Table of Contents
ISD
iii
DETAILED DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Speech/Sound Quality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Flash Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Microcontroller Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
PIN DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Voltage Inputs (V
CCA
, V
CCD
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ground Inputs (V
SSA
, V
SSD
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Non-Inverting Analog Input (ANA IN+) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Inverting Analog Input (ANA IN–) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Audio Output (AUD OUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Slave Select (SS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Master Out Slave In (MOSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Master In Slave Out (MISO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Serial Clock (SCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Interrupt (INT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Row Address Clock (RAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
External Clock Input (XCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
AutoMute™ Feature (AM CAP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
SERIAL PERIPHERAL INTERFACE (SPI) DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Message Cueing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
SPI Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
SPI Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
TIMING DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
DEVICE PHYSICAL DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
ISD MicroTAD-16M
iv
Voice Solutions in Silicon™
FIGURES, CHARTS, AND TABLES IN THE ISD MICROTAD-16M DATA SHEET
Figure 1: ISD MicroTAD-16M TSOP and PDIP/SOIC Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Figure 2: ISD MicroTAD-16M ANA IN Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Figure 3: SPI Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Figure 4: SPI Interface Simplified Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Figure 5: Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Figure 6: 8-Bit Command Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Figure 7: 24-Bit Command Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Figure 8: Playback/Record and Stop Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Figure 9: Application Example Using SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Figure 10: Application Example Using Microwire . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Figure 11: Application Example Using SPI Port on Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Figure 12: 28-Lead 8x13.4 mm Plastic Thin Small Outline Package (TSOP) Type I (E) . . . . . . . . . . . . .18
Figure 13: 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) (P) . . . . . . . . . . . . . . . . . . . . . . . . .19
Figure 14: 28-Lead 0.300-Inch Plastic Small Outline Integrated Circuit (SOIC) (S) . . . . . . . . . . . . . . .20
Figure 15: ISD MicroTAD-16M Bonding Physical Layout (Unpackaged Die) . . . . . . . . . . . . . . . . . . . .21
Table 1: External Clock Input Clocking Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Table 2: Opcode Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Table 3: SPI Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Table 4: Absolute Maximum Ratings (Packaged Parts). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Table 5: Operating Conditions (Packaged Parts) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Table 6: DC Parameters (Packaged Parts) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Table 7: AC Parameters (Packaged Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Table 8: Absolute Maximum Ratings (Die). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Table 9: Operating Conditions (Die) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Table 10: DC Parameters (Die) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Table 11: AC Parameters (Die) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Table 12: SPI AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Table 13: Plastic Thin Small Outline Package (TSOP) Type I (E) Dimensions. . . . . . . . . . . . . . . . . . . . .18
Table 14: Plastic Dual Inline Package (PDIP) (P) Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Table 15: Plastic Small Outline Integrated Circuit (SOIC) (S) Dimensions. . . . . . . . . . . . . . . . . . . . . . .20
Table 16: ISD MicroTAD-16M Device Pin/Pad Designations, with Respect to Die Center (mm). . . .22
ISD · 2727 North First Street, San Jose, CA 95125 · TEL: 408/943-6666 · FAX: 408/544-1787 · http://www.isd.com
May 1999
A Winbond Company
®
Figure: ISD MicroTAD-16M Block Diagram
GENERAL DESCRIPTION
The ISD MicroTAD-16M ChipCorder
¨
Product pro-
vides high-quality, 3-volt, single-chip record/
playback solutions for 16-minute messaging ap-
plications which are ideal for telephone answer-
ing devices (TADs). The CMOS-based devices
include an on-chip oscillator, antialiasing filter,
smoothing filter, AutoMute™ feature, audio am-
plifier, and high density, multilevel Flash storage
array. The ISD MicroTAD-16M is designed to be
used in a microprocessor- or microcontroller-
based system. Address and control are accom-
plished through a Serial Peripheral Interface (SPI)
or Microwire Serial Interface to minimize pin
count.
Recordings are stored in on-chip nonvolatile
memory cells, providing zero-power message
storage. This unique, single-chip solution is made
possible through ISD’s patented multilevel stor-
age technology. Voice and audio signals are
stored directly into memory in their natural form,
providing high-quality, solid-state voice repro-
duction.
ISD MicroTAD-16M
Single-Chip Voice Record/Playback Device
16-Minute Duration
Preliminary Data Sheet
ISD MicroTAD-16M
ii
Voice Solutions in Silicon
™
FEATURES
¥
Single-chip voice record/playback solution
¥
Single +3 volt supply
¥
Low-power consumption
Ð
Operating current:
I
CC
Play = 15 mA (typical)
I
CC
Rec = 25 mA (typical)
Ð
Standby current: 1 µA (typical)
¥
Single-chip duration of 16 minutes
¥
4.0 KHz sample rate
¥
Typical band pass filter 1.7 KHz
¥
High-quality, natural voice/audio
reproduction
¥
AutoMute feature provides background
noise attenuation during periods of silence
¥
No algorithm development required
¥
Microcontroller SPI or Microwire™ Serial
Interface
¥
Fully addressable to handle multiple
messages
¥
Nonvolatile message storage
¥
Power consumption controlled by SPI
or Microwire control register
¥
100-year message retention (typical)
¥
100K record cycles (typical)
¥
On-chip clock source
¥
Available in die form, PDIP, SOIC, and TSOP
ISD MicroTAD-16M
1
ISD
DETAILED DESCRIPTION
SPEECH/SOUND QUALITY
The ISD MicroTAD-16M ChipCorder is offered at
4.0 KHz sampling frequency.
The speech samples are stored directly into on-
chip nonvolatile memory without the digitization
and compression associated with other solu-
tions. Direct analog storage provides a natural
sounding reproduction of voice, music, tones,
and sound effects not available with most solid-
state solutions.
