1. General description
The LVT126 is a high-performance BiCMOS product designed for VCC operation at 3.3 V.
This device combines low static and dynamic power dissipation with high speed and high
output drive. The 74LVT126 device is a quad buffer that is ideal for driving bus lines. The
device features four output enable inputs (1OE, 2OE, 3OE and 4OE), each controlling one
of the 3-state outputs.
2. Features
■Quad bus interface
■3-state buffers
■Output capability: +64 mA and −32 mA
■TTL input and output switching levels
■Input and output interface capability to systems at 5 V supply
■Bus-hold data inputs eliminate the need for external pull-up resistors to hold unused
inputs
■Live insertion and extraction permitted
■No bus current loading when output is tied to 5 V bus
■Power-up 3-state
■Latch-up protection:
◆JESD78: exceeds 500 mA
■ESD protection:
◆MIL STD 883 method 3015: exceeds 2000 V
◆Machine model: exceeds 200 V
3. Quick reference data
74LVT126
3.3 V quad buffer; 3-state
Rev. 04 — 11 February 2005 Product data sheet
Table 1: Quick reference data
GND = 0 V; T
amb
=25
°
C.
Symbol Parameter Conditions Min Typ Max Unit
tPLH propagation delay nA to nY CL = 50 pF; VCC = 3.3 V - 2.3 - ns
tPHL propagation delay nA to nY CL = 50 pF; VCC = 3.3 V - 2.4 - ns
CIinput capacitance VI = 0 V or VCC -4-pF
COoutput capacitance outputs disabled;
VO= 0 V or 3.0 V -8-pF
ICC quiescent supply current outputs disabled;
VCC = 3.6 V - 0.13 - mA
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 2 of 15
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
4. Ordering information
5. Functional diagram
Table 2: Ordering information
Type number Package
Temperature range Name Description Version
74LVT126D −40 °C to +85 °C SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
74LVT126DB −40 °C to +85 °C SSOP14 plastic shrink small outline package; 14 leads; body width
5.3 mm SOT337-1
74LVT126PW −40 °C to +85 °C TSSOP14 plastic thin shrink small outline package; 14 leads; body
width 4.4 mm SOT402-1
74LVT126BQ −40 °C to +85 °C DHVQFN14 plastic dual in-line compatible thermal enhanced very thin
quad flat package; no leads; 14 terminals;
body 2.5 ×3×0.85 mm
SOT762-1
Fig 1. Logic symbol Fig 2. IEC logic symbol
001aac482
1A 1Y2
11OE
2A 2Y
2OE
3A 3Y
3OE
4A 4Y
4OE
5
4
9
10
12
13
3
6
8
11
001aac483
2
1
1
5
4
9
10
12
13
3
EN1
6
8
11
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 3 of 15
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
6. Pinning information
6.1 Pinning
6.2 Pin description
(1) The die substrate is attached to the
exposed die pad using conductive die
attach material. It can not be used as
a supply pin or input.
Fig 3. Pin configuration SO14, SSOP14
and TSSOP14 Fig 4. Pin configuration DHVQFN14
126
VCC
GND
001aac484
1
2
3
4
5
6
7 8
10
9
12
11
14
13
1A
1Y
1OE
2A
2Y
2OE
3A
3Y
3OE
4A
4Y
4OE
001aac485
126
Transparent top view
2Y 3A
GND(1)
2A 3OE
2OE 4Y
1Y 4A
1A 4OE
GND
3Y
1OE
VCC
6 9
5 10
4 11
3 12
2 13
7
8
1
14
terminal 1
index area
Table 3: Pin description
Symbol Pin Description
1OE 1 1 output enable input
1A 2 1 data input
1Y 3 1 data output
2OE 4 2 output enable input
2A 5 2 data input
2Y 6 2 data output
GND 7 ground (0 V)
3Y 8 3 data output
3A 9 3 data input
3OE 10 3 output enable input
4Y 11 4 data output
4A 12 4 data input
4OE 13 4 output enable input
VCC 14 supply voltage
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 4 of 15
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
7. Functional description
7.1 Function table
[1] H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
8. Limiting values
[1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings
are observed.
[2] The performance capability of a high-performance integrated circuit in conjunction with its thermal
environment can create junction temperatures which are detrimental to reliability.
