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notice_e-01
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called “TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’ s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to “Foreign Exchange and For-
eign Trade Control Law” of Japan, “U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
20
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mlcc04_e-01
■ FEATURES
■ PART NUMBER
■ STANDARD EXTERNAL DIMENSIONS/STANDARD QUANTITY
■ SPECIFICATIONS
■ APPLICATIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Q value in the high frequency range (1 GHz+) is superior compared to
other types of multilayer capacitors.
◦The 1005(0402) case size is designed for high density mounting and
weight reduction in various applications.
◦Suitable for those high frequency applications in which a capacitor
with both a high Q-value and small size is required such as portable
communications and other wireless applications.
VCO, TCXO etc.
◦Adjustment of characteristics in high frequency circuit
Type Dimension [mm] Standard quantity [pcs]
L W T e Paper tape Embossed tape
□VK105
（0402 inch）1.0±0.05 0.5±0.05 0.5±0.05 0.25±0.1 10000 －
❶Rated voltage
〔VDC〕
E 16
U 50
❾Thickness 〔mm〕
W 0.5
❼Nominal
capacitance〔pF〕
example
020 2
4R3 4.3
※R＝Decimal point
❻Temperature
characteristics 〔ppm/℃〕
CH 0±60
RH －220±60
❷Series name
V
Multilayer ceramic
capacitor for high
frequency
❸End termination
K Plated
❽Capacitance
tolerance
B±0.1pF
J±5％
MULTILAYER CERAMIC CAPACITORS
FOR HIGH FREQUENCY APPLICATIONS
（
1GHz+
）
Temperature
Characteristics
Operating
Temperature range
Temperature
Coefficient range
[ppm/℃]
Capacitance
Tolerance
CH －55～＋125℃ 0±60 ±0.1pF（～2.0pF）
±5％（2.2pF～）
RH －220±60
●Capacitance vs Q value （Typical for CH characteristic）
⓫Packaging
Fφ178mm Taping
（2mm pitch）
❿Special code
－Standard
REFLOW
U V K 1 0 5 △R H 4 R 3 J W －F△
❶ ❷ ❸ ❹ ❺ ❻ ❼ ❽ ❾ ❿ ⓫ ⓬
❹Dimension
Type （inch）L×W 〔mm〕
105 （0402）1.0×0.5
❺Dimension
tolerance
△Standard
△=Blank Space
⓬ Internal code
△Standard
△=Blank Space
21
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CAPACITORS
mlcc04_e-01
■ PART NUMBERS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Rated Voltage
（DC）Part number
EHS
(Environmental
Hazardous
Substances)
Temperature
characteristics Capacitance
〔pF〕
Capacitance
tolerance
Q
（at 1GHz）（min.）
Thickness
[mm] Typical Q
CH RH
E: 16V
U: 50V
□VK105 CH0R3BW RoHS ●0.3
±0.1pF
300
0.5±0.05
1200
□VK105 CH0R4BW RoHS ●0.4 300 1200
□VK105 CH0R5BW RoHS ●0.5 300 1200
□VK105 CH0R6BW RoHS ●0.6 300 1100
□VK105 CH0R7BW RoHS ●0.7 300 1100
□VK105 CH0R8BW RoHS ●0.8 300 1000
□VK105 CH0R9BW RoHS ●0.9 300 950
□VK105 CH010BW RoHS ●1.0 300 950
□VK105 CH1R1BW RoHS ●1.1 280 930
□VK105 CH1R2BW RoHS ●1.2 270 850
□VK105 CH1R3BW RoHS ●1.3 260 740
