(Voltages referenced to AGND.)
VL, VA, VEXT, XIN.................................................-0.3V to +4.0V
V18, XOUT.............-0.3V to the lesser of (VA + 0.3V) and +2.0V
RST, IRQ, MOSI/A1, CS/A0, SCLK/SCL,
MISO/SDA, LDOEN, SPI/I2C...................-0.3V to (VL + 0.3V)
TX0, RX0, CTS0, GPIO0, GPIO1,
GPIO2, GPIO3.....................................-0.3V to (VEXT + 0.3V)
TX1, RX1, CTS1, GPIO4, GPIO5,
GPIO6, GPIO7.....................................-0.3V to (VEXT + 0.3V)
TX2, RX2, CTS2, GPIO8, GPIO9,
GPIO10, GPIO11.................................-0.3V to (VEXT + 0.3V)
TX3, RX3, CTS3, GPIO12, GPIO13,
GPIO14, GPIO15.................................-0.3V to (VEXT + 0.3V)
DGND................................................................... -0.3V to +0.3V
Continuous Power Dissipation (TA = +70°C)
TQFN (derate 38.5mW/°C above +70°C)................3076.9mW
Operating Temperature Range............................-40°C to +85°C
Maximum Junction Temperature......................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s)....................................300°C
Soldering Temperature (reflow) ......................................+260°C
TQFN
Junction-to-Ambient Thermal Resistance (θJA) ..........26°C/W
Junction-to-CaseThermal Resistance (θJC) ..................1°C/W
(Note 1)
(VA = +2.35V to +3.6V, VL = +1.71V to +3.6V, VEXT = +1.71V to +3.6V, TA = -40°C to +85°C, unless otherwise noted. Typical values
are at VA = +2.5V, VL = +1.8V, VEXT = +2.8V, TA = +25°C.) (Notes 2, 3)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
DC Electrical Characteristics
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Digital Interface Supply Voltage VL1.71 3.6 V
Analog Supply Voltage VA2.35 3.6 V
UART Interface Logic Supply
Voltage VEXT 1.71 3.6 V
Logic Supply Voltage V18 1.65 1.95 V
CURRENT CONSUMPTION
VA Supply Current I A
1.8MHz crystal oscillator active, PLL
disabled, SPI/I2C interface idle, UART
interfaces idle, VLDOEN = VL
400 µA
Baud rate = 1Mbps, 20MHz external clock,
SPI/I2C interface idle, PLL disabled, all
UARTs in loopback mode, VLDOEN = 0V
0.5 mA
VA Shutdown Supply Current IASHDN
Shutdown mode, VLDOEN = 0V, VRST = 0V,
all inputs and outputs are idle 35 µA
VL Shutdown or Sleep Supply
Current IL
Shutdown mode, VLDOEN = 0V, VRST = 0V,
all inputs and outputs are idle 12 µA
VEXT Shutdown Supply Current IEXT
Shutdown mode, VLDOEN = 0V, VRST = 0V,
all inputs and outputs are idle 8 µA
MAX14830 Quad Serial UART with 128-Word FIFOs
www.maximintegrated.com Maxim Integrated
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