SCL signal) to

bridge the undefined region of the falling edge of SCL.

[5] Cb = total capacitance of one bus line in pF.

[6] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at

250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines

without exceeding the maximum specified tf.

Table 14. Dynamic characteristics: I/O pins[1]

Tamb =





C to +85



C; 3.0 V



VDD



3.6 V.

Symbol Parameter Conditions Min Typ Max Unit

trrise time pin configured as output 3.0 - 5.0 ns

tffall time pin configured as outpu t 2.5 - 5.0 ns

Table 15. Dynamic characteristic: I2C-bus pins[1]

Tamb =





C to +85



C.[2]

Symbol Parameter Conditions Min Max Unit

fSCL SCL clock

frequency Standard-mode 0 100 kHz

Fast-mode 0 400 kHz

Fast-mode Plus 0 1 MHz

tffall time [4][5][6][7] of both SDA and SCL

signals

Standard-mode

-300ns

Fast-mode 20 + 0.1  Cb300 ns

Fast-mode Plus - 120 ns

tLOW LOW period of the

SCL clock Standard-mode 4.7 - s

Fast-mode 1.3 - s

Fast-mode Plus 0.5 - s

tHIGH HIGH period of the

SCL clock Standard-mode 4.0 - s

Fast-mode 0.6 - s

Fast-mode Plus 0.26 - s

tHD;DAT data hold time [3][4][8] Standard-mode 0 - s

Fast-mode 0 - s

Fast-mode Plus 0 - s

tSU;DAT data set-up time

[9][10] Standard-mode 250 - ns

Fast-mode 100 - ns

Fast-mode Plus 50 - n s

Product data sheet Rev. 2 — 25 November 2013 49 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

[7] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should

allow for this when considering bus timing.

[8] The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than the maximum of tVD;DAT or

tVD;ACK by a transition time (see UM10204). This maximum must only be met if the device does not stretch the LOW period (tLOW) of the

SCL signal. If the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock.

[9] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the

acknowledge.

[10] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement tSU;DAT = 250 ns must then be met.

This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the

LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the

Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time.

Fig 23. I2C-bus pins clock timing

002aaf425

70 %

30 %

SDA

70 %

30 %

70 %

30 %

70 %

30 %

tHD;DAT

SCL

1 / fSCL

70 %

30 %

70 %

30 %

tVD;DAT

tHIGH

tLOW

tSU;DAT

Product data sheet Rev. 2 — 25 November 2013 50 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

10.6 SSP interface

[1] Tcy(clk) = (SSPCLKDIV  (1 + SCR)  CPSDVSR) / fmain. The clock cycle time derived from the SPI bit rate Tcy(clk) is a function of the

main clock frequency fmain, the SPI peripheral clock divider (SSPCLKDIV), the SPI SCR parameter (specified in the SSP0CR0 register),

and the SPI CPSDVSR parameter (specified in the SPI clock prescale register).

[2] Tamb = 40 C to 85 C.

[3] Tcy(clk) = 12  Tcy(PCLK).

[4] Tamb = 25 C; for normal voltage supply range: VDD = 3.3 V.

Table 16. Dynamic characteristics of SPI pins in SPI mode

Symbol Parameter Conditions Min Typ Max Unit

SPI master (in SPI mode)

Tcy(clk) clock cycle time full-duplex mode [1] 50 - - ns

when only transmitting [1] 40 ns

tDS data set-up time in SPI mode

2.4 V  VDD  3.6 V

[2] 15 - - ns

2.0 V  VDD < 2.4 V [2] 20 ns

1.8 V  VDD < 2.0 V [2] 24 - - ns

tDH data hold time in SPI mode [2] 0-- ns

tv(Q) data output valid time in SPI mode [2] --10 ns

th(Q) data output hold time in SPI mode [2] 0-- ns

SPI slave (in SPI mode)

Tcy(PCLK) PCLK cycle time 20 - - ns

tDS data set-up time in SPI mode [3][4] 0-- ns

tDH data hold time in SPI mode [3][4] 3  Tcy(PCLK) + 4 - - ns

tv(Q) data output valid time in SPI mode [3][4] --3  Tcy(PCLK) + 11 ns

th(Q) data output hold time in SPI mode [3][4] --2  Tcy(PCLK) + 5 ns

Product data sheet Rev. 2 — 25 November 2013 51 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Fig 24. SSP master timing in SPI mode