□VK105 CH1R5BW RoHS ●1.5 240 710
□VK105 CH1R6BW RoHS ●1.6 230 670
□VK105 CH1R8BW RoHS ●1.8 210 650
□VK105 CH020 BW RoHS ●2.0 190 610
□VK105 CH2R2JW RoHS ●2.2
±5％
180 530
□VK105 CH2R4JW RoHS ●2.4 170 510
□VK105 CH2R7JW RoHS ●2.7 150 460
□VK105 CH030JW RoHS ●3.0 130 390
□VK105 CH3R3JW RoHS ●3.3 120 370
□VK105 CH3R6JW RoHS ●3.6 110 360
□VK105 CH3R9JW RoHS ●3.9 99 360
□VK105 CH4R3JW RoHS ●4.3 84 360
□VK105 CH4R7JW RoHS ●4.7 84 340
□VK105 CH5R1JW RoHS ●5.1 84 320
□VK105 RH0R5BW RoHS ●0.5
±0.1pF
300 1100
□VK105 RH0R 6BW RoHS ●0.6 300 1000
□VK105 RH0R7BW RoHS ●0.7 300 1000
□VK105 RH0R8BW RoHS ●0.8 300 970
□VK105 RH0R 9BW RoHS ●0.9 300 950
□VK105 RH010BW RoHS ●1.0 300 900
□VK105 RH1R1BW RoHS ●1.1 280 900
□VK105 RH1R2BW RoHS ●1.2 270 740
□VK105 RH1R3BW RoHS ●1.3 260 700
□VK105 RH1R5BW RoHS ●1.5 240 680
□VK105 RH1R6BW RoHS ●1.6 230 640
□VK105 RH1R8BW RoHS ●1.8 210 620
□VK105 RH020BW RoHS ●2.0 190 570
□VK105 RH2R2JW RoHS ●2.2
±5％
180 480
□VK105 RH2R4JW RoHS ●2.4 170 470
□VK105 RH2R7JW RoHS ●2.7 150 420
□VK105 RH030JW RoHS ●3.0 130 360
□VK105 RH3R3JW RoHS ●3.3 120 350
□VK105 RH3R6JW RoHS ●3.6 110 340
□VK105 RH3R9JW RoHS ●3.9 99 340
□VK105 RH4R3JW RoHS ●4.3 84 340
□VK105 RH4R7JW RoHS ●4.7 84 320
□VK105 RH5R1JW RoHS ●5.1 84 310
□Please specify the Rated Voltage code.
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mlcc_pack-P1 mlcc_pack_e-01
■ PACKAGING
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Taped package
①Minimum Quantity
②Taping material
※No bottom tape for pressed carrier tape
③Representative taping dimensions
◦Paper Tape（8mm wide）
◦Pressed carrier tape （2mm pitch）
T1
㧗0.1/−0
◦Paper tape
◦Embossed tape Type Chip Cavity Insertion Pitch Tape Thickness
A B F T
□MK107
□WK107 1.0 1.8
4.0±0.1
1.1max.
□2K110 1.15 1.55 1.0max.
□MK212
□WK212 1.65 2.4 1.1max.□4K212
□2K212
□MK316 2.0 3.6
Type Chip Cavity Insertion Pitch Tape Thickness
A B F T
□2K096 0.72 1.02
52.0±0.05
0.6max.
□MK105
□VK105 0.65 1.15 0.8max.
㧗0.1/−0
㧗0.1/−0
◦Punched carrier tape （4mm pitch）
Note：Taping size might be different depending on the size of the product.
◦Punched carrier tape （2mm pitch）
◦Chip filled
Type
Thickness Standard quantity [pcs]
mm code Paper tape Embossed
tape
□
MK042
0.2 C,D —40000
□MK063 0.3 P,T 15000
—
□2K096 0.3 P
100000.45 K
□WK105 0.3 P
□MK105
0.2 C 20000
0.3 P 15000
0.5 V, W 10000
□VK105 0.5 W
□MK107
□WK107
0.45 K 4000
0.5 V —4000
0.8 A
4000 —
□2K110
0.5 V
0.6 B
0.8 A
□MK212
□WK212
0.45 K
0.85 D
1.25 G —3000
□4K212 0.85 D
4000 —□2K212 0.85 D
□MK316
0.85 D
1.15 F
—3000
1.25 G
1.6 L
2000
□MK325
0.85 D
—
1.15 F
1.9 N
2.0max Y
2.5 M
500（T）, 1000（P）
□MK432 2.5 M —500
Unit：mm
Unit：mm
Unit：mm
Type Chip Cavity
Insertion Pitch
Tape Thickness
Ａ Ｂ Ｆ Ｔ T1
□MK063 0.37 0.67
2.0±0.05
0.45max. 0.42max.□2K096 0.65 1.02
□WK105
0.65 1.15MK105（*1C）0.4max. 0.3max.
MK105（*1P）0.45max. 0.42max.
