MC74HC151A 8-Input Data Selector/Multiplexer High-Performance Silicon-Gate CMOS The MC74HC151 is identical in pinout to the LS151. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device selects one of the eight binary Data Inputs, as determined by the Address Inputs. The Strobe pin must be at a low level for the selected data to appear at the outputs. If Strobe is high, the Y output is forced to a low level and the Y output is forced to a high level. The HC151 is similar in function to the HC251 which has 3-state outputs. 16 16 1 DATA INPUTS 4 D1 3 D2 2 D3 1 1 TSSOP-16 DT SUFFIX CASE 948F 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb-Free Package (Note: Microdot may be in either location) PIN ASSIGNMENT D3 1 16 VCC D2 2 15 D4 D1 3 14 D5 D0 4 13 D6 Y 5 12 D7 Y 6 11 A0 STROBE 7 10 A1 GND 8 9 A2 5 Y DATA OUTPUTS D4 15 D5 14 6 Y A0 11 10 A1 A2 9 STROBE HC 151A ALYWG G 1 D6 13 D7 12 ADDRESS INPUTS HC151AG AWLYWW 16 Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2 to 6 V Low Input Current: 1 mA High Noise Immunity Characteristic of CMOS Devices These are Pb-Free Devices D0 MARKING DIAGRAMS SOIC-16 D SUFFIX CASE 751B 16 Features * * * * * * http://onsemi.com FUNCTION TABLE 7 Inputs PIN 16 = VCC PIN 8 = GND Figure 1. Logic Diagram Outputs A2 A1 A0 Strobe Y Y X L L L L H H H H X L L H H L L H H X L H L H L H L H H L L L L L L L L L D0 D1 D2 D3 D4 D5 D6 D7 H D0 D1 D2 D3 D4 D5 D6 D7 D0, D1, ..., D7 = the level of the respective D input. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. (c) Semiconductor Components Industries, LLC, 2010 January, 2010 - Rev. 0 1 Publication Order Number: MC74HC151A/D MC74HC151A MAXIMUM RATINGS Symbol Parameter Value Unit -0.5 to +7.0 V DC Input Voltage (Referenced to GND) -1.5 to VCC + 1.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC + 0.5 V VCC DC Supply Voltage (Referenced to GND) Vin Vout Iin DC Input Current, per Pin 20 mA Iout DC Output Current, per Pin 25 mA ICC DC Supply Current, VCC and GND Pins 50 mA PD Power Dissipation in Still Air 500 TBD mW Tstg Storage Temperature -65 to +150 C SOIC Package TSSOP Package This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 2) VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Min Max Unit 2.0 6.0 V 0 VCC V -55 +125 C 0 0 0 1000 500 400 ns DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) Guaranteed Limit Symbol Parameter Test Conditions VCC V - 55 to 25C v 85C v 125C Unit VIH Minimum High-Level Input Voltage Vout = 0.1 V or VCC - 0.1 V |Iout| v 20 mA 2.0 4.5 6.0 1.5 3.15 4.2 1.5 3.15 4.2 1.5 3.15 4.2 V VIL Maximum Low-Level Input Voltage Vout = 0.1 V or VCC - 0.1 V |Iout| v 20 mA 2.0 4.5 6.0 0.3 0.9 1.2 0.3 0.9 1.2 0.3 0.9 1.2 V VOH Minimum High-Level Output Voltage Vin = VIH or VIL |Iout| v 20 mA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V 4.5 6.0 3.98 5.48 3.84 5.34 3.70 5.20 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 4.5 6.0 0.26 0.26 0.33 0.33 0.40 0.40 Vin = VIH VOL Maximum Low-Level Output Voltage |Iout| v 4.0 mA |Iout| v 5.2 mA Vin = VIH or VIL |Iout| v 20 mA Vin = VIH or VIL |Iout| v 4.0 mA |Iout| v 5.2 mA V Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 0.1 1.0 1.0 mA ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND Iout = 0 mA 6.0 8 80 160 mA http://onsemi.com 2 MC74HC151A AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) Guaranteed Limit Symbol Parameter VCC V - 55 to 25C v 85C v 125C Unit tPLH, tPHL Maximum Propagation Delay, Input D to Output Y (Figures 2 and 7) 2.0 4.5 6.0 170 