FLASH STORAGE
One of the benefits of ISD’s ChipCorder technolo-
gy is the use of on-chip nonvolatile memory, which
provides zero-power message storage. The mes-
sage is retained for up to 100 years (typically)
without power. In addition, the device can be
re-recorded (typically) over 100,000 times.
MICROCONTROLLER INTERFACE
A four-wire (SCLK, MOSI, MISO, SS) SPI interface is
provided for ISD MicroTAD-16M control and ad-
dressing functions. The ISD MicroTAD-16M is con-
figured to operate as a peripheral slave device,
with a microcontroller-based SPI bus interface.
Read/Write access to all the internal registers oc-
curs through this SPI interface. An interrupt signal
(INT) and internal read-only Status Register are
provided for handshake purposes.
PROGRAMMING
The ISD MicroTAD-16M is also ideal for playback-
only applications, where single or multiple mes-
sage Playback is controlled through the SPI port.
Once the desired message configuration is creat-
ed, duplicates can easily be generated via an
ISD programmer or a 3rd party programmer.
PIN DESCRIPTIONS
VOLTAGE INPUTS (V
CCA
, V
CCD
)
To minimize noise, the analog and digital circuits
in the ISD MicroTAD-16M device use separate pow-
er busses. These +3 V busses are brought out to
separate pins and should be tied together as
close to the supply as possible. In addition, these
supplies should be decoupled as close to the
package as possible.
GROUND INPUTS (V
SSA
, V
SSD
)
The ISD MicroTAD-16M utilizes separate analog
and digital ground busses. The analog ground
(V
SSA
) pins should be tied together as close to
the package as possible and connected
through a low-impedance path to power supply
ground. The digital ground (V
SSD
) pin should be
connected through a separate low-impedance
path to power supply ground. These ground
paths should be large enough to ensure that the
impedance between the V
SSA
pins and the V
SSD
pin is less than 3
Ω
. The backside of the die is con-
nected to V
SS
through the substrate resistance.
In a chip-on-board design, the die attach area
must be connected to V
SS
or left floating.
ISD MicroTAD-16M
2
Voice Solutions in Silicon
™
Figure 2: ISD MicroTAD-16M ANA IN Modes
Figure 1: ISD MicroTAD-16M TSOP and PDIP/SOIC Pinouts
28-PIN TSOP
ANA IN+
ANA IN–
NC
INT
XCLK
V
CCD
SCLK
SS
MOSI
MISO
V
SSA
NC
V
SSA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
NC
RAC V
CCA
NC
NC
NC
AM CAP
NC
AUD OUT
NC
V
SSD
NC
NC NC
ISD4004
V
SSA
PDIP/SOIC
NC
V
CCD
INT
V
SSD
V
SSA
NC
NC
NC
ANA IN+
NC
V
SSA
AUD OUT
AM CAP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
SCLK
SS
XCLK
MOSI
MISO
RAC
V
SSA
NC
NC
V
CCA
NC
NC
NC
ISD4004
ANA IN–
NC
ISD MicroTAD-16M
3
ISD
NON-INVERTING ANALOG INPUT (ANA IN+)
This pin is the non-inverting analog input that
transfers the signal to the device for recording.
The analog input amplifier can be driven single
ended or differentially. In the single-ended input
mode, a 32 mVp-p (peak-to-peak) maximum sig-
nal should be capacitively connected to this pin
for optimal signal quality. This capacitor value,
together with the 3 K
Ω
input impedance of ANA
IN+, is selected to give cutoff at the low frequen-
cy end of the voice passband. In the differential-
input mode, the maximum input signal at ANA
IN+ should be 16 mVp-p for optimal signal quali-
ty. The circuit connections for the two modes are
shown in Figure 2 on page 2.
INVERTING ANALOG INPUT (ANA IN–)
This pin is the inverting analog input that transfers
the signal to the device for recording in the dif-
ferential-input mode. In this differential-input
mode, a 16 mVp-p maximum input signal at
ANA IN– should be capacitively coupled to this
pin for optimal signal quality as shown in the ISD
MicroTAD-16M ANA IN Modes, Figure 2. This ca-
pacitor value should be equal to the coupling
capacitor used on the ANA IN+ pin. The input im-
pedance at ANA IN– is nominally 56 K
Ω
. In the sin-
gle-ended mode, ANA IN– should be
capacitively coupled to V
SSA
through a capaci-
tor equal to that used on the ANA IN+ input.
AUDIO OUTPUT (AUD OUT)
This pin provides the audio output to the user.
It is capable of driving a 5 K
Ω
impedance. It is
recommended that this pin be AC coupled.
NOTE
The AUDOUT pin is always at 1.2 volts when
the device is powered up. When in play-
back, the output buffer connected to this
pin can drive a load as small as 5 K
Ω
. When
in record, a resistor connects AUDOUT to
the internal 1.2 volt analog ground supply.
This resistor is approximately 850 K
Ω
. This rel-
atively high impedance allows this pin to
be connected to an audio bus without
loading it down.
SLAVE SELECT (SS)
This input, when LOW, will select the ISD Mi-
croTAD-16M device.
MASTER OUT SLAVE IN (MOSI)
This is the serial input to the ISD MicroTAD-16M
device. The master microcontroller places data
on the MOSI line one half-cycle before the rising
clock edge to be clocked in by the ISD Micro-
TAD-16M device.
MASTER IN SLAVE OUT (MISO)
This is the serial output of the ISD MicroTAD-16M
device. This output goes into a high-impedance
state if the device is not selected.
SERIAL CLOCK (SCLK)
This is the clock input to the ISD MicroTAD-16M. It
is generated by the master device (microcon-
troller) and is used to synchronize data transfers
in and out of the device through the MISO and
MOSI lines. Data is latched into the ISD MicroTAD-
16M on the rising edge of SCLK and shifted out of
the device on the falling edge of SCLK.