*1 Thickness, C：0.2mm、P：0.3mm
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mlcc_pack-P2
mlcc_pack_e-01
■ PACKAGING
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Embossed tape（8mm wide）
◦Embossed tape（12mm wide）
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
□WK107 1.0 1.8
4.0±0.1
1.3max 0.25±0.1
□MK212 1.65 2.4
3.4max. 0.6max.□MK316 2.0 3.6
□MK325 2.8 3.6
④Trailer and Leader
Trailer 160mm min.
Leader 400mm min.
100mm or more
⑤Reel size
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow
as illustrated below.
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
㧗0.1/−0
㧗0.1/−0
2.0±0.1
F
36＋0/−0.2
110±0.7
12±0.1
＋0.2/−0
＋0/−0.2
12.0±0.1
8.8±0.1
6.8±0.1
1.0＋0/−0.1 2.0＋0/−0.1 1.5＋0.1/−0
Unit：mm
⑦Bulk Cassette
1.0±0.02
0.8±0.04 0.9±0.05
1.8±0.02
4.0±0.05
Ｆ2.0±0.04
◦Embossed tape（4mm wide）
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
□MK042 0.23 0.43 1.0±0.02 0.5max. 0.25max.
A B C
φ178±2.0 φ50min.
φ13.0±0.2
D E R
φ21.0±0.8 2.0±0.5
1.0
t W
4mm wide tape 1.5max.
5±1.0
8mm wide tape 2.5max.
10±1.5
12mm wide tape 2.5max.
14±1.5
Unit：mm
Unit：mm
Unit：mm
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
□MK432 3.7 4.9 8.0±0.1 4.0max. 0.6max.
Unit：mm
E
W
C
RDB
t
A
E
W
C
RDB
t
A
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mlcc_reli-R1 mlcc_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
7. Q or Dissipation Factor
Specified
Value
Temperature Compensating
（Class 1）
Standard C＜30 pF：Q≧400＋20C、C≧30 pF：Q≧1000 （C：Nominal capacitance）
High Frequency Type Refer to detailed specification
High Permittivity（Class 2） Note 1 BJ, B7, C6,C7：2.5％ max., F：7％ max.
【Test Methods and Remarks】
High Frequency Type
Measuring equipment: HP4291A
Measuring jig: HP16192A
Class 1 Class 2
Standard High Frequency Type C≦10μF C＞10μF
Preconditioning None Thermal treatment （at 150℃ for 1hr） Note 2
Measuring frequency 1ＭHz±10％1GHz 1ｋHz±10％120±10Hz
Measuring voltage Note 1 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms
Bias application None
6. Capacitance （Tolerance）
Specified
Value
Temperature Compensating
（Class 1）
Standard C△
U△
0.5pF≦C≦5pF：±0.25pF
0.5pF<C≦10pF：±0.5pF
C＞10pF：±5%
RH
S△
T△
0.5pF≦C≦2pF：±0.1pF
C＞2pF：±5%
High Frequency Type CH
RH
0.5pF≦C≦2pF：±0.1pF
C＞2pF：±5%
High Permittivity （Class 2）BJ, B7, C6,C7：±10％ or ±20％, F：－20％／＋80％
【Test Methods and Remarks】
Class 1 Class 2
Standard High Frequency Type C≦10μF C＞10μF
Preconditioning None Thermal treatment （at 150℃ for 1hr） Note 2
Measuring frequency 1ＭHz±10％1ｋHz±10％120±10Hz
Measuring voltage Note 1 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms
Bias application None
5. Insulation Resistance
Specified
Value
Temperature Compensating
（Class 1）
Standard 10000 MΩ min.
High Frequency Type
High Permittivity （Class 2） Note 1C≦0.047μF : 10000 MΩ min.
C＞0.047μF : 500MΩ・μF
【Test Methods and Remarks】
Applied voltage: Rated voltage
Duration: 60±5 sec.
Charge/discharge current: 50mA max.
4. Withstanding Voltage（Between terminals）
Specified
Value
Temperature Compensating
（Class 1）
Standard
No breakdown or damage
High Frequency Type
High Permittivity（Class 2）
【Test Methods and Remarks】
Class 1 Class 2
Applied voltage Rated voltage×3 Rated voltage×2.5
Duration 1 to 5 sec.
Charge/discharge current 50mA max.
