Pb
RoHS
ECXO-2158-32.000M TR
PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters
are intentionally excluded from this specification sheet.
ECXO-2158 -32.000M TR
Series
Ecliptek Custom Oscillator
Nominal Frequency
32.000MHz
Packaging Options
Tape & Reel
ELECTRICAL SPECIFICATIONS
Nominal Frequency 32.000MHz
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-202, Method 213, Condition C
Resistance to Soldering Heat MIL-STD-202, Method 210
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010
Vibration MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
1.60 ±0.20
5.00
±0.15
7.00
±0.15
MARKING
ORIENTATION
3.68
±0.15
1.4 ±01 1.2 ±0.2
2.60
±0.15
5.08
±0.15
12
34
PIN CONNECTION
1 Tri-State
2 Case Ground
3 Output
4 Supply Voltage
LINE MARKING
1ECXO2158
232.000M
3XXYZZ
XX=Ecliptek Manufacturing
Designator
Y=Last Digit Of Year
ZZ=Week of Year
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 1 of 5
ECXO-2158-32.000M TR
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
2.88
1.81
2.0 (X4)
2.2 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 2 of 5
DIA 50 MIN
DIA 20.2 MIN
DIA 13.0 ±0.2
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.5 MIN
Tape & Reel Dimensions
*Compliant to EIA 481A
ECXO-2158-32.000M TR
16.0
+0.3/-0.1
7.5 ±0.1
6.75 ±0.1
4.0 ±0.1
2.0 ±0.1
8.0 ±0.1 B0*
DIA 1.5 +0.1/-0.0
A0*
0.3 ±0.05
K0*
22.4 MAX
360 MAX
Quantity Per Reel: 1,000 units
16.4 +2.0/-0.0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 3 of 5
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
ECXO-2158-32.000M TR
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 4 of 5
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
ECXO-2158-32.000M TR
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 5 of 5