SCK (CPOL = 0)

MOSI

MISO

Tcy(clk)

tDS tDH

tv(Q)

DATA VALID DATA VALID

th(Q)

SCK (CPOL = 1)

DATA VALID DATA VALID

MOSI

MISO

tDS tDH

DATA VALID DATA VALID

th(Q)

DATA VALID DATA VALID

tv(Q)

CPHA = 1

CPHA = 0

002aae829

Product data sheet Rev. 2 — 25 November 2013 52 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Fig 25. SSP slave timing in SPI mode

SCK (CPOL = 0)

MOSI

MISO

Tcy(clk)

tDS tDH

tv(Q)

DATA VALID DATA VALID

th(Q)

SCK (CPOL = 1)

DATA VALID DATA VALID

MOSI

MISO

tDS tDH

tv(Q)

DATA VALID DATA VALID

th(Q)

DATA VALID DATA VALID

CPHA = 1

CPHA = 0

002aae830

Product data sheet Rev. 2 — 25 November 2013 53 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

10.7 USB interface

[1] Characterized but not implemented as production test. Guaranteed by design.

Table 17 . Dynamic characteristics: USB pins (full-speed)

CL = 50 pF; Rpu = 1.5 k



on D+ to VDD; 3.0 V



VDD



3.6 V.

Symbol Parameter Conditions Min Typ Max Unit

trrise time 10 % to 90 % 8.5 - 13.8 ns

tffall time 10 % to 90 % 7.7 - 13.7 n s

tFRFM differential rise and fall time

matching tr/t

f--109%

VCRS output signal crossover voltage 1.3 - 2.0 V

tFEOPT source SE0 interval of EOP see Figure 26 160 - 175 ns

tFDEOP source jitter for differential transition

to SE0 transition see Figure 26 2-+5ns

tJR1 receiver jitter to next transition 18.5 - +18.5 ns

tJR2 receiver jitter for paired transitions 10 % to 90 % 9-+9ns

tEOPR EOP width at receiver must accept as

EOP; see

Figure 26

[1] 82 --ns

Fig 26. Differen t ia l da ta-to-EOP transition skew and EOP width

aaa-009330

PERIOD

differential

data lines

crossover point

source EOP width: t

FEOPT

receiver EOP width: t

EOPR

crossover point

extended

differential data to

SE0/EOP skew

n T

PERIOD

+ t

FDEOP

Product data sheet Rev. 2 — 25 November 2013 54 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

11. Application information

11.1 Suggested USB interface solutions

The USB device can be connected to the USB as self-powered device (see Figure 27) or

bus-powered device (see Figure 28).

On the LPC11U3x, the PIO0_3/USB_VBUS pin is 5 V tolerant only when VDD is applied

and at operating voltage level. Therefore, if the USB_VBUS function is connected to the

USB connector and the device is self-powered, the USB_VBUS pin must be protected for

situations when VDD = 0 V.

If VDD is always greater than 0 V while VBUS = 5 V, the USB_VBUS pin can be connected

directly to the VBUS pin on the USB connector.

For systems where VDD can be 0 V and VBUS is directly applied to the VBUS pin,

precautions must be taken to reduce the voltage to below 3.6 V, which is the maximum

allowable voltage on the USB_VBUS pin in this case.

One method is to use a volt age divider to connect th e USB_VBUS pin to the VBUS on the

USB connector. The voltage divider ratio should be such that the USB_VBUS pin will be

greater than 0.7VDD to indicate a logic HIGH while below the 3.6 V allow ab le ma xim u m

voltage.

For the following operating conditions

VBUSmax = 5.25 V

VDD = 3.6 V,

the voltage divider shou ld pr ov ide a reduction of 3.6 V/5.2 5 V or ~0.68 6 V.