INTERRUPT (INT)
The ISD MicroTAD-16M interrupt pin goes LOW
and stays LOW when an Overflow (OVF) or End
of Message (EOM) marker is detected. This is an
open drain output pin. Each operation that ends
in an EOM or Overflow will generate an interrupt
including the message cueing cycles. The inter-
rupt will be cleared the next time an SPI cycle is
initiated. The interrupt status can be read by an
RINT instruction.
Overflow Flag (OVF)
—The Overflow flag indi-
cates that the end of the ISD MicroTAD-16M’s
analog memory has been reached during a
record or playback operation.
End of Message (EOM)
—The End-of-Message
flag is set only during playback operation when
an EOM is found. There are eight EOM flag posi-
tion options per row.
ISD MicroTAD-16M
4
Voice Solutions in Silicon
™
ROW ADDRESS CLOCK (RAC)
This is an open drain output pin that provides a
signal with a 400 ms period at the 4 KHz sampling
frequency. (This represents a single row of memo-
ry and there are 2400 rows of memory in the ISD
MicroTAD-16M devices.) This signal stays HIGH for
350 ms and stays LOW for 50 ms when it reaches
the end of a row.
The RAC pin stays HIGH for 218.76
µ
sec and stays
LOW for 31.26
µ
sec in Message Cueing mode
(see page 5 for a more detailed description of
Message Cueing). Refer to the AC Parameters
table for RAC timing information on other sam-
ple rate products.
When a record command is first initiated, the
RAC pin remains HIGH for an extra T
RACLO
period.
This is due to the need to load sample and hold
circuits internal to the device. This pin can be
used for message management techniques.
EXTERNAL CLOCK INPUT (XCLK)
The external clock input for the ISD MicroTAD-
16M product has an internal pull-down device.
These products are configured at the factory
with an internal sampling clock frequency cen-
tered to ±1 percent of specification. The fre-
quency is then maintained to a variation over
the entire commercial temperature and oper-
ating voltage ranges as defined by the min-
imum/maximum limits in the applicable AC
Parameters table. The internal clock has a toler-
ance, over the extended temperature, industrial
temperature and voltage ranges as defined by
the minimum/maximum limits in the applicable
AC Parameters table. A regulated power supply
is recommended for industrial temperature
range parts. If greater precision is required, the
device can be clocked through the XCLK pin in
Table 1.
This recommended clock rate should not be var-
ied because the antialiasing and smoothing filters
are fixed. Thus, aliasing problems can occur if the
sample rate differs from the one recommended.
The duty cycle on the input clock is not critical,
as the clock is immediately divided by two inter-
nally.
If the XCLK is not used, this input should be
connected to ground.
AUTOMUTE™ FEATURE (AM CAP)
This pin is used in controlling the AutoMute fea-
ture. The AutoMute feature attenuates the signal
when it drops below an internally set threshold.
This helps to eliminate noise (with 6 dB of attenu-
ation) when there is no signal (i.e., during periods
of silence). A 1
µ
F capacitor to ground should be
connected to the AM CAP pin. This capacitor
becomes a part of an internal peak detector
which senses the signal amplitude (peak). This
peak level is compared to an internally set
threshold to determine the AutoMute trip point.
For large signals the AutoMute attenuation is set
to 0 dB while 6 dB of attenuation occurs for
silence. The 1
µ
F capacitor also affects the rate
at which the AutoMute feature changes with the
signal amplitude (or the attack time). The Auto-
mute feature can be disabled by connecting
the AM CAP pin to V
CCA
.
T
RAC
ROW (400 ms)
RAC
50 ms
T
RACLO
Table 1: External Clock Input Clocking
Table
Part Number Sample Rate Required Clock
ISD MicroTAD-16M 4.0 KHz 512 KHz
ISD MicroTAD-16M
5
ISD
SERIAL PERIPHERAL INTERFACE (SPI) DESCRIPTION
The ISD MicroTAD-16M operates from an SPI serial
interface. The SPI interface operates with the fol-
lowing protocol.
The data transfer protocol assumes that the mi-
crocontroller’s SPI shift registers are clocked on
the falling edge of the SCLK. With the ISD Micro-
TAD-16M, data is clocked in on the MOSI pin on
the rising clock edge. Data is clocked out on the
MISO pin on the falling clock edge.
1.
All serial data transfers begin with the fall-
ing edge of SS pin.
2.
SS is held LOW during all serial communica-
tions and held HIGH between instructions.
3.
Data is clocked in on the rising clock edge
and data is clocked out on the falling
clock edge.
4.
Play and Record operations are initiated
by enabling the device by asserting the SS
pin LOW, shifting in an opcode and an
address field to the ISD MicroTAD-16M de-
vice (refer to the Opcode Summary on
the page 6).
5.
The opcodes and address fields are as fol-
lows: <8 control bits> and <16 address
bits>.
6.
Each operation that ends in an EOM or
Overflow will generate an interrupt, in-
cluding the Message Cueing cycles. The
Interrupt will be cleared the next time an
SPI cycle is initiated.
7.
As Interrupt data is shifted out of the ISD
MicroTAD-16M MISO pin, control and ad-
dress data is simultaneously being shifted
into the MOSI pin. Care should be taken
such that the data shifted in is compatible
with current system operation. It is possible
to read interrupt data and start a new op-
eration within the same SPI cycle.
8.
An operation begins with the RUN bit set
and ends with the RUN bit reset.
9.
All operations begin with the rising edge
of SS.