3. Rated Voltage
Specified
Value
Temperature Compensating
（Class 1）
Standard 50VDC, 25VDC, 16VDC
High Frequency Type 50VDC, 16VDC
High Permittivity （Class 2）50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC
2. Storage Conditions
Specified
Value
Temperature Compensating
（Class 1）
Standard －55 to ＋125℃
High Frequency Type
High Permittivity （Class 2）
Specification Temperature Range
BJ B－25 to ＋85℃
X5R －55 to ＋85℃
B7 X7R －55 to ＋125℃
C6 X6S －55 to ＋105℃
C7 X7S －55 to ＋125℃
FF－25 to ＋85℃
Y5V －30 to ＋85℃
1.Operating Temperature Range
Specified
Value
Temperature Compensating
（Class 1）
Standard －55 to ＋125℃
High Frequency Type
High Permittivity （Class 2）
Specification Temperature Range
BJ B－25 to ＋85℃
X5R －55 to ＋85℃
B7 X7R －55 to ＋125℃
C6 X6S －55 to ＋105℃
C7 X7S －55 to ＋125℃
FF－25 to ＋85℃
Y5V －30 to ＋85℃
Multilayer Ceramic Capacitors
Super Low Distortion Multilayer Ceramic Capacitors and Medium-High
Voltage Multilayer Ceramic Capacitors are noted separately.
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mlcc_reli-R2
mlcc_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
8. Temperature Characteristic（Without voltage application）
Specified
Value
Temperature Compensating
（Class 1）
Standard
Temperature Characteristic ［ppm/℃］ Tolerance
C□ ：0 CH, CJ, CK
H±60
J±120
K±250
R□ ：ー220 RH
S□ ：ー330 SH, SJ, SK
T□ ：ー470 TJ, TK
U□ ：ー750 UJ, UK
SL ：＋350 to －1000
High Frequency Type
High Permittivity （Class 2）
Specification Capacitance change Reference temperature Temperature Range
BJ B±10％20℃ －25 to ＋85℃
X5R ±15％25℃ －55 to ＋85℃
B7 X7R ±15％25℃ －55 to ＋125℃
C6 X6S ±22％25℃ －55 to ＋105℃
C7 X7S ±22％25℃ －55 to ＋125℃
FF＋30/ー80％20℃ －25 to ＋85℃
Y5V ＋22/ー82％25℃ －30 to ＋85℃
【Test Methods and Remarks】
Class 1
Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
（C85－C20） × 106
（ppm/℃）
C20×△T △T＝65
Class 2
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
（C－C2） ×100（％）
C2
C ：Capacitance in Step 1 or Step 3
C2 ：Capacitance in Step 2
Step B、F X5R、X7R、X6S、X7S、Y5V
1 Minimum operating temperature
2 20℃25℃
3 Maximum operating temperature
9. Deflection
Specified
Value
Temperature Compensating
（Class 1）
Standard Appearance : No abnormality
Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.
High Frequency Type Appearance : No abnormality
Capacitance change : Within±0.5 pF
High Permittivity （Class 2）Appearance : No abnormality
Capacitance change : Within ±12.5%（BJ, B7, C6, C7）, Within ±30%（F）
【Test Methods and Remarks】
Multilayer Ceramic Capacitors
Board Thickness Warp Duration
042、063 Type glass epoxy-resin substrate 0.8mm 1mm 10 sec.
The other types 1.6mm
Array Type
Board Thickness Warp Duration
096、110、212 Type glass epoxy-resin substrate 1.6mm 1mm 10 sec.
Board Warp
Capacitance measurement shall
be conducted with the board bent
10. Body Strength
Specified
Value
Temperature Compensating
（Class 1）
Standard —
High Frequency Type No mechanical damage.
High Permittivity （Class 2） —
【Test Methods and Remarks】
High Frequency Type
Applied force: 5N
Duration: 10 sec.
A
A
A
11. Adhesive Strength of Terminal Electrodes
Specified
Value
Temperature Compensating
（Class 1）
Standard
No terminal separation or its indication.High Frequency Type
High Permittivity （Class 2）
【Test Methods and Remarks】
Multilayer Ceramic Capacitors Array Type
Applied force Duration
042、063 Type 2N 30±5 sec.