Fig 27. USB interface on a self-powered device where USB_VBUS = 5 V

LPC1xxx

USB-B

connector

USB_DP

USB_CONNECT

soft-connect switch

USB_DM

USB_VBUS

1.5 kΩ

RS = 33 Ω

aaa-010178

RS = 33 Ω

Product data sheet Rev. 2 — 25 November 2013 55 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

For a bus-powered device, the VBUS signal does not need to be connected to the

USB_VBUS pin (see Figure 28). The USB_CONNECT function can additionally be

connected as sho wn in Figure 27 to prevent the USB from timing out when there is a

significant delay between power-up and handling USB traffic.

Remark: When a bus-powered circuit as shown in Figure 28 is used or , for a self-powered

device, when the VBUS pin is not connected, configure the PIO0_3/USB_VBUS pin for

GPIO (PIO0_3) in the IOCON block. This ties the VBUS signal HIGH internally.

Fig 28. USB interface on a bus-po wered device

LPC1xxx

1.5 kΩ

aaa-010179

USB-B

connector

USB_DP

USB_DM

RS = 33 Ω

REGULATOR

VBUS

Product data sheet Rev. 2 — 25 November 2013 56 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

11.2 XTAL input

The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a

clock in slave mode, it is recommende d that the inpu t be coupled throug h a cap acitor with

Ci = 100 pF. To limit the input voltage to the specified range, choose an additional

capacitor to ground Cg which attenuate s the input volt age by a facto r Ci/(Ci + Cg). In slave

mode, a minimum of 200 mV (RMS) is needed.

In slave mode, couple the input clock signal with a capacitor of 100 pF (Figure 29), with an

amplitude between 200 mV (RMS) and 1000 mV (RMS). This signal corresponds to a

square wave signal with a signal swing of between 280 mV and 1.4 V. The XTALOUT pin

in this configuration can be left unconnected.

External components and models used in oscillation mode are shown in Figure 30 and in

Table 18 and Table 19. Since the feedback resistance is integrated on chip, only a crystal

and the capacitances CX1 and CX2 need to be connected externally in case of

fundamental mode oscillation (L, CL and RS represent the fundamental frequency).

Capacit ance CP in Figure 30 represents the p arallel package ca pacitance and must not be

larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal

manufacturer.

Fig 29. Slave mode operation of the on-chip oscillator

Fig 30. Oscillator modes and models: oscillation mode of operation and external crystal

model used for CX1/CX2 evaluation

LPC1xxx

XTALIN

100 pF Cg

002aae788

002aaf424

LPC1xxx

XTALIN XTALOUT

CX2

CX1

XTAL

=CLCP

Product data sheet Rev. 2 — 25 November 2013 57 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

11.3 XTAL Printed-Circuit Board (PCB) layout guidelines

Follow these guidelines for PCB layout:

•Connect the crystal on the PCB as close as possible to the oscillator input and output

pins of the chip.

•Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal

use have a common ground plane.

•Connect the external components to the ground plain.

•To keep parasitics and the noise coupled in via the PCB as small as possible, keep

loops as small as possible.

• Choose smaller values of Cx1 and Cx2 if parasit ics of the PCB layout increase.

Table 18. Recommended values for CX1/CX2 in oscillation mode (c rystal and external

components parameters) low frequency mode

Fundamental oscillation

frequency FOSC

Crystal load

capacitance CL

Maximum crystal

series resistance RS

External load

capacitors CX1, CX2

1 MHz to 5 MHz 10 pF < 300 18 pF, 18 pF

20 pF < 300 39 pF, 39 pF

30 pF < 300 57 pF, 57 pF

5 MHz to 10 MHz 10 pF < 300 18 pF, 18 pF

20 pF < 200 39 pF, 39 pF

30 pF < 100 57 pF, 57 pF

10 MHz to 15 MHz 10 pF < 160 18 pF, 18 pF

20 pF < 60 39 pF, 39 pF

15 MHz to 20 MHz 10 pF < 80 18 pF, 18 pF

Table 19. Recommended values for CX1/CX2 in oscillation mode (c rystal and external

components parameters) hi gh frequency mode

Fundamental oscillation

frequency FOSC

Crystal load

capacitance CL

Maximum crystal

series resistance RS

External load

capacitors CX1, CX2

15 MHz to 20 MHz 10 pF < 180 18 pF, 18 pF

20 pF < 100 39 pF, 39 pF

20 MHz to 25 MHz 10 pF < 160 18 pF, 18 pF

20 pF < 80 39 pF, 39 pF

Product data sheet Rev. 2 — 25 November 2013 58 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