Table 4: Function table[1]
Input Output
nOE nA nY
HLL
HHH
LXZ
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage −0.5 +4.6 V
VIinput voltage [1] −0.5 +7.0 V
VOoutput voltage output inOFF-state or
HIGH-state [1] −0.5 +7.0 V
IIK input diode current VI < 0 V - −50 mA
IOK output diode current VO < 0 V - −50 mA
IOoutput current output in LOW-state - 128 mA
output in HIGH-state - −64 mA
Tstg storage temperature −65 +150 °C
Tjjunction temperature [2] - 150 °C
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 5 of 15
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
9. Recommended operating conditions
10. Static characteristics
Table 6: Recommended operating conditions
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage 2.7 - 3.6 V
VIinput voltage 0 - 5.5 V
VIH HIGH-level input voltage 2.0 - - V
VIL LOW-level input voltage - - 0.8 V
IOH HIGH-level output current - - −32 mA
IOL LOW-level output current none - - 32 mA
current duty cycle
≤ 50 %; f ≥1 kHz --64mA
∆t/∆V input transition rise or fall
rate outputs enabled - - 10 ns/V
Tamb ambient temperature in free air −40 - +85 °C
Table 7: Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Typ Max Unit
Tamb =−40 °C to +85 °C[1]
VIK input diode voltage IIK =−18 mA; VCC = 2.7 V - −0.9 −1.2 V
VOH HIGH-level output voltage IOH =−100 µA;
VCC = 2.7 V to 3.6 V; VCC − 0.2 VCC − 0.1 - V
IOH =−8 mA; VCC = 2.7 V 2.4 2.5 - V
IOH =−32 mA; VCC = 3.0 V 2.0 2.2 - V
VOL LOW-level output voltage VCC = 2.7 V
IOL = 100 µA - 0.1 0.2 V
IOL = 24 mA - 0.3 0.5 V
VCC = 3.0 V
IOL = 16 mA - 0.25 0.4 V
IOL = 32 mA - 0.3 0.5 V
IOL = 64 mA - 0.4 0.55 V
ILI input leakage current
all input pins VCC = 0 V or 3.6 V; VI= 5.5 V - 1 10 µA
control pins VCC = 3.6 V; VCC or GND - ±0.1 ±1µA
data pins VCC = 3.6 V; VI=V
CC [2] - 0.1 1 µA
VCC = 3.6 V; VI=0V [2] -−1−5µA
IOFF power-down output current VCC = 0 V; VI or VO = 0 V to 4.5 V - 1 ±100 µA
IHOLD bus hold current A input VCC = 3 V; VI = 0.8 V [3] 75 150 - µA
VCC = 3 V; VI = 2.0 V −75 −150 - µA
VCC = 0 V to 3.6 V; VI= 3.6 V ±500 - - µA
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 6 of 15
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
[1] Typical values are measured at nominal VCC and Tamb = 25 °C.
[2] Unused pins at VCC or GND.
[3] This is the bus hold overdrive current required to force the input to the opposite logic state.
[4] This parameter is valid for any VCC between 0 V and 1.2 V with a transition time of up to 10 ms. From VCC = 1.2 V to VCC = 3.3 V ±0.3 V
a transition time of 100 µs is permitted. This parameter is valid for Tamb =25°C only.
[5] Measured with outputs pulled up to VCC or GND.
[6] This is the increase in supply current for each input at the specified voltage level other than VCC or GND.
11. Dynamic characteristics
IEX external current into output output in HIGH-state when
VO>V
CC; VO = 5.5 V and
VCC = 3.0 V
- 60 125 µA
IPU, IPD power-up or power-down
3-state output current VCC ≤ 1.2 V; VO = 0.5 V to VCC;
VI= GND or VCC; nOE = don’t care [4] -±1±100 µA
IOZ 3-state output current VCC = 3.6 V
output HIGH: VO = 3.0 V - 1 5 µA
output LOW: VO = 0.5 V - −1−5µA
ICC quiescent supply current VCC = 3.6 V; VI = GND or VCC;
IO=0 A
outputs HIGH - 0.13 0.19 mA
outputs LOW - 2 7 mA
outputs disabled [5] - 0.13 0.19 mA
∆ICC additional supply current
per input pin VCC = 3 V to 3.6 V; one input at
VCC − 0.6 V and other inputs at
VCC or GND
[6] - 0.1 0.2 mA
CIinput capacitance VI = 0 V or VCC -4-pF
COoutput capacitance outputs disabled; VO= 0 V or 3.0 V - 8 - pF
Table 7: Static characteristics
…continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Typ Max Unit
Table 8: Dynamic characteristics
GND = 0 V; t
r
=t
f
= 2.5 ns; C
L
= 50 pF; R
L
= 500
Ω
; for test circuit see Figure 7.
Symbol Parameter Conditions Min Typ Max Unit
Tamb =−40 °C to +85 °C[1]
tPLH propagation delay nA to nY VCC = 2.7 V - - 4.5 ns
VCC = 3.3 V ±0.3 V 1.0 2.3 3.8 ns
tPHL propagation delay nA to nY VCC = 2.7 V - - 4.4 ns
VCC = 3.3 V ±0.3 V 1.0 2.4 3.9 ns
tPZH output enable time nOE to nY VCC = 2.7 V - - 6.1 ns
VCC = 3.3 V ±0.3 V 1.0 3.6 5.4 ns
tPZL output enable time nOE to nY VCC = 2.7 V - - 5.8 ns
VCC = 3.3 V ±0.3 V 1.1 3.6 5.2 ns
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 7 of 15
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
[1] Typical values are at VCC = 3.3 V and Tamb =25°C.
