SPECIFICATION
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Supplier : Samsung electro-mechanics •
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Samsung P/N : CL43B334KBFNNNE
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Product : Multi-layer Ceramic Capacitor •
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Description : CAP, 330㎋
㎋㎋
㎋, 50V, ±10%, X7R, 1812
CL 43 B 334 K B F N N N E
①
①①
① ②
②②
② ③
③③
③ ④
④④
④ ⑤
⑤⑤
⑤ ⑥
⑥⑥
⑥ ⑦
⑦⑦
⑦ ⑧
⑧⑧
⑧ ⑨
⑨⑨
⑨ ⑩
⑩⑩
⑩ ⑪
⑪⑪
⑪
①
①①
①Series Samsung Multi-layer Ceramic Capacitor
②
②②
②Size 1812 (inch code) L: 4.5 ± 0.4 mm W: ± 0.3 mm
③
③③
③Dielectric X7R ⑧
⑧⑧
⑧Inner electrode
④
④④
④Capacitance 330 ㎋Termination
⑤
⑤⑤
⑤Capacitance ±10 % Plating (Pb Free)
tolerance ⑨
⑨⑨
⑨Product Normal
⑥
⑥⑥
⑥Rated Voltage 50 V ⑩
⑩⑩
⑩Special Reserved for future use
⑦
⑦⑦
⑦Thickness 1.25 ± 0.2 mm ⑪
⑪⑪
⑪Packaging Embossed Type, 7" reel
B. Samsung Reliablility Test and Judgement condition
Capacitance Within specified tolerance 1㎑±10% 1.0±0.2Vrms
Tan δ
δδ
δ (DF) 0.025 max.
Insulation 10,000Mohm or 500Mohm⋅㎌Rated Voltage 60~120 sec.
Resistance Whichever is Smaller
Appearance No abnormal exterior appearance Microscope (×10)
Withstanding No dielectric breakdown or of the rated voltage
Voltage mechanical breakdown
Temperature X7R
Characterisitcs (From -55℃ to 125℃, Capacitance change shoud be within ±15%)
Adhesive Strength No peeling shall be occur on the 500g⋅F, for 10±1 sec.
of Termination terminal electrode
Bending Strength Capacitance change : within ±12.5% Bending to the limit (1mm)
with 1.0mm/sec.
Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder
is to be soldered newly 245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to Capacitance change : within ±7.5% Solder pot : 270±5℃, 10±1sec.
Soldering heat Tan δ, IR : initial spec.
Sn 100%
Cu
Ni
3.2
Performance Test condition
250%
A. Samsung Part Number
Vibration Test Capacitance change : within ±5% Amplitude : 1.5mm
Tan δ, IR : initial spec. From 10㎐ to 55㎐ (return : 1min.)
2hours × 3 direction (x, y, z)
Moisture Capacitance change : within ±12.5% With rated voltage
Resistance Tan δ : 0.05 max 40±2℃, 90~95%RH, 500+12/-0hrs
IR : 500Mohm or 25Mohm ⋅ ㎌
Whichever is Smaller
High Temperature Capacitance change : within ±12.5%
With
of the rated voltage
Resistance Tan δ : 0.05 max Max. operating temperature
IR : 1000Mohm or 50Mohm ⋅ ㎌
Whichever is Smaller 1000+48/-0hrs
Temperature Capacitance change : within ±7.5% 1 cycle condition
Cycling Tan δ, IR : initial spec.
Min. operating temperature
→25℃
→Max. operating temperature →25℃
5 cycle test
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.
200%
Performance Test condition