11.4 Standard I/O pad configuration

Figure 31 shows the possible pin modes for standard I/O pins with analog input function:

•Digital output driver

•Digital input: Pull-up enabled/disabled

•Digital input: Pull-down enabled/disabled

•Digital input: Repeater mode enabled/disabled

•Analog input

Fig 31. Standard I/O pad co nfi gu ra t io n

ESD

strong

pull-up

strong

pull-down

weak

pull-up

weak

pull-down

open-drain enable

output enable

repeater mode

enable

pull-up enable

pull-down enable

select data

inverter

data output

data input

select glitch

filter

analog input

select analog input

002aaf695

pin configured

as digital output

driver

pin configured

as digital input

pin configured

as analog input

10 ns RC

GLITCH FILTER

Product data sheet Rev. 2 — 25 November 2013 59 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

11.5 Reset pa d configuration

11.6 ADC effective input impedance

A simplified diagram of the ADC input channels can be used to determine the effective

input impedance seen from an external voltage source. See Figure 33.

The effective input impedance, Rin, seen by the external voltage source, VEXT, is the

parallel impedance of ((1/fs x Cia) + Rmux + Rsw) and (1/fs x Cio), and can be calculate d

using Equation 1 with

fs = sampling frequency

Cia = ADC analog input capacitance

Rmux = analog mux resistance

Rsw = switch resistance

Cio = pin capacitance

(1)

Fig 32. Reset pad configuration

VSS

reset

002aaf274

VDD

Rpu ESD

ESD

20 ns RC

GLITCH FILTER PIN

Fig 33. ADC input channel

Cia

VEXT

002aah615

ADC

COMPARATOR

ADC Block

Rin

Cio

Rmux Rsw

Source

<2 kΩ<1.3 kΩ

Rin 1

fsCia



------------------Rmux Rsw





fsCio



------------------







Product data sheet Rev. 2 — 25 November 2013 60 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Under nominal operating condition VDD = 3.3 V and with the maximum sampling

frequency fs = 400 kHz, the parameters assume the following values:

Cia = 1 pF (max)

Rmux = 2 kΩ (max)

Rsw = 1.3 kΩ (max)

Cio = 7.1 pF (max)

The effective input impedance with these parameters is Rin = 308 kΩ.

11.7 ADC usage notes

The following guidelines show how to increase the performance of the ADC in a noisy

environment beyond the ADC specifications listed in Table 6:

•The ADC input trace must be short and as close as possible to the LPC11U3x chip.

•Shield The ADC input traces from fast switching digital signals and noisy power

supply lines.

•The ADC and the digit al core share the same p ower supply . Therefore, filter the power

supply line adequately.

•To improve the ADC performance in a noisy environment, put the device in Sleep

mode during the ADC conversion.

11.8 I/O Handler software library applications

The following sections provide application examples for the I/O Handler software library.

All library examples mak e us e of th e I/O Han dle r ha rd wa re to ext en d the fu nc tio na lity of

the part through software library calls. The libraries are available on

http://www.LPCware.com.

11.8.1 I/O Handler I2S

The I/O Handler software library provides functions to emulate an I2S master transmit

interface using the I/O Handler hardware block.

The emulated I2S interface loops o ver a 1 kB buf fer, transmitting the datawords according

to the I2S protocol. Interru pts are generated every time when the first 512 bytes have been

transmitted and when the last 512 bytes have been transmitted. This a llows the ARM core

to load the free portion of the buffer with new data, thereby enabling streaming audio.

Two channels with 16-bit p er chann el are supported . Th e code size of the sof tware libra ry

is 1 kB and code must be executed from the SRAM1 memory area reserved for the I/O

Handler code.