MESSAGE CUEING
Message cueing allows the user to skip through
messages, without knowing the actual physical
location of the message. This operation is used
during playback. In this mode, the messages are
skipped 1600 times faster than in normal play-
back mode. It will stop when an EOM marker is
reached. Then, the internal address counter will
point to the next message.
If you are utilizing the Message Cueing Com-
mand, you must perform the following Message
Cueing procedure to ensure proper Message
Cueing for the MicroTAD product. Failure to fol-
low this procedure may result in inaccurate Mes-
sage Cueing.
Procedure for Proper Message Cueing:
A single “dummy” STOP command must be sent
to the device before executing a Message Cue-
ing (MC) or SET Message Cueing (SET MC) In-
struction.
The “dummy” STOP instruction consists of a com-
mand with control bits set as follows:
RUN bit = 0
PLAY/RECORD bit = 0
PU bit = 1
IAB bit = 1
MC bit = 0
That is, a hex “30” is shifted into the device as a
command.
One or more MC or SET MC commands may be
executed following this command. It is not nec-
essary to repeat the “dummy” STOP command
until after a subsequent playback operation.
ISD MicroTAD-16M
6
Voice Solutions in Silicon
™
1.
Message Cueing can be selected only at the beginning of a play operation.
2.
As the Interrupt data is shifted out of the ISD MicroTAD-16M, control and address data is being shifted in. Care should
be taken such that the data shifted in is compatible with current system operation. It is possible to read interrupt
data and start a new operation at the same time. See Figure 5 through Figure 8 for Opcode format.
POWER-UP SEQUENCE
The ISD MicroTAD-16M will be ready for an oper-
ation after T
PUD
(50 ms approximately for 4 KHz
sample rate). The user needs to wait T
PUD
before is-
suing an operational command. For example, to
play from address 00 the following programing
cycle should be used.
Playback Mode
1.
Send POWERUP command.
2.
Wait T
PUD
(power-up delay).
3.
Send SETPLAY command with address 00.
4.
Send PLAY command.
The device will start playback at address 00 and
it will generate an interrupt when an EOM is
reached. It will then stop playback.
Record Mode
1.
Send POWERUP command.
2.
Wait T
PUD
(power-up delay).
3.
Send POWERUP command.
4.
Send SETREC command with address 00.
5.
Send REC command.
The device will start recording at address 00 and
it will generate an interrupt when an overflow is
reached (end of memory array). It will then stop
recording.
Table 2: Opcode Summary
Instruction Opcode <8 bits>
Address <16 bits> Operational Summary
POWERUP 00100XXX Power-Up: Device will be ready for an operation after T
PUD
.
SETPLAY 11100XXX <A15–A0> Initiates Playback from address <A15–A0>.
PLAY 11110XXX Playback from the current address (until EOM or OVF).
SETREC 10100XXX <A15–A0> Initiates a Record operation from address <A15–A0>.
REC 10110XXX Records from current address until OVF is reached.
SETMC 11101XXX <A15–A0> Initiates Message Cueing (MC) from address <A15–A0>.
MC
1
11111XXX Performs a Message Cue. Proceeds to the end of the current message
(EOM) or enters OVF condition if no more messages are present.
STOP 0X110XXX Stops current operation.
STOPPWRDN 0X01XXXX Stops current Operation and enters stand-by (power-down) mode.
RINT
2
0X110XXX Read Interrupt status bits: Overflow and EOM.
ISD MicroTAD-16M
7
ISD
SPI PORT
The following diagram describes the SPI port and the control bits associated with it.
Figure 3: SPI Port
SPI CONTROL REGISTER
The SPI control register provides control of individual device functions such as Play, Record, Message
Cueing, Power-Up and Power-Down, Start and Stop operations, and Ignore Address pointers.
Table 3: SPI Control Register
Control
Register Bit Device Function Control
Register Bit Device Function
RUN Enable or Disable an operation PU Master power control
=
=
1
0
Start
Stop
=
=
1
0
Power-Up
Power-Down
P/R Selects Play or Record operation IAB Ignore address control bit
=
=
1
0
Play
Record
=
=
1
0
Ignore input address register (A15–A0)
Use the input address register contents
for an operation (A15–A0)
MC Enable or Disable Message
Cueing
P15–P0 Output of the row pointer register
=
=
1
0
Enable Message Cueing
Disable Message Cueing
A15–A0 Input address register
ISD MicroTAD-16M
8
Voice Solutions in Silicon
™
Figure 4: SPI Interface Simplified Block Diagram
1.
Stresses above those listed may cause permanent
damage to the device. Exposure to the absolute
maximum ratings may affect device reliability.
Functional operation is not implied at these
conditions.
Table 4: Absolute Maximum Ratings
(Packaged Parts)
(1)
Condition Value
Junction temperature 150°C
Storage temperature range –65°C to +150°C
Voltage applied to any pin (V
SS
– 0.3 V) to
(V
CC
+ 0.3 V)
Voltage applied to any pin
(Input current limited to ±20 mA)
(V
SS
– 1.0 V) to
(V
CC
+ 1.0 V)
Lead temperature
(soldering – 10 seconds)
300°C
V
CC
– V
SS
–0.3 V to +7.0 V
1. V
CC
= V
CCA
= V
CCD.
2. V
SS
= V
SSA
= V
SSD
.
Table 5: Operating Conditions
(Packaged Parts)
Condition Value
Consumer operating
temperature range
0°C to +50°C
Supply voltage (VCC)(1) +2.85 V to +3.15 V
Ground voltage (VSS)(2) 0 V
ISD MicroTAD-16M
9
ISD
1. Typical values: T
A
= 25°C and 3.0 V.
2. All min/max limits are guaranteed by ISD via electrical testing or characterization. Not all specifications are
100 percent tested.
3. V
CCA
and V
CCD
connected together.
