PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
10 November 2017 Product data sheet
1. General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-
Mounted Device (SMD) plastic package.
2. Features and benefits
Average forward current: IF(AV) ≤ 5 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
High power capability due to clip-bond technology
AEC-Q101 qualified
Small and flat lead SMD plastic package
Capable for reflow and wave soldering
3. Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Switch Mode Power Supply (SMPS)
Reverse polarity protection
Low power consumption applications
4. Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IF(AV) average forward
current
δ = 0.5 ; f = 20 kHz; Tsp ≤ 130 °C;
square wave
- - 5 A
VRreverse voltage Tj = 25 °C - - 40 V
VFforward voltage IF = 5 A; Tj = 25 °C - 430 490 mV
IRreverse current VR = 40 V; Tj = 25 °C - 60 300 µA
Nexperia PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG4050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 10 November 2017 2 / 13
5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 K cathode[1]
2 A anode
1 2
CFP5 (SOD128)
sym001
1 2
[1] The marking bar indicates the cathode.
6. Ordering information
Table 3. Ordering information
PackageType number
Name Description Version
PMEG4050EP CFP5 plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8
mm x 2.6 mm x 1 mm body
SOD128
7. Marking
Table 4. Marking codes
Type number Marking code
PMEG4050EP AF
Nexperia PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG4050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 10 November 2017 3 / 13
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRreverse voltage Tj = 25 °C - 40 V
δ = 0.5 ; f = 20 kHz; Tamb ≤ 0 °C; square
wave
[1] - 5 AIF(AV) average forward current
δ = 0.5 ; f = 20 kHz; Tsp ≤ 130 °C; square
wave
- 5 A
IFSM non-repetitive peak
forward current
tp = 8 ms; Tj(init) = 25 °C; square wave - 70 A
[2] - 625 mW
[3] - 1.05 W
Ptot total power dissipation Tamb ≤ 25 °C
[1] - 2.1 W
Tjjunction temperature - 150 °C
Tamb ambient temperature -55 150 °C
Tstg storage temperature -65 150 °C
[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
[1] [2] - - 200 K/W
[1] [3] - - 120 K/W
Rth(j-a) thermal resistance
from junction to
ambient
in free air
[1] [4] - - 60 K/W
Rth(j-sp) thermal resistance
from junction to solder
point
[5] - - 12 K/W
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a
significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[5] Soldering point of cathode tab.
Nexperia PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG4050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 10 November 2017 4 / 13
006aab688
10
1
102
103
Zth(j-a)
(K/W)
10- 1
tp(s)
10- 3 102103
10110- 2 10- 1
duty cycle =
10.75
0.5 0.33
0.25 0.2
0.1
0.05
0.02 0.01
0
FR4 PCB, standard footprint
Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aab689
10
1
102
103
Zth(j-a)
(K/W)
10- 1
tp(s)
10- 3 102103
10110- 2 10- 1
duty cycle =
10.75
0.5 0.33
0.25 0.2
0.1
0.05
0.02 0.01
0
FR4 PCB, mounting pad for cathode 1 cm2
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
Nexperia PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG4050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 10 November 2017 5 / 13
006aab690
tp(s)
10- 3 102103
10110- 2 10- 1
10
1
102
Zth(j-a)
(K/W)
10- 1
duty cycle =
10.75
0.5
0.33
0.2
0.25
0.1
0.05
0.02 0.01
0
Ceramic PCB, Al2O3, standard footprint
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
IF = 0.1 A; Tj = 25 °C - 270 310 mV
IF = 1 A; Tj = 25 °C - 340 390 mV
VFforward voltage
IF = 5 A; Tj = 25 °C - 430 490 mV
VR = 10 V; Tj = 25 °C - 10 - µAIRreverse current
VR = 40 V; Tj = 25 °C - 60 300 µA
VR = 1 V; f = 1 MHz; Tj = 25 °C - 600 - pFCddiode capacitance
VR = 10 V; f = 1 MHz; Tj = 25 °C - 220 - pF
Nexperia PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG4050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 10 November 2017 6 / 13
006aab337
VF(V)
0 0.60.40.2
10- 2
10- 3
1
10- 1
10
IF
(A)
10- 4
(1)
(2)
(3) (4) (5)
(1) Tj = 150 °C
(2) Tj = 125 °C
(3) Tj = 85 °C
(4) Tj = 25 °C
(5) Tj = -40 °C
Fig. 4. Forward current as a function of forward
voltage; typical values
006aab338
10- 1
10- 2
10- 3
10- 4
10- 5
10- 6
10- 7
IR
(A)
10- 8
VR(V)
0 403010 20
(1)
(2)
(3)
(4)
(1) Tj = 125 °C
(2) Tj = 85 °C
(3) Tj = 25 °C
(4) Tj = -40 °C
Fig. 5. Reverse current as a function of reverse
voltage; typical values
VR(V)
0 403010 20
006aab339
400
800
1200
Cd
(pF)
0
f = 1 MHz; Tamb = 25 °C
Fig. 6. Diode capacitance as a function of reverse
voltage; typical values
IF(AV) (A)
0 862 4
006aab340
1
2
3
PF(AV)
(W)
0
(1)
(2)
(3)
(4)
Tj = 150 °C
(1) δ = 0.1
(2) δ = 0.2
(3) δ = 0.5
(4) δ = 1
Fig. 7. Average forward power dissipation as a
