RGRF
R1
C1
VIN
VOUT
= 1 +
V
V
OUT
IN
R
R
F
G
1
1 + sR C
1 1
( (
((
1
2pR C
1 1
f =
-3 dB
Product
Folder
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Now
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Software
Support &
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
Industry-Standard Dual Operational Amplifiers
1
1 Features
1• Wide supply range of 3 V to 36 V (B version)
• Quiescent current: 300 µA per amplifier (B
version, typical)
• Unity-gain bandwidth of 1.2 MHz (B version)
• Common-mode input voltage range includes
ground, enabling direct sensing near ground
• Low input offset voltage of 3 mV at 25°C (A and B
versions, maximum)
• Internal RF and EMI filter (B version)
• On products compliant to MIL-PRF-38535, all
parameters are tested unless otherwise noted. On
all other products, production processing does not
necessarily include testing of all parameters.
2 Applications
•Merchant network and server power supply units
•Multi-function printers
•Power supplies and mobile chargers
•Motor control: AC induction, brushed DC,
brushless DC, high-voltage, low-voltage,
permanent magnet, and stepper motor
•Desktop PC and motherboard
•Indoor and outdoor air conditioners
•Washers, dryers, and refrigerators
•AC inverters, string inverters, central inverters,
and voltage frequency drives
•Uninterruptible power supplies
•Programmable logic controllers
•Electronic point-of-sale systems
Single-Pole, Low-Pass Filter
3 Description
The LM358B and LM2904B devices are the next-
generation versions of the industry-standard
operational amplifiers (op amps) LM358 and LM2904,
which include two high-voltage (36-V) op amps.
These devices provide outstanding value for cost-
sensitive applications, with features including low
offset (300 µV, typical), common-mode input range to
ground, and high differential input voltage capability.
The LM358B and LM2904B op amps simplify circuit
design with enhanced features such as unity-gain
stability, lower offset voltage of 3 mV (maximum at
room temperature), and lower quiescent current of
300 µA per amplifier (typical). High ESD (2 kV, HBM)
and integrated EMI and RF filters enable the LM358B
and LM2904B devices to be used in the most rugged,
environmentally challenging applications.
The LM358B and LM2904B amplifiers are available in
micro-sized packaging, such as the SOT23-8, as well
as industry standard packages, including SOIC,
TSSOP, and VSSOP.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM358B, LM2904B,
LM358, LM358A, LM2904,
LM2904V, LM258, LM258A SOIC (8) 4.90 mm × 3.90 mm
LM358B, LM2904B,
LM358, LM358A, LM2904,
LM2490V TSSOP (8) 3.00 mm × 4.40 mm
LM358B(2), LM2904B(2),
LM358, LM358A, LM2904,
LM2904V, LM258, LM258A VSSOP (8) 3.00 mm × 3.00 mm
LM358B(2), LM2904B(2) SOT-23 (8) 2.90 mm × 1.60 mm
LM358, LM2904 SO (8) 5.20 mm × 5.30 mm
LM358, LM2904, LM358A,
LM258, LM258A PDIP (8) 9.81 mm × 6.35 mm
LM158, LM158A CDIP (8) 9.60 mm × 6.67 mm
LM158, LM158A LCCC (20) 8.89 mm × 8.89 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
(2) Package is for preview only.
2
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 4
6 Pin Configuration and Functions......................... 5
7 Specifications......................................................... 6
7.1 Absolute Maximum Ratings ...................................... 6
7.2 ESD Ratings.............................................................. 6
7.3 Recommended Operating Conditions....................... 7
7.4 Thermal Information.................................................. 7
7.5 Electrical Characteristics: LM358B and LM358BA ... 8
7.6 Electrical Characteristics: LM2904B and
LM2904BA ................................................................. 9
7.7 Electrical Characteristics: LM358, LM358A............ 10
7.8 Electrical Characteristics: LM2904, LM2904V........ 11
7.9 Electrical Characteristics: LM158, LM158A............ 12
7.10 Electrical Characteristics: LM258, LM258A.......... 13
7.11 Typical Characteristics.......................................... 14
7.12 Typical Characteristics.......................................... 21
8 Parameter Measurement Information ................ 23
9 Detailed Description............................................ 24
9.1 Overview................................................................. 24
9.2 Functional Block Diagram - LM358B, LM358BA,
LM2904B, LM2904BA.............................................. 24
9.3 Feature Description................................................. 25
9.4 Device Functional Modes........................................ 25
10 Application and Implementation........................ 26
10.1 Application Information.......................................... 26
10.2 Typical Application ............................................... 26
11 Power Supply Recommendations ..................... 27
12 Layout................................................................... 27
12.1 Layout Guidelines ................................................. 27
12.2 Layout Examples................................................... 28
13 Device and Documentation Support................. 29
13.1 Documentation Support ........................................ 29
13.2 Related Links ........................................................ 29
13.3 Receiving Notification of Documentation Updates 29
13.4 Support Resources ............................................... 29
13.5 Trademarks........................................................... 29
13.6 Electrostatic Discharge Caution............................ 29
13.7 Glossary................................................................ 29
14 Mechanical, Packaging, and Orderable
Information........................................................... 30
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision W (October 2019) to Revision X Page
• Added application links to Applications section ..................................................................................................................... 1
• Deleted preview tag from LM358B and LM2904B TSSOP (8) package in Device Information table .................................... 1
• Changed section title from Community Resources to Support Resources.......................................................................... 29
Changes from Revision V (September 2018) to Revision W Page
• Added specification in the Device Comparison Table............................................................................................................ 4
• Changed CDM ESD rating for LM358B and LM2904B in ESD Ratings ................................................................................ 6
• Changed VSto V+ in Recommended Operating Conditions.................................................................................................. 7
• Changed Thermal Information for the LM158FK and LM158JG devices............................................................................... 7
• Added Typical Characteristics section for the LM358B and LM2490B op amps................................................................. 14
• Added test circuit for THD+N and small-signal step response, G = –1 in the Parameter Measurement Information
section .................................................................................................................................................................................. 23
• Changed the Functional Block Diagram............................................................................................................................... 24
• Deleted preview designator from LM358B and LM2904B in the Related Links section ...................................................... 29
Changes from Revision U (January 2017) to Revision V Page
• Changed the data sheet title ................................................................................................................................................. 1
• Changed first four items in the Features section ................................................................................................................... 1
• Changed the first item in the Applications section and added four new items ...................................................................... 1
• Changed voltage values in the first paragraph of the Description section............................................................................. 1
3
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
• Changed text in the second paragraph of the Description section......................................................................................... 1
