Product Datasheet Search Results:
- 25LC1024-I/P
- Microchip Technology
- IC EEPROM 1MBIT 20MHZ 8DIP - 25LC1024-I/P
- 25LC1024-I/PG
- Microchip Technology, Inc.
- 128K X 8 SPI BUS SERIAL EEPROM, PDIP8
- 25LC1024-I/P
- Microchip Technology, Inc.
- 128K X 8 SPI BUS SERIAL EEPROM, PDIP8
Product Details Search Results:
Microchip.com/25LC1024-I/P
{"Category":"Integrated Circuits (ICs)","Memory Type":"EEPROM","Online Catalog":"SPI Serial EEPROM","Series":"-","Product Photos":"8-DIP","Family":"Memory","PCN Assembly/Origin":"8L SOIJ Package/Plating 31/Jul/2013","Package / Case":"8-DIP (0.300\", 7.62mm)","Format - Memory":"EEPROMs - Serial","Supplier Device Package":"8-PDIP","Packaging":"Tube","Datasheets":"25LC1024","Memory Size":"1M (128K x 8)","Voltage - Supply":"2.5 V ~ 5.5 V","Standard Package":"60","Interface":"SPI Serial","Operating Temperature":...
1529 Bytes - 08:44:33, 21 December 2024
Microchip.com/25LC1024-I/PG
{"Terminal Finish":"MATTE TIN","Terminal Pitch":"2.54 mm","Terminal Form":"THROUGH-HOLE","Operating Temperature-Max":"85 Cel","Clock Frequency-Max (fclk)":"20 MHz","Number of Words Code":"128K","Write Cycle Time-Max (tWC)":"5 ms","Supply Voltage-Nom (Vsup)":"5 V","Temperature Grade":"INDUSTRIAL","Package Shape":"RECTANGULAR","Status":"ACTIVE","Lead Free":"Yes","Operating Temperature-Min":"-40 Cel","Number of Words":"131072 words","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"1","Memory Dens...
1679 Bytes - 08:44:33, 21 December 2024
Microchip.com/25LC1024-I/P
{"Terminal Finish":"MATTE TIN","Terminal Pitch":"2.54 mm","Terminal Form":"THROUGH-HOLE","Operating Temperature-Max":"85 Cel","Clock Frequency-Max (fclk)":"20 MHz","Number of Words Code":"128K","Write Cycle Time-Max (tWC)":"6 ms","Supply Voltage-Nom (Vsup)":"5 V","Temperature Grade":"INDUSTRIAL","Package Shape":"RECTANGULAR","Status":"ACTIVE","Lead Free":"Yes","Operating Temperature-Min":"-40 Cel","Number of Words":"131072 words","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"1","Memory Dens...
1689 Bytes - 08:44:33, 21 December 2024