Semiconductor Components Industries, LLC, 2001
October, 2001 – Rev. 8 1Publication Order Number:
SN74LS245/D
SN74LS245
Octal Bus Transceiver
The SN74LS245 is an Octal Bus Transmitter/Receiver designed for
8-line asynchronous 2-way data communication between data buses.
Direction Input (DR) controls transmission of Data from bus A to bus
B or bus B to bus A depending upon its logic level. The Enable input
(E) can be used to isolate the buses.
•Hysteresis Inputs to Improve Noise Immunity
•2-Way Asynchronous Data Bus Communication
•Input Diodes Limit High-Speed Termination Effects
•ESD > 3500 Volts
LOGIC AND CONNECTION DIAGRAMS DIP (TOP VIEW)
18 17 16 15 14 13
1234 567
20 19
8
VCC
DIR
EB1 B2 B3 B5B4 B6
A1 A2 A3 A4 A5 A6 A7
910
A8 GND
12 11
B7 B8
TRUTH TABLE
INPUTS
OUTPUT
E DIR OUTPUT
L L Bus B Data to Bus A
L H Bus A Data to Bus B
H X Isolation
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
GUARANTEED OPERATING RANGES
Symbol Parameter Min Typ Max Unit
VCC Supply Voltage 4.75 5.0 5.25 V
TAOperating Ambient
Temperature Range 0 25 70 °C
IOH Output Current – High –3.0 mA
O
–15 mA
IOL Output Current – Low 24 mA
LOW
POWER
SCHOTTKY
http://onsemi.com
PDIP–20
N SUFFIX
CASE 738
20
1
20
1
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
SN74LS245N
AWLYYWW
MARKING
DIAGRAMS
LS245
AWLYYWW
SOIC–20
DW SUFFIX
CASE 751D 1
1
20 1SOEIAJ–20
M SUFFIX
CASE 967
74LS245
AWLYWW
1
Device Package Shipping
ORDERING INFORMATION
SN74LS245N PDIP–20 1440 Units/Box
SN74LS245DW SOIC–WIDE 38 Units/Rail
SN74LS245DWR2 SOIC–WIDE 2500/Tape & Reel
SN74LS245M See Note 1.
SOEIAJ–20
SN74LS245MEL See Note 1.SOEIAJ–20
1. For ordering information on the EIAJ version of
the SOIC package, please contact your local
ON Semiconductor representative.
SN74LS245
http://onsemi.com
2
DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE (unless otherwise specified)
Limits
Symbol Parameter Min Typ Max Unit Test Conditions
VIH Input HIGH Voltage 2.0 V Guaranteed Input HIGH Voltage for
All Inputs
VIL Input LOW Voltage 0.8 VGuaranteed Input LOW Voltage for
All Inputs
VT+–VT– Hysteresis 0.2 0.4 V VCC = MIN
VIK Input Clamp Diode Voltage –0.65 –1.5 V VCC = MIN, IIN = –18 mA
VOH
Out
p
ut HIGH Voltage
2.4 3.4 V VCC = MIN, IOH = –3.0 mA
VOH Output HIGH Voltage 2.0 V VCC = MIN, IOH = MAX
VOL
Out
p
ut LOW Voltage
0.25 0.4 V IOL = 12 mA VCC = VCC MIN,
VIN VIL or VIH
VOL Output LOW Voltage 0.35 0.5 V IOL = 24 mA VIN = VIL or VIH
per Truth Table
IOZH Output Off Current HIGH 20 µA VCC = MAX, VOUT = 2.7 V
IOZL Output Off Current LOW –200 µA VCC = MAX, VOUT = 0.4 V
A or B, DR or
E20 µA VCC = MAX, VIN = 2.7 V
IIH Input HIGH Current DR or E 0.1 mA VCC = MAX, VIN = 7.0 V
A or B 0.1 mA VCC = MAX, VIN = 5.5 V
IIL Input LOW Current –0.2 mA VCC = MAX, VIN = 0.4 V
IOS Output Short Circuit Current (Note 2.) –40 –225 mA VCC = MAX
Power Supply Current
Total, Output HIGH 70
ICC Total, Output LOW 90 mA VCC = MAX
Total at HIGH Z 95
2. Not more than one output should be shorted at a time, nor for more than 1 second.
AC CHARACTERISTICS (TA = 25°C, VCC = 5.0 V, TRISE/TFALL ≤ 6.0 ns)
Limits
Symbol Parameter Min Typ Max Unit Test Conditions
tPLH
tPHL Propagation Delay, Data to Output 8.0
8.0 12
12 ns
CL
=
45
p
F,
tPZH Output Enable Time to HIGH Level 25 40 ns
CL
=
45
pF
,
RL = 667 Ω
tPZL Output Enable Time to LOW Level 27 40 ns
L
tPLZ Output Disable Time from LOW Level 15 25 ns C
L
= 5.0 pF,
tPHZ Output Disable Time from HIGH Level 15 25 ns
CL
=
5
.
0
F
,
RL = 667 Ω
SN74LS245
http://onsemi.com
3
PACKAGE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
M
L
J20 PL
M
B
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A25.66 27.171.010 1.070
B6.10 6.600.240 0.260
C3.81 4.570.150 0.180
D0.39 0.550.015 0.022
G2.54 BSC0.100 BSC
J0.21 0.380.008 0.015
K2.80 3.550.110 0.140
L7.62 BSC0.300 BSC
M0 15 0 15
N0.51 1.010.020 0.040
E
1.27 1.770.050 0.070
1
11
10
20
–A–
SEATING
PLANE
K
N
FG
D20 PL
–T–
M
A
M
0.25 (0.010) T
E
B
C
F
1.27 BSC0.050 BSC
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–05
ISSUE F
20
1
11
10
B20X
H10X
C
L
18X A1
A
SEATING
PLANE
hX 45
E
D
M
0.25 M
B
M
0.25 S
AS
B
T
eT
B
A
DIM MIN MAX
MILLIMETERS
A2.35 2.65
A1 0.10 0.25
B0.35 0.49
C0.23 0.32
D12.65 12.95
E7.40 7.60
e1.27 BSC
H10.05 10.55
h0.25 0.75
L0.50 0.90
0 7
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.
SN74LS245
http://onsemi.com
4
PACKAGE DIMENSIONS
M SUFFIX
SOEIAJ PACKAGE
CASE 967–01
ISSUE O
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
12.35 12.80 0.486 0.504
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
--- 0.81 --- 0.032
A1
HE
Q1
LE
10 0
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
HE
A1
LEQ1
c
A
ZD
E
20
110
11
b
M
0.13 (0.005)
e
0.10 (0.004)
VIEW P
DETAIL P
M
L
A
b
c
D
E
e
L
M
Z
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4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031
Phone: 81–3–5740–2700
Email: r14525@onsemi.com
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For additional information, please contact your local
Sales Representative.
SN74LS245/D
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