bluetooth_a4.qxd 11/3/00 8:56 AM Page 1 T H E W O R L D L E A D E R I N D S P A N D A N A L O G Product Bulletin BluetoothTM Chip Set Solution from Texas Instruments * Chip set includes: - Digital baseband controller with on-chip Bluetooth, ROM-based software stack up to Host Controller Interface (HCI) - RF transceiver Hardware * No external flash memory required I/F RISC Processor * Extremely sensitive reception of -86 dBm extends range up to five times Bluetooth requirements Core ROM, RAM Bluetooth Host: Cell-phone PC Camera Key Features: * Complete two-chip solution supports current BluetoothTM specification Power Management Unit Bluetooth RF Transceiver TRF6001 Bluetooth Baseband BSN6030 * Point-to-point support for simultaneous voice and data communication * Supports up to 1 Mbps transmission in 2.4-GHz ISM band * Low-power operation: around 10 mA for typical Bluetooth voice application TI's low-power, affordable Bluetooth Chip Set supports the latest Bluetooth specification with just two devices -- an RF transceiver and a digital baseband controller. An all-digital interface between the devices, plus onchip support for standard communication interfaces and TMS320TM digital signal processors (DSPs), make the chip set easy to implement in Bluetooth applications. The Bluetooth Chip Set from Texas Instruments provides a two-chip solution that supports the latest Bluetooth specification for short-distance wireless communications. Consisting of the BSN6030 Bluetooth Baseband Controller and the TRF6001 Bluetooth Radio Frequency (RF) Transceiver, the chip set integrates the complete Bluetooth software stack up to the Host Controller Interface (HCI), with no external flash memory required, for a complete Bluetooth system solution. Operating in the 2.4-GigaHertz (GHz) ISM band worldwide, TI's Bluetooth solution supports simultaneous point-to-point transmission of voice and data, with rates up to 1 Megabit per second (Mbps). The chip set not only saves space and power but also can extend the range of transmission up to five times the distance of a standard implementation of the Bluetooth specification. Among the many types of systems that can take advantage of the TI solution are: * All-digital interface between chips simplifies design * Integrates easily with TMS320TM DSPs for use in mobile Internet appliances * Digital cellular phones * Internet appliances * Cordless phones * Hands-free phone headsets * Wireless home networks for PCs, PDAs * Remote game and video controls * PC-peripheral communications, including printers, digital cameras, internet audio players bluetooth_a4.qxd 11/3/00 8:56 AM Page 2 additional power savings. The high efficiency of the chip set keeps power consumption to about 10 milliamperes (mA) for a typical Bluetooth voice application. Software Bluetooth Profiles RFCOMM; TCP/IP;... L2CAP HCI Firmware Audio HCI Driver I/F Driver Host UART HCI Driver Link Manager I/F Driver Link Controller UART Bluetooth Baseband TI's Bluetooth Chip Set includes the complete Bluetooth software stack up to the Host Controller Interface (HCI) in on-chip ROM, eliminating the need for external flash memory. Extended Range The TI Bluetooth solution offers an extended sensitivity of -86 decibels with reference to 1 milliWatt (0 dBm) and a bit error rate (BER) of 10 -3. This figure represents an increase of 16 dB beyond the sensitivity required by the standard. Under certain conditions, a signal that a basic implementation receives at no greater distance than 10 meters can be received by the TI solution at up to 50 meters. This extra sensitivity allows applications using TI's Bluetooth solution to operate more reliably at longer distances. Low Power Consumption Both baseband controller and RF transceiver operate at 3.3 V and employ power-down modes to prolong system operation between battery charges. The BSN6030 controller features an extra-low-power 1.8-V core for MicroStar JuniorTM Packaging TI's advanced MicroStar Junior packaging helps minimize your circuit board's size, weight and cost. These high-performance packages provide excellent heat dissipation and low inductance in a low-profile, chip-scale footprint. MicroStar Junior packages are available with fully or selectively populated ball grids. Worldwide Operation The TRF6001 transceiver employs frequency-hopping spread spectrum (FHSS) technology for maximum robustness of the radio link. The complete chipset is designed for worldwide regulatory compliance for operation in the 2.4-GHz requency band. High Performance The BSN6030 controller achieves high performance with an integrated 32-bit ARM7TM RISC microprocessor, plus 16K words of RAM for data storage and 112K words of programmed ROM. In addition to running the complete Bluetooth software stack up to the HCI, the device offers processing power for Bluetooth profiles or general application software. To save external components and simplify design, support for A-Law and -Law codecs is included on chip, along with a high-speed