INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-PLA190-R04 1
PLA190
Single Pole, Normally Open
OptoMOS® Relay
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Pb
Applications
Features
Description
Ordering Information
Parameter Rating Units
Blocking Voltage 400 VP
Load Current 150 mArms / mADC
On-Resistance (max) 22
Pin Configuration
Part Number Description
PLA190 6-Pin DIP (50/Tube)
PLA190S 6-Pin Surface Mount (50/Tube)
PLA190STR 6-Pin Surface Mount (1,000/Reel)
Switching Characteristics of
Normally Open Devices
• 5000Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Version Available
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security Systems
• Aerospace
• Industrial Controls
Approvals
Form-A
IF
ILOAD
10%
90%
ton toff
1
3
2
4
5
6
+ Control
- Control
NC
Load
Do Not Use
Load
AC/DC Configuration
1
3
2
4
5
6
+ Control
- Control
NC
+ Load
- Load
DC-Only Configuration
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
The PLA190 is a 400V, single-pole, normally open
(1-Form-A) solid state relay that uses optically
coupled relay technology to provide an enhanced
5000Vrms isolation barrier between the input and
output of the relay.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R04
PLA190
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Ratings Units
Blocking Voltage 400 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 5000 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current (Continuous)
AC/DC Configuration -I
L
- - 150 mArms / mADC
DC Configuration - - 250 mADC
Peak Load Current t=10ms ILPK - - ±400 mAP
On-Resistance
AC/DC Configuration IF=150mA RON
--22
DC Configuration IF=250mA - - 7
Off-State Leakage Current VL=400VPILEAK -- 1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton -- 1 ms
Turn-Off toff - - 0.5
Output Capacitance VL=50V, f=1mHz COUT -25 - pF
Input Characteristics
Input Control Current to Activate IL=150mA IF-- 5 mA
Input Control Current to Deactivate - IF0.4 0.7 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics
Input to Output Capacitance - CI/O -3 - pF
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PLA190
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R04
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
LED Forward Voltage (V)
1.23 1.24 1.25 1.26 1.27 1.28
Device Count (N)
0
5
10
15
20
25
30
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Turn-On Time (ms)
0.24 0.26 0.28 0.30 0.32 0.34 0.36
Device Count (N)
0
5
10
15
20
25
30
Typical Turn-On Time
(N=50, IF=5mA, IL=150mA)
Turn-Off Time (ms)
0.11 0.12 0.13 0.14 0.15 0.16 0.17
Device Count (N)
0
5
10
15
20
25
30
Typical Turn-Off Time
(N=50, IF=5mA, IL=150mA)
LED Current (mA)
0.25 0.35 0.45 0.55 0.65 0.75 0.85
Device Count (N)
0
5
10
15
20
25
30
Typical IF for Switch Operation
(N=50, IL=150mA)
On-Resistance (:)
13.9 14.0 14.1 14.2 14.3 14.4 14.5
Device Count (N)
0
5
10
15
20
25
30
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=150mA)
Blocking Voltage (VP)
460 465 470 475 480 485
Device Count (N)
0
5
10
15
20
25
30
Typical Blocking Voltage Distribution
(N=50)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
LED Forward Current (mA)
0 1020304050
Turn-On Time (ms)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Typical Turn-On Time
vs. LED Forward Current
(IL=30mA)
LED Forward Current (mA)
0 1020304050
Turn-Off Time (ms)
0.132
0.134
0.136
0.138
0.140
0.142
0.144
Typical Turn-Off Time
vs. LED Forward Current
(IL=30mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current to Operate (mA)
0.40
0.45
0.50
0.55
0.60
0.65
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
0.25
0.30
0.35
0.40
0.45
Typical Turn-On Time vs. Temperature
(IF=5mA, IL=80mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (ms)
0.10
0.11
0.12
0.13
0.14
0.15
0.16
0.17
0.18
Typical Turn-Off Time vs. Temperature
(IF=5mA, IL=80mA)
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R04
PLA190
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
11
12
13
14
15
16
17
18
Typical On-Resistance vs. Temperature
(IF=5mA, IL=100mA)
Load Voltage (V)
-2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0
Load Current (mA)
-150
-100
-50
0
50
100
150
Typical Load Current vs. Load Voltage
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
100
110
120
130
140
150
160
Maximum Load Current vs. Temperature
AC/DC Configuration
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
170
180
190
200
210
220
230
240
250
260
Maximum Load Current vs. Temperature
DC-Only Configuration
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
450
455
460
465
470
475
480
485
490
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
3
4
5
6
7
8
9
Leakage Current vs. Temperature
Measured Across Pins 5&6
(VL=400V)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (A)
0.0
0.2
0.4
0.6
0.8
1.0
Energy Rating Curve, Single Pole
(IF=5mA)
INTEGRATED CIRCUITS DIVISION
PLA190
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Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
PLA190 / PLA190S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
PLA190 / PLA190S 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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Pb
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
6R04
PLA190
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002) 4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020) 6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
PLA190
PLA190S
Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION
Specification: DS-PLA190-R04
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
For additional information please visit our website at: www.ixysic.com
7
PLA190
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Dimensions
mm
(inches)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
A0 = 10.10
(0.398)
P = 12.00
(0.472)
K1 = 3.80
(0.15)
K0 = 4.90
(0.19)
User Direction of Feed
PLA190STR Tape & Reel
Mouser Electronics
Authorized Distributor
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