DS23022 Rev. 5 - 2 1 of 3 SB120-SB160
www.diodes.com ãDiodes Incorporated
SB120 - SB160
1.0A SCHOTTKY BARRIER RECTIFIER
Features
AA
B
C
D
DO-41 Plastic
Dim Min Max
A25.40 ¾
B4.06 5.21
C0.71 0.864
D2.00 2.72
All Dimensions in mm
Maximum Ratings and Electrical Characteristics @ TA= 25°C unless otherwise specified
·Schottky Barrier Chip
·Guard Ring Die Construction for Transient Protection
·Low Power Loss, High Efficiency
·High Surge Capability
·High Current Capability and Low Forward Voltage Drop
·Surge Overload Rating to 40A Peak
·For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Applications
·Lead Free Finish, RoHS Compliant (Note 3)
Mechanical Data
·Case: DO-41 Plastic
·Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
·Moisture Sensitivity: Level 1 per J-STD-020C
·Terminals: Finish - Bright Tin. Plated Leads Solderable per
MIL-STD-202, Method 208
·Polarity: Cathode Band
·Mounting Position: Any
·Ordering Information: See Last Page
·Marking: Type Number
·Weight: 0.3 grams (approximate)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic Symbol SB120 SB130 SB140 SB150 SB160 Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
20 30 40 50 60 V
RMS Reverse Voltage VR(RMS) 14 21 28 35 42 V
Average Rectified Output Current
(Note 1) (See Figure 1) IO1.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)
IFSM 40 A
Forward Voltage (Note 2) @ IF= 1.0A VFM 0.50 0.70 V
Peak Reverse Current @ TA= 25°C
at Rated DC Blocking Voltage (Note 2) @ TA= 100°CIRM
0.5 mA
10 5.0
Typical Thermal Resistance Junction to Lead (Note 1) RqJL 15 °C/W
Typical Thermal Resistance Junction to Ambient RqJA 50 °C/W
Operating Temperature Range Tj-65 to +125 -65 to +150 °C
Storage Temperature Range TSTG -65 to +150
Notes: 1. Measured at ambient temperature at a distance of 9.5mm from the case.
2. Short duration test pulse used to minimize self-heating effect.
3. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7.