105 Type or more 5N
Applied force Duration
096 Type 2N 30±5 sec.
110、212 Type 5N
12. Solderability
Specified
Value
Temperature Compensating
（Class 1）
Standard
At least 95% of terminal electrode is covered by new solder.High Frequency Type
High Permittivity （Class 2）
【Test Methods and Remarks】
Solder type Solder temperature Duration
Eutectic solder H60A or H63A 230±5℃4±1 sec.
Lead-free solder Sn-3.0Ag－0.5Cu 245±3℃
1
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mlcc_reli-R3 mlcc_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
13. Resistance to Soldering
Specified
Value
Temperature Compensating
（Class 1）
Standard
Appearance: No abnormality
Capacitance change: Within ±2.5% or ±0.25pF, whichever is larger.
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No abnormality
High Frequency Type
Appearance: No abnormality
Capacitance change: Within ±2.5%
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No abnormality
High Permittivity （Class 2） Note 1
Appearance: No abnormality
Capacitance change: Within ±7.5% （BJ, B7, C6, C7）
Within ±20% （F）
Dissipation factor: Initial value
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No abnormality
【Test Methods and Remarks】
Class 1
042, 063 Type 105 Type
Array（096, 110 Type）
Preconditioning None
Preheating 150℃, 1 to 2 min. 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
Solder temp. 270±5℃
Duration 3±0.5 sec.
Recovery 6 to 24 hrs （Standard condition） Note 5
Class 2
042、063 Type 105, 107, 212 Type
Array（096, 110,212 Type） 316, 325 Type
Preconditioning Thermal treatment （at 150℃ for 1 hr） Note 2
Preheating 150℃, 1 to 2 min. 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
80 to 100℃, 5 to 10 min.
150 to 200℃, 5 to 10 min.
Solder temp. 270±5℃
Duration 3±0.5 sec.
Recovery 24±2 hrs （Standard condition） Note 5
14. Temperature Cycle (Thermal Shock）
Specified
Value
Temperature Compensating
（Class 1）
Standard
Appearance: No abnormality
Capacitance change: Within ±2.5% or ±0.25pF, whichever is larger.
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No abnormality
High Frequency Type
Appearance: No abnormality
Capacitance change: Within ±0.25pF
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No abnormality
High Permittivity （Class 2） Note 1
Appearance: No abnormality
Capacitance change: Within ±7.5% （BJ, B7, C6, C7）
Within ±20% （F）
Dissipation factor: Initial value
Insulation resistance: Initial value
Withstanding voltage （between terminals）: No abnormality
【Test Methods and Remarks】
Class 1 Class 2
Preconditioning None Thermal treatment （at 150℃ for 1 hr） Note 2
1 cycle
Step Temperature（℃） Time（min.）
1 Lowest operating temperature ＋0/－3 30±3
2 Normal temperature 2 to 3
3 Highest operating temperature ＋0/－3 30±3
4 Normal temperature 2 to 3
Number of cycles 5 times
Recovery 6 to 24 hrs （Standard condition） Note 5 24±2 hrs （Standard condition） Note 5
15. Humidity （Steady State）
Specified
Value
Temperature Compensating
（Class 1）
Standard
Appearance: No abnormality
Capacitance change: Within ±5% or ±0.5pF, whichever is larger.
Q： C＜10pF： Q≧200＋10C
10≦C＜30pF： Q≧275＋2.5C
C≧30pF： Q≧350 （C：Nominal capacitance）
Insulation resistance: 1000 MΩ min.
High Frequency Type
Appearance: No abnormality
Capacitance change: Within ±0.5pF,
Insulation resistance: 1000 MΩ min.
High Permittivity （Class 2） Note 1
Appearance: No abnormality
Capacitance change: Within ±12.5%（BJ, B7, C6, C7）
Within ±30%（F）
Dissipation factor： 5.0% max. （BJ, B7, C6, C7）
11.0% max.（F）
Insulation resistance: 50 MΩμF or 1000 MΩ whichever is smaller.
【Test Methods and Remarks】
Class 1
Standard High Frequency Type
Preconditioning None
Temperature 40±2℃60±2℃
Humidity 90 to 95％RH
Duration 500＋24/ー0 hrs
Recovery 6 to 24 hrs （Standard condition） Note 5
Class 2
All items
Preconditioning Thermal treatment （at 150℃ for 1 hr） Note 2
Temperature 40±2℃
Humidity 90 to 95％RH
Duration 500＋24/ー0 hrs
Recovery 24±2 hrs （Standard condition） Note 5
1
2
mlcc_reli-R4
mlcc_reli_e-01
■ RELIABILITY DATA
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
16. Humidity Loading
Specified
Value
Temperature Compensating
（Class 1）
Standard
Appearance: No abnormality
Capacitance change: Within ±7.5% or ±0.75pF, whichever is larger.