• Added devices LM358B and LM2904B to data sheet............................................................................................................ 1
• Changed the first three rows of the Device Information table and added a a cross-referenced note for PREVIEW-
status devices......................................................................................................................................................................... 1
• Added Device Comparison table ........................................................................................................................................... 4
• Added a table note to the Pin Functions table ...................................................................................................................... 5
• Changed "free-air temperature" to "ambient temperature" in the Absolute Maximum Ratings condition statement ............. 6
• Changed all entries in the Absolute Maximum Ratings table except TJand Tstg .................................................................. 6
• Deleted lead temperature and case temperature from Absolute Maximum Ratings.............................................................. 6
• Changed device listings and their voltage values in the ESD Ratings table ......................................................................... 6
• Changed "free-air temperature" to "ambient temperature" in the Recommended Operating Conditions condition
statement ............................................................................................................................................................................... 7
• Changed table entries for all parameters in the Recommended Operating Conditions table................................................ 7
• Added rows to the Thermal Information table, and a table note regarding device-package combinations .......................... 7
• Deleted the Operating Conditions table................................................................................................................................ 13
• Added a condition statement to the Typical Characteristics section.................................................................................... 21
• Changed specific voltages to a Recommended Operating Conditions reference................................................................ 24
• Changed unity-gain bandwidth from 0.7 MHz for all devices to 1.2 MHz for B-version devices.......................................... 25
• Changed slew rate from.3 V/µs for all devices to o.5 V/µs for B-version devices................................................................ 25
• Changed the Input Common Mode Range section in multiple places throughout............................................................... 25
• Changed VCC to VSin the Application Information section .................................................................................................. 26
• Subscripted the suffixes fro RIand RF.................................................................................................................................. 26
• Changed Operational Amplifier Board Layout for Noninverting Configuration with an image that includes a dual op amp 28
• Added Preview designation to the LM358B and LM2904B devices in Table 1 ................................................................... 29
Changes from Revision T (April 2015) to Revision U Page
• Changed data sheet title......................................................................................................................................................... 1
• Added Receiving Notification of Documentation Updates section and Community Resources section ............................. 29
Changes from Revision S (January 2014) to Revision T Page
• Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes,Application
and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
Changes from Revision R (July 2010) to Revision S Page
• Converted this data sheet from the QS format to DocZone using the PDF on the web........................................................ 1
• Deleted Ordering Information table ........................................................................................................................................ 1
• Updated Features to include Military Disclaimer.................................................................................................................... 1
• Added Typical Characteristics section.................................................................................................................................. 21
• Added ESD warning............................................................................................................................................................. 29
4
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
5 Device Comparison Table
PART NUMBER SUPPLY
VOLTAGE TEMPERATURE
RANGE VOS (MAXIMUM
AT 25°C) IQ/ CH (TYPICAL AT
25°C) INTEGRATED EMI
FILTER PACKAGE
LM358B 3 V–36 V –40°C to 85°C 3 mV 300 µA Yes D, DDF, DGK, PW
LM2904B 3 V–36 V –40°C to 125°C 3 mV 300 µA Yes D, DDF, DGK, PW
LM358 3 V–32 V 0°C to 70°C 7 mV 350 µA No D, PW, DGK, P, PS
LM2904 3 V–26 V –40°C to 125°C 7 mV 350 µA No D, PW, DGK, P, PS
LM358A 3 V–32 V 0°C to 70°C 3 mV 350 µA No D, PW, DGK, P
LM2904V 3 V–32 V –40°C to 125°C 7 mV 350 µA No D, PW
LM158 3 V–32 V –55°C to 125°C 5 mV 350 µA No JG, FK
LM158A 3 V–32 V –55°C to 125°C 3 mV 350 µA No JG, FK
LM258 3 V–32 V –25°C to 85°C 5 mV 350 µA No D, DGK, P
LM258A 3 V–32 V –25°C to 85°C 3 mV 350 µA No D, DGK, P
4NC
5IN1±
6NC
7IN1+
8NC
9NC
10V±
11NC
12IN2+
13NC
14 NC
15 IN2±
16 NC
17 OUT2
18 NC
19 NC
20 V+
1 NC
2 OUT1
3 NC
Not to scale
1OUT1 8 V+
2IN1±7 OUT2
3IN1+ 6 IN2±
4V±5 IN2+
Not to scale
5
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
6 Pin Configuration and Functions
D, DDF, DGK, P, PS, PW, and JG Packages
8-Pin SOIC, SOT23-8, VSSOP, PDIP, SO, TSSOP, and CDIP
Top View FK Package
20-Pin LCCC
Top View
NC - No internal connection
(1) For a listing of which devices are available in what packages, see Device Comparison Table.
Pin Functions
PIN I/O DESCRIPTION
NAME LCCC(1) SOIC, SOT23-8, VSSOP, CDIP,
PDIP, SO, TSSOP, CFP(1)
IN1– 5 2 I Negative input
IN1+ 7 3 I Positive input
IN2– 15 6 I Negative input
IN2+ 12 5 I Positive input
OUT1 2 1 O Output
OUT2 17 7 O Output
V– 10 4 — Negative (lowest) supply or ground (for single-
supply operation)
NC 1, 3, 4, 6, 8, 9, 11,
13, 14, 16, 18, 19 — — No internal connection
V+ 20 8 — Positive (highest) supply
6
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Differential voltages are at IN+, with respect to IN−.
(3) Short circuits from outputs to VScan cause excessive heating and eventual destruction.
7 Specifications
7.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage, VS= ([V+] – [V–])
LM358B, LM358BA,
LM2904B, LM2904BA ±20 or 40
V
LM158, LM258, LM358,
LM158A, LM258A, LM358A,
LM2904V ±16 or 32
LM2904 ±13 or 26
Differential input voltage, VID(2)
LM358B, LM358BA,
LM2904B, LM2904BA,LM158,
LM258, LM358, LM158A,
LM258A, LM358A, LM2904V –32 32 V
LM2904 –26 26
Input voltage, VIEither input
LM358B, LM358BA,
LM2904B, LM2904BA –0.3 40
V
LM158, LM258, LM358,
LM158A, LM258A, LM358A,
LM2904V –0.3 32
LM2904 –0.3 26
Duration of output short circuit (one amplifier) to ground at (or below) TA= 25°C,
VS≤15 V(3) Unlimited s
Operating ambient temperature, TA
LM158, LM158A –55 125
°C
LM258, LM258A –25 85
LM358B, LM358BA –40 85
LM358, LM358A 0 70
LM2904B, LM2904BA,
LM2904, LM2904V –40 125
Operating virtual-junction temperature, TJ150 °C
Storage temperature, Tstg –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings VALUE UNIT
LM358B, LM358BA, LM2904B, AND LM2904BA
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
LM158, LM258, LM358, LM158, LM258A, LM358A, LM2904, AND LM2904V
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
7
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
7.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted) MIN MAX UNIT
VSSupply voltage, VS= ([V+] – [V–])
LM358B, LM358BA, LM2904B,
LM2904BA 3 36
VLM158, LM258, LM358, LM158A,
LM258A, LM358A, LM2904V 3 30
LM2904 3 26
VCM Common-mode voltage V– V+ – 2 V
TAOperating ambient temperature
LM358B, LM358BA –40 85
°C
LM2904B, LM2904BA, LM2904,
LM2904V –40 125
LM358, LM358A 0 70
LM258, LM258A –20 85
LM158, LM158A –55 125
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) For a listing of which devices are available in what packages, see Device Comparison Table.