11.8.2 I/O Handler UART

The I/O Handler UART library emulates one additional full-duplex UART. The emulated

UART can be config ur ed for 7 or 8 d ata bits, no parity, and 1 or 2 stop bits. The baud rate

is configurable up to 115200 baud. The RXD signal is available on three I/O Handler pins

(IOH_6, IOH_16, IOH_20), while TXD and CTS are available on all 21 I/O Handler pins.

The code size of the software libr ary is about 1.2 kB and code must be executed fro m the

SRAM1 memory area reserved for the I/O Handler code.

Product data sheet Rev. 2 — 25 November 2013 61 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

11.8.3 I/O Handler I2C

The I/O Handler I2C library allows to have an additional I2C-bus master. I2C read, I2C write

and combined I2C r ead/write are su pported. Dat a is automatically r ead from and written to

user-defined buffers.

The I/O Handler I2C library combined with the on-chip I2C module allows to have two

distinct I2C buses, allowing to sep arate low-speed fr om high - spe e d device s or brid gin g

two I2C buses.

11.8.4 I/O Handler DMA

The I/O Handler DMA library offers DMA-like functionality. Four types of transfer are

supported: memory to memory, memory to peripheral, peripheral to memory and

peripheral to peripheral. Supported peripherals are USART, SSP0/1, ADC and GPIO.

DMA transfers can be triggered by the source/target peripheral, software, counter/timer

module CT16B1, or I/O Handler pin PIO1_6/IOH_16.

Product data sheet Rev. 2 — 25 November 2013 62 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

12. Package outline

Fig 34. Package outline HVQFN33 (5 x 5 x 0.85 mm)

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

MO-220

hvqfn33f_po

11-10-11

11-10-17

Unit(1)

max

nom

min

0.85

0.05

0.00

0.2

5.1

4.9

3.75

3.45

5.1

4.9

3.75

3.45

0.5 3.5

Dimensions (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;

32 terminals; body 5 x 5 x 0.85 mm

0.30

0.18

D(1)

A(1) DhE(1) Ehee

1e2L

3.5

0.1 0.1

0.05

0.5

0.3

0.05

0 2.5 5 mm

scale

1/2 e

AC B

terminal 1

index area

detail X

y1C

916

32 25

terminal 1

index area

1/2 e

Product data sheet Rev. 2 — 25 November 2013 63 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Fig 35. Package outline HVQFN33 (7 x 7 x 0.85 mm)

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

- - -

hvqfn33_po

09-03-17

09-03-23

Unit

mm max

nom

min

1.00

0.85

0.80

0.05

0.02

0.00 0.2 7.1

7.0

6.9

4.85

4.70

4.55

7.1

7.0

6.9 0.65 4.55 0.75

0.60

0.45 0.1

A(1)

Dimensions

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;

33 terminals; body 7 x 7 x 0.85 mm

A1b

0.35

0.28

0.23

(1) DhE(1) Eh

4.85

4.70

4.55

1e2

4.55

0.1

0.05

0.08

0 2.5 5 mm

scale

terminal 1

index area

detail X

AC B

vCw

terminal 1

index area Dh

L9 16

Product data sheet Rev. 2 — 25 November 2013 64 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Fig 36. Package outline TFBGA48 (SOT1155-2)

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOT1155-2 - - -

sot1155-2_po

13-06-17

13-06-19

Unit

max

nom

min

1.10

0.95

0.85

0.30

0.25

0.20

0.35

0.30

0.25

4.6

4.5

4.4

4.6

4.5

4.4

0.5 3.5 0.15 0.08

Dimensions

TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 x 4.5 x 0.7 mm SOT1155-2

A1A2

0.80

0.70

0.65

bDEee

3.5

e2vw

0.05

0.1

0 5 mm

scale

ball A1

index area

24681357

e1/2 e

1/2 e

ball A1

index area

solder mask open area

not for solder ball

detail X

AA2

AC B

Ø v

CØ w

Product data sheet Rev. 2 — 25 November 2013 65 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Fig 37. Package outline LQFP48 (SOT313-2)

UNIT A

max. A1A2A3bpcE

(1) eH

ELL

pZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 1.6 0.20

0.05 1.45

1.35 0.25 0.27

0.17 0.18

0.12 7.1

6.9 0.5 9.15

8.85 0.95

0.55 7

0.12 0.10.21

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75

0.45

SOT313-2 MS-026136E05 00-01-19

03-02-25

D(1) (1)(1)