4. SS = V
CCA
= V
CCD
, XCLK = MOSI = V
SSA
= V
SSD
and all other pins floating.
5. Measured with AutoMute feature disabled.
Table 6: DC Parameters (Packaged Parts)
Symbol Parameters Min(2) Typ(1) Max(2) Units Conditions
VIL Input Low Voltage VCC x 0.2 V
VIH Input High Voltage VCC x 0.8 V
VOL Output Low Voltage 0.4 V IOL = 10 µA
VOL1 RAC, INT Output Low Voltage 0.4 V IOL = 1 mA
VOH Output High Voltage VCC – 0.4 V IOH = –10 µA
ICC VCC Current (Operating)
— Playback
— Record
15
25
30
40
mA
mA
REXT = ∞(3)
REXT = ∞ (3)
ISB VCC Current (Standby) 1 10 µA (3) (4)
IIL Input Leakage Current ±1 µA
IHZ MISO Tristate Current 1 10 µA
REXT Output Load Impedance 5 KΩ
RANA IN+ ANA IN+ Input Resistance 2.2 3.0 3.8 KΩ
RANA IN– ANA IN– Input Resistance 40 56 71 KΩ
AARP ANA IN+ or ANA IN– to AUD OUT Gain 25 dB (5)
ISD MicroTAD-16M
10
Voice Solutions in Silicon
™
1. Typical values: T
A
= 25°C and 3.0 V.
2. All min/max limits are guaranteed by ISD via electrical testing or characterization. Not all specifications are 100 percent
tested.
3. Low-frequency cut off depends upon the value of external capacitors (see Pin Descriptions).
4. Single-ended input mode. In the differential input mode, V
IN
maximum for ANA IN+ and ANA IN– is 16mVp-p.
5. For greater stability, an external clock can be utilized (see Pin Descriptions).
6. Filter specification applies to the antialiasing filter and the smoothing filter. Therefore, from input to output, expect a 6dB
drop by nature of passing through both filters.
7. The typical output voltage will be approximately 570mVp-p with V
IN
at 32mVp-p.
8. For optimal signal quality, this maximum limit is recommended.
9. When a record command is sent, T
RAC
= T
RAC
+ T
RACLO
on the first row addressed.
Table 7: AC Parameters (Packaged Parts)
Symbol Characteristic Min(2) Typ(1) Max(2) Units Conditions
FSSampling Frequency 4.0 KHz (5)
FCF Filter Pass Band 1.7 KHz 3-dB Roll-Off Point(3) (7)
TREC Record Duration 16 min (6)
TPLAY Playback Duration 16 min
TPUD Power-Up Delay 50 msec
TSTOP or
TPAUSE
Stop or Pause in Record
or Play
100 msec
TRAC RAC Clock Period 400 msec (9)
TRACLO RAC Clock Low Time 50 msec
TRACM RAC Clock Period in
Message Cueing Mode
250 µsec
TRACML RAC Clock Low Time in
Message Cueing Mode
31.25 µsec
THD Total Harmonic Distortion 1 2 % @ 1 KHz
VIN ANA IN Input Voltage 32 mV Peak-to-Peak(4) (7) (8)
ISD MicroTAD-16M
11
ISD
1. Stresses above those listed may cause permanent
damage to the device. Exposure to the absolute
maximum ratings may affect device reliability.
Functional operation is not implied at these conditions.
1. Case temp
2. V
CC
= V
CCA
= V
CCD
3. V
SS
= V
SSA
= V
SSD
.
1. Typical values: T
A
= 25°C and 3.0 V.
2. All min/max limits are guaranteed by ISD via electrical testing or characterization. Not all specifications are
100 percent tested.
3. V
CCA
and V
CCD
connected together.
4. SS = V
CCA
= V
CCD
, XCLK = MOSI = V
SSA
= V
SSD
and all other pins floating.
5. Measured with AutoMute feature disabled.
Table 8: Absolute Maximum Ratings (Die)(1)
Condition Value
Junction temperature 150°C
Storage temperature range –65°C to +150°C
Voltage applied to any pad (VSS – 0.3 V) to
(VCC + 0.3 V)
Voltage applied to any pad
(Input current limited to ±20 mA)
(VSS – 1.0 V) to
(VCC + 1.0 V)
VCC – VSS –0.3 V to +7.0 V
Table 9: Operating Conditions (Die)
Condition Value
Consumer operating
temperature range (1) 0°C to +50°C
Supply voltage (VCC)(2) +2.85 V to +3.15 V
Ground voltage (VSS)(3) 0 V
Table 10: DC Parameters (Die)
Symbol Parameters Min(2) Typ(1) Max(2) Units Conditions
VIL Input Low Voltage VCC x 0.2 V
VIH Input High Voltage VCC x 0.8 V
VOL Output Low Voltage 0.4 V IOL = 10 µA
VOL1 RAC, INT Output Low Voltage 0.4 V IOL = 1 mA
VOH Output High Voltage VCC – 0.4 V IOH = –10 µA
ICC VCC Current (Operating)
— Playback
— Record
15
25
30
40
mA
mA
REXT = ∞ (3)
REXT = ∞ (3)
ISB VCC Current (Standby) 1 10 µA (3) (4)
IIL Input Leakage Current ±1 µA
IHZ MISO Tristate Current 1 10 µA
REXT Output Load Impedance 5 KΩ
RANA IN+ ANA IN+ Input Resistance 2.2 3.0 3.8 KΩ
RANA IN– ANA IN– Input Resistance 40 56 71 KΩ
AARP ANA IN+ or ANA IN– to AUDOUT Gain 25 dB (5)
ISD MicroTAD-16M
12
Voice Solutions in Silicon
™
1. Typical values: T
A
= 25°C and 3.0 V.
