Description
The Slim Font Seven Segment Displays incorporates
a new slim font character design. This slim font
features narrow width, specially mitered segments
to give fuller appearance to the illuminated
character. Faces of these displays are painted a
neutral gray for enhanced on/off contrast.
All devices are available in either common anode or
common cathode configuration with right hand
decimal point.
Features
• As AlInGaP red color
• Gray Face Paint
Gray package gives optimum contrast
• Design flexibility
Common anode or common cathode
• Excellent appearance
• Slim font design
• Mitered corners, evenly illuminated segments
Devices
As AlInGaP Red Description
HDSP-561C Common Anode
HDSP-563C Common Cathode
HDSP-56xC Series
13 mm Slim Font
Seven Segment Displays
Data Sheet
2
Part Numbering System
Notes:
1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest
Avago representative for details.
2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1
bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.
5082 -X X X X-X X X X X
HDSP-X X X X-X X X X X
Mechanical Options[1]
00: No Mechanical Option
Color Bin Options[1,2]
0: No Color Bin Limitation
Maximum Intensity Bin[1,2]
0: No Maximum Intensity Bin Limitation
Minimum Intensity Bin[1,2]
0: No Minimum Intensity Bin Limitation
Device Configuration/Color[1]
C: AlInGaP Red
Device Specific Configuration[1]
Refer to Respective Datasheet
Package[1]
Refer to Respective Datasheet
3
12.25 ± 0.25
(0.482)
1.25
(0.049)
Ø
7.40
(0.292)
1.25
(0.049)
10°
13.00
(0.512)
17.50 ± 0.3/–0.25
(0.689)
6.40 ± 0.25
(0.252)
7.00 ± 0.25
(0.276)
3.60 ± 0.3
(0.142)
15.24 ± 0.3
(0.600)
0.30 ± 0.08 TYP.
(0.012)
45°
a
DP
b
c
f
e
g
d
10 9 876
12345
0.50 ± 0.08
(0.020)
3.59 ± 0.3 TYP.
(0.141)
2.54 ± 0.3 TYP.
(0.100)
Package Dimensions and Internal Circuit
Pin Function
1E
2D
3 Common A/C
4C
5DP
6B
7A
8 Common A/C
9F
10 G
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 MM.
4
Absolute Maximum Ratings at TA = 25˚C
Description Symbol HDSP-561C/563C Units
DC Forward Current per Segment or DP[1,2,3] IF50 mA
Peak Forward Current per Segment or DP[2,3] IPEAK 100 mA
Average Forward Current[3] IAVE 30 mA
Reverse Voltage per Segment or DP (IR = 100 µA) VR5V
Operating Temperature TO–40 to +105 ˚C
Storage Temperature TS–40 to +120 ˚C
Wave Soldering Conditions Temperature 250 ˚C
Time 3 s
Notes:
1. Derate linearly as shown in Figure 1.
2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more
information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).
3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.
Bin Name Min.[2] Max.[2]
T 18.000 25.000
U 25.001 36.000
Notes:
1. Bin categories are established for
classification of products. Products may
not be available in all bin categories.
2. Tolerance for each bin limit is ± 10%.
Optical/Electrical Characteristics at TA = 25˚C
Device
Series
HDSP- Parameter Symbol Min. Typ. Max. Units Test Conditions
561C Forward Voltage IV1.90 2.40 V IF = 20 mA
563C Reverse Voltage VR5VI
F = 100 µA
Peak Wavelength λPEAK 635 nm Peak Wavelength
of Spectral Distribution
at IF = 20 mA
Dominant Wavelength[3] λd622.5 626 630 nm
Spectral Halfwidth ∆λ1/2 40 nm Wavelength Width
at Spectral Distribution
1/2 Power Point
at IF = 20 mA
Speed of Response τS20 ns Exponential Time
Constant, e-tτs
Capacitance C 40 pF VF = 0, f = 1 MHz
Intensity Bin Limits[1]
(mcd at 10 mA)
5
Contrast Enhancement
For information on contrast
enhancement, please see
Application Note 1015.
Soldering/Cleaning
Cleaning agents from ketone
family (acetone, methyl ethyl
ketone, etc.) and from the
chlorinated hydrocarbon family
(methylene chloride,
trichloroethylene, carbon
tetrachloride, etc.) are not
recommended for cleaning LED
parts. All of these various
solvents attack or dissolve the
encapsulating epoxies used to
form the package of plastic LED
parts.
For information on soldering
LEDs, please refer to Application
Note 1027.
Figure 1. Maximum forward current vs.
ambient temperature. Derating based on
TJMAX = 130˚C.
Figure 2. Forward current vs. forwrad
voltage.
I
F
– FORWARD CURRENT PER SEGMENT – mA
0.0
0
V
F
– FORWARD VOLTAGE – V
120
60
2.0 3.0
80
20
1.0 2.5
40
1.5
100
I
F
– MAXIMUM AVERAGE CURRENT – mA
0
0
T
A
– AMBIENT TEMPERATURE – ˚C
60
30
120
40
10
20
20
40
50
60 80 100
Figure 3. Relative luminous intensity vs. DC
forward current.
Figure 4. Relative efficiency (luminous
intensity per unit current) vs. peak current.
RELATIVE LUMINOUS INTENSITY
(NORMALIZED TO 1 AT 10 mA)
0
0
I
F
– FORWARD CURRENT PER SEGMENT – mA
3.5
3.0
1.5
1.0
40
20 6010 30 50
2.5
2.0
0.5
RELATIVE EFFICIENCY
(NORMALIZED TO 1 AT 10 mA)
0010203040 60
I
PEAK
– PEAK FORWARD CURRENT
PER SEGMENT – mA
0.2
0.4
0.6
0.8
1.0
1.4
1.2
50
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved.
5988-4823EN May 31, 2006