7.1

6.9

9.15

8.85

0.95

0.55

vMB

vMA

36 25

detail X

(A )

0 2.5 5 mm

scale

pin 1 index

LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2

Product data sheet Rev. 2 — 25 November 2013 66 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Fig 38. Package outline LQFP64 (SOT314-2)

UNIT A

max. A1A2A3bpcE

(1) eH

ELL

pZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 1.6 0.20

0.05 1.45

1.35 0.25 0.27

0.17 0.18

0.12 10.1

9.9 0.5 12.15

11.85 1.45

1.05 7

0.12 0.11 0.2

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75

0.45

SOT314-2 MS-026136E10 00-01-19

03-02-25

D(1) (1)(1)

10.1

9.9

12.15

11.85

1.45

1.05

EA1

detail X

(A )

HA2

vMB

vMA

48 33

pin 1 index

0 2.5 5 mm

scale

LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2

Product data sheet Rev. 2 — 25 November 2013 67 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

13. Soldering

Fig 39. Reflow solderin g for the HVQFN33 (5x5) package

Footprint information for reflow soldering of HVQFN33 package

occupied area

solder paste

solder land

Dimensions in mm

0.5

002aag766

Issue date 11-11-15

11-11-20

Ax Ay Bx C D

5.95 5.95 4.25 0.85

4.25 0.27

5.25

6.2

SLx SLy nSPx nSPy

3.75 3.75 3 3

0.30

0.60

detail X

SLy

SLx

nSPy

nSPx

see detail X

GyHy By

Product data sheet Rev. 2 — 25 November 2013 68 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Fig 40. Reflow solderin g for the HVQFN33 (7x7) package

Footprint information for reflow soldering of HVQFN33 package

001aao134

occupied area

solder land

solder resist

solder land plus solder paste

solder paste deposit

Dimensions in mm

Remark:

Stencil thickness: 0.125 mm

e = 0.65

evia = 4.25

OwDtot = 5.10 OA

PID = 7.25 PA+OA

OID = 8.20 OA

0.20 SR

chamfer (4×)

0.45 DM

evia = 1.05

W = 0.30 CU

evia = 4.25

evia = 2.40

LbE = 5.80 CU

LbD = 5.80 CU

PIE = 7.25 PA+OA

LaE = 7.95 CU

LaD = 7.95 CU

OIE = 8.20 OA

OwEtot = 5.10 OA

EHS = 4.85 CU

DHS = 4.85 CU

4.55 SR

B-side

(A-side fully covered)

number of vias: 20

Solder resist

covered via

0.30 PH

0.60 SR cover

0.60 CU

SEhtot = 2.70 SP

SDhtot = 2.70 SP

GapE = 0.70 SP

SPE = 1.00 SP

0.45 DM

SPD = 1.00 SP

GapD = 0.70 SP

Product data sheet Rev. 2 — 25 November 2013 69 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Fig 41. Reflow solderin g for the TFBGA48 package

DIMENSIONS in mm

PSLSPSRHxHy

SOT1155-2

solder land plus solder paste

occupied area

Footprint information for reflow soldering of TFBGA48 package

solder land

solder paste deposit

solder resist

detail X

see detail X

0.50 0.225 0.275 0.325 4.75 4.75 sot1155-2_fr

Product data sheet Rev. 2 — 25 November 2013 70 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Fig 42. Reflow solderin g for the LQFP48 package

SOT313-2

DIMENSIONS in mm

occupied area

Footprint information for reflow soldering of LQFP48 package

AyBy

D2 (8×)D1

(0.125)

Ax Ay Bx By D1 D2 Gx Gy Hx Hy

10.350

0.560 10.350 7.350 7.350

0.500 0.280

1.500 0.500 7.500 7.500 10.650 10.650 sot313-2_fr

solder land

Generic footprint pattern

Refer to the package outline drawing for actual layout

Product data sheet Rev. 2 — 25 November 2013 71 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Fig 43. Reflow solderin g for the LQFP64 package