2. All min/max limits are guaranteed by ISD via electrical testing or characterization. Not all specifications are 100
percent tested.
3. Low-frequency cut off depends upon the value of external capacitors (see Pin Descriptions).
4. Single-ended input mode. In the differential input mode, V
IN
maximum for ANA IN+ and ANA IN– is 16 mV
peak-to-peak.
5. For greater stability, an external clock can be utilized (see Pin Descriptions).
6. Filter specification applies to the antialiasing filter and to the smoothing filter.
7. The typical output voltage will be approximately 570 mV peak-to-peak with V
IN
at 32 mV peak-to-peak.
8. For optimal signal quality, this maximum limit is recommended.
9. When a record command is sent, T
RAC
= T
RAC
+ T
RACLO
on the first row addressed.
Table 11: AC Parameters (Die)
Symbol Characteristic Min(2) Typ(1) Max(2) Units Conditions
FSSampling Frequency 4.0 KHz (5)
FCF Filter Pass Band 1.7 KHz 3dB Roll-Off Point (3) (6)
TREC Record Duration 16 min (5)
TPLAY Playback Duration 16 min (5)
TPUD Power-Up Delay 50 msec
TSTOP or
TPAUSE
Stop or Pause in Record
or Play
100 msec
TRAC RAC Clock Period 400 msec (9)
TRACLO RAC Clock Low Time 50 msec
TRACM RAC Clock Period in
Message Cueing Mode
250 µsec
TRACML RAC Clock Low Time in
Message Cueing Mode
31.25 µsec
THD Total Harmonic Distortion 1 2 % @ 1 KHz
VIN ANA IN Input Voltage 32 mV Peak-to-Peak(4) (7) (8)
ISD MicroTAD-16M
13
ISD
1. Typical values: T
A
= 25°C and 3.0 V. Timing measured at 50 percent of the V
CC
level.
2. Tristate test condition.
Table 12: SPI AC Parameters1
Symbol Characteristics Min Max Units Conditions
TSSS SS Setup Time 500 nsec
TSSH SS Hold Time 500 nsec
TDIS Data in Setup Time 200 nsec
TDIH Data in Hold Time 200 nsec
TPD Output Delay 500 nsec
TDF(2) Output Delay to hiΖ500 nsec
TSSmin SS HIGH 1 µsec
TSCKhi SCLK High Time 400 nsec
TSCKlow SCLK Low Time 400 nsec
F0CLK Frequency 1,000 KHz
ISD MicroTAD-16M
14
Voice Solutions in Silicon
™
TIMING DIAGRAMS
Figure 5: Timing Diagram
Figure 6: 8-Bit Command Format
XX X C0 C2
P5P4P3P2P1P0EOMOVF
SS
SCLK
MOSI
MISO
C4C3C1
(1)
ISD MicroTAD-16M
15
ISD
Figure 7: 24-Bit Command Format
Figure 8: Playback/Record and Stop Cycle
SS
MOSI
MISO
A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 X X X C0 C1 C2 C3 C4
A0 A1 A2 A3 A4 A5
P4 P5 P6 P7 P8 P9OVF EOM P0 P1 P2 P3 P10
SCLK
BYTE 1 BYTE 2 BYTE 3
P11 P12 P13 P14 P15 XXXXXX
ISD MicroTAD-16M
16
Voice Solutions in Silicon
™
Figure 9: Application Example Using SPI(1)
1. This application example is for illustration purposes only. ISD makes no representation or warranty that such
application will be suitable for production.
2. Please make sure the bypass capacitor, C2 is as close as possible to the package.
3
2
4
5
1
J1
LINE OUT
R2
1M
C5
1 µF
R1
10K
R3 100 R4
100K POT 3
1
2
11
GAIN-OUT
V01
V02
VDD
GND
GND
GND
GND
GND
ñIN
+IN
BYPASS
HP-IN1
HP-IN2
HPSENSE
SHUTDOWN
LM4860M
AUDIO AMPLIFIER
U3
10
15
12
1
4
8
9
16
2
3
7
6
5
14
13
C6
1 µFC7
.1 µF
3
2
4
5
1
J4
EXT
SPEAKER
14
13
3
2
28
1
16
17
24
25
26
AUD OUT
AM CAP
MISO
MOSI
SCLK
SS
ANA IN–
ANA IN+
RAC
INT
XCLK
U1
ISD MicroTAD-16M
C11
0.1 µF
C10
0.1 µF
VCC
R6
47KW PA0
TCMP
PC6
PC0
TCAP
PD4/SCK
PD3/MOSI
PD2/MISO
PD1/TD0 30
31
32
33
28
38
37
35
11
OSC2
68HC705C8P
U2
PD0/RDI 29
PD5/SS 34
PC5
PC4
PC3
PC2 26
25
24
23
PC1 27
22
PB2
PB1
PB0 12
13
14
PC7 21
PB3 15
PA4
PA3
PA2
9
8
7
PA1
10
OSC1
39
C8
15ñ25pF
R7
10KW
C9
15ñ30pF
RESET
1
IRQ
2
PB6
PB5
PB4 16
17
18
PB7 19
PA5
6
PA7
4PA6
5
PD7
VCC
R5
47KW
C4
1 µF
C1
22 µF
VCC
11
12
23
4
18
27
VCCA
VCCD
VSSD
VSSA
VSSA
VSSA
C3
0.1 µFC2
0.1 µF
4.096
MHz
ISD MicroTAD-16M
17
ISD
Figure 10: Application Example Using Microwire(1)
1. This application example is for illustration purposes only. ISD makes no representation or warranty that such
application will be suitable for production.