function of average forward current; typical
values
Nexperia PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG4050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 10 November 2017 7 / 13
VR(V)
0 403010 20
006aab341
0.6
1.2
1.8
PR(AV)
(W)
0.0
(1)
(2)
(3)
(4)
Tj = 125 °C
(1) δ = 1
(2) δ = 0.9
(3) δ = 0.8
(4) δ = 0.5
Fig. 8. Average reverse power dissipation as a
function of reverse voltage; typical values
Tamb (°C)
0 50 100 150 1751257525
006aab342
2.5
5.0
7.5
IF(AV)
(A)
0
(1)
(2)
(3)
(4)
FR4 PCB, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 9. Average forward current as a function of
ambient temperature; typical values
Tamb (°C)
0 50 100 150 1751257525
006aab343
2.5
5.0
7.5
IF(AV)
(A)
0
(1)
(2)
(3)
(4)
FR4 PCB, mounting pad for cathode 1 cm2
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 10. Average forward current as a function of
ambient temperature; typical values
Tamb (°C)
0 50 100 150 1751257525
006aab344
2.5
5.0
7.5
IF(AV)
(A)
0
(1)
(2)
(3)
(4)
Ceramic PCB, Al2O3, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 11. Average forward current as a function of
ambient temperature; typical values
Nexperia PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG4050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 10 November 2017 8 / 13
Tsp (°C)
0 50 100 150 1751257525
006aab345
2.5
5.0
7.5
IF(AV)
(A)
0
(1)
(2)
(3)
(4)
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 12. Average forward current as a function of solder point temperature; typical values
11. Test information
tp
tcy
P
t
006aac658
duty cycle δ =
tp
tcy
Fig. 13. Duty cycle definition
The current ratings for the typical waveforms are calculated according to the equations:
IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with IRMS
defined as RMS current.
Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC)
standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in
automotive applications.
Nexperia PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG4050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 10 November 2017 9 / 13
12. Package outline
07-09-12Dimensions in mm
1.1
0.9
0.22
0.10
0.6
0.3
5.0
4.4 4.0
3.6
1.9
1.6
2.7
2.3
1
2
Fig. 14. Package outline CFP5 (SOD128)
13. Soldering
solder lands
solder resist
occupied area
solder paste
2.53.4 2.1
(2×)
1.9
(2×)
4.4
4.2
6.2
1.2
(2×)
1.4
(2×) sod128_fr
Dimensions in mm
Fig. 15. Reflow soldering footprint for CFP5 (SOD128)
Nexperia PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG4050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 10 November 2017 10 / 13
SOD128Wave soldering footprint information
sod128_fw
occupied area
dummy track (solder resist and Cu free)
solder resist
solder lands
Issue date
Dimensions in mm
17-06-06
17-06-07
4.2
(2×)
5.7 4.35
(2×)
3.5 (2×) 3.65 (2×)
2.3
10.2
5.8
Fig. 16. Wave soldering footprint for CFP5 (SOD128)
Nexperia PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG4050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 10 November 2017 11 / 13
14. Revision history
Table 8. Revision history
Data sheet ID Release date Data sheet status Change notice Supersedes
PMEG4050EP v.2 20171110 Product data sheet - PMEG4050EP_1
Modifications: Features and benefits: Capable for reflow and wave soldering added
Soldering: Wave soldering footprint added
PMEG4050EP_1 20090914 Product data sheet - -
Nexperia PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG4050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 10 November 2017 12 / 13
15. Legal information
Data sheet status
Document
status [1][2]
Product
status [3]
Definition
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production This document contains the product
specification.
[1] Please consult the most recently issued document before initiating or
completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nexperia.com.
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Nexperia PMEG4050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG4050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 10 November 2017 13 / 13
16. Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 3
9. Thermal characteristics............................................... 3
10. Characteristics............................................................ 5
11. Test information......................................................... 8
12. Package outline.......................................................... 9
13. Soldering..................................................................... 9
14. Revision history........................................................11
15. Legal information..................................................... 12
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Date of release: 10 November 2017