7.4 Thermal Information
THERMAL METRIC(1)
LM258, LM258A, LM358, LM358A, LM358B, LM358BA, LM2904,
LM2904B, LM2904BA, LM2904V(2) LM158, LM158A
UNITD
(SOIC) DGK
(VSSOP) P
(PDIP) PS
(SO) PW
(TSSOP) FK
(LCCC) JG
(CDIP)
8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 20 PINS 8 PINS
RθJA Junction-to-ambient thermal
resistance 124.7 181.4 80.9 116.9 171.7 84.0 112.4 °C/W
RθJC(top) Junction-to-case (top)
thermal resistance 66.9 69.4 70.4 62.5 68.8 56.9 63.6 °C/W
RθJB Junction-to-board thermal
resistance 67.9 102.9 57.4 68.6 99.2 57.5 100.3 °C/W
ψJT Junction-to-top
characterization parameter 19.2 11.8 40 21.9 11.5 51.7 35.7 °C/W
ψJB Junction-to-board
characterization parameter 67.2 101.2 56.9 67.6 97.9 57.1 93.3 °C/W
RθJC(bot) Junction-to-case (bottom)
thermal resistance — — — — — 10.6 22.3 °C/W
8
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
(1) Specified by characterization only
7.5 Electrical Characteristics: LM358B and LM358BA
VS= (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA= 25°C, VCM = VOUT = VS/2, RL= 10k connected to VS/2
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
VOS Input offset voltage
LM358B ±0.3 ±3.0 mV
TA= –40°C to +85°C ±4 mV
LM358BA ±2.0 mV
TA= –40°C to +85°C ±2.5 mV
dVOS/dTInput offset voltage drift TA= -40°C to +85°C(1) ±3.5 11 µV/°C
PSRR Power Supply Rejection Ratio ±2 15 µV/V
Channel separation, dc f = 1 kHz to 20 kHz ±1 µV/V
INPUT VOLTAGE RANGE
VCM Common-mode voltage range VS= 3 V to 36 V (V–) (V+) – 1.5 V
VS= 5 V to 36 V TA= –40°C to +85°C (V–) (V+) – 2 V
CMRR Common-mode rejection ratio (V–) ≤VCM ≤(V+) – 1.5 V VS= 3 V to 36 V 20 100 µV/V
(V–) ≤VCM ≤(V+) – 2.0 V VS= 5 V to 36 V TA= –40°C to +85°C 25 316
INPUT BIAS CURRENT
IBInput bias current ±10 ±35 nA
TA= –40°C to +85°C(1) ±50 nA
IOS Input offset current 0.5 4 nA
TA= –40°C to +85°C(1) 5 nA
dIOS/dTInput offset current drift TA= –40°C to +85°C 10 pA/℃
NOISE
EnInput voltage noise f = 0.1 to 10 Hz 3 µVPP
enInput voltage noise density f = 1 kHz 40 nV/√/Hz
INPUT IMPEDANCE
ZID Differential 10 || 0.1 MΩ|| pF
ZIC Common-mode 4 || 1.5 GΩ|| pF
OPEN-LOOP GAIN
AOL Open-loop voltage gain VS= 15 V; VO= 1 V to 11 V; RL≥10 kΩ, connected to (V-) 70 140 V/mV
TA= –40°C to +85°C 35 V/mV
FREQUENCY RESPONSE
GBW Gain bandwidth product 1.2 MHz
SR Slew rate G = + 1 0.5 V/µs
ΘmPhase margin G = + 1, RL= 10kΩ, CL= 20 pF 56 °
tOR Overload recovery time VIN × gain > VS10 µs
tsSettling time To 0.1%, VS= 5 V, 2-V Step , G = +1, CL= 100 pF 4 µs
THD+N Total harmonic distortion + noise G = + 1, f = 1 kHz, VO= 3.53 VRMS, VS= 36V, RL= 100k, IOUT ≤±50µA, BW = 80 kHz 0.001 %
OUTPUT
VOVoltage output swing from rail
Positive Rail (V+)
IOUT = 50 µA 1.35 1.42 V
IOUT = 1 mA 1.4 1.48 V
IOUT = 5 mA(1) 1.5 1.61 V
Negative Rail (V-)
IOUT = 50 µA 100 150 mV
IOUT = 1 mA 0.75 1 V
VS= 5 V, RL ≤10 kΩconnected to (V–) TA= –40°C to +85°C 5 20 mV
IOOutput current
VS= 15 V; VO= V-;
VID = 1 V Source(1) -20 -30
mA
TA= –40°C to +85°C -10
VS= 15 V; VO= V+;
VID = -1 V Sink(1) 10 20
TA= –40°C to +85°C 5
VID = -1 V; VO= (V-) + 200 mV 60 100 μA
ISC Short-circuit current VS= 20 V, (V+) = 10 V, (V-) = -10 V, VO= 0 V ±40 ±60 mA
CLOAD Capacitive load drive 100 pF
ROOpen-loop output resistance f = 1 MHz, IO= 0 A 300 Ω
POWER SUPPLY
IQQuiescent current per amplifier VS= 5 V; IO= 0 A TA= –40°C to +85°C 300 460 µA
IQQuiescent current per amplifier VS= 36 V; IO= 0 A 800 µA
9
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
(1) Specified by characterization only
7.6 Electrical Characteristics: LM2904B and LM2904BA
VS= (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA= 25°C, VCM = VOUT = VS/2, RL= 10k connected to VS/2
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
VOS Input offset voltage
LM2904B ±0.3 ±3.0 mV
TA= –40°C to +125°C ±4 mV
LM2904BA ±2.0 mV
TA= –40°C to +125°C ±2.5 mV
dVOS/dTInput offset voltage drift TA= –40°C to +125°C(1) ±3.5 12 µV/°C
PSRR Power Supply Rejection Ratio ±2 15 µV/V
Channel separation, dc f = 1 kHz to 20 kHz ±1 µV/V
INPUT VOLTAGE RANGE
VCM Common-mode voltage range VS= 3 V to 36 V (V–) (V+) – 1.5 V
VS= 5 V to 36 V TA= –40°C to +125°C (V–) (V+) – 2 V
CMRR Common-mode rejection ratio (V–) ≤VCM ≤(V+) – 1.5 V VS= 3 V to 36 V 20 100 µV/V
(V–) ≤VCM ≤(V+) – 2.0 V VS= 5 V to 36 V TA= –40°C to +125°C 25 316
INPUT BIAS CURRENT
IBInput bias current ±10 ±35 nA
TA= –40°C to +125°C(1) ±50 nA
IOS Input offset current 0.5 4 nA
TA= –40°C to +125°C(1) 5 nA
dIOS/dTInput offset current drift TA= –40°C to +125°C 10 pA/℃
NOISE
EnInput voltage noise f = 0.1 to 10 Hz 3 µVPP
enInput voltage noise density f = 1 kHz 40 nV/√/Hz
INPUT IMPEDANCE
ZID Differential 10 || 0.1 MΩ|| pF
ZIC Common-mode 4 || 1.5 GΩ|| pF
OPEN-LOOP GAIN
AOL Open-loop voltage gain VS= 15 V; VO= 1 V to 11 V; RL≥10 kΩ, connected to (V-) 70 140 V/mV
TA= –40°C to +125°C 35 V/mV
FREQUENCY RESPONSE
GBW Gain bandwidth product 1.2 MHz
SR Slew rate G = + 1 0.5 V/µs
ΘmPhase margin G = + 1, RL= 10kΩ, CL= 20 pF 56 °
tOR Overload recovery time VIN × gain > VS10 µs
tsSettling time To 0.1%, VS= 5 V, 2-V Step , G = +1, CL= 100 pF 4 µs
THD+N Total harmonic distortion + noise G = + 1, f = 1 kHz, VO= 3.53 VRMS, VS= 36V, RL= 100k, IOUT ≤±50µA, BW = 80 kHz 0.001 %
OUTPUT
VOVoltage output swing from rail
Positive Rail (V+)
IOUT = 50 µA 1.35 1.42 V
IOUT = 1 mA 1.4 1.48 V
IOUT = 5 mA(1) 1.5 1.61 V
Negative Rail (V-)
IOUT = 50 µA 100 150 mV
IOUT = 1 mA 0.75 1 V
VS= 5 V, RL ≤10 kΩconnected to (V–) TA= –40°C to +125°C 5 20 mV
IOOutput current
VS= 15 V; VO= V-; VID =
1 V Source(1) -20 -30
mA
TA= –40°C to +125°C -10
VS= 15 V; VO= V+; VID
= -1 V Sink(1) 10 20
TA= –40°C to +125°C 5
VID = -1 V; VO= (V-) + 200 mV 60 100 μA
ISC Short-circuit current VS= 20 V, (V+) = 10 V, (V-) = -10 V, VO= 0 V ±40 ±60 mA
CLOAD Capacitive load drive 100 pF
ROOpen-loop output resistance f = 1 MHz, IO= 0 A 300 Ω
POWER SUPPLY
IQQuiescent current per amplifier VS= 5 V; IO= 0 A TA= –40°C to +125°C 300 460 µA
IQQuiescent current per amplifier VS= 36 V; IO= 0 A 800 µA
10
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VSfor testing purposes is 30 V for LM358 and LM358A.
(2) All typical values are TA= 25°C.