2. Please make sure the bypass capacitor, C2 is as close as possible to the package.
Figure 11: Application Example Using SPI Port on Microcontroller(1)
1. This application example is for illustration purposes only. ISD makes no representation or warranty that such
application will be suitable for production.
2. Please make sure the bypass capacitor, C2 is as close as possible to the package.
3
2
4
5
1
J1
LINE OUT
R2
1M
C5
1 µF
C4
1 µF
R1
10K
R3 100 R4
100K POT
3
1
2
11
GAIN-OUT
V01
V02
V
DD
GND
GND
GND
GND
GND
ñIN
+IN
BYPASS
HP-IN1
HP-IN2
HPSENSE
SHUTDOWN
LM4860M
AUDIO AMPLIFIER
U
3
10
15
12
1
4
8
9
16
2
3
7
6
5
14
13
C6
1 µF
C7
.1 µF
3
2
4
5
1
J4
EXT
SPEAKER
14
13
3
2
28
1
16
17
24
25
26
AUD OUT
AM CAP
MISO
MOSI
SCLK
SS
ANA INñ
ANA IN+
RAC
INT
XCLK
U
1
R5
4.7KW
R6
4.7KW
V
CC
C9
0.1 µF
C8
0.1 µF
V
CC
V
CC
C10
82pF
R7
3.3KW
CLI
V
CC
L6
INT
RESET
G3
D0
D1
D2
21
20
19
28
25
23
24
6
5
GND
COP 820C
U
2
D3
22
G2
27
G1
26
L7
SO
G7
SK
2
4
1
18
SI
3
17
L1
L2
L3
L4
15
14
13
12
L5
16
L0
11
13
12
11
8
9
10
10
7
ISD MicroTAD-16M
C1
22 µF
V
CC
11
12
23
4
18
27
V
CCA
V
CCD
V
SSD
V
SSA
V
SSA
V
SSA
C3
0.1 µFC2
0.1 µF
3
2
4
5
1
J1
LINE OUT
R2
1M
C5
1 µF
C4
1 µF
R1
10K
R3 100 R4
100K POT
3
1
2
11
GAIN-OUT
V01
V02
V
DD
GND
GND
GND
GND
GND
ñIN
+IN
BYPASS
HP-IN1
HP-IN2
HPSENSE
SHUTDOWN
LM4860M
AUDIO AMPLIFIER
U
3
10
15
12
1
4
8
9
16
2
3
7
6
5
14
13
C6
1 µF
C7
.1 µF
3
2
4
5
1
J4
EXT
SPEAKER
14
13
3
2
28
1
16
17
24
25
26
AUD OUT
AM CAP
MISO
MOSI
SCLK
SS
ANA INñ
ANA IN+
RAC
INT
XCLK
R5
4.7KW
R6
4.7KW
V
CC
C9
0.1 µF
C8
0.1 µF
V
CC
V
CC
C10
R7
V
DD
RB0
MCLR
RA5
RC3
RC5
RC4
15
14
7
21
8
1
20
V
SS
PIC16C62A
U
2
RC0
11
OSC1
9
V
SS
16
19
ISD MicroTAD-16M
C1
22 µF
V
CC
11
12
23
4
18
27
V
CCA
V
CCD
V
SSD
V
SSA
V
SSA
V
SSA
C3
0.1 µFC2
0.1 µF
U
1
ISD MicroTAD-16M
18
Voice Solutions in Silicon
™
DEVICE PHYSICAL DIMENSIONS
Figure 12: 28-Lead 8x13.4 mm Plastic Thin Small Outline Package (TSOP) Type I (E)
NOTE: Lead coplanarity to be within 0.004 inches.
Table 13: Plastic Thin Small Outline Package (TSOP) Type I (E) Dimensions
INCHES MILLIMETERS
Min Nom Max Min Nom Max
A 0.520 0.528 0.535 13.20 13.40 13.60
B 0.461 0.465 0.469 11.70 11.80 11.90
C 0.311 0.315 0.319 7.90 8.00 8.10
D 0.002 0.006 0.05 0.15
E 0.007 0.009 0.011 0.17 0.22 0.27
F 0.0217 0.55
G 0.037 0.039 0.041 0.95 1.00 1.05
H0°3°6°0°3°6°
I 0.020 0.022 0.028 0.50 0.55 0.70
J 0.004 0.008 0.10 0.21
ISD MicroTAD-16M
19
ISD
Figure 13: 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) (P)
Table 14: Plastic Dual Inline Package (PDIP) (P) Dimensions
INCHES MILLIMETERS
Min Nom Max Min Nom Max
A 1.445 1.450 1.455 36.70 36.83 36.96
B1 0.150 3.81
B2 0.065 0.070 0.075 1.65 1.78 1.91
C1 0.600 0.625 15.24 15.88
C2 0.530 0.540 0.550 13.46 13.72 13.97
D 0.19 4.83
D1 0.015 0.38
E 0.125 0.135 3.18 3.43
F 0.015 0.018 0.022 0.38 0.46 0.56
G 0.055 0.060 0.065 1.40 1.52 1.65
H 0.100 2.54
J 0.008 0.010 0.012 0.20 0.25 0.30
S 0.070 0.075 0.080 1.78 1.91 2.03
q 0° 15° 0° 15°
ISD MicroTAD-16M
20
Voice Solutions in Silicon
™
Figure 14: 28-Lead 0.300-Inch Plastic Small Outline Integrated Circuit (SOIC) (S)
NOTE: Lead coplanarity to be within 0.004 inches.