Q： C＜30pF：Q≧100＋10C/3
C≧30pF：Q≧200 （C：Nominal capacitance）
Insulation resistance: 500 MΩ min.
High Frequency Type
Appearance: No abnormality
Capacitance change: C≦2pF：Within ±0.4 pF
C＞2pF：Within ±0.75 pF （C：Nominal capacitance）
Insulation resistance: 500 MΩ min.
High Permittivity （Class 2） Note 1
Appearance: No abnormality
Capacitance change: Within ±12.5% （BJ, B7, C6, C7）
Within ±30%（F）
Dissipation factor： 5.0% max. （BJ, B7, C6, C7）
11.0% max.（F）
Insulation resistance: 25 MΩ
μF or 500 MΩ, whichever is smaller.
【Test Methods and Remarks】
Class 1
Standard High Frequency Type
Preconditioning None
Temperature 40±2℃60±2℃
Humidity 90 to 95％RH
Duration 500＋24/ー0 hrs
Applied voltage Rated voltage
Charge/discharge current 50mA max.
Recovery 6 to 24 hrs （Standard condition） Note 5
Class 2
All items
Preconditioning Voltage treatment
（Rated voltage are applied for 1 hour at 40℃） Note 3
Temperature 40±2℃
Humidity 90 to 95％RH
Duration 500＋24/ー0 hrs
Applied voltage Rated voltage
Charge/discharge current 50mA max.
Recovery 24±2 hrs （Standard condition） Note 5
17. High Temperature Loading
Specified
Value
Temperature Compensating
（Class 1）
Standard
Appearance: No abnormality
Capacitance change: Within ±3% or ±0.3pF, whichever is larger.
Q： C＜10pF： Q≧200＋10C
10≦C＜30pF： Q≧275＋2.5C
C≧30pF： Q≧350 （C：Nominal capacitance）
Insulation resistance: 1000 MΩ min.
High Frequency Type
Appearance: No abnormality
Capacitance change: Within ±3% or ±0.3pF, whichever is larger.
Insulation resistance: 1000 MΩ min.
High Permittivity （Class 2） Note 1
Appearance: No abnormality
Capacitance change: Within ±12.5%（BJ, B7, C6, C7）
Within ±30%（F）
Dissipation factor： 5.0% max.（BJ, B7, C6, C7）
11.0% max.（F）
Insulation resistance: 50 MΩ
μF or 1000 MΩ, whichever is smaller.
【Test Methods and Remarks】
Class 1
Standard High Frequency Type
Preconditioning None
Temperature 125±3℃
Duration 1000＋48/ー0 hrs
Applied voltage Rated voltage×2
Charge/discharge current 50mA max.
Recovery 6 to 24hr （Standard condition） Note 5
Class 2
BJ, F C6 B7, C7
Preconditioning Voltage treatment （Twice the rated voltage shall be
applied for 1 hour at 85℃, 105℃ or 125℃） Note 3, 4
Temperature 85±2℃105±3℃125±3℃
Duration 1000＋48/ー0 hrs
Applied voltage Rated voltage×2 Note 4
Charge/discharge current 50mA max.
Recovery 24±2 hrs （Standard condition） Note 5
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for 24±2hours.
Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and
kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.
Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condi-
tion.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
1
2
mlcc_prec-P1 mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-
pose applications.
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage
having rapid rise time is used in a circuit.
2. PCB Design
Precautions
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance. Therefore, the following items must
be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper
amount of solder.
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.
◆Pattern configurations（Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors
shall be carefully considered to minimize stresses.
Technical
consider-
ations
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions （unit: mm）
Wave-soldering Land patterns for PCBs
Type 107 212 316 325
Size L 1.6 2.0 3.2 3.2
W 0.8 51.25 1.6 2.5
A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
Solder-resist
Chip capacitor
L
L
W
B
C
B
A
W
LWDC
Land
Chip capacitor
Reflow-soldering
Type 042 063 105 107 212 316 325 432
Size L 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5
W 0.2 0.3 0.5 0.8 51.25 1.6 2.5 3.2
A
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55
0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5
B
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50
0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8
C
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55
0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5
Note：Recommended land size might be different according to the allowance of the size of the product.
