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3
P
Vishay Sfernice
Document Number: 53017
Revision 26-Jul-05
For technical questions, contact sfer@vishay.com
T.C. CODE FILM
Ni Cr
Y
± 10ppm/°C*
Ni Cr
E
± 25ppm/°C
Ni Cr or Ta2N
H
± 50ppm/°C
(standard)
Ni Cr or Ta2N
K
± 100ppm/°C
* R > 50Ω on request for lower values
TEMPERATURE COEFFICIENT TIGHTEST
TOLERANCE CODE OHMIC
VALUES
R > 10Ω
C
± 0.25%
R > 25Ω
B
± 0.10%
R > 50Ω
W
± 0.05%
R > 100Ω
P
± 0.02%
R > 250Ω
L
TCR
ppm/°C
± 25
± 20
± 10
± 0.01%
BEST TOL. AND TCR V RESISTANCE VALUE
High Precision Wraparound, Thin Film Chip Resistors
1.27
(0.050)
TESTS CONDITIONS
Thermal Shock
Short Time Overload
Low Temperature Operation
Resistance To Solder Heat
High Temperature
Moisture Resistance
MIL - PRF - 55342G
MIL-Std-202 F -Method 107 F
MIL - PRF - 55342G
Para 3.10.4.7.5
MIL - PRF - 55342G
Para 3.9 & 4.7.4
MIL - PRF - 55342G
Para 3.12, 4.7.7, 4.7.1.2
MIL - PRF - 55342G
Para 3.13 & 4.7.8
MIL-Std-202 F-Method 106 E
MIL - PRF - 55342G
2000 hours Pn at 70°C
MIL-Std-202 F -Method 108 A
MIL-PRF-55342G
Requirements
Typical
performances MIL-PRF-55342G
Requirements
Typical
performances
± 0.25%
± 0.10%
± 0.25%
± 0.25%
± 0.40%
± 0.20%
± 0.50%
± 0.02%
± 0.01%
± 0.01%
± 0.04%
± 0.01%
± 0.075%
± 0.15%
± 0.05%
± 0.05%
± 0.05%
± 0.05%
± 0.10%
± 0.05%
± 0.5%
± 0.02%
± 0.01%
± 0.01%
± 0.03%
± 0.01%
± 0.05%
± 0.10%*
Ta2N DRIFTS Ni Cr
Load Life
*0.05 % under Pd
PERFORMANCE
Several types of packaging are available: tube, waffle-pack and tape
and reel.
NUMBER OF PIECES PER PACKAGE
SIZE TUBE
WAFFLE
PACK
2" X 2"
TAPE AND REEL TAPE
WIDTH
0603
0505
1005
1206
1505
2010
0805
0705
500 100
140
60
500
100
250 4000
*12mm on request
MIN. MAX.
PACKAGING
MIL - PRF - 55342G
Para 3.11 & 4.7.6
ELECTRICAL SPECIFICATIONS
Resistance Range: 10Ω to 3MΩ
Resistance Tolerance: ± 0.1% to ± 5%
± 0.01% to ± 0.05% on Y type
Power Dissipation: Pn: 50mW to 1W
Pd: 37mW to 500mW
on tolerance tighter than ± 0.05%
Temperature Coefficient: see table below
MECHANICAL SPECIFICATIONS
Substrate: Alumina
Technology: Thin Film
Film: Nickel Chromium with mineral
passivation or Ta2N
Protection: Silicon
Terminations: B type: SnPb over nickel barrier
for solder reflow
N type: SnAg over nickel barrier
G type: gold over nickel barrier for
other applications
CLIMATIC SPECIFICATIONS
Operating Temp. Range: – 55°C to + 155°C
For temperature up to 200°C, please consult factory
% RATED POWER
100
80
60
40
20
0
0 20 40 60 70 80 100 120 140 155
AMBIENT TEMPERATURE IN °C
POWER DERATING CURVE
8mm*
8mm
0402