Table 15: Plastic Small Outline Integrated Circuit (SOIC) (S) Dimensions
INCHES MILLIMETERS
Min Nom Max Min Nom Max
A 0.701 0.706 0.711 17.81 17.93 18.06
B 0.097 0.101 0.104 2.46 2.56 2.64
C 0.292 0.296 0.299 7.42 7.52 7.59
D 0.005 0.009 0.0115 0.127 0.22 0.29
E 0.014 0.016 0.019 0.35 0.41 0.48
F 0.050 1.27
G 0.400 0.406 0.410 10.16 10.31 10.41
H 0.024 0.032 0.040 0.61 0.81 1.02
ISD MicroTAD-16M
21
ISD
Figure 15: ISD MicroTAD-16M Bonding Physical Layout1 (Unpackaged Die)
1. The backside of die is internally connected to V
SS
. It MUST NOT be connected to any other potential or damage
may occur.
2. Double bond recommended.
3. This figure reflects the current die thickness. Please contact ISD as this thickness may change in the future.
ISD MicroTAD-16M
I. Die Dimensions
X: 4230 microns
Y: 9780 microns
I. Die Thickness(3)
11.5 ±0.5 mils
I. Pad Opening (min)
90 x 90 microns
3.5 x 3.5 mils
VCCD1
VSSA
AUD OUT
AM CAP
ANA IN–
INT
VSSA
XCLK
VCCD2
SS
MOSI
MISOVSSD2
VSSD1
ISD MicroTAD-16M
RAC
SCLK
VSSA(2)
ANA IN+
VCCA(2)
ISD MicroTAD-16M
22
Voice Solutions in Silicon
™
1. Double bond recommended.
Table 1: ISD MicroTAD-16M Device Pin/Pad Designations,
with Respect to Die Center (µm)
Pin Pin Name X Axis Y Axis
VSSA VSS Analog Power Supply –1898.1 –4622.4
VSSA VSS Analog Power Supply –1599.9 –4622.4
AUD OUT Audio Output 281.9 –4622.4
AM CAP AutoMute 577.3 –4622.4
ANA IN – Inverting Analog Input 1449.4 –4622.4
ANA IN + Noninverting Analog Input 1603.5 –4622.4
VCCA(1) VCC Analog Power Supply 1898.7 –4622.4
VSSA VSS Analog Power Supply 1885.2 –4622.4
RAC Row Address Clock 1483.8 4623.7
INT Interrupt 794.8 4623.7
XCLK External Clock Input 564.8 4623.7
VCCD2 VCC Digital Power Supply 387.9 4623.7
VCCD1 VCC Digital Power Supply 169.5 4623.7
SCLK Slave Clock –14.7 4623.7
SS Slave Select –198.1 4623.7
MOSI Master Out Slave In –1063.7 4623.7
MISO Master In Slave Out –1325.6 4623.7
VSSD1 VSS Digital Power Supply –1655.3 4623.7
VSSD2 VSS Digital Power Supply –1836.9 4623.7
ISD MicroTAD-16M
23
ISD
ORDERING INFORMATION
When ordering ISD MicroTADTM devices, please refer to the following valid part numbers.
For the latest product information, access ISD’s worldwide website at http://www.isd.com.
Part Number
ISD MicroTAD-16ME
ISD MicroTAD-16MP
ISD MicroTAD-16MS
ISD MicroTAD-16MX
Product Family
ISD MicroTADTM
Special Temperature Field:
Blank= Consumer Packaged (0˚C to +50˚C)
or Consumer Die (0˚C to +50˚C)
Package Type:
E= 28-Lead 8x13.4mm Plastic Thin Small Outline
Package (TSOP) Type 1
P= 28-Lead 0.600-Inch Plastic Dual Inline
Package (PDIP)
S= 28-Lead 0.300-Inch Plastic Small Outline
Package (SOIC)
X= Die
ISD Part Number Description
ISD MicroTAD 16M
Duration:
16M=16 minutes
A Winbond Company
®
Part No. ISDMicroTADDS1-599
2727 North First Street
San Jose, California 95134
800/677-0769 (US Only)
Tel: 408/943-6666
Fax: 408/544-1787
http://www.isd.com
IMPORTANT NOTICES
The warranty for each product of ISD (Information Storage
Devices, Inc.), is contained in a written warranty which governs
sale and use of such product. Such warranty is contained in the
printed terms and conditions under which such product is sold, or
in a separate written warranty supplied with the product. Please
refer to such written warranty with respect to its applicability to
certain applications of such product.
These products may be subject to restrictions on use. Please
contact ISD, for a list of the current additional restrictions on
these products. By purchasing these products, the purchaser of
these products agrees to comply with such use restrictions. Please
contact ISD for clarification of any restrictions described herein.
ISD, reserves the right, without further notice, to change the ISD
ChipCorder product specifications and/or information in this
document and to improve reliability, functions and design.
ISD assumes no responsibility or liability for any use of the ISD
ChipCorder products. ISD conveys no license or title, either
expressed or implied, under any patent, copyright, or mask work
right to the ISD ChipCorder products, and ISD makes no
warranties or representations that the ISD ChipCorder products are
free from patent, copyright, or mask work right infringement,
unless otherwise specified.
Application examples and alternative uses of any integrated
circuit contained in this publication are for illustration purposes
only and ISD makes no representation or warranty that such
applications shall be suitable for the use specified.
The 100-year retention and 100K record cycle projections are
based upon accelerated reliability tests, as published in the ISD
Reliability Report, and are neither warranted nor guaranteed by
ISD.
This data sheet and any future addendum to this data sheet is
(are) the complete and controlling ISD ChipCorder product
specifications. In the event any inconsistencies exist between the
information in this and other product documentation, or in the
event that other product documentation contains information in
addition to the information in this, the information contained
herein supersedes and governs such other information in its entirety.
Copyright© 1999, ISD (Information Storage Devices, Inc.) All rights
reserved. ISD is a registered trademark of ISD. ChipCorder and
MicroTAD are trademarks of ISD. All other trademarks are
properties of their respective owners.