SOT314-2

DIMENSIONS in mm

occupied area

Footprint information for reflow soldering of LQFP64 package

AyBy

P1P2

D2 (8×) D1

(0.125)

Ax Ay Bx By D1 D2 Gx Gy Hx Hy

13.300 13.300 10.300 10.300

0.500

0.560 0.280

1.500 0.400 10.500 10.500 13.550 13.550 sot314-2_fr

solder land

Generic footprint pattern

Refer to the package outline drawing for actual layout

Product data sheet Rev. 2 — 25 November 2013 72 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

14. Revision history

Table 20. Revision history

Document ID Release date Data sheet status Change notice Supersedes

LPC11U3X v.2 20131125 Product data sheet - LPC11U3X v.1.1

Modifications: •Part LPC11U37HFBD64/401 with I/O handler added.

•Additional I/O Handler pin functions added in Table 3.

•Typical range of watchdog oscillator frequency changed to 9.4 kHz to

2.3 MHz.See Table 13.

•Section 11.8 “ I/O Handler software library applications” added.

•Updated Section 11.1 “Suggested USB interface solutions” for clarity.

•Condition VDD = 0 V added to Parameter VI in Table 5 for clarity.

LPC11U3X v.1.1 20130924 Product data sheet - LPC11U3X v.1

Modifications: •Removed the footnote “The peak current is limited to 25 times the

corresponding maximum current.” in Table 4.

•Table 3: Added “5 V tolerant pad” to RESET/PIO0_0 table note.

•Table 7: Removed BOD interrupt level 0.

•Programmable glitch filter is enabled by default. See Section 7.7.1.

•Added Section 11.6 “ADC effective input impedance”.

•Table 5 “Static characteristics” added Pin capacitance section.

•Updated Section 11.1 “Suggested USB interface solutions”.

•Table 4 “Limiting values”:

–Updated VDD min and max.

–Updated VI conditions.

•Table 10 “EEPROM characteristics”:

–Removed fclk and ter; the user does not have control over these

parameters.

–Changed the tprog from 1.1 ms to 2.9 ms; the EEPROM IAP always

does an erase and program, thus the total program time is ter + tprog.

•Changed title of Figure 29 from “USB interface on a self-powered

device” to “USB interface with soft-connect”.

•Section 10.7 “USB interface” added. Parameter tEOPR1 and tEOPR2

renamed to tEOPR.

LPC11U3X v.1 20120420 Product data sheet - -

Product data sheet Rev. 2 — 25 November 2013 73 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

15. Legal information

15.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) d escribed in th is docume nt may have changed since this docum ent was pub lished and may dif fer in case of multiple devices. The latest product statu s

information is available on the Internet at URL http://www.nxp.com.

15.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full dat a

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

15.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect , incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipme nt, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expect ed

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for il lustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liabili ty related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessa ry

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly object s to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyri ghts, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Producti on This document contains the product specif ication.

Product data sheet Rev. 2 — 25 November 2013 74 of 76

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specif ications.

15.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

I2C-bus — logo is a trademark of NXP B.V.

16. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 2 — 25 November 2013 75 of 76

continued >>

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

17. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 4

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 6

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 10

7 Functional description . . . . . . . . . . . . . . . . . . 16

7.1 On-chip flash programming memory . . . . . . . 16

7.2 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

7.3 SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.4 On-chip ROM . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.5 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.6 Nested Vectored Interrupt Controller (NVIC) . 18

7.6.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

7.6.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 19

7.7 IOCON block . . . . . . . . . . . . . . . . . . . . . . . . . 19

7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

7.8 General-Purpose Input/Output GPIO . . . . . . . 19

7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.9 USB interface . . . . . . . . . . . . . . . . . . . . . . . . 20

7.9.1 Full-sp eed USB device controller . . . . . . . . . . 20

7.9.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.10 I/O Handler (LPC11U37HF BD64/401 only) . . 20

7.11 USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.12 SSP serial I/O controller. . . . . . . . . . . . . . . . . 21

7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.13 I2C-bus serial I/O controller . . . . . . . . . . . . . . 22