7.7 Electrical Characteristics: LM358, LM358A
For VS= (V+) – (V–) = 5 V, TA= 25 °C, (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
OFFSET VOLTAGE
VOS Input offset voltage VS= 5 V to 30 V; VCM = 0 V; VO= 1.4
V
LM358 3 7
mV
TA= 0°C to 70°C 9
LM358A 2 3
TA= 0°C to 70°C 5
dVOS/dTInput offset voltage drift LM358 TA= 0°C to 70°C 7 µV/°C
LM358A TA= 0°C to 70°C 7 20
PSRR Input offset voltage vs power
supply (ΔVIO/ΔVS)VS= 5 V to 30 V 65 100 dB
VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB
INPUT VOLTAGE RANGE
VCM Common-mode voltage range
VS= 5 V to 30 V LM358 (V–) (V+) – 1.5
V
VS= 30 V LM358A
VS= 5 V to 30 V LM358 TA= 0°C to 70°C (V–) (V+) – 2
VS= 30 V LM358A
CMRR Common-mode rejection ratio VS= 5 V to 30 V; VCM = 0 V 65 80 dB
INPUT BIAS CURRENT
IBInput bias current VO= 1.4 V
LM358 –20 –250
nA
TA= 0°C to 70°C –500
LM358A –15 –100
TA= 0°C to 70°C –200
IOS Input offset current VO= 1.4 V
LM358 2 50
nA
TA= 0°C to 70°C 150
LM358A 2 30
TA= 0°C to 70°C 75
dIOS/dTInput offset current drift 10 pA/°C
LM358A TA= 0°C to 70°C 300
NOISE
enInput voltage noise density f = 1 kHz 40 nV/√Hz
OPEN-LOOP GAIN
AOL Open-loop voltage gain VS= 15 V; VO= 1 V to 11 V; RL≥2 kΩ25 100 V/mV
TA= 0°C to 70°C 15
FREQUENCY RESPONSE
GBW Gain bandwidth product 0.7 MHz
SR Slew rate G = +1 0.3 V/µs
OUTPUT
VOVoltage output swing from rail Positive rail
VS= 30 V; RL= 2 kΩTA= 0°C to 70°C 4
VVS= 30 V; RL≥10 kΩ2 3
VS= 5 V; RL≥2 kΩ1.5
Negative rail VS= 5 V; RL≤10 kΩTA= 0°C to 70°C 5 20 mV
IOOutput current
VS= 15 V; VO= 0 V; VID
= 1 V Source
–20 –30
mA
LM358A –60
TA= 0°C to 70°C –10
VS= 15 V; VO= 15 V;
VID = –1 V Sink 10 20
TA= 0°C to 70°C 5
VID = –1 V; VO= 200 mV 12 30 µA
ISC Short-circuit current VS= 10 V; VO= VS/ 2 ±40 ±60 mA
POWER SUPPLY
IQQuiescent current per
amplifier VO= 2.5 V; IO= 0 A TA= 0°C to 70°C 350 600 µA
VS= 30 V; VO= 15 V; IO= 0 A 500 1000
11
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VSfor testing purposes is 26 V for LM2904 and 32 V for LM2904V.
(2) All typical values are TA= 25°C.
7.8 Electrical Characteristics: LM2904, LM2904V
For VS= (V+) – (V–) = 5 V, TA= 25 °C, (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP (2) MAX UNIT
OFFSET VOLTAGE
VOS Input offset voltage VS= 5 V to maximum; VCM = 0 V; VO= 1.4
V
Non-A suffix
devices 3 7
mV
TA= –40°C to 125°C 10
A-suffix
devices 1 2
TA= –40°C to 125°C 4
dVOS/dTInput offset voltage drift TA= –40°C to 125°C 7 µV/°C
PSRR Input offset voltage vs power
supply (ΔVIO/ΔVS)VS= 5 V to 30 V 65 100 dB
VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB
INPUT VOLTAGE RANGE
VCM Common-mode voltage range VS= 5 V to maximum (V–) (V+) – 1.5 V
TA= –40°C to 125°C (V–) (V+) – 2
CMRR Common-mode rejection ratio VS= 5 V to maximum; VCM = 0 V 65 80 dB
INPUT BIAS CURRENT
IBInput bias current VO= 1.4 V –20 –250 nA
TA= –40°C to 125°C –500
IOS Input offset current VO= 1.4 V
Non-V suffix
device 2 50
nA
TA= –40°C to 125°C 300
V-suffix
device 2 50
TA= –40°C to 125°C 150
dIOS/dTInput offset current drift TA= –40°C to 125°C 10 pA/°C
NOISE
enInput voltage noise density f = 1 kHz 40 nV/√Hz
OPEN-LOOP GAIN
AOL Open-loop voltage gain VS= 15 V; VO= 1 V to 11 V; RL≥2 kΩ25 100 V/mV
TA= –40°C to 125°C 15
FREQUENCY RESPONSE
GBW Gain bandwidth product 0.7 MHz
SR Slew rate G = +1 0.3 V/µs
OUTPUT
VOVoltage output swing from rail Positive rail
RL≥10 kΩVS– 1.5
V
Non-V suffix
device
VS= maximum; RL=
2 kΩ
TA= –40°C to 125°C
4
VS= maximum; RL≥
10 kΩ2 3
V-suffix device
VS= maximum; RL=
2 kΩ6
VS= maximum; RL≥
10 kΩ4 5
Negative rail VS= 5 V; RL≤10 kΩTA= –40°C to 125°C 5 20 mV
IOOutput current
VS= 15 V; VO= 0 V; VID = 1 V Source –20 –30
mA
TA= –40°C to 125°C –10
VS= 15 V; VO= 15 V; VID = –1 V Sink 10 20
TA= –40°C to 125°C 5
VID = -1 V; VO= 200 mV Non-V suffix device 30 µA
V-suffix device 12 40
ISC Short-circuit current VS= 10 V; VO= VS/ 2 ±40 ±60 mA
POWER SUPPLY
IQQuiescent current per amplifier VO= 2.5 V; IO= 0 A TA= –40°C to 125°C 350 600 µA
VS= maximum; VO= maximum / 2; IO= 0 A 500 1000
12
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VSfor testing purposes is 30 V for LM158 and LM158A.
(2) All typical values are TA= 25°C.
(3) On products compliant to MIL-PRF-38535, this parameter is not production tested.
7.9 Electrical Characteristics: LM158, LM158A
For VS= (V+) – (V–) = 5 V, TA= 25 °C, (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
OFFSET VOLTAGE
VOS Input offset voltage VS= 5 V to 30 V; VCM = 0 V; VO= 1.4 V
LM158 3 5
mV
TA= –55°C to 125°C 7
LM158A 2
TA= –55°C to 125°C 4
dVOS/dTInput offset voltage drift LM158 TA= –55°C to 125°C 7 µV/°C
LM158A TA= –55°C to 125°C 7 15(3)
PSRR Input offset voltage vs power supply
(ΔVIO/ΔVS)VS= 5 V to 30 V 65 100 dB
VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB
INPUT VOLTAGE RANGE
VCM Common-mode voltage range
VS= 5 V to 30 V LM158 (V–) (V+) – 1.5
V
VS= 30 V LM158A
VS= 5 V to 30 V LM158 TA= –55°C to 125°C (V–) (V+) – 2
VS= 30 V LM158A
CMRR Common-mode rejection ratio VS= 5 V to 30 V; VCM = 0 V 70 80 dB
INPUT BIAS CURRENT
IBInput bias current VO= 1.4 V
LM158 –20 –150
nA
TA= –55°C to 125°C –300
LM158A –15 –50
TA= –55°C to 125°C –100
IOS Input offset current VO= 1.4 V
LM158 2 30
nA
TA= –55°C to 125°C 100
LM158A 2 10
TA= –55°C to 125°C 30
dIOS/dTInput offset current drift 10 pA/°C
LM158A TA= –55°C to 125°C 200
NOISE
enInput voltage noise density f = 1 kHz 40 nV/√Hz
OPEN-LOOP GAIN
AOL Open-loop voltage gain VS= 15 V; VO= 1 V to 11 V; RL≥2 kΩ50 100 V/mV
TA= –55°C to 125°C 25
FREQUENCY RESPONSE
GBW Gain bandwidth product 0.7 MHz
SR Slew rate G = +1 0.3 V/µs
OUTPUT
VOVoltage output swing from rail Positive rail
VS= 30 V; RL= 2 kΩTA= –55°C to 125°C 4
VVS= 30 V; RL≥10 kΩ2 3
VS= 5 V; RL≥2 kΩ1.5
Negative rail VS= 5 V; RL≤10 kΩTA= –55°C to 125°C 5 20 mV
IOOutput current
VS= 15 V; VO= 0 V; VID = 1 V Source
–20 –30
mA
LM158A –60
TA= –55°C to 125°C –10
VS= 15 V; VO= 15 V; VID = –1
VSink 10 20
TA= –55°C to 125°C 5
VID = –1 V; VO= 200 mV 12 30 µA
ISC Short-circuit current VS= 10 V; VO= VS/ 2 ±40 ±60 mA
POWER SUPPLY
IQQuiescent current per amplifier VO= 2.5 V; IO= 0 A TA= –55°C to 125°C 350 600 µA
VS= 30 V; VO= 15 V; IO= 0 A 500 1000
13
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VSfor testing purposes is 30 V for LM258 and LM258A.