34 29 215 43 37 255 51 43 ns tPLH, tPHL Maximum Propagation Delay, Input D to Output Y (Figures 4 and 7) 2.0 4.5 6.0 185 37 31 230 46 39 280 56 48 ns tPLH, tPHL Maximum Propagation Delay, Input D to Output Y (Figures 3 and 7) 2.0 4.5 6.0 185 37 31 230 46 39 280 56 48 ns tPLH, tPHL Maximum Propagation Delay, Input A to Output Y (Figures 3 and 7) 2.0 4.5 6.0 205 41 35 255 51 43 310 62 53 ns tPLH, tPHL Maximum Propagation Delay, Input D to Output Y (Figures 5 and 7) 2.0 4.5 6.0 125 25 21 155 31 26 190 38 32 ns tPLH, tPHL Maximum Propagation Delay, Strobe to Output Y (Figures 6 and 7) 2.0 4.5 6.0 125 25 21 155 31 26 190 38 32 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 2, 4 and 7) 2.0 4.5 6.0 75 15 13 95 19 16 110 22 19 ns - 10 10 10 pF Cin Maximum Input Capacitance Typical @ 25C, VCC = 5.0 V CPD 36 Power Dissipation Capacitance (Per Package) pF PIN DESCRIPTIONS INPUTS Strobe (Pin 7) D0, D1, ... , D7 (Pins 4, 3, 2, 1, 15, 14, 13, 12) Strobe. This input pin must be at a low level for the selected data to appear at the outputs. If the Strobe pin is high, the Y output is forced to a low level and the Y output is forced to a high level. Data inputs. Data on any one of these eight binary inputs may be selected to appear on the output. CONTROL INPUTS OUTPUTS A0, A1, A2 (Pins 11, 10, 9) Y, Y (Pins 5, 6) Address inputs. The data on these pins are the binary address of the selected input (see the Function Table). Data outputs. The selected data is presented at these pins in both true (Y output) and complemented (Y output) forms. http://onsemi.com 3 MC74HC151A SWITCHING WAVEFORMS tf tr VALID INPUT D VCC 50% INPUT A GND GND tPLH tPLH tPHL 90% 50% 10% OUTPUT Y tPHL OUTPUT Y OR Y 50% tTHL tTLH Figure 2. Figure 3. tr tf tf VCC 90% 50% 10% INPUT D VALID VCC 90% 50% 10% GND tPHL VCC GND tPLH tPLH 90% 50% 10% OUTPUT Y tPHL 90% 50% 10% Y tTHL tr 90% STROBE 50% 10% tTLH tTLH tTHL Figure 4. Figure 5. TEST POINT tr tf VCC 90% 50% STROBE 10% GND tPHL Y OUTPUT DEVICE UNDER TEST tPLH 90% 50% 10% tTHL CL* tTLH *Includes all probe and jig capacitance Figure 6. Figure 7. Test Circuit http://onsemi.com 4 MC74HC151A 4 D0 3 D1 D2 2 D3 1 DATA INPUTS 5 Y D4 15 6 Y D5 14 DATA OUTPUTS D6 13 D7 12 A0 11 ADDRESS INPUTS A1 10 9 A2 7 STROBE Figure 8. Expanded Logic Diagram ORDERING INFORMATION Package Shipping MC74HC151ADG SOIC-16 (Pb-Free) 48 Units / Rail MC74HC151ADR2G SOIC-16 (Pb-Free) 2500 Tape & Reel TSSOP-16* 2500 Tape & Reel Device MC74HC151ADTR2G For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free. http://onsemi.com 5 MC74HC151A PACKAGE DIMENSIONS SOIC-16 CASE 751B-05 ISSUE K -A- 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 -B- 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C -T- SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT* 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74HC151A PACKAGE DIMENSIONS TSSOP-16 DT SUFFIX CASE 948F-01 ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U T U M S V S K CCC CCC EEE CCC EEE S K1 2X L/2 16 9 J1 B -U- L SECTION N-N J PIN 1 IDENT. N 8 1 0.25 (0.010) M 0.15 (0.006) T U S A -V- N F DETAIL E C 0.10 (0.004) -T- SEATING PLANE D H G DETAIL E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C --- 1.20 --- 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011 -W- J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_ SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MC74HC151A ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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