●LWDC: Recommended land dimensions for reflow-soldering（unit: mm）
Type 105 107 212
Size L 0.52 50.8 1.25
W 1.0 1.6 2.0
A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7
B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5
C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1
●Array type: Recommended land dimensions for reflow-soldering （unit: mm）
2 circuits 4 circuits
Type 096（2 circuits）110（2 circuits）212（2 circuits）212（4 circuits）
Size L 0.9 1.37 2.0 2.0
W 0.6 1.0 1.25 1.25
a 0.25 to 0.35 0.35 to 0.45 0.5 to 0.6 0.5 to 0.6
b 0.15 to 0.25 0.55 to 0.65 0.5 to 0.6 0.5 to 0.6
c 0.15 to 0.25 0.3 to 0.4 0.5 to 0.6 0.2 to 0.3
d 0.45 0.64 1.0 0.5
Chip capacitor
a
a
b
d
c
Land
c
d
a
a
b
（2）Examples of good and bad solder application
Items Not recommended Recommended
Mixed mounting of
SMD and leaded
components
Component
placement close to
the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Precautions on the use of Multilayer Ceramic Capacitors
To next page
1
2
mlcc_prec-P2
mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
2. PCB Design
Technical
consider-
ations
◆Pattern configurations（Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de-
flection.
Items Not recommended Recommended
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from
least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2.Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro-
priately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further
information.
Technical
consider-
ations
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points
shall be considerable.
（1） The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2） The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the
PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement:
Items Not recommended Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted
periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci-
tors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions
shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f . The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
［Recommended condition］
Figure 212/316 case sizes as examples
a 0.3mm min
b 100 to 120 μm
c Adhesives shall not contact land
1
2
mlcc_prec-P3 mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
Precautions
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt% （in CI equivalent） of halogenated content. Flux having a strong acidity content shall not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
consider-
ations
◆Selection of Flux
1-1. When too much halogenated substance （Chlorine, etc.） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-（Chlorine, etc.） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-Chlorine, etc.） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec-） content is used to activate fl ux, or highly acidic fl ux is used, it may lead to corrosion of terminal elec- content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
trodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect
the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause
a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be
considered carefully when water-soluble flux is used.
◆Soldering
• Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
• Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
• Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃.
• Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］
【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】
Temperature（℃）
0
100
200
300
230℃
Within 10 sec.
60sec.
Min.
60sec.
Min.
Slow cooling
Preheating
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Caution
①The ideal condition is to have solder mass （fillet） controlled to 1/2 to 1/3 of the thickness of a capacitor.
Capacitor
PC board
T
Solder
②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as
close to recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
Temperature （℃）
0
100
200
300
Temperature （℃）
0
100
200
300
Temperature （℃）
Temperature （℃）
0
100
200
300
Peak 260℃ Max.
Within 10sec.
Heating above
230℃
40sec. Max.
Slow
cooling
Preheating 150℃
60sec. Min.
230〜250℃
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150℃
0
100
200
300
400
230〜280℃
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature （℃）
0
100
200
300
400
Temperature （℃）
0
100
200
300
400
Peak 350℃ Max.
Within 3sec.
Peak 280℃ Max.
Within 3sec.
Slow cooling Slow cooling
⊿T
⊿T
Preheating
150℃ Min.
60sec. Min.
Preheating
150℃ Min.
60sec. Min.
⊿T
316type or less
⊿T≦150℃
⊿T
325type or more
⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
1
2
mlcc_prec-P4
mlcc_prec_e-01
■ PRECAUTIONS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning.（e.g. to
remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics.
Technical
consider-
ations
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in
a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions （insufficient or excessive cleaning） may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered
portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked;
Ultrasonic output : 20 W/ℓ or less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
Precautions
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal stor-
age conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or
destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
Precautions
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
◆Storage
1.
To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in
the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity : Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capaci-
tors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2.
The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, ｓo care shall be taken to design circuits . Even if
capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour.
Technical
consider-
ations
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/
packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability be-
fore using the capacitors.
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