(2) All typical values are TA= 25°C.
7.10 Electrical Characteristics: LM258, LM258A
For VS= (V+) – (V–) = 5 V, TA= 25 °C, (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
OFFSET VOLTAGE
VOS Input offset voltage VS= 5 V to 30 V; VCM = 0 V; VO= 1.4 V
LM258 3 5
mV
TA= –25°C to 85°C 7
LM258A 2 3
TA= –25°C to 85°C 4
dVOS/dTInput offset voltage drift LM258 TA= –25°C to 85°C 7µV/°C
LM258A 7 15
PSRR Input offset voltage vs power supply
(ΔVIO/ΔVS)VS= 5 V to 30 V 65 100 dB
VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB
INPUT VOLTAGE RANGE
VCM Common-mode voltage range
VS= 5 V to 30 V LM258 (V–) (V+) – 1.5
V
VS= 30 V LM258A
VS= 5 V to 30 V LM258 TA= –25°C to 85°C (V–) (V+) – 2
VS= 30 V LM258A
CMRR Common-mode rejection ratio VS= 5 V to 30 V; VCM = 0 V 70 80 dB
INPUT BIAS CURRENT
IBInput bias current VO= 1.4 V
LM258 –20 –150
nA
TA= –25°C to 85°C –300
LM258A –15 –80
TA= –25°C to 85°C –100
IOS Input offset current VO= 1.4 V
LM258 2 30
nA
TA= –25°C to 85°C 100
LM258A 2 15
TA= –25°C to 85°C 30
dIOS/dTInput offset current drift 10 pA/°C
LM258A TA= –25°C to 85°C 200
NOISE
enInput voltage noise density f = 1 kHz 40 nV/√Hz
OPEN-LOOP GAIN
AOL Open-loop voltage gain VS= 15 V; VO= 1 V to 11 V; RL≥2 kΩ50 100 V/mV
TA= –25°C to 85°C 25
FREQUENCY RESPONSE
GBW Gain bandwidth product 0.7 MHz
SR Slew rate G = +1 0.3 V/µs
OUTPUT
VOVoltage output swing from rail Positive rail
VS= 30 V; RL= 2 kΩTA= –25°C to 85°C 4
VVS= 30 V; RL≥10 kΩ2 3
VS= 5 V; RL≥2 kΩ1.5
Negative rail VS= 5 V; RL≤10 kΩTA= –25°C to 85°C 5 20 mV
IOOutput current
VS= 15 V; VO= 0 V; VID = 1 V Source
–20 –30
mA
LM258A –60
TA= –25°C to 85°C –10
VS= 15 V; VO= 15 V; VID = –1
VSink 10 20
TA= –25°C to 85°C 5
VID = –1 V; VO= 200 mV 12 30 µA
ISC Short-circuit current VS= 10 V; VO= VS/ 2 ±40 ±60 mA
POWER SUPPLY
IQQuiescent current per amplifier VO= 2.5 V; IO= 0 A TA= –25°C to 85°C 350 600 µA
VS= 30 V; VO= 15 V; IO= 0 A 500 1000
Frequency (Hz)
Open Loop Voltage Gain (dB)
Phase ()
-20 -10
-10 0
0 10
10 20
20 30
30 40
40 50
50 60
60 70
70 80
80 90
90 100
1k 10k 100k 1M
D012
Gain (dB)
Phase (°)
Frequency (Hz)
Closed Lopp Voltage Gain (dB)
-30
-20
-10
0
10
20
30
40
50
60
70
1k 10k 100k 1M
D017
G = 1
G = 10
G = 100
G = 1000
G = –1
Temperature (°C)
Offset Voltage (µV)
-40 -20 0 20 40 60 80 100 120
-750
-450
-150
150
450
750
DC10
Common-Mode Voltage (V)
Offset Voltage (µV)
-18 -12 -6 0 6 12 17
-500
-300
-100
100
300
500
DC10
Offset Voltage (µV)
Amplifiers (%)
-1800 -1200 -600 0 600 1200 1800
0
2
4
6
8
10
12
14
16
18
20
DC11
Offset Voltage Drift (µV/°C)
Amplifiers (%)
0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75
0
3
6
9
12
15
18
21
24
27
30
DC12
14
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
7.11 Typical Characteristics
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).
Figure 1. Offset Voltage Production Distribution Figure 2. Offset Voltage Drift Distribution
Figure 3. Offset Voltage vs Temperature Figure 4. Offset Voltage vs Common-Mode Voltage
Figure 5. Open-Loop Gain and Phase vs Frequency Figure 6. Closed-Loop Gain vs Frequency
Output Current (mA)
Output Voltage (V)
0 10 20 30 40 50
V+
(V+) – 3 V
(V+) – 6 V
(V+) – 9 V
(V+) – 12 V
DC13
–40C
25C
125C
Output Current (mA)
Output Voltage (V)
0 5 10 15 20 25 30 35 40
V–
(V–) + 3 V
(V–) + 6 V
(V–) + 9 V
(V–) + 12 V
(V–) + 15 V
(V–) + 18 V
DC1-
–40C
25C
125C
Temperature (°C)
Input Bias Current (nA)
-40 -10 20 50 80 110 130
-12
-11
-10
-9
-8
-7
-6
DCIB
IB+
IB–
Temperature (°C)
Input Offset Current (nA)
-40 -10 20 50 80 110 130
-0.03
-0.015
0
0.015
0.03
0.045
0.06
DCIO
Common-Mode Voltage (V)
Input Bias Current (nA)
-20 -15 -10 -5 0 5 10 15 20
-15
-12.5
-10
-7.5
-5
DC3I
IB+
IB–
Common-Mode Voltage (V)
Input Offset Current (pA)
-20 -15 -10 -5 0 5 10 15 20
-40
-20
0
20
40
60
80
100
120
DC3I
15
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).
Figure 7. Input Bias Current vs Common-Mode Voltage Figure 8. Input Offset Current vs Common-Mode Voltage
Figure 9. Input Bias Current vs Temperature Figure 10. Input Offset Current vs Temperature
Figure 11. Output Voltage Swing vs
Output Current (Sourcing) Figure 12. Output Voltage Swing vs
Output Current (Sinking)
Frequency (Hz)
Voltage Noise Spectral Density (nV/—Hz)
0
10
20
30
40
50
60
70
80
90
100
10 100 1k 10k 100k
D010
Frequency (Hz)
THD+N (dB)
-112
-104
-96
-88
-80
-72
-64
-56
-48
-40
-32
100 1k 10k
D013
10 k
2 k
Temperature (°C)
Power Supply Rejection Ratio (dB)
-40 -20 0 20 40 60 80 100 120 140
-123
-122
-121
-120
-119
-118
DC8_
Time (s)
Voltage (µV)
0 1 2 3 4 5 6 7 8 9 10
-2
-1.6
-1.2
-0.8
-0.4
0
0.4
0.8
1.2
1.6
D011
Frequency (Hz)
PSRR and CMRR (dB)
0
10
20
30
40
50
60
70
80
90
100
1k 10k 100k 1M
D001
PSRR+
PSRR-
CMRR
Temperature (°C)
Common-Mode Rejection Ratio (dB)
-40 -10 20 50 80 110 130
85
90
95
100
105
110
115
120
DC2_
VS= 36V
VS= 5V
16
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).