7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7.14 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7.15 General purpose external event counter/

timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

7.16 System tick timer . . . . . . . . . . . . . . . . . . . . . . 23

7.17 Windowed WatchDog Timer (WWDT) . . . . . . 23

7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

7.18 Clocking and power control . . . . . . . . . . . . . . 24

7.18.1 Integrated oscillators . . . . . . . . . . . . . . . . . . . 24

7.18.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 25

7.18.1.2 System oscillator . . . . . . . . . . . . . . . . . . . . . . 26

7.18.1.3 Watchdog oscillator . . . . . . . . . . . . . . . . . . . . 26

7.18.2 System PLL and USB PLL . . . . . . . . . . . . . . . 26

7.18.3 Clock output . . . . . . . . . . . . . . . . . . . . . . . . . . 26

7.18.4 Wake-up process. . . . . . . . . . . . . . . . . . . . . . 26

7.18.5 Power control. . . . . . . . . . . . . . . . . . . . . . . . . 26

7.18.5.1 Power profiles . . . . . . . . . . . . . . . . . . . . . . . . 27

7.18.5.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 27

7.18.5.3 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . 27

7.18.5.4 Power-down mode. . . . . . . . . . . . . . . . . . . . . 27

7.18.5.5 Deep power-down mode . . . . . . . . . . . . . . . . 28

7.18.6 System control. . . . . . . . . . . . . . . . . . . . . . . . 28

7.18.6.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

7.18.6.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 28

7.18.6.3 Code security (Code Read Protection - CRP) 28

7.18.6.4 APB interface. . . . . . . . . . . . . . . . . . . . . . . . . 29

7.18.6.5 AHBLite . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

7.18.6.6 External interrupt inputs. . . . . . . . . . . . . . . . . 29

7.19 Emulation and debugging . . . . . . . . . . . . . . . 30

8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 31

9 Static characteristics . . . . . . . . . . . . . . . . . . . 32

9.1 BOD static characteristics . . . . . . . . . . . . . . . 38

9.2 Power consumption . . . . . . . . . . . . . . . . . . . 38

9.3 Peripheral power consumption . . . . . . . . . . . 41

9.4 Electrical pin characteristics. . . . . . . . . . . . . . 43

10 Dynamic characteristics. . . . . . . . . . . . . . . . . 46

10.1 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . 46

10.2 External clock. . . . . . . . . . . . . . . . . . . . . . . . . 46

10.3 Internal oscillators . . . . . . . . . . . . . . . . . . . . . 47

10.4 I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

10.5 I2C-bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

10.6 SSP interface. . . . . . . . . . . . . . . . . . . . . . . . . 50

10.7 USB interface . . . . . . . . . . . . . . . . . . . . . . . . 53

11 Application information . . . . . . . . . . . . . . . . . 54

11.1 Suggested USB interface solutions . . . . . . . . 54

11.2 XTAL input . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

11.3 XTAL Printed-Circuit Board (PCB) layout

guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

11.4 Standard I/O pad configuration . . . . . . . . . . . 58

11.5 Reset pad configuration. . . . . . . . . . . . . . . . . 59

11.6 ADC effective input impedance . . . . . . . . . . . 59

11.7 ADC usage notes. . . . . . . . . . . . . . . . . . . . . . 60

11.8 I/O Handler software library applications . . . . 60

11.8 .1 I/O Handler I2S. . . . . . . . . . . . . . . . . . . . . . . . 60

11.8.2 I/O Handler UART . . . . . . . . . . . . . . . . . . . . . 60

11.8 .3 I/O Handler I2C. . . . . . . . . . . . . . . . . . . . . . . . 61

11.8.4 I/O Handler DMA . . . . . . . . . . . . . . . . . . . . . . 61

12 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 62

13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

14 Revision history . . . . . . . . . . . . . . . . . . . . . . . 72

NXP Semiconductors LPC11U3x

32-bit ARM Cortex-M0 microcontroller

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of rele ase: 25 November 2013

Document identifier : LPC11U3X

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 73

15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 73

15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 73

15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 74

16 Contact information. . . . . . . . . . . . . . . . . . . . . 74

17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75