12. Waveforms
tPHZ output disable time nOE to nY VCC = 2.7 V - - 4.3 ns
VCC = 3.3 V ±0.3 V 1.0 2.2 3.8 ns
tPLZ output disable time nOE to nY VCC = 2.7 V - - 6.1 ns
VCC = 3.3 V ±0.3 V 1.3 3.6 5.5 ns
Table 8: Dynamic characteristics
…continued
GND = 0 V; t
r
=t
f
= 2.5 ns; C
L
= 50 pF; R
L
= 500
Ω
; for test circuit see Figure 7.
Symbol Parameter Conditions Min Typ Max Unit
VM = 1.5 V.
VOL and VOH are typical voltage output drop that occur with the output load.
Fig 5. Propagation delay input (nA) to output (nY)
VM = 1.5 V.
VOL and VOH are typical voltage output drop that occur with the output load.
Fig 6. Enable and disable times of 3-state outputs
mnb072
nA input
nY output
tPLH tPHL
GND
VI
VM
VM
VM
VM
VOH
VOL
001aac486
tPZL
nY output
nY output
nOE input
VOL
VOH
3.5 V
VI
VM
GND
0 V
tPLZ
tPZH tPHZ
VOL + 0.3 V
VOH − 0.3 V
VM
VM
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 8 of 15
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
VM= 1.5 V.
a. Input pulse definition
Test data is given in Table 9.
Definitions test circuit:
RL = Load resistor.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
VEXT = Test voltage for switching times.
b. Test circuit
Fig 7. Load circuitry for switching times
Table 9: Test data
Input Load VEXT
VIfitWtr, tfCLRLtPHZ, tPZH tPLZ, tPZL tPLH, tPHL
2.7 V ≤ 10 MHz 500 ns ≤ 2.5 ns 50 pF 500 ΩGND 6 V open
001aac221
VMVM
tW
tW
10 %
90 % 90 %
0 V
VI
VI
negative
pulse
positive
pulse
0 V
VMVM
90 %
10 % 10 %
tTHL(tf)
tTLH(tr)
tTLH(tr)
tTHL(tf)
VEXT
VCC
VIVO
mna616
D.U.T.
CL
RT
RL
RL
PULSE
GENERATOR
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 9 of 15
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
13. Package outline
Fig 8. Package outline SO14 (SOT108-1)
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 8.75
8.55 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT108-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
7
8
1
14
y
076E06 MS-012
pin 1 index
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.35
0.34 0.16
0.15 0.05
1.05
0.041
0.244
0.228 0.028
0.024 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
99-12-27
03-02-19
0 2.5 5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 10 of 15
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
Fig 9. Package outline SSOP14 (SOT337-1)
UNIT A1A2A3bpcD
(1) E(1) eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.21
0.05 1.80
1.65 0.25 0.38
0.25 0.20
0.09 6.4
6.0 5.4
5.2 0.65 1.25 0.2
7.9
7.6 1.03
0.63 0.9
0.7 1.4
0.9 8
0
o
o
0.13 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT337-1 99-12-27
03-02-19
(1)
wM
bp
D
HE
E
Z
e
c
vMA
X
A
y
17
14 8
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
MO-150
pin 1 index
0 2.5 5 mm
scale
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1
A
max.
2
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 11 of 15
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
Fig 10. Package outline TSSOP14 (SOT402-1)
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 5.1
4.9 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.72
0.38 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1 MO-153 99-12-27
03-02-18
wM
bp
D
Z
e
0.25
17
14 8
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
A
max.
1.1
pin 1 index
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 12 of 15
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
Fig 11. Package outline DHVQFN14 (SOT762-1)
terminal 1
index area
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 3.1
2.9
Dh
1.65
1.35
y1
2.6
2.4 1.15
0.85
e1
2
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT762-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT762-1
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
26
13 9
8
7
1
14
X
D
E
C
BA
02-10-17
03-01-27
terminal 1
index area
AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 13 of 15
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
14. Revision history
Table 10: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
74LVT126_4 20050211 Product data sheet - 9397 750 14553 74LVT126_3
Modifications: •The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•Figure 4: added Figure note 1.
74LVT126_3 20040624 Product data sheet - 9397 750 13542 74LVT126_2
74LVT126_2 19980219 Product specification - 9397 750 03515 74LVT126_1
74LVT126_1 - - - - -
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
9397 750 14553 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 11 February 2005 14 of 15
15. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
16. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
17. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
18. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheetcontains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 11 February 2005
Document number: 9397 750 14553
Published in The Netherlands
Philips Semiconductors 74LVT126
3.3 V quad buffer; 3-state
19. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Functional description . . . . . . . . . . . . . . . . . . . 4
7.1 Function table. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
9 Recommended operating conditions. . . . . . . . 5
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13
15 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 14
16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
17 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
18 Contact information . . . . . . . . . . . . . . . . . . . . 14