Figure 13. CMRR and PSRR vs Frequency Figure 14. Common-Mode Rejection Ratio vs
Temperature (dB)
VS= 5 V to 36 V
Figure 15. Power Supply Rejection Ratio vs
Temperature (dB) Figure 16. 0.1-Hz to 10-Hz Noise
Figure 17. Input Voltage Noise Spectral Density vs
Frequency
G = 1, f = 1 kHz, BW = 80 kHz,
VOUT = 10 VPP, RLconnected to V–
Figure 18. THD+N Ratio vs Frequency, G = 1
Temperature (°C)
Quiescent Current per Amplifier (µA)
-40 -20 0 20 40 60 80 100 120
240
300
360
420
480
540
600
DC4_
VS= 36V
VS= 5V
Frequency (Hz)
Open Loop Output Impedance ()
100
200
300
400
500
1k 10k 100k 1M
D006
Supply Voltage (V)
Quiescent Current (µA)
3 9 15 21 27 33 36
280
310
340
370
400
430
460
DC_S
Amplitude (VPP)
THD+N (dB)
0.001 0.01 0.1 1 10 2020
-110
-95
-80
-65
-50
-35
-20
D016
10 k
2 k
Frequency (Hz)
THD+N (dB)
-104
-96
-88
-80
-72
-64
-56
-48
-40
-32
100 1k 10k
D014
10 k
2 k
Amplitude (VPP)
THD+N (dB)
0.001 0.01 0.1 1 10 2020
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
D015
10 k
2 k
17
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).
G = –1, f = 1 kHz, BW = 80 kHz,
VOUT = 10 VPP, RLconnected to V–
Figure 19. THD+N Ratio vs Frequency, G = –1
G = 1, f = 1 kHz, BW = 80 kHz,
RLconnected to V–
Figure 20. THD+N vs Output Amplitude, G = 1
G = –1, f = 1 kHz, BW = 80 kHz,
RLconnected to V–
Figure 21. THD+N vs Output Amplitude, G = –1 Figure 22. Quiescent Current vs Supply Voltage
Figure 23. Quiescent Current vs Temperature Figure 24. Open-Loop Output Impedance vs Frequency
Time (s)
Voltage (mV)
0 20 40 60 80 100
-10
-7.5
-5
-2.5
0
2.5
5
7.5
10
D022
Input
Output
Time (s)
Voltage (mV)
0 20 40 60 80 100
-10
-7.5
-5
-2.5
0
2.5
5
7.5
10
D023
Input
Output
Capacitance Load (pF)
Phase Margin (°)
0 40 80 120 160 200 240 280 320 360
30
33
36
39
42
45
48
51
54
57
60
D018
Time (s)
Voltage (V)
0 200 400 600 800 1000
-20
-10
0
10
20
D021
Input
Output
Capacitance load (pF)
Overshoot (%)
0 40 80 120 160 200 240 280 320 360
8
12
16
20
24
28
32
36
40
44
D019
Overshoot (+)
Overshoot (-)
Capacitance load (pF)
Overshoot (%)
40 80 120 160 200 240 280 320 360
0
2
4
6
8
10
12
14
16
18
D020
Overshoot (+)
Overshoot (–)
18
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).
G = 1, 100-mV output step, RL= open
Figure 25. Small-Signal Overshoot vs Capacitive Load
G = –1, 100-mV output step, RL= open
Figure 26. Small-Signal Overshoot vs Capacitive Load
Figure 27. Phase Margin vs Capacitive Load
G = –10
Figure 28. Overload Recovery
G = 1, RL= open
Figure 29. Small-Signal Step Response, G = 1
G = –1, RL= open, RFB = 10K
Figure 30. Small-Signal Step Response, G = –1
Temperature (°C)
Short-Circuit Current (mA)
-40 -25 -10 5 20 35 50 65 80 95 110 125
-60
-40
-20
0
20
40
60
DC7_
Sinking
Sourcing
Frequency (Hz)
Maximum Output Voltage (VPP)
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1k 10k 100k 1M
D005
Time (µs)
Votlage (V)
0 20 40 60 80 100
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
AC_S
Output
Input
Temp(C)
Slew Rate(V/s)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0.425
0.475
0.525
0.575
0.625
0.675
D009
Positive
Negative
Time (s)
Output Delta from Final Value (mV)
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
-20
-16
-12
-8
-4
0
4
8
12
16
20
D003
Time (s)
Output Delta from Final Value (mV)
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
-40
-32
-24
-16
-8
0
8
16
24
32
40
D004
19
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).
G = 1, RL= open
Figure 31. Large-Signal Step Response (Rising)
G = 1, RL= open
Figure 32. Large-Signal Step Response (Falling)
G = 1, RL= open
Figure 33. Large-Signal Step Response Figure 34. Slew Rate vs Temperature
Figure 35. Short-Circuit Current vs Temperature
VS= 15 V
Figure 36. Maximum Output Voltage vs Frequency
Frequency (Hz)
EMIRR (dB)
24
30
36
42
48
54
60
66
72
78
84
90
1M 10M 100M 1G
D007
Frequency (Hz)
Channel Separation (dB)
-135
-125
-115
-105
-95
-85
-75
1k 10k 100k 1M
D008
20
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with
TA= 25°C, VS= 36 V (±18 V), VCM = VS/ 2, RLOAD = 10 kΩconnected to VS/ 2 (unless otherwise noted).
Figure 37. Channel Separation vs Frequency Figure 38. EMIRR (Electromagnetic Interference Rejection
Ratio) vs Frequency
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 4 8 12 16 20 24 28 32 36 40
Voltage (V)
Time (s)
VOUT
C001
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0 2 4 6 8 10
Voltage (V)
Time (s)
VOUT
C001
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000
CMRR (dB)
Frequency (kHz)
CMRR
C001
0
20
40
60
80
100
120
140
160
0 5 10 15 20 25 30 35 40
Avol Voltage Gain (dB)
V+ Supply Voltage (Vdc)
RL=20K
RL=2K
0.2
0.22
0.24
0.26
0.28
0.3
0.32
0.34
0.36
0 5 10 15 20 25 30
Supply Current (mA)
Supply Voltage (Vdc)
–55C
0C
125C
0
2
4
6
8
10
12
14
16
18
20
–55 –35 –15 525 45 65 85 105 125
Input Current (nAdc)
Temperature (°C)
5Vdc
15Vdc
30Vdc
21
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
7.12 Typical Characteristics
Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V.
Figure 39. Input Current vs Temperature Figure 40. Supply Current vs Supply Voltage
Figure 41. Voltage Gain vs Supply Voltage Figure 42. Common-Mode Rejection Ratio vs Frequency
Figure 43. Voltage Follower Large Signal Response (50 pF) Figure 44. Voltage Follower Small Signal Response (50 pF)
0.01
0.1
1
10
0.001 0.01 0.1 1 10 100
Output Voltage (Vdc)
Output Sink Current (mAdc)
5Vdc
15Vdc
30Vdc
0
10
20
30
40
50
60
70
80
90
–55 –35 –15 525 45 65 85 105 125
Output Current (mAdc)
Temperature (°C)
0
2.5
5
7.5
10
12.5
15
17.5
20
1 10 100 1k
Output Swing (Vp-p)
Frequency (kHz)
1
2
3
4
5
6
7
8
0.001 0.01 0.1 1 10 100
Output Voltage (Vdc) relative to Vcc
Output Sink Current (mAdc)
22
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
Typical Characteristics (continued)
Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V.
Figure 45. Maximum Output Swing vs Frequency
(VCC = 15 V) Figure 46. Output Sourcing Characteristics
Figure 47. Output Sinking Characteristics Figure 48. Source Current Limiting
10 k
+18V
-18V
–
+
GNDGND
RL
VIN
VO
−
+
RL
CL
VI
VCC+
VCC−
VO
−
+
100 Ω
VCC+
VCC−
RS
900 Ω
VI= 0 V
23
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
8 Parameter Measurement Information
Figure 49. Unity-Gain Amplifier Figure 50. Noise-Test Circuit
Figure 51. Test Circuit, G = –1, for THD+N and Small-Signal Step Response
VCC+
~100 µA
Current
Regula tor
~6 µA
Current
Regula tor
IN-
IN+
OUT
~6 µA
Current
Regulator
~120 µA
Curren t
Regulator
24
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
9 Detailed Description
9.1 Overview
These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to
operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the
difference between the two supplies is within the supply voltage range specified in the Recommended Operating
Conditions section, and VSis at least 1.5 V more positive than the input common-mode voltage. The low supply-
current drain is independent of the magnitude of the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier
circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices
can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required
interface electronics without additional ±5-V supplies.