UART serial interface. Flexible Clocking The chip set can operate with flexible clock sources ranging from 10 to 20 MHz in increments of 1 MHz. Since system clock requirements vary, this versatility permits designers to use TI's Bluetooth chip set in a wide v ariety of applications. bluetooth_a4.qxd 11/3/00 8:56 AM Page 3 Ease of Design An all-digital interface between the devices, plus several integrated interfaces to standard communications, make it easy to implement TI's Bluetooth solution in a system. The chip set also connects easily to a TMS320 DSP for added value in high-performance real-time applications such as mobile Internet appliances and wireless digital phones with Bluetooth capabilities. The Bluetooth Chip Set is fully supported by an evaluation module (EVM), documentation and reference design, as well as by TI's extensive network of wireless applications specialists throughout the world. Space Savings TI's Bluetooth chip set is designed to save space in mobile applications. No external flash memory is required for program code, saving cost and space, as well as eliminating potential problems with the availability of flash devices. The BSN6030 controller is available in a range of small-scale MicroStar Junior ball grid arrays (BGA), down to an 80-lead, 6x6 mm package. The TRF6001 transceiver is available in a 56-lead MicroStar Junior BGA that measures just 5x5 mm. Together, the chips require less board area than a single-chip 8x8 mm solution. TI's Roadmap for Bluetooth TI is committed to developing a complete family of low-power solutions for Bluetooth application needs. TI's plans for future generations of Bluetooth products include integration of functionality such as low intermediate frequency (IF) filtering, and support for point-to-multipoint operations. BSN6030 Bluetooth Baseband Controller * Embedded ARM7 RISC microprocessor * 16K word RAM, 112K word fully programmed ROM with Bluetooth software stack up to HCI including UART transport layer * 3.3-V single supply with power-down modes * Ultra-low-power 1.8-V core * On-chip PLL for variable clock source from 10 to 20 MHz * Integrated UART interface * Glueless connection to external Codecs * Space-saving MicroStar Junior BGA package options down to a 6x6 mm footprint TRF6001 Bluetooth RF Transceiver * 2.4-GHz frequency-hopping spread spectrum (FHSS) radio * 3.3-V single supply with power-down mode * -86 dB sensitivity at BER = 10 -3 * Single-conversion receiver * Low-noise amplifier with gain control * On-chip PLL for variable clock source from 10 to 20 MHz * Space-saving 5x5 mm, 56-lead MicroStar Junior BGA package For More Information To learn more about TI's Bluetooth Chip Set, or other TI short-distance wireless products, call your regional TI sales office or visit www.ti.com/sc/bluetooth bluetooth_a4.qxd 11/3/00 8:56 AM Page 4 TI Worldwide Technical Support Internet TI Semiconductor Home Page www.ti.com/sc TI Distributors www.ti.com/sc/docs/general/distrib.htm Product Information Centers Americas Phone Fax Internet +1(972) 644-5580 +1(214) 480-7800 www.ti.com/sc/ampic Europe, Middle East, and Africa Phone Belgium (English) France Germany Israel (English) Italy Netherlands (English) Spain Sweden (English) United Kingdom Fax Email Internet +32 (0) 27 45 55 32 +33 (0) 1 30 70 11 64 +49 (0) 8161 80 33 11 1800 949 0107 800 79 11 37 +31 (0) 546 87 95 45 +34 902 35 40 28 +46 (0) 8587 555 22 +44 (0) 1604 66 33 99 +44 (0) 1604 66 33 34 epic@ti.com www.ti.com/sc/epic Asia Phone International Domestic Australia China Hong Kong India Indonesia Korea Malaysia New Zealand Philippines Singapore Taiwan Thailand Fax Email Internet +886-2-23786800 Local Access Code 1-800-881-011 00-800-8800-6800 800-96-1111 000-117 001-801-10 001-800-8800-6800 1-800-800-011 000-911 105-11 800-0111-111 080-006800 0019-991-1111 886-2-2378-6808 tiasia@ti.com www.ti.com/sc/apic TI Number -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450 -800-800-1450 Japan Phone International Domestic Fax International Domestic Internet International Domestic +81-3-3344-5311 0120-81-0026 +81-3-3344-5317 0120-81-0036 www.ti.com/sc/jpic www.tij.co.jp/pic Important Notice: The products and services of Texas Instruments and its subsidiaries described herein are sold subject to TI's standard terms and conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no liability for applications assistance, customer's applications or product designs, software performance, or infringement of patents. The publication of information regarding any other company's products or services does not constitute TI's approval, warranty or endorsement thereof. A050200 The red/black banner, TMS320 and MicroStar Junior are trademarks of Texas Instruments. Bluetooth is a trademark of Telefonaktiebolaget L M Ericsson. ARM is a trademark of Advanced RISC Machines, Ltd. All other trademarks are the property of their respective owners. (c) 2000 Texas Instruments Incorporated Printed in the U.S.A. Printed on recycled paper. SWCT002