9.2 Functional Block Diagram - LM358B, LM358BA, LM2904B, LM2904BA
25
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
9.3 Feature Description
9.3.1 Unity-Gain Bandwidth
The unity-gain bandwidth is the frequency up to which an amplifier with a unity gain may be operated without
greatly distorting the signal. These devices have a 1.2-MHz unity-gain bandwidth (B Version).
9.3.2 Slew Rate
The slew rate is the rate at which an operational amplifier can change its output when there is a change on the
input. These devices have a 0.5-V/µs slew rate (B Version).
9.3.3 Input Common Mode Range
The valid common mode range is from device ground to VS– 1.5 V (VS– 2 V across temperature). Inputs may
exceed VSup to the maximum VSwithout device damage. At least one input must be in the valid input common-
mode range for the output to be the correct phase. If both inputs exceed the valid range, then the output phase is
undefined. If either input more than 0.3 V below V– then input current should be limited to 1 mA and the output
phase is undefined.
9.4 Device Functional Modes
These devices are powered on when the supply is connected. This device can be operated as a single-supply
operational amplifier or dual-supply amplifier, depending on the application.
V
RF
A
RI
V
1.8
A 3.6
0.5
V
VOUT
A
VIN
Vsup+
+
VOUT
RF
VIN
RI
Vsup-
26
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The LMx58 and LM2904 operational amplifiers are useful in a wide range of signal conditioning applications.
Inputs can be powered before VSfor flexibility in multiple supply circuits.
10.2 Typical Application
A typical application for an operational amplifier is an inverting amplifier. This amplifier takes a positive voltage on
the input, and makes it a negative voltage of the same magnitude. In the same manner, it also makes negative
voltages positive.
Figure 52. Application Schematic
10.2.1 Design Requirements
The supply voltage must be chosen such that it is larger than the input voltage range and output range. For
instance, this application scales a signal of ±0.5 V to ±1.8 V. Setting the supply at ±12 V is sufficient to
accommodate this application.
10.2.2 Detailed Design Procedure
Determine the gain required by the inverting amplifier using Equation 1 and Equation 2:
(1)
(2)
Once the desired gain is determined, choose a value for RIor RF. [Subscripts should be fixed in the
accompanying figures and equations also.] Choosing a value in the kilohm range is desirable because the
amplifier circuit uses currents in the milliampere range. This ensures the part does not draw too much current.
This example uses 10 kΩfor RIwhich means 36 kΩis used for RF. This was determined by Equation 3.
(3)
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
0 0.5 1 1.5 2
Volts
Time (ms)
VIN
VOUT
27
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
Typical Application (continued)
10.2.3 Application Curve
Figure 53. Input and Output Voltages of the Inverting Amplifier
11 Power Supply Recommendations
CAUTION
Supply voltages larger than specified in the recommended operating region can
permanently damage the device (see the Absolute Maximum Ratings).
Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high-
impedance power supplies. For more detailed information on bypass capacitor placement, see the Layout
section.
12 Layout
12.1 Layout Guidelines
For best operational performance of the device, use good PCB layout practices, including:
• Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the
operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low-impedance
power sources local to the analog circuitry.
– Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds, paying attention to the flow of the ground current.
• To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If
it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as
opposed to in parallel with the noisy trace. [Things in parallel never cross, by definition]
• Place the external components as close to the device as possible. Keeping RFand RGclose to the inverting
input minimizes parasitic capacitance, as shown in Layout Examples.
• Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.
+
RIN
RG
RF
VOUT
VIN
OUT1
OUT2
IN1í
IN1+
Ví
V+
IN2í
IN2+
RG
RIN
RF
GND
VIN
VSí
GND
VS+
GND
Run the input traces as far
away from the supply lines
as possible
Only needed for
dual-supply
operation
Place components close to
device and to each other to
reduce parasitic errors
Use low-ESR, ceramic
bypass capacitor
(or GND for single supply) Ground (GND) plane on another layer
28
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
12.2 Layout Examples
Figure 54. Operational Amplifier Board Layout for Noninverting Configuration
Figure 55. Operational Amplifier Schematic for Noninverting Configuration
29
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
www.ti.com
SLOS068X –JUNE 1976–REVISED JUNE 2020
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation FeedbackCopyright © 1976–2020, Texas Instruments Incorporated
13 Device and Documentation Support
13.1 Documentation Support
13.1.1 Related Documentation
• Texas Instruments, Circuit Board Layout Techniques.
13.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to order now.
Table 1. Related Links
PARTS PRODUCT FOLDER ORDER NOW TECHNICAL
DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY
LM158 Click here Click here Click here Click here Click here
LM158A Click here Click here Click here Click here Click here
LM258 Click here Click here Click here Click here Click here
LM258A Click here Click here Click here Click here Click here
LM358 Click here Click here Click here Click here Click here
LM358A Click here Click here Click here Click here Click here
LM358B Click here Click here Click here Click here Click here
LM2904 Click here Click here Click here Click here Click here
LM2904B Click here Click here Click here Click here Click here
LM2904V Click here Click here Click here Click here Click here
13.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
13.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
13.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
13.7 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
30
LM158
,
LM158A
,
LM258
,
LM258A
LM358
,
LM358A
,
LM358B
,
LM358BA
,
LM2904
,
LM2904B
,
LM2904BA
,
LM2904V
SLOS068X –JUNE 1976–REVISED JUNE 2020
www.ti.com
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
Submit Documentation Feedback Copyright © 1976–2020, Texas Instruments Incorporated
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most-
current data available for the designated devices. This data is subject to change without notice and without
revision of this document. For browser based versions of this data sheet, see the left-hand navigation pane.
PACKAGE OPTION ADDENDUM
www.ti.com 21-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-87710012A ACTIVE LCCC FK 20 1 Non-RoHS
& Green POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710012A
LM158FKB
5962-8771001PA ACTIVE CDIP JG 8 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 8771001PA
LM158
5962-87710022A ACTIVE LCCC FK 20 1 Non-RoHS
& Green POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710022A
LM158AFKB
5962-8771002PA ACTIVE CDIP JG 8 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 8771002PA
LM158A
LM158 MW8 ACTIVE WAFERSALE YS 0 1 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125
LM158AFKB ACTIVE LCCC FK 20 1 Non-RoHS
& Green POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710022A
LM158AFKB
LM158AJG ACTIVE CDIP JG 8 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 LM158AJG
LM158AJGB ACTIVE CDIP JG 8 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 8771002PA
LM158A
LM158FKB ACTIVE LCCC FK 20 1 Non-RoHS
& Green POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710012A
LM158FKB
LM158JG ACTIVE CDIP JG 8 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 LM158JG
LM158JGB ACTIVE CDIP JG 8 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 8771001PA
LM158
LM258AD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
LM258ADGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M3L, M3P, M3S, M3
U)
LM258ADR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM258A
LM258ADRE4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
LM258ADRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM258AP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type -25 to 85 LM258AP
LM258APE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -25 to 85 LM258AP
LM258D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
LM258DG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
LM258DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2
U)
LM258DGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2
U)
LM258DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -25 to 85 LM258
LM258DRG3 ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -25 to 85 LM258
LM258DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
LM258P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type -25 to 85 LM258P
LM258PE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -25 to 85 LM258P
LM2904AVQDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
LM2904AVQDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
LM2904AVQPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
LM2904AVQPWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
LM2904BAIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2904BA
LM2904BIDGKR PREVIEW VSSOP DGK 8 2500 RoHS (In
work) & Green
(In work)
Call TI Call TI -40 to 125
LM2904BIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B
LM2904BIPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904B
LM2904D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
PACKAGE OPTION ADDENDUM
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Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM2904DE4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
LM2904DG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
LM2904DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB
U)
LM2904DGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB
U)
LM2904DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 LM2904
LM2904DRE4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
LM2904DRG3 ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LM2904
LM2904DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
LM2904P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type -40 to 125 LM2904P
LM2904PE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 LM2904P
LM2904PSR ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
LM2904PW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
LM2904PWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 L2904
LM2904PWRG3 ACTIVE TSSOP PW 8 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L2904
LM2904PWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
LM2904PWRG4-JF ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
LM2904QDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1
LM2904QDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1
LM2904VQDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
LM2904VQDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
LM2904VQPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
PACKAGE OPTION ADDENDUM
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Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM2904VQPWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
LM358AD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
LM358ADE4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
LM358ADG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
LM358ADGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6
U)
LM358ADGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6
U)
LM358ADR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM358A
LM358ADRE4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
LM358ADRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
LM358AP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type 0 to 70 LM358AP
LM358APE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 LM358AP
LM358APW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358A
LM358APWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L358A
LM358APWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358A
LM358BAIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 L358BA
LM358BIDGKR PREVIEW VSSOP DGK 8 2500 RoHS (In
work) & Green
(In work)
Call TI Call TI -40 to 85
LM358BIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B
LM358BIPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 LM358B
LM358D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358
LM358DG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358
PACKAGE OPTION ADDENDUM
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Addendum-Page 5
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM358DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5
U)
LM358DGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 (M5L, M5P, M5S, M5
U)
LM358DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 LM358
LM358DRE4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358
LM358DRG3 ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 LM358
LM358DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LM358
LM358P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU | SN N / A for Pkg Type 0 to 70 LM358P
LM358PE3 ACTIVE PDIP P 8 50 RoHS &
Non-Green SN N / A for Pkg Type 0 to 70 LM358P
LM358PE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 LM358P
LM358PSR ACTIVE SO PS 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358
LM358PW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358
LM358PWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 L358
LM358PWRG3 ACTIVE TSSOP PW 8 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 L358
LM358PWRG4 ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358
LM358PWRG4-JF ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 L358
PLM2904BIDGKR ACTIVE VSSOP DGK 8 2500 RoHS (In
work) & Green
(In work)
Call TI Call TI -40 to 125
PLM358BIDGKR ACTIVE VSSOP DGK 8 2500 RoHS (In
work) & Green
(In work)
Call TI Call TI -40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
PACKAGE OPTION ADDENDUM
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Addendum-Page 6
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM258A, LM2904, LM2904B :
•Automotive: LM2904-Q1, LM2904B-Q1
•Enhanced Product: LM258A-EP, LM2904-EP
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
PACKAGE OPTION ADDENDUM
www.ti.com 21-Jan-2021
Addendum-Page 7
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM258ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM258DRG3 SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904AVQDR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1
LM2904AVQDRG4 SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Dec-2020
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM2904AVQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904AVQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904BIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904DR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904DRG3 SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM2904DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904PWRG4-JF TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904VQDR SOIC D 8 2500 330.0 12.5 6.4 5.2 2.1 8.0 12.0 Q1
LM2904VQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358ADR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM358ADR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358APWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358BAIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358BIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358BIPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM358DR SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Dec-2020
Pack Materials-Page 2
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM358DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM358DRG3 SOIC D 8 2500 330.0 15.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358PWRG4-JF TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM258ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM258ADR SOIC D 8 2500 853.0 449.0 35.0
LM258ADR SOIC D 8 2500 333.2 345.9 28.6
LM258ADR SOIC D 8 2500 364.0 364.0 27.0
LM258ADR SOIC D 8 2500 340.5 338.1 20.6
LM258ADRG4 SOIC D 8 2500 853.0 449.0 35.0
LM258ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM258DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Dec-2020
Pack Materials-Page 3
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM258DR SOIC D 8 2500 340.5 338.1 20.6
LM258DR SOIC D 8 2500 364.0 364.0 27.0
LM258DR SOIC D 8 2500 853.0 449.0 35.0
LM258DR SOIC D 8 2500 333.2 345.9 28.6
LM258DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM258DRG3 SOIC D 8 2500 333.2 345.9 28.6
LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM258DRG4 SOIC D 8 2500 853.0 449.0 35.0
LM2904AVQDR SOIC D 8 2500 340.5 338.1 20.6
LM2904AVQDRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2904AVQPWR TSSOP PW 8 2000 853.0 449.0 35.0
LM2904AVQPWRG4 TSSOP PW 8 2000 853.0 449.0 35.0
LM2904BAIDR SOIC D 8 2500 340.5 338.1 20.6
LM2904BIDR SOIC D 8 2500 340.5 338.1 20.6
LM2904BIPWR TSSOP PW 8 2000 853.0 449.0 35.0
LM2904DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
LM2904DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM2904DR SOIC D 8 2500 853.0 449.0 35.0
LM2904DR SOIC D 8 2500 333.2 345.9 28.6
LM2904DR SOIC D 8 2500 364.0 364.0 27.0
LM2904DR SOIC D 8 2500 340.5 338.1 20.6
LM2904DRG3 SOIC D 8 2500 333.2 345.9 28.6
LM2904DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM2904DRG4 SOIC D 8 2500 853.0 449.0 35.0
LM2904DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2904PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM2904PWR TSSOP PW 8 2000 853.0 449.0 35.0
LM2904PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM2904PWRG4 TSSOP PW 8 2000 853.0 449.0 35.0
LM2904PWRG4-JF TSSOP PW 8 2000 853.0 449.0 35.0
LM2904QDR SOIC D 8 2500 350.0 350.0 43.0
LM2904VQDR SOIC D 8 2500 340.5 338.1 20.6
LM2904VQPWR TSSOP PW 8 2000 853.0 449.0 35.0
LM2904VQPWRG4 TSSOP PW 8 2000 853.0 449.0 35.0
LM358ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM358ADR SOIC D 8 2500 340.5 338.1 20.6
LM358ADR SOIC D 8 2500 853.0 449.0 35.0
LM358ADR SOIC D 8 2500 364.0 364.0 27.0
LM358ADR SOIC D 8 2500 333.2 345.9 28.6
LM358ADRG4 SOIC D 8 2500 853.0 449.0 35.0
LM358ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM358APWR TSSOP PW 8 2000 364.0 364.0 27.0
LM358APWR TSSOP PW 8 2000 853.0 449.0 35.0
LM358APWRG4 TSSOP PW 8 2000 853.0 449.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Dec-2020
Pack Materials-Page 4
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM358BAIDR SOIC D 8 2500 340.5 338.1 20.6
LM358BIDR SOIC D 8 2500 340.5 338.1 20.6
LM358BIPWR TSSOP PW 8 2000 853.0 449.0 35.0
LM358DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
LM358DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM358DR SOIC D 8 2500 333.2 345.9 28.6
LM358DR SOIC D 8 2500 853.0 449.0 35.0
LM358DR SOIC D 8 2500 340.5 338.1 20.6
LM358DR SOIC D 8 2500 364.0 364.0 27.0
LM358DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM358DRG3 SOIC D 8 2500 333.2 345.9 28.6
LM358DRG4 SOIC D 8 2500 853.0 449.0 35.0
LM358DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM358PWR TSSOP PW 8 2000 853.0 449.0 35.0
LM358PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM358PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM358PWRG4 TSSOP PW 8 2000 853.0 449.0 35.0
LM358PWRG4-JF TSSOP PW 8 2000 853.0 449.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Dec-2020
Pack Materials-Page 5
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PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
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EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
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EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
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PACKAGE OUTLINE
C
TYP
6.6
6.2
1.2 MAX
6X 0.65
8X 0.30
0.19
2X
1.95
0.15
0.05
(0.15) TYP
0 - 8
0.25
GAGE PLANE
0.75
0.50
A
NOTE 3
3.1
2.9
B
NOTE 4
4.5
4.3
4221848/A 02/2015
TSSOP - 1.2 mm max heightPW0008A
SMALL OUTLINE PACKAGE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
18
0.1 C A B
5
4
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
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EXAMPLE BOARD LAYOUT
(5.8)
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
8X (1.5)
8X (0.45)
6X (0.65)
(R )
TYP
0.05
4221848/A 02/2015
TSSOP - 1.2 mm max heightPW0008A
SMALL OUTLINE PACKAGE
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:10X
1
45
8
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
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EXAMPLE STENCIL DESIGN
(5.8)
6X (0.65)
8X (0.45)
8X (1.5)
(R ) TYP0.05
4221848/A 02/2015
TSSOP - 1.2 mm max heightPW0008A
SMALL OUTLINE PACKAGE
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
45
8
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
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